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Simon Windsor & Khilna Chandaria November 2016 Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

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Page 1: Simon Windsor & Khilna Chandaria November 2016 - … Windsor & Khilna Chandaria November 2016 Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without

Simon Windsor & Khilna Chandaria

November 2016

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

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Legal DisclaimersIntel technologies may require enabled hardware, specific software, or services activation. Performance varies depending on system configuration. Check with your system manufacturer or retailer.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmarkand MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance.

§ For more information go to http://www.intel.com/performance.

Celeron, Intel, the Intel logo, Intel Atom, Intel Core, Intel. Experience What's Inside, the Intel. Experience What's Inside logo, Intel Inside, the Intel Inside logo, Intel RealSense, Intel Unite, Intel vPro, Iris, Pentium, Thunderbolt, the Thunderbolt logo, and True Key are trademarks of Intel Corporation in the U.S. and/or othercountries.

*Other names and brands may be claimed as the property of others.

Warning: Altering PC clock or memory frequency and/or voltage may (i) reduce system stability and use life of the system, memory and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel assumes no responsibility that the memory, included if used with altered clock frequencies and/or voltages, will be fit for any particular purpose. Check with memory manufacturer for warranty and additional details.

All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps

Cost reduction scenarios described are intended as examples of how a given Intel- based product, in the specified circumstances and configurations, may affect future costs and provide cost savings. Circumstances will vary. Intel does not guarantee any costs or cost reduction.

© 2016 Intel Corporation.

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

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Agenda

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

• Intel Desktop platform Update• Platform Roadmap • Intel vPro & Stable Image program• Thunderbolt 3, Unite & VR

• Intel Server Roadmap

• Intel Optane & SSDs

• Intel NUC & Compute Stick

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Intel® DesktopHigh-Level Roadmap

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

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5Q Desktop Product RoadmapLeft edge of box represents early edge of the production window1

SProcessors

Y / ZProcessors

NProcessors

XProcessors

Skylake-SDual and Quad-Core 95W, 65W, 35W LGA

Kaby Lake-SDual and Quad-Core 95W, 65W, 35W LGA

Apollo LakeDual and Quad-Core10W SOC, BGA

Kaby Lake-YDual-Core ≤4.5W 1-chip BGA

Cherry TrailQuad-Core 2W SoC BGA

Broadwell-E6, 8, and 10-Core140W LGA

Note: All S processor TDPs correspond to reference thermal solutions. 6th Gen Intel® Core™ and 7th Gen Intel® Core™ 95W SKUs use a 130W thermal solution. See Mark.Intel.com for tested spec limits for each SKU.1. The most recent platform dashboard or ILU should be used to resolve any discrepancies with the dates and timelines on this slide.

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

Skylake-X6, 8, and 10-Core 140W

Kaby Lake-X4 Core ≥95W

Broadwell-E Skylake-X Kaby Lake-X Kaby Lake-S Kaby Lake-Y Apollo Lake

Dashboard1

Production Window

BDW-E: In production SKL-X: ww27-39’17 KBL-X: ww27-39’17 KBL-S 4+2: ww42-45’16KBL-S 2+2: ww51’16-05’17

KBL-Y 2+2: In ProductionKBL-Y 2+2 (integrated HDCP 2.2):ww44-47’16

APL: In production

Aug 2016 ILU1

Sales Embargo

BDW-E: Launched SKL-X: TBD KBL-X: TBD KBL-S 4+2: Jan’17KBL-S 2+2: Jan’17

KBL-Y 2+2: Launched APL: Launched

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Performance Sleek / Stylish Design Low Power

Lo

w P

ow

er

Pe

rfo

rma

nce

5 Quarter Desktop Form Factor / Silicon Advocacy

Enthusiast Tower

• Gaming

• Content Creation

• Max Performance

• No compromise for DIY/Modders

Mainstream Tower

• Price/Performance

• Versatile

• Security

All-in-One

• High Performance

• Stylish

• Huge HD Display

Mini PC

• Full PC Performance

• Space Savings; Fits Anywhere

Compute Stick

• Large screen computing

• Freedom to consume & connect

For a full list of OS support, please see the appropriate platform POR document posted on iref.intel.com (available document links included in note section below).

1) Refer to the Mobile 5Q Roadmaps at iref.intel.com for details on Kaby Lake-U, Kaby Lake-Y, & Cherry Trail (document links included in note section below).

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

Broadwell-E / Skylake-X / Kaby Lake-X

Skylake-S / Kaby Lake-S

Apollo Lake

Kaby Lake-Y1

Cherry Trail1

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7th Gen Intel® Core™ Processors

1. Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration. No computer system can be absolutely secure. Check with your system manufacturer or retailer or learn more at [intel.com].

Double-digit performance gains on a mobile PC vs. 5-yr-old PC1

Ultra performance with unlocked parts

Modern Standby and Intel® Ready Mode Technology

Better power efficiency for mobile

Intel® Optane™ Memory

Performance and Responsiveness

Dedicated media engine

4K UHD with HDR and WCG support

Premium 4K content from service providers

High fidelity audio

Fantastic Entertainment

No passwords

HW-enhanced multifactor authentication

Secure online transactions and payments

Security

4K and 360 content creation

Touch, stylus, and voice input

Content Creation

Better together with Windows* 10

Intel’s Best-In-Class PlatformsInnovation to drive exciting experiences, capabilities and form factors

Powerful compute for an amazing VR experience

Virtual Reality Experience

On-the-go full HD gaming on Intel® Iris™ graphics

Live-broadcast gaming

Fluid and Vivid Gaming

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7th Gen Intel® Core™ (Kaby Lake-S) Platform Value Proposition

Fantastic Media & Display

• Media and Display enhancements to drive improved visual experiences and access to Premium Content1

Increased Performance1

• Improved CPU performance1

• More I/O for high performance PCIe devices1

Amazing Responsiveness

• Increased system responsiveness with Intel® Optane™ Technology1

Platform Compatibility2

• 7th Gen Intel® Core™ Desktop (S) processors are footprint compatible with 6th Gen Intel® Core™ Desktop (S) processors

1. Results have been estimated or simulated by Intel based on a comparison of 7th Gen Intel® Core™ core frequencies with 6th Gen Intel® Core ™ IA core frequencies. Results have been estimated or simulated using internal Intel analysis or architecture simulation or modeling, and provided for informational purposes. Any differences in your system hardware, software or configuration may affect your actual performance. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information visit http://www.intel.com/performance. 2. Only refers to LGA processor socket compatibility. For SW, new graphics driver required to support new graphics and media HW features.

