microwave conference

FIRST CLASS MAIL US POSTAGE

PAIDPermit No. 490 LIBERTY, MO

RFIC Reception6 to 10 PM

Crowne Plaza

Microwave Journal/MTT-S Reception

6 to 8 PM

Heard Museum

Rump Session:Challenges

and OpportunitiesFacing Microwave CAD

7 to 9:30 PM

Hyatt

Corona Ranch5 to 10:00 PM

Industry-hosted CocktailReception

6 to 7:30 PM

Hyatt

Awards Banquet7:30 to 10:00 PM

Hyatt

Women in Engineering5:30 to 7:30 PM

Hyatt

Registration 7 AM to 6 PMWSA: State-of-the-Art Filter Design Using EM and Circuit Simulation Techniques

WSB: RF Systems and Circuit Issues of Third Generation Wideband CDMA Systems Like UMTSWSC: RF and High Speed Applications of Tunnel Devices

WSD: Microwave Photonic Component, Integration and System Techniques for Broadband Fiber-fed WirelessWSE: Advanced LTCC Microwave Design and Manufacturing Issues

WSF: New Advances in Nonlinear Circuit Design WSG: High Power RF Si: Devices, Modules and TrendsWSH: Web-based RF and Microwave Education

WSI: Advances in RF MEMS: Components, Packaging, Reliability and MicrophonicsWSJ: Ferrite Devices and Materials for Millimeter-wave Applications

WSK: Dynamics of the Microwave WorkbenchSCSA: Engineering Applications of Fast-MOM and Green Function-based Wavelets

SCSB: RF Power Amplifiers: Classes A–S

Registration 7 AM to 5 PM

RFIC Plenary Session 8 AM to 10 AM — RFIC Technical Sessions 10 AM to 5 PM – Civic PlazaWMA: Linearization for 3G Systems

WMB: Statistical Design and Modeling Techniques for Microwave CADWMC: ICs for 40 Gbit/s Data Rate Communications

WMD: Advances in Ceramic Interconnect Technologies for Wireless, RF and Microwave ApplicationsWME: Ultra-high Speed ICs for Commercial Applications — Present Status and Future Trends

WMF: High Density/Multilayer RF Interconnects PMA: RF CMOS for Bluetooth WMG: High Performance and Emerging Filter Technologies for WirelessSCMA: Nonlinear Measurement Basics

IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM 2001/MICROWAVE WEEK

MORNING LUNCHTIME AFTERNOON EVENING8:00–9:40 AM 10:10–11:50 AM 12:00–1:15 PM 1:20–3:00 PM 3:30–5:10 PM

TU1A: Techniques for System LevelNonlinear Analysis and SimulationTU1B: Power Combiners/Dividers

and Directional CouplersTU1C: Microwave Photonics

TU1D: Frequency Converters

TU1E: Smart Antennas

TU1F: Biological Effects and Medical Applications

TU2A: Plenary Session PTA: One Chip Radio

RFIC Session

TU3B: Baluns, Spiral Inductors and Resonators

TU3C: MEMS for AntennaApplications

TU3D: Control Devices

TU3E: Phased Array Antennas

RFIC Session

TU4A: Low Noise Amplifiers(LNAs) (Joint IMS/RFIC)

TU4B: Innovative Structures

TU4C: MEMS Control Circuits

TU4D: Acoustic Devices for Wireless Communications

and SensingTU4E: Novel Antennas

and ApplicationsRFIC Session


IMS Exhibition & µAPS 9 AM to 5 PM

WEIF: INTERACTIVE FORUM 2:30 TO 5 PM


RFIC Symposium 8:30 AM to 5 PM – Civic Plaza IMS Exhibition 9 AM to 5 PM; µAPS 12 to 5 PM

TUIF: INTERACTIVE FORUM 2:30 TO 5 PM


IMS Exhibition & µAPS 9 AM to 3 PM

THIF: INTERACTIVE FORUM 2:30 TO 5 PM

Workshop Registration 7 AM to 9 AM

ARFTG Conference & Exhibition 7:30 AM to 5 PM – Crowne PlazaWFA: Industrial Applications of Electromagnetic (EM) Solvers

WFB: RF Passive Component Evaluation TechniquesSCFA: Introduction to MEMS and RF MEMS

SCFB: Multicarrier Signal Description for Linear Power Amplifiers

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WE1A: Mode Conversion BetweenDissimilar Transmission MediaWE1B: High Power Amplifiers

and DevicesWE1C: Non-linear Device

ModelingWE1D: Frequency Control Advances

for Wireless Applications

WE1E: Dispersion Properties of Periodic Structures and Uniform

Transmission LinesWE1F: Advances in Time Domain

Methods I

WE2A: Novel Transmission Lines,Properties and Applications

WE2B: Techniques to Advance PowerAmplifier Linearity and Efficiency

WE2C: Nonlinear FET Modeling

WE2D: The NBS/NIST Centennial:One Hundred Years of RF Metrology

and StandardsWE2E: Leaky-wave Excitation

and Guidance in PrintedTransmission Lines

WE2F: Advances in Time-domainMethods II

PWA: Automotive RadarPWB: University-Industrial

Interactions

WE3A: Power Amplifiers for Wireless Applications

WE3B: Wideband CommunicationsSystems

WE3C: Nonlinear Modeling ofSilicon Devices and Power Amplifiers

WE3D: Microwave and OpticalBroadband Internet Access

WE3E: CAD with Neural Networksand EM Techniques

WE3F: Applications of TimeDomain Methods

WE4A: Next Generation PowerAmplifier Techniques

WE4B: New Technologies forWireless Communications Systems

WE4C: Wireless Sensors forAutomotive, RFID and Comm. Systems

WE4D: Internet via Satellites

WE4E: CAD Procedures and Optimization

WE4F: Ferrite and FerroelectricDevices

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TH1A: Microwave Signal Sources

TH1B: Active and Tunable Filters

TH1C: Passive Filters andMultiplexers I

TH1D: HF/VHF/UHF PowerAmplifiers

TH1E: Probing and AutomatedMeasurements

TH1F: Al Gross MemorialSpecial Session

TH2A: Millimeter-wave SignalSources

TH2B: Active and Planar Filters

TH2C: Passive Filters and Multiplexers II

TH2D: Millimeter-waveMultiplexers and MixersTH2E: Measurements

of Non-linear Devices and Systems

TH2F: High Speed HBT Technologyand Applications

PTHA: Commercial Exploitationof 92–96 GHz Spectrum

TH3A: Multi-layer PackagingTechniques

TH3B: Linear Modeling of Devicesand Components

TH3C: Passive Filters and Multiplexers III

TH3D: Millimeter-wave TransceiverElements and Assemblies

TH3E: Spatial Combining and Active Antennas

TH3F: High Performance MMICTechnologies

TH4A: Packaging InterconnectTechniques

TH4B: Frequency Domain EMTechniques

TH4C: Low Noise Components and Techniques

TH4D: Microwave Applicationsof Superconductivity

Thur

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Registration 2 to 6 PMSat.,

May 19

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Additional Meetings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59Administrative Committee . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64ARFTG Chairman’s Message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3ARFTG Conference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55Awards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60Crowne Plaza Hotel Floor Plan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .INSIDE BACK COVERExhibition Invitation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3Exhibitors and Exhibition Hours . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58Fellows . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60Future IMS Locations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64General Chairman’s Message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61Guest Program . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .66Historical Exhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59Hotel Map and Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10, 67, INSIDE BACK COVERHousing Form . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9Hyatt Regency Hotel Floor Plan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67IEEE MTT-S Membership Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6Interactive Forum

Tuesday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32Wednesday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42Thursday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51

Microwave Application & Product Seminars . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56–57MTT-S Technical Program Chairs’ Message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2Panel Sessions

Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5Monday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23Tuesday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33Wednesday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43Thursday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53

Phoenix Civic Plaza Floor Plan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68, INSIDE BACK COVERPhoenix Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65Plenary Session . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4Registration Form . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7Registration Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11RF and Microwave Education Forum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33RFIC Chairman’s Message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3RFIC Symposium . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12–13Rump Session . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33Social Events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65Special Sessions

Wednesday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43Thursday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53

Special Tuesday Evening Event . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65Steering Committee . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63Student Paper Competition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25Technical Program Committee . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62Technical Sessions

Tuesday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26–31Wednesday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34–41Thursday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44–51

Transportation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65Workshops

Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5Sunday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14–18Monday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20–23Friday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54

CONTENTS (LISTED ALPHABETICALLY)

2

The Microwave Theory and Techniques Society elected to startthe new millennium with an odyssey to a new frontier. On behalf

of the Steering Committee for the IMS2001, itis my pleasure and honor to invite you toPhoenix and the Valley of the Sun. This nev-er-before trek signifies the new horizons mi-crowave technologies and applications areapproaching in commercial and civilian ap-plications. The penetration of RF and mi-crowave systems, components, circuits, andtechnologies into the daily life surroundingmany of us is at an all-time high. This trend will continue, given the steady increase in

telecommunications demand and information superhighway re-quirements. This phenomenal technical and commercial growthreflects and manifests itself very well in the status of the Interna-tional Microwave Symposium.

Last year in Boston, attendance, papers, and exhibits were atan all-time record high. We are looking forward to hosting you inPhoenix. We expect IMS2001, in all likelihood, to break newrecords again and we want you to be part of it.

In 1993, when Phoenix team started planning for hosting thissymposium, it was projected that less than half of the Civic Plazawould be enough to accommodate it. As of today, IMS2001 ex-panded to fill the entire plaza, and would even fill more space if it

Samir El-Ghazaly

were available. More than 860 exhibit spaces have been reserved,with more companies on the waiting list, which promises thelargest exhibit ever. The IMS and RFIC Technical Program Com-mittees received a record of more than 1000 papers. The excellentquality of the submitted papers forced the committees to acceptmore than 500 papers, and to expand the symposium into six par-allel sessions, which are new records. The student paper competi-tion is more popular than ever, with 242 papers submitted.

For the microwave week to be complete, it must go beyondtechnical discussions and new discoveries. Our steering commit-tee has prepared a very rich and diverse social program for you.You have the opportunity to visit historical sites, modern elegantshopping boutiques, hidden valleys of Arizona, and one of theseven natural wonders of the world, The Grand Canyon. Thesouthwestern evening at the Corona Ranch and Rodeo Groundsis a new highlight of the week. The Awards Banquet is anothermemorable blend of the microwave and Arizona cultures. Themicrowave week is the culmination of eight years of continuoushard work. I invite you to participate, and enjoy every aspect of it.

From the Grand-Canyon State, I extend this invitation and awarm welcome to you. I look forward to you sharing this mi-crowave odyssey with us.

