new 19nm process nand flash memory chips with 64gb capacity
TRANSCRIPT
-
8/6/2019 New 19nm Process NAND Flash Memory Chips With 64GB Capacity
1/2
Toshiba launches 19nm process NAND flash memory
The worlds finest process yields single chips with a 64 gigabit capacity
Dsseldorf, Germany, 26th April 2011 Toshiba Electronics Europe, reinforcing itsleadership in the development and fabrication of cutting-edge, high density NAND flashmemories, today announced that it has fabricated NAND flash memories with 19nm*1process technology, the finest level yet achieved. This latest technology advance hasalready been applied to 2-bit-per-cell 64-gigabit (Gb) chips that are the world's smallest andoffer the highest density on a single chip (8 gigabytes (GB))*2. Toshiba will also add 3-bit-per-cell products fabricated with the 19nm process technology to its product line-up.
Samples of 2-bit-per-cell 64-gigabit will be available from the end of this month with mass
production scheduled for the third quarter of the year (July to September 2011).
Toshiba leads the industry in fabricating high density, small die size NAND flash memorychips. Application of the 19nm generation process technology will further shrink chip size,allowing Toshiba to assemble sixteen 64Gbit NAND flash memory chips in one package andto deliver 128GB devices for application in smartphones and tablet PCs. The 19nm processproducts are also equipped with Toggle DDR2.0, which enhances data transfer speed.
As the market for mobile equipment, such as smartphones, tablet PCs, and SSDs (solidstate drives) expands, demand for smaller, higher density memory products grows. Byaccelerating process migration in NAND flash memory, Toshiba aims to reinforce and extendits leadership in the NAND flash memory market.
Note:*1 nm = nanometer (1 billionth of a meter)
*2 Source: Toshiba Corporation, April 2011
-
8/6/2019 New 19nm Process NAND Flash Memory Chips With 64GB Capacity
2/2
About Toshiba
Toshiba Electronics Europe (TEE) is the European electronic components business of Toshiba Corporation,which is ranked among the worlds largest semiconductor vendors. TEE offers one of the industry's broadest ICand discrete product lines including high-end memory, microcontrollers, ASICs, ASSPs and display products forautomotive, multimedia, industrial, telecoms and networking applications. The company also has a wide range of
power semiconductor solutions. TEE was formed in 1973 in Neuss, Germany, providing design, manufacturing,marketing and sales and now has headquarters in Dsseldorf, Germany, with subsidiaries in France, Italy, Spain,Sweden and the United Kingdom. TEE employs approximately 300 people in Europe. Company president is Mr.Hitoshi Otsuka.
Toshiba Corporation is a world leader and innovator in pioneering high technology, a diversified manufacturerand marketer of advanced electronic and electrical products spanning digital consumer products; electronicdevices and components; power systems, including nuclear energy; industrial and social infrastructure systems;and home appliances. Founded in 1875, Toshiba today operates a global network of more than 730 companies,with 204,000 employees worldwide and annual sales surpassing US$75 billion.
For more company information visit Toshiba's web site at www.toshiba-components.com
Contact details for publication:Toshiba Electronics Europe, Hansaallee 181, D-40549 Dsseldorf, GermanyTel: +49 (0) 211 5296 0 Fax: +49 (0) 211 5296 792197
Web: http://www.toshiba-components.com/pressoffice/index.aspE-mail: MAC/IC: [email protected]
Contact details for editorial enquiries:Henning Rausch, Toshiba Electronics EuropeTel: +49 (211) 5296 117E-mail: [email protected]
Issued by:Simon Flatt/Andrew Town, Pinnacle Marketing Communications Ltd, Prosperity House, Dawlish Drive, Pinner,Middlesex, HA5 5LN, UKTel: +44 (0) 20 8869 9229/+44 (0) 20 8429 6546 Fax: +44 (0) 20 8868 4373.Web: www.pinnacle-marketing.comE-mail: [email protected] or [email protected]
April 2011 Ref. 6110/A