os-pcn-2018-030-a introduction of ux:3 chips and change ......customer information package | os qm...
TRANSCRIPT
www.osram-os.com
OS-PCN-2018-030-A
Introduction of UX:3 Chips and Change of
Plating for TOPLED Black with InGaN
Technology
Customer Information Package
OS QM CQM ICI | 01.10.2018
Light is OSRAM
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
2
OS-PCN-2018-030-A
Overview
Page
1. Reason for change 03
2. Description of change 05
3. Changes in the datasheets 07
4. Time schedule 76
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
3
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Reason for change
Improved Reliability for Signage Applications in Humid Environment
Ensurance of Long Term Availability
Brightness Improvement
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
4
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
List of affected Products
TOPLED Black
LB T64G
LB T66G
LT T64G
LT T66G
LV T64G
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
5
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Description of change (all devices)
Current status New status
Inhouse galvanic processes Pre-plated Leadframe
MSL level 2 MSL level 4
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
6
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Description of change (all devices)
Item Current status New status
Chip Technology ThinGaN UX:3
Chip Carrier Ge Si
Chip Height 190µm 120µm
Wafer Size 100mm 150mm
Polarity n-up p-up
Chip Drawing
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
7
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (all devices)
Datasheet value Current status New status
ESD withstand voltage ESD sensitive device 2 kV
Exemplary average
lifetime for median
Brightness Group
Value given *)
*) except LV T64G
Not specified in the
Datasheet
Remark:
Due to changes in characteristics Q-codes might be replaced.
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
8
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (all devices)Taping
Current status New status
Package Mark = Cathode Mark Package Mark = Anode Mark
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
9
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LB T64G)
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
10
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LB T64G)
Characteristics
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
11
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LB T64G)Brightness Groups
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
12
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LB T64G)Forward Voltage Groups
Current status New status
No Grouping
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
13
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LB T64G)Relative Spectral Emission – V() = Standard eye response curve
Erel = f(); TS = 25°C; IF = 20mA
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
14
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LB T64G)Radiation Characteristic
Irel = f( ); TS = 25°C
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
15
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LB T64G)Forward Current
IF = f(VF); TS = 25°C
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
16
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LB T64G)Relative Illuminance
EV / EV (20mA) = f(IF); TS = 25°C
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
17
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LB T64G)Dominant Wavelength
dom = f(IF); TS = 25°C
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
18
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LB T64G)Forward Voltage
VF = VF – VF(25°C) = f(Tj); IF = 20mA
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
19
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LB T64G)Relative Illuminance
EV / EV (25°C) = f(Tj); IF = 20mA
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
20
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LB T64G)Dominant Wavelength
dom = dom - dom (25°C) = f(Tj); IF = 20mA
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
21
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LB T64G)Package Outline
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
22
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LB T66G)
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
23
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LB T66G)
Characteristics
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
24
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LB T66G)Brightness Groups
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
25
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LB T66G)Forward Voltage Groups
Current status New status
No Grouping
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
26
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LB T66G)Relative Spectral Emission – V() = Standard eye response curve
Irel = f(); TS = 25°C; IF = 20mA
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
27
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LB T66G)Radiation Characteristic
Irel = f( ); TS = 25°C
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
28
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LB T66G)Forward Current
IF = f(VF); TS = 25°C
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
29
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LB T66G)Relative Luminous Intensity
IV / IV (20mA) = f(IF); TS = 25°C
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
30
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LB T66G)Dominant Wavelength
dom = f(IF); TS = 25°C
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
31
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LB T66G)Forward Voltage
VF = VF – VF(25°C) = f(Tj); IF = 20mA
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
32
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LB T66G)Relative Luminous Intensity
IV / IV (25°C) = f(Tj); IF = 20mA
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
33
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LB T66G)Dominant Wavelength
dom = f(Tj); IF = 20mA
Current status New status
Not published
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
34
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LB T66G)Package Outline
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
35
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LT T64G)
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
36
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LT T64G)
Characteristics
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
37
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LT T64G)Brightness Groups
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
38
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LT T64G)Forward Voltage Groups
Current status New status
No Grouping
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
39
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LT T64G)Relative Spectral Emission – V() = Standard eye response curve
Erel = f(); TS = 25°C; IF = 20mA
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
40
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LT T64G)Radiation Characteristic
Irel = f( ); TS = 25°C
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
41
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LT T64G)Forward Current
