new product introduction challenges in the bleeding edge...

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New Product Introduction Challenges in the

Bleeding Edge Technology Nodes

Andrzej J. Strojwas

Carnegie Mellon University & PDF Solutions, Inc.

EDS Distinguished Lecturer Mini-Colloquium

"Nanoelectronics - Technology, Design, Modeling"

Rzeszow, June 26, 2019

2

Outline

Layout Design Rule Scaling Crisis

Yield and Reliability Detractors

New Product Introduction

Layout Extraction Engine: FIRE

Product Detective (PD) CV

Direct Probe (DP) CV

Resistance variability Crisis

VarScan Solution

Design-For-Inspection Solution

Conclusions

3

CD Variability and Overlay Crisis

MX Block and Fin Cut Examples

Source: N. Mohanty, TEL, Lithography Workshop, 2016

4

Edge Placement Error (EPE)


5

Yield Loss Due to EPE

EPE is #1 Obstacle for New Node Development


6

EUV: Local CD Non-Uniformity Yield Loss

Sources: Shot Noise (small number of photons) and Photo-chemical Stochastics

Source: H.J. Levinson, GlobalFoundries, June 2018

7

Contacted Gate Pitch Scaling Challenges

Source: P. Hashemi &T.Hook, IBM, 2017 VLSI Short Course

8

Intel’s Hyper-Scaling: Double Single Diffusion Break

Source: https://fuse.wikichip.org/news/525/iedm-2017-isscc-2018-intel-10nm-switching-to-cobalt-

interconnects/4/

9

Outline








VarScan Solution


Conclusions

10

Gate to S/D Spacing: Undetectable from top-view SEM

Source: IEDM-2016, INTC, “A 10nm High Performance and Low-Power COMS Technology

Feature 3rd Generation FinFET Transistor, Self-aligned Quad Patterning Contact over Active

Gate and Cobalt Local Interconnects”

Red circle: if there

is electrical

leakage path, it

can’t be detected

by high resolution

in-line SEM

11

Cut masks: Metal Gate Cut Mask

Source: http://www.msscorps.com/archive/10%20nm%20technology%20node.pdf

Possible Parametric Failure

due to Vt shift

tsmc/10nm SEC/10nm

12

Via Chamfering

Overlay Marginality

Source: S.S. Devender, US Patent, 2017

13

BEOL Reliability Concern

Via- Metal Overlay Error Causing Low k Dielectric Reliability Hazard

good *

V1

M2

M1 M1

“ 100M Via Chip failure would be about 240 DPPM if the standard

deviations (σ's) of nth via (VIAn) and nth metal (Mn) layer critical

dimensions (CDs) are controlled at 2.0nm and 1.4nm, respectively,

and the VIAn-to-Mn alignment σ is as tight as 2.3nm”

Source: J. Chen, NVIDIA, SPIE August 2012

14

Outline








VarScan Solution


Conclusions

15

Fabs transition from 1-3 large customers running high volume products to

many customers running multiple smaller volume products. This results

in:

Great increase in resources required for process changes as each product

requiring its own separate qualification Excessive resources and time to release to manufacturing

Much reduced capability to monitor production, resulting in greater

exposure to tool mismatches and drifts

Increased strain on Engineering Resources for New Product Introductions,

and consequently increased risk of increased time to yield entitlement


16

Rather than learning using products only, use a comprehensive set of test

structures that contain all product-specific and generic technology

characterization structures to fully characterize what is or will be

manufactured to:

Accelerate and reduce cost of Qualification of Process Changes Simplify process change Introduction by using a test structure

Improve Production Monitoring Characterization content on test structures allows early and accurate identification of deviation/risk tools

Increased variation can be broken down by device width, length, Vt, Implant, layout affects

De-risk NPI Scanning new products to identify layout constructs not covered by TVV, if any, to highlight risk areas.

Coverage of such risk areas, if identified, in ScribeCV for early readout and faster diagnosis of issues.

Allows cost-efficient sustaining of technology

Use IP and product level extraction and profiling to define Constructs, Devices, HoL, multi-layer, sub-DR structures to quantify process change impact on products,

process-windows, and module/tool control specs

Block definition and associated DoE necessary and sufficient

Platform Based Learning

17

Critical/High-Risk Patterns include

GRV & DR Validation

Sub-DR (Canary)

Critical Patterns

Critical devices & attribute

High Risk Pattern Asses:

Critical pattern extractions

Device profiling

Multilayer high risk patterns

Litho/etch marginal layouts

Test Structure Generation and Use Profile

Test Structure Blocks and DoE

Key Process window and HoL checks

Critical GR, Constructs,

Device Config

PCRB Requirements and IP blocks

Design Manuals

Product Layouts

IP Blocks

Extraction &

Layout Profiling

Critical and High-Risk Patterns

Use cases

• Process change qual

• Process monitoring

• NPI

New Product

• Check product profiling

• Determine TVV coverage – Green/Red

• Options: DPCV

Updates

• Update with Technology variant or new product class

• Product specific Scribe

18

Layout Profiling Flow Using PDF FIRE System:

Design Space Analysis: • GRV & DR Validation

• Sub-DR (Canary)

• Critical Patterns

• Critical devices & attributes

Inputs Outputs

1. Inputs from INT, CFM,

PWQs, Yield, Litho & other

Modules, WAT, Product

2. MAS/ORC+ assessments

3. PDF CV‘s & KB

1. Known Risky Patterns

2. Failrate Assessment

3. DSD (p-value)

4. Low margin layouts/patterns

5. High risk device

configurations (variability &

performance)

Critical Area Assessment:

• Acp Extractions (line/space)

• Via/Hole count extractions

• Critical run length (ppkm)

1. Product GDS-in

2. Design finished GDS/Oasis

3. DSD (p-value)

4. Defect Density / Failrates

1. Yr - Random defectivity

assessment per layer

2. Opens/Shorts yield impact

3. Via/Hole failrate yield impact

4. Critical run length yield

5. Pattern density (layer)

High Risk Pattern Asses:

• Critical pattern extractions

• Device profiling

• Multilayer high risk patterns

• Litho/etch marginal layouts

Functional & Parametric

Profiling and Coverage

Assessment

1. Product GDS-in

2. Design finshed GDS/Oasis

3. Stdcells

4. SRAM BCK‘s

5. Design space analysis

1. High risk pattern yield

impact assessment

2. Device variability &

performance assessment

3. Multi-layer high risk pattern

yield impact assessment

(Via Chamfer, Island &

Stack voids, CA/CB, etc;)

