multilayer thin film technology for the sts electronic high density interconnection e. atkin moscow...
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Multilayer thin film technology for the STS electronic high density
interconnection
E. Atkin Moscow Engineering Physics Institute (State University) – MEPhI,
M. Merkin, A.Voronin Skobeltsyn Institute of Nuclear Physics / Moscow State University – SINP / MSU,
A. KazakAvangard
CBM Collaboration meeting
March 9-12, 2005
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The Interconnection gap• Requires new high density
Interconnect technologies
IC scaling
Time
Siz
e sc
alin
g
PCB scaling
Advanced PCB
Reduced Gap
Thin film lithography based
Interconnect technology
By Eric BeyneIMEC
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WHY ?
• Material budget• 25 um pitch• space flexibility• reliability of the contact• stress reliability• special bonding equipment• Difficult to repair
By Eric Beyne
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Bonding technology
IC
Bond pitch :
100 25m
SPCBFPCB
contact pitch :
800100 m• Down to 25m pitch
Wire bonding
• High density
substrate
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BONDING THIN FILM Technology
By Avangard company
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High Density Thin Film Interconnects for Digital Applications
•Technology :– Substrates : 150 mm Ø, Si, glass, ceramic, high Tg laminate or metal.
– Cu lines, 3-5m thick, down to 10m wide lines & spaces– Metal finish top surface : Cu/Ni/Au– Power & ground layers : 2 m thick Al – Integrated decoupling
capacitors (0.75 nF/mm2)
– Automated design
methodology
By Eric BeyneIMEC, Kapeldreef 75, B-3001 Leuven
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High Density Thin Film Interconnects By Eric Beyne
IMEC, Kapeldreef 75, B-3001 Leuven
Si w afer
Cu/low K interconnect
Chip passivation
BCB Dielectric
Electroplated Cu
Electroplated Ni (UBM )
Electroplated solder bump
Cu bond pad
Solder balls <100 um
60 um flip chip bump pitch
BCB -benzo-cyclobutene
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Flexible PC board&solderingby Avangard company
• polyimide• precise soldering up to 20um pitch to create high reliability contacts between the detector and chip• low profile• price is 1Euro**/front-end channel • passive SMD components close the chip• possibility to create capacitors and inductances by polyimide-metal film• micro connectors 600um high and 300um pitch – easy to repair • SIS ( system in the package)• high frequency interconnection
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Multilayer thin film technology RrontEnd
module RND
Micro connector
Silicon detector
FrontEnd chipPolyimide board (options)
Substrate (?)
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Option 2
First layer Second layer
10 – Soldering 65
4
3
21
87 87 9
79
7
1. Chip
2. Additional protection
3. First Insulate layer
4. First conductor layer
5. Second Insulate layer
6. Second conductor layer
7. Soldering pads
8. Internal Metallized hole
9. Second layer soldering hole
10.Soldered contact
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Option 2Steps
• Cu pad film on the chip
• Polyimide board production
• Chip mounting
• ? Substrate production, polyimide board with the chip mounting onto substrate
• Testing with micro connector
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Option 3
3
76
5 4
1 8 2
1. Substrate
2. Chip
3. Glue
4. Polyimide lacquer
5. First conductor layer
6. Polyimide
7. Second conductor layer
8. Evaporated contact
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Summary
• Thin film technology interconnection RND
started
• First result expected this year
• Expected price is 1Euro/channel
• We really need to test interconnection technologies