Samir El-GhazalyGeneral Chairman

2001 International Microwave Symposium

AN INVITATION TO MICROWAVE WEEK 2001

MTT-S IMS TECHNICAL PROGRAM

IMS2001 Technical Program Committee (TPC) has put togetheran excellent technical program that covers a broad spectrum of

topics that are important to the microwavecommunity. A record number of 930 paperswere submitted to IMS2001. The student pa-per submissions have grown to 242 papers,another new record for IMS. A total of 511papers (55%) were accepted for presenta-tions. The quality of the papers submittedwas very good, including some of the paperswe were not able to accommodate in thisyear’s symposium.

In order to accommodate the increasednumber of papers, we added one more parallel track to the tradi-tional five tracks. The Interactive Forum papers will be presentedTuesday through Thursday in the afternoon. Student papers willbe sprinkled in with the regular session papers. Student papercontest finalists will be recognized and awards will be presentedat the student award luncheon on Thursday.

Workshops and short courses will be held Sunday, Mondayand Friday. This year we have 20 workshops and five short cours-es on a wide variety of topics of interest to the microwave com-munity. In addition, we have five focused sessions, four panel ses-sions and one rump session to bring you the latest in several

Vijay Nair

emerging technology areas. Joint sessions will be held with RFICon Monday and with ARFTG on Thursday. These sessions high-light the areas of interest between IMS and the other symposia

planned for the microwave week.Historical exhibits will be very special this

year. In addition to traditional microwaveexhibits there will be a collection of exhibitsin memory of Al Gross, who was a visionaryin the early development of wireless com-munication systems. On Thursday morningthere will be an Al Gross memorial specialsession highlighting his impact on the wire-less communication field. Make sure to at-tend these special events.

This symposium also provides you an opportunity to makenew contacts, to rekindle old acquaintances and to network withexperts in RF and microwave technology. We have a variety ofsocial programs throughout the week so that you can enjoy yourvisit to the Valley of the Sun.

We look forward to seeing you in Phoenix to experience aweek of Microwave Odyssey!

IMS2001 Technical Program Co-ChairsVijay Nair

Chuck Weitzel

Chuck Weitzel

3

RFIC SYMPOSIUM

On behalf of the Technical Program Committee, welcome tothe 2001 IEEE Radio Frequency Integrated Circuits (RFIC) Sympo-

sium. The RFIC Symposium is one of theforemost IEEE Technical conference dedi-cated to the latest innovations in monolithicIC development for wireless and wirelinecommunications RF and high frequencycomponents. The RFIC symposium will be-gin on Sunday with workshops on variousRF designs issues. The plenary session willstart the conference on Monday with a focuson the next generation of Wireless LAN and trends towards CMOS RF IC design. Follow-

ing this plenary session, the regular technical program starts. Apanel session during lunch will allow interactive discussions on

the merits of CMOS RF design for Bluetooth. Recent advancesand pros and cons of CMOS for RF design will be discussed bythe experts in this area. On Monday afternoon and Tuesday, therewill be over 12 sessions dealing with various aspects of RF mono-lithic IC development. The RFIC symposium will conclude onTuesday with a joint session with IMS.

Thanks to the authors and technical program committee mem-bers for an exciting RFIC technical program. Please join us forthis symposium and we look forward to seeing you in Phoenix.

Sayfe Kiaei RFIC Technical Program Chairman

2001 IEEE RFIC Symposium Sayfe Kiaei

ARFTG CONFERENCE

Welcome to the 57th Conference of the Automatic Radio Fre-quency Techniques Group (ARFTG), being held on Friday, May

25, 2001 in the Crowne Plaza Hotel. The con-ference will include technical presentations,an interactive forum, and an exhibition; allintended to give one ample opportunity tointeract with some of the top people in theautomated RF and microwave test commu-nity. The main conference theme “Best Practicesand Strategies for RF Test” will focus on al-ternatives, tradeoffs, practical considerations and particular examples of industrial mi-

crowave test and measurement methods. Technical considera-tions (e.g., accuracy, equipment selection, test methodology)and non-technical issues (e.g., cost of test, cost of equipment,speed of test) will be discussed in detail by the invited presenta-tions. In addition, papers concerning traditional ARFTG interestssuch as metrology, S-parameter, noise figure and non-linear mea-surements will be presented.

The invited presentations include Stavros Iezekiel of the Uni-versity of Leeds discussing lightwave S-parameter measurement

techniques, John Mahon of M/A-COM on practical test considera-tions in a production microwave component manufacturing envi-ronment, and Eric Strid of Cascade Microtech on high-throughputmicrowave probing.

An important part of any ARFTG Conference is the opportunityto interact one-on-one with colleagues, experts and vendors inthe rf and microwave test and measurement community.Whether your interests include high-throughput production orone-of-a-kind metrology measurements, complex systems or sim-ple circuit modeling, small signal S-parameter or large-signal non-linear measurements, phase noise or noise figure, dc or light-wave, you will find a kindred spirit or maybe even an expert. Thecontinental breakfast in the exhibition area, the two exhibition/interactive forum sessions and the luncheon, offer ample oppor-tunity for discussion with others facing similar test and measure-ment challenges. Attendees often find that these interactions aretheir best source of ideas and information for their current pro-jects. So come and join us. You’ll find that the atmosphere is in-formal and friendly.

Check out ARFTG on the Web at www.arftg.org.Charles Wilker

Conference Chair

Charles Wilker

EXHIBITION

The exhibition that is part of Microwave Week gives you theopportunity to visit displays from more than 450 companies thatwill be showing the latest products and services available to ourindustry. A number of new companies will be exhibiting this yearin addition to the traditional exhibitors. In addition, the Mi-crowave Application and Product Seminars (µAPS), which are intheir fifth year, will be held on the show floor. These seminars arealways well received and have been improved and expanded forthis year’s meeting.

The exhibition is open from 9:00 AM to5:00 PM on Tuesday and Wednesday andfrom 9:00 AM to 3 PM on Thursday. I hope youwill take advantage of this unique chance tovisit the largest group of microwave ex-hibitors at any show in the world.

Harlan Howe, Jr.Exhibition Manager

Harlan Howe, Jr.

All Microwave Week registrants and guests are invited to at-tend the IMS 2001 Plenary Session, which will begin at 10:10 AM

on Tuesday, May 22, in the Phoenix Symphony Hall. Welcomingremarks will be given by Symposium Chairman Samir El-Ghazaly,Arizona State University President Lattie Coor, and by MTT-S Pres-ident Charles Jackson, followed by an overview of the technicalprogram by TPC Chairman Vijay Nair. The Class of 2001 IEEE Fel-lows will be recognized, and 2000 IEEE President Bruce Eisen-stein will present the IEEE Electromagnetics Award to ProfessorFawwaz T. Ulaby.

Mr. Dennis A. Roberson, Senior Vice-President and Chief Tech-nical Officer of Motorola Inc., will present the keynote address.

Stephen M. Goodnick, Vice ChairmanIMS 2001 Steering Committee

PLENARY SESSION

NOTES

4

Fawwaz T. Ulaby Dennis A. Roberson Stephen M. Goodnick

SPECIAL SESSIONS

The IMS2001 technical program committee has organized fivesessions in diverse areas of special interest to many attendees ofthe Symposium. All papers in these special sessions were solicit-ed and invited by the session organizers, and then reviewed andaccepted by the technical program committee. Detailed descrip-tions of the special sessions can be found on the pages listed af-ter each session title to the right:

✗ Session WE1D — Frequency Control Advances for WirelessApplications (See page 43.)

✗ Session WE2D — The NBS/NIST Centennial: One HundredYears of RF Metrology and Standards (See page 43.)

✗ Session WE3D — Microwave and Optical Broadband InternetAccess (See page 43.)

✗ Session WE4D — Internet via Satellites (See page 43.)✗ Session TH1F — Al Gross Memorial Special Session (See

page 53.)

5

In addition to the workshops and specialsessions, the 2001 Symposium will featurefive lunchtime (12:00 to 1:15 PM) panel ses-sions at the Civic Plaza. Furthermore, anevening rump session will be held on Tues-day evening, from 7:00 to 9:30 PM at the Hy-att. These panel and rump sessions provideattendees with opportunities to hear lively di-alog and differing views from a panel of ex-perts on subjects of current interest, while atthe same time allowing a high level of audi-ence interaction. The following topics will bediscussed:

PANEL SESSIONSMonday, May 21• RF CMOS for Bluetooth

Tuesday, May 22• One Chip Radio

Wednesday, May 23• Automotive Radar• University-Industry Interactions

Thursday, May 24 • Commercial Exploitation of 92-96 GHz

Spectrum

RUMP SESSION Tuesday, May 22• Challenges and Opportunities

for Microwave CAD

Detailed descriptions of the panel andrump sessions can be found on pages 24, 33,43 and 53 for Monday, Tuesday, Wednesdayand Thursday, respectively.

Participation in the panel and rump ses-sions requires separate registration; pleaseuse the registration form on page 7. Registra-tion for panel sessions includes a box lunch;rump session registration includes refresh-ments.

MTT-S PANEL AND RUMP SESSIONS

WORKSHOPS

(FOR A MORE DETAILED DESCRIPTION OF ANY OF THE EVENTS ON THIS PAGE, VISIT WWW.IMS2001.ORG)Number Time Title

WSA 8:00 AM–5:00 PM State-of-the-Art Filter Design Using EM and Circuit Simulation Techniques

WSB 8:00 AM–5:00 PM RF Systems and Circuit Issues of Third Generation Wideband

CDMA Systems Like UMTS

WSC 8:00 AM–5:00 PM RF and High Speed Applications of Tunnel Devices

WSD 8:00 AM–5:00 PM Microwave Photonic Component, Integration and System Techniques

for Broadband Fiber-fed Wireless

WSE 8:00 AM–5:00 PM Advanced LTCC Microwave Design and Manufacturing Issues

WSF 8:00 AM–12:00 PM New Advances in Nonlinear Circuit Design

WSG 1:00 PM–5:00 PM High Power RF Si: Devices, Modules and Trends

WSH 8:00 AM–5:00 PM Web-based RF and Microwave Education

WSI 8:00 AM–5:00 PM Advances in RF MEMS: Components, Packaging,

Reliability and Microphonics

WSJ 8:00 AM–5:00 PM Ferrite Devices and Materials for Millimeter-wave Applications

WSK 1:00 PM–5:00 PM Dynamics of the Microwave Workbench

WMA 8:00 AM–5:00 PM Linearization for 3G Systems

WMB 8:00 AM–5:00 PM Statistical Design and Modeling Techniques for Microwave CAD

WMC 8:00 AM–5:00 PM ICs for 40 Gbit/s Data Rate Communications

WMD 8:00 AM–5:00 PM Advances in Ceramic Interconnect Technologies for Wireless,

RF and Microwave Applications

WME 8:00 AM–5:00 PM Ultra-high Speed ICs for Commercial Applications —

Present Status and Future Trends

WMF 8:00 AM–12:00 PM High Density/Multilayer RF Interconnects

WMG 1:00 PM–5:00 PM High Performance and Emerging Filter Technologies for Wireless

WFA 8:00 AM–12:00 PM Industrial Applications of Electromagnetic (EM) Solvers

WFB 8:00 AM–12:00 PM RF Passive Component Evaluation Techniques

SundayMay 20

MondayMay 21

FridayMay 25

6

2001 IEEE MICROWAVE THEORY AND TECHNIQUES SOCIETYMEMBERSHIP APPLICATION

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Selected Publications of MTT and ED SocietiesT-MTT, MGW-L, ED-L, T-ED (Included in membership fee)

Microwave and Guided WaveLetters $118.00 ■■ $14.00 ■■

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and Techniques $113.00 ■■ $17.00 ■■Journal of Lightwave

Technology, IEEE/OSA $135.00 ■■ $18.00 ■■*IEEE membership required or request*Affiliate application to join MTT Society only. Amount Paid $ __________

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7R

Advance Conference Registration

IEEE MTT-S MICROWAVE WEEK EVENTSMay 20–25, 2001 ✦ Phoenix, AZ ✦ IMS ✦ RFIC ✦ ARFTG

Each conference attendee must submit a separate registration form. A copy of this form may be used. The deadline for advanced registration is May 15, 2000.

