msc8156 mezzanine detailed design specification€¦ · msc8156 mezzanine detailed design...

© Freescale Semiconductor, Inc., 2010. All rights reserved.

Freescale SemiconductorTechnical Data

1 Overview

1.1 ScopeThis document provides a detailed design description of the MSC8156 Mezzanine card. It also describes the architecture, interconnections, and used components.

1.2 ReferencesThe documents listed below are referenced in this document:

1. MSC8156 Reference Manual

2. MSC8156 Hardware Specification

3. PICMG AMC.0 R2.0 “Advanced Mezzanine Card Base Specification”

4. PICMG AMC.2 “PCIe Advanced Mezzanine Card Base Specification”

5. PICMG AMC.4 “SRIO Advanced Mezzanine Card Base Specification”

6. Freescale 815x Power Calculator

Document Number: MSC8156MDDSRev. 0, 01/2010

Contents1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.1. Scope. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.2. References. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

2. MSC8156 Mezzanine . . . . . . . . . . . . . . . . . . . . . . . . . .23. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

3.1. SerDes Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 3.2. Ethernet Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 3.3. MSC8156 DDR-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 3.4. MSC8156 UART Interface . . . . . . . . . . . . . . . . . . . .12 3.5. MSC8156 JTAG Interface . . . . . . . . . . . . . . . . . . . .12 3.6. Reset and Configuration Signals. . . . . . . . . . . . . . . .12 3.7. I2C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 3.8. Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 3.9. SPI Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 3.10. GPIO/Timers and Interrupts . . . . . . . . . . . . . . . . . .19 3.11. Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 3.12. Mezzanine Connector . . . . . . . . . . . . . . . . . . . . . . .21 3.13. Mechanicals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24

4. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

MSC8156 MezzanineDetailed Design Specification

MSC8156 Mezzanine Detailed Design Specification, Rev. 0

2 Freescale Semiconductor

MSC8156 Mezzanine

1.3 Definitions, Acronyms, and Abbreviations

2 MSC8156 MezzanineThe MSC8156 Mezzanine is a MSC8156 based daughter card that can be plugged into the Freescale Common AMC base card. The mezzanine is populated with the MSC8156 and DDR3 memory. All active interfaces, such as SRIO, Ethernet, control, clocking, and power are routed to the high-speed connector (HSC), that connects the mezzanine to the AMC base card.

For high-bandwidth operation, the MSC8156 routes two ×4 3.125 GHz SRIO interfaces (SRIO0 and SRIO1) to the HSC. The SRIO1 interface can be configured as an option to support PCIe.

Control and data traffic are handled by two RGMII interfaces, which are routed from the MSC8156 to the HSC.

Auxiliary functions like reset/control/GPIO/timer and clocking are routed to the HSC. These are connected to the generic mezzanine control bus on the AMC base card, which in turn connects to the system FPGA. The FPGA drives the reset and control of the MSC8156 mezzanine. Power is provided to the card through the HSC connector. All voltages are generated from the base card.

Table 1. Definitions, Acronyms, and Abbreviations

AMC Advanced Mezzanine Card (AdvancedMC™)

ATCA Advanced Telecommunications Computing Architecture

BDM Background Debug Mode

CPLD Complex Programmable Logic Device

DIP Dual In Line Package

DNP Do Not Populate

DSP Digital Signal Processor

EEPROM Electrically Erasable Programmable Read Only Memory

GETH Giga-bit Ethernet

HSC High Speed Connector

HW Hardware

I2C (bus) Inter-Integrated Circuit

RCW Reset Configuration Word

sRIO Serial Rapid IO

UART Universal Asynchronous Receiver/Transmitter

UEC UCC Gigabit Ethernet Controller

MTCA Micro Telecommunications Computing Architecture (MicroTCA™)


Freescale Semiconductor 3

Features

Figure 1 shows the MSC8156 mezzanine architecture.