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

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7th Gen Intel® Core™ (Kaby Lake-S) Platform Overview

Key Features Platform Details

Socket:• LGA 1151

Power:• Dual & Quad Core: 65W, 35W• Enthusiast Quad Core: 95W

Chipset Compatibility:• Intel® 200 Series Chipset• Intel® 100 Series Chipset4

• Increased Core Performance1

• Enhanced Full Range BCLK Overclocking2

• Media and Display Enhancements:• 5120x2880@30Hz w/ one cable;

5120x2880@60Hz w/ two cables3

• HEVC 10-bit(HW) Decode/Encode• VP9 10-bit(HW) Decode• Premium UHD/4K Content

• Support for Intel® Optane™ Technology• Support for Thunderbolt™ 3• Intel® Ready Mode Technology• Intel® Turbo Boost Technology 2.0

1. Results have been estimated or simulated by Intel based on a comparison of 7th Gen Intel® Core™ IA core frequencies with 6th Gen Intel® Core ™ IA core frequencies.. Results have been estimated or simulated using internal Intel analysis or architecture simulation or modeling, and provided for informational purposes. Any differences in your system hardware, software or configuration may affect your actual performance. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information visit http://www.intel.com/performance.2. Unlocked features are present with select chipsets and processor combinations. See overclocking disclaimer on slide 2.3. Requires two combined display I/O in collage mode. 4. Excludes Intel® Optane™ Technology support

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

‡: DDR4 spec increase for 1DPC & 2DPC UDIMM and 1DPC SODIMM only

EDPKaby Lake Processor

Intel®200

Series Chipset

DMI 3.0

DDR4 (1.2V) 2400 ‡:

DDR3L (1.35V) 1600

x16 PCI Express 3.03 DDI

USB 3.0

USB 2.0

10/100/1000 LAN PHY

PCI Express 3.0

Enhanced SPI

SPI

LPC

SMBus

Audio

SATA 3.0

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Intel® 200 Series Chipset Overview

Key Features

New Intel® Chipset with Increased I/O Performance & Flexibility

• Support for 7th Gen Intel® Core™ and 6th Gen Intel® Core™ Processors• 30 Total High-Speed I/O lanes with Increased Port Flexibility1

• Up to 24 PCIe 3.0 and 6 SATA 3.0• Up to 10 USB 3.0 Ports

• Support for Intel® Optane™ Technology• Intel® RST PCIe Storage x4 Gen3• Intel® Rapid Storage Technology 15

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

Intel®200

Series Chipset

USB 3.0

USB 2.0

10/100/1000 LAN PHY

PCI Express 3.0

Enhanced SPI

SPI

LPC

SMBus

Audio

SATA 3.0

1. Compared to Intel® 100 Series Chipset

*Certain features may not be present in all SKUs.

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11Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

High Fidelity Visuals w/ Enhanced Video Formats for the Ultimate Media Experience* Other names and brands may be claimed as the property of others.

11

High Fidelity Premium Content

• 4K/UHD Premium Content from providers like Netflix*

• HDCP 2.2 over DisplayPort

• HW Decode support for HEVC & VP9 10-bit

• REC2020 (Wide Color Gamut) & HDR with Blu-ray UHD Playback

User Generated Content

• 4K Streams using HEVC HW (8b/10b) Decode & Encode

• Fast browser & YouTube* Content Decode (VP9 HW Decode)

• Fast Content Creation & Editing

Protected Content

• Hardware DRM support for Premium Content Playback anytime, anywhere

• Enhanced Content Protection with PlayReady 3.0

• Intel® Software Guard Extensions (Intel® SGX) Content Protection for scaling 4k

7th Gen Intel® Core™ (Kaby Lake-S) Graphics –Delivers Next Generation Content to PC

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Intel® BusinessRoadmap

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

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Desktop Platform – Business Roadmap2016 2017

Q3 Q4 Q1 Q2 Q3

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

i7-6700

i5-6600

i5-6500

i3-6320

i3-6300

i3-6100

G4520

G4500

i3-6320

i3-6300

i3-6100

G4520

G4500

P1

MS2

MS1

T3

T2

T1

L3

L2

Skylake-S Kaby Lake-S

NOTE: Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See www.intel.com/products/processor_number for details. Roadmap shows production availability and is not reflective of exact launch granularity and timing – please refer to ILU guidanceRoadmap shows SKU advocacy and is not an indication of product end-of-life status.

1 Kaby Lake-S Dual Core 65W & 35W LGA production window target ww51’16 .

L1 G4400 G4400

Intel® SIPP Processors supporting Intel® vPro™ Technology

i7-7700

i5-7600

i5-7500

i7-7700

i5-7600

i5-7500

i7-7700

i5-7600

i5-7500

i7-7700

i5-7600

i5-7500

i3-73201

i3-73001

i3-71001

G46201

G46001

G45601

i3-7320

i3-7300

i3-7100

G4620

G4600

G4560

i3-7320

i3-7300

i3-7100

G4620

G4600

G4560

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Desktop Platform – Business RoadmapLow Power 35W

2016 2017

Q3 Q4 Q1 Q2 Q3

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

i7-6700T

i5-6600T

i5-6500T

i3-6300T

i3-6100T

i3-6300T

i3-6100T

P1

MS2

MS1

T2

T1

Skylake-S Kaby Lake-S

NOTE: Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See www.intel.com/products/processor_number for details. Roadmap shows production availability and is not reflective of exact launch granularity and timing – please refer to ILU guidanceRoadmap shows SKU advocacy and is not an indication of product end-of-life status.

1 Kaby Lake-S Dual Core 65W & 35W LGA production window target ww51’16 .

Intel® SIPP Processors supporting Intel® vPro™ Technology

i7-7700T

i5-7600T

i5-7500T

i7-7700T

i5-7600T

i5-7500T

i7-7700T

i5-7600T

i5-7500T

i7-7700T

i5-7600T

i5-7500T

i3-7300T1

i3-7100T1

i3-7300T

i3-7100T

i3-7300T

i3-7100T

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Desktop Platform – Business Roadmap (BGA)

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

Apollo Lake

NOTE: Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See www.intel.com/products/processor_number for details. Roadmap shows production availability and is not reflective of exact launch granularity and timing – please refer to ILU guidanceRoadmap shows SKU advocacy and is not an indication of product end-of-life status.