Afterwards, on-site fees apply and will be approximately 30% higher.

NAME

AFFILIATION

ADDRESS

US/CANADA TEL. INT'L TEL.

IEEE MEMBER ■■■■ Yes ■■■■ No IEEE Membership No.*

Name of Guest

Last First

Company, Etc. Mail Stop

Street

City State/Prov. Postal Code Country

*Must be given to qualify for member discount

For a complimentary badge for plenary session and exhibits

To register, check ■■■■✓ the appropriate boxes and enter corresponding fees in the Remittance column.ONLY PAID ATTENDEES WILL BE ADMITTED TO THE WORKSHOPS AND TECHNICAL SESSIONS.

INTERNATIONAL MICROWAVE SYMPOSIUM (Tue, Wed. & Thur.)IEEE Non-

Member Member RemittanceAll IMS Sessions (Includes IMS CD ROM and Digest.) ■■■■ $290 ■■■■ $420 $ ___________All IMS Sessions (Includes IMS CD ROM, no Digest.) ■■■■ $240 ■■■■ $370 $ ___________Single-Day Registration ■■■■ $125 ■■■■ $180 $ ___________(Includes IMS CD ROM, no Digest.)

Student, Retiree, Life Member ■■■■ $140 ■■■■ $155 $ ___________(Includes IMS CD ROM, no Digest.)

RFIC SYMPOSIUM (Mon. & Tue.) ■■■■ $125 ■■■■ $175 $ ___________(INCLUDES EXHIBITS, LUNCH, RFIC RECEPTION AND RFIC DIGEST.)RFIC Reception Only ■■■■ $250 ■■■■ $450 $ ___________ARFTG–AUTOMATIC RF TECHNIQUES GROUP CONFERENCE (Thur., Fri.) (INCLUDES EXHIBITS, BREAKFAST, LUNCH, ARFTG DIGEST AND ARFTG EXHIBITION.)

ARFTG Member ■■■■ $150 $ ___________ARFTG Non-member ■■■■ $190 $ ___________ARFTG Student, Retiree ■■■■ $170 $ ___________

ADDITIONAL DIGESTS AND CD ROMS(FOR PICKUP ON-SITE ONLY. SEPARATE DIGESTS AND CD ROMS WILL BE AVAILABLE AFTER THE SYMPOSIUM FROM THE IEEE.)

IMS Digest Qty. ___ @ ■■■■ $170 ■■■■ $190 $ ___________IMS CD ROM Qty. ___ @ ■■■■ $120 ■■■■ $130 $ ___________RFIC Digest Qty. ___ @ ■■■■ $135 ■■■■ $150 $ ___________ARFTG Digest

Member Qty. ___ @ ■■■■ $120 $ ___________Non-member Qty. ___ @ ■■■■ $145 $ ___________

PANEL SESSIONS (INCLUDES BOX LUNCH. SEE REVERSE SIDE FOR SCHEDULE.)PMA: RF CMOS for Bluetooth ■■■■ $10 $ ___________PTA: One Chip Radio ■■■■ $10 $ ___________PWA: Automotive Radar ■■■■ $10 $ ___________PWB: University-Industrial Interactions ■■■■ $10 $ ___________PTHA: Commercial Exploitation of 92–96 GHz Spectrum ■■■■ $10 $ ___________

RUMP SESSION (TUESDAY EVENING)RTA: Challenges & Opportunities Facing Microwave CAD ■■■■ $20 $ ___________

AWARDS BANQUET (WEDNESDAY EVENING) Qty. ___@ ■■■■ $40 $ ___________HYATT REGENCY

SOCIAL EVENT (TUESDAY EVENING) Qty. ___@ ■■■■ $35 $ ___________CORONA RANCH AND RODEO GROUNDS

WORKSHOPS AND SHORT COURSES For paid attendees only.Student/Retiree/

IEEE Member Non-member Life MemberFull Day $100 $130 $75Half Day $170 $190 $55SUNDAY MONDAY FRIDAY

■■■■ WSA (Full Day) $____ ■■■■ WMA (Full Day) $____ ■■■■ WFA (Morning) $____■■■■ WSB (Full Day) $____ ■■■■ WMB (Full Day) $____ ■■■■ WFB (Morning) $____■■■■ WSC (Full Day) $____ ■■■■ WMC (Full Day) $____■■■■ WSD (Full Day) $____ ■■■■ WMD (Full Day) $____■■■■ WSE (Full Day) $____ ■■■■ WME (Full Day) $____■■■■ WSF (Morning) $____ ■■■■ WMF (Morning) $____■■■■ WSG (Afternoon) $____ ■■■■ WMG (Afternoon) $____■■■■ WSH (Full Day) $____■■■■ WSI (Full Day) $____■■■■ WSJ (Full Day) $____■■■■ WSK (Afternoon) $____

SHORT COURSES (SEE BACK OF THIS PAGE FOR TITLES.)SUNDAY MONDAY FRIDAY

■■■■ SCSA (Full Day) $____ ■■■■ SCMA (Full Day) $____ ■■■■ SCFA (Full Day) $____■■■■ SCSB (Full Day) $____ ■■■■ SCFB (Full Day) $____

Full-day workshops and short courses include continental breakfast, lunch and afternoonrefreshments. Morning workshops include continental breakfast and lunch. Afternoon workshops include lunch and afternoon refreshments. Registration includes Workshop CD ROM. Workshop presenters’ notes will be available at the workshop.

GUEST PROGRAMS

GSA: Phoenix Valley Area Highlights Qty. ___ @ ■■■■ $127 $________GSB: Boyce Thompson Arboretum Qty. ___ @ ■■■■ $158 $________GMC: Native American Cultures Tour Qty. ___ @ ■■■■ $138 $________GMD: Desert Botanical Garden Qty. ___ @ ■■■■ $138 $________GTE: Taliesin West Qty. ___ @ ■■■■ $141 $________GWF: Phoenix Art Museum Qty. ___ @ ■■■■ $134 $________GWG: Verde Canyon Train (1st class) Qty. ___ @ ■■■■ $188 $________GWH: Verde Canyon Train (coach) Qty. ___ @ ■■■■ $172 $________GTHI: Sedona/Montezuma Castle Qty. ___ @ ■■■■ $156 $________GTHJ: Sedona/Grand Canyon (overnight double occ.) Qty. ___ @ ■■■■ $180 PP$________GTHK: Sedona/Grand Canyon (overnight single occ.) Qty. ___ @ ■■■■ $212 $________GFL: Grand Canyon (overnight double occ.) Qty. ___ @ ■■■■ $193 PP$________GFM: Grand Canyon (overnight single occ.) Qty. ___ @ ■■■■ $240 $________GFN: Grand Canyon via Sedona & Navajo Nation Qty. ___ @ ■■■■ $183 $________

PLEASE FAX (781) 769-5037 OR MAIL; DO NOT FORWARD HARD COPY IF FAXEDREGISTRATION IS AVAILABLE ONLINE AT WWW.MTT-SREGISTRATION.COM

MAIL COMPLETED FORM AND PAYMENT TO:MTT-S Registration, 685 Canton Street, Norwood, MA 02062

For information or handicap special needs only (phone registration is not available) (781) 769-9750.

The only acceptable forms of payment are check, money order, MasterCard, VISA or American Express.Make your check or money order (US $ ONLY on a US Bank or Traveler’s Check) payable to: IEEE/MTT-S

■■■■ MasterCard ■■■■ VISA ■■■■ American ExpressCard # Exp. Date

Signature _________________________________________ Written requests for refunds will be honored if received by April 27, 2001.A $25 cancellation fee will be charged for processing.

e-mail Address

MTT-S MEMBER ■■■■ Yes ■■■■ No

ARFTG MEMBER ■■■■ Yes ■■■■ No

TOTAL REMITTANCE $ _________________INDIVIDUAL PAYMENT MUST ACCOMPANY FORM

R

Each conference attendee must submit a separate registration form. A copy of this form may be used. Deadline for advance registration via fax or mail is April 27, 2001. Registration deadline via Website is May 4, 2001.

Afterwards, on-site fees apply and will be approximately 30% higher.

(Signature must accompany credit card payment)

WORKSHOPS

TOTAL$ ________

SHORT COURSES TOTAL $ ________

(INCLUDES EXHIBITS AND LUNCH) (SEE BACK OF THIS PAGE FOR TITLES.)

