passive distortion compensation for package level interconnect

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1 Passive Distortion Compensation for Package Level Interconnect Chung-Kuan Cheng UC San Diego Dongsheng Ma & Janet W ang Univ. of Arizona

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Passive Distortion Compensation for Package Level Interconnect. Dongsheng Ma & Janet Wang Univ. of Arizona. Chung-Kuan Cheng UC San Diego. Outline. Motivation Review of High-Speed Serial Links Passive Distortion Compensation Theory Implementation Simulation Results - PowerPoint PPT Presentation

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Page 1: Passive Distortion Compensation for Package Level Interconnect

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Passive Distortion Compensation for Package Level Interconnect

Chung-Kuan ChengUC San Diego

Dongsheng Ma & Janet Wang

Univ. of Arizona

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Outline

1. Motivation2. Review of High-Speed Serial Links3. Passive Distortion Compensation

1. Theory2. Implementation3. Simulation Results

4. Power Management and System Integration

5. Research Direction

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1. Motivation: ITRS Bandwidth Projection

• Abundant on-chip bandwidth• Off-chip bandwidth is the bottleneck• Many chip are I/O limited

9078

6859

5245

4036

3228

2522

2018

1614

y = 10800x-2.1

1

10

100

10 100

#I/O padsOff-chip fclkAggr BWAggr BW (Fit)

Technology (nm) No

rma

lize

d u

nit

to 9

0nm

nod

e

Courtesy of Hamid Hatamkhani et al., DAC ‘06

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2. Review of High-Speed Serial Links

Techniques On-Chip Off-ChipPre-emphasis and equalization √ √

Clocked Discharging (M. Horowitz, ISVLSI’03)

Frequency Modulation (S. Wong, JSSC ’03; Jose ISVLSI ’05)

√ √

CDMA on wireline (Jongsun Kim et al.)

√ √

Non-linear Transmission Line (E. Hajimiri JSSC’05, E.C. Kan CICC ’05)

Resistive Termination (Tsuchiya et al., EPEP; M. Flynn ICCAD ’05)

√ √

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3. Passive Distortion Compensation

Typical RLC Transmission Line Distortionless Transmission Line

•Frequency dependent phase velocity (speed) and attenuation

• Intentionally make leakage conductance satisfy R/G=L/C• Frequency response becomes flat from DC mode to Giga Hz

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3.1 Theory: Telegrapher’s Equations• Telegrapher’s equations

• Propagation Constant

• Wave Propagation

• and correspond to attenuation and phase velocity. Both are frequency dependent in general.

• Characteristic Impedance

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3.1 Theory: Distortionless Lines

• Distortionless transmission line

If

Both attenuation and phase velocity become frequency independent

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3.1 Theory: Differential CaseCommon Mode – Current flowing in the same direction

Differential Mode – Current flowing in the opposite direction

Shunt between each line to ground Shunt between the two lines

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3.2 Implementation

• Evenly add shunt resistors between the signal line and the ground

• Non-ideality

Ideal Assumption

In Practice Implication

Homogeneous and distributive line

Discrete shuntsWhat’s the optimal spacing?

Are the shunt resistors realizable?

Frequency independent RLGC

Frequency dependent RLGC

What’s the optimal frequency for the matching?

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3.2 Implementation: MCM trace

MCM On-chip

Length

Series Resistance

Frequency dependency ofline parameters Large Small

~10 cm ~ 10 mm1 Ω/mm 1 Ω/μm

MCM trace vs. On-chip interconnect

Operation region RLC RC

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3.2 Implementation: A MCM Stripline Case

• Control the signal line thickness to minimize skin effect (cost vs. distortion)

• Assume LCP dielectric

Geometry based on IBM high-end AS/400 system

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3.3 Simulation: Methodology

• Transient simulation in Hspice• Each transmission line segment is modeled by W-

element using frequency-dependent tabular model

• Discrete resistors• Used CZ2D tool from IBM for RLGC extraction

• Part of IBM EIP (Electrical Interconnect & Packaging) suite.