4. XY inspection coordinates

5. PDK/Model/MAS updates

FIRE

FIRE

19

PDF FIRE Layout Profiling Engine used to extract critical patterns on existing products and IPs – statistics generated for all unique and risk patterns

Risk patterns based on MRA (Manufacturing Risk Assessment)

Full Design Space Decomposition leads to basis set of test structure layouts and associated DoE, or restricted use rules for certain risk layouts

Critical layouts are generated into test DUTs, with multiple replicates and variants per die

Massively parallel testing allows all structures on all shots to be measured

Product and IP Profiling:

Identify Critical Layout Patterns and Design Space Usage

Extract Critical Layout

Patterns by product/IP

Design Massively

Parallel Test

Structures for high

resolution test,

including below DR

margin structures

Massively Parallel

Test with Integrated

Analysis Capability

Digital heavy product

Analog heavy product

20

Product Detective (PD) CV Risk Assessment

Within Die Variability and Soft Leakage

PDCV assesses: Within die MA process window overlay improvement and control

Leakage tails with within spec misalignment candidates for stress test (e.g. HVS) for screening

21

Application of PDCV for Product Risk Assessment

All pattern are similar

Black: In library

Red: New pattern

Check for “loose match”

new pattern

Check for “tight match”

new pattern

Index of pattern (sorted by difference)

60% of “new” pattern

have tight match to

library.

30% of new patterns

have loose match to

library. Check with

inline inspection.

Remaining 10% of

patterns do not match

the library. Add to

scribeline/DPCV and

future CVi/DFI libraries.

Extraction and

classification of patterns

against CV results key to

1st time right, avoiding

reliability/qual issues

CV+FIRE provides ability

to map yield and quality

loss metrics for tapeouts,

drives Inspection, PWQ,

DfM actions

S2S gap, variation

analysis on PDCV over

constructs allows for

opportunistic corner-

tightening and electrical

scaling

PDCV compliant designs –

all characterized patterns

– provide 1st time right and

avoid quality issues

Diffe

ren

ce

fro

m L

ibra

ry

sm

all

big

22

Direct Probe (DP) CV® Transistor Characterization

PDF Solution’s

Direct Probe CV®

Design + DOE

-10%

0%

10%

20%

30%

40%

50%

1

17

33

49

65

81

97

11

3

12

9

14

51

61

17

7

19

32

09

22

5

24

1

25

7

27

3

28

9

30

5

32

1

33

73

53

36

9

38

5

40

1

41

74

33

44

9

46

54

81

49

7

51

3

52

9

54

5

56

1

57

7

59

3

60

96

25

64

1

65

7

Idsat

S2S

Gap

(%, (S

ilic

on

-SP

ICE

)/S

PIC

E)

SPICE_TT

Ver. 1

Ver. 2

ref. Transistor x%

Use Existing FEOL Silicon in-situ

- Exact match to process and layout

Modify only Contact through M1

- Access 100 transistor/mm2

- Millions of devices per wafer measured

Probe at M1: Fast Silicon TAT; Fast Test

- Full Parametric DC I/V Sweeps

- Si2Spice” (hardware vs model)

- Identify high Iddq leakage outliers

- 1-2 week per learning cycle

Conventional

Approach

Modified (new) MOL to M1

Masks

Original FEOL Masks + Silicon

Unused Mx,Vx Masks

Broad layout style sampling

Statistical/Variability Data

Product …

Manual Micro-probing

DP CV Approach

http://images.anandtech.com/doci/8562/APL1011_TMET05_166628_Poly_blog_blocks.png

23

pdFasTest® and DP® CV Massively Parallel Test: Enabling Full Statistical Sampling

1 1 15

300

880.5

794.6

60.1

3.9

6640

5976

6972

8800

0

1000

2000

3000

4000

5000

6000

7000

8000

9000

10000

0

100

200

300

400

500

600

700

800

900

1000

Conventional1x22

Conventional2x24

Conventional1X100

DPCV1.0

To

tal C

ou

nts

of

DU

Ts

To

tal Testi

ng

Tim

e (

Ho

ur)

S

peed

Im

pro

vem

en

t (X

)

Throughput TestTime Transistor• pdFasTest with DPCV results in test

times of a few hours for full wafer,

all die, all DUTtest

• Conventional parametric tester

incapable of matching the test times

for the layout density of DPCV –

presently at 110DUTs/mm^2

DPCV® +

pdFasTest® F-180 (256 channels)

~3 Million devices parametric tested per wafer in less than 5 hours allowing for full wafer, all die, all DUT testing for full characterization across-reticle and across-wafer

Data: assuming SOC chip of 100mm2, 330 Dies per wafer are

tested and all 8800 transistor in DP CV per reticle are tested.

Weeks

Hours

Days

24

Outliers: devices that fall outside any reasonable model expectation Centering, variability

Usually at ppm level, difficult/impossible to detect with typical PCM and sampling

DPCV identifies layout configurations prone to outliers

Direct Probe CV: Variability and Outliers Identification

Each data point corresponds to one DUT from one Die

NMOS PMOS

Model

IDS

at

Me

asu

red

in

Si

Strong layout dependent signatures

25

Outline








VarScan Solution


Conclusions

26

Resistance Variability Sources

“Design and process technology co-optimization with

SADP BEOL in sub-10nm SRAM bit cell”, 2015 IEEE

International Electron Devices Meeting

(http://semimd.com/chipworks/)

http://www.techinsights.com/technology-

intelligence/overview/latest-reports/tsmc-10-nm-process/

•MOL interface

Single Diffusion Break

Double Diffusion Break

•Transistor

Isolation

SRAM BL/VDD/VSS

contact

Various OPC/BEOL

process

•Layout vs. Process

Trade-off

VLSI-2018

•BEOL

New Material

New Integration

SADP+Cut-mask

LE-LE-LE

Reverse engineering from Technology insight




27

Challenge in In-line Electrical Detection

0

2

4

6

8

10

12

14

16

18

20

0 20 40 60 80 100 120 140 160

No

rma

lize

d R

es

ista

nc

e (

Arb

ita

ry U

nit

)

Radius (mm)

9.25 8.95 9.30 8.98 8.42 9.00

8.88 8.51 9.26 8.88 9.25 9.27 8.85 8.89 9.25 9.13 9.06 8.88 8.94 9.20 9.61 8.89 8.55 9.44

8.97 9.13 9.43 9.71 9.42 9.14 9.24 9.87 9.46 9.33 9.58 9.49 9.50 9.83 9.70 9.06 8.85 8.76 9.21 9.25 9.18 9.32 8.60 9.22

