oofelie::multiphysics fullymagnetic mems magnetostatic actuator based on 25 μmthick soi magnetic...
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Sensor & Actuator Current Techniques
06/11/2014
Tokyo Seminar - MEMS
1
OOFELIE::Multiphysics fully
addresses Today’s Advanced Design
Needs
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Electrostatics
ADVANCED MEMS PLATFORM FOR OPTICAL NETWORKS
Tokyo Seminar - MEMS
206/11/2014
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Piezoelectricity - SAW
SAW/BAW
Acoustic wave generation
using piezoelectric effect
2D/3D FEM models
AlN – anisotropic materials
PML FOR INFINITE MEDIUM
GYROSCOPIC EFFECT
ANALYSES
Modal
Harmonic
INTERDIGITAL TRANSDUCER
(IDT) DESIGN
INVESTIGATION OF THERMAL
EFFECTS
Tokyo Seminar - MEMS
306/11/2014
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PIEZOELECTRICITY - ACCELEROMETER
VIBRATING INERTIAL
ACCELEROMETER (VIA & DIVA) Piezoelectricity
Thermoelastic damping
ANALYSES
Modal
Harmonic
QUALITY FACTOR
MAXIMIZATION
CO-SIMULATION WITH IC RLC external circuit
PACKAGING EFFECTS
Air damping
Thermal stresses
FRAME OPTIMISATION
Mechanical losses
Tokyo Seminar - MEMS
406/11/2014
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Tokyo Seminar - MEMS
5
Piezoelectricity - MEMS Micro-Mirror
Mirror substrate,
torsion bars and
frame in Silicon,
50 µm thick
Al layer, 0.3 µm thick
PZT actuators, 3 µm thick
PZT actuators, 3 µm thick
06/11/2014
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Tokyo Seminar - MEMS
6
Piezoelectricity - MEMS Micro-Mirror
Harmonic analysis
Elastic
deformation
Complete
deformation
Modal analysis
Rotation resonant mode at 15997 Hz
Dynamic analysis (and exportation to ZEMAX):
06/11/2014
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Piezoelectricity - MEMS harvester
Tokyo Seminar - MEMS
706/11/2014
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Piezoelectric MEMS harvester
Tokyo Seminar - MEMS
806/11/2014
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PIEZORESISTIVITY - PRESSURE SENSOR
PIEZORESISTIVE EFFECT
Change of resistivity due to
mechanical stresses
PARAMETRIC MODEL
Geometry of gauges
Geometry of sensitive
mechanical elements
MATERIALS
Parameters identification
THIN-FILM BEHAVIOUR
Membrane elements
PRESTRESS
Due to temperature
Manufacturing process
Tokyo Seminar - MEMS
906/11/2014
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Magnetic MEMS
MAGNETOSTATIC ACTUATOR
Based on 25 μm thick SOI
Magnetic core and plunger made of 4 μm electroplated soft magnetic permalloy - NiFe
(80/20)
Windings are realized by electroplating 2 μm of Copper.
Isolation and planarization based on polymer deposition
Tokyo Seminar - MEMS
1006/11/2014
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Acoustics - Micro-loudspeaker
Pressure field amplitude Pressure field amplitude
Radiated
acoustic power
11
Tokyo Seminar - MEMS
06/11/2014
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AUTONOMOUS SMART SYSTEMS
PIEZOELECTRIC HARVESTER
Mechanical vibrations
produces energy
ANALYSES
Modal
Harmonic
Random Vibration
THERMAL HARVESTER
Seebeck/Thomson effects
Temperature gradient
produces energy
ANALYSIS
Steady-state
Dynamic
Tokyo Seminar - MEMS
1206/11/2014
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MP-F.S.I. – Piezo Micro-Pump Simulations
SEMICON Europa 2014
13
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MANUFACTURING PROCESS
OOFELIE::MULTIPHYSICS FOR ROBUST MICRO-SYSTEMS DESIGN
06/11/2014
Tokyo Seminar - MEMS
14
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Dealing With Pre-stress from Manufacturing Process
Full FAB-process Simulation
Step by step simulation of the
process
Pre – Stress Formula based Input
Estimated stress measured on the line
06/11/2014 15
Tokyo Seminar - MEMS
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PACKAGING
OOFELIE::MULTIPHYSICS FOR ROBUST MICRO-SYSTEMS DESIGN
06/11/2014
Tokyo Seminar - MEMS
16
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Packaging effects
IDENTIFY MOST APPROPRIATE PACKAGE FOR HARSH
ENVIRONMENTS
UNDERSTAND AND MASTER
Size, length and shape of bondwiring
The influence of gluing
The influence of the package on the functionality
Limit induced stresses caused by assembly process
06/11/2014
Tokyo Seminar - MEMS
17
Simulation with To8 package
Study the energy losses through
the mounting parts
Optimize the resonance quality
Minimize the effect of thermal
stresses on the resonance
frequency.
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Thermal Management – Heat sink Simulations
OBTAIN THE BEST PERFORMANCES IN THE OPTIMAL
TEMPERATURE RANGE
SEMICON Europa 2014
18
Consider all types of heat
transfer to cool the devices
Conduction
Dynamic Capacitive effects
External / Mutual / Orbital
Radiation
Natural / Forced Convection
Reproduce the
Heating Cycles
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Wafer level packaging
06/11/2014
Tokyo Seminar - MEMS
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Wafer level packaging
06/11/2014
Tokyo Seminar - MEMS
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TSV (Through Silicon Via) Simulations
SEMICON Europa 2014
21
Create the best
meshes with
OOFELIE UI
Visualize the
thermomechanical
stress concentration
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CONCLUSION
06/11/2014
Tokyo Seminar - MEMS
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Technologies needed to cover & close the MEMS value chain
Tokyo Seminar - MEMS
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OOFELIE::Multiphysics Key Features
INTEGRATED CAE ENVIRONMENT COMBINED WITH MEMS PRO® FOR EDA FLOW CONNECTION
ENGINEERING STANDARD, INTUITIVE, TIME-SAVING DESIGN FLOW INCLUDING
SCRIPTING, PARAMETERIZATION AND OPTIMIZATION
BROAD TRANSDUCER DOMAIN COVERAGE (ELECTROSTATICS, PIEZORESISTIVITY, PIEZOELECTRICITY, ELECTROMAGNETIC EFFECTS)
STRONGLY COUPLED MULTIPHYSICS APPROACH FOR FASTER AND MORE
ACCURATE CONVERGENCE IN DYNAMICS
EFFICIENT HANDLING OF LARGE SCALE AND COMPLEX INDUSTRIAL PROBLEMS
FINITE ELEMENT AND BOUNDARY ELEMENT METHODS COMBINED (FEM/BEM COUPLING)
MODEL ORDER REDUCTION TECHNIQUES FOR CO-SIMULATION WITH EDA SOLVERS (VERILOG A & VHDL-AMS)
MULTIPHYSICS FEA COMBINED WITH ZEMAX® FOR MOEMS DESIGN
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Engineering Standard Multiphysics Solutions When You Need To Get The Job Done!
06/11/2014
Tokyo Seminar - MEMS
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