multimedia expansion board ii (meb ii) user's guide - microchip
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2013 Microchip Technology Inc. DS70005148A
Multimedia Expansion Board II (MEB II)User’s Guide
DS70005148A-page 2 2013 Microchip Technology Inc.
Information contained in this publication regarding deviceapplications and the like is provided only for your convenienceand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS ORIMPLIED, WRITTEN OR ORAL, STATUTORY OROTHERWISE, RELATED TO THE INFORMATION,INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY, PERFORMANCE, MERCHANTABILITY ORFITNESS FOR PURPOSE. Microchip disclaims all liabilityarising from this information and its use. Use of Microchipdevices in life support and/or safety applications is entirely atthe buyer’s risk, and the buyer agrees to defend, indemnify andhold harmless Microchip from any and all damages, claims,suits, or expenses resulting from such use. No licenses areconveyed, implicitly or otherwise, under any Microchipintellectual property rights.
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of ourproducts. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV
== ISO/TS 16949 ==
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their respective companies.
© 2013, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-62077-656-8
MULTIMEDIA EXPANSIONBOARD (MEB) II USER’S
GUIDE
Table of Contents
Chapter 1. Introduction1.1 Kit Contents .................................................................................................. 111.2 System Diagram ........................................................................................... 111.3 Multimedia Features ..................................................................................... 131.4 MEB and MEB II Differences ........................................................................ 17
Chapter 2. Hardware2.1 Hardware Features ....................................................................................... 19
Appendix A. Board Layout and SchematicsA.1 Board Layout ................................................................................................ 32A.2 Schematics .................................................................................................. 35
Appendix B. Bill of Materials....................................................................................... 49
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MULTIMEDIA EXPANSIONBOARD II (MEB II) USER’S
GUIDE
Preface
INTRODUCTION
This chapter contains general information that will be useful to know before using the Multimedia Expansion Board II (MEB II). Items discussed in this chapter include:
• Document Layout• Conventions Used in this Guide• Recommended Reading• The Microchip Web Site• Development Systems Customer Change Notification Service• Customer Support• Document Revision History
DOCUMENT LAYOUT
This document describes how to use the Multimedia Expansion Board II (MEB II) as a development tool to emulate and debug firmware on a target board. This user’s guide is composed of the following chapters:
• Chapter 1. “Introduction” provides a brief overview of the starter kit, highlighting its features and uses.
• Chapter 2. “Hardware” provides the hardware descriptions of the starter kit.
• Appendix A. “Board Layout and Schematics” provides a block diagram, board layouts, and detailed schematics of the starter kit.
• Appendix B. “Bill of Materials” provides the bill of materials for the components used in the design and manufacture of the starter kit.
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level of the document.
For the most up-to-date information on development tools, see the MPLAB® IDE online help. Select the Help menu, and then Topics to open a list of available online help files.
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Multimedia Expansion Board II (MEB II) User’s Guide
CONVENTIONS USED IN THIS GUIDE
This manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONS
Description Represents Examples
Italic characters Referenced books MPLAB IDE User’s Guide
Emphasized text ...is the only compiler...
Initial caps A window the Output window
A dialog the Settings dialog
A menu selection select Enable Programmer
Quotes A field name in a window or dialog
“Save project before build”
Underlined, italic text with right angle bracket
A menu path File>Save
Bold characters A dialog button Click OK
A tab Click the Power tab
Text in angle brackets < > A key on the keyboard Press <Enter>, <F1>
Plain Courier New Sample source code #define START
Filenames autoexec.bat
File paths c:\mcc18\h
Keywords _asm, _endasm, static
Command-line options -Opa+, -Opa-
Bit values 0, 1
Constants 0xFF, ‘A’
Italic Courier New A variable argument file.o, where file can be any valid filename
Square brackets [ ] Optional arguments mcc18 [options] file [options]
Curly brackets and pipe character: { | }
Choice of mutually exclusive arguments; an OR selection
errorlevel {0|1}
Ellipses... Replaces repeated text var_name [, var_name...]
Represents code supplied by user
void main (void){ ...}
Notes A Note presents information that we want to re-emphasize, either to help you avoid a common pitfall or to make you aware of operating differences between some device family members. A Note can be in a box, or when used in a table or figure, it is located at the bottom of the table or figure. Note 1: This is a note used in a
table.
Note: This is a standard note box.
CAUTION
This is a caution note.
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Preface
RECOMMENDED READING
This user’s guide describes how to use the starter kit. The following Microchip documents are available and recommended as supplemental reference resources.
Release Notes for the Multimedia Expansion Board
For the latest information, Microchip has a dedicated web page for the Multimedia Expansion Board II (MEB II), which can be accessed at: http://www.microchip.com/meb2
Family Reference Manual Sections
Family Reference Manual sections are available, which explain the operation of the PIC32 microcontroller family architecture and peripheral modules. The specifics of each device family are discussed in the individual family’s device data sheet.
Device Data Sheets
Refer to the appropriate device data sheet for device-specific information and specifications. These documents may be obtained from the Microchip web site or your local sales office.
Reference information found in these data sheets includes:
• Device memory maps
• Device pinout and packaging details
• Device electrical specifications
• List of peripherals included on the devices
PIC32MX Flash Programming Specification (DS60001145)
Refer to this document for information on instruction sets and firmware development.
MPLAB® XC32 C/C++ Compiler User’s Guide (DS50001686)
This document details the use of Microchip’s MPLAB XC32 Compiler for PIC32 microcontrollers to develop 32-bit applications.
MPLAB® X IDE User’s Guide (DS50002027)
Consult this document for more information pertaining to the installation and implementation of the MPLAB X IDE software.
THE MICROCHIP WEB SITE
Microchip provides online support via our web site at http://www.microchip.com. This web site makes files and information easily available to customers. Accessible by most Internet browsers, the web site contains the following information:
• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listings
• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listings of seminars and events; and listings of Microchip sales offices, distributors and factory representatives
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Multimedia Expansion Board II (MEB II) User’s Guide
DEVELOPMENT SYSTEMS CUSTOMER CHANGE NOTIFICATION SERVICE
Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest.
To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions.
The Development Systems product group categories are:
• Compilers – The latest information on Microchip C compilers and other language tools
• Emulators – The latest information on the Microchip in-circuit emulator, MPLAB REAL ICE™
• In-Circuit Debuggers – The latest information on the Microchip in-circuit debugger, MPLAB ICD 3
• MPLAB X IDE – The latest information on Microchip MPLAB X IDE, the Windows® Integrated Development Environment for development systems tools
• Programmers – The latest information on Microchip programmers including the PICkit™ 3 development programmer
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.
Technical support is available through the web site at: http://support.microchip.com
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Preface
DOCUMENT REVISION HISTORY
Revision A (November 2013)
This is the initial release of this document.
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MULTIMEDIA EXPANSIONBOARD II (MEB II) USER’S
GUIDE
Chapter 1. Introduction
Thank you for choosing the Microchip Technology Multimedia Expansion Board II (MEB II). The MEB II is a compact, highly versatile development board, which in conjunction with a PIC32 starter kit and a display daughter board, provides a system for developing a wide range of multimedia applications. The MEB II kit includes a 4.3" WQVGA PCAP touch display daughter board and supports detachable display boards allowing for a variety of resolutions.
This chapter covers the following topics:
• Kit Contents• System Diagram• Multimedia Features
• MEB and MEB II Differences
1.1 KIT CONTENTS
The Multimedia Expansion Board II (MEB II) contains the following items:
• Multimedia Expansion Board II (MEB II) (Mother Board)
• 4.3" WQVGA Display Board (Daughter Board)
• Multimedia Expansion Board II (MEB II) Information Sheet
1.2 SYSTEM DIAGRAM
The MEB II system consists of the PIC32 Starter Kit, MEB II mother board, and a dis-play daughter board (4.3" PCAP touch), as shown in Figure 1-1. MEB II is a mother board that contains all the necessary components and interfaces to support the multi-media features. PIC32 starter kit connects to MEB II through a 168-pin board-to-board connector and contains the PIC32 microcontroller with additional components (debug, memory, communication etc). Refer to http://www.microchip.com/meb2 for supported PIC32 Starter Kits and other additional information. The display daughter board is con-nected to the MEB II using a 60-pin board-to-board connector (detachable), providing flexibility to support a variety of displays.
Note: If you are missing any part of a kit, contact a Microchip sales office for assis-tance. A list of Microchip offices for sales and service is provided on the back page of this document.