8.86 8.70 9.02 9.53 9.56 9.69 9.66 9.63 9.95 9.20 9.33 9.98 10.04 9.73 9.66 9.57 9.23 9.63 9.69 9.28 9.32 8.62 9.68 9.45 9.19 9.26 9.24 8.72

8.81 9.55 9.42 9.64 10.04 9.66 9.54 9.46 9.99 9.62 9.23 10.10 9.47 9.68 10.38 9.72 10.03 9.42 9.28 10.39 10.13 9.35 9.88 10.02 9.50 9.40 9.53 9.38 9.42 9.40 8.80 8.88

8.53 8.95 9.67 9.69 9.76 10.32 10.26 9.68 10.69 9.81 10.19 10.13 10.40 9.67 9.39 10.31 10.43 10.21 10.29 10.25 10.17 9.87 10.28 9.92 9.74 9.99 10.00 10.02 9.95 9.64 9.59 9.60 8.99 9.61 8.48 8.81

8.92 8.87 9.54 9.51 9.71 9.63 9.82 10.20 10.58 10.36 9.70 9.86 10.27 10.68 10.37 10.12 10.15 10.39 10.88 9.89 9.82 10.11 9.98 10.28 10.58 10.28 9.81 9.58 10.41 57.75 9.96 9.99 9.79 9.72 9.10 9.25 8.72 8.89

9.12 8.90 9.17 9.27 10.06 9.85 9.63 9.86 10.28 9.83 9.99 10.03 10.25 9.98 10.53 10.36 10.03 9.91 10.22 10.19 10.25 10.33 9.94 10.20 10.37 10.34 10.02 10.13 10.54 10.00 9.99 10.31 9.88 10.32 9.42 9.68 9.58 8.65 9.15 9.21

8.84 9.44 9.47 9.63 10.02 9.64 10.05 10.03 10.23 9.93 10.54 10.19 10.08 10.63 10.62 10.18 9.83 10.34 10.02 10.58 10.57 10.37 10.16 10.07 10.09 10.65 9.87 10.60 10.04 10.47 10.56 10.14 10.25 10.22 9.94 10.04 10.13 9.73 9.38 9.29 9.23 8.96 9.15 8.82

9.28 9.71 9.51 9.32 9.20 9.90 9.73 10.28 10.42 9.71 10.08 10.42 10.43 10.67 10.10 10.16 10.32 10.05 10.91 10.62 10.10 10.16 10.19 10.39 10.24 10.55 10.39 10.35 10.33 10.12 10.74 10.42 10.11 10.42 10.18 10.19 10.72 10.03 10.12 9.94 9.17 9.75 9.30 9.21 9.02 8.36

8.92 9.44 8.83 9.96 9.70 10.09 10.24 10.09 10.46 10.25 10.35 10.41 10.25 10.35 10.52 10.27 10.19 10.20 10.27 10.61 10.67 9.61 10.48 10.43 9.90 9.78 10.21 10.36 10.54 10.30 10.03 10.62 9.98 10.58 10.63 10.84 10.22 10.18 10.19 10.50 9.85 10.50 9.58 9.44 8.90 9.24 8.92 8.48

8.69 9.44 9.51 9.59 9.55 9.91 10.17 10.34 10.49 10.54 10.55 10.11 10.83 9.86 10.07 10.15 9.93 10.01 9.70 9.92 10.54 10.02 10.41 10.36 10.06 10.11 9.93 10.26 9.92 9.56 10.33 10.77 10.51 10.39 10.63 9.45 11.04 10.51 10.56 10.07 10.88 9.84 10.07 10.24 9.77 9.64 9.42 9.11 9.38 8.64

9.26 9.05 9.44 9.81 10.22 9.88 10.14 10.67 10.33 9.88 10.34 10.10 10.01 10.23 9.55 10.45 10.72 10.87 10.13 9.48 9.52 9.93 9.69 9.58 9.65 10.40 10.75 9.78 9.75 9.86 11.07 10.00 9.77 10.44 10.71 10.73 10.24 10.03 10.24 10.51 10.45 10.75 10.74 9.99 10.07 9.04 9.22 9.86 9.00 8.59

9.30 9.24 9.61 9.93 9.83 9.90 10.50 10.44 10.60 10.19 10.35 10.12 10.43 10.65 10.49 9.77 10.39 9.50 10.08 10.04 10.49 10.09 10.77 9.56 10.09 9.90 9.97 9.91 9.89 10.12 10.01 10.15 10.13 9.91 10.06 9.76 10.18 9.50 10.74 10.58 9.88 10.51 10.43 10.53 10.18 10.17 9.79 9.22 9.64 8.90 9.08 9.17

9.50 9.50 9.56 9.80 10.00 10.43 10.04 10.27 10.39 10.23 10.38 9.92 10.08 10.13 10.05 9.75 9.75 10.03 9.69 10.08 9.29 9.91 9.85 9.86 9.93 9.43 9.82 9.57 9.40 9.51 9.49 9.14 9.67 9.80 9.77 9.95 9.49 10.31 9.61 10.35 10.05 9.98 10.36 10.55 10.36 10.16 9.91 10.23 9.96 9.91 9.75 9.32 9.23 8.51

9.14 9.38 9.44 9.40 9.53 10.01 10.18 10.09 9.70 9.58 9.90 10.07 10.38 10.32 9.61 9.96 10.36 9.77 9.55 9.54 9.80 9.76 32.51 9.84 9.03 9.07 9.47 9.67 10.21 9.19 9.98 10.17 9.52 9.30 9.68 9.57 10.12 9.80 10.36 9.63 10.42 10.39 10.08 10.72 9.89 10.43 10.50 10.30 10.24 9.89 9.61 9.82 9.56 9.27 8.99 8.75

9.41 9.48 9.89 9.75 9.91 9.41 10.30 10.70 10.40 10.39 9.81 9.65 10.31 9.69 10.44 10.20 9.89 9.72 9.62 9.60 10.23 9.52 9.07 8.85 9.39 9.29 9.47 8.98 9.52 9.32 9.40 9.14 9.22 9.92 9.39 9.12 8.97 9.45 9.56 9.81 9.80 10.09 9.74 10.28 9.81 10.55 10.27 10.31 9.83 9.81 9.75 9.72 9.47 9.62 8.95 9.17

