nick jaeger 2010

8/3/2019 Nick Jaeger 2010

1/27

Silicon Photonics and Higher EducationSilicon Photonics and Hig

her Education

ByBy

Nicolas A. F. JaegerNicolas A. F. Jaeger,,Dan Deptuck,Dan Deptuck,Nicolas Rouger, andNicolas Rouger, andLukas ChrostowskiLukas Chrostowski


2/27

22

AffiliationsAffiliations

Nicolas JaegerNicolas Jaeg

er Electrical and Computer Engineering,Electrical and Computer Engineering,University of British ColumbiaUniversity of British Columbia

Lukas ChrostowskiLukas Chrostowski Electrical and Computer Engineering,Electrical and Computer Engineering,

University of British ColumbiaUniversity of British Columbia

Dan DeptuckDan Dep

tuck Canadian Microelectronics Corporation orCanadian Microelectronics Corporation orCMC MicrosystemsCMC Microsystems

Nicolas RougerNicolas Roug

er Centre National de la Recherche Scientifique,Centre National de la Recherche Scientifique,Grenoble UniversityGrenoble University


3/27

33

Silicon Photonics Workshop and Graduate CourseSilicon Photonics Workshop an

d Graduate Course

The CMC-UBC Silicon Photonics WorkshopThe CMC-UBC Silicon Photonics Workshop

andand

UBC's EECE 584 Graduate CourseUBC's EECE 584 Graduate Course

Background image from:Background image from:R. Boeck, N. A. F. Jaeger, and L. Chrostowski,R. Boeck, N. A. F. Jaeger, and L. Chrostowski,

Experimental Demonstration of the Vernier Effect UsingExperimental Demonstration of the Vernier Effect UsingSeries Coupled Resonators, submitted to the 2010Series Coupled Resonators, submitted to the 2010International Conference on Optical MEMS andInternational Conference on Optical MEMS andNanophotonics.Nanophotonics.


4/2744

OutlineOutline

MotivationMotivation

ePIXfab, IMEC, LETI, and PhotonFABePIXfab, IMEC, LETI, and PhotonFAB

CMC-UBC Graduate Course and WorkshopCMC-UBC Graduate Course and Workshop

AcknowledgementsAcknowledgements


5/27

55

MotivationMotivation

Silicon photonics has come of ageSilicon photonics has come of age

Small sizeSmall size

Reasonable lossesReasonable losses

Silicon photonics is compatible with CMOSSilicon photonics is compatible with CMOS

technologiestechnologies Silicon photonics will play a significant role in the futureSilicon photonics will play a significant role in the future

Photonic wiresPhotonic wires

Photonic crystalsPhotonic crystals

Passive and active devicesPassive and active devices

Students need to be trained in this technologyStudents need to be trained in this technology

Foundry services for affordable multi-project wafers areFoundry services for affordable multi-project wafers arenow available through IMEC and LETInow available through IMEC and LETI


6/27

66

Motivation - ContinuedMotivation - Continued

Silicon nanophotonics and the newly established foundries, IMECSilicon nanophotonics and the newly established foundries, IMEC

and LETI, enable the nanofabrication of optical components forand LETI, enable the nanofabrication of optical components foroptical communications, sensors, and biomedical devices.optical communications, sensors, and biomedical devices.

Example components:Example components: Photonic waveguides (photonic crystal or stripe/ridge)Photonic waveguides (photonic crystal or stripe/ridge)

Photonic crystalsPhotonic crystals Modulators and detectorsModulators and detectors Gratings for fiber couplingGratings for fiber coupling Ring resonators and filtersRing resonators and filters Multiplexers (diffraction or arrayed waveguide)Multiplexers (diffraction or arrayed waveguide)

A Recent Development:A Recent Development:A. Biberman et al., First Demonstration of 80-km Long-HaulA. Biberman et al., First Demonstration of 80-km Long-HaulTransmission of 12.5-Gb/s Data Using Silicon Microring ResonatorTransmission of 12.5-Gb/s Data Using Silicon Microring ResonatorElectro-Optic Modulator, OFC/NFOEC 2010, San Diego, CA,Electro-Optic Modulator, OFC/NFOEC 2010, San Diego, CA,

March 23-25, 2010, JWA28.March 23-25, 2010, JWA28.