GUEST PROGRAM TOTAL $________

8

WORKSHOPS(FOR A MORE DETAILED DESCRIPTION OF ANY OF THE EVENTS ON THIS PAGE, VISIT WWW.IMS2001.ORG)

Number Time TitleWSA 8:00 AM–5:00 PM State-of-the-Art Filter Design Using EM and Circuit Simulation TechniquesWSB 8:00 AM–5:00 PM RF Systems and Circuit Issues of Third Generation Wideband CDMA Systems Like UMTSWSC 8:00 AM–5:00 PM RF and High Speed Applications of Tunnel DevicesWSD 8:00 AM–5:00 PM Microwave Photonic Component, Integration and System Techniques for Broadband Fiber-fed WirelessWSE 8:00 AM–5:00 PM Advanced LTCC Microwave Design and Manufacturing IssuesWSF 8:00 AM–12:00 PM New Advances in Nonlinear Circuit DesignWSG 1:00 PM–5:00 PM High Power RF Si: Devices, Modules and TrendsWSH 8:00 AM–5:00 PM Web-based RF and Microwave EducationWSI 8:00 AM–5:00 PM Advances in RF MEMS: Components, Packaging, Reliability and MicrophonicsWSJ 8:00 AM–5:00 PM Ferrite Devices and Materials for Millimeter-wave ApplicationsWSK 1:00 PM–5:00 PM Dynamics of the Microwave WorkbenchWMA 8:00 AM–5:00 PM Linearization for 3G SystemsWMB 8:00 AM–5:00 PM Statistical Design and Modeling Techniques for Microwave CADWMC 8:00 AM–5:00 PM ICs for 40 Gbit/s Data Rate CommunicationsWMD 8:00 AM–5:00 PM Advances in Ceramic Interconnect Technologies for Wireless, RF and Microwave ApplicationsWME 8:00 AM–5:00 PM Ultra-high Speed ICs for Commercial Applications — Present Status and Future TrendsWMF 8:00 AM–12:00 PM High Density/Multilayer RF InterconnectsWMG 1:00 PM–5:00 PM High Performance and Emerging Filter Technologies for WirelessWFA 8:00 AM–12:00 PM Industrial Applications of Electromagnetic (EM) SolversWFB 8:00 AM–12:00 PM RF Passive Component Evaluation Techniques

PANEL SESSIONSMonday PMA 12:00 PM–1:15 PM RF CMOS for BluetoothTuesday PTA 12:00 PM–1:15 PM One Chip RadioWednesday PWA 12:00 PM–1:15 PM Automotive RadarWednesday PWB 12:00 PM–1:15 PM University-Industrial Interactions Thursday PTHA 12:00 PM–1:15 PM Commercial Exploitation of 92–96 GHz Spectrum

SHORT COURSESSunday SCSA 8:00 AM–5:00 PM Engineering Applications of Fast-MOM and Green Function-based WaveletsSunday SCSB 8:00 AM–5:00 PM RF Power Amplifiers: Classes A–S Monday SCMA 8:00 AM–5:00 PM Nonlinear Measurement Basics Friday SCFA 8:00 AM–5:00 PM Introduction to MEMS and RF MEMS Friday SCFB 8:00 AM–5:00 PM Multicarrier Signal Description for Linear Power Amplifiers

SOCIAL EVENTSSunday 6:00 PM –10:00 PM RFIC ReceptionMonday 6:00 PM–8:00 PM Microwave Journal ReceptionTuesday 5:00 PM–10:00 PM Corona Ranch and Rodeo GroundsWednesday 5:30 PM–7:30 PM Women in Engineering ReceptionWednesday 6:00 PM–7:30 PM Industry ReceptionWednesday 7:30 PM–10:00 PM Awards Banquet

GUEST PROGRAMSSunday GSA 12:30 PM–4:30 PM Phoenix Valley Area HighlightsSunday GSB 8:30 AM–4:30 PM Boyce Thompson ArboretumMonday GMC 9:00 AM–2:30 AM Native American Cultures TourMonday GMD 8:30 AM–12:00 PM Desert Botanical GardenTuesday GTE 8:00 AM–12:00 PM Taliesin WestWednesday GWF 8:00 AM–12:00 PM Phoenix Art MuseumWednesday GWG 9:00 AM–6:30 PM Verde Canyon Train (1st class)Wednesday GWH 9:00 AM–6:30 PM Verde Canyon Train (coach)Thursday GTHI 8:00 AM–5:30 PM Sedona/Montezuma CastleThursday GTHJ 7:30 AM–8:30 PM Sedona/Grand Canyon (overnight double occ.)Thursday GTHK 7:30 AM–8:30 PM Sedona/Grand Canyon (overnight single occ.)Friday GFL 7:00 AM–8:30 PM Grand Canyon (overnight double occ.)Friday GFM 7:00 AM–8:30 PM Grand Canyon (overnight single occ.)Friday GFN 7:00 AM–8:30 PM Grand Canyon via Sedona & Navajo Nation

SundayMay 20

MondayMay 21

FridayMay 25

9

CONFERENCE HOUSING

2001 IEEE MTT-S INT’L MICROWAVE SYMPOSIUM

May 20–25, 2001 • Phoenix, AZ

MTT-S • ARFTG • RFIC

Hotel locations and rates are shown on the reverse side of this form. Please show three choices.

INSTRUCTIONS AND HOUSING BUREAU POLICY1. Please print or type all data requested.2. Confirmations will be sent after each reservation booking, modification and/or

cancellation. If you do not receive a confirmation via e-mail, fax or mail within 14days after any transaction, contact the Housing Bureau at 602-462-6269. You will notreceive a confirmation from the hotel.

3. All rates are per room per night and are subject to 11.07% tax (subject to change).4. Request room type and indicate special requests in the section provided on the

form. Specific room types will be assigned at check-in. Please be advised thatrequests are not guaranteed.

5. A deposit of $150 is required for each reservation. Requests received withoutdeposits will be returned and will not be processed. Provide complete

credit card information or mail a check payable to IEEE Housing Bureau. The hotelholding your reservation may charge credit card deposits after May 3, 2001. Creditcards must be valid through June 2001 to be used for deposits.

6. Changes, modifications and cancellations prior to May 3, 2001 must go through theHousing Bureau. Reservations secured by check will be assessed $25.00 fees ifcancelled at any time. Reservations guaranteed by credit card may be cancelledwithout penalty until March 20, 2001 after which a $25.00 fee will be charged forcancellations. Your full deposit will be forfeited if you do not cancel within 72 hoursof arrival date.

7. Changes after May 3, 2001 must be made with your hotel.8. Valid Govt. ID will be required at check-in for Govt. rate rooms.

HOTEL PREFERENCE

First choice __________________________ Second choice_____________________________ Third choice_______________________________

If hotel choices are unavailable, which is most important: Rate ______ or Location ______ (please select one)

Name

e-mail

Company

Address

City __________________________________________________ State/Province ________________________ ZIP/Postal Code _________________

Country ______________Daytime Phone ( ) ________________________________or FAX ( ) ____________________________________

Deposit paid by: ■■ Check or Money Order ■■ MasterCard ■■ Visa ■■ American Express ■■ ____________________

CARDHOLDER NAME (printed)

CARDHOLDER SIGNATURE *REQUIRED

CARD NO. ______________________________________ EXP. DATE (Must be later than 6-30-2001) _________________________

ROOM OCCUPANTS1. Print or type names of persons occupying each room. If more than three rooms are required,

attach a list providing the information requested below for each additional room.2. Select room type desired, indicate arrival and departure dates, and special requests (not guaranteed).

Check one: ■■ Single ■■ Double (1 bed) ■■ Dbl/Dbl (2 dbl beds) ■■ Govt.

Arr. Date: ____________________ Dep. Date: ____________________

Requests: ■■ Smoking ■■ Non-Smoking ■■ Wheelchair Accessible ■■ King

Occupants (first name first)

ROOMNO. 1

1.

2.


Arr. Date: ____________________ Dep. Date: ____________________


ROOMNO. 2

1.

2.


Arr. Date: ____________________ Dep. Date: ____________________


ROOMNO. 3

1.

2.

Reservations may be made on-line, by fax or mail and must be received by the Housing Bureau between February 1, 2001 and May 3, 2001. Changes and modifications may be made byphone (602-452-6269). No phone reservations will be accepted.

On-line Fax Mailwww.ims2001.org 602-256-5292 IEEE Housing BureauCode: IEEEATT0501 400 E. Van Buren, #600

Phoenix, AZ 85004

R

R

ATTENDEEuse code

IEEEATTO5O1

First Last

w/Int’l Country Code

Requests for blocks of rooms without named occupants must be accompanied by this completed form and directed to Ms. Carol Mikosz, Housing Coordinator, Greater PhoenixConvention & Visitors Bureau, 400 E. Van Buren, Suite 600, Phoenix, AZ 85004. Ms. Mikosz may be reached by telephone at 602-452-6269 or fax at 602-256-5292.

LISTED CONVENTION RATES ARE AVAILABLE ONLY FOR RESERVATIONS MADE BY MAY 3, 2001

(Payable to: IEEE Housing Bureau) Other

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HOTEL INFORMATION

NOTTO

SCALE

4th

AVEN

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3rd

3rd

3rd

AVE.

1st S

TREE

TRE

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T1s

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**3 milesfrom Civic Plaza

East-West streetsare 1/2 mile apart

North-South streetsare 1/8 mile apart

2001 IMS CONFERENCE HOTELSListed Convention Rates are available only for reservations made by May 3, 2001

Map No. Hotel Single Double1 Hyatt Regency Hotel $162 $162 Govt Rate $792 Crowne Plaza $102 $1023 Ramada Inn – Downtown $199 $1994 San Carlos Hotel $109 $109

*5 Best Western Executive Park $199 $199*6 Quality Inn & Resort $199 $199*7 Lexington City Square Hotel $199 $199*8 Holiday Inn Midtown $199 $199 Govt Rate $79*9 Holiday Inn Select AP $199 $199*10 Doubletree Suites $112 $112*11 Wyndham Phoenix Airport $103 $103*12 Embassy Suites Airport $112 $122*13 Phoenix Airport Marriott $101 $112*14 Sheraton Phoenix Airport $109 $109*15 Wyndham Buttes Resort $140 $140*16 Radisson Phoenix Airport $199 $199*17 Phoenix Hilton Suites $159 $159

Check with the Housing Bureau for triple or quadruple occupancy rates.*Denotes hotels on shuttle routes.

11

REQUIREMENTS

Registration fees are required of all participants, including ses-sion chairs, authors, and workshop and panel session organizersand speakers.

ADVANCE REGISTRATION

Reduced rates are offered for advanced registration when re-ceived by April 27, 2001. A registration form is available on page7 of this program. Each registrant must submit a separate form,with payment, to the address shown at the bottom of the registra-tion form. If using a credit card, then fax and online registration isavailable. When mailing, please mail early to ensure receipt bythe deadline; otherwise, on-site fees will apply.

Individual remittance must accompany the registration formand is payable in US dollars only using personal check drawn ona US bank, traveler’s check, international money order or creditcard (MasterCard, VISA or American Express). Personal checksmust be encoded at the bottom with the bank number, accountnumber and check number. Bank drafts, wire transfers and cashare unacceptable and will be returned. Government or companypurchase orders will not be accepted and will be returned.

GUEST REGISTRATION

To preregister your guest, include his or her name on your reg-istration form. Guest badges will be included in the envelope thatyou will receive upon check-in. On-site guest registration also willbe available.

STUDENTS, RETIREES AND LIFE MEMBERS

Students, retirees and IEEE Life Members receive a substantialdiscount on the IMS registration fee. Digests are not included. Toqualify as a student, a registrant must be either a student memberof IEEE or a full-time student carrying a course load of at leastnine credit hours. ARFTG also provides discounts for studentsand retirees.

PRESS REGISTRATION

Credentialed press representatives are welcome to register on-site only at the Exhibitor Counter, without cost and thereby haveaccess to technical sessions and exhibits. Digest are notincluded.