9.46 9.56 9.27 9.92 10.14 10.28 10.88 10.37 9.94 10.62 10.45 10.27 10.06 10.11 10.25 9.97 9.88 9.52 9.16 10.03 9.66 9.46 8.98 9.72 9.21 8.99 9.22 8.97 8.63 9.63 9.07 8.60 9.38 9.23 9.40 9.56 9.85 9.50 9.50 10.04 9.42 10.02 10.15 10.58 9.94 10.54 10.31 10.85 10.87 10.22 10.07 9.73 9.64 9.58 9.33 9.11 8.64 8.77

9.44 9.72 10.22 10.06 10.06 9.90 10.75 10.04 10.45 10.37 10.29 9.80 10.42 10.03 9.36 10.08 10.00 9.70 9.42 9.48 9.38 9.46 9.34 9.56 8.84 9.16 9.35 9.30 9.16 9.07 8.78 8.64 9.70 9.13 9.55 9.46 9.09 9.37 9.61 9.57 9.43 9.53 9.88 10.01 10.45 10.09 9.97 10.14 10.14 10.45 9.64 10.48 9.61 10.07 10.00 9.27 9.32 8.49

9.25 9.11 9.69 9.90 9.45 10.83 9.21 9.76 11.00 10.23 10.20 10.74 10.36 9.98 9.92 9.66 9.94 9.52 9.90 9.08 8.70 8.83 8.75 8.73 9.06 9.02 8.82 8.76 8.84 9.33 8.86 9.01 8.82 9.14 9.22 9.15 9.23 9.13 9.48 9.10 9.57 9.52 9.90 9.83 9.41 10.28 10.30 10.25 10.04 9.91 10.33 10.31 10.45 9.91 9.71 9.69 9.66 9.05 9.08 8.62

8.71 9.51 10.09 10.30 10.65 10.01 10.29 10.23 10.64 10.17 9.72 10.23 9.95 9.89 10.05 9.51 9.39 9.23 9.36 9.79 9.17 8.74 8.70 8.93 9.16 9.13 8.86 9.39 9.17 9.56 9.06 9.30 9.09 9.69 9.05 9.18 9.64 8.68 9.38 9.04 8.95 9.40 9.68 9.23 9.58 9.59 10.52 10.06 10.41 10.31 10.69 9.78 10.33 9.79 10.07 9.77 9.67 9.10 8.88 8.56

9.21 9.27 9.32 9.66 10.02 9.94 10.81 10.56 10.24 10.01 10.14 10.25 9.76 9.93 9.28 9.11 9.25 9.13 9.20 9.24 9.72 8.69 9.47 9.03 8.86 8.76 9.47 9.10 8.95 9.06 8.93 8.50 9.51 9.38 9.29 8.87 8.77 8.79 8.83 8.89 9.72 9.26 9.35 9.85 9.66 9.91 10.01 9.85 9.88 10.32 10.88 9.94 9.93 9.99 10.36 10.17 9.85 9.81 9.45 9.54 9.22 9.05

9.62 9.95 9.53 9.73 9.55 9.78 10.49 9.69 9.65 10.12 10.34 9.82 10.02 9.69 9.48 9.35 9.56 9.70 8.74 9.43 9.26 9.20 9.79 9.36 9.10 8.83 9.11 9.44 9.47 8.91 8.80 8.78 9.03 9.17 9.07 9.35 15.98 9.45 8.89 9.11 9.15 9.05 9.09 9.48 9.31 9.60 9.75 10.35 9.98 10.73 10.12 10.26 10.32 10.44 10.62 9.92 9.68 10.11 9.37 8.54 9.05 9.15

9.14 9.89 9.56 10.12 9.98 10.31 10.53 10.43 9.98 10.02 10.29 10.17 10.05 9.70 9.62 9.45 8.84 9.82 8.91 9.12 8.95 9.11 9.05 8.54 8.91 9.32 9.08 9.57 9.01 9.40 9.11 9.14 9.42 9.01 9.31 9.22 8.71 9.01 9.53 9.16 8.97 8.97 9.10 8.94 9.32 8.99 9.48 9.93 10.18 9.90 10.33 9.95 10.30 10.17 10.45 9.93 9.61 10.21 9.33 9.61 9.10 8.76

9.22 9.04 9.20 9.64 10.18 9.93 10.63 10.38 10.50 10.80 10.80 10.37 10.27 9.72 9.94 9.30 9.64 9.26 9.18 8.40 9.13 9.17 9.25 9.02 9.14 9.37 9.13 9.12 9.50 9.39 9.92 9.11 9.88 9.66 8.96 8.88 9.59 9.25 8.99 9.15 8.82 8.66 9.29 8.94 9.23 9.10 9.48 9.50 9.63 10.08 10.38 10.56 11.02 9.70 10.43 10.18 9.85 10.17 9.67 9.97 9.44 8.94 9.29 8.72

9.04 9.36 9.84 9.83 10.37 10.11 10.30 10.29 10.90 10.39 10.34 10.10 9.53 9.78 9.52 10.01 9.10 9.48 9.32 9.51 9.05 9.67 8.85 8.69 9.16 9.06 8.85 9.54 10.30 9.35 9.55 9.35 9.04 10.03 9.43 8.97 9.12 9.03 9.43 9.14 8.73 9.08 8.83 9.43 9.05 9.44 9.41 9.74 9.78 9.65 10.32 10.29 10.10 10.56 10.86 9.92 10.42 10.26 9.62 10.26 9.69 9.53 8.82 8.85

8.96 10.14 9.86 9.64 10.08 10.40 10.27 9.79 10.37 10.27 10.24 9.82 9.74 9.73 9.83 9.95 9.54 9.42 9.34 9.59 8.80 8.78 9.44 9.46 9.28 9.52 10.15 9.15 9.62 9.69 10.10 10.00 10.05 10.01 10.14 9.67 9.86 9.49 9.33 8.99 8.59 8.65 9.11 8.90 9.06 9.13 9.54 9.36 9.62 10.27 10.05 10.09 9.84 10.02 10.50 10.30 10.13 9.88 9.90 9.91 9.85 9.35 8.70 8.89

9.55 9.90 9.75 9.46 10.08 9.93 10.04 10.06 9.99 10.06 10.12 9.80 9.23 10.04 10.04 9.48 9.44 9.10 9.20 8.72 8.60 9.43 9.36 9.02 9.50 9.77 9.56 9.85 10.15 10.06 10.32 10.57 9.76 9.56 10.15 9.97 9.50 9.32 9.62 9.14 9.08 8.98 9.29 9.21 8.94 8.98 9.45 9.50 9.56 9.82 9.78 9.62 10.54 9.83 10.32 10.22 10.29 10.29 9.84 10.01 9.48 9.31 9.26 8.92

