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GLAST LAT Project Peer Review & CDR Preparation

Document: LAT-PR-00771-04 1

Peer Review and CDR Preparation

LAT Engineering MeetingDecember 17, 2002

ReferenceSEMP (LAT-MD-00066)NASA SRO – Design Review Guidelines (Section 4.3)



Preparation SchedulePreparation Schedule

• Subsystems Peer Reviews– ACD January 7-8, 2003– CAL March 17-18, 2003– Elec/DAQ/PWR/Flt SW March 19-20, 2003– TKR March 24-25, 2003– Mech March 26-27, 2003– I&T March 28, 2003

• Walk Through Review – Combined LAT IPO and GSFC Project Office chart walk

through to be performed in the week of April 8–9 • CDR

– Material available 4/18/03 for transmittal • This is 7 work days prior to review date per CDRL 306

– Review Dates 4/29 – 5/2/03 (1 month after completion of last Peer Review)



GSFC CDR GuidelineGSFC CDR Guideline

• Paragraph 4.3 from the GSFC System Review Office Guideline



Entrance & Exit CriteriaEntrance & Exit Criteria

Design StatusDesign Status

Demonstrate evolution & heritage of “Final Design”Demonstrate compliance of system performanceClosure of Actions from PDR & ∆PDRComplete ICDsFinal implementation plans– EM– Prototype– Flight Units– Spares

Complete design analysis

Fabrication StatusFabrication Status

Qualification/Environmental Test Plan and FlowGround OperationsControl methods for all safety hazards identifiedFMEAWorst case analysisFracture controlShipping environment and mode of transportation



CDR Check ListCDR Check List

• PDR – CDR Check List Comparison (reference GSFC SRO Checklist)PDR CDR Checklist Category

Closure of Action Item from Previous Reviews

Closure of Action Item from Previous Reviews

Action Item Database

Science/Technical Objectives, Requirements, General Specificaiton

Evolution & Heritage of the Final Design

Design Specifications

Performance RequiremensError budget determination Combined optical, thermal,

and mechanical budgets or total system performance

System Performance Analysis/Allocation

Weight, Power, Data rate, Commands, EMI/EMCSystem Performance budgetsInterface Requirements Interface Control Documents Design Specifications

Mechanical/structural design, analyses, and life tests

Complete design analyses Analysis/Modeling/EM Test Reports

Electrical, thermal, optical/radiometric design and analyses

Engineering Model/Breadboard Test Results and Design Margins

Software requirements and d iDesign verification, test flow and calibration/test plans

Qualification/Environmental Test Plans and Test Flow

Plans

Mission and ground system operations

Ground Operations Plans

Launch Vehicle interfaces Launch Vehicle interfaces Design Specificaitons

Parts selection, qualification, and Failure Mode and Effects Analysis plans

Reliability analyses results: FMEA, Worst Case Analysis, Fracture Control

Analysis/Modeling/EM Test Reports

Support MaterialsGround Support Equipment design

Plans for shipping containers, environmental control and mode of transportation

Support Materials

Problem Areas N/A

Schedule CMS



Breakdown of the CDR Check List for each Breakdown of the CDR Check List for each SubsystemSubsystem

Check list is designed to provide a quick look of the project readiness for CDR



CDR Check List (continued)CDR Check List (continued)



Preparation ExamplesPreparation Examples

• ACD has provided a website of their CDR preparation status• I encourage everyone to view posted material, including the

CDR Dry Run charts

http://lhea-glast.gsfc.nasa.gov/acd/cdr/index.html

• The following slides are examples for each Check List category presented in the ACD charts



Closure of Action ItemsClosure of Action Items

• Identified action items from PDR and ∆PDR• Show status and closure of NASA GSFC action items

AI# 2.Perform light yield tests and muon detection efficiency measurement of the final optical system (scintillator tiles; and fiber ribbons, connector, clear fibers, and photomultiplier tubes).

Complete – results are similar to those shown in January: with two phototubes, 0.9997 efficiency is met; with one phototube, efficiency is ~ 0.999

Light output of Fermilab tiles is good. Light losses in the optical connector and clear fibers were higher than expected. Design improvements were made to compensate for these losses.