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Multimedia Expansion Board II (MEB II) User’s Guide
FIGURE 1-1: MEB II SYSTEM DIAGRAM
MEB II System
Starter
Kit with
(PIC32) EBI-SRAM orEBI-PSRAM
VGA Camera
24-bit Audio
Bluetooth®
Accelerometer
Temperature
Dis
pla
y C
onne
ctor
Display with
PCAP touch
PIC
tail™
Con
nect
ormTouch™ Buttons
microSD
Sensor
Wi-Fi
Sta
rter
Kit
Con
nect
or
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Introduction
1.3 MULTIMEDIA FEATURESThe component layout of the MEB II is shown in Figure 1-2 (front side) and Figure 1-3 (bottom side). As mentioned previously, the MEB II kit also includes a 4.3" PCAP touch display board. The component layout of this board is shown in Figure 1-4 (front side) and Figure 1-5 (bottom side).
The front side of the MEB II includes these key features, as shown in Figure 1-2:
1. Display daughter board connector (60-pin Hirose board-to-board connector)
2. mTouch™ buttons
3. Push Button
4. Power LED
5. User LEDs
6. VGA Camera (OVM7690)
7. PICtail™ Connector
8. Analog temperature sensor
FIGURE 1-2: MULTIMEDIA EXPANSION BOARD II (MEB II) LAYOUT (FRONT SIDE)
62
1
8
54
3
7
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Multimedia Expansion Board II (MEB II) User’s Guide
The bottom side of the MEB II includes these key features, as shown in Figure 1-3:
1. Regulated 5V and 3.3V power supply for powering the board through a 9-15V DC Adapter.
2. PIC32 Starter Kit connector (168-pin Hirose board-to-board connector).
3. 24-bit stereo audio codec (AK4953A).
4. Integrated 802.11bg wireless module (MRF24WG0MA).
5. Low-cost Bluetooth® HCI transceiver (BTM805).
6. EBI SRAM memory (IS61WV102416BLL).
7. microSD slot.
8. Analog accelerometer (ADXL325).
FIGURE 1-3: MULTIMEDIA EXPANSION BOARD II (MEB II) LAYOUT (BOTTOM SIDE)
1
2
6
4
5
7
8
3
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Introduction
The front side of the 4.3" WQVGA PCAP touch display board includes this key feature, as shown in Figure 1-4: 1) 4.3" WQVGA glass with PCAP touch panel.
FIGURE 1-4: WQVGA PCAP TOUCH DISPLAY BOARD LAYOUT (FRONT SIDE)
1
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The bottom side of the 4.3" WQVGA PCAP touch display board includes these key features, as shown in Figure 1-5:
1. 60-pin MEB II connector.
2. Display panel connector.
3. PCAP touch connector.
4. Microchip touch controller (MTCH6301).
5. 6-in PCAP touch connector for future use.
6. PICkit™ Serial Analyzer interface (optional)
FIGURE 1-5: WQVGA PCAP TOUCH DISPLAY BOARD LAYOUT (BOTTOM SIDE)
1
23
4
6
5
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Introduction
1.4 MEB AND MEB II DIFFERENCES
Table describes the differences between the first (MEB) and second (MEB II) generation boards.
TABLE 1-1: MEB BOARD DIFFERENCES
Feature MEB II MEB
Starter Kit Connector 160-pin Hirose FX10 series board-to-board connector
132-pin Hirose FX10 series board-to-board connector
Starter Kit Refer to: http://www.microchip.com/meb2 Refer to: http://www.microchip.com/meb
Display Low-Cost Controllerless (LCC) graphics On-board graphics controller (SSD1926)
60-pin display connector N/A
Includes a 4.3" WQVGA display with projected capacitive touch(MTCH6301)
3.2" QVGA display with resistive touch
Supports up to 7" WVGA display through a connector
N/A
External SRAM (EBI) ISSI 2 MB external synchronous RAM (IS61WV102416BLL-10TLI
N/A
VGA Camera Available on board N/A
Audio 24-bit audio codec (AK4953A) 24-bit audio codec (WM8731)
Bluetooth® Low cost Bluetooth™ HCI transceiver N/A
Wi-Fi IEEE 802.11b/g (MRF24WG0MA) transceiver module
IEEE 802.11b (MRF24WB0MA) transceiver module
Accelerometer ADXL325 3-axis analog accelerometer BMA150 3-axis digital accelerometer and temperature sensor
Temperature Sensor MCP9700T analog temperature sensor Temperature sensor in BMA150
microSD Connects to Host CPU on the starter kit Connects to the graphics controller
mTouch™ Buttons Two touch buttons; additional touch button support through a PICtail™ connector
Touch button support through a PICtail™ connector
PICtail™ Connector Yes Yes
EEPROM N/A 128-byte EEPROM (24LC08)
SPI Flash See Note 1 2MB SST25VF016 serial Flash
CPLD See Note 2 Xilinx XC2C64A for port enhancement
Joystick N/A Available
Note 1: Serial Quad Flash support through the PIC32 Starter Kit.
2: Port enhancement is not necessary due to extended connector and available device pins.
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MULTIMEDIA EXPANSIONBOARD II (MEB II) USER’S
GUIDE
Chapter 2. Hardware
This chapter describes the hardware used in MEB II and 4.3" WQVGA PCAP Touch Display Board.
2.1 HARDWARE FEATURES
2.1.1 Power Supply
Power can be supplied to the MEB II in two ways: 1) through the DC connector (J3) located on the MEB II (Figure 2-1), and 2) through the USB on the Starter Kit. By connecting a 9-15V power supply to the DC connector or the USB device on the Starter Kit, the MEB II, Display Daughter Board and the Starter Kit will receive the proper voltages. However, if the application plans to use multiple features of the MEB II, it is recommended to use a 9V to 15V DC power supply.
FIGURE 2-1: 9V TO 15V DC POWER SUPPLY
Note: Refer to Appendix A. “Board Layout and Schematics” and Appendix B. “Bill of Materials” for the schematics and manufacturer and part number information of the hardware components used in the Multimedia Expansion Board II (MEB II) and the 4.3" WQVGA PCAP Touch Display Board.
CAUTION
When connecting the Multimedia Expansion Board II (MEB II) to a starter kit, do not have power applied to either the starter kit or the DC power supply. Failure to heed this caution could result in hardware damage.
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Multimedia Expansion Board II (MEB II) User’s Guide
2.1.2 Starter Kit Connector
The starter kit connector, as shown in Figure 2-2, is a high-speed, 168-pin Hirose FX10 board-to-board connector that is used to connect the MEB II to PIC32 starter kits.
FIGURE 2-2: STARTER KIT CONNECTOR
After connecting a PIC32 starter kit, applications can be developed and run using the rich features of the MEB II. Table 2-1 shows the Starter Kit Connector pin and the MEB II component mapping.
CAUTION
When connecting the Multimedia Expansion Board II (MEB II) to a starter kit, do not have power applied through either the starter kit or the DC power supply. Failure to heed this caution could result in hardware damage.