ON-SITE REGISTRATION

On-site registration for all Microwave Week events will be avail-able at the Phoenix Civic Plaza. Registration hours are:

Saturday, May 19 2:00 PM–6:00 PM

Sunday, May 20 7:00 AM–6:00 PM

Monday,May 21 7:00 AM–5:00 PM

Tuesday, May 22 7:00 AM–5:00 PM

Wednesday, May 23 7:00 AM–5:00 PM

Thursday, May 24 7:00 AM–3:00 PM

Friday, May 25 7:00 AM–9:00 AM

ON-SITE WORKSHOP REGISTRATION

On-site registration on Saturday and Sunday is available toeveryone. On-site registration for Friday’s workshops will be avail-able from 7:00 to 9:00 AM on Friday for those who have not previ-ously registered.

ON-SITE ARFTG REGISTRATION

Late on-site ARFTG registration will be available at the PhoenixCivic Plaza on Friday from 7:00 to 9:00 AM. If at all possible, pleasepreregister earlier in the week to reduce the on-site workload.

ON-SITE REGISTRATION FEES

IEEE Non-Member Member

Int’l Microwave SymposiumAll IMS Sessions $375 $525(Includes IMS CD ROM and Digest.)All IMS Sessions $325 $465(Includes IMS CD ROM, no Digest.)Single Day $155 $230(Includes IMS CD ROM, no Digest.)Student, Retiree, Life Member $50 $60(Includes IMS CD ROM, no Digest.)

RFIC Symposium $150 $210RFIC Reception Only $50 $50

ARFTG ConferenceARFTG Member $180 $180ARFTG Non-member $220 $220ARFTG Student/Retiree $90 $90

Additional Digests and CD ROMs (on-site pickup only)IMS Digest $70 $90IMS CD ROM $20 $30RFIC Digest $35 $50ARFTG DigestARFTG Member $20 $20ARFTG Non-member $45 $45

Panel Session $15 $15

Rump Session $25 $25

Awards Banquet $40 $40

Exhibits Only $10 $10

Guest Programs (See page 66 for complete information.)GSA: Phoenix Valley Area Highlights $127GSB: Boyce Thompson Arboretum $158GMC: Native American Cultures Tour $138GMD: Desert Botanical Garden $138GTE: Taliesin West $141GWF: Phoenix Art Museum $134GWG: Verde Canyon Train (1st class) $188GWH: Verde Canyon Train (coach) $172GTHI: Sedona/Montezuma Castle $156GTHJ: Sedona/Grand Canyon (overnight double occ.) $180 PPGTHK: Sedona/Grand Canyon (overnight single occ.) $212GFL: Grand Canyon (overnight double occ.) $193 PPGFM: Grand Canyon (overnight single occ.) $240GFN: Grand Canyon via Sedona & Navajo Nation $183

Workshops IEEE Non- Student/RetireeMember Member Life Member

Full Day $130 $165 $190Half Day $185 $110 $160

REFUND POLICY

Refund requests received by April 27, 2001 will be honored,but will be subject to a $25 service charge. For requests post-marked after this date, preregistrants will, in lieu of a refund, bemailed any digests due. This policy applies to registrations forguest programs and the awards banquet as well. Please state thepreregistrant’s name and provide a mailing address for the refundcheck. If the registration was paid by credit card, reimbursementwill be through an account credit. Address your requests to: MTT-S Registration, 685 Canton St., Norwood, MA 02062.

REGISTRATION

Message from the RFIC General Chairman

Welcome to the 2001 IEEE Radio Frequency Integrated Circuit (RFIC)Symposium, being held in Phoenix, Arizona at the Phoenix Civic Plaza,

May 20-22, 2001. The RFIC Symposium is the lead-ing IEEE conference dedicated to the advance-ment of monolithic IC technologies for RF, wire-less and broadband communications systems.

The Symposium opens on Sunday, May 20 withworkshops, and continues on Monday and Tues-day, May 21 and 22, with technical sessions. TheTechnical Program Committee under the chair-manship of Dr. Sayfe Kaiei has selected 60 papersfor presentation during 14 technical sessions andan interactive forum. Topics such as Wideband CDMA transceivers, RF and microwave power am-

plifiers, frequency generation, next generation front-end design, RF ICpackaging, RF IC passive components and high frequency device model-ing will be presented. There are four invited papers covering topics in lowcost RF CMOS design and GPS for handheld applications. Monday will in-clude a lunchtime panel discussion on the topic of RF CMOS for Blue-tooth applications.

The technical program is complemented by social activities to relax,meet peers, make new friends and have informal technical discussions.The opportunity to meet informally with colleagues has proven to be animportant part of past symposia. The RFIC social program includes thetraditional reception held on Sunday evening, as well as the MicrowaveJournal Reception on Monday evening. On Tuesday, the RFIC Symposiumattendees will also be able to attend the Plenary Session of the MTT-S Symposium and visit over 850 exhibit booths displaying a wide va-riety of RF and microwave products and services.

Once again, on behalf of the Steering Committee, we welcome you tothe 2001 IEEE RFIC Symposium in Phoenix.

David LovelaceGeneral Chairman, 2001 IEEE RFIC Symposium

RFIC STEERING COMMITTEE

David Lovelace, General ChairSayfe Kiaei, Technical Program ChairLuciano Boglione, DigestNatalino Camilleri, TransactionsAditya Gupta, PublicityStephen Lloyd, SecretaryJyoti Mondal, FinanceJoe Staudinger, Local Arrangements

RFIC TECHNICAL PROGRAM COMMITTEE

Fazal Ali, Nokia Mobile PhonesDavid Allstot, University of WashingtonKirk Ashby, MicrotuneLuciano Boglione, ConexantNatalino Camilleri, RF & Wireless Design Services Inc.Thomas Cho, Intel/Level 1John Choma, University of Southern CaliforniaYann Deval, Laboratoire IXLSherif Embabi, Texas InstrumentsIan Galton, University of California, San DiegoAditya Gupta, AndigicsRamesh Harjani, University of MinnesotaStefan Heinen, Infineon TechnologiesAlbert Jerng, DSP GroupReynold Kagiwada, TRW Inc.Sayfe Kiaei, Arizona State UniversityKevin Kobayashi, Stanford Micro-devicesBill Kuhn, Kansas State UniversityMahesh Kumar, Lockheed Martin Government Electronic SystemsStephen Lloyd, Conexant Systems Inc.David Lovelace, Gain TechnologyJyoti Mondal, Motorola Inc. Vijay Nair, Motorola Inc.David Ngo, RFMDJoe Staudinger, Motorola Inc. Bruce Thompson, Motorola Inc.

David Lovelace

MON1A Advances in RF CMOS — BallroomRFIC Plenary SessionChair: D. Lovelace, Gain Technology • Co-chair: S. Kiaei, Arizona State Univ.8:30 AM MON1A-1: Invited: Wireless LASN Revolution: From Silicon to Systems

T.H. Meng, B. McFarland, Atheros Communications Inc.9:15 AM MON1A-2: Keynote Paper: Recent Advances in RF CMOS

A. Hajimiri, Cal Tech. University11:00 AM MON2B-3: A Nonlinear Capacitance Cancellation Technique and its

Application to a CMOS Class AB Power AmplifierC. Wang, L.E. Larson, P.M. Asbeck, Center for Wireless Communications, La Jolla,USA

MON2A W-CDMA Transceivers — BallroomChair: N. Camilleri, RF & Wireless Design • Co-chair: S. Heinen, Infineon Tech.10:20 AM MON2A-1: A W-CDMA Zero-IF Front-end for UMTS in a 75 GHz SiGe

BiCMOS TechnologyH. Pretl, Danube Integrated Circuits Eng, Linz, Austria; W. Schelmbauer, L. Maurer, H. Westermayr, R. Weigel, University of Linz, Linz, Austria; B. Klepser, B. Adler, J. Fenk, Infineon Tech, Munich, Germany

10:40 AM MON2A-2: Dual-Band/Tri-Mode Receiver IC for N- and W-CDMASystems Using 6"-PHEMT TechnologyB. McNamara, S. Zhang, M. Murphy, Infineon Technologies Corp., Nashua, USA; H.M. Banzer, H. Kapusta, E. Rohrer, T. Grave, L. Verweyen, Infineon Technologies AG,Munich, Germany

11:00 AM MON2A-3: High-performance Quadrature Modulators for BroadbandWireless CommunicationB. Sam, Analog Devices Inc., Beaverton, USA; P. Halford, Analog Devices, Wilmington,USA

11:20 AM MON2A-4: A Versatile Receiver IC Supporting W-CDMA, CDMA andAMPS Cellular Handset ApplicationsK. Rampmeier, B. Agarwal, P. Mudge, D. Yates, Conexant Systems Inc., NewportBeach, USA; T. Robinson, Wavecom, Paris, France

11:40 AM MON2A-5: Fully Integrated W-CDMA IF Chip-set for UMTS MobilesW. Thomann, J. Fenk, Infineon Technologies, Munich, Germany; R. Weigel, University of Linz, Linz, Austria; R. Hagelauer, University of Linz, Linz, Austria

MON2B Power Amplifiers: Technology & Performance — Tucson 38–39Chair: B. Thompson, Motorola Inc. • Co-chair:F. Ali, Nokia Mobile Phones10:20 AM MON2B-1: A 50% Efficiency InGaP/GaAs HBT Power Amplifier Module

for 1.95 GHz Wide-band CDMA HandsetsT.B. Nishimura, M. Tanomura, K. Azuma, K. Nakai, Y. Hagegawa, H. Shimawaki, NEC Corp., Kawasaki, Japan

10:40 AM MON2B-2: SiGe-power Amplifiers in Flipchip and Packaged TechnologyW. Bischof, M. Alles, S. Gerlach, A. Kruck, A. Schueppen, J. Sinderhauf, H. Wassener,Atmel Wireless & Microcontrollers, Heilbronn, Germany

11:20 AM MON2B-4: Student: RF Power Performance of LDMOSFETs on SOI: An Experimental Comparison with Bulk Si LDMOSFETsJ.G. Fiorenza, J.A. del Alamo, Massachusetts Institute of Technology, Cambridge, USA

MON2C Frequency Generation — Tucson 40–41Chair: A. Jerng, DSP Group • Co-chair: Y. Deval, Laboratoire IXL10:20 AM MON2C-1: A 0.35 µm CMOS 2.5 GHz Complementary -Gm VCO using

PMOS Inversion Mode VaractorsR.L. Bunch, S. Raman, Virginia Tech, Blacksburg, USA

10:40 AM MON2C-2: HiperLAN 5.4 GHz Low Power CMOS Synchronous OscillatorY. Deval, J. Begueret, A. Spataro, P. Fouillat, IXL Laboratory, Talence, France; D. Belot,F. Badets, STMicroelectronics, Crolles, France

