national taiwan university · 2016. 1. 10. · epc -the leader in egan® fets national taiwan...
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www.epc-co.comEPC - The Leader in eGaN® FETs National Taiwan University 2012 1
The eGaN® FET Journey Continues
Alex LidowEfficient Power Conversion CorporationNovember 2012
National Taiwan UniversityEmerging Applications for GaN Transistors
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Agenda
• Why Gallium Nitride?• Hard Switched Converters
• Envelope Tracking• High Frequency Resonant Converters
• Wireless Power• Summary
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Why Gallium Nitride?
• Enhancement-Mode devices available (eGaN® FETs)
• RDS(ON) per unit area much smaller than silicon power MOSFET
• Much faster switching• Very low capacitance (CG, CISS, COSS)• No parasitic PN junction body (QRR=0)
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Dielectric
GaN- - - - - - - - - - - - - - -
Si
AlGaN Electron Generating Layer
Aluminum NitrideIsolation Layer
DGS- - - -
eGaN® FET Structure
Two DimensionalElectron Gas (2DEG)
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Flip Chip Assembly
HEATSINK
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Hard Switched Converters
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Example: Buck Converter
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33.253.5
3.754
4.254.5
4.755
5.255.5
0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3Po
wer
Los
s(W
)Parasitic Inductance (nH)
Power Loss vs Parasitic Inductance
Ls
33.253.5
3.754
4.254.5
4.755
5.255.5
0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3Po
wer
Los
s(W
)Parasitic Inductance (nH)
Power Loss vs Parasitic Inductance
LsLLoop
Cin
T
SR
LLoop: High Frequency Power Loop Inductance
LS: Common Source Inductance
VIN=12 V, VOUT=1.2 V, FS=1 MHz, IOUT= 20 A
Buck Converter Parasitics
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0
0.5
1
1.5
2
2.5
So-8 LFPAK DirectFET LGA
Pow
er L
oss
(W)
Device Loss BreakdownPackageDie
18%
82%
VIN =12V VOUT =1.2V IOUT =20A FS =1MHz
0
0.5
1
1.5
2
2.5
So-8 LFPAK DirectFET LGA
Pow
er L
oss
(W)
Device Loss BreakdownPackageDie
18%
82%
27%
73%
VIN =12V VOUT =1.2V IOUT =20A FS =1MHz
0
0.5
1
1.5
2
2.5
So-8 LFPAK DirectFET LGA
Pow
er L
oss
(W)
Device Loss BreakdownPackageDie
18%
82%
27%
73%
53%47%
VIN =12V VOUT =1.2V IOUT =20A FS =1MHz
0
0.5
1
1.5
2
2.5
So-8 LFPAK DirectFET LGA
Pow
er L
oss
(W)
Device Loss BreakdownPackageDie
18%
82%
27%
73%
53%47%
82%18%
VIN =12V VOUT =1.2V IOUT =20A FS =1MHz
LFPAK
Packaging Evolution
DirectFET LGA eGaNSo-8
65
70
75
80
85
90
0.5 1 1.5 2 2.5 3 3.5
Effic
ienc
y (%
)
Switching Frequency (MHz)
So-8LFPAKDirectFETeGaN
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83
84
85
86
87
88
89
90
91
2 4 6 8 10 12 14 16 18 20 22 24
Effic
ienc
y (%
)
Output Current (IOUT)
LLoop≈2.9nH
40V MOSFET
83
84
85
86
87
88
89
90
91
2 4 6 8 10 12 14 16 18 20 22 24
Effic
ienc
y (%
)
Output Current (IOUT)
LLoop≈1.6nH
LLoop≈2.9nH
40V MOSFET
83
84
85
86
87
88
89
90
91
2 4 6 8 10 12 14 16 18 20 22 24
Effic
ienc
y (%
)
Output Current (IOUT)
LLoop≈1.0nH
LLoop≈1.6nH
LLoop≈2.9nH
40V MOSFET
83
84
85
86
87
88
89
90
91
2 4 6 8 10 12 14 16 18 20 22 24
Effic
ienc
y (%
)
Output Current (IOUT)
LLoop≈1.0nH
LLoop≈1.6nH
LLoop≈0.4nH
LLoop≈2.9nH
40V MOSFET
Layout Impact on Efficiency
VIN=12 V, VOUT=1.2 V, FS=1 MHz, L=150 nH
Experimental Efficiency
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0
20
40
60
80
100
120
140
160
0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
Volta
ge O
vers
hoot
(%)
High Frequency Loop Inductance (LLOOP)
0
20
40
60
80
100
120
140
160
0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
Volta
ge O
vers
hoot
(%)
High Frequency Loop Inductance (LLOOP)
0
20
40
60
80
100
120
140
160
0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
Volta
ge O
vers
hoot
(%)
High Frequency Loop Inductance (LLOOP)
Peak Voltage Comparison
VIN=12 V, VOUT=1.2 V, FS=1 MHz, L=150 nH
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Envelope Tracking
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RF Transmission
Fixed supply
Peak PowerAverage Power
Output Power (dBm)
Output Probability
Average efficiency only 25%
Peak efficiency up to 65%
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Effect of ET
Envelope Tracking
Output Power (dBm)
Output Probability
Average Power
Average efficiency ~50% (incl. ET)
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Linear-Assisted Buck ET
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Efficiency45 VIN 22 VOUT
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4MHz Loss Breakdown
Top eGaN FET
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Resonant Converters
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Ref: Y. Ren, M. Xu, J. Sun, and F. C. Lee, “A family of high power density unregulated bus converters,” IEEE Trans. Power Electron., vol. 20, no. 5, pp. 1045–1054, Sep. 2005.
VGS(S1,S3) VGS(SR1)
VGS(S2,S4) VGS(SR2)
ILK1
ILK2
4:1
48V 12V
SR1
SR2
Resonant Converter
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eGaN® FET vs MOSFET
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MOSFET VGS
MOSFET VDS
eGaN FETVDS
eGaN FET VGS
Duty Cycle Comparison
DMOSFET = 34%DeGaN = 42%
FS = 1.2 MHz, VIN = 48 V, and VOUT = 12 V
21
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Efficiency Comparison
90
91
92
93
94
95
96
97
98
0 5 10 15 20 25 30 35 40
Effic
ienc
y (%
)
Output Current (IOUT)
1.2 MHz MOSFET
1.2 MHz eGaN FET
10 W 12 W
14 W
FS = 1.2 MHz, VIN = 48 V, and VOUT = 12 V
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0
2
4
6
8
10
12
Power Loss (W)
Gate Drive
Transfomrer CoreConduction + Turn Off
eGaN FETIOUT = 20 A
MOSFETIOUT = 20 A
eGaN FET IOUT = 2.5 A
MOSFETIOUT = 2.5 A
FS = 1.2 MHz, VIN = 48 V, and VOUT = 12 V
Loss Breakdown
Transformer Core
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Wireless Power
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Wireless Power
25
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Wireless Power
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Wireless Power
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Efficiency Comparison
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Loss Breakdown
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Summary• eGaN FETs operate efficiently in multi-
megahertz envelope tracking systems which can reduce transmit power by 50%.
• eGaN FETs reduce power losses by 25% or more in 1.2 MHz resonant DC-DC converters.
• eGaN FETs reduce power losses by 25% in 6.78 MHz wireless power transmission systems.
• You can always improve efficiency with eGaN FETs!
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The end of the road for silicon…..
is the beginning of the eGaN FET
journey!