TABLE 2-1: STARTER KIT CONNECTOR MAPPING
Starter Kit Connector MEB II
Pin Number
SignalPin
TypeComponent Description
1 SS1 O Audio Codec Left-Right Clock
64 RH3 O Audio Power Down
82 SDA2 I/O I2C data
94 SDI1 I Audio Serial Data Output
96 REFCLKO1 O External Master Clock Input
112 SCL2 I/O Serial Clock
117 SDO1 O Audio Serial Data Input
118 SCK1 O Audio Bit Clock
7 RB1 O EBI-SRAM/Display Horizontal Sync.
68 EBIWE O Pixel Clock
77 RJ3 O Reset
78 EBICS2 O Chip Select
103 RB4 O Data Enable
108 RH9 O Vertical Sync
116 RH13 O Standby
131 EBID15 I/O R0
132 LCD_B7 I/O B7
133 LCD_R1 I/O R1
134 EBID3 I/O B6
135 LCD_R2 I/O R2
136 EBID2 I/O B5
137 EBID11 I/O R3
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Hardware
138 EBID1 I/O EBI-SRAM/Display B4
139 EBID12 I/O R4
140 EBID0 I/O B3
141 EBID13 I/O R5
142 EBID4 I/O B2
143 EBID14 I/O R6
144 LCD_B1 I/O B1
145 LCD_R7 I/O R7
146 LCD_B0 I/O B0
147 EBID10 I/O G0
148 LCD_G7 I/O G7
149 LCD_G1 I/O G1
150 EBID9 I/O G6
151 EBID5 I/O G2
152 EBID8 I/O G5
153 EBID6 I/O G3
154 EBID7 I/O G4
155 EBIOE O Pixel Clock
13 MCLR I/O Touch Touch Controller Reset (System Reset in general)
110 RH10 O Touch Wakeup
124 SCL1 I/O Serial Clock
126 SDA1 I/O Serial Data
92 AN42 I mTouch button Touch Button B1
111 AN28 I Touch Button B2
80 RJ7 O VGA Camera Power Down
86 RA9 I Vertical Sync
90 OC5 O System Input Clock
104 SDA3 I/O Serial Data
106 SCL3 I/O Serial Clock
19 INT2 I VGA Camera Pixel
93 RE8 O VGA Camera Regulator
Shutdown
27 EBIA1/RK1 I/O EBI-SRAM/VGA Camera
Address 1/VGA Camera Data 1
31 EBIA3/RK2 I/O Address 3/VGA Camera Data 2
61 EBIA16/RK0 I/O Address 16/VGA Camera Data 0
63 EBIA17/RK3 I/O Address 17/VGA Camera Data 3
65 EBIA18/RK4 I/O Address 17/VGA Camera Data 4
67 EBIA19/RK5 I/O Address 17/VGA Camera Data 5
73 EBIA20/RK6 I/O Address 17/VGA Camera Data 6
75 EBIA21/RK7 I/O Address 17/VGA Camera Data 7
TABLE 2-1: STARTER KIT CONNECTOR MAPPING (CONTINUED)
Starter Kit Connector MEB II
Pin Number
SignalPin
TypeComponent Description
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Multimedia Expansion Board II (MEB II) User’s Guide
25 EBIA0 O EBI-SRAM Address 0
29 EBIA2 O Address 2
33 EBIA4 O Address 4
35 EBIA5 O Address 5
37 EBIA6 O Address 6
43 EBIA7 O Address 7
47 EBIA9 O Address 9
49 EBIA10 O Address 10
51 EBIA11 O Address 11
53 EBIA12 O Address 12
55 EBIA13 O Address 13
57 EBIA14 O Address 14
59 EBIA15 O Address 15
79 EBIA23 O Sleep Enable
81 EBIBS0 O Bank Select 0 (Lower Bank)
83 EBIBS1 O Bank Select 1 (Upper Bank)
14 INT0 I Wi-Fi Wi-Fi Interrupt
85 RH14 O Sleep
89 SDI4 I Serial Data Out
105 SDO4 O Serial Data In
95 SS4 O Chip Select
120 RJ0 O Reset
114 SCK4 I/O Serial Clock
87 SCK2 I Bluetooth Serial Transmit
107 RB2 O Regulator Enable
122 U2RTS O Request to send
91 U2CTS I/O Serial Clear to Send
88 U2TX O Serial Receive/mTouch button analog channel
119 AN6 O Accelerometer X-axis out
121 AN7 O Y-axis out
123 AN8 O Z-axis out
23 AN23 I Temperature Sensor Temp. Sense channel
163 SD_DATA3/SD_CD I/O microSD Data 3/Card Detect
164 SD_DATA2 I/O Data 2
165 SD_DATA1 I/O Data 1
166 SD_DATA0 I/O Data 0
167 SD_CLK O Clock
168 SD_CMD O Command
76 RJ5 I Mechanical Card Detect
4 RA0 O Fire Button
113 RH0 O LED1
62 RH2 O LED2
115 RH1 O LED3
92 RH6 O LED4
84 RH11 O LED5
TABLE 2-1: STARTER KIT CONNECTOR MAPPING (CONTINUED)
Starter Kit Connector MEB II
Pin Number
SignalPin
TypeComponent Description
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Hardware
2.1.3 Display Connector
The MEB II supports display on a separate daughter card through a 60-pin Hirose DF12 board-to-board display connector, as shown in Figure 2-3.
FIGURE 2-3: DISPLAY CONNECTOR
The MEB II supports a variety of displays through the daughter board and the kit includes a 4.3" WQVGA Projected Capacitive (PCAP) Touch display. Refer to 2.1.15 “4.3” WQVGA PCAP Touch Display Daughter Board” for additional details. Table 2-2 shows the display connector functional mapping.
CAUTION
When connecting the Multimedia Expansion Board II (MEB II) to a starter kit or to the display daughter board, do not have power applied through either the starter kit or the DC power supply. Failure to heed this caution could result in hardware damage.
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TABLE 2-2: DISPLAY CONNECTOR
Display Connector
Pin Number Signal Pin Type Description
9 G4 I/O Display RGB Data
10 G0 I/O
11 G5 I/O
12 G1 I/O
13 G6 I/O
14 G2 I/O
15 G7 I/O
16 G3 I/O
17 R0 I/O
18 B0 I/O
19 R1 I/O
20 B1 I/O
21 R2 I/O
22 B2 I/O
23 R3 I/O
24 B3 I/O
25 R4 I/O
26 B4 I/O
31 R5 I/O
32 B5 I/O
33 R6 I/O
34 B6 I/O
35 R7 I/O
36 B7 I/O
37 PCLK I/O Display Pixel Clock
38 STBYB I/O Display Standby
39 VSYNC I/O Display Vertical Sync
40 HSYNC I/O Display Horizontal Sync
41 DE I/O Display Data Enable
42 CS I/O Display Chip Select
43 INT I/O Touch interrupt
44 SCL I/O Touch Serial Clock
45 WAKE I/O Touch Wake
46 SDA I/O Touch Serial Data
47 BLEN I/O Display Backlight Enable
48 RESET I/O Display Reset
55 MCLR I/O System Reset
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Hardware
2.1.4 EBI SRAM Memory (Optional)
The MEB II includes an External Bus Interface (EBI) routed to support both asynchronous SRAM and pseudo-SRAM memories. By default, these memories are not populated on the board and users can populate them as needed. The interface is routed considering both ISSI SRAM (IS61WV51216BLL-10TLI) and pseudo-SRAM (IS66WVE4M16BLL-70BLI) memories, as shown in Figure 2-4.
FIGURE 2-4: EBI SRAM MEMORY
2.1.5 VGA Camera Sensor
The MEB II includes an Omnivision OVM7690 VGA camera sensor with an active array size of 640 x 480 (VGA resolution), as shown in Figure 2-5. The PIC32 microcontroller uses the I2C interface to control the sensor and the sensor communicates the image data through an 8-bit (DATA7-DATA0) data bus.
FIGURE 2-5: VGA CAMERA SENSOR
2013 Microchip Technology Inc. DS70005148A-page 25
Multimedia Expansion Board II (MEB II) User’s Guide
2.1.6 24-bit Audio Codec
The MEB II includes an Asahi Kasei AKM4953A 24-bit audio codec for high-quality audio, as shown in Figure 2-6. The AK4953A is low power consumption 24-bit stereo codec with a microphone, headphone, and speaker amplifiers, which is suitable for portable applications with a recording/playback function. The I2C interface of the audio codec is used by the PIC32 device for control and the I2S interface is used for audio.
FIGURE 2-6: 24-BIT AUDIO CODEC
2.1.7 Bluetooth® HCI Transceiver
The Flaricomm BTM805 Bluetooth® HCI (Host Control Interface) module is included in the MEB II, adding Bluetooth capability, as shown in Figure 2-7. The PIC32 microcontroller communicates with the Bluetooth module through the UART interface.
FIGURE 2-7: BLUETOOTH® TRANSCEIVER
Note: In an application, since Bluetooth and microSD share the same pins on the board, only one can be used at any given time.
DS70005148A-page 26 2013 Microchip Technology Inc.
Hardware
2.1.8 802.11b/g Wireless Transceiver
The MEB II includes 802.11b/g wireless connectivity through the Microchip MRF24WG0MA device, as shown in Figure 2-8. The PIC32 microcontroller uses the SPI bus interface to communicate to the wireless module.
FIGURE 2-8: 802.11b/g TRANSCEIVER
2.1.9 Accelerometer
The MEB II includes an Analog Devices ADXL325BCPZ analog 3-axis accelerometer, as shown in Figure 2-9. The ADXL325 is a small, low power, 3-axis accelerometer with signal conditioned voltage outputs that measures acceleration with a minimum full-scale range of ±5g. The accelerometer uses three analog channels from the PIC32 microcontroller for the three axes (x, y and z).
FIGURE 2-9: ACCELEROMETER
2013 Microchip Technology Inc. DS70005148A-page 27
Multimedia Expansion Board II (MEB II) User’s Guide
2.1.10 Temperature Sensor
The MEB II includes a Microchip MCP9700T analog temperature sensor, as shown in Figure 2-10. The MCP9700T uses one analog channel on the PIC32 microcontroller. The MCP9700 Linear Active Thermistor™ IC is an analog temperature sensor that con-verts temperature to an analog voltage. The MCP9700 provides a low-cost solution for applications that require measurement of a relative change of temperature with ±1°C accuracy at room temperature.