9.49 9.48 9.71 9.58 10.20 10.09 10.58 10.31 10.30 10.10 10.12 10.25 9.33 9.32 9.60 9.81 8.68 9.30 9.25 9.11 9.05 9.56 9.62 8.86 9.24 9.34 9.57 10.13 10.36 9.68 10.30 10.11 10.89 9.81 10.22 10.26 10.07 9.71 9.04 9.64 9.53 9.29 8.83 8.69 8.89 8.86 9.57 9.13 9.73 9.65 9.84 9.54 10.06 10.47 10.15 9.92 10.96 9.82 10.26 10.08 10.04 9.31 8.89 8.28

8.67 9.78 10.26 9.94 9.50 10.19 9.96 10.69 10.05 10.59 10.00 10.26 9.75 9.57 8.95 9.51 8.80 53.26 8.80 9.11 8.63 9.01 9.10 9.15 8.92 9.63 9.83 10.31 10.43 10.37 10.37 10.25 10.71 9.91 9.88 10.55 9.66 9.80 9.96 9.61 9.41 9.27 8.99 8.64 8.85 9.33 8.98 9.27 9.73 9.52 9.50 9.60 9.89 9.95 9.90 9.60 10.30 9.85 10.40 9.65 9.90 9.43 9.30 8.56

9.04 9.03 9.02 10.06 10.04 10.11 10.50 10.31 10.58 10.17 10.49 10.58 10.56 10.06 9.78 9.70 9.39 8.63 9.20 9.16 9.01 9.07 9.33 9.52 9.94 9.43 10.26 10.12 9.87 10.08 10.15 10.62 10.49 10.83 10.68 10.50 10.21 10.16 9.97 9.83 9.79 8.86 9.00 8.82 9.21 9.30 9.06 9.05 9.13 9.44 9.80 9.20 10.12 10.45 10.31 10.51 10.96 10.76 9.97 10.24 9.78 10.03 9.85 9.36 9.25 8.66

9.10 9.41 9.74 9.93 10.23 10.19 9.62 9.66 10.60 10.03 9.88 10.00 10.40 9.99 9.90 9.61 9.08 9.42 9.25 8.85 9.46 9.06 9.32 9.54 9.91 9.51 9.67 9.72 10.29 10.33 10.18 10.25 10.76 10.20 10.86 9.87 10.40 10.12 9.86 9.95 9.14 9.50 8.99 9.07 8.79 8.89 9.03 9.02 9.27 9.18 9.73 10.18 10.20 10.83 10.07 9.94 10.25 10.19 10.24 9.69 10.27 9.78 9.77 9.70 9.11 9.36

9.37 8.56 9.74 9.74 9.54 9.93 10.49 10.43 10.29 10.13 10.36 9.69 9.88 9.98 9.72 9.16 9.13 9.48 9.00 9.50 8.65 9.48 9.43 9.84 9.40 9.97 10.02 9.70 10.64 10.05 10.34 10.01 9.42 10.45 10.03 10.16 10.98 10.44 9.96 10.11 9.72 9.07 9.64 9.06 9.09 8.64 9.31 8.72 8.93 41.06 9.43 9.65 10.18 10.30 10.47 10.27 9.86 10.19 9.65 10.30 9.86 9.76 9.18 9.35 8.93 8.31

9.71 9.32 9.81 10.08 9.27 10.00 10.38 10.64 10.45 10.42 10.06 10.24 10.45 9.42 9.91 9.33 9.40 9.21 9.52 8.83 8.95 8.81 34.92 9.25 9.41 9.74 10.05 10.08 9.83 10.57 10.38 10.18 10.18 10.47 10.21 10.31 10.15 10.41 10.36 9.92 9.51 9.28 9.11 9.17 9.05 8.45 9.07 9.58 9.34 9.58 9.30 9.90 9.92 10.09 10.41 10.66 10.33 10.65 9.57 10.31 9.41 9.63 9.62 9.28 9.02 8.95

8.79 9.28 9.40 9.47 9.88 10.05 10.35 10.09 10.31 10.30 10.47 10.03 10.12 9.38 9.61 9.03 8.75 8.80 9.30 9.42 9.05 8.86 8.81 9.07 9.95 9.60 9.31 10.31 9.78 9.94 10.13 9.88 10.31 10.08 10.55 10.50 10.55 9.74 9.60 9.51 9.72 9.36 9.39 9.34 8.86 9.26 9.11 9.27 9.17 9.31 9.70 10.17 9.37 9.96 10.47 9.99 9.71 10.63 10.22 10.09 9.53 10.21 9.87 9.07 8.98 8.70

9.55 9.23 9.15 10.25 9.86 10.87 10.08 10.49 10.17 9.98 10.16 10.00 9.53 9.64 9.31 9.74 9.09 8.98 9.24 9.30 9.37 8.96 9.70 9.28 9.78 9.84 9.88 9.77 10.05 10.63 9.95 11.04 10.62 10.32 10.28 10.23 10.00 10.01 9.47 9.33 8.70 9.08 9.06 9.40 9.55 9.93 9.46 9.81 9.38 9.39 10.08 9.89 9.69 10.33 10.26 10.06 10.47 9.75 10.03 10.30 9.43 9.37 9.42 8.86

8.83 9.41 9.74 10.07 9.94 10.41 10.31 10.68 10.66 10.10 10.02 9.99 10.26 9.30 8.95 9.68 9.46 9.38 9.49 8.84 9.44 9.28 9.42 9.40 9.66 9.86 9.56 9.90 9.91 10.18 10.23 10.57 10.70 10.15 10.46 9.85 9.79 10.29 9.36 9.82 9.60 9.06 9.02 8.79 9.03 8.95 9.06 9.48 8.94 9.71 9.41 10.43 9.58 9.79 10.24 9.90 10.70 9.96 9.93 9.64 9.57 9.76 8.80 8.41

9.26 9.58 8.97 10.06 10.18 9.49 9.72 10.21 10.04 10.25 10.33 9.75 10.08 9.45 9.27 9.02 9.31 9.49 8.71 9.05 9.21 8.70 9.08 9.04 9.80 9.68 10.32 9.77 9.91 9.74 10.18 10.19 10.28 10.26 9.40 10.18 10.09 9.65 9.19 9.56 9.59 9.33 8.74 8.41 9.35 8.92 9.45 9.48 9.88 10.37 10.16 10.59 9.65 10.06 10.71 10.43 10.08 10.00 9.72 9.80 9.93 8.80 8.87 8.85