Figure 1. MSC8156 Mezzanine Architecture

3 Features• Target use

— Mezzanine card for AMC base card

— Software development platform for baseband, media gateway, and RNC solutions

— Design reference and enablement platform for customers and third parties

• Form factor

— 70mm × 39mm

• Connectivity

— 1× SRIO interfaces (×4) connected to the HSC

— 1× SRIO/PCIe multiplexed interface (×4) connected to the HSC

— 2× RGMII interfaces connected to the HSC

— 2× DDR3 interfaces each with 512 Mbytes of 64-bit DDR3 memory

— I2C interface for boot connected to the HSC

— UART connected to the HSC

— SPI Interface

• Debug

— JTAG connected to the HSC

— JTAG header provided for DSP mezzanines on AMC base card

— Multiple test points



Features

• Power supply (provided by base card)

— 3.3V IO

— 2.5V Ethernet

— 1.5V/0.75V DDR3

— 1.0V Core

— 1.0V SerDes

• Clocks

— SerDes, Ethernet provided by AMC base card

— Core clock on mezzanine

3.1 SerDes InterfaceThe high-speed serial interface contains two Lynx blocks that supports several SerDes interfaces on the MSC8156. The MSC8156 mezzanine implements following options:

• Option 1: Lynx0 = SRIO0 [×4], Lynx1 = SRIO1 [×4]

• Option 2: Lynx0 = SRIO0 [×4], Lynx1 = PCIe [×4]

In the Lynx1 hardware block, the SRIO1 and PCIe signals are multiplexed onto the same MSC8156 pins; option 1 uses the SRIO1 interface, while option 2 uses the PCIe. Note that SRIO and PCIe specifications use different termination schemes. SRIO uses 0.1-μF DC blocking capacitors at the receiver end, while PCIe uses a 0.1μF DC blocking capacitors at the transmitter end. This option is selectable by a number of capacitor/resistor changes at the board assembly stage.

3.1.1 SRIO InterfaceThe MSC8156 supports two RapidIO controllers. Each supports a high-performance, point-to-point, low pin count packet, switched-level interconnect that can be used in a variety of applications as an open standard. The MSC8156 SRIO subsystem complies with the RapidIO interconnect specification revision 1.2. Each port controller supports ×1 or ×4 width at 1.25, 2.5, and 3.125 GHz.

The MSC8156 mezzanine routes the two ×4 SRIO interface to the HSC for distribution to the AMC base card.

Table 2 described the connections between the MSC8156 and the HSC.

Table 2. MSC8156 SRIO Interface

Signal IO Comment

SRIO Controller 0

SRIO0_TXD0_P O Direct connection to HSC

SRIO0_TXD0_N O Direct connection to HSC






Features




SRIO0_RXD0_P I DC blocking capacitor at MSC8156 pin

SRIO0_RXD0_N I DC blocking capacitor at MSC8156 pin







SRIO0_REFCLK_P I DC blocking capacitor at MSC8156 pin

SRIO0_REFCLK_N I DC blocking capacitor at MSC8156 pin

SRIO0_IMP_CAL_TX I TX Impedance calibration control (100 to ground)

SRIO0_IMP_CAL_RX I RX impedance calibration control (200 to ground)

SRIO Controller 1

















Table 2. MSC8156 SRIO Interface (continued)

Signal IO Comment



Features

To operate at 3.125, 2.5, or 1.25 GHz, the MSC8156 uses a fixed LVDS SerDes clock frequency of 125 MHz, which is provided by SRIOx_REFCLK from the AMC base card.

The transmission frequency of the MSC8156 SRIO should match the reset configuration word SCLK bits.

3.1.2 PCIeThe MSC8156 supports a PCI express controller that supports communication with PCIe devices. The PCIe interface is designed to comply with the PCI express specification, Revision 1.0a.

Table 3 gives details of PCIe signals (for clarity, the SRIO multiplexed signal are also included in the table).

SRIO1_REFCLK_P I DC blocking capacitor at MSC8156 pin

SRIO1_REFCLK_N I DC blocking capacitor at MSC8156 pin

SRIO1_IMP_CAL_TX I TX impedance calibration control (100 to ground)

SRIO1_IMP_CAL_RX I RX impedance calibration control (200 to ground)

Table 3. PCIe Signals

Signal IO Multiplexed with Comments

PE_TXD0_P O SRIO1_TXD0_P DC blocking capacitor at MSC8156 pin

PE _TXD0_N O SRIO1_TXD0_N DC blocking capacitor at MSC8156 pin

PE _TXD1_P O SRIO1_TXD1_P DC blocking capacitor at MSC8156 pin






PE_RXD0_P I SRIO1_RXD0_P Direct connection to HSC

PE_RXD0_N I SRIO1_RXD0_N Direct connection to HSC





SRIO1_REFCLK_P I – DC blocking capacitor at MSC8156 pin

SRIO1_REFCLK_N I – DC blocking capacitor at MSC8156 pin

Table 2. MSC8156 SRIO Interface (continued)

Signal IO Comment



Features

For PCIe, the MSC8156 requires a fixed LVDS SerDes clock frequency of 100 MHz which is provided by SRIOx_REFCLK from the AMC base card.

