mxm 3.0 type b module specification - zentrica · rev 0.1 page 3 of 19 september 4, 2013 1....

AMD Radeon TM HD7970M

MXM 3.0 Type B

Module Specification

REV 0.1 of 19 September 4, 2013

CONTENTS

1. Overview ....................................................................................................................................... 3

1.1. General Description ........................................................................................................ 3

1.2. Features ............................................................................................................................ 3

2. Module Diagrams ........................................................................................................................ 7

2.1. Module Block Diagram ................................................................................................... 7

2.2. Module Mechanical Parameters ................................................................................... 8

3. Display Configuration ................................................................................................................. 9

3.1. Default Display Settings ................................................................................................. 9

3.2. Optional Display Setting ................................................................................................. 9

4. Mechanical and Environmental Specifications ..................................................................... 10

4.1. Electromechanical Specification ................................................................................. 10

4.2. Thermo-mechanical Specification .............................................................................. 10

4.3. Environmental Specifications and Conditions .......................................................... 10

5. Electrical Specifications ........................................................................................................... 11

5.1 PCI Express® Support ................................................................................................. 11

5.2 Electrical Connector ...................................................................................................... 11

6. Electrical Exceptions ................................................................................................................. 16

6.1. VGA ................................................................................................................................. 16

6.2. LVDS ............................................................................................................................... 16

7. Power .......................................................................................................................................... 17

7.1. Power Tree ..................................................................................................................... 17

7.2. Power Consumption ..................................................................................................... 18

7.3. Power Sequencing ........................................................................................................ 18


1. Overview

1.1. General Description

The AMD Radeon™ HD 7970M MXM 3.0 Type B module from AMD’s Embedded Solutions

is designed to reap the benefits of PCI Express® 3.0, and achieve fast time-to-market with

cutting edge, innovative solutions. The module features an AMD Radeon HD 7970 GPU at

850MHz with 2GB of GDDR5 on-module graphics memory at 1200MHz.

The module consists of a standard single 285-pin edge connector that all input/outputs are

routed through and is based on the MXM Graphics Module Mobile PCI Express Module

Electromechanical Specification Version 3.1, Revision 1.0 (http://www.mxm-sig.org/).

1.2. Features

• Graphics Core Next (GCN) Architecture:

• 9th generation programmable hardware tessellation unit

• 20 Compute units (1280 Stream processors)

• 80 Texture units

• 128 Z/Stencil ROP units

• 32 Color ROP units

• 512KB L2 read/write cache

• 256-bit GDDR5 memory interface

Image Quality Enhancement Technology:

• Up to 24x multi-sample and super-sample anti-aliasing

• Adaptive anti-aliasing

• Enhanced Quality Anti-Aliasing (EQAA)

• Morphological Anti-Aliasing (MLAA)

• 16x angle invariant anisotropic texture filtering

• 128-bit floating point HDR rendering

AMD Eyefinity Multi-Display Technology:

•

•

•

http://www.mxm-sig.org/


•

•

•

• DirectCompute 11, and Microsoft® C++ AMP

Video Codec Engine (VCE):

• Accelerated H.264 HD video encoding, transcoding, and up-scaling

• Unified Video Decoder (UVD)

• H.264

• VC-1

• MPEG-2 (SD & HD)

• MVC (Blu-ray 3D)

• MPEG-4 Part 2 (DivX® /Xvid)

• Adobe® Flash

Enhanced Video Quality:

• Advanced post-processing and scaling

• Deblocking

• Denoising

• Automatic deinterlacing

• Mosquito noise reduction

• Edge enhancement

• 3:2 pulldown detection

• Advanced video color correction

• Brighter whites processing (Blue Stretch)

• Independent video gamma control

• Flesh tone correction

• Color vibrance control

• Dynamic contrast

• Dynamic video range control

• DXVA 1.0 & 2.0 support

AMD HD3D Technology:

• Stereoscopic 3D display/glasses support

• Blu-ray 3D support

• Stereoscopic 3D gaming


• 3rd party Stereoscopic 3D middleware software support

AMD CrossFire™ multi-GPU Technology:

• Supports dual GPU performance scaling

Cutting-edge Integrated Display Support:

• DisplayPort 1.2

Max resolution: 2560x1600 per display

Multi-Stream Transport

21.6 Gbps bandwidth

High bit-rate audio

• HDMI™ (with 3D, 4k, Deep Color, x.v.Color)

Max resolution: 4096x3112

1080p60 Stereoscopic 3D

Quad HD/4k video support

• Dual-link DVI with HDCP


• VGA


Integrated HD Audio Controller:

• Output protected high bit rate 7.1 channel surround sound over HDMI with no

additional cables required

• Supports AC-3, AAC, Dolby TrueHD and DTS Master Audio formats

AMD PowerPlay™ Power Management Technology:

• Automatic power management with low power idle states

• AMD PowerTune technology

• Intelligent TDP management technology

• Dynamic clock speed/performance enhancement for games

• AMD ZeroCore Power technology

Additional Interfaces:

• 153.6 GB/s memory bandwidth

• 2176 GFLOPs Single Precision compute power

• 136 GFLOPs Double Precision compute power

• PCI Express 3.1 x16 bus interface

• DirectX® 11 graphics


• OpenGL 4.2 support

• Partially Resident Texture (PRT) support


2. Module Diagrams

This section provides a block diagram and the mechanical parameters of the module.

2.1. Module Block Diagram

Module Block Diagram

Note: The Module Block Diagram shows what the HD 7970M is capable of displaying and

does not reflect the actual default video BIOS settings.


