mosfets dosimetry
TRANSCRIPT
MOSFETS dosimetryMiguel Ángel Carvajal Rodríguez
ECsens, CITIC-UGR, Department of ElectronicsUniversity of Granada, E-18071 Granada, Spain
OUTLINE
Introduction Radiation effects Constant current measurements Linear range improvement: Two currents method Thermal dependence:
• Thermal model for lateral transistors• Thermal compensation: Three currents method
Sensor module: Biased and unbiased modes Readout process: deferred mode Results and discussion
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Introduction
Why MOSFET dosimeters for in-vivo dosimetry?• Small size and low cost• Immediately readout• Linearity• Easy calibration• Reproducibility
SiO2
n
p+ p+
Puerta
GSD
B
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Radiation effects
par e--huecohuecoelectrónhuecoatrapadotrampa
SiO2
Si
VGB>0
Puerta
(a)
SiO2
Si
VGB>0
Puerta
(b)
SiO2
Si
VGB>0
Puerta
(c)
SiO2
Si
VGB>0
Puerta
(d)
SiO2
Si
VGB>0
Puerta
(e)
SiO2
Si
VGB>0
Puerta
(f)
SiO2
Si
VGB>0
Puerta
(g)
E
GATE
GATE GATEGATE
GATE GATE GATE
Electron-hole pairHoleElectronTrapped holeTrap
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Unbiased mode:• No external voltage.• Low sensitivity
Biased mode:• External VGB during irradiation• Higher sensitivity and linearity.
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M1VGB
M2
Radiation effects
Ionizing radiation createscharge in the oxide and traps inthe Si-SiO2 interface.
Charge in oxide and positivetraps produce an increment inthe threshold voltage, |Vt|.
Interface traps degrade thecarriers mobility and then, the βparameter is reduced.
( )22 tGSD VVI −−=β
Radiation effects
SiO2
n
p+
Gate
GSD
B
+ + + + ++ + + + + + +++ + +p+
SiO2
Gate
+ + + + ++ + + + + + +++ + +
+ ++- -
+ ++- -
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Simplified measurement of Vt : VS at constantdrain current (VGD = 0).
00
<∆>∆
β|V| t
ID
VS
VDD
S
G B
D
⇒≈ constant β St VV ∆≈∆
( )22 tGSD VVI −−=β
Constant current measurements
βIVV St
2−=
Ionizing radiation creates charge in the oxide: Thresholdvoltage, Vt ,is the dosimetric parameter
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Radiation effects in electrical parameters
|Vt| increases and β reduces with absorbed dose
y = 0.0297x + 0.0037R2 = 0.9999
0.00
0.20
0.40
0.60
0.80
1.00
1.20
1.40
1.60
1.80
0 10 20 30 40 50 60Dose (Gy)
∆|V T
| (V)
5.65E-04
5.70E-04
5.75E-04
5.80E-04
5.85E-04
5.90E-04
5.95E-04
6.00E-04
6.05E-04
∆β (A
/V2 )∆|Vt|
∆β
• 60Co Source
• Semicondcutor analyser HP-4145B
• Unbiased mode
3N163, Vishay-Siliconix (USA)
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Linear range improvement:Two currents method (2CM)
Accounting for ∆β effect in ∆Vt
Pre- and post-irradiation parameters at constant current I:
⇒−=βIVV St
2
prepre
Spre
tIVV
β2
−=
postpost
Spost
tIVV
β2
−={
−−∆=∆ prepostSt IVV
ββ112}
( )22 tS VVI −=β
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Using two drain currents during read-out phase:
Threshold voltage shift without neglecting β degradation
Problem: Thermal compensated source voltage at twodifferent currents are needed, thus the thermal compensationmust be made using the thermal coefficient of Vt.
−−∆=∆ prepostSt IVV
ββ112 11
−−∆=∆ prepostSt IVV
ββ112 22
1
2
121
1II
VVVV SSSt
−
∆−∆+∆=∆
Linear range improvement:Two currents method (2CM)
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Both |Vt| and β decrease withtemperature.