3.1.3 Termination SchemeTo accommodate both PCIe and SRIO on the Lynx 1 interface, the termination scheme in Figure 1 is used. When Lynx 1 is configured as SRIO (option A), 0.01-μF blocking capacitors are placed at the receive end and 0 resistors at the transmit end. When Lynx 1 is configured as PCIe (option B) 0.1-μF blocking capacitors are placed at the transmit end and 0 resistors at the receive end. By default, Lynx 1 is configured as SRIO.

Figure 2. SerDes Termination Scheme

3.2 Ethernet InterfaceThe MSC8156 supports two UCC gigabit Ethernet controllers (UECs) that are coordinated by the QUICC engine controller. The UEC interfaces on the MSC8156 is configured to use the RGMII interface. Note that the option to use SGMII is not available, because the SerDes pins have been allocated for SRIO use.

Both controllers RGMII interfaces are connected to the HSC; these signals are described in Table 4 and Figure 3. Typically a source termination value of 22 is placed at the transmitter pins (depending on board simulation).



Features

Table 4. MSC8156 Ethernet Interface

Signal IO Comments

Ethernet Controller 1

GE1_TX_CLK I Direct connection to HSC

GE1_TX_CLK O Direct connection to HSC through source termination

GE1_GTX_CTL O Direct connection to HSC through source termination

GE1_TXD0 O Direct connection to HSC through source termination




GE1_RX_CLK I Direct connection to HSC

GE1_RX_CTL I Direct connection to HSC

GE1_RXD0 I Direct connection to HSC




Ethernet Controller 2

GE2_TX_CLK I Direct connection to HSC

GE2_GTX_CLK O Direct connection to HSC through source termination

GE2_TX_CTL O Direct connection to HSC through source termination





GE2RX_CLK I Direct connection to HSC

GE2RX_CTL I Direct connection to HSC

GE2RXD0 I Direct connection to HSC




MDIO

GE_MDC O Unused (nc)

GE_MDIO B Unused (nc)



Features

Figure 3. Ethernet Interface

3.3 MSC8156 DDR-3Each MSC8156 supports dual 64-bit DDR3 controllers. The design utilizes both memory controllers attaching 512 Mbytes DDR3 memory to each. The 512 Mbytes are made of four 800 MHz, 8-Mbytes ×16 bits ×8 banks (1-Gbit) devices. The part used for this design is the Micron MT41J64M16BLA-15E.

The DDR3–SDRAM is configured with 13-row address lines, 10-column address lines, and 8 banks. Control of each memory device is done through CS0 signal. Individual differential clocks and their associated enable signal are routed to each memory. Note that EEC is not supported in this configuration.

Every DDR3 signal is a member of one of four separate groups. Each group has unique rules in terms of signal connection and signal routing. The four groups and the connectivity between controller and memory are shown in Table 5.

Table 5. DDR3 Signals

Signal Group

MSC8156 Signal

DDR3 Device1 Signal

DDR3 Device 2 Signal



Termination/Notes

Description

Address and Command

MA[12:0] A[12:0] A[12:0] A[12:0] A[12:0] 47 Ω to VTT Address bus

MBA[2:0] BA[2:0] BA[2:0] BA[2:0] BA[2:0] 47 Ω to VTT Bank address bus

MWE WE WE WE WE 47 Ω to VTT Write enable

MCAS CAS CAS CAS CAS 47 Ω to VTT Column address strobe

MRAS RAS RAS RAS RAS 47 Ω to VTT Row address strobe



Features

Control MCKE0 CKE CKE CKE CKE 47 Ω to VTT Clock enable

MCKE1 47 Ω to VTT Clock enable

MCS0 CS CS CS CS 47 Ω to VTT Chip select

MODT0 ODT ODT ODT ODT 47 Ω to VTT On-Die termination

MODT1 47 Ω to VTT On-Die termination

Data MDQS0± LDQS± ODT Data strobes/complement

MDQS1± UDQS± ODT Data strobes/complement

MDQS2± LDQS± ODT Data strobes/complement





MDQS7± UDQS± ODT Data Strobes/complement

MDM0 LDM ODT Data mask

MDM1 UDM ODT Data mask







MDQ[7:0] DQ[7:0] ODT Data bus








Clocks MCK[1:0]± MCK0± MCK0± MCK0± MCK0± Clock/complement

Table 5. DDR3 Signals (continued)

Signal Group

MSC8156 Signal

DDR3 Device1 Signal




Termination/Notes

Description



Features

Complex DDR3 timing adaptation is available through the DDR clocking subsystem of the MSC8156, and it supports the following:

• Positioning of the DQS output during writes to DDR memory

• Sampling of input data from DDR memory

• Synchronizing the incoming DDR data to the internal clock

• Control of the relationship between output data and CLK_OUT

• Write leveling

• Read leveling

• ZQ calibration

3.3.1 Terminations and I/O VoltageThe DDR3 interface operates with 1.5 V I/O and 0.75 VTT voltages, which are supplied from the AMC base card.

