pcn template- product information notification · the ejector-pin mark size is also reduced from...

Document No. 001-11741 Rev. *M Page 1 of 2

Cypress Semiconductor Corporation, 198 Champion Court, San Jose, CA 95134. Tel: (408) 943-2600

PRODUCT INFORMATION NOTIFICATION

PIN: PIN200302 Date: January 15, 2020

Subject: Ejector Pin Mark Change for Select 32-LQFP Package Assembled at TFME To: PCN ALERTS MOUSER [email protected] Change Type: Minor Description of Change: Cypress announces the change of ejector pin mark for select 32-LQFP package assembled at TongFu Microelectronics Co., Ltd (TFME, No.288, Chongchuan Road,Nantong, Jiangsu, China). The change is from existing one ejector-pin mark to two ejector pin marks at package bottom and additional two ejector-pin marks at package top. Marking needs to be shifted to cater for additional ejector-pin marks. The ejector-pin mark size is also reduced from 2.5mm to 1.0mm diameter. Pin1 mark position unchanged but reduced from 1.2mm to 0.8mm diameter. The ejector-pin mark change is due to change of standard lead frame to high density lead frame but will not affect TFME’s stringent quality and reliability requirements. There are no changes to ordering part numbers. Product datasheets remain the same and can be downloaded from the Cypress Website (www.cypress.com). Benefit of Change: This qualification is part of Cypress’ continuous improvement in our flexible manufacturing initiative providing Cypress with the added capability to meet upside market demand, reduce business continuity risk, and ensure consistent and reliable delivery to customers in dynamic, changing market conditions. Part Numbers Affected: 18 See the attached ‘Affected Parts List’ file for a list of all part numbers affected by this change. Note that any new parts that are introduced after the publication of this PIN will include all changes outlined in this PIN.

http://www.cypress.com/

Document No. 001-11741 Rev. *M Page 2 of 2

Qualification Status: This change has been qualified through a series of tests documented in the Qualification Test Plan QTP#173401 This qualification report can be found as an attachment to this PCN or by visiting www.cypress.com and typing the QTP number in the keyword search window. Approximate Implementation Date: This change will be implemented with the date of this notification. Anticipated Impact: Products manufactured are completely compatible with existing product from form, fit, functional, parametric, and quality performance perspectives. Cypress also recommends that customers take this opportunity to review these changes against current application notes, system design considerations and customer environment conditions to assess impact (if any) to their application. Method of Identification: Cypress maintains traceability of product to wafer level, including wafer fabrication location, through the lot number marked on the package. Response Required: This is an information only announcement. No response is required. For additional information regarding this change, contact your local sales representative or contact the PCN Administrator at [email protected]. Sincerely, Cypress PCN Administration

http://www.cypress.com/mailto:[email protected]

Document No. 002-23576 Rev. ** ECN #: 6125238

Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.

Page 1 of 8

Cypress Semiconductor

Package Qualification Report

QTP# 173401, 173403 VERSION **

April, 2018

LQFP Package,

Pb-free, Au and Cu wire, 260℃ Reflow, TongFu

FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE

Prepared By: Hideho Taoka

Reviewed By: Kunihiro Miyazono

Reliability Engineer Reliability Manager

Approved By:

David Hoffman

Reliability Director

mailto:[email protected]



Page 2 of 8

PRODUCT QUALIFICATION HISTORY

QTP Number

Description of Qualification Purpose Date

173401 LQFP32 High Density Lead Frame Qualification at TongFu Microelectronics

Apr., 2018

173403 LQFP48 High Density Lead Frame Qualification at TongFu Microelectronics

Apr., 2018



Page 3 of 8

PRODUCT DESCRIPTION (for qualification)

Qualification Purpose: Qualify LQFP32 High Density Lead Frame at TongFu

Marketing Part #: MB95F334KPMC-G-SN-YE2

Device Description: General purpose single-chip products

Cypress Division: Microcontroller and Connectivity Division

PACKAGE ASSEMBLY FACILITY SITE

LQFP32 TongFu Microelectronics

MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION

Package Designation: LQB032

Package Outline, Type, or Name: 32-Low Profile Quad Flat Package

Mold Compound Name/Manufacturer: CEL8240HF10-CWK for Cu, CEL8240HF10 for Au-wire / HITACHI

Mold Compound Flammability Rating: V-0

Mold Compound Alpha Emission Rate: N/A

Lead Frame Material: C7025

Lead Finish, Composition / Thickness: Pure-Sn / 7 – 20 um

Die Backside Preparation Method/Metallization: Back Grind

Die Separation Method: Sawing

Die Attach Supplier: HITACHI

Die Attach Material: EN4600B

Bond Diagram Designation BA-NF-1010676*01

Wire Bond Method: Thermosonic

Wire Material/Size: Au / 20um (0.8mil), CuPd / 20um (0.8mil)

Thermal Resistance Theta JA C/W: N/A

Package Cross Section Yes/No: Yes

Name/Location of Assembly (prime) facility: TongFu Microelectronics

MSL LEVEL 3

Reflow Profile 260℃

ELECTRICAL TEST / FINISH DESCRIPTION

Test Location: TongFu Microelectronics



Page 4 of 8

PRODUCT DESCRIPTION (for qualification)

Qualification Purpose: Qualify LQFP48 High Density Lead Frame at TongFu

Marketing Part #: MB9AF111KPMC-G-JNE2

Device Description: General purpose single-chip products

Cypress Division: Microcontroller and Connectivity Division

PACKAGE ASSEMBLY FACILITY SITE

LQFP48 TongFu Microelectronics

MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION

Package Designation: LQA048

Package Outline, Type, or Name: 48-Low Profile Quad Flat Package

Mold Compound Name/Manufacturer: CEL8240HF10-CWK for Cu, CEL8240HF10 for Au-wire / HITACHI

