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Plasma Cleaner

ContentsGas Plasma Dry Cleaner

PDC200/210/510 PDC610G

Gas Plasma Reactor PR200/300/301 PR500/510

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Gas Plasma Dry CleanerPDC200/210/510

FeaturesSimple and compact plasma surface treatment deviceRIE (Reactive Ion Etching) Plasma mode, with DP (Direct Plasma) mode as optionExcellent electrode structure for plasma uniformitySimple touch panel system

ApplicationsPlasma processing of CSP, BGA, COB substratumRemoval of organic films and metal oxidized filmsDry cleaning of printed circuit boardSurfactant processLED assemblyFor R&D

Small and compact, suitable for R&D purposes

PDC210

DP(Direct Plasma) mode RIE(Reactive Ion Etching) mode

Chamber Diagram

Electrons

Oxygen moleculeCarbon dioxide

Quartz stand

Oxygen atom(ion)

SampleWafer and etc.

Switch

DP

RIE

MatchingBox

DP(Direct Plasma) mode

Electrons

Ar Ions

Inorganic

Si wafer and etc.

Switch Matchingbox

RIE(React ive Ion Etching) mode

DP

RIE

matter

Electrons

Oxygen moleculeCarbon dioxide

Quartz stand

Oxygen atom(ion)

SampleWafer and etc.

Switch

DP

RIE

MatchingBox

DP(Direct Plasma) mode

Electrons

Ar Ions

Inorganic

Si wafer and etc.

Switch Matchingbox

RIE(React ive Ion Etching) mode

DP

RIE

matter

Plasma Surface Treatment Device

Model PDC200 PDC210 PDC510Plasma mode RIE (DP mode option) RIE/DP selectableElectrode structure Parallel flat stage plateVacuum gauge Capacitance manometerHigh frequency output Max 300W Max 500WOscillation frequency 13.56MHz Quartz oscillatorOutput setting method Manual setting on LCD touch panelMatching method Auto tuningController ProgrammableDisplay LCD touch panelChamber size W400 × D250 × H150mm W500 x D300 x H200mmStage size W250 × D170mm W410 x D210mmChamber material Aluminum Reaction gas 2 systems (Argon, Oxygen)Purge gas Nitrogen or dry airReaction gas flow control Flow meter Mass flow controllerRotary vacuum pump (optional) ~345L/min. ~500L/min.External dimensions W540×D600×H600mm W540×D600×H600mm W700xD700xH700mmWeight ~100kg ~105kg 180kgPower source Single phase AC115V 50/60Hz 3-phase AC200V~AC240V 50/60Hz

High frequency output

Specifications

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300W(PDC200)

500W(PDC210/510) Stage size 250×170mm

(PDC200/210)410×210mm

(PDC510)

PDC200/210/510145CATV1-201701

FCC and CE certified compact plasma cleaner with selectable RIE / DP modes and switchable electrodes (1 to 3 stages) covering a wide range of applications

Gas Plasma Dry CleanerPDC610GMulti Stage Plasma Cleaner

Chamber

Plasma Discharge

Stage size Standards250 x 220 mm1-stage, 2-stages, 3-stages selectable FCC / CE compliant

FeaturesMaximum power of 600W with compact packageElectrodes can be switched among 1-stage, 2-stages, and 3-stagesSupports processing of a vertical magazineRIE/DP modes selectableSupports integrated data logger (optional)Matching point memory function (optional)Complies with FCC and CE standards

ApplicationsImprovement of adhesiveness of various materials and surface reformationLight ashing and light etching processPretreatment of implemented board bonding, plastic package and print board platingProcessing of LED related commercial productsCleaning of electronic partsResist peeling or residue removal after wetting processCleaning of accuracy parts including optics and optical fibers, or machine partsReformation of resin surface including fluoro resin

Model PDC610Plasma mode RIE/DP selectableElectrode structure 3-stage independent parallel flat platesVacuum gauge Capacitance manometerHigh frequency output Max 600WOscillation frequency 13.56MHz Quartz oscillatorOutput setting method Manual setting on LCD touch panelMatching method Auto tuningControl device Sequencer Display LCD touch panelChamber size W350 x D270 x H300 mmStage size W250 x D220mm Three stagesChamber material AluminumReactive gas 2 systems (Argon and Oxygen)Purge gas Nitrogen or dry airVacuum pump Rotary vacuum pump (Approx. 345 L/min)External dimension W600 x D722 x H700 mmExterior material Stainless steelPower source 3-phase AC200V~AC230V 50/60 Hz 15A

(vacuum pump included)Standards FCC / CE marking

Specifications

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600WHigh-frequency Output

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Gas Plasma ReactorPR200/300/301Compact, Barrel Type, Low Temperature Ashing Device

