Operational 200mm / 150mm Fab

Available for Purchase

SCOTLAND, UK

Texas Instruments IncorporatedOperational 200mm / 150mm Fab

Greenock, Scotland, UK

Contents

Executive Summary

Site Overview

Fab Operations

Tools & Infrastructure

Regional Advantages

Contact Information

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Executive Summary

Texas Instruments Incorporated (“TI”) is offering

for sale its operational, automotive-qualified

200mm / 150mm fab located in the town of

Greenock, Scotland, United Kingdom.

The installed capacity of the fab is 21,666 wafer

starts per month based on the facility’s current

product mix.

This fab manufactures power management,

lighting, thermal management, and amplifier

products, serving customers in the automotive,

consumer, energy, and industrial sectors.

This offering may include a multi-year supply

agreement, allowing the buyer to generate

revenue during product qualification and

production ramp.

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KEY FACILITY FACTS

Cleanroom 82,226 sq. ft. (Class 1 – 10,000)

Production Capacity

Installed capacity8,333 wafers / month (200mm) 13,333 wafers / month (150mm)

Four-wall capacity23,333 wafers / month (200mm equivalent)

Geometries 7 μm – 0.7 μm in production (most tools capable of producing down to 0.35 μm)

Process Technologies BiCMOS, CMOS, Metal Gate CMOS, Poly Gate CMOS, BiPolar

Certifications ISO / TS16949, ISO 9001, ISO 14001, OHSAS 18001

Headcount 321

Tool Count 269

Year Built 1987

The current facility was built in 1987. The site was originally established by National Semiconductor as a 150mm fab.

Prior to Texas Instruments’ acquisition of National Semiconductor in 2011, the fab began its conversion to 200mm

production. The 23-acre Greenock campus includes four buildings consisting of approximately 318,782 sq. ft.

Site Overview

BUILDING YEAR BUILT FUNCTION AREA (FT2) AREA (M2)

A 1978 Office, cafeteria, gym 61,856 5,747

B 1996 Utilities (chillers, boilers, compressor) 9,826 913

C 1987 Fab (manufacturing, office, plant equipment) 232,416 21,592

D 1997 Support office, chemical stores 14,684 1,364

Buildings

Building C

Building D

Building B

DI Water

Building A Unused Land & Parking

ParkingBulk GasesWater Storage

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SITE O

VERVIEW

ITEM AREA (FT2) AREA (M2)

Ground Floor

Class 100,000 14,779 1,373

Class 10,000 26,296 2,443

Class 1,000 1,238 115

Class 10 27,114 2,519

Class 1 1,679 156

Total Ground Floor 71,106 6,606

First Floor

Class 100,000 4,661 433

Class 10,000 4,672 434

Class 100 1,787 166

Total First Floor 11,120 1,033

Cleanroom The Class 1 – 100,000 cleanroom area

of Building C spans 82,226 sq. ft. and

utilizes a combination of ballroom and

bay-and-chase configurations.

There is no sub-fab—services are fed

down from the plenum. Dry etch bays

have a 600mm-raised floor.

Building C – Fab cleanroom cross-section (Photo Ballroom 2)

DOWNSTAND BEAM DOWNSTAND BEAMDOWNSTAND BEAM

CLEANROOM SPECIFICATIONS

Floor LoadingFloors concentrated load: 1,200 KgfFloors ultimate load: 3,000 KgfPedestals: 5,000-11,000 Kgf

Raised Floor Height Ballroom & dry etch areas: 600mm

Vibration Tool-specific

Maximum Make-up Air Flow Rate 280 cfm @ 8.5 inches

Recirculation Air Flow Rate Typical ~85% recirculation to VLF / FFUs

Gowning AreaImplant Bay

Epitaxial Room

Photo Ballroom 2

Photo Ballroom 3 (Class 1)

CMP Bay

Vertical Furnace / Deposition AislesHorizontal Furnace

Aisles

Metal Deposition Bay

Plasma Etch Aisles / PB 1

SITE O

VERVIEW

(cont’d)

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OfficeThe office area offers approx. 53,000 sq. ft. of floor space for use in a variety of applications and purposes, including bullpen

areas, offices, and conference rooms. The office area also features a fitness center and staff cafeteria that can accommodate

up to 108 people.

Fab Operations

Capacity In 2008, the Greenock fab initiated a

plan to convert its 150mm production

to 200mm.

As of December 2015, approximately

70% of existing volume qualified for

200mm production.

The current installed capacity and average mask layers by process type and wafer size are as follows:

200mm %tage Starts

20100

10

20

30

40

50

60

70

80

90

100

2011 2012 2013 2014 2015

150mm %tage Starts

INSTALLED CAPACITY - REAL WAFERS (MAX.) (WSPM)

Process Type 150mm 200mm Total

BiCMOS / CMOS 5,000 5,000 10,000

BiPolar 8,333 3,333 11,666

Total 13,333 8,333 21,666

AVERAGE MASK LAYERS

Process Type 150mm 200mm

BiCMOS / CMOS 19 21

BiPolar 11 13

Overall Average 14 18

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Products Manufactured Illustrative products manufactured in the fab include simple switches, switching regulators, LED drivers, linear regulators,

temperature sensors, and LDO regulators serving multiple industry segments.