3.3.2 MSC8156 Mezzanine Memory Mapping

Table 6 describes the MSC8156 mezzanine memory map.

Misc ZQ 240 Ω to VSSQ (GND)

RESET RESET RESET RESET 1.5V tolerant Device reset

Table 6. MSC8156 Mezzanine Memory Map

Address Range Memory Type Size

0x40000000–0x5FFFFFFF External DDR3 Bank 1 512 Mbytes

0x60000000–0x7FFFFFFF Reserved 512 Mbytes

0x80000000–0x9FFFFFFF External DDR3 Bank 2 512 Mbytes

0xA0000000–0xBFFFFFFF Reserved 512 Mbytes

0xC0000000–0xC0107FFF M3 memory 1 Mbyte + 32 Kbyte

0xC0108000–0xFECFFFFF Reserved 511 Mbyte – 32 Kbyte

0xFED00000–FEDFFFFFF MAPLE-B 1 Mbyte

0xFEE00000–0xFEE3FFF QUICC Engine Subsystem 256 Kbytes

0xFEE40000–0xFEEFFFF Reserved (QUICC engine subsystem) 768 Kbytes

Table 5. DDR3 Signals (continued)

Signal Group

MSC8156 Signal

DDR3 Device1 Signal




Termination/Notes

Description



Features

3.4 MSC8156 UART InterfaceThe MSC8156 UART is connected directly to the HSC.

3.5 MSC8156 JTAG InterfaceThe MSC8156 EONCE module allows non intrusive interaction with the SC3850 core, enabling examination/analysis of registers, memory, and on-chip peripherals. The EONCE module connects with the debugging system through the on-chip JTAG TAP controller pins.

The MSC8156’s EONCE JTAG debug ports are connected directly to the HSC. The EEO signal is used to drive the cores into debug, while the EE1 indicates if a core is in debug. The EONCE signals available on the HSC connector are described in Table 8.

3.6 Reset and Configuration Signals

3.6.1 Reset

The MSC8156 has three external reset sources as follows:

• Power on Reset (PORESET)

• Hard Reset (HRESET)

0xFEF00000–0xFEF17FFF Boot ROM 96 Kbytes

0xFEF18000–0xFFFFFFFF Reserved 928 Kbytes

Table 7. MSC8156 UART Interface

Signal IO Comments

UTXD O Multiplexed with GPIO29

URXD I Multiplexed with GPIO28

Table 8. MSC8156 JTAG Interface

Signal IO Comments

EE0 I Direct connection to HSC

EE1 I Connected to test point

TMS I Direct connection to HSC

TRST I Direct connection to HSC

TCK I Direct connection to HSC

TDI I Direct connection to HSC

TDO O Direct connection to HSC

Table 6. MSC8156 Mezzanine Memory Map (continued)

Address Range Memory Type Size



Features

• Soft Reset (SRESET).

Assertion of the PORESET signal starts the power on reset flow, the MSC8156 reads its reset configuration word (RCW) and the PLL locks. Assertion of the open drain (OD) HRESET resets the individual blocks and registers, but not the PLL. The SRESET is not used in this design and is pulled high.

Table 9 shows the MSC8156 Reset Signals.

3.6.2 ConfigurationPORESET is the high-level reset of the MSC8156, and when asserted, it drives all other resets within the MSC8156. The rising edge of PORESET is used by the MSC8156 to latch external RCW signals.

The RCW source (RCW_SRC[0:2]) option enables the MSC8156 to load the RCW from a variety of sources. These signals are driven from the FPGA on the AMC base card.

The 2 RCW_ source options in Table 10 are used in the design. These are selectable through switches on the base card.

The hard-coded option is used during factory board bring up. By default the MSC8156 loads the RCW from I2C.

To enable multi-DSP boot over I2C, the MSC8156’s STOP_BS and GPIO[0:1] signals are routed to the FPGA, which in turns uses them to control the multi-DSP boot process.