11:00 AM MON2C-3: High Performance Flip-chip Multi-mode, Multi-band VCO ICusing A Standard Low Cost BiCMOS ProcessD. Lovelace, Gain Technology, Phoenix, USA; R. Disilvestro, Motorola, Tempe, USA

11:20 AM MON2C-4: A 5.7 GHz Hiperlan SiGe BiCMOS Voltage-controlledOscillator and Phase-locked-loop Frequency SynthesizerB.H. Klepser, M. Scholz, J.J. Kucera, Infineon Technologies, Munich, Germany

11:40 AM MON2C-5: A Fully Integrated PLL Frequency Synthesizer LSI for MobileCommunication SystemT. Yasunaga, S. Hirano, Y. Miyahara, Matsushita Communication Industrial Co., Ltd.,Yokohama, Japan; M. Maeda, Y. Hiraoka, Matsushita Electronics Corp., Nagaokakyo,Japan

MON2D Next Generation Front End Design — Tucson 42–43Chair: K. Ashby, Microtone Inc. • Co-chair: S. Lloyd, Conexant Co.10:20 AM MON2D-1: A Flexible 10–300 MHz Receiver IC Employing a Bandpass

Sigma-Delta ADCR. Schreier, J. Lloyd, L. Singer, F. Weiss, B. Sam, D. Paterson, C. Jacobs, J. Steinheider, M. Timko, J. Zhou, Analog Devices, Wilmington, USA; W. Martin,Motorola, Ft. Lauderdale, USA

10:40 AM MON2D-2: A Completely Integrated 1.8 Volt 5 GHz Tunable ImageReject Notch FilterJ.W. Rogers, SiGe Microsystems, Ottawa, Canada; C. Plett, Carleton University,Ottawa, Canada

11:00 AM MON2D-3: A Monolithic 2-V 950-MHz CMOS Bandpass Amplifier with a Notch Filter for Wireless ReceiversC. GUO, A.N. Chan, H.C. Luong, Department of Electrical and Electronic Engineering,Kowloon, China

2001 RFIC TECHNICAL PROGRAM

12

Advisory Board

Fazal AliEliot Cohen

Reynold KagiwadaChristian Kermarrec

Louis LiuVijay Nair

11:20 AM MON2D-4: Tuned LNA for RFICs using Boot-strapped InductorF. Albertoni, B. Neri, E. Sentieri, Università di Pisa, Pisa, Italy; L. Fanucci, ConsiglioNazionale delle Ricerche, Pisa, Italy

MON3A GPS Special Session — BallroomChair: R. Harjani, University of Minnesota • Co-chair: J. Choma, Univ. of So. CA1:30 PM MON3A-1: Invited: GPS: Systems Overview

S. Kiaei, Arizona State University, Tempe, AZ2:00 PM MON3A-2: Invited: A 2/4 GHz CMOS Transceiver for Bluetooth

H. Darbi, S. Khorrahj, E. Chein, M. Pan, S. Wu, S. Moluodi, J. Leete, J. Rael, R. Lee, B. Ibrahim, M. Rofougaran, R. Rofougaran, Broadcom Corp., El Segundo, USA

2:30 PM MON3A-3: A Highly Integrated GPS Receiver for Cellular HandsetF. Dantoni, A. Holden, S. Fu, D. Sahu, S. Venkatraman, S.H. Embabi, TexasInstruments, Dallas, USA

MON4A Integrated Bluetooth Transceivers — BallroomChair: B. Kuhn, Kansas State Univ. • Co-chair: D. Allsot, Univ. of Washington3:50 PM MON4A-2: The First Very Low-IF RX, 2-Point Modulation TX CMOS

System on Chip Bluetooth SolutionC. Dürdodt, M. Friedrich, C. Grewing, M. Hammes, A. Hanke, S. Heinen, J. Oehm, D. Pham-Stäbner, D. Seippel, S. van Waasen, E. Wagner, Infineon Technologies,Düsseldorf, NRW; D. Theil, Universität Dortmund, Dortmund, NRW

4:10 PM MON4A-3: A Fully Integrated CMOS Frequency Synthesizer forBluetoothD. Theil, K. Schumacher, University of Dortmund, Dortmund, Germany; C. Dürdodt,University of Bochum, Bochum, Germany; A. Hanke, S. Heinen, S. van Wasaen, D. Seippel, D. Pham-Stäbner, Infineon Technologies, Düsseldorf, Germany

4:30 PM MON4A-4: Student-designed Bluetooth Radio in Silicon-on-SapphireW.B. Kuhn, Kansas State University, Manhattan, USA

4:50 PM MON4A-5: A 2.5V CMOS Switched-capacitor Channel-select Filter with Image Rejection and Automatic Gain ControlY. Chen, Industrial Technology Research Institute, Hsin Chu, ROC; J. Bor, P. Huang,MediaTek Inc., Hsin Chu, ROC

MON4B RFIC Packaging & Passive Components — Tucson 38–39Chair: J. Staudinger, Motorola SPS • Co-chair: M. Kumar, Lockheed Martin Govt.3:30 PM MON4B-1: Design and Modeling of Compact On-chip Transformer/

Balun Using Multi-level Metal Windings for RF Integrated CircuitsT. Liang, J. Gillis, D. Wang, P. Cooper, IBM Microelectronics, Lowell, USA

3:50 PM MON4B-2: A Complete Physical Frequency Dependent Lumped Modelfor RF Integrated InductorsJ.J. Sieiro, J.M. Lopez-Villegas, J. Cabanillas, J.A. Sorio, J. Samitier, Universitat deBarcelona, Barcelona, Spain

4:10 PM MON4B-3: Microwave Filters on a Low Resistivity Si Substrate with aPolyimide Interface Layer for Wireless CircuitsJ. Papapolymerou, The University of Arizona, Tucson, USA; G.E. Ponchak, NASA GlennResearch Center, Cleveland, USA

4:30 PM MON4B-4: On-board Probing of Broadband RF Amplifiers using CPWInterconnectsK. Naishadham, Philips Broadband Networks Inc., Manlius, USA

4:50 PM MON4B-5: Modeling of Lead-Frame Plastic CSPs for Accurate predictionof Their Low-Pass Filter Effects on RFICsT. Horng, S. Wu, H. Huang, National Sun Yat-Sen University, Kaohsiung, ROC; C. Chiu,C. Hung, Advanced Semiconductor Engineering Inc., Kaohsiung, ROC

MON4C Active Device Modeling for RFIC Applications — Tucson 40–41Chair: L. Liu. TRW • Co-chair: V. Nair, Motorola3:30 PM MON4C-1: RF Circuit Performance Degradation Due to Soft Breakdown

and Hot Carrier Effect in 0.18 mm CMOS TechnologyQ. Li, J. Zhang, W. Li, J.S. Yuan, University of Central Florida, Orlando, USA; Y. Chen, A. Oates, Lucent Technologies, Orlando, USA

3:50 PM MON4C-2: Reduced Intermodulation Distortion of AlGaAs/InGaAsDoped-channel FETs by Air-bridge Gate ProcessH. Chiu/Hsien Chin, F. Chien/Feng Tso, S. Yang/Shih Cheng, Y. Chan/Yi Jen, NationalCentral University, Chungli, ROC

4:10 PM MON4C-3: Systematic Analysis of RF Distortion in SiGe HBTsG. Niu, Q. Liang, J.D. Cressler, Auburn University, Auburn, USA; C.S. Webster, D.L. Harame, IBM Microelectronics, Essex Junction, USA

4:30 PM MON4C-4: Field-modulating Plate (FP) InGaP MESFET with HighBreakdown Voltage and Low DistortionA. Wakejima, K. Ota, K. Matsunaga, W. Contrata, M. Kuzuhara, NEC Corp., Otsu, Japan

4:50 PM MON4C-5: Large Signal Bias-dependent Modeling of PHEMTs by PulsedMeasurementsK. Lan, B.L. Ooi, M.S. Leong, P.S. Kooi, National University of Singapore, Singapore,Singapore

MON4D High Frequency Devices & IC Techniques — Tucson 42–43Chair: J. Mondal, Motorola Inc. • Co-chair: A. Gupta, ANADIGICS Inc.3:30 PM MON4D-1: 20-GHz INP-HBT Voltage-controlled Oscillator

with Wide Tuning RangeH. Djahanshahi, N. Saniei, C. Salama, University of Toronto, Toronto, Canada; S.P. Voinigescu, M.C. Maliepaard, Nortel Networks, Ottawa, Canada

3:50 PM MON4D-2: The Design of CMOS Transimpedance Amplifier Based on BSIM Large-signal ModelC. Kuo Chin Wei, C. Hsiao Chao Chih, S. Yang Shih Cheng, Y. Chan Yi Jen, NationalCentral University, Chungli, ROC

4:10 PM MON4D-3: Monolithic Ka-band Even-harmonic Quadrature ResistiveMixer for Direct Conversion ReceiversK.S. Ang, M. Chongcheawchamnan, D. Kpogla, P.R. Young, I.D. Robertson, Universityof Surrey, Guildford, UK; D. Kim, M. Ju, H. Seo, Eoncom, Seoul, Korea

4:30 PM MON4D-4: Compensation of MMIC Spread in 60 GHzTelecommunication Module by Automatic Output Power ControlM. Filleboeck, J. Schroth, EADS Deutschland GmbH, Ulm, Germany

4:50 PM MON4D-5: A 23-GHz Low-noise Amplifier in SiGe HeterojunctionBipolar TechnologyG. Schuppener, Royal Institute of Technology, Stockholm, Sweden; T. Harada, Dept.of Electronics, Tokyo, Japan; Y. Li, Ericsson Microwave Systems AB, Mölndal, Sweden

TUE3A RF Transceivers — BallroomChair: S. Heinen, Infineon Tech. • Co-chair: N. Camilleri, RF & Wireless Design1:20 PM TUE3A-1: A Single Chip ASK/FSK 900MHz Transceiver in a Standard

0.25 µm CMOS TechnologyW. Schuchter, G. Hofer, G. Krasser, H. Koblmiller, V. Schultheiss, A. Dollinger, M. Mark, INFINEON Technologies Austria AG, Graz, Austria

1:40 PM TUE3A-2: A Highly Integrated UHF Data Receiver for VehicleApplicationsD. T. Jobling, D. Frund, Motorola, Geneva, Switzerland; C. Landez, A. Huot, Motorola,Toulouse, France

2:00 PM TUE3A-3: 1W 900 MHz Direct Conversion CMOS Transmitter for PagingApplicationsD. Gerna, A. Giry, D. Belot, D. Pache, STMicroelectronics, Crolles, France; D. Manstretta, University of Pavia, Pavia, Italy

2:20 PM TUE3A-4: A One Chip RF Transceiver MMIC for ETC with Surface Via-hole Isolation TechniqueS. Yamamoto, A. Suwa, T. Tanbo, T. Kitazawa, K. Tara, M. Hagio, MatsushitaElectronics Corp., Nagaokakyo, Japan