8.60 9.38 9.75 9.88 9.89 10.60 10.48 10.04 10.13 9.74 10.08 10.24 9.73 9.67 9.59 9.17 9.07 9.75 9.32 9.35 8.15 9.37 9.14 9.58 9.47 9.69 9.51 9.69 9.62 10.01 9.90 9.70 10.37 9.40 9.63 9.99 10.21 8.98 9.37 9.82 9.28 8.65 9.49 8.58 9.00 9.31 9.31 9.41 9.56 10.03 10.04 10.01 9.79 10.70 10.28 9.78 10.05 10.40 10.19 9.87 9.90 9.17 8.79 8.93

8.97 8.98 9.69 10.40 10.19 10.30 10.07 10.64 10.41 9.84 10.60 9.91 9.89 10.29 9.49 9.36 9.72 9.15 9.12 8.78 9.32 8.81 8.67 9.00 8.96 8.73 9.31 9.84 9.60 9.53 9.98 9.73 9.74 9.99 9.89 9.23 9.37 9.36 9.22 9.15 9.08 8.65 9.02 8.65 9.24 9.21 9.05 9.58 9.82 10.07 10.29 9.48 10.35 10.27 10.52 10.72 10.53 9.75 9.79 9.89 9.62 9.70 8.88 8.58

9.04 8.85 8.80 9.57 10.42 9.92 10.01 10.23 10.56 9.81 10.82 9.93 9.83 10.17 9.93 9.40 9.09 9.10 8.97 9.13 9.13 8.95 9.20 8.69 8.96 8.60 9.16 9.55 9.93 9.42 9.74 9.23 9.69 9.75 9.65 9.55 8.89 9.65 9.44 9.96 9.28 9.20 8.98 9.26 9.47 9.23 9.62 9.01 9.81 10.11 10.19 10.45 10.82 10.25 10.10 10.39 10.34 10.24 10.01 9.45 9.10 8.88 9.05 9.38

8.78 8.64 9.61 10.00 10.26 9.84 10.10 10.67 10.82 10.38 9.71 9.99 10.16 9.58 9.34 9.66 9.70 9.66 8.95 8.67 9.31 9.01 8.88 9.30 9.12 8.87 9.53 8.83 8.98 9.17 9.07 9.02 9.45 9.00 9.18 9.28 9.50 8.77 9.22 9.09 9.07 8.91 9.54 8.94 9.26 10.15 10.04 9.47 9.67 10.30 10.00 10.22 10.13 10.33 9.47 9.73 10.31 9.72 9.61 9.00 9.02 9.32

9.48 9.54 9.68 9.75 9.36 10.17 9.72 10.23 10.35 10.12 10.27 10.48 10.32 9.91 9.72 9.16 9.37 9.62 9.15 8.89 9.43 9.02 9.28 9.11 9.28 9.68 8.28 8.94 9.21 9.08 8.72 9.20 8.87 8.88 9.38 9.15 8.98 9.36 8.51 8.83 9.54 9.50 9.12 8.98 9.36 9.55 10.09 9.46 10.04 10.33 9.66 10.23 10.62 10.51 10.61 9.76 10.31 9.34 9.53 9.41 9.21 8.92

9.17 9.29 9.94 9.37 10.22 10.03 10.42 10.79 9.88 10.11 10.18 10.46 9.82 10.31 9.63 9.66 9.87 9.29 9.49 8.93 9.17 8.58 9.13 8.93 8.72 9.20 9.08 8.90 8.92 8.95 9.23 8.77 8.91 8.55 9.60 9.18 9.50 8.93 9.10 8.88 9.23 9.59 9.10 9.53 8.98 10.67 9.82 9.83 10.38 10.05 9.88 10.43 10.60 10.53 10.78 10.25 9.71 9.66 8.95 9.23 8.93 8.82

8.98 9.40 9.48 10.22 10.35 10.20 10.58 10.63 10.36 10.58 10.30 10.43 9.80 9.66 9.70 9.73 9.39 9.22 9.33 9.19 8.63 9.32 8.98 8.87 9.37 8.92 8.85 8.77 9.15 9.13 8.90 9.16 8.90 8.98 8.74 9.09 9.31 9.93 9.70 9.19 9.09 9.62 9.89 9.41 9.42 9.91 10.61 9.79 10.90 10.66 10.37 9.80 10.25 9.93 9.54 9.69 9.43 9.28 9.24 8.60

8.04 9.37 9.44 10.11 9.58 10.55 10.18 10.45 10.13 10.87 9.84 10.17 10.15 10.57 10.02 9.57 9.56 9.94 9.13 8.76 9.28 9.36 9.04 9.22 8.96 9.18 8.81 8.67 9.55 8.91 8.92 9.46 9.27 9.31 9.11 9.07 9.46 9.24 8.91 9.07 9.98 9.88 10.07 10.16 10.25 9.84 10.07 10.18 10.50 10.57 10.11 10.34 10.05 9.93 9.78 9.61 9.81 9.11 9.47 9.06

8.95 9.48 9.64 10.56 10.26 10.35 10.98 9.99 10.17 10.24 10.51 10.54 10.02 9.99 9.63 9.78 9.79 9.44 9.29 8.99 8.49 9.41 9.24 9.31 8.93 8.85 9.16 8.81 8.51 9.07 9.48 9.12 9.34 8.56 8.99 9.41 9.63 9.67 9.19 9.62 10.24 9.95 10.60 9.52 10.32 10.01 10.05 10.01 10.63 10.24 10.25 10.03 9.83 10.25 9.06 9.41 9.05 8.71

9.38 9.13 9.68 9.55 10.16 10.35 10.39 10.56 10.47 10.39 10.23 10.07 10.27 10.37 10.28 9.83 9.81 10.31 9.37 9.24 9.01 8.90 9.34 9.64 9.27 9.22 9.51 8.75 9.32 9.14 9.54 45.95 8.85 9.24 8.68 9.80 9.46 9.87 9.38 9.81 10.16 10.01 9.91 10.48 10.63 9.99 10.68 10.27 10.39 10.54 10.33 9.99 9.98 9.80 9.52 9.48 9.20 8.65

9.50 9.03 9.26 9.43 10.29 9.82 10.50 10.51 10.17 10.05 10.04 9.98 10.48 10.32 9.88 9.56 9.31 10.29 9.45 9.82 9.79 9.25 9.53 9.24 9.31 9.57 9.75 9.27 9.29 9.38 9.31 9.43 8.81 9.48 9.48 9.20 9.57 9.94 9.34 9.73 9.66 10.03 10.68 10.47 10.25 10.66 9.94 10.78 10.23 9.69 10.04 9.55 9.95 9.15 9.48 8.66