All the configuration signals are connected directly to the HSC and routed on the base card to the FPGA that drives the configuration and control signals. When the reset configuration flow is complete, the signals revert to their default GPIO settings.

Table 11 shows the Reset Configuration Connections.

Table 9. MSC8156 Reset Signals

Signal IO Comments

PORESET I Direct connection to HSC

HRESET OD Connected to HSC using a 10K pull up (to 3.3V)

SRESET I Not used, 10K pull up to 3.3V

Table 10. Reset Configuration Signals

RCW_SRC[0:2] Description Comment

010 Load RCW from I2C Standard operation

100 Hardcode option 1 For factory programming

Table 11. Reset Configuration Connections

Signal IO Reset Post Reset Configuration

RCW_SRC0 B Reset source GPIO27/TMR 4




Features

Figure 4 shows the RCW Control.

Figure 4. Reset Configuration Word Control

3.6.2.1 Loading Reset Configuration Word from External I2C

When the load RCW from I2C option is selected, the board powers up and samples the RCW_SOURCE pins and reads 010 for I2C. The MSC8156 then accesses the I2C bus at address B[7:0]= b1010000, which represents the EEPROM. Bits B[7:4] = b1010 are hard coded into the EEPROM device, while the bits B[3:1] are defined by the A[2:0] pins, which are tied low. The final bit B0 is set by the read/write signal.

After the master MSC8156 (DSP1) has read its RCW, it configures itself as a slave EEPROM using the address b1010111. The slaves, DSPs, then access DSP1 to read their RCW.


STOP_BS B Multi-DSP I2C control –

GPIO0 B Multi-DSP I2C control, GPIO0

GPIO1 B Multi-DSP I2C control, GPIO1

Table 12. EEPROM Address

Signal A[2:0] pins R/W

B7 B6 B5 B4 B3 B2 B1 B0

1 0 1 0 0 0 0 0

Table 11. Reset Configuration Connections (continued)

Signal IO Reset Post Reset Configuration



Features

The I2C EEPROM is programmed by DSP1, with the RCW described in Table 13 and Table 14. These are the default values and can be changed by the user when required.

Table 13. RCWLR (Load from I2C)

RCWLR Bit Name Value Description

[31:30] CLKO 01 Source is PLL1 [CLKOUT=100 MHz

29 – 0 Reserved

28:24 S2P 00011 SerDes Port 0: Rapid IO 4 × 3.125 GHz

23:20 S1P 0011 SerDes Port 1: Rapid IO 4 × 3.125 GHz

19:18 – 00 Reserved

17 SCLK2 1 SerDes reference clock = 125 MHz

16 SCLK1 1 SerDes reference clock = 125 MHz

15:8 – 0 Reserved

7 PLL1DIS 0 PLL1 enabled (required for Clock Mode 0)

6 – – Reserved

5:0 MODCK 000000 Clock Mode 0

DSP1: RCWLR=0x43330000DSP2: RCWLR=0x43330000DSP3: RCWLR=0x43330000

Table 14. RCWHR (Load from I2C)


[31:30] RES 00 Reserved

29 EWDT 0 Disable watch dog timer

28 PRDY 0 PCI Express not ready

27:24 BPRT 0001 Boot Port=SRIO with no I2C support

23 RIO 1 Host access after boot, enabled

22 RPT 0 RIO pass through disabled

21 RHE 0 RapidIO controller is agent


18 RM 100

DSP1:Reset MasterDSP2: Reset SlaveDSP3: Reset Slave

17:13 – 00000 Reserved

12 GE1 1 RGMII selected


10 R1A 0 Do not accept all device IDs

9 R2A 0 Do not accept all device IDs



Features

3.6.2.2 Loading Reset Configuration Word from Hard-Coded Option

When the MSC8156 is configured to load the hard-coded RCW, that is, RCW_SRC[0:2] = b100, it is initialized with the hard-coded RCW as described in Table 15 and Table 16.