PR200

Model PR200 PR300 PR301Plasma mode Direct plasma (DP)High frequency output Max. 200W Max. 300W (100W x 3 chambers) Max. 300WOscillation frequency 13.56MHzTuning method Auto matching Manual biaxialReaction chamber Pyrex glass, ø100×160mm x 1 chamber Pyrex glass, ø64×160mm×3 chambers Pyrex glass, ø118×160mm x 1 chamberReaction gas 1 system (oxygen), flow meter control with dry air purge gasControl system Manual leak valve Auto pressure reduction, auto leak valvePiping material Stainless steel, Teflon Stainless steel, Teflon, Copper and Brass Stainless steel, TeflonExternal dimensions(W×D×H) 350 x 400 x 500mm 438 × 520 × 556mm 438 × 520 × 660mmWeight ~25kg ~36kg ~34kgPower source (50/60Hz) AC115V AC115 / AC220VOptional accessories Sample dish, vacuum pump Sample dish, stand, shelf, vacuum pump

Specifications

www.yamato-usa.comYamato Scientific America Inc. PR200/300/301

High-frequency output

200W(PR200)

300W(PR300/301)

Reaction chamber

ø64 x 160mm x 3(PR300)

ø100 x 160mm x 1(PR200)

ø118 x 160mm x 1(PR301)

ApplicationsFunctionalization of the polymeric material surface improves adhesionOxidation reaction generates functional groups -OH, >C=O, -COOH on the surface (very small amount of water and carbondioxide will impact)In nitrogen plasma, a nitrogen atom is incorporated onto thesurface, generates a functional group -NH2

Resist peelingSurface modification of materials (metals, polymers, films,ceramics, etc.)Asbestos pre-processing (ashing of membrane filter)Low-temperature ashing (polymer material, coal, food, etc.)PDMS chips bonding to glass and PDMS substrateProduction of semiconductors and analysis work

FeaturesIsotropy barrel typeCompact, space saving designCapable of removing coated organic matterAdjustable RF suitable for various applicationsOutstanding operability and safetyCan be set for a wide range of output conditions to handle a variety of testing samples

Wide range of application from ashing, etching, dry cleaning, etc.

PR301PR300

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PR301 with observation window PR300 with observation window PR500

Phase-contrast microscope

Collected to membrane filter

Acetone

Deposited with acetone vapor

Ashing filter w

ith

oxygen plasma

SEM-EDS analysis

Example application: asbestos analysis pre-processing

www.yamato-usa.comPR200/300/301Yamato Scientific America Inc.

Control Panel

PR2001 chamber (ø100 x 160mm)

PR3003 chambers (ø64 x 160mm)Contamination free

PR3011 chamber (ø118 x 160mm)

Chamber

The gas plasma equipment has a wide range of applications from ashing, etching, dry cleaning, etc.

Interior

Accessories

Piping System (PR300)

Operation FlowchartMain switch

ONPower switch

ONPump switch

ON

Pump switchOFF TerminationNormal

PressurePurge gas

Stop

Purge gas

Gas switch ONGas valve OPEN

Gas switch OFFGas valve CLOSE

Predecompression Evacuation

Reaction

Output switchOFF

Output switchON

T

PR300, PR301PR200

Sample dish Sample shelf for PR300 Sample shelf for PR301

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Gas Plasma ReactorsPR500/510Compact, Barrel Type, Low Temperature Ashing Device

High-frequency output 500W Reaction

chamber ø215 x 305mm

PR500 (Manual version) PR510 (Touch panel version)

SpecificationsModel PR500 (Flow meter) PR510 (Mass flow meter)

Method Barrel type chamber direct plasmaHigh frequency output Max. 500WOscillating frequency 13.56MHzTuning method Automatic tuningReaction chamber Made of quartz, ø215×305mmReaction gas Dual system (O2 / CF4)Control system Manual Automatic touch panelPiping material Stainless steel, TeflonExternal dimensions (W×D×Hmm) 438×520×760 520×630×760Weight ~60kg ~60kgPower source (50/60Hz) AC115V / AC220VStandard accessories Connection cable: 1 complete set

Vacuum grease: 1 pc.O-ring for reaction chamber: 1pc.

Optional accessories Frame for wafers (2, 3, 4, 5, 6 inches)Multi-purpose angled frameAluminum etching tunnelStand

FeaturesCompact, space saving design with oscillation section integrated with a portion of the chamberOutstanding operability and safety with the automatic tuning system as standand componentEquipped with a large quartz chamber (ø215mm) which can process big testing samples

ApplicationsRemoval of photoresistCleaning of partsSurfactant treatmentMicro polishingCorresponds to wafer and glass substrate

www.yamato-usa.comYamato Scientific America Inc. PR500/510

Designed with large chamber size made of quartz considered almost completely resistant against most plasma processes

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Wafer Ashing

Chamber

ø215mm large caliber chamber

The gas plasma equipment has a wide range of applications from ashing, etching, dry cleaning, etc.

www.yamato-usa.comYamato Scientific America Inc. PR500/510

Operation FlowchartMain switch

ONPower switch

ONPump switch

ON

Pump switchOFF TerminationNormal

PressurePurge gas

Stop

Purge gas

Gas switch ONGas valve OPEN

Gas switch OFFGas valve CLOSE

Predecompression Evacuation

Reaction

Output switchOFF

Output switchON

T

Piping System (PR500/510)

Control Panel

PR500

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