2016 2017

Q3 Q4 Q1 Q2 Q3

J3

J2

J1

J4205

J3455

J3355

J4205

J3455

J3355

J4205

J3455

J3355

J4205

J3455

J3355

J4205

J3455

J3355

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Intel® ChipsetRoadmap

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

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Desktop Chipset RoadmapBusiness Platforms

2016 2017

Q3 Q4 Q1 Q2 Q3

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

Q170

Q150

B150

H110 H110

B250

Stable PlatformsIntel® vPro™

Technology iSIPP

H110

iSIPP

Small & Medium Business

Value

B250

Q270

Q250

Q270

Q250

H110

Roadmap shows production availability and is not reflective of exact launch granularity and timing – please refer to ILU guidance.Roadmap shows SKU advocacy and is not an indication of product end-of-life status.

B250

Q270

Q250

H110

B250

Q270

Q250

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Intel® 200 Series Chipsets BusinessKey Feature Differentiation Q270 Q250 B250

Intel® ME 11.6 Firmware SKU Corporate Corporate Corporate / Consumer

Processor PCI Express* 3.0 Configuration Support1x16 or 2x8 or

1x8+2x41x16 1x16

Intel® SIPP Eligible Yes1 Yes1 No

Intel® vPro™ Technology with Intel® Active Management Technology

Yes1,2 No2 No

Intel® Optane™ Technology Yes Yes Yes

Intel® Rapid Storage Technology Yes Yes Yes

Intel® Rapid Storage Technology for PCIe Storage Driver Support3 Yes Yes Yes

RAID 0, 1, 5, 103 Yes No No

Intel® Smart Response Technology3 Yes No No

I/O Port Flexibility Yes Yes Yes

Maximum High Speed I/O Lanes 30 27 25

Total USB Ports (Maximum USB3)4 14 (10) 14 (8) 12 (6)

Maximum SATA 3.0 Ports (6 Gbit/s) 4 6 6 6

Maximum PCI Express* 3.0 lanes4 24 14 12

Maximum Intel® RST for PCIe Storage Ports (x4 M.2 or x2 SATA Express) 4 3 1 1

• Supports 7th Gen Intel® Core™ (KabyLake-S) & 6th Gen Intel® Core™ (Skylake-S) processors LGA 1151

• Support for Intel® Optane™ Technology• Intel® Rapid Storage Technology 15• Three independent displays • Intel® Platform Trust Technology (w/o

Intel® TXT)• Intel® Device Protection Technology

with Boot Guard• Intel® Smart Sound Technology• Integrated Gigabit Ethernet MAC

• Supports Jacksonville PHY

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

Some features are not available on all corporate chipset skus.

1. iSIPP, vPro™, & AMT on Kaby Lake-S processors are only supported with select Intel® 200 series chipsets2. Supports Intel® Standard Manageability3. Some features and capabilities require SSDs and/or multiple HDDs4. Maximum lanes/port counts available may vary depending on platform implementation

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Intel® 100 Series Chipsets BusinessKey Feature Differentiation Q170 Q150 B150

Intel® ME Firmware SKU Corporate Corporate Corporate

Processor PCI Express* 3.0 Configuration Support

1x16 or 2x8 or 1x8 + 2x4

1x16 1x16

Intel® SIPP Eligible Yes1 Yes1 No

Intel® vPro™ Technology Eligible Yes1 No No

Intel® Active Management Technology Yes1 No2 No

Intel® Rapid Storage Technology Yes Yes Yes

RAID 0, 1, 5, 103 Yes No No

Intel® Smart Response Technology3 Yes No No

Maximum HSIO Lanes 26 20 18

Total USB Ports (Maximum USB3)4 14 (10) 14 (8) 12 (6)

Maximum SATA 3.0 Ports (6 Gbit/s) 4 6 6 6

Maximum PCI Express* 3.0 lanes4 20 10 8

Maximum SATA Express Capable Ports (x2) 4 3 1 1

Maximum Intel® RST for PCIe Storage Ports (x4 M.2 or x2 SATA Express) 4 3 0 0

• Supports 6th Gen Intel® Core™ (Skylake-S) and 7th

Gen Intel® Core™ (Kaby Lake-S) processors LGA 1151

• Three independent displays (w/ Skylake-S processor)

• Corporate Intel® ME Firmware support• Intel® Platform Trust Technology (w/o Intel® TXT)• Intel® Device Protection Technology with Boot

Guard• I/O Port Flexibility• Intel® Smart Sound Technology• Intel® Rapid Storage Technology 14• Integrated Gigabit Ethernet MAC

• Supports Jacksonville PHY

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

1. iSIPP, vPro™, & AMT on Intel® 100 series chipsets are only supported with select 6th Gen Intel® Core™ (Skylake-S) processors2. Supports Intel® Standard Manageability.3. Some features and capabilities require SSDs, multiple HDDs and/or Skylake-S processors.4. Maximum lanes/port counts available may vary depending on platform implementation.

Some features are not available on all corporate chipset skus.

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Q1’17 Q2’17 Q3’17

2017

* Left edge of box corresponds to targeted OEM Enterprise system shipment (FCS)

CPU: i7-6700, i7-6700T, i5-6600, i5-6600T, i5-6500, i5-6500T

PCH: Intel® Q170 Chipset (vPro™), Intel® Q150 ChipsetWLAN: Intel® Dual Band Wireless-AC 8260 (Snowfield Peak)LAN: Intel® Ethernet Connection I219-LM (Jacksonville LM)SSD: Intel® SSD Pro 2500 Series (2.5” and M.2)

6th Gen Intel® Core™ (Skylake-S) Platform iSIPP components

Q3 ‘16 Q4 ‘16

2016

Skylake-S iSIPP Software

OS Wi-Fi LAN Gfx ME Firmware

Windows* 7 32 bit 18.12.1.2 20.2 15.40.4.4256 11.0.0.1171

Windows* 7 64 bit 18.12.1.2 20.2 15.40.4.64.4256 11.0.0.1171

Windows* 8.1 64 bit 18.12.1.2 20.2 15.40.4.64.4256 11.0.0.1171

Windows* 10 64 bit 18.12.4.2 20.2 15.40.6.64.4278 11.0.0.1171

Intel® SIPP (iSIPP) Transition Guidance: Desktop

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

6th Gen Intel® Core™ (Skylake-S) Processors 4+2Intel® Q270 and Q250 Chipsets

6th Gen Intel® Core™ (Skylake-S) Processors 4+2Intel® Q170 and Q150 Chipsets

Other names and brands may be claimed as the property of others.