8:3 Device ID 000000000001000010

DSP1 = 000000DSP2 = 000001DSP3 = 000010

2 – 0 Reserved

1 RMU 0 Access local memory Port 0

0 CTLS 1 Common transport type is a large system

DSP1: RCWHR=0x01841801DSP2: RCWHR=0x01801809DSP3: RCWHR=0x01801811

Table 15. RCWLR (Hard Coded)


[31:30] CLK 00 Source is PLL0 [CLKOUT=80 MHz]

29 – 0 Reserved

28:24 S1P 01010 SerDes port 1, PCIe 1x SGMII1. SGMII2

23:20 S2P 0011 SerDes port 0, Rapid IO 4x 3.125 GHz

19:18 0 00 Reserved

17 SCLK2 1 SerDes ref clock = 125 MHz

16 SCLK1 1 SerDes ref clock = 125 MHz

15:6 – 0000000000 Reserved

5:0 MODCK 000000 Clock mode 0

DSP1: RCWLR=0x0A330000DSP2: RCWLR=0x0A330000DSP3: RCWLR=0x0A330000

Table 16. RCWHR (Hard Coded)


[31:30] – 00 Reserved

29 EWDT 0 Disable watch dog timer

28 PRDY 0 PCIe not ready

27:24 BPRT 0000 Boot port is SRIO (BPRT value ignored)

23 RIO 1 Host access after boot, enabled

Table 14. RCWHR (Load from I2C) (continued)




Features

3.7 I2C InterfaceThe I2C bus can be used to load RCW and boot code from the I2C. The bus is connected to an EEPROM on the AMC base card. Table 17 describes the connections.

3.8 ClockingAll MSC8156 internal frequencies are derived from the 100 MHz on-board clock (CLKIN) and the clock mode which is defined in the RCW. A CLKIN of 100 MHz and clock mode 0 sets the six MSC8156 cores to 1 GHz. The CLKOUT signal is connected to a test point that depends on the boot mode, as shown in Table 14 and Table 16.

22 RPT 0 RIO pass through disabled

21 RHE 0 RapidIO controller is host


18 RM 0 Not reset master

17:13 – 00000 Reserved



10 R1A 0 SRIO0 does not accept all device IDs

9 R2A 0 SRIO1 does not accept all device IDs

8:3 Device ID 000000 Device ID=0

2 – 0 Reserved

1 RMU 0 Access local memory port 0

0 CTLS 1 Common transport type is a large system

DSP1: RCWHR=0x00801801DSP2: RCWHR=0x00801801DSP3: RCWHR=0x00801801

Table 17. I2C Signals

Signal IO Comment

SDA B I2C data line, direct connection to HSC

SCL B I2C clock line, direct connection to HSC

Table 16. RCWHR (Hard Coded) (continued)




Features

Table 18 shows the clocking frequencies for clock mode 0.

3.9 SPI Interface The serial peripheral interface (SPI) allows the exchange of data with other devices containing SPI. In this case, the MSC8156 is connected to a 16-Mbyte external flash (Spansion S25FL128P) located on the AMC base card by the SPI bus. The large memory gives the MSC8156 the option to boot stand-alone with stored application code. The SPI bus is connected to the flash memory through FPGA. This gives the user the choice of using the pins as GPIO if the SPI option is not used.

Table 19 and Figure 5 shows SPI interface signals.

Table 18. Clocking Frequencies for Clock Mode 0

Block Frequency (MHz)

CLKIN 100

PLL0 900

PLL1 1000

PLL2 800

CLASS 500

DSP core subsystem 1000

HSSI 333

QUICC engine 500

MAPLE 450

DDR controller 1 800

DDR controller 2 800

Table 19. SPI Interface

MSC8156 Signal IO Comment

SPI_SL I Multiplexed with GPIO20

SPI_MISO OD Multiplexed with GPIO19

SPI_MOSI OD Multiplexed with GPIO18

SPI_SCK OD Multiplexed with GPIO17



Features

Figure 5. SPI Interface

3.10 GPIO/Timers and InterruptsA number of GPIO, timers, and interrupts are routed to the HSC. These are connected directly to the AMC base card’s FPGA, and can be configured as required. Note that some of these signals are multiplexed with the reset configuration signals. Once the reset is complete, the signals revert to the GPIO/Timer/Interrupt option.

Table 20. GPIO/Timer and IRQ Signals

Signal IO Comment

GPIO0/IRQ0 B Used for I2C Boot control

GPIO1/IRQ1 B Used for I2C Boot control

GPIO17 B Multiplexed with SPI_SCK

GPIO18 B Multiplexed with SPI_MOSI

GPIO19 B Multiplexed with SPI_MISO

GPIO20 B Multiplexed with SPI_SL

GPIO24/TMR1 B Multiplexed with RCW_SRC2



GPIO28 B Multiplexed with UART_RXD

GPIO29 B Multiplexed with UART_TXD

GPIO30 B Multiplexed with I2C_SCL

GPIO31 B Multiplexed with I2C_SDA



Features

Two non-maskable interrupts are routed to the FPGA through HSC.