FIGURE 2-10: TEMPERATURE SENSOR
2.1.11 microSD Card Slot
The MEB II includes a microSD card slot that interfaces to the PIC32 microcontroller through an SD Interface, as shown in Figure 2-11.
FIGURE 2-11: microSD CARD SLOT
2.1.12 Touch Buttons
The MEB II includes two touch buttons that use the Microchip mTouch™ technology, as shown in Figure 2-12. These two touch buttons are interfaced to the PIC32 through two analog channels.
FIGURE 2-12: TOUCH BUTTONS
Note: In an application, since Bluetooth and microSD share the same pins on the board, only one can be used at any given time.
DS70005148A-page 28 2013 Microchip Technology Inc.
Hardware
2.1.13 PICtail™ Connector
The MEB II includes an I/O expansion slot, which enables the use of several of Micro-chip's PICtail™ daughter boards, as shown in Figure 2-13. For more information on how to interface to the board, as not all daughter boards are compatible, refer to the specific PICtail daughter board schematic.
FIGURE 2-13: PICtail™ CONNECTOR
2.1.14 Push Button and User Controlled LEDs
The MEB II includes one power LED, five user-controlled LEDs, and one Push Button, as shown in Figure 2-14.
FIGURE 2-14: PUSH BUTTON AND USER CONTROLLED LEDS
2.1.15 4.3” WQVGA PCAP Touch Display Daughter Board
The 4.3" WQVGA PCAP touch display daughter board includes a 4.3" WQVGA display and a Microchip MTCH6301 touch controller to support the PCAP touch screen overlay on the display. The daughter board connects to the MEB II Development Board through a 60-pin board-to-board connector. Refer to 1.3 “Multimedia Features” for additional information on the display daughter board component layout. Figure 2-15 shows the display connector.
FIGURE 2-15: DISPLAY PANEL CONNECTOR AND BACKLIGHT CIRCUIT
2013 Microchip Technology Inc. DS70005148A-page 29
Multimedia Expansion Board II (MEB II) User’s Guide
2.1.16 MTCH6301 Touch Controller
The MTCH6301 is a turn-key PCAP controller that allows easy integration of multi-touch and gestures to create a rich user interface. The MTCH6301 supports up to 13 receive (RX) and 18 transmit (TX) channels, and sensor sizes up to 4.3". The MTCH6301 communicates with the PIC32 microcontroller through a serial I2C bus and an interrupt, as shown in Figure 2-16.
FIGURE 2-16: MTCH6301 TOUCH CONTROLLER
DS70005148A-page 30 2013 Microchip Technology Inc.
MULTIMEDIA EXPANSIONBOARD II (MEB II) USER’S
GUIDE
Appendix A. Board Layout and Schematics
This appendix provides examples of the board layout and component schematics for the Multimedia Expansion Board II (MEB II) and includes the following figures:
• Figure A-1: “MEB II Layout (Top Assembly)”
• Figure A-2: “MEB II Layout (bottom assembly)”
• Figure A-3: “4.3” WQVGA PCAP Touch Board Layout (Top Assembly)”
• Figure A-4: “4.3” WQVGA PCAP Touch Board Layout (bottom Assembly)”
• Figure A-5: “Power Supply”
• Figure A-6: “Starter Kit Connector”
• Figure A-7: “Display connector”
• Figure A-8: “EBI SRAM Memory”
• Figure A-9: “VGA Camera Sensor and 2.8V Regulator”
• Figure A-10: “24-bit Audio Codec”
• Figure A-11: “Bluetooth® Transceiver”
• Figure A-12: “802.11b/g Transceiver”
• Figure A-13: “Accelerometer”
• Figure A-14: “Temperature Sensor”
• Figure A-15: “microSD Card Slot”
• Figure A-16: “Touch Buttons”
• Figure A-17: “PICtail™ Connector”
• Figure A-18: “Push Button and User Controlled LEDs”
• Figure A-19: “Display Panel Connector and Backlight Circuit”
• Figure A-20: “Touch Controller”
2013 Microchip Technology Inc. DS70005148A-page 31
Multimedia Expansion Board II (MEB II) User’s Guide
A.1 BOARD LAYOUT
FIGURE A-1: MEB II LAYOUT (TOP ASSEMBLY)
DS70005148A-page 32 2013 Microchip Technology Inc.
Board Layout and Schematics
FIGURE A-2: MEB II LAYOUT (BOTTOM ASSEMBLY)
FIGURE A-3: 4.3” WQVGA PCAP TOUCH BOARD LAYOUT (TOP ASSEMBLY)
2013 Microchip Technology Inc. DS70005148A-page 33
Multimedia Expansion Board II (MEB II) User’s Guide
FIGURE A-4: 4.3” WQVGA PCAP TOUCH BOARD LAYOUT (BOTTOM ASSEMBLY)
DS70005148A-page 34 2013 Microchip Technology Inc.
Board Layout and Schematics
A.2 SCHEMATICSFIGURE A-5: POWER SUPPLY
16V10uF
C5616V10uF
C57
GNDGND
LPS4018-472M4.7uH
L1
0RR1
R35DNP
10K
R17
+5V
22uFC66
22uFC67
GND
0.022uF
C55
+9V
+5V
16V10uF
C580.1uFC1
2.2uF10V
C49
GNDGND
+3.3V
3V Power Supply
VIN1
GND2
VOUT 3
TAB(GND)4
U5
MCP1826S-3302E/DB
NC6
VIN11
VIN2
FB5
SW 13
SW1
PG
ND
14
SG
ND
4
VIN3
EN9
NC7
SW 16
SW 12BO
OS
T1
0
EP17
PG8
PG
ND
15
U4
MC
P1
63
22T
-500
E/N
G
GND
2013 Microchip Technology Inc. DS70005148A-page 35
Multimedia Expansion Board II (MEB II) User’s Guide
FIGURE A-6: STARTER KIT CONNECTOR
OC1/LCD_BLEN
RA1/ CAM_HREF
RA0/PUSH_BUTTON
GND
+5V+5V
GND
EBIA2
GND
+3.3V
GND
+3.3V
SDI2/INT4/CAM_PCLK/EBIA8
SS3/EBIA15
RH2/LED2
GND
+3.3V
GND
+3.3V
LCD_RESET
SDA2/AUDIO_SDA
RH11/LED5
RH14/WIFI_SLEEP
SCK3/U2TX/BT_RX
SDI4/WIFI_SDO OC5/CAM_XVCLK
AN12/SDO2/U2CTS/BT_CTS RH6/LED4/AN42
REFCLKO1/AUDIO_MCKISS4/WIFI_CS
AN32/SDI1/AUDIO_SDTO
GND
+3.3V
GND
+3.3V
SS2
LCD_DE
AN3/SDO4/WIFI_SDI
CAM_SDA
CAM_SCL
RA9
RH0/LED1
SCL2/AUDIO_SCL
SCK4/WIFI_SCK/SDI3
LCD_STBYB
SCK1/AUDIO_BICKAN5/SDO1/AUDIO_SDTI
AN6/ACCEL_XOUT
AN7/ACCEL_YOUT
AN8/ACCEL_ZOUT SCL1/TOUCH_SCL
SDA1/TOUCH_SDA
GND
+3.3V
GND
+3.3V
LCD_G4/EBID7LCD_G3/EBID6
LCD_G2/EBID5
LCD_G1
LCD_G0/EBID10
LCD_B6/EBID3
LCD_B7
LCD_G5/EBID8
LCD_B5/EBID2
LCD_B4/EBID1
LCD_B3/EBID0
LCD_B1
LCD_B2/EBID4
LCD_G6/EBID9
LCD_G7
LCD_R0/EBID15
LCD_R1
LCD_R2
LCD_R3/EBID11
LCD_R4/EBID12
LCD_R5/EBID13
LCD_R6/EBID14
LCD_R7
SD_DATA3/SD_CD
GNDGND
+5V +5V
EBIBS1
AN14/SCK2/U2RX/BT_TX
U2RTS/BT_RTS
INT0/WIFI_INT
AN23/TEMP_SENSE
RH1/LED3
RH3/AUDIO_PDN
EBIWE/LCD_PCLK
AN28/RA10
RK0/CAM_DATA0/EBIA16
RK3/CAM_DATA3/EBIA17
RK4/CAM_DATA4/EBIA18
RK5/CAM_DATA5/EBIA19
RK6/CAM_DATA6/EBIA20
RK7/CAM_DATA7/EBIA21
RK1/CAM_DATA1/EBIA1
RK2/CAM_DATA2/EBIA3
+3.3V
+3.3V
+3.3V
INT1/TOUCH_INT
AN0/CAM_LDO_SHDN
LCD_HSYNC
MCLR
EBIA0
EBIA4
EBIA5
EBIA6
EBIA7
EBIA9
EBIA10
EBIA11
EBIA12
EBIA13
EBIA14
EBICS0
EBICS1
EBICS2/LCD_CS
CAM_PWDNEBIA23
EBIBS0
CAM_VSYNC
BT_VREG_EN LCD_VSYNC
RJ0/WIFI_RESET
SD_DATA2
SD_DATA1 SD_DATA0
SD_CLK SD_CMD
TOUCH_WAKE
SS1/AUDIO_LRCK
EBIOE/LCD_PCLK
117 118
111 112
105 106
99 100
93 94
87 88
81 82
75 76
69 70
57 58
51 52
45 46
39 40
33 34
27 28
21 22
15 16
9 10
3 4
119 120
107 108
109 110
113 114
115 116
95 96
97 98
101 102
103 104
83 84
85 86
89 90
91 92
71 72
73 74
77 78
79 80
59 60
61 62
65 66
67 68
47 48
49 50
53 54
55 56
35 36
37 38
41 42
43 44
25 26
29 30
23 24
19 20
13 14
17 18
11 12
7 8
1 2
5 6
31 32
63 64
121 122
123 124
125 126
127 128
129 130
135 136
137 138
131 132
133 134
141
140
143
142
145
144
147 148
149 150
151 152
153 154
159 160
161 162
155 156
157 158
163 164
165 166
167 168
146
139
J1
FX
10
A-1
68S
-SV
R231.1K
R261.1K
R241.1K
R251.1K
LCD_B0
DS70005148A-page 36 2013 Microchip Technology Inc.