7th Gen Intel® Core™ (Kaby Lake-S) Processors 4+2Intel® Q270 and Q250 Chipsets

Better

Best

+ Intel® Qx50 Chipset

+ Intel® Qx70 Chipset

CPU: i7-7700, i7-7700T, i5-7600, i5-7600T, i5-7500, i5-7500T

PCH: Intel® Q270 Chipset (vPro™), Intel® Q250 ChipsetWLAN: Windstorm Peak, Intel® Dual Band Wireless-AC 8260 (Snowfield Peak)LAN: Intel® Ethernet Connection I219-LM (Jacksonville LM)SSD: Intel® SSD Pro 6000p

7th Gen Intel® Core™ (Kaby Lake-S) Platform iSIPP components

Kaby Lake-S iSIPP Software

OS Wi-Fi LAN Gfx ME Firmware

Windows* 10 64 bit (RS1) TBD Q4’17 TBD Q4’17 TBD Q4’17 TBD Q4’17

Windows*7 32 bit/64 bit and Windows* 8.1 supported on Skylake-S iSIPP eligible CPUs with Intel® Q270 and Q250 Chipsets

(Drivers/Firmware versions TBD Q4’17)

Updated

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Intel® Desktop User Experiences & Capabilities

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

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Intel® Turbo Boost Max Technology 3.0

• In-Die Variation naturally produces parts with some cores that are faster than others (higher performance/ lower voltage)

• Intel® Turbo Boost Max Technology 3.0

o Identifies the best performing core to provide increased single threaded performance

o Requires OS awareness or Intel’s core affinitization driver to get the performance benefits

• Processor continues to operate within specifications/warranty, this is not “overclocking”

Intel® Turbo Boost Max Technology 3.0 improves single thread performance on X-series platforms starting with BDW-E

Core 1 Core 2 Core 3 Core 4

Core 5 Core 6 Core 7 Core 8 Core 7

Core 2 Core 3 Core 4

Core 5 Core 6

Core 1

Core 8

Processor 1 Processor 2

vsBest Core

Intel® Turbo Boost Max Technology 3.0 improves single thread performance on X-series platforms starting with BDW-E

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

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The Age of the Always Available PC; Intel® Ready Mode Technology

ALWAYS LISTENING FOR VOICE

COMMANDS

Go Hands FreeCommunication

Media & Gaming

NEVER AGAIN MISS

OUT ON UPDATES OR

VIDEO CALLS

Data Synchronization

APPLICATIONS INSTANTLY UPDATED

Ready in a Flash

INSTANTLY RESUME

“ALWAYS AVAILABLE”

RESPONSIVENESS

MORE

RESPONSIVE

WINDOWS CORTANA / HELLO

Remote Desktop

MANAGE YOUR HOME OR OFFICE PC AROUND THE CLOCK

INSTANT STREAMING

Simplify your digital life in your home or office

Intel® Ready Mode Technology replaces traditional sleep state with a quiet, low power, display off, active state.1 — similar to the kind used by your cell phone and tablet

Digital content “Always Available”. Anytime Anywhere.

Unleash your computing power, Bring your vision to life

1 Requires an Intel® Ready Mode Technology-enabled system or motherboard, a genuine Intel® processor, Windows® 7, Windows 8.1, or Windows 10 OS. Results dependent upon hardware, applications installed, internet connectivity, setup and configuration.

In market with 6th Gen Intel® Core™ and Windows 10;7th Gen Intel® Core™ & Apollo Lake call to action: Enable Intel® Ready Mode Technology on all desktop systems

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

Other names and brands may be claimed as the property of others.

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27

Thunderbolt™ 3 brings the best USB-C to Desktop

More

Speed

More

Protocols

The USB-C that does it all.

More

Pixels

More

Power

Dual 4K displays60hz

15Wdevice

40 Gbps – fastest connection

As compared to other PC I/O connection technologies including eSATA, USB, and IEEE 1394 Firewire. Performance will vary depending on the specific hardware and software used. Must use a Thunderbolt-enabled device.

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

Other names and brands may be claimed as the property of others.

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Intel® DesktopBusiness Capabilities

& Features

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

Intel® vPro™ TechnologyPerformance/Productivity, Security, Manageability, & Stability

Intel® Small Business AdvantageSecurity, Connectivity, Sharing, & Device Health Management

All in One Mini PC Tower

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29

7th Gen Intel® Core™ vPro™ Desktop Platform

Simple Collaboration in smart and connected conference rooms• Intel® Unite™ v4 (or latest)

No Wires:• Intel® Unite™, Intel® Authenticate bluetooth proximity

usages

Amazing Responsiveness: • System acceleration with Intel® Optane™ Technology,

Intel® RMT

Enhanced Setup & Configuration software for ease of AMT activation

Intel® AMT continuity with SCCM and Intune

Intel® Stable Image Platform Program

Workplace Transformation

Remote manageability made easier

Scale Security Capabilities: Protect, Detect, Correct

Right Device for the Right Job

Hardware-enhanced security with amazing performance for user productivity to drive workplace transformation

IT Foundation

Worker Productivity

PERFORMANCEFORM FACTORS

SECURITY MANAGEABILITYSTABILITY

USER EXPERIENCEPRODUCTIVTY

Intel® Authenticate hardware-enhanced multi-factor authentication• Pre-boot support, face recognition

3D NAND-based Intel Pro SSDs (PCIe and SATA)• Scale Remote Secure Erase

Intel® SGX identity and data protection usages

Compelling refresh opportunities across all desktop form factors

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

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30

Intel® Unite™: Smarter conference rooms. Smarter meetings.

1 - Example plug-ins only. Cisco* Telepresence, Lighting Controls and Skype for Business*, showcase the type of environment and solution integration that can occur using the design of the Intel Unite solution and the accompanying Intel Unite Plug-In SDK.

Share instantly

See who is connected

Quick disconnect

Room lights too bright? Try dimming them

Easily control other room features1

Quickly send a file to meeting participants

Know where you’re sharing your content

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

Other names and brands may be claimed as the property of others.