3.11 Power The MSC8156 mezzanine is supplied with power from the AMC base card. The power requirements are application dependent. The user should refer the MSC8156 power calculator for the mezzanine power requirements. Table 22 details the voltage split.

The DDR3 power is calculated using the following:

DDR 3 VTT/Vref Calculation (0.75V)

Per Memory Controller: Address and Control Lines = 22 lines (0.75V/47W = 16 mA per Line) = 22 × 16mA = 352mA

Biasing is assumed to be negligible.

Table 21. Non-Maskable Interrupts

Signal IO Comment

INT_OUT O Direct connection to HSC

NMI I Direct Connection to HSC

Table 22. Power Requirements

Signal Power (W) Current (A) Voltage Comment

MSC8156

[VCORE]VDD

VDDPLL0VDDPLL1VDDPLL2VDDSXCVDDSXP

See 8156 Power Calculator [ref 6]

1.0V Internal Logic PowerSystem PLL 0 - Low impedanceSystem PLL 1 - Low impedanceSystem PLL 2 - Low impedance

[VSERDES]VDDRIOPLL

VDDSXCVDDSXP

1.0V SERDES PLL - Low impedanceSERDES C Power - Low impedanceSERDES P Power - Low impedance

VDDDD 1.5V DDR3 Controller 1 DDR3 Controller 2

MVREF 0.75V DDR3 tracking

VDDIO 2.5V General IO

VDDGE1VDDGE2

2.5V Eth. Controller 1Eth. Controller 2

DDR3 (MT41J64M16 x 8)

VDD 2768mW 1845mA 1.5V DDR3 IO

VTT 529mW 705mA 0.75 1uA leakage on reference voltage



Features

Per MSC8156 Mezzanine = 352mA × 2=704mA

DDR3 1.5V calculation

From Micon Power calculator per “×16 bit” device = 346mW

Per MSC8156 Mezzanine = 346 mW ×8 = 2768 mW

The ripple requirements on the rails are described in Table 23.

The DDR3 reference voltage VTT (0.75V) should track the 1.5V. Both the 1.5V and the 0.75V are supplied from the AMC base card.

The HSC has a 1.1A per pin rating. Table 24 describes the number of power pins used at the HSC connector to supply power.

For power sequencing, MSC8156 Core (1.0V) should rise first followed by the 2.5V IO.

3.11.1 PLL Power Supply Design

Each of the MSC8156 PLL blocks has an external RC filter for the PLLn_AVDD signals. Refer the MSC8156 data sheet for used filtering scheme.

3.12 Mezzanine ConnectorThe HSC provides connectivity and power between the AMC base card and the mezzanine. The connector has 150 pins with 1.1A current rating plus an integrated ground.

Table 23. Voltage Ripple Requirements

Voltage (V) 1.0V 1.5V 2.5V

MSC8156 0.97V (–3%) => 1.05V (+5%) ±75mV (±5%) ±125mV (±/5%)

DDR3 – ± 75mV (±5%) –

Table 24. MSC8156 Mezzanine Power Pins

Voltage (V) Number of Pins Allocated Comments

0.75V 3 DDR3 /2 (VTT)

1.0V 14 Core

1.0V 3 SERDES

1.5V 6 DDR3

2.5V 4 From Ethernet IO supply

2.5V 2 From VIO Supply (3.3V or 2.5V)



Features

The connector pin out is described in Table 25. The SAMTEC QTS high-speed header connector is used. The header mates with a Samtec QSS high-speed socket on the AMC base card.

