pl0066 wccw mc

8/4/2019 Pl0066 Wccw Mc

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SPECIFICATION

PART NO. : PL0066-WCCW-MC

6.0 x 6.0 mm CERAMIC SMD TYPE

ATTENTION

OBSERVE PRECAUTION

FOR HANDLING

ELECTRO STATIC

SENSITI VE

DEV ICES

Ver 1, MS 100311

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TAKE EFFECT DATE MODIFY ISSUES REMARKS

PL0066-WCCW-MC6.0 x 6.0mm

CERAMIC SMD TYPE

MODIFY RECORD

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Part No.

LED Chip

Lens ColorMaterial Emitting Color

LT1J63-1W-RYGAW-S07

White&Green InGaN/Sapphire

Nature White Water Clear Red&Yellow AlGaInP/Si

Amber AlGaInP/GaAs

1.36

6.0


CERAMIC SMD TYPE

Package Dimensi ons

6.0

1.36 0.68 0.45 0.23

W G A W

Anode Mark

W Y G W

AW G R W

K

W A G W

Notes:

1. All dimensions are in mm.

2. Tolerance is ±0.25mm unless otherwise noted.

Description

PL0066-WCCW-MC Cool White

8/4/2019 Pl0066 Wccw Mc


Parameter Symbol Rating Unit

Power Dissipation

White&Green

PD

120

mWRed&Yellow 78

Amber 72

Reverse Voltage VR 5 V

D.C. Forward Current If 30 mA

Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) If(Peak) 100 mA

Operating Temperature Range Topr. -40 to +100 ℃

Storage Temperature Range Tstg. -40 to +100℃

Soldering Temperature. Ts ld. Reflow Soldering: 260℃ for 10 sec.

Electric Static Discharge Threshold (HBM) ESD 300 V

Parameter Symbol Condition Min. Typ. Max. Unit

Luminous Flux Фv If=80mA 10.7 20 lm

Forward Voltage Vf If=80mA 11.5 15 V

Correlated Color Temperature

Rank C9

CCT If=80mA

5500 -- 6000

KRank C10 6000 -- 6500

Rank C11 6500 -- 7000

Color Renderig Index CRI If=80mA -- 94 -- Ra

Reverse Current Ir Vr=5V 50 µ A

Viewing Angle2θ1/2

If=80mA 120 deg


CERAMIC SMD TYPE

Absolute Ratings at Ta=25

Electrical and Optical Characteris tics:

。

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CERAMIC SMD TYPE

F o r w a r d C u r r e n t I F ( m A )

F o r w a r d C u r r e n t I F ( m A )

R e l a t i v e R e s p o n s e

R e l a t i v e i n t e n s i t y

( I v )

PL0066-WCCW-MC 6.0 x 6.0mm

Typical Electrical/Optical Characteristic Curves

(25℃ Ambient Temperature Unless Otherwise Noted)

1 .0

0 .8

0 .6

0 .4

0 .2

0

3 0 0 4 0 0 5 0 0 6 0 0 7 0 0

Fig.1 WHITE LED Spectrum VS. WAVELENGTH

50 A R&Y W&G

1 .2

40 1 .1

30 1 .0

。

20 0 .9

10 0 .8

1.6 2.0 2.4 3.0 3.4 4.0

0 .7-3 0 0 3 0 6 0 9 0 1 2 0

Applied Voltage (V)A m b ie n t T e m p e ra tu re T a ( C )

Forward Current VS. Applied Voltage Forward Current VS. Luminous Intensity

50

40

30

20

10

0 20 40 60 80

℃100

120

1.0

0.9

0.8

0.7

0° 10° 20°

30°

40°

50°

60°

70°

80°

90°

Ambient Temperature Ta ( ) 0.5 0.3 0.1 0.2 0.4 0.6

Ambient Temperature VS. Forward Current Radiation Diagram

8/4/2019 Pl0066 Wccw Mc


Reflow Solder ing

Lead Solder Lead – f ree So lder Pre-heat 120~150℃ 180~200℃

Pre-heat time 120sec. Max. 120sec. Max.

Peak temperature 240℃ Max. 260℃ Max.

Solder ing time 10sec. Max. 10sec. Max.

Cond ition refer to Temperature-

profile 1

refer to Temperature-

profile 2

6 . 0


CERAMIC SMD TYPE

PRECAUTION IN USEStorage

Recommended storage environment

Temperature: 5oC ~ 30oC (41oF ~ 86oF)

Humidity: 60% RH Max.

Use within 7 days after opening of sealed vapor / ESD barrier bags.

If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the

storage time, baking treatment should be performed using the following conditions.

Baking treatment: 60±5℃ for 24 hour s.

Fold the opened bag firmly and keep in dry environment.

Soldering

*Af ter reflow solder ing rapid cooling should be avoided.

[Temperature-profile (Surf ace of circuit board)] Use the conditions shown to the under f igure.

＜1 : Lead Solder＞＜2 : Lead -f ree Solder＞

240°CMax. 260°C Max. 2.5~5°C/sec. 10sec. Max.

1~5°C/sec.10sec. Max.

Pre-heating Pre-heating

120~150°C 180~200°C 60sec. Max. 60sec. Max.

120sec. Max. 120sec. Max.

2.5~5°C/sec.1~5°C/sec.

[ Recommended so ldering pad design ]

Use the following conditions shown in the figure.

2.5 1.6

(Unit:mm)

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CERAMIC SMD TYPE

Handling of Silicone Resin LEDs

HandlingIndica

tions

During processing, mechanical stress on the sur f ace should be minimized as much as possib le.

Sharp objects of all types should not be used to p ierce the sealing compound

Figure 1

In general, LEDs should only be handled from the side. By the way, this also applies to LE Ds

without a silicone sealant, since the surf ace can also become scratched .

Figure 2

When populating boards in SMT production, there are basically no restrictions regard ing the form

of the pick and place nozzle, except that mechanical pressure on the surf ace of the resin must be

prevented.

This is assured by choosing a pick and place nozzle which is lar ger than the LED’s reflector a

rea.

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5 7

6 0 . 0

± 0 . 5

13.2 0.

16.2±0.5

1 7 8 . 0

±

1

0 . 8

0 . 6

0 . 4

1 . 7

5

0 . 1

0 . 2

5 . 5

0

0 . 5

0 . 2

6 . 4

5

0 . 3

0 . 4

0 . 6

1 2 . 0

0 . 3


CERAMIC SMD TYPE

Dimensions for Ta

±

pe

± ±

4.0 0.1 8.0 0.1

± ±0 .93

±0

±.3

Dimensions for Reel

5

Notes:

1.All dimensions are in mm, tolerance is±2.0mm unless otherwise noted.

2.Specifications are subject to change without notice

pl0066 wccw mc

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