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31

Version 2.0

AVAILABLE NOW

Version 1.0

Content Sharing• Wireless display• Split screen share• Peer-to-peer1

Operating System Support• Microsoft Windows* 7, 8.1, 10• Apple* Mac OS X

Core Product• Annotations• File Sharing

Common Unified Architecture• Plugin SDK• Plugins:

• Guest Access

Content Sharing• Wireless display (App Sharing)• Extended display

Operating System Support• Microsoft Windows 7, 8.1, 10• Apple Mac OS X

Core Product• Auto Disconnect

Common Unified Architecture• Plugins:

• Skype for Business*

Intel® Unite™ App Feature Roadmap

1 – Minimum of one client in a peer-to-peer sharing session must have 4th gen or newer Intel Core vPro or Intel Core M vPro processor2 – In-room participants only. Up to 1080p at 20-30fps. Client PC requires 3rd gen Intel Core Processor or newer with Intel graphics, running Windows 7, 8.1 and 10.This slide contains details, product schedules and other information that is subject to change without notice.

Version 3.0

AVAILABLE NOW

Content Sharing• Video playback with audio support2

Operating System Support• Microsoft Windows 7, 8.1, 10• Apple Mac OS X• Apple iPad app (view only)

Core Product• Scheduled Meetings• Meeting Lock

Common Unified Architecture• Plugins:

• Secure Guest Access

Version 4.0

IN-MARKET AVAILABILITY: 1H 2017

Content Sharing• Multi Room/Hub meeting support

Operating System Support• Microsoft Windows 7, 8.1, 10• Apple Mac OS X, Apple iPad app• Google Android* & Chrome* app

Core Product• New User Interface•.Admin Portal Telemetry Data•Deployment & SW Maintenance Improvements

Common Unified Architecture• New Plugin Architecture & SDK• Plugins:

• eWhiteboard Content Sharing

PLANNING PHASEDEVELOPMENT PHASE

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

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Intel® Desktop Form Factor AdvocacyIntel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

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3333

Mainstream TOWER PCThe Power to Play, Create, Entertain, and Inspire

Price/Performance

• High-performance processor and graphics

• Wide range of scalable options

• Very cost-effective

Versatile

• Highly configurable and customizable

• Expandable and upgradable memory, storage, and other components

• Supports multiple displays and existing peripherals

Security

• Hardware-enhanced security features help protect data and identities

• Large storage capacity keeps content and info at home

• Hard to lose or steal

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.33

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ALL-IN-ONE PCAmazing Performance—Stylish Fun

High Performance

• Desktop-class computing performance

• Increased productivity

• Broad hardware and software compatibility to run favorite apps

• Fast, high-capacity SSD storage1

Stylish

• Beautiful, clutter-free design

• Full PC and monitor in one

• Built-in camera, microphone, and premium audio

• Adaptable and versatile design options – upright to lay flat, built-in battery options1

Huge HD Display

• Large 4K Ultra-HD1 or HD screen with premium audio

• Touch screen1

• Intel® RealSense™ gesture control and facial recognition1

1. Available on select models and configurations.

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

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Sleek, stylish & space-saving

Amazing desktop-class performance

High Quality Display

Simultaneous multi-user PC

games, education, home theater

AIO Value Proposition

Clean lines, slim, no cables, clutter-free, modern, one cord

setup

Storage, memory, compute & I/O

performance of a desktop without the

tower

Large, high quality 4K touch-screen to

immerse yourself in working, creating, gaming or videos

Shared family PC –multiplayer games, educational apps, movies & shows

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

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With Callouts Version

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Data Center Product Lines

Intel® Xeon Phi™ coprocessors work synergistically with Intel® Xeon® processors. SoCs are optimized for lower power, higher density design points.

+

Intel® Itanium® processor9500 product family

Intel® Xeon Phi™ coprocessor x100 product family

Intel® Xeon® processorE7 family

Intel® Xeon® processorE5 family

Intel® Xeon® processorE3 family

Intel® Xeon® processorD family

Intel® Atom™ processor product family

System on Chip (SoC) CPU Co-Processor

No Change

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Fabrics

Intel® Xeon PhiTM

Efficient Perf.2S Server/Wkstn

Efficient Perf.4S Server

ExpandableServer

38

Datacenter Platform Roadmap

Intel® True Scale FabricQDR Host Channel Adapter/Switch + Intel Fabric SW Suite

Intel® Omni-Path ArchitectureHost Fabric Interface/Switch & SW

Grantley-EP 4S Platform

E5-4600 v3 (Haswell)AVX2, DDR4, 9.6 GT/s, 22nm

Grantley-EP Platform

E5-2600 v3AVX2, DDR4, 9.6 GT/s, 22nm

E5-2600 v4 (Broadwell)AVX2, DDR4, 9.6 GT/s , 14nm

In Planning

18c

18c 22c

Brickland Platform

E7-8800/4800 v3AVX2, DDR3/4, 9.6 GT/s, 22nm

18 cores E7-8800/4800 v4 (Broadwell)AVX2, DDR3/4, 9.6 GT/s, 14nm

24 cores

Purley-SP Platform

Skylake14nm

AVX-512, 6 ch. DDR4, 10.4GT/s, Intel® Omni-Path

Architecture, FPGA, Next Gen NVM, Intel®

QuickAssist Technology

E5-4600 v4 (Broadwell)AVX2, DDR4, 9.6 GT/s, 14nm

22c

Groveport Platform

Knights Landing (CPU) AVX-512, MCDRAM, 6 ch. DDR4, Intel® OPA, 14nm

Knights Landing (Coprocessor)AVX-512, MCDRAM, 14nm

72c

72cIntel® Xeon Phi™ Coprocessor(Knights Corner)

61c

2016 2017

28 cores

NVM (Intel® DIMMs based on 3D XPoint™ Technology)Apache Pass

128GB, 256GB, 512GB

SSD Storage Future SSDs

P3700/P3600/P3500 (NVMe) 400-2000GB, 2.5” & AIC, HE & ME & SE Cold Stream (NVMe) 375-3000GB, 2.5” & AIC

D3700/D3600(DualPort NVMe) 800-2000GB, 2.5”, HE & ME

S3710/S3610/S3510/S3500 (SATA) 80 - 1600GB, 2.5” & M.2, HE & ME & SEE 3D NAND NVMe P4x00 and SATA S3520

SOC’s

Entry 1SGreenlow 1S Platform

Xeon E3-1200 v5 (Sky Lake)AVX2, DDR4, Iris Pro Gfx, 14nm

Xeon E3-1200 v6 (Kaby Lake)AVX2, DDR4, Iris Pro Gfx

4c

Grangeville PlatformXeon D 1500 (Broadwell DE)