7/27

77

ePIXfab, IMEC, LETI, PhotonFAB,ePIXfab, IMEC, LETI, PhotonFAB,CMC Microsystems, and UBCCMC Microsystems, and UBC

ePIXfab offers access to IMEC and LETI foundariesePIXfab offers access to IMEC and LETI foundariesthrough PhotonFAB.through PhotonFAB.

CMC Microsystems offers access to ePIXfab forCMC Microsystems offers access to ePIXfab for

Canadian universities, research institutions, andCanadian universities, research institutions, andindustry.industry.

UBC offers advanced training in silicon photonicsUBC offers advanced training in silicon photonicsthrough thethrough the CMC-UBC WorkshopCMC-UBC Workshop and theand the EECE 584EECE 584

graduate course.graduate course.


8/27

88

ePIXfab the silicon photonics platformePIXfab the silicon photonics platformhttp://www.epixfab.eu/http://www.epixfab.eu/

ePIXfab supports a fab-less silicon photonics model.ePIXfab supports a fab-less silicon photonics model.

ePIXfab organizes the fabrication of large-scaleePIXfab organizes the fabrication of large-scalesilicon photonics ICs through the use of Multisilicon photonics ICs through the use of Multi

Project Wafer (MPW) shuttles.Project Wafer (MPW) shuttles. MPW shuttles offer access to the silicon photonicsMPW shuttles offer access to the silicon photonics

IC technologies at IMEC and LETI.IC technologies at IMEC and LETI. ePIXfab offers training courses and tutorials onePIXfab offers training courses and tutorials on

silicon photonics and MPWs through PhotonFAB.silicon photonics and MPWs through PhotonFAB. Additionally, ePIXfab's partners offer design andAdditionally, ePIXfab's partners offer design and

back-end technologies, e.g., nanostructuring andback-end technologies, e.g., nanostructuring andpackaging.packaging.


9/27

99

IMEC passive photonic cSOI 220nm*IMEC passive photonic cSOI 220nm*http://www2.imec.be/be_en/home.htmlhttp://www2.imec.be/be_en/home.html

cSOI 220nm is IMEC's main process for fabricatingcSOI 220nm is IMEC's main process for fabricatingpassive photonic components in a 220 nm thick crystallinepassive photonic components in a 220 nm thick crystallineSi film on a 2000nm thick buried oxide (BOX).Si film on a 2000nm thick buried oxide (BOX).

Main cSOI 220nm process features:Main cSOI 220nm process features: 220nm top Si film on a 2000nm BOX220nm top Si film on a 2000nm BOX 193nm lithography193nm lithography Etches of 70nm and 220nmEtches of 70nm and 220nm Typical line width of 450nmTypical line width of 450nm Typical pitch of 400nmTypical pitch of 400nm Minimum line width of 120nmMinimum line width of 120nm Minimum pitch of 300nmMinimum pitch of 300nm Photonic wire losses of 2.5-3dB/cmPhotonic wire losses of 2.5-3dB/cm

______________* http://www.epixfab.eu/technology/imec_std/* http://www.epixfab.eu/technology/imec_std/


10/27

1010

LETI silicon photonics STANDARD*LETI silicon photonics STANDARD*http://www-leti.cea.fr/enhttp://www-leti.cea.fr/en

This is LETI's main processThis is LETI's main process for fabricating passivefor fabricating passivephotonic components in either a 220 nm thick crystallinephotonic components in either a 220 nm thick crystallineor a 220nm thick amorphous Si film on a 2000nm thickor a 220nm thick amorphous Si film on a 2000nm thickBOX.BOX.