Mold Compound Flammability Rating: V-0

Mold Compound Alpha Emission Rate: N/A

Lead Frame Material: C7025

Lead Finish, Composition / Thickness: Pure-Sn / 7 – 20 um

Die Backside Preparation Method/Metallization: Back Grind

Die Separation Method: Sawing

Die Attach Supplier: HITACHI

Die Attach Material: EN4600B

Bond Diagram Designation BA-NF-1010602*02

Wire Bond Method: Thermosonic

Wire Material/Size: Au / 20um (0.8mil), CuPd / 20um (0.8mil)

Thermal Resistance Theta JA C/W: N/A

Package Cross Section Yes/No: Yes

Name/Location of Assembly (prime) facility: TongFu Microelectronics

MSL LEVEL 3

Reflow Profile 260℃

ELECTRICAL TEST / FINISH DESCRIPTION

Test Location: TongFu Microelectronics



Page 5 of 8

RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS

Stress/Test Test Condition (Temp/Bias) Result P/F

Temperature Cycle JESD22- A104, -65℃ to +150℃ Precondition : JESD22-A113

P

Acoustic Microscopy J-STD-020, AEC-Q006 Precondition: JESD22 Moisture Sensitivity Level 3

P

Physical Dimension Coplanarity, Stand-off, Total Package Height, Package Dimension, Mold Cap Thickness, Lead Foot Length Cpk : >1.33

P

Solderability Test J-STD-002, P

Wire Bond Pull Cpk : > 1.33 P



Page 6 of 8

Reliability Test Data

QTP #:173401, 173403

Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism

STRESS : Temperature Cycle

STRESS : Acoustic Microscopy (Post-PC)

STRESS : Acoustic Microscopy (Post-Temperature Cycle)

STRESS : Physical Dimension

STRESS ; Solderability

MB95F334 7G64319 1736-311(Cu) TongFu 500 77 0

MB95F334 7G64319 1736-311(Au) TongFu 500 77 0

MB95F334 7G64319 1736-312(Cu) TongFu 500 77 0

MB9AF111 4K91957 1736-311(Cu) TongFu 500 77 0

MB9AF111 4K91957 1736-311(Au) TongFu 500 77 0

MB9AF111 4K91957 1736-312(Cu) TongFu 500 77 0

MB95F334 7G64319 1736-311(Cu) TongFu - 22 0

MB95F334 7G64319 1736-311(Au) TongFu - 22 0

MB95F334 7G64319 1736-312(Cu) TongFu - 22 0

MB9AF111 4K91957 1736-311(Cu) TongFu - 22 0

MB9AF111 4K91957 1736-311(Au) TongFu - 22 0

MB9AF111 4K91957 1736-312(Cu) TongFu - 22 0

MB95F334 7G64319 1736-311(Cu) TongFu - 22 0

MB95F334 7G64319 1736-311(Au) TongFu - 22 0

MB95F334 7G64319 1736-312(Cu) TongFu - 22 0

MB9AF111 4K91957 1736-311(Cu) TongFu - 22 0

MB9AF111 4K91957 1736-311(Au) TongFu - 22 0

MB9AF111 4K91957 1736-312(Cu) TongFu - 22 0

MB95F334 7G64319 1736-311(Cu) TongFu - 30 0

MB9AF111 4K91957 1736-311(Cu) TongFu - 30 0

MB95F334 7G64319 1736-311(Cu) TongFu - 3 0 MB95F334 7G64319 1736-311(Au) TongFu - 3 0 MB95F334 7G64319 1736-312(Cu) TongFu - 3 0 MB9AF111 4K91957 1736-311(Cu) TongFu - 3 0 MB9AF111 4K91957 1736-311(Au) TongFu - 3 0 MB9AF111 4K91957 1736-312(Cu) TongFu - 3 0



Page 7 of 8

Reliability Test Data

QTP #:173401, 173403

Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism

STRESS ; Wire Bond Pull

MB95F334 7G64319 1736-311(Cu) TongFu - 30 0 MB95F334 7G64319 1736-311(Au) TongFu - 30 0 MB95F334 7G64319 1736-312(Cu) TongFu - 30 0 MB9AF111 4K91957 1736-311(Cu) TongFu - 30 0 MB9AF111 4K91957 1736-311(Au) TongFu - 30 0 MB9AF111 4K91957 1736-312(Cu) TongFu - 30 0


Document History Page

Document Title: QTP#173401 TongFu LQFP High Density Leadframe Qualification Report Document Number: 002-23576


Page 8 of 8

Rev. ECN No.

Orig. of Change

Description of Change

** 6125238 KUMI Initial spec. release.

Select 32-LQFP Package Ejector Pin Mark Change

CYPRESS CONFIDENTIAL2

Changing Points - Pin 1 size, number of ejector pins & ejector pin location

a) Pin 1 size reduced from 1.2mm diameter to 0.8mm.

b) At package top surface, added 2 ejector pin marks.

c) At package bottom surface, changed from 1 ejector pin mark (2.5mm) at the center to 2 smaller

ejector pin marks (1.0mm) at the corners

Package Top View Package Bottom View


Picture below shows on revised marking area for LQFP32 to avoid the e-pin mark at

package top.

Marking Position Shift


31762-Select_LQFP32_Ejector_Pin_Mark_Change.pdfSlide Number 1Slide Number 2Slide Number 3Slide Number 4

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