9.11 9.53 9.06 9.69 10.24 10.13 10.22 10.24 10.29 9.98 10.57 10.26 10.50 9.52 10.55 10.48 9.88 9.76 9.97 9.82 9.67 9.41 9.57 9.41 9.23 9.15 9.47 9.57 9.70 10.11 10.02 9.79 11.68 9.90 9.89 9.74 10.17 10.18 9.93 9.82 10.14 10.77 10.61 10.25 10.45 10.43 10.59 10.18 10.45 10.18 9.98 9.73 9.77 9.30 8.85 8.72

9.17 8.92 9.31 9.95 9.95 10.60 10.01 10.38 10.79 10.63 10.70 10.42 10.14 10.17 10.17 10.26 10.44 10.19 10.04 9.82 9.64 9.76 10.04 9.59 9.96 9.77 9.91 9.96 9.74 9.25 9.87 9.75 9.99 9.89 9.67 9.60 10.31 10.40 10.58 10.15 10.32 10.60 10.28 10.16 10.22 9.79 9.31 10.30 9.94 9.45 9.39 8.64 9.15 9.04

8.98 9.65 9.64 9.60 10.11 9.33 9.81 10.29 9.97 10.38 10.14 10.56 10.39 9.63 10.43 10.12 10.38 9.95 10.20 9.83 10.10 9.84 10.09 9.82 10.13 9.41 9.81 9.88 9.95 9.95 9.92 10.09 9.75 9.69 10.56 10.02 10.15 9.83 10.17 10.64 10.11 9.76 9.78 10.15 42.04 10.15 9.82 9.79 9.94 9.12 9.19 9.17

9.37 9.65 9.67 9.70 9.92 9.64 10.35 10.66 9.81 9.94 9.76 10.30 10.68 10.00 10.42 10.49 10.46 9.56 9.42 10.37 10.02 10.26 10.17 10.22 9.70 9.99 9.81 9.87 9.97 9.77 10.12 10.34 10.55 10.08 9.71 10.77 10.95 10.24 10.76 10.20 10.54 9.98 10.61 9.77 10.41 10.12 8.99 9.29 9.53 8.95

8.98 9.58 9.21 9.41 9.30 9.69 9.87 9.67 10.23 10.38 10.43 10.46 10.71 10.82 10.18 10.75 10.31 10.30 10.37 10.39 10.08 10.29 10.04 9.68 9.77 10.45 10.61 9.86 9.84 10.61 9.91 10.40 9.96 10.41 10.47 10.25 10.31 10.66 10.07 10.16 10.31 9.87 9.54 10.41 10.32 9.73 9.46 9.03 8.54 8.66

8.44 8.98 9.23 9.60 9.70 9.91 10.35 9.35 10.53 10.57 10.09 10.29 10.56 10.05 10.36 10.31 10.38 10.24 10.14 10.60 9.64 10.14 10.56 10.16 9.86 10.17 10.52 10.22 10.61 9.95 10.15 9.55 10.46 10.87 10.01 10.43 10.33 10.54 10.04 9.87 9.88 10.16 9.53 32.45 9.29 9.41 8.91 8.47

8.79 9.21 9.52 9.69 10.11 9.66 9.82 10.61 10.02 9.75 10.72 10.25 10.08 10.79 10.35 9.98 10.56 9.83 10.43 10.61 44.38 10.34 10.35 10.72 10.33 9.72 10.08 10.37 9.99 10.26 10.16 10.57 10.08 10.26 10.48 10.70 9.99 9.74 9.46 10.11 10.15 9.45 9.00 9.14 9.71 8.95

22.03 9.46 9.08 9.43 9.64 9.74 9.98 10.12 10.14 10.39 10.49 10.20 10.45 10.59 10.26 10.46 10.33 10.69 9.93 10.35 10.13 10.26 10.60 10.03 10.65 10.46 10.17 9.73 10.75 9.88 10.02 10.18 9.88 9.75 10.02 9.99 9.77 9.39 9.46 9.47 9.36 9.28 8.98 8.65

9.08 9.18 9.16 9.85 9.62 9.64 9.99 9.86 10.06 9.88 10.18 10.06 10.79 10.14 10.74 10.68 10.15 10.25 10.29 10.31 10.14 10.68 10.24 10.56 10.02 10.28 10.36 9.87 10.58 10.11 10.35 10.35 9.67 9.76 10.26 10.36 9.37 8.88 9.18 8.76

9.10 8.81 9.20 10.00 9.60 10.05 9.63 10.11 9.72 10.07 10.60 10.21 10.89 10.27 10.90 10.10 10.40 9.89 10.08 10.08 10.45 10.07 10.52 10.09 10.47 10.35 10.75 10.30 10.64 10.39 10.03 9.26 9.34 9.75 9.49 9.51 8.86 8.79

9.23 8.98 9.24 9.44 9.52 9.56 10.43 9.90 9.79 9.71 9.95 9.98 10.63 10.18 10.43 10.16 9.93 9.94 34.36 10.15 9.76 10.13 9.54 9.74 9.99 9.98 9.76 9.70 9.95 9.49 9.55 9.23 9.46 9.50 8.56 9.34

9.32 8.80 9.26 9.71 9.31 9.55 9.76 9.55 10.14 9.90 10.11 10.30 10.49 9.82 9.99 10.58 10.57 10.05 9.97 10.11 10.06 9.75 9.94 10.01 9.73 10.08 9.58 9.38 8.99 9.43 8.88 8.64

8.59 9.48 9.04 9.70 9.26 9.91 9.35 9.66 10.02 9.86 9.99 10.27 9.78 9.90 9.99 9.55 9.94 9.67 9.29 9.47 9.94 9.31 9.31 9.53 8.99 9.41 8.94 9.12

9.38 8.97 9.14 9.71 8.96 9.03 9.51 9.33 9.30 9.48 9.84 9.08 9.59 9.78 9.63 9.36 9.73 8.98 9.90 8.92 9.48 8.84 8.71 8.80

8.94 8.68 8.49 9.17 9.23 8.95 9.45 8.43 9.15 9.15 9.29 9.66 9.37 9.25 9.32 9.18 9.00 8.92

9.27 9.04 9.14 9.22 9.06 8.68

Conventional parametric testing can

only provide wafer map distribution Depending on the maturity of

technology, the parametric outlier

failure can vary from ppk to ppb

28

VarScan: Resistor/Transistor Ultra-high Density Array in Scribe-line

2016 um

Marco size:

