os-pcn-2018-030-a introduction of ux:3 chips and change ......customer information package | os qm...

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www.osram-os.com OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology Customer Information Package OS QM CQM ICI | 01.10.2018 Light is OSRAM

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Page 1: OS-PCN-2018-030-A Introduction of UX:3 Chips and Change ......Customer Information Package | OS QM CQM ICI | ZK OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for

www.osram-os.com

OS-PCN-2018-030-A

Introduction of UX:3 Chips and Change of

Plating for TOPLED Black with InGaN

Technology

Customer Information Package

OS QM CQM ICI | 01.10.2018

Light is OSRAM

Page 2: OS-PCN-2018-030-A Introduction of UX:3 Chips and Change ......Customer Information Package | OS QM CQM ICI | ZK OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for

Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

2

OS-PCN-2018-030-A

Overview

Page

1. Reason for change 03

2. Description of change 05

3. Changes in the datasheets 07

4. Time schedule 76

Page 3: OS-PCN-2018-030-A Introduction of UX:3 Chips and Change ......Customer Information Package | OS QM CQM ICI | ZK OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for

Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

3

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Reason for change

Improved Reliability for Signage Applications in Humid Environment

Ensurance of Long Term Availability

Brightness Improvement

Page 4: OS-PCN-2018-030-A Introduction of UX:3 Chips and Change ......Customer Information Package | OS QM CQM ICI | ZK OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for

Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

4

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

List of affected Products

TOPLED Black

LB T64G

LB T66G

LT T64G

LT T66G

LV T64G

Page 5: OS-PCN-2018-030-A Introduction of UX:3 Chips and Change ......Customer Information Package | OS QM CQM ICI | ZK OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for

Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

5

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Description of change (all devices)

Current status New status

Inhouse galvanic processes Pre-plated Leadframe

MSL level 2 MSL level 4

Page 6: OS-PCN-2018-030-A Introduction of UX:3 Chips and Change ......Customer Information Package | OS QM CQM ICI | ZK OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for

Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

6

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Description of change (all devices)

Item Current status New status

Chip Technology ThinGaN UX:3

Chip Carrier Ge Si

Chip Height 190µm 120µm

Wafer Size 100mm 150mm

Polarity n-up p-up

Chip Drawing

Page 7: OS-PCN-2018-030-A Introduction of UX:3 Chips and Change ......Customer Information Package | OS QM CQM ICI | ZK OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for

Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

7

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (all devices)

Datasheet value Current status New status

ESD withstand voltage ESD sensitive device 2 kV

Exemplary average

lifetime for median

Brightness Group

Value given *)

*) except LV T64G

Not specified in the

Datasheet

Remark:

Due to changes in characteristics Q-codes might be replaced.

Page 8: OS-PCN-2018-030-A Introduction of UX:3 Chips and Change ......Customer Information Package | OS QM CQM ICI | ZK OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for

Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

8

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (all devices)Taping

Current status New status

Package Mark = Cathode Mark Package Mark = Anode Mark

Page 9: OS-PCN-2018-030-A Introduction of UX:3 Chips and Change ......Customer Information Package | OS QM CQM ICI | ZK OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for

Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

9

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LB T64G)

Page 10: OS-PCN-2018-030-A Introduction of UX:3 Chips and Change ......Customer Information Package | OS QM CQM ICI | ZK OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for

Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

10

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LB T64G)

Characteristics

Current status New status

Page 11: OS-PCN-2018-030-A Introduction of UX:3 Chips and Change ......Customer Information Package | OS QM CQM ICI | ZK OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for

Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

11

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LB T64G)Brightness Groups

Current status New status

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Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

12

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LB T64G)Forward Voltage Groups

Current status New status

No Grouping

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Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

13

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LB T64G)Relative Spectral Emission – V() = Standard eye response curve

Erel = f(); TS = 25°C; IF = 20mA

Current status New status

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Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

14

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LB T64G)Radiation Characteristic

Irel = f( ); TS = 25°C

Current status New status

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Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

15

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LB T64G)Forward Current

IF = f(VF); TS = 25°C

Current status New status

Page 16: OS-PCN-2018-030-A Introduction of UX:3 Chips and Change ......Customer Information Package | OS QM CQM ICI | ZK OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for

Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

16

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LB T64G)Relative Illuminance

EV / EV (20mA) = f(IF); TS = 25°C

Current status New status

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Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

17

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LB T64G)Dominant Wavelength

dom = f(IF); TS = 25°C

Current status New status

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Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

18

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LB T64G)Forward Voltage

VF = VF – VF(25°C) = f(Tj); IF = 20mA

Current status New status

Page 19: OS-PCN-2018-030-A Introduction of UX:3 Chips and Change ......Customer Information Package | OS QM CQM ICI | ZK OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for

Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

19

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LB T64G)Relative Illuminance

EV / EV (25°C) = f(Tj); IF = 20mA

Current status New status

Page 20: OS-PCN-2018-030-A Introduction of UX:3 Chips and Change ......Customer Information Package | OS QM CQM ICI | ZK OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for

Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

20

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LB T64G)Dominant Wavelength

dom = dom - dom (25°C) = f(Tj); IF = 20mA

Current status New status

Page 21: OS-PCN-2018-030-A Introduction of UX:3 Chips and Change ......Customer Information Package | OS QM CQM ICI | ZK OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for

Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

21

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LB T64G)Package Outline

Current status New status

Page 22: OS-PCN-2018-030-A Introduction of UX:3 Chips and Change ......Customer Information Package | OS QM CQM ICI | ZK OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for

Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

22

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LB T66G)

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Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

23

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LB T66G)

Characteristics

Current status New status

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Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

24

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LB T66G)Brightness Groups

Current status New status

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Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

25

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LB T66G)Forward Voltage Groups

Current status New status

No Grouping

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Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

26

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LB T66G)Relative Spectral Emission – V() = Standard eye response curve

Irel = f(); TS = 25°C; IF = 20mA

Current status New status

Page 27: OS-PCN-2018-030-A Introduction of UX:3 Chips and Change ......Customer Information Package | OS QM CQM ICI | ZK OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for

Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

27

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LB T66G)Radiation Characteristic

Irel = f( ); TS = 25°C

Current status New status

Page 28: OS-PCN-2018-030-A Introduction of UX:3 Chips and Change ......Customer Information Package | OS QM CQM ICI | ZK OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for

Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

28

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LB T66G)Forward Current

IF = f(VF); TS = 25°C

Current status New status

Page 29: OS-PCN-2018-030-A Introduction of UX:3 Chips and Change ......Customer Information Package | OS QM CQM ICI | ZK OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for

Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

29

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LB T66G)Relative Luminous Intensity

IV / IV (20mA) = f(IF); TS = 25°C

Current status New status

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Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

30

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LB T66G)Dominant Wavelength

dom = f(IF); TS = 25°C

Current status New status

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Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

31

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LB T66G)Forward Voltage

VF = VF – VF(25°C) = f(Tj); IF = 20mA

Current status New status

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Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

32

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LB T66G)Relative Luminous Intensity

IV / IV (25°C) = f(Tj); IF = 20mA

Current status New status

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Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

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OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LB T66G)Dominant Wavelength

dom = f(Tj); IF = 20mA

Current status New status

Not published

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Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

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OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LB T66G)Package Outline

Current status New status

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Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

35

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LT T64G)

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Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

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OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LT T64G)

Characteristics

Current status New status

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Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

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OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LT T64G)Brightness Groups

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Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

38

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LT T64G)Forward Voltage Groups

Current status New status

No Grouping

Page 39: OS-PCN-2018-030-A Introduction of UX:3 Chips and Change ......Customer Information Package | OS QM CQM ICI | ZK OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for

Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

39

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LT T64G)Relative Spectral Emission – V() = Standard eye response curve

Erel = f(); TS = 25°C; IF = 20mA

Current status New status

Page 40: OS-PCN-2018-030-A Introduction of UX:3 Chips and Change ......Customer Information Package | OS QM CQM ICI | ZK OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for

Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

40

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LT T64G)Radiation Characteristic

Irel = f( ); TS = 25°C

Current status New status

Page 41: OS-PCN-2018-030-A Introduction of UX:3 Chips and Change ......Customer Information Package | OS QM CQM ICI | ZK OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for

Customer Information Package | OS QM CQM ICI | ZK

OS-PCN-2018-030-A Introduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Technology | 01.10.2018

41

OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LT T64G)Forward Current

IF = f(VF); TS = 25°C

Current status New status

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Changes in the Datasheets (LT T64G)Relative Illuminance

EV / EV (20mA) = f(IF); TS = 25°C

Current status New status

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Changes in the Datasheets (LT T64G)Dominant Wavelength

dom = f(IF); TS = 25°C

Current status New status

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OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

Changes in the Datasheets (LT T64G)Relative Forward Voltage

VF = VF – VF(25°C) = f(Tj); IF = 20mA

Current status New status

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Changes in the Datasheets (LT T64G)Relative Illuminance

EV / EV (25°C) = f(Tj); IF = 20mA

Current status New status

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Changes in the Datasheets (LT T64G)Dominant Wavelength

dom = f(Tj); IF = 20mA

Current status New status

Not published

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Changes in the Datasheets (LT T64G)Package Outline