LAT-TD-00843-D1, Design Qualification Tests for ACD TDA and Phototubes

Show results

Identify the action requested



Design SpecificationDesign Specification

• Science/technical objectives and technical budgets• Requirements & specifications metrics and flow down

– All TBX (TBD, TBA, TBS, etc…) should be removed or addressed• Drawing metrics

– Number and percent complete of major assemblies and critical component drawings

– Plans for completing the remaining drawings Parameter Requirement Expected Performance Verification

Method Detection of Charged Particles

≥ 0.9997 average detection efficiency over entire area of ACD (less for bottom row of tiles)

≥0.9997 ≥0.99 (bottom tiles)

Test and Analysis

Fast VETO signal Logic signal 200-1600 nsec after passage of charged particle

200-1600 nsec Test

PHA signal For each phototube, pulse height measurement for each Trigger Acknowledge (TACK) Below 10 MIP, precision of <0.02 MIP or 5% (whichever larger) Above 10 MIP, precision of < 1 MIP or 2% (whichever larger)

< 0.02 MIP or 5% < 1 MIP or 2%

Test and Analysis

False VETO rate - backsplash

< 20% false VETO's due to calorimeter backsplash at 300 GeV

< 20% Analysis

False VETO rate - noise < 1% gamma-ray rejection from false VETO's due to electrical noise

< 1% Analysis

High Threshold (Heavy Nuclei) Detection

Detection of highly-ionized particles (C-N-O or heavier) for calorimeter calibration.

Yes Analysis

Size Outside: 1796 x1796 x 1015 mm Inside Grid: 1574 x 1574 x 204.7 mm Inside TKR: 1515.5 x 1515.5 x 650 mm

1796 x1796 x 1015 1574 x 1574 x 204.7 1515.5 x 1515.5 x 650

Demonstrate

Mass < 228 kg 270 Demonstrate Power < 31 Watts (conditioned) 24 Demonstrate Instrument Lifetime Minimum 5 yrs > 5 yr. Analysis

Identify key requirements



Key Technical BudgetsKey Technical Budgets

Technical Resources

• ACD Mass– Allocation 235 kg– ACD detailed estimate 270 kg (15% over

PDR allocation. LAT has been notified, CR is being submitted)

• ACD Power– Allocation 31 W (conditioned)– ACD detailed estimate 14 W max

• Thermal Interface (max dissipation across ASD-LAT interface)

– Dissipation Allocation 16 W– Dissipation Estimate <14 W

• Identified technical budgets, it’s allocation from LAT System, changes since PDR

• Show allocation flow down within the subsystemItem Estimated

Mass (Kg)Calculated Mass (Kg)

Actual Mass (Kg)

Total Mass without

Margin (Kg)Mechanical Hardware

Tile Shell Assembly (TSA) 29.8004 29.8004

Shell/Base Middle & Corner Flexures 1.6000 5.9824 7.5824

Base Frame Assembly (BFA) 25.1535 0.1248 25.2783Tile Flexures 4.3900 5.0320 9.4220

Clear Fiber Cable & Fiber Ribbon Tiedowns 1.1840 0.1984 1.6800 3.0624

Shield/Blanket Attachments 0.4000 2.5840 2.9840ACD/LAT Interface Hardware 0.6000 0.6000

Uralane & Safety Cable 1.0000 1.0000

Mechanical Hardware Total 79.7295Tile Detector Assemblies

Tiles 95.3650 95.3650Tile Wrapping 7.7700 7.7700

Tile Pig Tails & Clear Fiber Cables 8.5026 3.7896 12.2922Fiber Ribbons 0.0000 1.3928 1.3928

Fiber Ribbon Wrapping 0.3472 0.3472Fiber Ribbon Pig Tails 0.1600 0.1200 0.1712 0.4512

Tile Detector Assemblies Total 117.6184Electronic Hardware

PMT Assemblies 0.2910 11.8340 12.1250Chassis Structure 13.8360 13.8360

FREE Board & PCB 6.0360 0.0000 6.0360HVBS 2.2560 2.2560

Power Distribution Board 1.7280 1.7280Bulkhead Connectors & Brackets 2.2352 1.3000 3.5352

Harnessing, Tiedowns & Fasteners 0.5000 0.3120 0.8120

Electronic Hardware Total 40.3282Thermal Hardware

Thermistors, Wiring & Tiedowns 2.3800 2.3800Micrometeoroid/Thermal Blanket 30.0800 30.0800

Thermal Hardware Total 32.4600TOTAL ACD 270.1361Show break down of

allocation within subsystem



Interface Control DocumentInterface Control Document

• ICD and IDD are completed and signed– Identify major trades to accommodate design– Remaining open issues should have closure

plan• 24 identical robust circular

connectors (38999, series 2)

• 2 circular housekeeping connectors (38999, series 2)

• Parts, pin outs, signal def, grounding all defined in ICD

DATA Products

•Channel specific charged particle VETOs

•VETO hit maps

•PHAs

•Diagnostics

•Housekeeping (thermistor output, voltage monitor output, direct to AEM)

DATA Products

•Channel specific charged particle VETOs

•VETO hit maps

•PHAs

•Diagnostics

•Housekeeping (thermistor output, voltage monitor output, direct to AEM)

FRont End Electronics(FREE) #1

HVBS Pri

HVBS Red

FREE #2

HVBS Pri

HVBS Red

FREE #12

HVBS Pri

HVBS Red

ACD ElectronicsModule (AEM)