IF = f(VF); TS = 25°C
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
42
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LT T64G)Relative Illuminance
EV / EV (20mA) = f(IF); TS = 25°C
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
43
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LT T64G)Dominant Wavelength
dom = f(IF); TS = 25°C
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
44
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LT T64G)Relative Forward Voltage
VF = VF – VF(25°C) = f(Tj); IF = 20mA
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
45
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LT T64G)Relative Illuminance
EV / EV (25°C) = f(Tj); IF = 20mA
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
46
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LT T64G)Dominant Wavelength
dom = f(Tj); IF = 20mA
Current status New status
Not published
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
47
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LT T64G)Package Outline
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
48
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LT T66G)
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
49
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LT T66G)
Characteristics
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
50
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LT T66G)Brightness Groups
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
51
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LT T66G)Forward Voltage Groups
Current status New status
No Grouping
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
52
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LT T66G)Relative Spectral Emission – V() = Standard eye response curve
Irel = f(); TS = 25°C; IF = 20mA
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
53
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LT T66G)Radiation Characteristic
Irel = f( ); TS = 25°C
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
54
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LT T66G)Forward Current
IF = f(VF); TS = 25°C
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
55
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LT T66G)Relative Luminous Intensity
IV / IV (20mA) = f(IF); TS = 25°C
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
56
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LT T66G)Dominant Wavelength
dom = f(IF); TS = 25°C
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
57
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LT T66G)Forward Voltage
VF = VF – VF(25°C) = f(Tj); IF = 20mA
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
58
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LT T66G)Relative Luminous Intensity
IV / IV (25°C) = f(Tj); IF = 20mA
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
59
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LT T66G)Dominant Wavelength
dom = f(Tj); IF = 20mA
Current status New status
Not published
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
60
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LT T66G)Package Outline
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
61
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LV T64G)
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
62
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LV T64G)
Characteristics
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
63
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LV T64G)Brightness Groups
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
64
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LV T64G)Forward Voltage Groups
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
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OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LV T64G)Relative Spectral Emission – V() = Standard eye response curve
Erel = f(); TS = 25°C; IF = 20mA
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
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OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LV T64G)Radiation Characteristic
Irel = f( ); TS = 25°C
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
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OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LV T64G)Forward Current
IF = f(VF); TS = 25°C
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
68
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LV T64G)Relative Illuminance
EV / EV (20mA) = f(IF); TS = 25°C
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
69
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LV T64G)Dominant Wavelength
dom = f(IF); TS = 25°C
Current status New status
Not published
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
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OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LV T64G)Forward Voltage
VF = VF – VF(25°C) = f(Tj); IF = 20mA
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
71
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LV T64G)Relative Illuminance
EV / EV (25°C) = f(Tj); IF = 20mA
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
72
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LV T64G)Dominant Wavelength
dom = dom - dom (25°C) = f(Tj); IF = 20mA
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
73
OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Changes in the Datasheets (LV T64G)Package Outline
Current status New status
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
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OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Updated Datasheet version
TOPLED Black Datasheet version
before PCN
Datasheet version
after PCN
LB T64G 2.2 1.3 *)
LB T66G 2.2 1.3 *)
LT T64G 2.1 1.2 *)
LT T66G 2.1 1.2 *)
LV T64G 1.3 1.4 *)
Note: After PCN approval and shipment of new material, the new data sheet versions will be valid.
Latest version of data sheet (related to after PCN version) is accessible on OSRAM OS homepage.
*) New Datasheet format
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
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OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
PCN Samples
TOPLED Black
LB T64G
LB T66G
LT T64G
LT T66G
LV T64G
PCN Samples available on demand
Customer Information Package | OS QM CQM ICI | ZK
OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018
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OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips
Time schedule for PCN material
(after implementation
of change):
Final qualification report 15.09.2018
Samples available On demand
Intended Start of delivery 01.02.2019 *)
*) or earlier if released by customer and upon
mutual agreement
Time schedule for Pre-PCN material
(prior to implementation
of change):
Last time order date (LTO) 15.03.2019 **)
**) expected approval date needs to be available
at this time. Lead time and LTO quantity shall be
mutually agreed between OSRAM OS and
customer.
Last time delivery date (LTD) 15.09.2019 ***)
***) planned last date for delivery of products of
current status
Note:
Pre-PCN material: Products of current status, means before implementation of the changes as described in the PCN.
PCN material: Products with implementation of the changes as described in the PCN.
www.osram-os.com
Thank you.