Current status New status

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Changes in the Datasheets (LT T66G)

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Changes in the Datasheets (LT T66G)

Characteristics

Current status New status

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Changes in the Datasheets (LT T66G)Brightness Groups

Current status New status

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Changes in the Datasheets (LT T66G)Forward Voltage Groups

Current status New status

No Grouping

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Changes in the Datasheets (LT T66G)Relative Spectral Emission – V() = Standard eye response curve

Irel = f(); TS = 25°C; IF = 20mA

Current status New status

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Changes in the Datasheets (LT T66G)Radiation Characteristic

Irel = f( ); TS = 25°C

Current status New status

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Changes in the Datasheets (LT T66G)Forward Current

IF = f(VF); TS = 25°C

Current status New status

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Changes in the Datasheets (LT T66G)Relative Luminous Intensity

IV / IV (20mA) = f(IF); TS = 25°C

Current status New status

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Changes in the Datasheets (LT T66G)Dominant Wavelength

dom = f(IF); TS = 25°C

Current status New status

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Changes in the Datasheets (LT T66G)Forward Voltage

VF = VF – VF(25°C) = f(Tj); IF = 20mA

Current status New status

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Changes in the Datasheets (LT T66G)Relative Luminous Intensity

IV / IV (25°C) = f(Tj); IF = 20mA

Current status New status

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Changes in the Datasheets (LT T66G)Dominant Wavelength

dom = f(Tj); IF = 20mA

Current status New status

Not published

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Changes in the Datasheets (LT T66G)Package Outline

Current status New status

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Changes in the Datasheets (LV T64G)

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Changes in the Datasheets (LV T64G)

Characteristics

Current status New status

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Changes in the Datasheets (LV T64G)Brightness Groups

Current status New status

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Changes in the Datasheets (LV T64G)Forward Voltage Groups

Current status New status

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Changes in the Datasheets (LV T64G)Relative Spectral Emission – V() = Standard eye response curve

Erel = f(); TS = 25°C; IF = 20mA

Current status New status

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Changes in the Datasheets (LV T64G)Radiation Characteristic

Irel = f( ); TS = 25°C

Current status New status

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Changes in the Datasheets (LV T64G)Forward Current

IF = f(VF); TS = 25°C

Current status New status

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Changes in the Datasheets (LV T64G)Relative Illuminance

EV / EV (20mA) = f(IF); TS = 25°C

Current status New status

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Changes in the Datasheets (LV T64G)Dominant Wavelength

dom = f(IF); TS = 25°C

Current status New status

Not published

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Changes in the Datasheets (LV T64G)Forward Voltage

VF = VF – VF(25°C) = f(Tj); IF = 20mA

Current status New status

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Changes in the Datasheets (LV T64G)Relative Illuminance

EV / EV (25°C) = f(Tj); IF = 20mA

Current status New status

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Changes in the Datasheets (LV T64G)Dominant Wavelength

dom = dom - dom (25°C) = f(Tj); IF = 20mA

Current status New status

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Changes in the Datasheets (LV T64G)Package Outline

Current status New status

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Updated Datasheet version

TOPLED Black Datasheet version

before PCN

Datasheet version

after PCN

LB T64G 2.2 1.3 *)

LB T66G 2.2 1.3 *)

LT T64G 2.1 1.2 *)

LT T66G 2.1 1.2 *)

LV T64G 1.3 1.4 *)

Note: After PCN approval and shipment of new material, the new data sheet versions will be valid.

Latest version of data sheet (related to after PCN version) is accessible on OSRAM OS homepage.

*) New Datasheet format

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OS-PCN-2018-030-AIntroduction of UX:3 Chips and Change of Plating for TOPLED Black with InGaN Chips

PCN Samples

TOPLED Black

LB T64G

LB T66G

LT T64G

LT T66G

LV T64G

PCN Samples available on demand

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Time schedule for PCN material

(after implementation

of change):

Final qualification report 15.09.2018

Samples available On demand

Intended Start of delivery 01.02.2019 *)

*) or earlier if released by customer and upon

mutual agreement

Time schedule for Pre-PCN material

(prior to implementation

of change):

Last time order date (LTO) 15.03.2019 **)

**) expected approval date needs to be available

at this time. Lead time and LTO quantity shall be

mutually agreed between OSRAM OS and

customer.

Last time delivery date (LTD) 15.09.2019 ***)

***) planned last date for delivery of products of

current status

Note:

Pre-PCN material: Products of current status, means before implementation of the changes as described in the PCN.

PCN material: Products with implementation of the changes as described in the PCN.

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www.osram-os.com

Thank you.