Main LETI STANDARD process features:Main LETI STANDARD process features: 20cm wafers20cm wafers 220nm Si on a 2000nm BOX220nm Si on a 2000nm BOX crystalline or low-loss amorphous (hydrogenated)crystalline or low-loss amorphous (hydrogenated)

silicon filmssilicon films 193nm and 248nm lithography193nm and 248nm lithography 2 process layers: WG (220nm etch), FC (70nm etch)2 process layers: WG (220nm etch), FC (70nm etch) Predefined mask for fiber coupling available.Predefined mask for fiber coupling available.

______________* http://www.epixfab.eu/technology/leti_std/* http://www.epixfab.eu/technology/leti_std/


11/27

1111

LETI silicon photonics 4 FLEX*LETI silicon photonics 4 FLEX*http://www-leti.cea.fr/enhttp://www-leti.cea.fr/en

4 FLEX is LETI's main process for fabricating silicon4 FLEX is LETI's main process for fabricating siliconphotonic functions with both passive and active devices.photonic functions with both passive and active devices.

Main LETI 4 FLEX process features:Main LETI 4 FLEX process features: 20cm wafers20cm wafers

220nm Si on a 2000nm BOX or220nm Si on a 2000nm BOX or 400nm Si on a 1000nm BOX or400nm Si on a 1000nm BOX or Custom thicknesses between 100nm and 400nm.Custom thicknesses between 100nm and 400nm. Crystalline or low-loss amorphous (hydrogenated) SiCrystalline or low-loss amorphous (hydrogenated) Si

filmfilm

193nm and 248nm lithography193nm and 248nm lithography Si and Ge epitaxySi and Ge epitaxy Boron and Phosphorous Implants and annealsBoron and Phosphorous Implants and anneals Metal contactsMetal contacts

____________

* http://www.epixfab.eu/technology/leti_4_flex/* http://www.epixfab.eu/technology/leti_4_flex/


12/27

1212

PhotonFABPhotonFABhttp://www.epixfab.eu/photonfab/http://www.epixfab.eu/photonfab/

PhotonFAB lowers the barriers for R&D on siliconPhotonFAB lowers the barriers for R&D on siliconphotonic integrated circuits in order to increase take-up ofphotonic integrated circuits in order to increase take-up ofthe technology and strengthen the impact of R&D in thethe technology and strengthen the impact of R&D in the

European area.European area.

The objective of PhotonFAB is to decrease the total cost ofThe objective of PhotonFAB is to decrease the total cost offabless R&D through this scheme with:fabless R&D through this scheme with:

Increased technological capabilities offered through theIncreased technological capabilities offered through theePIXfab R&D foundryePIXfab R&D foundry

Lower effort and shallower learning curve for designLower effort and shallower learning curve for design

into the technologyinto the technology Lower prices for European usersLower prices for European users Improved access logisticsImproved access logistics Training and documentationTraining and documentation A roadmap for accessA roadmap for access


13/27

1313

PhotonFAB Training SchedulePhotonFAB Training Schedulehttp://www.epixfab.eu/photonfab/training/http://www.epixfab.eu/photonfab/training/

Annual Course on the ePIXfab MPW - A 3-day courseAnnual Course on the ePIXfab MPW - A 3-day coursecovering the technology, design, and MPW operation forcovering the technology, design, and MPW operation fordesigners of Si photonic ICs. The course is intended fordesigners of Si photonic ICs. The course is intended forthose who will actually design Si photonic circuits. Trainingthose who will actually design Si photonic circuits. TrainingSession # 1 was offered in October 2009 and Session #2Session # 1 was offered in October 2009 and Session #2

was offered in March 2010.was offered in March 2010. Short Course - A 1.5 to 3-hour tutorial for a wider,Short Course - A 1.5 to 3-hour tutorial for a wider,

technically oriented, public with an interest in Si photonics.technically oriented, public with an interest in Si photonics.Topics include: fundamentals of photonic waveguides,Topics include: fundamentals of photonic waveguides,passive devices, active devices, integration, andpassive devices, active devices, integration, and

applications. This was given atapplications. This was given at Micro & Nano EngineeringMicro & Nano Engineering20092009, Ghent, Belgium, in September 2009., Ghent, Belgium, in September 2009. Hands-on Design Training - ePIXfab is looking to offerHands-on Design Training - ePIXfab is looking to offer

training on specific software relevant to ePIXfab.training on specific software relevant to ePIXfab. Training on Demand - Dedicated training on the ePIXfabTraining on Demand - Dedicated training on the ePIXfab

MPW or Si photonics.MPW or Si photonics.


