module bonding working group
DESCRIPTION
Module Bonding Working Group. Salvatore Costa Universit à di Catania and INFN – Sezione di Catania. Bonding Facilities. Bonding Machines. Bonding Times per Module. Pre-bonding visual inspection:10min ARC test: 15-30min Bond: 5-35min 5min for K&S - PowerPoint PPT PresentationTRANSCRIPT
CMS Tracker MPR, CERN, 22 November 2004
22 Nov 2004CMS Tracker MPRSalvatore Costa - Catania
Module BondingWorking Group
Salvatore CostaUniversità di Catania and INFN – Sezione di Catania
CMS Tracker MPR, CERN, 22 November 2004
22 Nov 2004CMS Tracker MPRSalvatore Costa - Catania
Bonding Facilities
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Bonding Machines
Center Bonding Machines available to CMS
Bari Delvotec 6400
Catania Hughes 2470-II (1+1)
Firenze Delvotec 6400
Padova Kulicke&Soffa 8090, Kulicke&Soffa 4123, Hughes 2470-V
Pisa Kulicke&Soffa 8090
Torino Delvotec 6400
Fermilab Kulicke&Soffa 8090 (3)
Santa-Barbara Kulicke&Soffa 8090, Kulicke&Soffa 8060
Aachen Hesse&Knipps 710M
Hamburg Delvotec 6400
Karlsruhe Hesse&Knipps 710M
Strasbourg Delvotec 6400
Vienna Kulicke&Soffa 4123
Zurich Delvotec 6319, Delvotec 6320
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Bonding Times per Module• Pre-bonding visual inspection: 10min• ARC test: 15-30min• Bond: 5-35min
» 5min for K&S» 10min for Delvotec and Hesse&Knipps Double for 2-Sen Modules » 35min for Hughes.
• Post-bonding inspection: 10min• Pull test [if required] (pull, cleanup, rebond): 20min• DB entry: 5min
TOTAL: 45-90min excluding pull testTOTAL: 45-90min excluding pull test
NOTES: 1. ARC test times vary with Vpsp adjustment2. Some op may be performed in parallel by different people
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DB Interface
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Bonding WG Web Site
CMS Tracker MPR, CERN, 22 November 2004
22 Nov 2004CMS Tracker MPRSalvatore Costa - Catania
Production Rate
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Production Rate
CMS Tracker MPR, CERN, 22 November 2004
22 Nov 2004CMS Tracker MPRSalvatore Costa - Catania
Bonding Failures & Repair Actions
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Maintenance, Failures, Downtime Center Maintenance schedule Failures Downtime
TIB: Bari ~yearly, no contract No N/A
Catania on demand,no contract Once 1 month (*)Firenze yearly by contract 2 times 2 months (*) Padova regularly by bond op. No N/APisa by bond op. as needed No N/ATorino ~yearly, no contract No N/A
TEC:Aachen regularly by bond op. No N/AHamburg on demand,no contract Once 3 days Karslruhe on demand,no contract Once 1.5 daysStrasbourg yearly by contract No N/AVienna yearly by contract No N/AZurich on demand,no contract Once 2 weeks
TOB:FNAL 4/year by contract Damage by None
power failures UCSB 4/year by contract 1/machine ~1-2 week/machine
(*) Attempts (failed) to fix in house, to save money, made because prod was stopped
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Bonding Failures/Rep Actions1. Bonding failure detected during bonding or at post-bonding inspection:
– Wire won’t stick – Bond pops up (lift off) – Foot is misplaced and causes a short somewhere
We repair these right away if we can and/or list as unbonded the strips that are such as a result of the failure or of the “repair” action.
2. (Bonding) failure detected during post-bonding ARCS or LT tests:– Pinhole (caused by bonding/handling accident or pre-existing and either undetected in Sensor
test or on untested Sensor)– Short (caused by bonding/handling accident or by misplaced foot)– Open (bond popped up)
Same action.