Primary

#1

#2

#3

#12

ACD ElectronicsModule (AEM)

Secondary

#1

#2

#3

#12

Thermistors(-X, +Y, +Z)

Thermistors(+X, -Y, +Z)

ACD Base Electronics Assembly

PowerDistribution

Unit

SpacecraftInterface Unit

(TBD)

ACD-LAT ElectricalInterface

Show interfaces



Analysis/Modeling/EM ReportsAnalysis/Modeling/EM Reports• Identify analysis and modeling performed since PDR

– What are the impacts due to spacecraft/bus interface• Highlight impact to analysis due to design change• Highlight impact to design due to modeling change

Efficiency measurement setup:

M1, M2 - hardware trigger scintillators

S1, S2, S3 - software trigger scintillators

T1, and T2 - tested TDA’s

µ M1

S1

S2

T1

T2

S3

M2

Subject of the test - Fermilab made TDA prototypes (T1 and T2) equipped with clear fiber extensions and fiber-to-fiber connectors (made by GSFC)

Up to 50% of the light created in the tile, is being lost duringtransportation to the PMT

• Provide example of EM testing– Identify objective and resultsExample from ACD



Qualification/Environmental Test PlanQualification/Environmental Test Plan

• Identify qualification and environmental test to be performed in accordance to LAT Verification and Test Plan

ACD-LAT ICDRequirements and

Verification Database

ACD-LAT ICDRequirements and

Verification Database

Links between Requirements

ACD Level III and IV Requirements Database

ACD Level III and IV Requirements Database ACD Test

Databases

ACD Test DatabasesACD Allocation

Tables

ACD Allocation Tables

Development UnitPhase Design Fab Test

Engineering UnitPhase Design Fab Test

Flight UnitPhase Design Fab Test

Flight Environmental Testing

Acceptance Level

Environmental TestingQualification Level

PeerReviews

PeerReviews

Dev Unit Mods foldedinto Engineering Units

Design

RequirementsReview

Eng Unit Modsfolded into Flight

DesignSystems Eng

Pre-Fab Review

Systems EngPre-Fab Review

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Remarks

ACD Subsystem (Integrated ACS F GSFC Acpt X X ? X?-r X X X X X X C 4 X Acceptance LevelsSA F GSFC Acpt X ?SA D GSFC Qual X-b X X X X X 6S F GSFC Qual X-e X-e X-e X-e X X 2 ACD Structure w/mass sims, no elect or detC F TBD Par Qual X-e X-e X-e X-e X 2 ?P D GSFC Qual X-b h h h

SA F Fermilab Acpt X X X-d h X A, F-h 117 Flt TDAs SA S Fermilab Acpt X X-d 8 28 Flight SparesSA EM Fermilab Qual X X X X-d X F 6 20 TDAs

Tile Detector Assembly SA D Fermilab Qual X X X X-d 6 Functional testing code660 TDA Tiedown (Flexure) P F GSFC TBD X-c X Test bonded joint TDA Tiedown (Flexure) ? P EM GSFC Par Qual X-c X X X X X h Test bonded joint TDA Tiedown (Flexure) P D GSFC Qual X-b h Characterize flexures

C F GSFC TBD X A, F-hC EM GSFC Par Qual h X X-c X F h

WSF/Clear Fiber Connector C D GSFC Qual X ? h X X-d A? h 8-d Several development modelsC F GSFC Acpt ? X-e-c X-e-c X-e-c X-e-c X 4-c

SA EM GSFC Qual X X-? X X X X? X? F 2? Corner or one side BFA, BEA assembC D GSFC Par Qual X X-e X-e

Shield & Thermal Blanket C F GSFC X 4-c Similarity to dev. model Shield & Thermal Blanket C EM GSFC X Similarity to dev. model

C D JSC, GSF Qual 6 Characterize thermal perf., particle impactClear fiber cable assembly SA F GSFC Qual X-c X-c X A

C F GSFC TBD X-c X-c X-c X AC EM GSFC Par Qual X X-c X F 6-c

PMT/Fiber Connector C D GSFC Qual X X X-d F 8-d Several development modelsS F GSFC Acpt X-? X-? F

SA F GSFC Acpt X X X X F 2? (FREE, HVBS, PMT)SA EM GSFC Qual X X X X X F 10 (FREE, HVBS, PMT)SA D GSFC Qual F 2 (FREE, HVBS, PMT)

Electronics Chassis SA BB GSFC F mech BEA parts

Electronics Chassis Electronics Chassis

Tile Detector Assembly

WSF/Clear Fiber Connector WSF/Clear Fiber Connector

Base Frame Partial BFA & Electronics Chassis

Base Electronics Assembly Electronics Chassis

Base Frame - partial

Thermal

Item

Tile Shell Assembly Tile Shell Assembly - partial

Structural/MechanicalHardware Electrical

Shield & Thermal Blanket

PMT/Fiber Connector PMT/Fiber Connector

ACD Mech S/S (no elect or Det) Shell Shell - partial Tile Detector Assembly Tile Detector Assembly

