photonic packaging and integration technologies...
TRANSCRIPT
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2572-10
Winter College on Optics: Fundamentals of Photonics - Theory, Devices and Applications
Sonia M. García Blanco
10 - 21 February 2014
University of Twente The Netherlands
Photonic packaging and integration technologies II
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27/02/2014 Title: to modify choose 'View' then 'Heater and footer'
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Photonic packaging and integration technologies IIWinter School on Optics
ICTP, Trieste, February 2014Sonia M. García Blanco, University of Twente
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Packaged dies
[Lars Zimmerman, Helios, Silicon Photonics course][P. O’Brien, Tyndall National Institute, Cork, Ireland]
PHOTONIC PACKAGING AND INTEGRATION TECHNOLOGIES
Bare photonic dies
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1. Packaging of LEDs, detectors and image sensors
2. Packaging of photonic devices
3. Hybrid and heterogeneous integration technologies
OUTLINE
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HYBRID INTEGRATIONCONCEPT: “To develop a motherboard onto which
the different optical components are passively assembled
CONCEPT: “To develop a motherboard onto which the different optical components are passively
assembled
Passive assembly: - Purely visual
- Solder self alignment- Solder self alignment with mechanical stops
- V-grooves
- With MEMS or with micromachinesExamples of optical benches:
- Axsun- CPI- Tyndall
- INO- Kaiam
- Mycraline
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“VISUAL” PASSIVE ASSEMBLY
- Metal thermocompression bonding or solder (AuSn)- Alignment using a very accurate flip-chip bonder
Finetech Lambda: x, y (post-bond) < 1 mSET FC150: x, y (post-bond) < 1 m
[H. Oppermann, IZM]
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SOLDER “SELF-ALIGNMENT”
- Long solder stripes aligned in the x and z directions- Stripes along x self-alignment in z- Stripes along z self-alignment in x- x-z positioning accuracy <1m
EXAMPLE:
- y positioning volume of solder
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SOLDER “SELF-ALIGNMENT” WITH MECHANICAL STOPS
- Restoring force is proportional to initial misalignment 90 mm produces enough force to move the top die against the stops
- In final positions misalignment of pad and stud ensures force against stops
- Low accuracy pick-and-place equipment (~10-20 m)
[Hutter et. al., Proc. ECTC 2006]
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SOLDER “SELF-ALIGNMENT” WITH MECHANICAL STOPS
Placement before reflow After reflow chip is against the stops
[Hutter et. al., Proc. ECTC 2006]
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ALIGNMENT WITH MEMS
[Zhang et. al., JSTQE, 2010]
- Ball lens alignment in 2-axes by lateral movement of slope wedges- Fixed in aligned position by locking mechanism of MEMS structure
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ALIGNMENT WITH MICROMACHINES
[Axsun]
- Metallic “micromachines” made with the LIGA process- Positioned with very high accuracy on the substrate
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HYBRID INTEGRATIONCONCEPT: “To develop a motherboard onto which
the different optical components are passively assembled
CONCEPT: “To develop a motherboard onto which the different optical components are passively
assembled
Passive assembly: - Purely visual
- Solder self alignment- Solder self alignment with mechanical stops
- V-grooves
- With MEMS or with micromachinesExamples of optical benches:
- Axsun- CPI- Tyndall
- INO- Kaiam
- Mycraline
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AXSUN OPTICAL BENCH
[Axsun]
Electroplated LIGA mold Fibre gripper Various structures
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KAIAM HYBRID INTEGRATION PLATFORM
[Kaiam Corp]
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CIP OPTICAL BENCH
[CIP (now Huawei)]
[Isolator]
[Fibre array]
[Mech stops]
[Cavity]
[InP devices]
[Si daughter board] [Silica-on-silicon motherboard]
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CIP OPTICAL BENCH
[CIP (now Huawei)]
- Motherboard: low loss silica waveguide platform.