3. Electric failure detected with ARCS at any stage (pre-bonding, post-bias-pre-readout-bonding, post-bonding or LT tests which dos not exhibit a clear link to bonding:
– Increased LV current – Anomalous IV
We post the problem for the Debug/Repair Center
4. Electric failure detected during post-bonding ARCS or LT tests, which might be traced back to a bonding failure:
– Example: “pseudo”-pinhole: At post-bonding ARCS test, a “PHL-” is found. We pull the readout bond as prescribed for pinholes but the test keeps saying “PHL-”, so the Hyb ch is damaged. Since it was OK at ARCS test on arrival perhaps we killed it with bonding.
We post the problem for the Debug/Repair Center.
22 Nov 2004CMS Tracker MPR 12 Salvatore Costa - Catania
Bonding Failure Rates• Global percentage of damaged channels (Hyb ch and/or Sen
strips) because of bonding failures: <~0.01 %<~0.01 %– Based on a compilation of unrepairable bond failures reported by individual
centers on 20Apr2004. At that time 1180 Modules had been bonded (~800,000 bonds).
– Since then reports at Meetings have indicated improvements, therefore although a more recent quantitative estimate is not available, it can only be less.
– Global percentage is the average between 0 from a few centers (such as Pisa) were not a single bond failure leading to loss of channels has been observed and 0.08 % in Catania [see next slide for analysis of failure types] where the oldest bonding machines, also lacking modern amenities such as automatic correction of bond parameters with varying substrate quality, are.
• Not a singleNot a single module lost yet (i.,e. no module with > 2% affected channels) because of bonding failures out of 2,700 Modules bonded so far.
• Only 1 module unbondable for dirty Pitch Adapter.
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Bond Failure Analysis (Catania) 53 Modules
34048
bonds
Unrepairable failures
# modules affected % # channels affected %
Totals 10 19 29 0.08
Machine failures
7 13.2 14 0.04
Bond foot misplacement
2 3.8 9 0.026
to stick 4 7.6 4 0.012
Pinholes (caused by bonding?)
1 1.9 1 0.003
Operator mistakes
3 5.7 15 0.04
Mishandling 2 3.8 7 0.02
Wrong ref
Wrong par
(lifts, pinholes)1 1.9 8 0.02
CMS Tracker MPR, CERN, 22 November 2004
22 Nov 2004CMS Tracker MPRSalvatore Costa - Catania
The chief Bonding quality indicator:the Pull Test
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Module Pull Tests Performed
# Modules pull tested # Modules pull tested after 01Dec2003 (at last Mtg)after 01Dec2003 (at last Mtg)
Center PA TA PA-Sen Sen-Sen
Bari 98 (83 ) 101 (86) n/a
Catania 51 (51) 51 (51) n/a
Firenze 9 (9) 5 (5) n/a
Padova 18 (18) 99 (99) n/a
Pisa 18 (10) 46 (37) n/a
Torino 119 (114) 46 (46) n/a
Fermilab 121 (119) 35 (33) 35 (34)
Santa-Barbara 51 (51) 58 (58) 76 (76)
Aachen 37 (0) 41 (0) 41 (0)
Hamburg 69 (62) 50 (45) n/a
Karlsruhe 0 (0) 20 (20) n/a
Strasbourg 20 (20) 65 (65) 65 (65)
Vienna 55 (19) 91 (28) n/a
Zurich 0 (0) 42 (38) n/a
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Pull Test Results (Nov ‘04)
BA CT FI PD PI TO FL FL SB SB AA AA HA KA ST ST VI ZH
. ss ss ss ss
5g
Not angle-corrected yet!
Ave
rag
e f
orc
es (
g)
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Pull Test Results (Jul ‘04)
Readout bonds
0.0
2.0
4.0
6.0
8.0
10.0
12.0
14.0
16.0
18.0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
Av
era
ge
fo
rc
es
(g
)
01Dec-06Jun
07Jun-18Jul
BA CT FI PD PI TO FL FL SB SB HA KA ST ST VI ZH
. ss ss ss
5g
Not angle-corrected yet!