Board Layout and Schematics
FIGURE A-7: DISPLAY CONNECTOR
GND GND
+3.3V+3.3V
GND GND
+3.3V+3.3V
+5V +5V
GNDGND
GNDGND
TOUCH_WAKE
SCL1/TOUCH_SCL
SDA1/TOUCH_SDA
LCD_G1
LCD_R1
LCD_R2
LCD_R7 LCD_B7
LCD_B0
LCD_B1
LCD_G7
OC1/LCD_BLEN
LCD_DE
LCD_STBYB
LCD_VSYNC
EBIWE/LCD_PCLK
EBIOE/LCD_PCLKLCD_PCLK
LCD_HSYNC
MCLR
LCD_RESET
EBICS2/LCD_CS
LCD_R0/EBID15
LCD_B6/EBID3
LCD_B5/EBID2
LCD_B4/EBID1
LCD_B3/EBID0
LCD_B2/EBID4
LCD_G4/EBID7
LCD_G5/EBID8
LCD_G6/EBID9
LCD_R3/EBID11
LCD_R4/EBID12
LCD_R5/EBID13
LCD_R6/EBID14
LCD_G0/EBID10
LCD_G3/EBID6
LCD_G2/EBID5
LCD_PCLK
1 2
3 4
5 6
7 8
9 10
11 12
13 14
15 16
17 18
19 20
21 22
23 24
25 26
27 28
29 30
31 32
33 34
35 36
37 38
39 40
41 42
43 44
45 46
47 48
49 50
51 52
53 54
55 56
57 58
59 60
61
62J4
DF
12(3
.0)-
60D
P-0
.5V
(86)
12
3J9
INT1/TOUCH_INT
2013 Microchip Technology Inc. DS70005148A-page 37
Multimedia Expansion Board II (MEB II) User’s Guide
FIGURE A-8: EBI SRAM MEMORY
A01
A12
A23
A34
A45
CE6
I/O07
I/O18
I/O29
I/O310
VDD11
GND12
I/O413
I/O514
I/O615
I/O716
WE17
A518
A619
A720
A821
A922 A10 23
A11 24
A12 25
A1326
A1427
A1828
I/O829
I/O9 30
I/O10 31
I/O1132
VDD33
GND34
I/O1235
I/O13 36
I/O14 37
I/O15 38
LB39
UB40
OE41
A15 42
A16 43
A17 44U11
IS61WV51216BLL-10TLI
EBIA2
RK1/CAM_DATA1/EBIA1
RK2/CAM_DATA2/EBIA3
EBIA0
EBIA4
EBIA5
EBIA6
SDI2/INT4/CAM_PCLK/EBIA8
SS3/EBIA15
RK0/CAM_DATA0/EBIA16
RK3/CAM_DATA3/EBIA17
RK4/CAM_DATA4/EBIA18
EBIA7
EBIA9 EBIA10
EBIA11
EBIA12
EBIA13
EBIA14
EBIWE/LCD_PCLK
EBICS0
EBIBS1
EBIBS0
LCD_R0/EBID15
LCD_B6/EBID3
LCD_B5/EBID2
LCD_B4/EBID1
LCD_B3/EBID0
LCD_B2/EBID4 LCD_R3/EBID11
LCD_R4/EBID12
LCD_R5/EBID13
LCD_R6/EBID14
LCD_G0/EBID10
LCD_G4/EBID7 LCD_G5/EBID8
LCD_G6/EBID9LCD_G3/EBID6
LCD_G2/EBID5
0.1uFC27
0.1uFC26
0.01uFC31
0.01uFC30
GND
GND+3.3V
+3.3V
44pin-TSOP
EBIOE/LCD_PCLK
A01
A12
A23
A34
A45
CE6
I/O07
I/O18
I/O29
I/O310
VDD11
GND12
I/O413
I/O514
I/O615
I/O716
WE17
A518
A619
A720
A821
A922 A10 23
A11 24
A12 25
A1326
A1427
A1828
I/O8 29
I/O9 30
I/O10 31
I/O1132
VDD33
GND34
I/O12 35
I/O13 36
I/O14 37
I/O1538
LB39
UB40
OE41
A15 42
A16 43
A17 44U12
IS61WV51216BLL-10TLI
EBICS1
EBIA2
RK1/CAM_DATA1/EBIA1
RK2/CAM_DATA2/EBIA3
EBIA0
EBIA4
EBIA5
EBIA6
SDI2/INT4/CAM_PCLK/EBIA8
EBIA7
EBIA9
EBIWE/LCD_PCLK
LCD_B6/EBID3
LCD_B5/EBID2
LCD_B4/EBID1
LCD_B3/EBID0
LCD_B2/EBID4
LCD_G4/EBID7
LCD_G3/EBID6
LCD_G2/EBID5
SS3/EBIA15
RK0/CAM_DATA0/EBIA16
RK3/CAM_DATA3/EBIA17
RK4/CAM_DATA4/EBIA18
EBIA10
EBIA11
EBIA12
EBIA13
EBIA14
EBIBS1
EBIBS0
LCD_R0/EBID15
LCD_R3/EBID11
LCD_R4/EBID12
LCD_R5/EBID13
LCD_R6/EBID14
LCD_G0/EBID10
LCD_G5/EBID8
LCD_G6/EBID9
0.1uFC28
0.01uFC32
GND
+3.3V
0.1uFC29
0.01uFC33
+3.3V
GND
44pin-TSOP
EBIOE/LCD_PCLK
DS70005148A-page 38 2013 Microchip Technology Inc.