• Fast and accurate• Ensures causality of transient simulation

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3.3 Simulation: RLGC vs. Frequency

R

C

• Match at DC• Boost up low frequency traveling speed• Balance low frequency attenuation and high frequency attenuation

Z0 = 78 Ω, delay = 57.78 ps/cm

R1MHz=11.07 Ω/cm, L1MHz=5.52e-3 μH/cm, C1MHz =0.74 pF/cm

Rshunt =L1MHz/R1MHzC1MHz = 669.5 Ω/cm

LG

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3.3 Simulation: Shunt Resistor Spacing

• Number of shunt resistors = N

• Resistors are implemented with embedded carbon paste film

• Spacing depends on the target data rate

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3.3 Attenuation

• W8μm/t2μm/b20μm

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3.3 Phase Velocity

• W8μm/t2μm/b20μm

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3.3 Simulation: Pulse Response

less severe ISI effect

DC saturation voltage determined by the resistor ladder

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3.3 Jitter and Eye opening for 2um case

10 cm 20 cm

Jitter (ps) Eye opening (volt)

Jitter (ns) Eye opening (volt)

1 shunt/1 cm 1 5.565 0.42563 9.369 0.095785

Terminated with Z0 2

5.0228 0.37449 13.87 0.14595

Terminated with Rdc 3 5.8183 0.33906 12.117 0.090432

Open end 22.5 0.51 > 70 < 0.14

• W8μm/t2μm/b20μm

1. Each shunt resistor is 669.5 ohm

2. Z0=78 ohm

3. For 10cm line, Rdc = 66.9 ohm; for 20 cm line, Rdc=33.5 ohm

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3.3 Jitter and Eye opening for 4.5um case

10 cm 20 cm

Jitter (ps) Eye opening (volt)

Jitter (ns) Eye opening (volt)

1 shunt/1 cm 1 22.83 0.525 23.34 0.238

Terminated with Z0 2

7.3764 0.48916 37.327 0.21423

Terminated with Rdc 3 12.026 0.57114 37.443 0.20064

Open end Unrecognizable Unrecognizable

• W8μm/t4.5μm/b20μm

1. Each shunt resistor is 1232 ohm

2. Z0=71.1 ohm

3. For 10cm line, Rdc = 123.2 ohm; for 20 cm line, Rdc=61.6 ohm

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3.3 Simulation: Eye Diagrams

With 10 shunts (each = 669.5)Without shunt resistors

Jitter = 22.5 psEye opening = 0.51 V

Jitter = 5.57 psEye opening = 0.426 V

• W8μm/t2μm/b20μm/L10cm• 1000 bit PRBS at 10Gbps• W-element + tabular RLGC model in HSpice

Clear eye opening

Reducedamplitude

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3.3 Best Eye Diagram for 2um thick case• W8μm/t2μm/b20μm/L10cm

Jitter & eye opening v.s. shunt valueBest case when each shunt is 500 ohmJitter = 4.63 psEye opening = 0.35645 V

Jitter

Eyeopening

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3.3 Eye Diagram for 4.5um thick case when matched at DC

Sleepy Eye Jitter = 22.8 pseye opening = 0.525 V

• W8μm/t4.5μm/b20μm/L10cm

Open ended 10 shunts matched at DC

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3.3 Best Eye Diagram for the 4.5um thick case

• W8μm/t4.5μm/b20μm/L10cm

Jitter & eye opening v.s. shunt value

Best case when each shunt is 500 ohmJitter = 11.97 psEye opening = 0.44036 V

Jitter

Eyeopening

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3.3 Eye Diagram for the MCM trace

Jitter = 37.237 psEye opening = 0.214

Jitter = 23.24 pseye opening = 0.238 V

• W8μm/t4.5μm/b20μm/L20cm

Terminated with Z0 20 shunts matched at DC

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4. Adaptive Power Management (APM)

• The distortionless signaling simplifies the interface circuitry. However, the twice heavier attenuation due to passive compensation calls for adaptive power management;

• With adaptive power management, we adaptively regulate the power supply of the transmitter according to attenuation;

• The regulated supply voltage guarantees the speed of transmission while keeping the minimal power overhead and well-controlled bit-error rate.

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4. APM Preliminary Results

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4. APM Controller

CPUUtilization( , , , )

Performance Monitor

Frequency/Voltage TableTemperature/Voltage Table

Signal Processing

PerformanceRequest

Adaptive Power Controller (APC)

Intelligent Energy Manager *(IEM)

Core OperationsPropagatoin

Replica

EnergySource

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4. System Integration

• The reduction of the jitter leaves larger design margin for interface circuit design;

• To enable an effective and accurate communication, the operation of transmitter and receiver must be well synchronized. This requires accurate clock positioning and phase locking;

• Synergic method will be taken to achieve mutual compensation and joint leverage on signal accuracy, attenuation and system power.

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5. Research Direction• Develop analysis models for the

technology• Eye diagram analysis via step responses• Power consumption

• Optimize technologies• Chip carrier and board technologies• Redistribution• Physical dimensions• Shunts, terminators

• Prototype fabrication & measurement• More applications: clock trees, buses• Incorporate transmitter/receiver design

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The End

Thank you!