2:40 PM TUE3A-5: A 1-5 GHz Low-power Single-chip Receiver IC for OpticalVideo Distribution SystemT. Oka, T. Ikedo, K. Nojima, K. Fujimoto, Matsushita Communication Industrial Co.,Ltd., Yokohama, Japan

TUE3F Control Circuits for Receivers and Transmitters — Yuma 21–23Chair: F. Ali, Nokia Mobile Phones • Co-chair: B. Thompson, Motorola Inc.1:20 PM TUE3F-1: Power Controller for Dual Band TDMA Power Amplifiers

S. Weber, Infineon Technologies, Munich, Germany1:40 PM TUE3F-2: A 450 MHz CMOS RF Power Detector

S. Ho, Analog Devices Inc., Wilmington, USA2:00 PM TUE3F-3: Design of an LTCC Switch Diplexer Frond-end Module for

GSM/DCS/PCS ApplicationsR. Lucero, W. Qutteneh, D. Meyers, A. Pavio, J. Estes, Motorola Labs, Tempe, USA

2:40 PM TUE3F-4: A Monolithic Si PCS-CDMA Power Amplifier with anImpedance-controllable Biasing SchemeS. Luo, T. Sowlati, Philips Research, Briarcliff Manor, USA

TUE4A Low Noise Amplifiers (LNAs) — BallroomJoint IMS/RFIC SessionChair: S. Lloyd, Conexant Co. • Co-chair: K. Ashby, Microtune Inc.3:30 PM TUE4A-1: A Wide Dynamic Range Switched-LNA in SiGe BiCMOS

T. Nakatani, Matsushita Electric Industrial Co., Ltd., Kadoma City, Japan; J. Itoh, I. Imanishi, O. Ishikawa, Matsushita Electronics Corp., Takatsuki, Japan

3:50 PM TUE4A-2: Dual Bias Feed SiGe HBT Low Noise Linear AmplifierE. Taniguchi, K. Maeda, N. Suematsu, T. Takagi, Mitsubishi Electric Corp., Kamakura,Japan; T. Ikushima, K. Sadahiro, K. Itoh, Mitsubishi Electric Corp., Amagasaki, Japan

4:10 PM TUE4A-3: A1.4 dB NF Variable Gain LNA with Continuous Control for 2 GHz-band Mobile Phone using InGaP Emitter HBTY. Aoki, M. Fujii, H. Dodo, H. Hida, NEC Corp., Tsukuba, Japan; S. Ohkubo, S. Yoshida, T. Niwa, Y. Miyoshi, N. Goto, NEC Corp., Kawasaki, Japan

4:30 PM TUE4A-4: A 1.7 mA Low Noise Amplifier with Integrated Bypass Switchfor Wireless 0.05-6 GHz Portable ApplicationsH. Morkner, M. Frank, S. Yajima, Agilent Technologies, Newark, USA

TUE4F Building Block Front Ends — Yuma 21–23Chair: S. Lloyd, Conexant Co. • Co-chair: K. Ashby, Microtone Inc.3:30 PM TUE4F-1: 1.8V RF AGC and Mixer Implemented with a Novel

Four-terminal HBT (FHBT)S. Zhou, P. Ma, L. Zhang, J. Li, F. Chang, UCLA, Los Angeles, USA; P. Zampardi,Conexant, Newbury Park, USA

3:50 PM TUE4F-2: Design and Performance of a Highly Integrated WidebandActive Downconverter MMICC.F. Campbell, J.M. Beall, TriQuint Semiconductor, Richardson, USA

4:10 PM TUE4F-3: A 2.5 GHz Low Noise High Linearity LNA/Mixer IC in SiGeBiCMOS TechnologyD. Wang, IBM Microelectronics, Lowell, USA; K. Krishnamurithi, Maxim IntegratedProducts, Chelmsford, USA; S. Gibson, J. Brunt, Ericsson Mobile Communications,Baingstoke, UK

4:30 PM TUE4F-4: A 1.9 GHz Double-balanced Subharmonic Mixer for DirectConversion ReceiversK. Nimmagadda, G.M. Rebeiz, The University of Michigan, Ann Arbor, USA

4:50 PM TUE4F-5: A 1GHz-band Low Distortion Up-converter with a Linear in dBControl VGA for Digital TV TunerY. Youn, C. Kim, N. Kim, H. Yu, Electronics and Telecommunications ResearchInstitute (ETRI), Taejon, Korea

13

14

WSA: STATE-OF-THE-ART FILTER DESIGNUSING EM AND CIRCUIT SIMULATION TECHNIQUES

Date & Time: Sunday, May 20; 8:00 AM to 5:00 PM

Location: Phoenix Civic Plaza

Topics & Speakers:

✗ Applications of Space Mapping Optimization Technology toFilter Design , John Bandler, Bandler Corp.

✗ Filter Design Using Fast Planar EM SimulationsRadek Biernacki, Agilent EEsof EDA

✗ Direct Global Electromagnetic Optimization of MicrowaveFilters, Stephane Bila, IRCOM, France

✗ Direct EM Design of a Class of Rectangular Waveguide DualMode Filters, Marco Guglielmi, ESA ESTEC, The Netherlands

✗ Filters and Multiplexers for Space Application – DesignMethods, Dietmar Schmitt, Bosch, Germany

✗ Synthesis of Filters with Frequency-Variable Couplings (FVC)Dick Snyder, RS Microwave Co.

✗ Fast Analysis and Optimization of Coupled Line Filters UsingFEM, Dan Swanson, Bartley RF Systems

✗ Advanced Simulation/Design Techniques for MicrowaveFilters, Ming Yu, COM DEV International

✗ Circuit Elements/Coupling Matrix Conversion to PhysicalFilter Dimensions Using EM SimulationsKawthar Zaki, University of Maryland

Organizers: John Bandler, Bandler CorporationDick Snyder, RS Microwave

Sponsors: MTT-1, Computer-Aided DesignMTT-8, Filters and Passive Components

Technical Level: Tutorial and Advanced

Significant advances in computational electromagnetics con-tinue to be made. They have been implemented in widely avail-able commercial software as well as dedicated in-house software.They are applied to microwave filter simulation, modeling, syn-thesis and design, and EM validation. They are accompanied bynovel modeling and design concepts involving parameterizationof arbitrary geometries, space mapping and surrogate modeling,the adjoint sensitivity method, reduced-order modeling andequivalent circuit extraction, artificial neural network representa-tion, genetic algorithms and fast frequency sweeps.

Optimal design more closely and automatically integrates EMand circuit simulations directly into the design and manufactur-ing process in a manner increasingly transparent to the designer.This workshop will address the state of the art from componentmodeling to multiplexer design. Expectations of using EM simula-tors as effective tools in an automated design environment con-tinue to be raised based on considerable work currently inprogress. We emphasize optimization methodologies as a corner-stone in simulation, modeling, design and manufacturing.

This workshop will draw upon the popularity and success of re-cent workshops involving electromagnetics and CAD. A balancebetween theory, implementation and practical discussions ofcomputational and design issues will be struck so that the work-shop will have wide appeal.

WSB: RF SYSTEMS AND CIRCUIT ISSUES OF THIRD GENERATIONWIDEBAND CDMA SYSTEMS LIKE UMTS



Topics & Speakers:

✗ Spread Spectrum and CDMA TechniquesR. Weigel, University of Linz, Austria

✗ 3GPP System SpecificationsL. Maurer, University of Linz, Austria

✗ 3GPP and its RF-Related Specifications and Test CasesB. Adler, Infineon Technologies, Munich, Germany

✗ 3GPP RF System SimulationL. Eichinger, Agilent Technologies, Munich, Germany

✗ Evolution from 2G to 3G Transceiver ArchitecturesJ. Fenk, Infineon Technologies, Munich, Germany

✗ Commercial BiCMOS RFIC TransceiversW. Thomann, DICE Danube Integrated CircuitEngineering, Linz, Austria

✗ SiGe RFIC Zero-IF Receiver Front-ends Designed for 3GPPApplications, H. Pretl, DICE Danube Integrated CircuitEngineering, Linz, Austria

✗ 3GPP Transceiver Concepts Using RF CMOS TechnologyQ. Huang, Swiss Federal Institute of Technology (ETH)Zurich, Switzerland

Organizers: Robert Weigel, University of LinzJosef Fenk, Infineon Technologies

Sponsor: MTT-2 Microwave AcousticsMTT-6, Microwave and Millimeter Wave ICsMTT-11, Microwave MeasurementsMTT-16, Microwave SystemsMTT-17, HF/VHF/UHF TechnologyMTT-20, Wireless Communications


Just as second generation digital wireless systems such as GSMor cdmaOne have been widely deployed, work is well underwayto develop third generation (3G) wireless networks which arecalled International Mobile Telecommunications (IMT-2000), andin Europe, Universal Mobile Telecommunication System (UMTS).These networks will add broadband data to support video, Inter-net access, and other high-speed data services for untethered de-vices. This workshop provides comprehensive fundamental andpractical technical information about the RF-related system andRFIC issues of 3G W-CDMA systems like UMTS, cdma2000 etc.,technologies that will play a major role in the future of wirelesstelecommunications. The information presented here is targetedat RF engineering professionals and wireless practitioners.

This workshop will begin by introducing spread spectrum andCDMA basics. The second Section gives a description of the 3GPPsystem specifications. Sections 3 and 4 will deal in detail with RF-related 3GPP test cases and simulation issues. Here, pertinent RFsystem requirements derived from the 3GPP test cases such as du-plexing, transmit frequency stability, output power dynamics, ad-jacent channel leakage ratio, modulation accuracy, maximumand minimum input signal levels, adjacent channel selectivity,and blocking and intermodulation characteristics are presented.Moreover, 3GPP-related simulation scenarios are discussed andsimulation results for various system issues like dependence ofbit error rate from adjacent channel selectivity or influence oftransmitter characteristics on error vector magnitude are present-ed. Section 5 will focus on the evolution from 2G to 3G transmit-ter and receiver architectures (e.g., Tx heterodyne and direct up-conversion, Rx heterodyne and homodyne, etc.). The pros andcons of various concepts will be investigated both from the per-formance and the economical point of view. In particular, the RFfront-end challenges associated with multimode and multibandsystems (concerning antennas, switches, filters, power amplifiers,frequency synthesizers) are addressed. In Sections 6 and 7, BiC-MOS and SiGe RFICs successfully designed for commercial appli-cations using Infineon semiconductor processes will be present-ed. Finally, in Section 8 the feasibility of UMTS transceivers fabri-cated from CMOS technologies in the 2 GHz band areinvestigated. Here, the linearity of the baseband filters and sec-ond-order intermodulation of the mixers play an important role.

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WSC: RF AND HIGH SPEED APPLICATIONS OF TUNNEL DEVICES



Topics & Speakers:

✗ Overview of Tunnel Diode Applications for High SpeedIntegrated Circuits, Gianfranco Manes, University of Florence, Italy, Vijay Nair, Motorola Inc.