Therefore, at constant current:• If T ↑ |Vt| ↓ VS ↓• If T ↑ β ↓ VS ↑
( )
tD
S
tGSD
VI
V
VVI
+=
⇓
−−=
β
β
2
22
Thermal dependence
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Di
SGv
ZTC
321 TTT <<3T2T
1T
ID
VS
VDD
S
G B
D
Thermal dependence
Both effects are compensated at IZTC current (ZeroTemperature Coefficient)
The thermal dependence of VS is minimized at IZTC current
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Thermal model for lateral transistors
Thermal compensation: Model• Starting hypothesis: linear thermal trend of voltages
1
2
121
1II
VVVV SSSt
−
∆−∆+∆=∆
TVVTVV
SS
SS
∆+∆=∆
∆+∆=∆
2022
1011
α
α
TVV Vttt ∆+∆=∆ α0
} ⇒
−=
ZTCi
Vti II1αα
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Thermal compensation: Three currents method (3CM)
ΔVS Thermal compensation: Adding a new current
1
11
01
1ααC
SSCSS
VVVV−
∆−∆+∆=∆TVTV
TVTV
CSCSC
SS
∆+∆=∆
∆+∆=∆
α
α0
1011
)()(
001 SCS VV ∆≈∆:radiationnoIf
C
SCS VVTαα −∆−∆
≈∆1
1}
( )C
ZTCSSCSS II
IIVVVV
−
−∆−∆+∆=∆
1
111
01
−=
ZTCVt I
I1αα
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PROCEDURES OF MEASUREMENTThree currents method (3CM)
Thermal compensation• ∆|Vt| thermal compensated
• Simplification I1 = IZTC
• Additional current: IC
1
2
01
020
1
1II
VVVV SSSt
−
∆−∆+∆=∆
( )C
ZTCSSCSS II
IIVVVV
−−
∆−∆+∆=∆2
222
02
ZTC
ZTCSSZTCSt
IIVV
VV2
,02
,
1−
∆−∆+∆=∆
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Thermal model: Experimental validation (I)
−=
ZTCi
Vti II1αα
3N163#1
0.0E+00
2.0E-04
4.0E-04
6.0E-04
8.0E-04
1.0E-03
2 2.5 3 3.5 4 4.5|VDS| (V)
I (A)
-40.4 ºC
-40.4 ºC
85.0 ºC
85.0 ºC
y = -0.0021x + 2.7181R2 = 0.9983
y = 0.0027x + 4.0762R2 = 0.9958
2.45
2.55
2.65
2.75
2.85
-50 -30 -10 10 30 50 70 90T (ºC)
Vs[I D
=20 µ
A] (V
)
3.85
3.95
4.05
4.15
4.25
4.35
2.00E-051.00E-03
Vs [I
D=1
mA]
(V)
Thermal compensation: Three currents method (3CM)
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3N163#1
-4.0
-2.0
0.0
2.0
0 0.005 0.01 0.015 0.02 0.025 0.03 0.035ID
1/2 (A1/2)
α (m
V/ºC
)
20µA
−=
ZTCi
Vti II1αα
ID
VS
VDD
SG
B
D
Thermal model: Experimental verification (II)
Thermal compensation: Three currents method (3CM)
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Thermal model: Experimental verification (III)
Thermal compensation: Three currents method (3CM)
CD4007#1
-4.0
-2.0
0.0
2.0
0 0.005 0.01 0.015 0.02 0.025 0.03 0.035ID
1/2 (A1/2)
α (m
V/ºC
)
10µA
ZTCI
TVα−
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Thermal model: Experimental verification (IV)
Thermal compensation: Three currents method (3CM)
RADFET 400nm#1
-6.0
-3.0
0.0
3.0
6.0
9.0
12.0
0 0.01 0.02 0.03 0.04
ID1/2 (A1/2)
a (m
V/ºC
)
20 μA
700 μA
TVα−
ZTCI
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Thermal model: IZTC summary
Thermal compensation: Three currents method (3CM)
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One current:• To thermal compensation ID=IZTC. (usual mode)
Two currents:• To increase the linear range use
• To thermal compensation (without using IZTC)
Three currents:• Increasing the linear range and thermal compensation
( )C
ZTCSSCSS II
IIVVVV
−−
∆−∆+∆=∆2
222
02
ZTC
ZTCSSZTCSt
IIVV
VV2
,02
,
1−
∆−∆+∆=∆
( )C
ZTCSSCSS II
IIVVVV
−
−∆−∆+∆=∆
1
111
01
1
2
121
1II
VVVV SSSt
−
∆−∆+∆=∆
Thermal compensation: Three currents method (3CM)
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Thermal compensation with two identical devices
M1 M2
During irradiation
Read-out configuration
∆VD
+ -
M1 M2
Sensing: Two identical pMOS with different sensibilities. Readout: Differential measurement.
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Thermal compesation using two identical devices
During irradiation: Two different bias voltage, thereforedifferent sensitivity to radiation
The readout is carried out with the same conditionsminimizing the interference of the temperature.
( )DSSVDSVDSV
DS
S21
22
11 −=∆⇒
=∆=∆
M1 M2
During irradiation
Read-out configuration
∆VD
+ -
M1 M2
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Thermal compensation techniques: Summary
ONE TRANSISTOR (Lateral MOSFET): One current: IZTC. Two currents: Out of IZTC zone. Three currents: IZTC and two currents for thermal
compensation and linear range improvement.
TWO TRANSISTORS: Different bias voltages during irradiation and differential
measurements.