2.2. Module Mechanical Parameters

Module Mechanical Parameters

Note: Board photos are not to scale and measurement are in mm.

Note: Refer to the MXM 3.1 Type B specification for board dimensions and fan holes

location.


3. Display Configuration

The MXM module, using the AMD Radeon HD 7970 GPU, provides flexibility for display

configurations briefly explained here. If you do not use the default display settings, you will

need a custom video BIOS. Contact Supplier technical support channel first for changes to

the display settings.

3.1. Default Display Settings

• Dual-Link DVI-D (GPU display controllers DP E + DP F)

Only 2 legacy displays are active at the same time

• Single-Link DVI-I (GPU display controllers DP A + CRT)


• HDMI (GPU display controller DP C)


• DisplayPort v1.2 (GPU display controller DP D)

Note: Legacy displays are CRT, DVI or HDMI displays.

3.2. Optional Display Setting

The MXM module can be configured with LVDS_U* and LVDS_L* (DP E + DP F) as single

or dual-link LVDS, up to two single or one dual-link DVI, one HDMI or up to two DisplayPort

v1.1 outputs.

The MXM module description of DP_A, DP_B, DP_C, and DP_D (corresponding DP A, DP

C, DP B, DP D respectively for GPU descriptions) can be configured as single-link DVI,

HDMI or DisplayPort v1.2.

Only a maximum of two legacy displays (CRT, DVI or HDMI) can be displayed at the same

time. Only one HDMI will be output (one audio codec only).

Examples of possible configurations in addition to the default settings:

1. Single-link LVDS + single-link DVI-I + 4 DisplayPorts

2. Single-link LVDS + HDMI + 4 DisplayPorts

3. Single-link LVDS + 5 DisplayPorts

4. Dual-Link LVDS + 4 DisplayPorts

5. 6 DisplayPorts

6. Dual-link DVI-D + single DVI-I + 3 DisplayPorts

Note: Legacy displays are CRT, DVI or HDMI displays.


4. Mechanical and Environmental

Specifications

4.1. Electromechanical Specification

Refer to the MXM 3.1 Type B mechanical specifications outlined in the MXM Graphics

Module Mobile PCI Express Module Electromechanical Specification Version 3.1, Revision

1.0 (http://www.mxm-sig.org/). The AMD Radeon HD 7970M MXM 3.0 Type B module is

based upon that specification

4.2. Thermo-mechanical Specification

Feature Max. Configuration

Temperature Sensor Support Internal and External

External Temperature Sensor

Mechanism

ADM1032ARMZ

Fan Control Circuit Adjustable 2-wire fan circuit

Thermal Solution Type Active cooler

Passive Heatsink Type Fansink

Thermal Protection Critical Temperature Shutdown

(CTF)

4.3. Environmental Specifications and Conditions

Parameter Value

Operating Temperature 0°C to 55°C

Storage Temperature All function shall be normal after 500hrs

at -40°C to 75°C at normal humidity with

a 24-hour recovery period at room

temperature.

Operating Humidity 5% to 90% RH

Storage Humidity 5% to 95% RH


5. Electrical Specifications

Refer to the MXM electrical specifications outlined in the publicly available MXM Graphics

Module Mobile PCI Express Module Electromechanical Specification Version 3.1, Revision

1.0 (http://www.mxm-sig.org/). Some pins are different than in the specification. Refer to the

pin descriptions.

5.1 PCI Express® Support

The module supports up to 16 bidirectional PCI Express differential signaling lanes (x1, x2,

x4, x8, and x16). It is compliant with PCI Express Base Specification 3.1, except for power

delivery and power management. Embedded system power requirements supersede PCI

Express power specifications. Hot plug insertion is not supported.

5.2 Electrical Connector

Provides the connector pin assignment for the module. Note that some pins are different

compared to the MXM Graphics Module Mobile PCI Express Module Electromechanical

Specification Version 3.1, Revision 1.0 (http://www.mxm-sig.org/).


AMD Radeon ™ HD 7970M MXM Pin Assignment


6. Electrical Exceptions

6.1. VGA

When driving stereoscopic 3D displays AMD designs make use of the stereo-sync (generic

a/b) signal to differentiate between the left and right scene. This is implemented on OEM2

(MXM pin 40).

6.2. LVDS

LVDS Implementation in AMD Designs

The HD 7970M MXM differs from MXM 3.1 spec in the implementation of LVDS, specifically

on the pull-ups on the DDC lines and the MXM connector pin used for hot plug detect. AMD

recommends that the 4.7K PU to 3.3V on LVDS DDC lines be placed on the motherboard

side allowing the channel to be used for eDP/DP or LVDS. This adds flexibility and simplifies

display qualification.

To have more control over the display configuration, AMD designs make use of OEM3

(MXM pin 41) for DDCDATA_AUX7N (DPF) and OEM5 (MXM pin 43) for DDCCLK_AUX7P

(DPF).


7. Power

7.1. Power Tree


7.2. Power Consumption

7.3. Power Sequencing

The power sequencing for this board requires that the 5VRUN (+5V) and the PWR_SRC

(+20V) come up before or at the same time as 3V3RUN (3.3V). Voltage tolerances are

+/-5%.Layout Guidelines

Refer to the MXM Graphics Module, MXM Version 3.1 System Design Guide

(http://www.mxm-sig.org/) for detailed layout requirements on the system board.


Change log or update history

Rev. Date History

0.1 2013/9/4 1st Draft

mxm 3.0 type b module specification - zentrica · rev 0.1 page 3 of 19 september 4, 2013 1....

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