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Readout bonds
0.0
2.0
4.0
6.0
8.0
10.0
12.0
14.0
16.0
18.0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
Av
era
ge
p
ull fo
rc
e (g
)
01Dec-18Apr
19Apr-06Jun
Pull Test Results (Jun ‘04)
BA CT FI PD PI TO FL FL SB SB HA KA ST ST VI ZH
. ss ss ss
5g
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Loop Documentation
Procedure: Uses a few of the identical symmetrical bonds we place on the PA Tests areas.1. Document the original bond
2. Straighten a bond to (near) triangular shape
3. Measure the angle at the bond foot
4. Determine correction factor for pull strengths
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1. Document the original bond
• Gently push bond over with the pull tester hook until it rests flat on the PA surface, but taking care that its shape is not significantly altered.
• Take snapshot of bond under measuring machine.
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2. Make bond triangular• Gently pull bond up at mid-span with the pull tester hook until it takes a
(nearly) triangular shape (figure below).
• Gently push bond over with the pull tester hook until it rests flat on the PA surface, but taking care that its now triangular shape is not significantly altered.
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3. Measure angle at bond foot
• Take snapshot of triangularized bond.• Measure angle using measuring machine.
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4. Determine correction factor (1)
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4. Determine correction factor (2)
Correction factor:a = 1 / (2 sin)
(º) corr. factor a
10 2.88
20 1.46
30 1
40 0.79
50 0.65
60 0.58
70 0.53
80 0.51
90 0.5
For symmetrical bond:
CMS Tracker MPR, CERN, 22 November 2004
22 Nov 2004CMS Tracker MPRSalvatore Costa - Catania
Module Gradingfrom Bonding
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Module Grading from Bonding (1)
Grading based on # unbonded stripsGrading based on # unbonded strips
• First flag in BONDSTATUS_VALBONDSTATUS_VAL vector:– 0 if n_unbonded <1– 1 if 1% - 2– -1 if >2%
• These are consistent to grades A,B,C of ModTest and the module is faulty with >2% unbonded strips.
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Module Grading from Bonding (2)
Grading based on Grading based on mechanical quality of the bondsmechanical quality of the bonds
• Criteria to generate this second flag:– # Bias Bonds (Spec: 5, 15 for TIB back)
• >2: grade A (flag 0)• 2: grade B (flag 1)• <2: grade C (flag -1)
– # “critical” readout bonds [definition list of “critical” by Alan]: • ≤ 2%: grade A (flag 0)• > 2%: grade B (flag 1)• > 20%: grade C (flag -1)
– Operator judgment on all other bonds [guidelines to issue this judgment by Alan]:
• A, B, C.
• These criteria will be or’ed together to generate flag.
CMS Tracker MPR, CERN, 22 November 2004
22 Nov 2004CMS Tracker MPRSalvatore Costa - Catania
Bonding Specifications & Procedures
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Bonding Specs (1)
• Document on Bonding web site:
cms.ct.infn.it/bonding/bondspec.htm• Contents:
– Bonding Specifications … – Specifications on Bonding Jigs – Specifications on Module Carriers – Specifications on Module Components and Assembly
Relating to Bonding – Specifications on Working Environment – Specifications on Final Module Bonding Quality &
Acceptance
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Bonding Specs (2)
• wire thickness and type• number of bias bonds• loop height and form• tail length• accuracy of placement in X and Y• pull strength• break on pull failure• failure rate• number of bonds with one tool
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Bonding Procedures
• Bonding Proc Document on Bonding web site:
cms.ct.infn.it/bonding/bondproc.htm– “Reference” doc in 43 steps– Has many pictures (mainly for TIB at the moment)
• Procedure to perform the 50th wire Pull Tests
cms.ct.infn.it/bonding/pullproc.htm
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Skip rules
• Leave unbonded– All strips in bad-IDIEL list
(considered pinholes)
– All Isolated bad CAC (believed to have high chance to develop into pinholes with irradiation)
– All but lowest in a bad CAC chain (believed to represent shorts)
CAC Example: 3 34 35 36 37 skip isolated 3,
skip all but lowest in 34-37 chain, or: bond only 34
• Leave unbonded all strips in bad-IDIEL list (although 16 % are good), i.e. do not bother looking at their actual IDIEL value.
• Bond all isolated bad-CAC • For the consecutive bad-CAC,
compute rC and consider them members of a short if rC>1.5. Then bond only the first strip in the short.
• If rc<1.5 bond them, as if they were isolated