Board Layout and Schematics
FIGURE A-9: VGA CAMERA SENSOR AND 2.8V REGULATOR
OVM7690-R20A
DATA4E3
DATA5D3
DATA0B3
DATA7E1
DATA6E2
DOVDD E4
PCLKD1
HREFC1
VSYNCC2
VREF1 A4
VREF2 A3
AGNDC3
AVDD A2
XVCLKD2
PWDNA1
SCLB2
SDAB1
DATA1B4
DATA2C4
DATA3D4
U6
CAM_GND GND
0.1uFC8
0.1uFC7
0.1uFC6
0.1uFC5
DOVDD
AVDD
+3.3V
0.1uFC2
16V10uF
C59
3.3uH
L2
ADJ 4
Vout 5
GND2
SHDN3
Vin1
U7
TC1071
GND
470KR32 3.3uH
L3
3.3uH
L4
0.1uFC3
16V10uF
C60
0.1uFC4
16V10uF
C61
GND
GND
AVDD
348kR33
+2.8V
CAM_GND
TP1
TP3
TP2RA1/ CAM_HREF
RK1/CAM_DATA1/EBIA1
RK2/CAM_DATA2/EBIA3
SDI2/INT4/CAM_PCLK/EBIA8
RK0/CAM_DATA0/EBIA16
RK3/CAM_DATA3/EBIA17
RK4/CAM_DATA4/EBIA18
RK5/CAM_DATA5/EBIA19
RK6/CAM_DATA6/EBIA20
CAM_PWDN
CAM_VSYNC
OC5/CAM_XVCLK
CAM_SDA
CAM_SCL
RK7/CAM_DATA7/EBIA21
DOVDD
AN0/CAM_LDO_SHDN
2013 Microchip Technology Inc. DS70005148A-page 39
Multimedia Expansion Board II (MEB II) User’s Guide
FIGURE A-10: 24-BIT AUDIO CODEC
0.1uFC14
0.1uFC13
GND
0.1uFC16
16V10uF
C64
FB3
0R
R4
0.1uFC15
GND AGND
SS1/AUDIO_LRCK
SDA2/AUDIO_SDA
REFCLKO1/AUDIO_MCKI
SCL2/AUDIO_SCL
AN5/SDO1/AUDIO_SDTI
MPWR11
LIN1/DMDAT2
RIN1/DMCLK3
PDN4
CSN/SDA5
CCLK/SCL6
CDTIO/CAD07
SDTI8
LRCK9
BICK10
SDTO11
TVDD12
VSS213
MCKI14
MCKO15
I2C16
SVDD17
VSS418
SPN 19
SPP 20
DVDD21
HPL 22
HPR 23PVEE24
VSS325
CP 26
CN 27
AVDD28
VSS129
REGFIL30
VCOM31
LIN3 32
RIN3 33
LIN2 34
RIN2 35
MPWR236
T-P
AD
37
U1
AK4953A
SPP
SPN
HPR
2.2uF10V
C42
2.2uF10V
C41
AGND
2.2uF10V
C40
2.2uF10V
C39
0.1uFC220.1uF
C21
0.1uFC19
0.1uFC20
SVDD
CAVDD
SCK1/AUDIO_BICK
RH3/AUDIO_PDN
AGND
+3.3V
0.1uFC12
16V10uF
C62
FB1
0RR2
0.1uFC11
GND AGND
TVDD
+3.3V
CAVDD
SVDD
TVDD
0.1u
FC
1816
V10
uF
C65
FB
4 0RR
5
0.1u
FC
17
GN
DA
GN
D+1.
8V
+3.3V
+3.3V
+3.3V
+3.3V
DV
DD
DVDD+1.8V
+3.3V
TVDD
VIN
3
GN
D1
VO
UT
2U
10
MC
P17
00T
_180
2E/T
T
1uF
C34
1uF
C35
GN
DG
ND
+3.
3V
+1.
8V O
utpu
t
AGND
MPWR2
LIN2
HPL
TP8
TP7
TP6
TP5
AN32/SDI1/AUDIO_SDTO
0R
R3
FB2
16V10uF
C63
TP4
AGND
AGND
SPKR OUT
HP OUT
MIC IN
HPL
MPWR2
LIN2
2.2KR31
SPN
SPP
(STEREO)
(STEREO)
(MONO)
1uF
C36
C68
47uF, Tant
C69
47uF, Tant
R27
6.8R
R28
6.8R
R30100R
R29100R
C510.22uF
C500.22uF
HPR
AGND
AGND
5
1
4
3
2
J6
5
1
4
3
2
J5
5
1
4
3
2
J7
DS70005148A-page 40 2013 Microchip Technology Inc.
Board Layout and Schematics
FIGURE A-11: BLUETOOTH® TRANSCEIVER
FIGURE A-12: 802.11b/g TRANSCEIVER
NC1
GND2
VDD_AUX3
PIO_04
PIO_35
PIO_16
VDD_DIG7
PIO_48
PIO_29
PIO_510
VDD_PADS11
VREG_EN_RST#12
VDD_IN13
VREG_OUT_HV14
UART_TX15
UART_RX16
UART_RTS17
UART_CTS 18
VDD_RADIO 19
SPI_PCM#_SEL 20
SPI_MOSI 21
CLK 22
SPI_CS# 23
SPI_MISO 24
GN
D25
GN
D26
GN
D27
GN
D28
U2
Bluetooth_BTM805CL2BGND
2.2uF10V
C43
2.2uF10V
C44
2.2uF 10VC45
GND+3.3V
0.1uFC23
2.2uF10V
C47
GND
2.2uF10V
C48
2.2uF10V
C46
GND
AN14/SCK2/U2RX/BT_TX
AN12/SDO2/U2CTS/BT_CTS
U2RTS/BT_RTS
TP14
TP15
TP16
BT_VREG_EN
SCK3/U2TX/BT_RX
+3.3V
GND
+3.3V
1.0uF
C37
1.0uF
C38
+3.3V
4.7KR16
10K
R22
4.7KR12
4.7KR13
4.7KR14
4.7KR15
INT0/WIFI_INT
SS4/WIFI_CS
SDI4/WIFI_SDO
SCK4/WIFI_SCK/SDI3
RH14/WIFI_SLEEP
TP9
TP10
TP11
TP12
TP13
GND
GND
GND
GND
GND1
NC2
NC3
RESET7
NC8
NC9
GND10
NC11
NC12
NC13
NC14
NC15
WP16
VDD17
GND18 GND 19
HIBERNATE 20
NC 21
NC 22
CS 23
NC24
GND25
DEBUG_RX 26
DEBUG_TX 27
GND 28
VDD 29
GND 30
NC 31
SDO32
INT33
SCK34
SDI35
GND36
NC4
NC5
NC6
U3
MRF24WG0MA-I/RM
RJ0/WIFI_RESET
AN3/SDO4/WIFI_SDI
2013 Microchip Technology Inc. DS70005148A-page 41
Multimedia Expansion Board II (MEB II) User’s Guide
FIGURE A-13: ACCELEROMETER
FIGURE A-14: TEMPERATURE SENSOR
0.1uF
C10
+3.3V
GND
GND
AN6/ACCEL_XOUT
AN7/ACCEL_YOUT
AN8/ACCEL_ZOUT
NC
1
ST2
COM3
NC
4
COM5COM6COM7
ZOUT8
NC
9
YOUT10
NC
11
XOUT12
NC
13
VS14 VS15
NC
16
EP17
U9 ADXL325
GND
GND
C5247nF
C5347nF
C5447nF
GND3
VOUT 2VDD1
U8
MCP9700T-E/TT
+3.3V
0.1uFC24
GND
0.1uFC25
120R
R34
GND
AN23/TEMP_SENSE
DS70005148A-page 42 2013 Microchip Technology Inc.
Board Layout and Schematics
FIGURE A-15: microSD CARD SLOT
FIGURE A-16: TOUCH BUTTONS
2908
-05W
B-M
G
8
5
2
7
6
3
4
1
J8
10KR18
10KR19
10KR20
10KR21 0.1uF
C9
GND
GND
+3.3V
SD_DATA3/SD_CD
SD_DATA2
SD_DATA1
SD_DATA0
SD_CLK
SD_CMD
B2
B1+
_AN0/CAM_LDO_SHDN
RH6/LED4/AN42
2013 Microchip Technology Inc. DS70005148A-page 43
Multimedia Expansion Board II (MEB II) User’s Guide
FIGURE A-17: PICtail™ CONNECTOR
+3.3V
+3.3V
GND
SS4/WIFI_CS
RA9
SCL2/AUDIO_SCL
SS2
SCL1/TOUCH_SCL
SDA1/TOUCH_SDA
SCK4/WIFI_SCK/SDI3
SCK4/WIFI_SCK/SDI3
SDA2/AUDIO_SDA
1 2
3 4
5 6
7 8
9 10
11 12
13 14
15 16
17 18
19 20
21 22
23 24
25 26
27 28
J2
SDI2/INT4/CAM_PCLK/EBIA8
SS3/EBIA15
SCK1/AUDIO_BICK
SDI4/WIFI_SDO
SS1/AUDIO_LRCK
SS1/AUDIO_LRCK
AN14/SCK2/U2RX/BT_TX
AN12/SDO2/U2CTS/BT_CTS
AN32/SDI1/AUDIO_SDTO
AN3/SDO4/WIFI_SDI
AN28/RA10 AN3/SDO4/WIFI_SDI
AN5/SDO1/AUDIO_SDTI
TP18
AN0/CAM_LDO_SHDN
SCK3/U2TX/BT_RXSCK3/U2TX/BT_RX
DS70005148A-page 44 2013 Microchip Technology Inc.
