p4004ed

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P4004ED P-Channel Enhancement Mode MOSFET PRODUCT SUMMARY V (BR)DSS TO-252(DPAK) ABSOLUTE MAXIMUM RATINGS (T A = 25 °C Unless Otherwise Noted) THERMAL RESISTANCE RATINGS UNITS 1 Pulse width limited by maximum junction temperature. 2 Limited only by maximum temperature allowed MAXIMUM Avalanche Current Junction-to-Case 4.1 40 °C / W R θJA I AS E AS Junction-to-Ambient Operating Junction & Storage Temperature Range SYMBOL P D T J , T STG V DS TYPICAL Avalanche Energy L = 0.1mH Pulsed Drain Current 1 , 2 36 -21 20 30 Power Dissipation R DS(ON) 40mΩ @V GS = -10V TC = 70 °C PARAMETERS/TEST CONDITIONS Drain-Source Voltage Gate-Source Voltage I D - 21A SYMBOL T A = 25 °C T A = 70 °C V GS V A °C I D I DM -40V UNITS -70 -17 -21 ±20 Continuous Drain Current 2 TC = 25 °C -40 LIMITS -55 to 150 mJ W THERMAL RESISTANCE R θJC Ver 1.0 1 2010/4/28

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  • P4004EDP-Channel Enhancement Mode MOSFET

    PRODUCT SUMMARYV(BR)DSS

    TO-252(DPAK)

    ABSOLUTE MAXIMUM RATINGS (TA = 25 C Unless Otherwise Noted)

    THERMAL RESISTANCE RATINGS

    UNITS

    1Pulse width limited by maximum junction temperature.

    2Limited only by maximum temperature allowed

    MAXIMUM

    Avalanche Current

    Junction-to-Case 4.1

    40C / W

    RJA

    IAS

    EAS

    Junction-to-Ambient

    Operating Junction & Storage Temperature Range

    SYMBOL

    PD

    TJ, TSTG

    VDS

    TYPICAL

    Avalanche Energy L = 0.1mH

    Pulsed Drain Current1 , 2

    36

    -21

    20

    30Power Dissipation

    RDS(ON)

    40m @VGS = -10V

    TC = 70 C

    PARAMETERS/TEST CONDITIONS

    Drain-Source Voltage

    Gate-Source Voltage

    ID

    - 21A

    SYMBOL

    TA = 25 C

    TA = 70 C

    VGSV

    A

    C

    ID

    IDM

    -40V

    UNITS

    -70

    -17

    -21

    20

    Continuous Drain Current2

    TC = 25 C

    -40

    LIMITS

    -55 to 150

    mJ

    W

    THERMAL RESISTANCE

    RJC

    Ver 1.0 1 2010/4/28

  • P4004EDP-Channel Enhancement Mode MOSFET

    ELECTRICAL CHARACTERISTICS (TJ = 25 C, Unless Otherwise Noted)

    MIN TYP MAX

    -40

    -2 -2.5 -3

    250 nA

    1

    10

    -70 A

    65 73

    35 50

    30 40

    20 S

    1090

    175

    91

    4.95

    17

    5.5

    3

    6

    16

    26

    10

    -21 A

    -1.2 V

    15.5 nS

    7.9 nC1Pulse test : Pulse Width 300 sec, Duty Cycle 2.

    2Independent of operating temperature.

    m

    On-State Drain Current1 ID(ON) VDS = -5V, VGS = -10V

    Drain-Source On-State

    Resistance1

    VGS = -5V, ID = -8A

    VGS = -10V, ID = -10A

    RDS(ON) VGS = -7V, ID = -8A

    Forward Voltage1 VSD IF = -10A, VGS = 0V

    Reverse Recovery Time trrIF = -10 A, dlF/dt = 100A / S

    Reverse Recovery Charge Qrr

    SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS (TJ = 25 C)

    Continuous Current IS

    Turn-On Delay Time2 td(on)

    VDD = -20V, ID = -10A, VGS = -10V,

    RG=6nS

    Rise Time2 tr

    Turn-Off Delay Time2 td(off)

    Fall Time2 tf

    Total Gate Charge2 Qg

    VDS = 0.5V(BR)DSS,

    ID = -18A, VGS = -10VnCGate-Source Charge

    2 Qgs

    Gate-Drain Charge2 Qgd

    Input Capacitance Ciss

    VGS = 0V, VDS = -20V, f = 1MHz pFOutput Capacitance Coss

    Reverse Transfer Capacitance Crss

    Forward Transconductance1 gfs VDS = -10V, ID = -10A

    DYNAMIC

    V

    VDS = -32V, VGS = 0V

    PARAMETER SYMBOL TEST CONDITIONS

    STATIC

    LIMITSUNIT

    Gate-Body Leakage

    Gate Threshold Voltage

    Drain-Source Breakdown Voltage

    VGS(th)

    VGS = 0V, ID = -250AV(BR)DSS

    IGSS

    IDSSVDS = -30V, VGS = 0V , TJ = 125 C

    VDS = VGS, ID = -250A

    VDS = 0V, VGS = 20V

    Gate Resistance Rg VGS = 0V, VDS = 0V, f = 1MHz

    Zero Gate Voltage Drain Current A

    Ver 1.0 2 2010/4/28

  • P4004EDP-Channel Enhancement Mode MOSFET

    Ver 1.0 3 2010/4/28

  • P4004EDP-Channel Enhancement Mode MOSFET

    Ver 1.0 4 2010/4/28

  • P4004EDP-Channel Enhancement Mode MOSFET

    Ver 1.0 5 2010/4/28

  • P4004EDP-Channel Enhancement Mode MOSFET

    Ver 1.0 6 2010/4/28