Experienced Workforce The fab benefits from an experienced

workforce. The engineering team has

extensive process conversion experience,

including product migration from 150mm

to 200mm, with a demonstrated ability

to convert up to 35 products per quarter.

Process Control / Yield For the past three years, TI’s Greenock fab has consistently achieved over 98.5% yield.

CertificationsQuality

• ISO 9001 Quality Management System

• TS16949 Automotive Quality

Safety & Environmental

• ISO 14001 Environmental Management

• OHSAS 18001 Occupational Health & Safety

AMPLIFIERS LIGHTING POWER MANAGEMENT THERMAL MANAGEMENT

Automotive • • • •Consumer • • • •Energy • • •Industrial • • • •Military / Space • •

Tools & Infrastructure

The Greenock facility features 269 well-maintained front-end tools currently running 150mm and 200mm production from 7.0 μm

down to 0.7 μm. With the exception of the dry etch tools, the tool set is capable of producing down to 0.35 μm.

Greenock fab operations are fully supported by a robust infrastructure, including power, steam humidification, DI / incoming water,

controls / detection points, chemicals (CDUs), exhaust systems, gas plant (lease from AP), bulk gases, clean dry air (CDA), chillers,

boilers, house vacuum, process cooling (free cool), and make-up air.

Tool Highlights• A 200mm line currently running down to 0.7 μm node

• Most tools capable down to 0.35 μm with exception of

dry etch tools

• Highly capable line currently running processes at an

average of 14 to 18 mask layers with aluminium back-end

TOOL TYPE NUMBER OF TOOLS

150mm dedicated tools 142

200mm dedicated tools 106

Metrology tools 21

Total 269

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Regional Advantages

Scotland has a long-standing history of technological innovation in such fields as manufacturing, advanced materials, software, electronics, sensors, and photonics serving the oil and gas, renewable energy, aerospace, defense, and marine markets. Some 10,000 technology companies employ 161,000 people locally, including Rolls Royce, BAE Systems, Lockheed Martin, Oracle, Alexander Dennis, Selex ES, Thales, and Cirrus Logic.

Scotland offers key strengths in semiconductor design, sub-assembly systems and software, particularly in mixed-signal, analog design, and digital signal processing. With a particular focus on sensors, MEMS, and nanotechnology, key market areas include communications, medical devices, and sensing applications.

The fabless design sector is a real mix of international and homegrown Scottish companies, the key attractor being high-quality skills at moderate costs for Europe and low employee churn. Scotland offers a strong focus on addressing new opportunities in digital health and care, sensor systems, big data, and subsea engineering via new Innovation Centers connecting world-class academic research to industry. Digital technologies account for a significant proportion of Foreign Direct Investment (FDI) in the UK, with ICT-related investment (IT equipment, communications equipment, and software) making up around 25% of all FDI projects.

Top European Technology Ecosystem Scotland is home to technology companies of all sizes, including Semefab, Raytheon Systems Limited, Compound Semiconductor Technologies, The Scottish Microelectronics Centre (SMC), Kelvin Nanotechnology Ltd. (KNT), Pyreos, 4i2i, Alba Ultrasound, Ampsys, Cascade Technologies, Freescale, Xilinx, Analog Devices, Broadcom, Dialog Semiconductor, Aydeekay, Pressure Profile Systems, and ESS Technology. Vendors are typically focused on mature technology nodes, but have also built specialist capabilities in areas such as MEMS and compound semiconductors.

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Workforce & RecruitmentScotland’s workforce is one of the best trained, most reliable, and cost-competitive labor forces in the world. Scottish salary costs, including indirect social wage costs such as employer national healthcare insurance, are among the most competitive in Europe. Labor market regulations in the UK are the most flexible in Europe. With a world-renowned educational system and its ratio of university graduates per capita, Scotland’s talent base surpasses most countries of comparable size in Europe. From 2010 to 2013, the number of businesses operating in the Scottish ICT and digital technologies sector increased by 3.6% to 6,500, employing more than 73,000 professionals. With 16 universities, including Glasgow and Edinburgh, Scotland is known internationally for its outstanding academic expertise and world-leading research departments such as The Scottish Informatics and Computer Science Alliance (SICSA) and the Edinburgh Parallel Computing Centre (EPCC).

Accessible European LocationCentrally located in Greenock on the west coast of Scotland, the TI fab lies 20 miles from Glasgow airport, 30 miles from the city, and 75 miles from Edinburgh. From six main airports, 35 airlines provide flights to 30 destinations in the UK, Europe, North America, and global destinations. Scotland benefits from a great railway infrastructure ensuring frequent connections from all parts of the country and fast local commuter times.

Quality of Life Scotland is world-famous for its spectacular scenery, heritage, and vibrant culture. Western Scotland is a highly desirable location for people to live and work. The cost of living in Glasgow is 36% lower than in London. Scotland offers more than 550 golf courses. In addition to its amazing views, Inverclyde offers unique waterfront sporting and leisure opportunities, all easily accessible from Glasgow and beyond.