16*16*192=49152(Resistor),

or 72*64*32=147456(Xtor)

Force/Sense/Power Bus

Row decoder + Force/Sense/Power Bus

Column Decoder Resistor/Transistor cell

29

Experimental Results from the Leading Technology Node

R: Resistor IDSAT: Transistor

3.5-5s

5-5.5s

>5.5s

Layout

Style Vt-type

30

Outline








VarScan Solution


Conclusions

31

Motivation for DFI™: Yield Metrology

DFI Solution

Technology

Landscape

Exploding number of interactions due to multi-patterning

3D structures incorporate buried defects – these are difficult to detect

Extreme pattern congestion (e.g. Local Interconnect)

Tight process windows for dimensional control

Small variations (CD, MA) lead to significant variability in interconnect

resistance and transistor performance

Big die need cross-field metrology for monitor and control

Large conventional metrology marks congest scribe space

Compact silicon footprint

Non-contacting measurement: M0, M1, M4, M10

Comprehensive read-out

All pairwise pattern combinations

Process window monitor

Hot spot monitor

Cross-field metrology

32

What Is “Design-for-Inspection” (DFI™)?

Scribeline: TD Vehicles, MPW’s and Product

In Die: Uses unused space inherent in any Place and Route design Non-functional “Filler cells” commonly occupy 5-30% of logic blocks

DFI Fill Cells fit seamlessly into logic IP, substituting ordinary filler cells without area/performance

penalty

Fill cell count: Achieve 5B-10B DFI fill cells per wafer with 5% of die area

Standard design flows used to insert DFI fill cells

Algorithms used to distribute DFI filler cells across the die, for maximum issue coverage with fast

readout

Decomposition targets key process and pattern issues

High cell density in representative layout environment

Non-contacting measurement with eProbe® E-beam system

Transform E-beam signal into Electrical Response Index ERI

Measurement

Design DFI Cells

Placement

33

How Does DFI™ Work?

DFI cells are designed to catch key

process issues, leveraging PDF’s proven

characterization vehicle infrastructure

Technology-specific hard IP detects the tiniest of

electrical failures

Capability for built in “process margin checks” for

early detection of process drifts (“canary in the coal

mine”)

Electrical Response Index, calculated from

E-beam signal, provides non-contacting,

quantitative electrical metric that

correlates well with electrical test

CA

M1

CA

(V0`)

CA

M1

CA

(V0)

STI

Key AA

PO

CA

CB

V0

M1

Key pattern of interest

Embed key pattern of

interest in standard cell

environment and setup

electrical context

(grounding)

Measure electrical

response index of

DFI pad

ERI=“Electrical Response Index”

Passing DUT

(weak “ERI”)

Failing DUT

(strong “ERI”)

34

Electrical Response Index (ERI) Accuracy

Accuracy: ERI follows electrical leakage over 6+ orders of magnitude

Capability: ERI identifies electrically-critical defects

35

DFI Measurement Applications & Reports

• ERI detects

leakage,

shorts and

opens

• Pareto/Health

• Wafer map

• Multi-color

alignment yield

• Detect process

margin

• Cross-field

margin

• Control limits:

performance,

reliability

• Identify unique

pattern

combinations

• Hotspot

validation

• Identify NPI

pattern risks

Objective: Non-contacting, electrical metrology to cover base PDK and Product IP

• Billion cell

observability:

Failure mode,

PWMA, hot

spot

• Throughput &

Accuracy

• Big-die, cross-

field monitor

Failure Mode

Monitor

PW & MA

Monitor Hotspot DFI

In-die Monitor

DFI Reports

Scribeline

36

DFI “Electrical Response Index” (ERI) Outlier Concept

Pad Electrical Response Index (ERI)

DFI cell failures are typically

summarized by target fail mode

and wfr/lot/day/week/wave/etc.:

37

DFI Process Margin DOE: Process Window & Misalign

DOE enables extraction of Misalignment (“dfiMA”) and Process Window (“dfiPW”)

dfiMA is similar to inline Overlay but captures full 3-D electrical interactions

dfiPW is unique captures interaction of all CD’s, sidewalls, etc.

38

Cross-field Misalignment Analysis

Integral view of all sources of variability:

Layout, reticle, field, wafer, process

Cross-field data about 3 to 10M data points/wafer

Sub 1-nm Resolution

39

DFI: Process Window Monitor for Narrow Yield Window

Relates in-line DFI Process Window to Electrical Structure Yield Establishes trade-off between S2S and T2T short

No window for initial process

Improved process achieves desired limited yields, but still needs minimum process window with tight CD control

Initial Process Improved Process

40

In Die Example: ppm-level Gate-to-Contact Short

eProbe 250 Data Outlier Review Image Reference Review Image

41

In Die

High-observability monitors

HVM Control

Margin, Variability

Reliability/Performance

Margin, Latent Fails

TD Health

Open/short, Margin

DFI Reports

Misalignment

Process Window

Monitors inside

product die

DFI instruments products and enables new opportunities for

inline process control

42

DFI Status

eProbe 150: Running in production today with millions of cells/hr

throughput for scribeline and MPW CV’s

eProbe 250: First deliveries made

Designed to achieve billions of cells/hr throughput for sparsely spaced filler cells

Uniquely optimized e-beam system for DFI measurement accuracy and

performance

Realized over 100 tape-outs to date, spanning 6 nodes

28nm, 20nm, 16nm, 14nm, 10nm, 7nm + 5nm

Over 40 Product/MPW tape-outs with DFI content

Designs drawn from 5 fabless companies

Over 60 PDF CV vehicles taped-out with DFI content

Silicon

eProbe

43

Outline








VarScan Solution


Conclusions

44

Conclusions

Aggressive Layout Design Rule Scaling Pushes Tolerances to the Limit

Gate S/D Spacing and Single Diffusion Break are Most Critical

Parametric Variability

New Product Introduction Requires a Comprehensive Set of Test Structures

to cover all product layout patterns and Yield Loss/Variability Mechanisms

VarScan Solution for the ppm 100 ppb Parametric Defect Detection

Yield and Reliability Detractor Detection Challenges

3D Defects and Leakage Paths Invisible by Standard Inspection

Techniques

We must “Detect the Undetectable”

Design For Inspection to the Rescue

Parts per Billion Detection Capability with the In-line Non-Contact Custom

E-beam Equipment Measurements in less than 2 hours

new product introduction challenges in the bleeding edge...

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