45W TDP, DDR4, 14nm16cXeon D 1500 (Broadwell DE-NS)

45W TDP, DDR4, 14nm, QuickAssist16c

Atom C2000 (Avoton)64GB DDR3, 20W TDP, 4x2.5GbE

Atom C3000 (Denverton)128GB DDR4, VT-d, 4x10GbE

8c 16c

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Intel® Visual Compute Accelerator

Processor 20172016

Intel® Server Boards, Chassis, and Systems Roadmap

In DevelopmentShippingKey:

Intel® Xeon® Processor E5-2600 family

Scalable Performance

2S Density-optimized Compute Module and Chassis

2S Spread Core1U/2U Rack Optimized Server System

2S EEB Standard Server Board

Segment / Use Cases Server Product

Optimized density for HPC, HCI and Cloud use cases

Wide range of IO, storage and memory configurations to meet HPC, Storage, HCI, Cloud and Enterprise needs

High PCIe slots and performance at optimized price for entry level SMB, Embedded and Web hosting

• Intel® Xeon® Processor E5-2600 v4• 24 DIMMs, 8 PCIe slots• 24 2.5” drives, 12 3.5” drives, 8 NVMe in 2U• 1U/2U rack chassis

• Intel® Xeon® Processor E5-2600 v4• 8/16 DIMMs, 1 PCIe slot• 12/24 drives, 8 NVMe in 2U• 2U/4-Node, rack chassis

• Intel® Xeon® Processor E5-2600 v5• 24 DIMMs, 8 PCIe slots, Omni-Path, QAT, M.2, OCP Mezzanine• 24-2.5” drives, 12-3.5” drives, 24-NVMe in 2U, Dual 10GbE• 1U/2U rack chassis

• Intel® Xeon® Processor E5-2600 v4• 16 DIMMs, 6 PCIe slots, • 8/16 drives, SAS, dual 1GbE/10GbE• 4U pedestal chassis

• Intel® Xeon® Processor E5-2600 v5 • 16 DIMMs, 2 PCIe slots, Omni-Path, QAT, M.2• 24 2.5” drives, 12 3.5” drives, 8 NVMe in 2U• 2U/4-Node, rack chassis

• Intel® Xeon® Processor E5-2600 v5 • 16-DIMMs, 6 PCIe slots, dual 10GbE, M.2• 16 2.5” drives, 8 3.5” drives, 16 NVMe in 4U• 4U pedestal chassis

Kennedy & Taylor Pass (S2600KP, S2600TP)

Cottonwood Pass (S2600CW) Sawtooth Pass

Buchanan Pass

Wildcat Pass (S2600WT) Wolf Pass

Planning/Next Gen

Intel® Xeon® Processor E5-2600P family

Acceleration

2S Xeon+FPGAServer Board

High performance and acceleration for focused workloads in Cloud, Enterprise and Network

• Intel® Xeon® Processor E5-2600P v5• 24 DIMMs, 5 PCIe slots, M. 2, NVMe• 2U rack chassis

Blue Mountain Pass

Intel® Xeon® Processor E3-1200 family

Entry

1S micro-ATXServer SystemMid-range Enterprise

storage, Embedded & Light Web applications that value fast cores

• Intel® Xeon® Processor E3-1200 v6

• 4 DIMMs, 3 PCIe slots• 8 drives, SAS, I/O module

Silver Pass (S1200SP) Silver Pass Kaby Lake Refresh

• Intel® Xeon® Processor E3-1200 v5• 4 DIMMs, 3 PCIe slots• 8 drives, SAS, I/O module• 1U Rack /4U Pedestal chassis

• Coffee Lake• 4 DIMMs, 3 PCIe slots• 8 drives, M.2• 1U Rack /4U Pedestal chassis

Gold Run Pass

• Intel® Xeon® Phi Processor, up to 215W TDP support • 6 DIMMs, 2 PCIe slot• Dual-port Intel® Omni-Path in Riser 1 • 2U/4-Node, rack chassis

Adams Pass (S7200AP)Intel® Xeon® PhiTM

product family

Performance

Parallelized workflows in the HPC market

1S Density Optimized Compute Module and Chassis

2018

3 x Intel® Xeon® Processor E3-1283L v42 x 8GB or 16GB DDR3L ECC SODIMMs per E3 node

Full-length, double width x16 PCIe add-in card

Valley Vista (VCA1283LVV)

3 x Intel® Xeon® Processor E3-1285L v52 x 16GB or 32 GB DDR4 ECC SODIMMs per E3 nodeFull-length, double width x16 PCIe add-in card

Monte Vista (VCA1585LMV / MV-S) Intel® Xeon® Processor E3-1200 family

Visual Compute

• Next Gen

VGA Gen3Dense transcode and remote WS for Xeon E5 systems

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Quality & Reliability

- Best-in-class design

- uncompromising quality standards

- 1000’s of hours of validation

- Standard 3 Year Warranty

Commitment & Confidence

- Lifecycle Management

- Certification

- World Class Support

- Access to experts

The Intel Server EdgeWhy PCSD?

http://www.intelserveredge.com

• “We keep going back to PCSD because of that constant quality we get compared to other vendors”

• “Intel PCSD is extremely important to our future because the engineering is absolutely world class”

Customer Testimonials see here and here

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Standard Rack Servers

• 1U & 2U Rack Systems

• Highest Features

• Highest Performance

• Highest Flexibility

2U / 4 Node Servers

• Density Optimised

• Highest Efficiency

• HPC Focus

• Hyperconverged Focus

Pedestal Servers

• Standard SSI EEB 12x13”

• 4U Pedestal

• 3rd Party Chassis Compatibility

Grantley Product Overview (for Xeon E5-2600 v4)3 Product Families, 4 Board Families

2x E5-2600 v3/v424x DIMMs8x PCIe slots (2 x16)2x 1Gb or 2x 10Gb

S2600WT (Wildcat Pass)

2x E5-2600 v3/v48x DIMMs1x PCIe slotFDR option

S2600KP (Kennedy Pass)

2x E5-2600 v3/v416x DIMMs1x PCIe slotFDR option

S2600TP (Taylor Pass)

2x E5-2600 v3/v416x DIMMs6x PCIe slots (4 x16)LSI3008 SAS option2x 1GB or 2x 10Gb

S2600CW (Cottonwood Pass)