Economic IncentivesThe UK offers a corporate tax rate of 20% which, according to HM Treasury, means that the country has the lowest main corporation tax rate in the G8. Alongside this attractive rate for investors, there are other financial incentives of relevance that potential buyers may be able to take advantage of, including Regional Selective Assistance (RSA), Scottish Investment Bank (SIB), R&D Grants, Training Grant(s), Patent Box, Tax Obligation Accrual, and R&D Tax Credit (more information at www.hmrc.gov.uk/ct/forms-rates/claims/randd.html).

STEPHEN ROTHROCK

President & CEO+1.206.268.7801stephen.rothrock@atreg.com

SAIF KHAN

Vice President +1.206.268.7808saif.khan@atreg.com

ANNIE ROTHROCK

Associate+1.206.268.7803annie.rothrock@atreg.com

ATREG, Inc. | 221 Yale Avenue North | Suite 600 | Seattle, WA 98109 | USA | www.atreg.com

Knowledge. Relationships. Results.

Contact Information

The purpose of this brochure (”Brochure”) is to provide an overview of the Texas Instruments Incorporated (“TI” or the “Company”) semiconductor fabrication facility located in Greenock, Scotland, UK (the “Fab”). This Brochure is not designed to provide a comprehensive description of the Fab. Any information, whether included or omitted from the Brochure, is subjected to due diligence and should be independently validated by the prospective purchaser.

By accepting or receiving this Brochure, the recipient agrees and acknowledges that (a) neither TI nor ATREG (and none of their respective directors, officers, employees, representatives, or agents, nor their affiliates and respective directors, officers, employees, representatives, or agents – together, “Affiliates”) makes any express or implied representation, warranty, covenant, or any other agreement of any kind whatsoever related to the Fab, this Brochure, and any information contained herein, including with respect to the accuracy or completeness of the information contained herein and any information obtained in connection with any investigation of the Fab, (b) none of TI, ATREG, and their respective Affiliates makes any undertaking to update any statement or information contained in this Brochure or made in connection with any investigation of the Fab, and (c) the consummation of any transaction relating to the Fab or the subject matter of the Brochure is subject to the preparation and execution of definitive agreements in form and substance mutually agreeable to TI and the recipient, such definitive agreement shall not be made on any reliance on this Brochure or any other information not affirmatively warranted or represented in such definitive agreement, and no party shall have any claims whatsoever against TI, ATREG, or any of their respective Affiliates arising out of or relating to any transaction involving the Company other than those that may arise from a definitive agreement.

Each of TI, ATREG, and their respective Affiliates expressly disclaims any and all liability (whether known or unknown, asserted or unasserted, absolute or contingent, accrued or unaccrued, liquidated or unliquidated, due or to become due, or otherwise) or any indemnification or other obligation which may be based on this Brochure, including any errors therein or omissions therefrom, or any other information obtained in connection with the Fab, any investigation thereof, or the subject matter of the Brochure. In receiving this Brochure, the recipient also understands and agrees that (i) TI and ATREG may conduct any process related to the Fab in such manner as TI and ATREG, in their sole discretion, may determine (including, without limitation, negotiating and entering into a final

acquisition agreement with any third-party without notice to the recipient), (ii) TI and ATREG reserve the right to change, in their sole discretion, at any time and without notice, the procedures relating to any proposed transaction (including, without limitation, terminating all further discussions and requesting the return or destruction of all materials), and (iii) you shall not have any claims against TI, ATREG, or any of their respective Affiliates arising out of or relating to any transaction involving the Fab (other than those as against the parties to a definitive agreement with you in accordance with the terms thereof) nor, unless a definitive agreement is entered into with you, against any third-party with whom a transaction is entered into.

This Brochure includes certain statements, plans, forecasts, estimates, and projections with respect to actual or anticipated future financial performance or other aspects of the Fab. Such statements, plans, forecasts, estimates, and projections reflect various assumptions, which assumptions may or may not be correct. Such statements, plans, forecasts, estimates, and projection estimates are not necessarily indicative of current value or future performance, which may differ significantly from anything reflected in this Brochure. None of TI, ATREG, and their respective Affiliates makes any representation, memorandum, warranty, covenant, or any other agreement as to such statements, plans, forecasts, estimates, or projections, including any undertaking to update such statements, plans, forecasts, estimates, or projections. The recipient understands that there are inherent uncertainties in making such statements, plans, forecasts, estimates, or projections.

In furnishing this Brochure, neither the Company nor ATREG undertakes any obligation to provide the recipient with any additional information or access thereto. This Brochure shall not be deemed an indication of the state of affairs of the Fab, nor shall it constitute an indication that there has been no change in the business or affairs of the Fab since the date hereof. This Brochure is not and shall not be construed or viewed in any way to be a commitment, offer, obligation, or agreement with respect to any transaction with the Company. All communications, inquiries, and requests for information relating to these materials must be addressed to ATREG as representatives of the Company. You are not authorized to contact, and under no circumstances should you contact, the management, or any of the employees, directors, shareholders, suppliers, vendors, licensors, customers, partners, or lenders of the Company directly.