- Silicon daughter boards: InP chips with mode converters are passively attached.- Cavities in motherboard + polymer alignment stops + control of thickness of silica clad precise alignment
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MICRALYNE OPTICAL BENCH
[Mycraline]
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Traditional optical toolbox to be miniaturized …
INO OPTICAL BENCH: MINIATURIZATION OBJECTIVE
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… into INO’s toolbox of micro-components …
… integrated using INOs 3D microbench technologyS. García-Blanco, et. al., “Photonics integration, micro-assembly and packaging technologies at INO”, SPIE Photonics North, 2010 (Invited Presentation)
INO OPTICAL BENCH: MINIATURIZATION OBJECTIVE
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“Integration MEMS-based micro-optical components and macro COTS components on a 3-D multilevel
configuration”
“Integration MEMS-based micro-optical components and macro COTS components on a 3-D multilevel
configuration”
Multimode fiber
Fiber holding structure
Mirror / beamsplitter
Replicated microlenses
Filter Multimode fiber
Multimode fiber
Fiber holding structure
Mirror / beamsplitter
Replicated microlenses
Filter Multimode fiber
S. García-Blanco et. al., “3D MOEMS-based micro-bench platform for the miniaturization of sensing devices”, Proc. SPIE, 68870F, 2008
GENERAL OVERVIEW
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Current technology: replication in sol-gel materials (visible)
- Technology to fabricate microlenses in materials suitable for other wavelength ranges can be developed (mid and far-IR)
MICROLENSES INTEGRATION
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- Apertures, thin films filters, gratings
1. Optical components wafer-level microfabricated on both sides of intermediate layers
- Replicated microlenses
2. Wafer-level assembly of different levels- Solder ball self-alignment- Adhesive bonding
COMPONENTS INTEGRATED IN THE PLATFORM
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- Thick Ni e-plated structures- UV adhesive fixing of fiber
INTEGRATION OF OPTICAL FIBERS
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1. Packaging of LEDs, detectors and image sensors
2. Packaging of photonic devices
3. Hybrid and heterogeneous integration technologies
OUTLINE
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1. Packaging of LEDs, detectors and image sensors
2. Packaging of photonic devices
3. Hybrid and heterogeneous integration technologies
OUTLINE
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INTEGRATION OF OPTICAL SOURCESREMEMBER: Silicon has an indirect bandgap!!
INTEGRATION OF LIGHT SOURCE IN SILICON
PLATFORM
INTEGRATION OF LIGHT SOURCE IN SILICON
PLATFORM
Direct bonding of direct bandgap material on silicon wafer followed by post-processing
Direct bonding of direct bandgap material on silicon wafer followed by post-processing
Integration of “finished” laser sources by microassembly
technologies, such as “flip-chip” bonding
Integration of “finished” laser sources by microassembly
technologies, such as “flip-chip” bonding
~ Mature technology - Low integration density
Growth of direct bandgap materials directly onto silicon
Growth of direct bandgap materials directly onto silicon
- High potential integration density
- Difficulty due to lattice mismatch -> defects
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“HYBRID SILICON” PLATFORM
- Processing of the III-V material aligning to pre-existing silicon waveguides to form the devices- By varying the width of the silicon waveguide, the propagating mode can be pushed towards the III-V material or towards the Si waveguide
- III-V material bonded to silicon waveguide sample
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“HYBRID SILICON”: ASSEMBLY PROCESSIII-V to silicon nanophotonic devices wafer bonding concept:III-V to silicon nanophotonic devices wafer bonding concept:
Two main processes:
DVS-BCB adhesivebonding: Ghent University
Two main processes:
DVS-BCB adhesivebonding: Ghent University
Direct bonding: UCSB (example)
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“HYBRID SILICON” TECHNOLOGY PLATFORM
- Taper losses of 0.5 dB and 0.3 dB
- Taper couplers from SOI to III-V
SOI
n-InP
SCH with QWs
p-InP
[M. Heck et. al., JSTQE 2013]
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“HYBRID SILICON” TECHNOLOGY PLATFORM
- Simultaneous bonding of different III-V materials
[M. Heck et. al., JSTQE 2013]
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“HYBRID SILICON” BUILDING BLOCKS
- Sources
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“HYBRID SILICON” LASERS
- Diameters ranging from 15-50 m- 400 microring lasers in a 1 cm2 chip- Diameters ranging from 15-50 m- 400 microring lasers in a 1 cm2 chip
- Threshold current ~4 mA output power ~3.5 mW
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HYBRID SILICON LASERS
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“HYBRID SILICON” BUILDING BLOCKS
- Sources- Amplifiers- Modulators in the SOI part- Isolators integration of magneto-optic garnets
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“COMMERCIAL”
Demultiplexer
Plasmonic-based integrated optics (waveguides and nanostructures)
On-chip active devices
Passive photonic motherboard (SOI or
TripleX)
KYW on-chip laser or amplifier
Pump laser diode
Low-loss sharp bends enabled by thin metal layers
Gain compensated long-range plasmonicwaveguides
2 PhD positions are now open to work on these projects!! [[http://os.tnw.utwente.nl/vacature.php?submenu=23]
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“COMMERCIAL”