1U, 2x 750W PSU, 4x3.5” / 8x2.5”

R1208 / R1304

2U, 2x 1100W PSU, 2.5”/3.5” options

R2208 / R2224 / R2308 / R2312

2U, 2x 1600W PSU, 12x3.5” / 16x2.5”

H2216/H2312 (for HPC)

2U, 2x 1600/2130W PSU, 24x2.5”, 8xNVMe U.2

H2224 (for Hyperconverged Infra)

Pedestal / 4U rackable, fixed or 2x 750/1100/1600 PSU, up to 8x3.5” or 16x2.5”

P4000

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Introducing the Intel® SSD DC P3520 Series Reduces Latency by 30%17 & Up to 4.7x1

SATA performance acceleration with

NVMe*Maximize Intel® Xeon® performance

with NVMe* over PCIe*

Most widely adopted PCIe* family

Trusted Data Integrity &

Performance Consistency

Proven end-to-end data protection

Consistently reliable performance

Breakthrough cost-performance

profileIntel’s best DC IOPS/$

Optimized for read intensive scale-out storage

Full featured for DC applications

Bring Your Storage Out of the Cold with Mainstream NVMe*

*Other names and brands may be claimed as the property of others. Refer to appendix for footnote 1, 17

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The most-trusted SATA SSD now on

3D NAND Technology from Intel®

MODERNIZE STORAGE WITH THE INTEL® SSD DC S3520 SERIES

HDDReplacement

CloudServices

Web Server

Big DataAnalytics

1.0 DWPD Endurance2

30% LowerActive Write

Power3

Expanded M.2 Capabilities

3XHIGHER

Product Highlights1 Target Usages

Refer to appendix for footnotes 1, 2, 3

45

Compared with Intel® SSD DC S3510 Series

(extended operating temperature and capacities)

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Why Intel® NUC?

• Small form factor at 0.37l, 22.6 in3

• Scalability of Performance from Core i7 to Atom

• Multiple OS support

• Multiple screen support

• NUC’s come with latest CPU generation

• Easy upgrade flexibility and differentiation

• Manageability & Security with Intel® vPro Technology

• Availability of skus with 3 year life cycle and warranty

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2016 2017 2018 CPU M.2 SSD2.5”

SATA3SO-

DIMMHDMI

MiniDP

USB-C VGAMax #

DisplaysFront

HeadsetRear Spkr.+ TOSLINK

SDXC

i7-6770HQ45W

2x 2242/80 key MSATA3 / PCIe Gen3 X4

2x DDR42133+

Full2.0

TBT3 +USB 3.1 +

DP1.23*

i7-7567U28W

2242/80 key MSATA3 / PCIe Gen3 X4

2x DDR42133

Full2.0

TBT3 +USB 3.1 +

DP1.23* Micro

i7-5557U28W

2242/60/80 key MSATA3 / PCIe Gen2 X4

2x DDR3L1600

Mini1.4a 3*

i5-7200U15W

2242/80 key MSATA3 / PCIe Gen3 X4

2x DDR42133

Full2.0

TBT3 +USB 3.1 +

DP1.23* Micro

i5-6260U15W

2242/80 key MSATA3 / PCIe Gen3 X4

2x DDR42133

Full1.4b 3*

i5-5250U15W

2242/60/80 key MSATA3 / PCIe Gen2 X4

2x DDR3L1600

Mini1.4a 3*

i3-7100U15W

2242/80 key MSATA3 / PCIe Gen3 X4

2x DDR42133

Full2.0

USB 3.1 + DP1.2

3* Micro

i3-6100U15W

2242/80 key MSATA3 / PCIe Gen3 X4

2x DDR42133

Full1.4b 3*

i3-5010U15W

2242/60/80 key MSATA3 / PCIe Gen2 X4

2x DDR3L1600

Mini1.4a 3*

J345510W

2x DDR3L1866

Full2.0 2

J345510W

2x DDR3L1866

Full2.0 2

N37006W

DDR3L1600

Full1.4b 2

N37006W

DDR3L1600

Full1.4b 2

N30506W

DDR3L1600

Full1.4b 2

48

Intel® NUC – Consumer Roadmap

“Skull Canyon” – NUC6i7KYK6th Generation Core™ i7 Processor (SKL-H)

“Baby Canyon i7” Core™ i7 Processor (KBL-U)

“Rock Canyon i7” – NUC5i7RYH5th Generation Core™ i7 Processor (BDW-U)

“Baby Canyon i5” Core™ i5 Processor (KBL-U)

“Swift Canyon i5” – NUC6i5SYH/K6th Generation Core™ i5 Processor (SKL-U)

“Baby Canyon i3” Core™ i3 Processor (KBL-U)

“Swift Canyon i3” – NUC6i3SYH/K6th Generation Core™ i3 Processor (SKL-U)

“Rock Canyon i5” - NUC5i5RYH/K5th Generation Core™ i5 Processor (BDW-U)

“Rock Canyon i3” - NUC5i3RYH/K5th Generation Core™ i3 Processor (BDW-U)

“Grass Canyon” – NUC5PGYHPentium® Processor (BSW)

“Pinnacle Canyon” – NUC5CPYHCeleron® Processor (BSW)

“Arches Canyon” – NUC6CAYSCeleron® Processor (ApL)

“Arches Canyon” – NUC6CAYHCeleron® Processor (ApL)

“Pinnacle Canyon” – NUC5PPYHPentium® Processor (BSW)

Microsoft Windows* 10 Home x64, 2GB RAM, 32GB eMMC

Microsoft Windows* 10 Home x64, 2GB RAM, 32GB eMMC

*DisplayPort splitter may be required

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*Other names and brands may be claimed as the property of others.