Board Layout and Schematics
FIGURE A-18: PUSH BUTTON AND USER CONTROLLED LEDS
Green
D2
Red
D3
Red
D4
Red
D5
Red
D6
Red
D7
GND
470R
R6
470R
R7
470R
R8
470R
R9
470R
R10
470R
R11
+3.3V
S1
RH11/LED5
RH0/LED1
RH1/LED3
RH2/LED2
RA0/PUSH_BUTTON
RH6/LED4/AN42
2013 Microchip Technology Inc. DS70005148A-page 45
Multimedia Expansion Board II (MEB II) User’s Guide
FIGURE A-19: DISPLAY PANEL CONNECTOR AND BACKLIGHT CIRCUIT
MCP1650S-E/MS
CS3
NC6
FB4
EXT1
GND2
SHDN5
NC7
VIN8
U1
16V10uF
C1
10KR3
GND
GND
LPS3015-153ML
15uHL1
AO3424Q1 7.68K
R2SD107WS-7-F
D1
GNDGND
LED+
470RR4
LED-
10uF35V
C3
0.5R
R1
OC1/LCD_BLENGND
+3.3V
XF2M-4015-1A
38
35
32
29
26
23
20
17
14
11 8 5 239
40
36
37
27
28
30
31
33
34
24
25
15
16
18
19
21
22
12
13 3467910 1
J2
+3.3
V
GN
D
LC
D_R
0
LC
D_R
1
LC
D_R
2
LC
D_R
3
LC
D_R
4
LC
D_R
5
LC
D_R
6
LC
D_R
7
LC
D_G
4
LC
D_G
1
LC
D_G
0
LC
D_G
2
LC
D_G
3
LC
D_G
5
LC
D_G
6
LC
D_G
7
LC
D_B
0
LC
D_B
1
LC
D_B
4
LC
D_B
3
LC
D_B
2
LC
D_B
7
LC
D_B
6
LC
D_B
5
LCD
_PC
LK
LC
D_D
E
LCD
_VS
YN
C
LCD
_HS
YN
C
LC
D_R
ES
ET
LE
D+
LE
D-
LC
D_C
S
16V10uF
C2
GN
D
GN
D
DS70005148A-page 46 2013 Microchip Technology Inc.
Board Layout and Schematics
FIGURE A-20: TOUCH CONTROLLER
SDA1
TX172
TX163
TX154
TX145
VSS6
VCAP7
INT8
NC9
RX1210
RX1111
TX1312
TX1213
RX1014
RX915
VSS16
VDD17
RESET18
RX819
RX720
RX621
RX522
RX423
RX324
RX225
RX126
RX027
VDD28
VSS29
TX330
TX231
TX132
TX033
TX434
TX835
TX736
TX637
TX538
VSS39
VDD40
TX941
TX1042
TX1143
SCL44
U2
MTCH6301
0.1uFC5
0.1uFC4
0.1uFC610uF
C7
52271
-067
93
2
4
1
5
6
J3+3.3V
GND
SCL1/TOUCH_SCL
SDA1/TOUCH_SDA
INT1/TOUCH_INT
TOUCH_WAKE
SCL1/TOUCH_SCL
XF
2M-3
015-
1A
29
26
23
20
17
14
11
8
5
2
2728
30
2425
1516
1819
2122
1213
34
67
910
1
J4
T0T1
T2T3
T4T5
T6T7
T8
GND
T9T10
T11T12
T13T14
T15T16
CS0CS1
CS2CS3
CS4CS5
CS6CS7
CS8CS9
T1
T3
T5
T7
T9
T11
T13
T15
CS0
CS2
CS4
CS6
CS8
T0
T2
T4
T6
T8
T10
T12
T14
T16
CS1
CS3
CS5
CS7
CS9
GND
GND GND
+3.3V+3.3V
GND
+3.3V
SDA1/TOUCH_SDA
INT1/TOUCH_INT
MCLR
PICkit Serial AnalyzerConnection
+3.3V
GND
NC1
+V2
GND3
SDA4
SCL5
INT 6
J5 DNP
( DNP )
2013 Microchip Technology Inc. DS70005148A-page 47
Multimedia Expansion Board II (MEB II) User’s Guide
NOTES:
DS70005148A-page 48 2013 Microchip Technology Inc.
MULTIMEDIA EXPANSIONBOARD II (MEB II) USER’S
GUIDE
Appendix B. Bill of Materials
TABLE B-1: MULTIMEDIA EXPANSION BOARD II (MEB II) BILL OF MATERIALSQty. Reference Description Manufacturer Part No.
27 C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, C11, C12, C13, C14, C15, C16, C17, C18, C19, C20, C21, C22, C23, C24, C25, C26, C27
Cap, Ceramic, 0.1 µF, 50V X7R TDK Corporation C1608X7R1H104M
2 C30, C31 Cap, Ceramic, 0.01 µF, 50V X7R TDK Corporation C1608X7R1H103M
5 C34, C35, C36, C37, C38
Cap, Ceramic, 1 µF, 16V X5R TDK Corporation C1608X5R1C105K
11 C39, C40, C41, C42, C43, C44, C45, C46, C47, C48, C49
CAP CER 2.2 µF 10V 20% X5R 0603 TDK Corporation C1608X5R1A225M/0.80
2 C50, C51 CAP CER 0.22 µF 16V Y5V 0603 Murata Electronics North America GRM188F51C224ZA01D
3 C52, C53, C54
CAP CER 0.047 µF 50V 10% X7R 0603 TDK Corporation C1608X7R1H473K080AA
1 C55 CAP CER 0.022 µF 50V 20% X7R 0603 Murata Electronics North America GRM188R71H223MA01D
10 C56, C57, C58, C59, C60, C61, C62, C63, C64, C65
Cap, Ceramic, 10 µF, 16V X5R Taiyo Yuden EMK212BJ106MG-T
2 C66, C67 CAP CER 22 µF 16V 10% X5R 0805 TDK Corporation C2012X5R1C226K
2 C68, C69 CAP TANT 47 µF 6.3V 20% 1206 Kemet T494A476M006AT
5 R1, R2, R3, R4, R5
RES 0.0 OHM 1/10W 0603 SMD Rohm Semiconductor MCR03EZPJ000
6 R6, R7, R8, R9, R10, R11
RES 470 OHM 1/10W 1% 0603 SMD Rohm Semiconductor MCR03EZPFX4700
5 R12, R13, R14, R15, R16
RES 4.70K OHM 1/10W 1% 0603 SMD Panasonic - ECG ERJ-3EKF4701V
8 R17, R18, R19, R20, R21, R22, R44, R45
RES 10K OHM 1/10W 1% 0603 SMD Stackpole Electronics Inc RMCF0603FT10K0
6 R23, R24, R25, R26, R37, R38
RES 1.10K OHM 1/10W 1% 0603 SMD Panasonic Electronic Components ERJ-3EKF1101V
2 R27, R28 RES TF 6.8 OHM 1% 0.1W 0603 Stackpole Electronics Inc RMCF0603FT6R80
2 R29, R30 Res, 100 Ohm, 1/10W 1% Yageo RC0603FR-07100RL
1 R31 RES 2.20K OHM 1/10W 1% 0603 SMD Rohm Semiconductor MCR03EZPFX2201
1 R32 Res, 470K 1/10W 1% Panasonic - ECG ERJ-3EKF4703V
1 R33 RES TF 348K OHM 1% 0.1W 0603 Stackpole Electronics Inc RMCF0603FT348K
1 R34 Res, 120 Ohm, 1/10W 1% Stackpole Electronics Inc RMCF0603FT120R
1 R36 RES 100K OHM 1/10W 1% 0603 SMD Stackpole Electronics Inc RMCF0603FT100K
2013 Microchip Technology Inc. DS70005148A-page 49
Multimedia Expansion Board II (MEB II) User’s Guide
5 R39, R40, R41, R42, R43
RES 150 OHM 1/10W 1% 0603 SMD TE 3-1676481-5
1 D1 DIODE SCHOTTKY 1A 100V SMA Micro Commercial Co. SS110-TP
1 D2 LED, SMD, GRN, 0603 package Kingbright Corp. APT1608SGC
5 D3, D4, D5, D6, D7
LED, SMD, RED, 0603 package Kingbright Corp. APT1608EC
1 J1 Hirose FX10_ 168 pin Receptacle_w/ESK MH Hirose Electric Co. Ltd. FX10A-168S-SV
1 J2 CONN FEMALE 28POS DL .1" R/A TIN Sullins Connector Solutions PPTC142LJBN-RC
1 J3 CONN POWER JACK 2.5X5.5MM HI CUR CUI Inc PJ-002BH-SMT
1 J4 CONN HDR 60POS 0.5MM SMD GOLD Hirose Electric Co. Ltd. DF12(3.0)-60DP-0.5V(86)
3 J5, J6, J7 CONN JACK STEREO 5POS 3.5MM SMD Switchcraft Inc. 35RASMT4BHNTRX
1 J8 CONN MINI MICRO-SD 8PIN PCB GOLD Amphenol 101-00581-59
1 J9 CONN HEADER 3POS .100 RT/A SMD Sullins Connector Solutions GBC03SBSN-M89
1 J10 CONN MOD JACK R/A 6P6C SMD Amphenol RJLSE6202101T
1 L1 4.7uH 20% CoilCraft LPS4018-472M
3 L2, L3, L4 INDUCTOR MULTILAYER 3300NH 0603 Abracon Corporation AIML-0603-3R3K-T
4 FB1, FB2, FB3, FB4
FERRITE CHIP 600 OHM 500MA 0805 TDK Corporation MMZ2012Y601B
1 U1 CODEC (24bit Stereo) AKM AK4953A
1 U2 Dual-mode Bluetooth HCI Flaircomm FLC_BTM805
1 U3 TXRX RF 2.4GHZ PCB ANT 802.11B Microchip Technology Inc. MRF24WG0MA-I/RM
1 U4 IC REG BUCK SYNC 5V 2A 16-VQFN Microchip Technology Inc. MCP16322T-500E/NG
1 U5 IC LDO REG 1000MA 3.3V SOT223-3 Microchip Technology Inc. MCP1826S-3302E/DB
1 U6 SENSOR CAMERA CMOS 20CAMERACUBE OmniVision Technologies Inc OVM7690-R20A
1 U7 IC REG LDO ADJ 50MA SOT23A-5 Microchip Technology Inc. TC1071VCT713
1 U8 LP Linear Active Thermistor, SOT-23-3 Microchip Technology Inc. MCP9700T-E/TT
1 U9 Accelerometer ADXL325 Analog Devices Inc ADXL325BCPZ-RL7
1 U10 LDOVoltage Regulator, 1.8V, 250mA Microchip Technology Inc. MCP1700T-1802E/TT
1 U11 SRAM 16M (1Mx16) 10ns Async SRAM ISSI, Integrated Silicon Solution Inc. IS61WV102416BLL-10TLI
1 S1 SWITCH TACTILE SPST-NO 0.05A 12V C&K Components PTS635SK25SMTR LFS
1 GND TP-115*50_SMT Keystone Electronics 5015
TABLE B-2: DISPLAY BOARD BILL OF MATERIALSQty. Reference Description Manufacturer Part No.