Table 25. High-Speed Connector Pin Definition

MSC8156 HSC

Pin No. IO V Signal Name Pin No. IO V Signal Name

1 – 0 GND 2 – 0 GND

3 O – SD0_TXD0_P 4 I – SD0_RXD0_P

5 O – SD0_TXD0_N 6 I – SD0_RXD0_N

7 – 0 GND 8 – 0 GND



13 – 0 GND 14 – 0 GND



19 – 0 GND 20 – 0 GND



25 – 0 GND 26 – 0 GND

27 I – SD0_REFCLK_P 28 I – SD1_REFCLK_P

29 I – SD0_REFCLK_N 30 I – SD1_REFCLK_N

31 – 0 GND 32 – 0 GND



37 – 0 GND 38 – 0 GND



43 – 0 GND 44 – 0 GND



49 – 0 GND 50 – 0 GND



55 – 0 GND 56 – 0 GND

57 I 2.5 GE1_GTX_CLK 58 I 2.5 GE1_RX_CLK

59 O 2.5 GE1_TX_CLK 60 I 2.5 GE1_RX_CTL



Features

61 O 2.5 GE1_TX_CTL 62 I 2.5 GE1_RXD0

63 O 2.5 GE1_TXD0 64 I 2.5 GE1_RXD1

65 O 2.5 GE1_TXD1 66 I 2.5 GE1_RXD2

67 O 2.5 GE1_TXD2 68 I 2.5 GE1_RXD3

69 O 2.5 GE1_TXD3 70 I 0 GND

71 – 0 GND 72 I 2.5 GE2_GTX_CLK

73 I 2.5 GE2_RX_CLK 74 O 2.5 GE2_TX_CLK

75 O 2.5 GE2_RX_CTL 76 O 2.5 GE2_TX_CTL

77 O 2.5 GE2_RXD0 78 O 2.5 GE2_TXD0

79 O 2.5 GE2_RXD1 80 O 2.5 GE2_TXD1

81 O 2.5 GE2_RXD2 82 O 2.5 GE2_TXD2

83 O 2.5 GE2_RXD3 84 O 2.5 GE2_TXD3

85 B – nc 86 – 0 GND

87 B – nc 88 B 2.5 UART_TXD_GPIO29

89 B 2.5 EE0 90 B 2.5 UART_RXD_GPIO28

91 B 2.5 TMS 92 B 2.5 PORST_B

93 B 2.5 TRST_B 94 B 2.5 HRST_B

95 B 2.5 TCK 96 B 2.5 RCW_SRIO0_GPIO27_TMR4

97 B 2.5 TDI 98 B 2.5 RCW_SRIO1_GPIO25_TMR2

99 B 2.5 TDO 100 B 2.5 RCW_SRIO2_GPIO24_TMR1

101 B 2.5 I2C 102 B 2.5 STOP_BS

103 B 2.5 I2C 104 B 2.5 GPIO0_IRQ0

105 B 2.5 INT_OUT_B 106 B 2.5 GPIO1_IRQ1

107 B 2.5 NMI_B 108 B 2.5 SPI_SL_B_GPIO20

109 B – nc 110 B 2.5 SPI_MISO_GPIO19

111 O 2.5 BRD_ID0 112 B 2.5 SPI_MOSI_GPIO18

113 O 2.5 BRD_ID1 114 B 2.5 SPI_SCK_GPIO17

115 O 2.5 BRD_ID2 116 – – nc

117 – 5 nc 118 – – nc

119 B 2.5 DDR3_RST_B 120 – – nc

121 – 1 VCORE 122 2.5 – VIO_2V5

Table 25. High-Speed Connector Pin Definition (continued)

MSC8156 HSC




Features

3.12.1 Mezzanine Identification

Three signals, BRD_ID[2:0], are used to identify the mezzanine when located on the AMC base card. These three signals are connected to ground through 0Ω resistors with BRD_ID0’s pull down set to DNP. The pull ups on the base card sets the MSC8156 mezzanine tile to b001.

3.13 Mechanicals

3.13.1 Thermal RequirementsA heat sink is used to cool the MSC8156. The heat sink definition is based on thermal simulation within an ATCA/MicroTCA chassis with an air flow of >2 m/s.

3.13.2 Mezzanine Size and Component EnvelopeThe mezzanine is 70mm × 39mm, and when fitted on the AMC base card, the combined component layout complies with the “Full Size Mode Dimensions” of the AMC specification. Three mezzanines can be fitted onto the AMC base card.

123 – 1 VCORE 124 2.5 – VIO_2V5

125 – 1 VCORE 126 2.5 – VIO_2V5

127 – 1 VCORE 128 1.5 – VDDR

129 – 1 VCORE 130 1.5 – VDDR

131 – 1 VCORE 132 1.5 – VDDR

133 – 1 VCORE 134 1.5 – VDDR

135 – 1 VCORE 136 1.5 – VDDR

137 – 1 VCORE 138 1.5 – VDDR

139 – 1 VCORE 140 0.75 – VTT

141 – 1 VCORE 142 0.75 – VTT

143 – 1 VCORE 144 0.75 – VTT

145 – 1 VCORE 146 1 – VSERDES



Table 25. High-Speed Connector Pin Definition (continued)

MSC8156 HSC




Revision History

Figure 6 shows the mezzanine layout.

Figure 6. MSC8156 Mezzanine Layout

4 Revision HistoryTable 26. Document Revision History

Revision Number Date Substantive Change(s)

0 01/2010 Initial release.

Document Number: MSC8156MDDSRev. 001/2010

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