2016 2017 2018 CPU M.2 SSDSATA 7-pin

SO-DIMM

WiFi Card/Slot vPro™MiniDP

HDMI VGA eDPMax #

DisplaysAnalog Audio

TPM eMMC

i5-xxxxU15W

22x80 key MSATA3 / PCIe Gen3 X4

SATA3 port

2x DDR42133

M.2 802.11ac (pre-installed)

2x Full 2.0

2

i5-xxxxU15W

22x80 key MSATA3 / PCIe Gen3 X4

SATA3 port

2x DDR42133

M.2 22x30 slot

2x Full 2.0

2

i5-5300U15W

22x42/80 key BSATA3 / PCIe Gen2 X2

SATA3 bay

2x DDR3L1600

M.2 22x30 slot 2 3*

i5-5300U15W

22x42/80 key BSATA3 / PCIe Gen2 X2

SATA3 DOM port

2x DDR3L1600

M.2 22x30 slot 2 3*

i3-xxxxU15W

22x80 key MSATA3 / PCIe Gen3 X4

SATA3 port

2x DDR42133

M.2 802.11ac (pre-installed)

2x Full 2.0

2

i3-xxxxU15W

22x80 key MSATA3 / PCIe Gen3 X4

SATA3 port

2x DDR42133

M.2 22x30 slot

2x Full 2.0

2

i3-5010U15W

22x42/80 key BSATA3 / PCIe Gen2 X2

SATA3 bay

2x DDR3L1600

M.2 22x30 slot

2 3*

i3-5010U15W

22x42/80 key BSATA3 / PCIe Gen2 X2

SATA3 DOM port

2x DDR3L1600

M.2 22x30 slot

2 3*

E38155W fanless

SATA2 bay

DDR3L1066

Half-lengthMini PCIe slot

1.4a 2 4GB

E38155W fanless

SATA2 port

DDR3L1066

Half-lengthMini PCIe slot

1.4a Header 2 4GB

49

Intel® NUC – Commercial Roadmap

“Maple Canyon i5 kit” – NUC5i5MYHE5th Generation Core™ i5 vPro™ Processor (BDW-U)

“Maple Canyon i5 board” – NUC5i5MYBE5th Generation Core™ i5 vPro™ Processor (BDW-U)

ALL COMMERCIAL SKUs HAVE THREE-YEAR PRODUCT LIFECYCLESDashed boxes indicate product definition is WIP

*DisplayPort splitter may be required

“Maple Canyon i3 kit” – NUC5i3MYHE5th Generation Core™ i3 Processor (BDW-U)

“Maple Canyon i3 board” – NUC5i3MYBE5th Generation Core™ i3 Processor (BDW-U)

“Thin Canyon kit” – DE3815TYKHEAtom® Processor (BYT)

“Thin Canyon board” – DE3815TYBEAtom® Processor (BYT)

“Dawson Canyon i5 kit” – NUC7i5DNKE7th Generation Core™ i5 vPro™ Processor (KBL-U)

“Dawson Canyon i5 board” – NUC7i5DNBE7th Generation Core™ i5 vPro™ Processor (KBL-U)

“Dawson Canyon i3 kit” – NUC7i3DNKE7th Generation Core™ i3 Processor (KBL-U)

“Dawson Canyon i3 board” – NUC7i3DNBE7th Generation Core™ i3 Processor (KBL-U)

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*Other names and brands may be claimed as the property of others. 51

Why Intel® Compute Stick?

• Smaller form factor

• Fully configured

• Some skus comes with Windows 10 preloaded

• Great for single screen set up –easy to set up!

• Quad core CPU, low power consumption

• The roadmap has extended to include m3 & m5 vpro sku

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Intel® Compute Stick Roadmap

2016 2017 2018 CPU RAMOn-board Storage

OSWiFi+ BT

4KUSB 3.0

USB 2.0

vPro™Wake on

RTCCEC TPM

3-year PLC*

Warranty

m5-6Y57

4GB64GB eMMC

AC 2x24.2

30Hz1 +

2 hub 3 year

m3-6Y30

4GB64GB eMMC

Microsoft Windows* 10

Home x64

AC 2x24.2

30Hz1 +

2 hub 3 year

m3-6Y30

4GB64GB eMMC

AC 2x24.2

30Hz1 +

2 hub 3 year

4GB32GBeMMC

Microsoft Windows* 10

Home x64

AC 2x24.2

30Hz 1 1 1 year

x5-Z8300

2GB32GBeMMC

Microsoft Windows* 10

Home x86

AC 2x24.2

1 1 1 year

4GB64GBUFS

AC 2x24.2

30Hz 1 1 1 year

x5-Z8300

2GB32GBeMMC

AC 2x24.2

1 1 1 year

“Cedar City m5 vPro™” – STK2MV64CC6th Generation Core™ m5 vPro™ Processor (SKL-Y)

“Michigan City - Windows” STK3AW32MC Atom™

“Sterling City Windows”STK1AW32SC Atom™ x5 (CHT)

“Cedar City m3 Windows” – STK2M3W64CC6th Generation Core™ m3 Processor (SKL-Y)

“Cedar City m3 no OS” – STK2M364CC6th Generation Core™ m3 Processor (SKL-Y)

“Michigan City – no OS” STK3A64MC Atom™

“Sterling City no OS”STK1A32SC Atom™ x5 (CHT)

Notes: • “Cedar City” has three-year product lifecycle• Dashed boxes indicate product definition is TBD

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Pick the Right Tool for the Job

Feature Rich Cost Effective

• Multiple Screens Support

• Up to 4K (UHD) Resolution

• Performance for Advanced Analytics

• Customization via Broad Ecosystem

• Embedded Design Friendly

• Remote Manageability & Security

• Extended Product Life

• 3 Years Worldwide Limited Warranty

• Fully Configured & Easy to Use

• Comes with Windows 10 Preloaded

• Great for Single Screen Setup

• Cost Effective & Power Efficient

• Built In Storage & Wireless

• Intel Quality & Reliability

• 1-3 year warranty depending on spec

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*Other names and brands may be claimed as the property of others.

The CPU is critical to everything you do on a PC

If a background task causes a stutter in your virtual world, you get sick or you get a headache or and your head explodes…

Background tasks are handled by the CPU, not the GPU.

Core i7 processors give a better gaming and overall PC experience

55

7th Gen Core for Virtual Reality Core i7 for the Best Experience HTC Vive

Oculus Rift

Why use Core i7 for VR?

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VR Segments & Platforms

Enthusiast VR$600+

Mainstream PC/Console VR$399

• PC tethered• Relatively high CPU/GPU req.• Most immersive

Oculus Rift, HTC Vive

• Tethered (this case, console)• Middle-of-the-road CPU/GPU

req.• Very immersive

Sony PlayStation VR, Razer OSVR

• Phone/tablet powered• Modest CPU/GPU req.• Most portable, ubiquitous

Samsung Gear VR, Google Cardboard

Untethered VR$50-$1000

• Integrated SoC• Modest to middle-of-the-road

CPU/GPU req.• Portable, convenient

PRC vendors, AMD and other startups

Entry/Mobile VRPhone +$100

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Back UpIntel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

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