1 4.3" Display 4.3" Diplay w/ TP AMTouch USA P3003-02-1-01 Touch Panel/LCD assembly
3 C1, C2, C7 CAP CER 10 µF, 16V X5R Taiyo Yuden EMK212BJ106MG-T
1 C3 CAP CER 10 µF 35V 10% X5R 1206 Taiyo Yuden GMK316BJ106KL-T
3 C4, C5, C6 CAP CER .10 µF 50V X7R 0603 TDK Corporation C1608X7R1H104M
1 D1 DIODE SCHOTTKY 30V 100 mA SOD323 Diodes Inc. SD107WS-7-F
1 J1 CONN RCPT 60 POS 0.5 mm SMD GOLD Hirose Electric Co. Ltd. DF12(30)-60DS-0.5V(86)
1 J2 CONN FPC 40 POS 0.5 mm PITCH SMD Omron Electronics Inc., EMC Div XF2M-4015-1A
1 J4 CONN FPC 30 POS 0.5 mm PITCH SMD Omron Electronics Inc., EMC Div XF2M-3015-1A
1 L1 15 µH ±20% CoilCraft LPS3015-153ML
1 Q1 MOSFET N-CH 30V 2A SOT23 Alpha & Omega Semiconductor Inc. AO3424
1 R1 RES .50 Ohm 1/3W 1% 0805 SMD Susumu RL1220S-R50-F
1 R2 RES 7.68K Ohm 1/10W 1% 0603 SMD Panasonic - ECG ERJ-3EKF7681V
1 R3 RES 10K Ohm 1/10W 1% 0603 SMD Stackpole Electronics Inc. RMCF0603FT10K0
1 R4 RES 470 Ohm 1/10W 1% 0603 SMD Rohm Semiconductor MCR03EZPFX4700
1 U1 MCP1650-E/MS_BOOST Microchip Technology Inc. MCP1650S-E/MS
1 U2 MTCH6301 Microchip Technology Inc. MTCH6301-I/PT
J3 CONN FFC 6 POS 1 mm R/A ZIF SMD Molex Connector Corporation 52271-0679
J5 PICkit SERIAL ANALYZER_CONN HEADER 6 POS SMT .100 R/A 30 AU
MH1, MH2 0.120 Dia hole, unplated DNP DNP (120 mil unplated hole)
TABLE B-1: MULTIMEDIA EXPANSION BOARD II (MEB II) BILL OF MATERIALS (CONTINUED)Qty. Reference Description Manufacturer Part No.
DS70005148A-page 50 2013 Microchip Technology Inc.
2013 Microchip Technology Inc. DS70005148A-page 51
NOTES:
DS70005148A-page 52 2013 Microchip Technology Inc.
AMERICASCorporate Office2355 West Chandler Blvd.Chandler, AZ 85224-6199Tel: 480-792-7200 Fax: 480-792-7277Technical Support: http://www.microchip.com/supportWeb Address: www.microchip.com
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Austin, TXTel: 512-257-3370
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DetroitNovi, MI Tel: 248-848-4000
Houston, TX Tel: 281-894-5983
IndianapolisNoblesville, IN Tel: 317-773-8323Fax: 317-773-5453
Los AngelesMission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608
New York, NY Tel: 631-435-6000
San Jose, CA Tel: 408-735-9110
Canada - TorontoTel: 905-673-0699 Fax: 905-673-6509
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China - ChongqingTel: 86-23-8980-9588Fax: 86-23-8980-9500
China - HangzhouTel: 86-571-2819-3187 Fax: 86-571-2819-3189
China - Hong Kong SARTel: 852-2943-5100 Fax: 852-2401-3431
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China - QingdaoTel: 86-532-8502-7355Fax: 86-532-8502-7205
China - ShanghaiTel: 86-21-5407-5533 Fax: 86-21-5407-5066
China - ShenyangTel: 86-24-2334-2829Fax: 86-24-2334-2393
China - ShenzhenTel: 86-755-8864-2200 Fax: 86-755-8203-1760
China - WuhanTel: 86-27-5980-5300Fax: 86-27-5980-5118
China - XianTel: 86-29-8833-7252Fax: 86-29-8833-7256
China - XiamenTel: 86-592-2388138 Fax: 86-592-2388130
China - ZhuhaiTel: 86-756-3210040 Fax: 86-756-3210049
ASIA/PACIFICIndia - BangaloreTel: 91-80-3090-4444 Fax: 91-80-3090-4123
India - New DelhiTel: 91-11-4160-8631Fax: 91-11-4160-8632
India - PuneTel: 91-20-3019-1500
Japan - OsakaTel: 81-6-6152-7160 Fax: 81-6-6152-9310
Japan - TokyoTel: 81-3-6880- 3770 Fax: 81-3-6880-3771
Korea - DaeguTel: 82-53-744-4301Fax: 82-53-744-4302
Korea - SeoulTel: 82-2-554-7200Fax: 82-2-558-5932 or 82-2-558-5934
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SingaporeTel: 65-6334-8870Fax: 65-6334-8850
Taiwan - Hsin ChuTel: 886-3-5778-366Fax: 886-3-5770-955
Taiwan - KaohsiungTel: 886-7-213-7830
Taiwan - TaipeiTel: 886-2-2508-8600 Fax: 886-2-2508-0102
Thailand - BangkokTel: 66-2-694-1351Fax: 66-2-694-1350
EUROPEAustria - WelsTel: 43-7242-2244-39Fax: 43-7242-2244-393Denmark - CopenhagenTel: 45-4450-2828 Fax: 45-4485-2829
France - ParisTel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany - DusseldorfTel: 49-2129-3766400
Germany - MunichTel: 49-89-627-144-0 Fax: 49-89-627-144-44
Germany - PforzheimTel: 49-7231-424750
Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781
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Netherlands - DrunenTel: 31-416-690399 Fax: 31-416-690340
Poland - WarsawTel: 48-22-3325737
Spain - MadridTel: 34-91-708-08-90Fax: 34-91-708-08-91
Sweden - StockholmTel: 46-8-5090-4654
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Worldwide Sales and Service
10/28/13