14/27

1414

CMC-UBC Silicon Nanophotonics FabricationCMC-UBC Silicon Nanophotonics FabricationGraduate Course and Workshop 2010 - HistoryGraduate Course and Workshop 2010 - History

Started in 2008 with discussions betweenStarted in 2008 with discussions betweenUBC and CMCUBC and CMC

First offered as a 4 credit EE seminar andFirst offered as a 4 credit EE seminar andspecial problems (directed studies) coursespecial problems (directed studies) course

in 2008 2009 to 8 UBC studentsin 2008 2009 to 8 UBC students

Second offering as a 1-year long, 4 credit,Second offering as a 1-year long, 4 credit,directed studies course and workshop indirected studies course and workshop in2009 2010 to 23 participants from2009 2010 to 23 participants from

universities and industry Canada wideuniversities and industry Canada wide Now being offered in 2010 2011 as a 2-Now being offered in 2010 2011 as a 2-

stream graduate course or workshop tostream graduate course or workshop toCanadian universities and industryCanadian universities and industry


15/27

1515

Course/Workshop ObjectivesCourse/Workshop Objectives

By the end of the course, it is expected that students will beBy the end of the course, it is expected that students will beable to:able to:

Model a nanophotonic device or system, both analyticallyModel a nanophotonic device or system, both analytically

and numericallyand numerically Design a nanophotonic device/circuit, including necessaryDesign a nanophotonic device/circuit, including necessary

test structurestest structures Create a mask layout of a nanophotonic circuitCreate a mask layout of a nanophotonic circuit Experimentally test and characterize the fabricated deviceExperimentally test and characterize the fabricated device

Compare theory with experiments and identify sources ofCompare theory with experiments and identify sources oferrorerror Write a report on a nanophotonic deviceWrite a report on a nanophotonic device


16/27

1616

Detailed Course OutlineDetailed Course Outline

Nanophotonic device theory is taught:Nanophotonic device theory is taught: Optical waveguides - wave propagation, slab waveguides,Optical waveguides - wave propagation, slab waveguides,

buried channel waveguides, strip waveguides, analyticburied channel waveguides, strip waveguides, analyticsolutions, 2D effective index method, mode calculations,solutions, 2D effective index method, mode calculations,

Waveguide couplers - coupled-mode theory, coupler lengthWaveguide couplers - coupled-mode theory, coupler lengthcalculations, numerical modelling of couplers.calculations, numerical modelling of couplers.

Resonators Fabry-Perot resonators, ring resonators,Resonators Fabry-Perot resonators, ring resonators,transmission spectrum, resonator quality factor, extinction ratio,transmission spectrum, resonator quality factor, extinction ratio,effect of dispersion, free-spectral range, effect of temperature,effect of dispersion, free-spectral range, effect of temperature,optical losses, ring resonator design, numerical methods foroptical losses, ring resonator design, numerical methods for

cavity modelling.cavity modelling. Mask layout.Mask layout. Photonic crystals, band structures, photonic crystal cavity andPhotonic crystals, band structures, photonic crystal cavity and

wires.wires.


17/27

1717

Detailed Course Outline - ContinuedDetailed Course Outline - Continued

Software design tools will be used for the modelling and designSoftware design tools will be used for the modelling and designof the nanophotonic devices. Tools include numericalof the nanophotonic devices. Tools include numericalmathematical modelling (e.g., Matlab), optical simulation (e.g.,mathematical modelling (e.g., Matlab), optical simulation (e.g.,Finite Difference Time Domain, Beam Propagation Method),Finite Difference Time Domain, Beam Propagation Method),

mask layout (e.g., DW-2000)mask layout (e.g., DW-2000)

Fabrication technology description, design rules, processFabrication technology description, design rules, processdetails.details.