Show Flow

TraceabilityTest & Verification

Matrix



Parts & FMEA/WCA Parts & FMEA/WCA

• Parts and qualification status • FMEA/WCA/Fracture Control

Example - Results of Qualification PMT’s acceptance test

PMT 0882 0609 0610 0879 0883 0896 0885 1088 10851 Measured Sensitivity

At 900 VAt 1000 VAt 1050 V

209480

142340491

264609879

219512

249569

283619932

148330490

59146217

247578810

2 Measured L.Y. at900V-1050V

26-28.3 21.5-23.5

22.5-26 24-27 27-28 25-29 23-24 19-23 20-21.5

3 Measured L.Y. average,(place)

27.1(2-3)

22.5(7)

24.3(5)

25.5(4)

27.5(1)

27(2-3)

23.5(6)

21(8-9)

21(8-9)

4 Measured L.Y. atsensitivity of 600channels, (place)

28(1)

24(6)

24.5(5)

25.5(4)

27.5(2)

27(3)

23.5(7)

21(8-9)

21(8-9)

5 Q.E., from Data sheet(hereafter D.S.), (place)

16.0(5-6)

16.0(5-6)

15.4(7)

16.9(2)

16.8(3)

17.6(1)

16.1(4)

15.0(9)

15.2(8)

6 Measured Gain=sens(1000V)/L.Y. average,(place)

17.7(6)

15.1(7)

25.0(2)

20.1(5)

20.7(4)

22.9(3)

14.0(8)

7.0(9)

27.5(1)

7 Gain, from Data sheet,(place)

7.91(6)

6.19(8)

10.40(2)

8.66(5)

9.11(4)

10.10(3)

6.42(7)

3.00(9)

11.44(1)

8 L.Y. average / Q.E.(D.S.) 1.69 1.41 1.58 1.51 1.64 1.53 1.46 1.40 1.389 L.Y.(600) / Q.E.(D.S.) 1.75 1.50 1.59 1.54 1.64 1.53 1.52 1.3810 Gain at 1000V/Gain D.S. 2.24 2.44 2.40 2.32 2.27 2.27 2.18 2.33 2.40

Identify status of qualification test



Peer Review Agenda

(Suggested)



Suggested Peer Review Agenda (1/3)Suggested Peer Review Agenda (1/3)

Subsystem introduction & overview– Schedule summary– Critical path analysis

Subsystem engineering– Overview - identify major subsystem and interface design changes since

∆PDR• CCB’s (approved since ∆PDR and pending)

– Requirements and budget allocation updates– Subsystem ICDs, drawings, and procedures status– Subsystem performance analysis

• Simulation updates• Design trades analysis performed• Verification matrix• Reliability results• FMEA• Worst case analysis or part stress results • Fault tree analysis or single point failure analysis results

– Subsystem technical risk assessment & mitigation plan– Engineering model assessment




Major assemblies/elements within the subsystem– Requirement/compliance matrix – update since ∆PDR– Allocated budgets (mass, power, c.g., etc..) – updates from EM or

actual– Mechanical & electronic design changes since ∆PDR

• Performance modeling updates (structural, thermal, electronics)– Major assemblies/component

• Performance summaries– Performance prediction vs. requirement

– Engineering model test results• Test data discussion• Test result as compared to expected performance/prediction

– Design changes resulting from EM test• Qualification plan (including vibration, thermal, EMI/EMC, etc..)

– Procurement plan & Status• Identify critical component need dates vs. delivery dates• Summarize procurement contract status• EEE parts and material approval status/readiness• Long lead part requirement/procurement




Subsystem assemblies (fabrication plan)– Assembly flow overview & facilities status– Production readiness reviews

• Performed or planned– Test plan– Test Equipment (mechanical & electrical) preparation

• MGSE and EGSE status• Rack elevation, cables, power, test adapter• Test software and scripts status

– Processes & procedures– Transportation and handling plan/procedures

• Transportation container designSubsystem product assurance– Non-conformance reporting tracking and readiness– Production travelers



ConclusionConclusion

““We are ready to proceed to subsystem fabrication”We are ready to proceed to subsystem fabrication”

Design StatusDesign Status

Demonstrate evolution & heritage of “Final Design”Demonstrate compliance of system performanceClosure of Actions from PDR & ∆PDRComplete ICDsFinal implementation plans– EM– Prototype– Flight Units– Spares

Complete design analysis

Fabrication StatusFabrication Status

Qualification/Environmental Test Plan and FlowControl methods for all safety hazards identifiedFMEAWorst case analysisFracture controlShipping environment and mode of transportation

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