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PROCEDURES OF MEASUREMENTPulsed biasing (PB)
SNR improvement• Read-time instabilities caused by low frequency noise (LFN)
(due to near-interface and interface traps)• How can LFN be reduced? Chopping the drain current as in
other experimental techniques (i.e. spectroscopy) and averaging
pMOS Switch
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Sensor module
Unbiased mode• JFET as a switch (shortcircuited during irradiation and storage and
open during read-out)
pMOS
JFETRG
Irradiation and storage During readout
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Sensor module
Biased mode: Two JFET as switches CD4007
RADFET
Irradiation Readout
Storage
VGB
Readout process: deferred mode
Dose measurement process• Zeroing:
• Measurement and storage of pre-irradiation VS at the two (three) draincurrents
• Irradiation• Timeout for short-term fading (2-3
minutes)• Dose measurement
• Recovery of the pre-irradiation values from the memory.• Measurement and storage of the post-irradiation VS at the two
(three) currents• Dose calculation (calibration is required)
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Results for 3N163 (unbiased and deferred mode): (PB+2CM)
Linearity improvement• Irradiation source: Siemens KDS-6MV.
y = -3.35E-03x + 1.01E+00R2 = 9.17E-01
y = -1.06E-03x + 1.01E+00R2 = 5.20E-01
0.92
0.94
0.96
0.98
1.00
1.02
0 5 10 15 20 25Dose (Gy)
Nor
mliz
ed S
ensi
tivity
Sen VS (IZTC)Sen Vt , 2 Ids
MOSFET P2
Results for 3N163 (unbiased and deferred mode): (PB+2CM)
Linearity improvement• Sensitivity decay coefficient, mean sensitivity and the
linear limit (up to 5%).
DC modes PB
IZTC 2CM IZTC 2CM
m (mV/Gy2) -0.153 -0.095 -0.113 -0.057
Mean Sensitivity
(mV/Gy)20.6 19.7 20.0 19.2
Linear Range (Gy) 6.8 10.3 8.8 16.8
V
VPBVs
DCVs
µσ
µσ
4.36
8.45
=
=
20 % reduction of SD
Experimental results for 3N163 (3CM)
Thermal compensation:• Reduction in a factor of 50 in the thermal drift
• Compensated
AIAI
AI
ZTC µµµ
24712030
3
2
===
-20
-15
-10
-5
0
5
10
15
20
17 19 21 23 25 27 29 31T (ºC)
∆|V
t| (m
V)
∆|Vt| not compensated
∆|Vt| comp. Method (i)
∆|Vt| comp. Method (ii)CV
TVt /º70µ<∆∆
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Unbiased and deferred mode (3CM+PB): 3N163
Radiation response of 3N163 Dpre=30 Gy (60Co)
y = 0.0233xR2 = 1.0000
y = 0.0240xR2 = 1.0000
y = 0.0240xR2 = 1.0000
y = 0.0243xR2 = 1.0000
y = 0.0232xR2 = 1.0000
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0 10 20 30 40 50 60D-Dpre (Gy)
∆V t
(V)
12345Li l (5)
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Temperature range 10 – 40 ºC Resolution 1 cGy Accuracy ± 3 %
Linear range 15 Gy > 80 Gy*
Thermal drift < 3mGy/ºC Delay after irradiation 2 – 3 minutes * with recalibrations every 15 Gy
Note: For 3N163 transistor
Unbiased and deferred mode (3CM+PB): 3N163
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Dosimetry characterization, resultsRADFET 400nm
No improvement with 3CM respect one current method.
y = -0.2862x2 + 55.918x
y = -0.2876x2 + 56.072x
0
500
1000
1500
2000
2500
0 10 20 30 40 50 60
D (Gy)
?VT (
mV)
3I_400nm
Iztc_400nm
∆VT
(mV)
LINAC 6MV
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Sensitivity vs. dose
y = -3.1198x + 79.988R2 = 0.1846
y = -9.0124x + 68.031R2 = 0.6893
0
20
40
60
80
100
0 0.5 1 1.5 2 2.5 3 3.5D (Gy)
Sen
(mV/
Gy)
3N163 Biased 12.5VRADFET 400nm 0V
Deferred mode (3CM+PB): Summary
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Thermal model has been applied to RADFETs andlateral commercial transistors
For RADFETs 3CM and IZTC method are equivalent 3N163 biased at 10 V presents a sensitivity similar to
RADFETs of 400 nm in unbiased model, but showingmuch more fading.
CD4007 5.24 ± 0.17 021.5 ± 1.1 048 ± 3 555 ± 3 10
RADFET 55.4 ± 1.2 0
3N163
Bias (V)Sensitivity (mV/Gy)
Deferred mode (3CM+PB): Summary
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Future talks
Internal topology of the reader unit will be described Programmable current source Hardware for zeroing and resolution improvement
Real-time measurements DMOS transistor:
Thermal compensation Additional hardware required Radiation response
Etc.
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AKNOWLEDGEMENTS
MMND 2014, Port Douglas (Australia)