package technology for wearable...

Package Technology for Wearable Devices

SungSoon Park Amkor Technology Korea

Contents

1. What is Wearable Devices?

2. Why Wearable Devices?

3. Applications

4. System Configuration & Requirements

– Current & Future

5. Summary


• Devices incorporating computer and advanced

electronic technologies and can be worn

– Typically on human body

– But can be pet and others well

Source: http://rentpost.com


Source: Samsung, Apple, Fitbit, Google, Oculus


Source: http://vandrico.com

Smart Watch

Fitness Tracker



Smart Watch, Fitness Band



Number of Devices

287

Average Price(USD)

$302

Most Popular Component

Accelero

meter


Source: http://www.wearable-technologies.com/

Technology DriversConsumer Needs

• Smart Sensors• Connected Experience

• Connected Health Agents

• Self Tracking

• Miniaturization

• Augmented Vision

• Energy Harvesting

• Flexible Electronics


1) Assistance

A. Notification

• Incoming call, Message, E-mail, SNS update

B. Communication

• Phone call, Message, E-mail, SNS upload

2) Constant monitoring

A. Fitness tracking

B. Health monitoring

C. Policemen

Source: NYPD(USA)


3) Instant access to necessary information

A. Customer service

Source: Virgin Atlantic, Edinburgh airport(UK)


B. Navigation

•Outdoor

•Store

C. Theme Park Ticket

•MagicBand @ Disneyland

Source: www.gizmag.com, Disneyland


4) Better productivity in Workplace

A. Stock management

B. Hand free: Technicians who need to use both hand

Source: http://www.metaio.com/

3. Applications

1) Kids Tracking Smart Wristband

– Lineable, $5, GPS

– Use other smartphones as ad hoc GPS

Source: Lineable

3. Applications

2) Sports Activity Monitoring

– 6-axis accelerometer, EMG

– Heart Rate, Breathing

Source: Athos

3. Applications

3) Smart Sticker Thermometer

– Temperature Sensor, NFC module

Source: VIVALNK

3. Applications

4) Dog Activity Monitoring

– 3-axis accelerometer, Bluetooth

– 41 x 28 x 11 mm(Curved)

– 8 grams

Source: FitBark

3. Applications

5) Smart Jewelry

– Notification

– Activity Tracking

– Safety

Source: Cuff

3. Applications

– Smart Ring

– Intel MICA bracelet

Source: Smart Ring ,Intel


1) System Configuration – Current

Battery

Sensor Connectivity Processor

Display


A. Display

Source: Fitbit, SONY, Samsung

No display Rigid Curved


B. Sensor

Type Package Size

Accelerometer, Gyroscope,

Magnetometer, Microphone

QFN

LGA ~ 3x3mm

Altimeter, Barometer, Pressure LGA ~ 3x3mm

Temperature, Heart Rate,

Blood Oxygen, Pulse Oximeter,

Perspiration

LGA

QFN

WLCSP

~ 3x3mm

~1x1mm

Ambient Light, UV LGA ~5x3mm

GPS WLCSP ~ 3x3mm


Source: InvenSense, Bosch, ST, Sensirion


• Amkor Packaging Technology Capability

Item MLF(QFN)

Body size Min. 0.85x0.85mm

I/O pitch Min. 0.3mm

Package height Nom. 0.35mm


C. Processor

Type Package Size

AP(Application Processor) PoP ~12x12mm

DSP(Digital Signal Processor) BGA ~7x7mm

MCU(Micro Controller Unit) WLCSP ~3x3mm



Item PoP

Body size 8~17mm

Bottom I/O pitch Min. 0.35mm

Memory pitch Min. 0.35mm

Package height

(Bottom only) Nom. 0.53mm

Package height

(Top* + Bottom) Max. 1.04mm

* Assume Nom. 0.6mm memory


D. Connectivity


Type Package Size

WiFi + Bluetooth + GPS WLCSP ~4x4mm

Item WLCSP

Body size Max. 10x10mm

I/O pitch Min. 0.3mm


E. Battery

– Li-Ion Pouch Cell

– Bare Die(Cymbet Enerchip)

Source: Cymbet


3) System Configuration – Future

A. Sensor

– Flexible: Printed, Plastic electronics

– Speech recognition for hands-free functionality:

Microphone

– More sensing

B. Display

– Minimum space for display: Projection

– Flexible: Product design flexibility

Augmented Reality


A. Sensor

– Bio Stamp Temperature Monitoring

– Flexible: Printed, Plastic electronics

Source: MC10


B. Display

– Projection without display panel

– Projector module

Source: Cicret


C. Battery

– Flexible, Printable

Source: Enfucell, Blue Spark


– Energy Harvesting(with future battery)

① Photovoltaic

② Thermovoltaic

③ Piezoelectric

④ Biological Reactions

Battery

Sensor Energy

Harvesting

Processor & Connectivity

5. Summary

1) Current wearable devices use

– High performance general purpose processor

– AP or DSP which is

Expensive

Large size and

Consume much of power

– AP: PoP (~12x12mm)

– DSP: BGA (~7x7mm)

– WiFi + Bluetooth + GPS: WLCSP (~4x4mm)

5. Summary

2) Future wearable devices will use

– Specific purpose processor

– MCU which is

Lower cost

Smaller size and

Consume less of power

– MCU: WLCSP (Smaller)

– WiFi + Bluetooth + GPS: WLCSP (Smaller)

Thanks

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