Experimental methodology. Optical fiber coupling, tunableExperimental methodology. Optical fiber coupling, tunablelasers, detectors, polarization maintaining fibers andlasers, detectors, polarization maintaining fibers andpolarization control, spectrum measurements, temperaturepolarization control, spectrum measurements, temperaturecontrol, stabilitycontrol, stability

2010 2011 CMC UBC Silicon Nanophotonics2010 2011 CMC UBC Silicon Nanoph

otonics


18/27

1818

20102011 CMC-UBC Silicon Nanophotonics20102011 CMC-UBC Silicon NanophotonicsFabrication Graduate Course and Workshop -Fabrication Graduate Course and Workshop -

OptionsOptionshttp://www3.cmc.ca/en/training/SiliconNanophotonics.aspxhttp://www3.cmc.ca/en/training/SiliconNanophotonics.aspx

Option 1 Option 2

6-credit graduate course with 3 weeks ofinstruction

One-week workshop

July 5-24, 2010 July 19-24, 2010

$600 fabrication fee $4000 tuition and fabrication fee

(preferred pricing of $1100 for CMCs prototypinglevel subscribers and their students)

Course Registration for UBC EECE 584 No limitation at $4000 level(must be Canadian academic to benefit frompreferred pricing)

Visiting students from specific institutions mayregister for UBC EECE 584 at no cost.

Visiting students are eligible for FinancialAssistance towards travel and accommodationcosts if their supervisor holds a Designer orPrototyping level subscription with CMC.

To obtain a Prototyping level subscription see:http://www.cmc.ca/CMCSubscription/

Prototyping subscribers are also eligible to applyfor financial assistance towards travel and

accommodation costs.

To obtain a prototyping level subscription see:http://www.cmc.ca/CMCSubscription/


19/27

1919

20102011 Course/Workshop Prerequisites and20102011 Course/Workshop Prerequisites andSyllabiSyllabi

Option 1 Option 2

Prerequisites:

Enrolled in a graduate degree program at aCanadian universityLaptop for on-site training

Prerequisites:

Course(s) at the senior undergraduate orgraduate level on optics, waveguides, lasers, etc.- background material is provided ahead of time

Laptop for on-site training

Graduate course syllabus summary:

Theory of optical wave propagation,waveguides, couplers, resonatorsModeling of passive nanophotonic devices(e.g. waveguides, couplers, ring resonators,photonic crystals) using Matlab, LumericalFDTD, RSoft BeamPropMask design and layout using DW2000Design considerations for IMEC SOI process

Workshop syllabus summary:

Modeling of passive nanophotonic devices (e.g.waveguides, couplers, ring resonators, photoniccrystals) using Matlab, Lumerical FDTD, RSoftBeamPropMask design and layout using DW2000Design considerations for IMEC SOI process


20/27

2020

2009 2010 Course Schedule2009 2010 Course Schedule


21/27

2121

2009-2010 Course/Workshop Participation2009-2010 Course/Workshop Participation

23 Participants: 1 Undergraduate, 7 Masters, 10 Doctoral,23 Participants: 1 Undergraduate, 7 Masters, 10 Doctoral,4 Post Doctoral, 1 Industry 10 Universities4 Post Doctoral, 1 Industry 10 Universities

New BrunswickNew Brunswick Ecole Polytech.Ecole Polytech. LavalLaval McGillMcGill

IndustryIndustry McMasterMcMaster Queen'sQueen's Simon FraserSimon Fraser

OttawaOttawa UBCUBC WaterlooWaterloo

IndustryIndustry MastersMasters DoctoralDoctoral Post DocPost Doc UndergradUndergrad


22/27

2222

The 2009-2010 ChipThe 2009-2010 Chip

Chip Layout:Chip Layout: Dimensions: 7 mm XDimensions: 7 mm X

12 mm12 mm Length per device:Length per device:

4mm4mm

940 Input-output940 Input-outputcoupler pairscoupler pairs

25 um coupler pitch25 um coupler pitch

Typical Projects:Typical Projects:

Devices forDevices fortelecommunicationstelecommunications

SensorsSensors Demonstration ofDemonstration of

principles/conceptsprinciples/concepts


23/27

2323

The 2009-2010 Course/Workshop A SuccessThe 2009-2010 Course/Workshop A SuccessStoryStory

89% of attendees would89% of attendees wouldrecommend the course to othersrecommend the course to others

2 technical conference papers2 technical conference papersalready submitted with severalalready submitted with several

more anticipatedmore anticipated

2 published papers (plus other2 published papers (plus otherarticles and presentations) on thearticles and presentations) on the

coursecourse

Highlights:Highlights: Online forumOnline forum Bi-weekly video meetings inBi-weekly video meetings in

the design phasethe design phase Collaborative projectsCollaborative projects

SEM Pictures of SomeSEM Pictures of Some


24/27

2424

SEM Pictures of SomeSEM Pictures of SomeBuilding-Blocks/ComponentsBuilding-Blocks/Components

from the 2009-2010 Course/Workshopfrom the 2009-2010 Course/Workshop

First SubmissionsFirst Submissions from the 2009 2010from the 2009 2010


25/27

2525

First SubmissionsFirst Submissions from the 2009-2010from the 2009-2010Course/Workshop wCourse/Workshop were to theere to the 2010 International2010 International

Conference on Optical MEMS and NanophotonicsConference on Optical MEMS and NanophotonicsW. Shi, R. Vafaei,M. A. Guillen Torres, N. A. F. Jaeger, and L.W. Shi, R. Vafaei,M. A. Guillen Torres, N. A. F. Jaeger, and L.Chrostowski, Ring-Resonator with a Waveguide Crossing.Chrostowski, Ring-Resonator with a Waveguide Crossing.

R. Boeck, N. A. F. Jaeger, and L. Chrostowski, ExperimentalR. Boeck, N. A. F. Jaeger, and L. Chrostowski, ExperimentalDemonstration of the Vernier Effect Using Series CoupledDemonstration of the Vernier Effect Using Series Coupled

Resonators.Resonators.


26/27

2626

Schedule for the 2010-2011 CourseSchedule for the 2010-2011 Course

July: 2 week full-time instruction and tutorials plus attendance atJuly: 2 week full-time instruction and tutorials plus attendance at

the workshopthe workshop August-October: Design and modelling, with on-line & videoAugust-October: Design and modelling, with on-line & video

discussion forumsdiscussion forums

Sept 10th: Deadline - Design proposalSept 10th: Deadline - Design proposal

October 1st: Deadline - Model and design results.October 1st: Deadline - Model and design results. October 15th: Deadline - Draft chip layout (no design rule check)October 15th: Deadline - Draft chip layout (no design rule check)

October 20th: Deadline - Chip layout (with design rule check)October 20th: Deadline - Chip layout (with design rule check)

November 10th: Deadline - Final chip layout (submission to IMEC)November 10th: Deadline - Final chip layout (submission to IMEC)

December 1st: Deadline - Report of Design (design description,December 1st: Deadline - Report of Design (design description,modelling, layout)modelling, layout)

March 1st: Chips available for testing. Training on test equipmentMarch 1st: Chips available for testing. Training on test equipment

June: Deadline - Final Report: test results, comparison with modelJune: Deadline - Final Report: test results, comparison with model


27/27

2727

AcknowledgementsAcknowledgements IMECIMEC

Lumerical Software, Inc.Lumerical Software, Inc.

RSoft Design Group, Inc.RSoft Design Group, Inc.

Design Workshop TechnologiesDesign Workshop Technologies

Dr. Jeffrey Young, UBC Physics DepartmentDr. Jeffrey Young, UBC Physics Department CMC MicrosystemsCMC Microsystems

UBC Electrical and Computer Engineering DepartmentUBC Electrical and Computer Engineering Department

CMC-UBC Graduate Course/Workshop StudentsCMC-UBC Graduate Course/Workshop Students

R. BoeckR. Boeck

S. FlynnS. Flynn

R. VafaeiR. Vafaei

W. ShiW. Shi

nick jaeger 2010

Documents