✗ The Physics of Resonant Tunneling DiodesAldo Di Carlo, University of Rome, Italy

✗ Noise Suppression in Heterostructure Tunneling DevicesElliot Brown, UCLA

✗ Tunnel Diode Device Simulation and Process IntegrationNada El-Zein, Motorola Inc. Mandar Deshpande, Motorola Inc.

✗ Stability and Tradeoffs of Tunnel Diodes and their MicrowaveApplications, Alessandro Cidronali, Univ. of Florence, Italy

✗ Integrated Millimeter-wave Quantum-Barrier MixersD. Paul Steenson, The University of Leeds, UK

✗ Active Antennas For RF Applications Using HeterostructureInterband Tunneling DevicesSamir El-Ghazaly, Arizona State University

✗ Sb-Heterostructure Quantum Tunnel Diodes for MillimeterWave Radiometry and Passive ImagingJoel Schulman, Hughes Research Labs

✗ A/D Converter using Resonant Tunneling DiodesToshihiro Itoh, NTT Electronics Corporation, Japan

✗ Tunnel Diodes for RF and Digital ApplicationsAllen Seabaugh, University of Notre Dame

Organizers: Vijay Nair, Motorola Inc.Prof. Gianfranco Manes, U. of Florence – ItalyMandar Deshpande, Motorola Inc.

Sponsor: MTT-6, Microwave and Millimeter-Wave ICs

Technical Level: Tutorial

In recent years personal mobility and the attraction for portabledevices have led to an explosive growth in wireless communica-tion products. The requirements of flexibility and fast accesses todata are the driving forces for the introduction of advanced appli-cations at higher and higher frequencies. These applications makesevere demands on the technology required to implement them,with current solutions involving a mixture of technologies.

One proposed new technology is the use of Tunnel Devices.Quantum mechanical tunneling is a transport process that domi-nates as device dimensions get smaller and smaller. A tunneldiode is arranged so that electron-tunneling rate is reduced in acertain range of biases, leading to a negative differential resis-tance (NDR) characteristic. A tunnel diode can be integratedwith a transistor resulting in a novel, multifunctional device.

The non-linear and unique NDR characteristic of a tunnel deviceis useful for both digital and RF applications and is the defining fea-ture of this new technology. Many circuits that utilize tunnel de-vices have been proposed and demonstrated for both digital andAnalog/MMIC applications (like adders, SRAMs, XNORs, A/D con-verters, oscillators, frequency multipliers, amplifiers, mixers, re-ceivers and antennas). Novel and innovative circuit ideas andtopologies have made effective use of the enhanced functionalityof the tunnel devices making this new technology attractive.

Advantages of this technology include: ✗ reduction in circuit complexity and die size ✗ multifunctional ICs with superior performance✗ low power and low voltage operation (down to less than 1.0 volt)

The device technology must be optimized to meet the specificperformance requirements and properties of each circuit. Recent

advances in materials research have enabled tunnel diodes tomeet these challenges. Heterostructure band-gap engineering hasled to the achievement of tunnel diodes with high peak currentdensities and good peak-to-valley current ratios.

This workshop will present a comprehensive overview of thisnew tunnel device technology and its applications in RF and digi-tal circuits. The current status of tunnel diode physics and model-ing will be reviewed along with measurement techniques andnoise suppression. Tunnel device growth and issues in integratingit with other semiconductor devices and circuits will be dis-cussed. A variety of MMIC applications such as VCOs, amplifiers,mixers, receivers, antennas, mm wave radiometry and imagingapplications, and A/D circuits will be presented. Circuit and sys-tem level specifications and considerations will be discussed.

WSD: MICROWAVE PHOTONIC COMPONENT, INTEGRATIONAND SYSTEM TECHNIQUES FOR BROADBAND FIBER-FED WIRELESS



Topics & Speakers:

✗ Fibre-fed Broadband Wireless Access NetworksAlwyn Seeds, University College London, UK

✗ WDM Optical Network Infrastructure for 3GKam Lau, University of California, Berkeley

✗ MMIC-based Optically-Controlled Self-Oscillating Mixers forRemote Upconversion Fiber Radio PicocellsNeil Bourhill, University of Leeds

✗ Low Cost Fiber Radio Antenna ModulesDalma Novak, University of Melbourne, Australia

✗ Phase Coherency of Local Oscillators in Fiber OpticDistribution Networks, Afshin S. Daryoush, Drexel Univ.

✗ mm-Wave Photoreceivers and Optoelectronic IntegratedCircuits (OEICs), Andreas Umbach, u2t InnovativeOptoelectronic Components GmbH, Berlin, Germany

✗ mm-Wave Polymer-based Modulators with Applications toFiber Radio, H. Fetterman, UCLA

✗ Millimeterwave Electroabsorption Modulators, Dieter Jäger,Gerhard-Mercator Universität Duisburg, Germany

✗ Hybrid Integration Technology using Silica Planar LightwaveCircuit PlatformT. Kitagawa, NTT Photonics Laboratories, Japan

Organizer: Dr. Stavros Iezekiel, The University of Leeds

Sponsor: MTT-3, Lightwave TechnologyMTT-16, Microwave SystemsMTT-20, Wireless Communications


The explosive growth in communications has been driven bytwo complementary technologies: optical fiber and wireless com-munications. Fiber provides the massive bandwidth potential thathas fuelled the rise in Internet traffic, whilst wireless techniquesconfer mobility. The two technologies are starting to convergeinto fiber-radio systems, in which broadband services such asvideo on demand will be delivered over fiber to mm-wave pico-cells. In tandem with this, fiber communications is entering theera of Tb/s data rates.

This workshop will provide an overview of microwave photon-ic component technology and its system application in fiber-ra-dio systems. It will begin with a tutorial introduction to fiber radiosystems, followed by talks on state-of-the-art approaches to distri-bution of mm-waves over fiber and remote up-conversion tech-niques. Attention will then turn to the component integrationtechnologies that will be needed for low cost fiber-radio mod-ules, including: multichip modules, MMICs, OEICs and silicon mi-cromachining/MEMs for passive fiber alignment.

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WSE: ADVANCED LTCC MICROWAVE DESIGNAND MANUFACTURING ISSUES



Topics & Speakers:

✗ Advanced LTCC Front-End Modules and Processes for NewMobile Communication StandardsH. Flühr, Ch. Block, Ch. Hoffmann, EPCOS OHG,Deutschlandsberg, Austria

✗ Development of EM-based Component Libraries for LTCCand Related Multilayer ProcessesR.H. Jansen, G. Kahmen, P. Stöhr, A. Noculak, JansenMicrowave and RWTH Aachen, Aachen, Germany

✗ RF Characterization and Designing of Embedded Passivesinto LTCC Substrate, Harufumi Mandai, Yasuhiro Fujiki,Murata Manufacturing Co. Ltd., Tokyo, Japan

✗ LTCC as a Passive Integration Technology, V.T. Zaspalis, D. Hennings, M. Kammerer, R. Mauczok,B. Schreinemacher, Philips Research Labs, Aachen,Germany

✗ Advanced LTCC Applications for Handsets, Ch. Baratt, M. Garin, SOREP-ERULEC, Chateaubourg, France

✗ Communication Systems Requirements on LTCCDr. Steve Marsh, Marconi Ltd. UK

✗ Complex Circuit Design and Manufacturing Aspects of LTCCVincent Milano, Raytheon Co.

✗ LTCC Thermal ManagementW. Kinzy Jones, Florida International University

✗ LTCC Material, Vern Styger, Ferro Corp.✗ LTCC Circuit Manufacturing

Ray Brown, National Semiconductor Corp.✗ Thermal Management of High Power Components for Base

Stations , Mahesh Shah, Motorola Inc.✗ Modeling Techniques for Thermal considerations

Quan Li, ASE

Organizer: Rolf H. Jansen, Aachen Univ. of TechnologyJeanne Pavio, Motorola Inc.Frank Sullivan, Raytheon Systems Company

Sponsor: MTT-12, Microwave and Millimeter WavePackaging/Manufacturing


During the past few years, LTCC (Low Temperature Cofired Ce-ramics) has become an enabling technology for wireless applica-tions from GSM, CDMA, TDMA, Bluetooth and Wireless LAN atthe lower microwave frequency end up to the millimeter wave re-gion for such applications as LMDS at 30 GHz etc. This technolo-gy is able to provide cost-effective hardware solutions suitable forhigh volume manufacturing into multimillion production quanti-ties. The LTCC circuit medium allows reduced development cy-cles and thus short time-to-market. It is capable of complexitiesup to systems in a package and has been demonstrated to becompetitive in terms of excellent high frequency performance,high power handling, innovative compact 3D structures likebaluns, couplers etc. and thus miniaturization.

Advanced LTCC issues include the use of mixed dielectric con-stants, low loss materials, photo patterned conductors, high den-sity buried or passive circuit elements and the reach-out towardsapplications at 40 GHz and beyond.

The workshop will bring together contributors from LTCC de-sign and manufacturing groups worldwide. It will focus on thestill unsolved 3D multilayer design issues in close relation to vol-ume manufacturing issues and the trends towards innovative ma-

terials, high resolution patterning, buried non-ideal groundplanes, higher frequencies and improved thermal management.

WSF: NEW ADVANCES IN NONLINEAR CIRCUIT DESIGN



Topics & Speakers:

✗ New Advances in Nonlinear Circuit DesignAdalbert Beyer, Gerhard-Mercator-University Duisburg

✗ New Developments in Mixer DesignSteven A. Maas, Nonlinear Technologies Inc.

✗ Transient Circuit Simulation Using WaveletsMichael B. Steer, North Carolina State University

✗ Introduction to Measurement-based Mathematical Modeling ofNonlinear Devices and Components for Large-Signal CircuitSimulation, David Root, Agilent Technologies Santa Rosa

✗ Overview of Large-signal Measurements Based EquivalentCircuit and Behavioural Modeling Techniques with Regardto Non-linear Circuit Design EnhancementDominique Schreurs, K.U. Leuven, Belgium Adalbert Beyer, Gerhard-Mercator-University DuisburgSteven A. Maas, Nonlinear Technologies Inc.

Sponsor: MTT-1, Computer-Aided Design


In the last decade, a rapidly increasing demand in the develop-ment of microwave, millimeterwave and wireless communica-tion systems can be observed. There are few other areas in whichsuch enormous changes like those of nonlinear network designcan be recognized. In the past, the active devices and their tech-nology have moved from classical solutions to solid state perfor-mances and their integration. Currently, the monolithic integrat-ed circuit designs become predominant, and following this, theclassical circuit design has been shifted to advanced techniquesboth in time, frequency and mixed domains.

This workshop will present in depth tutorial discussion as wellas new developments in techniques for analyzing nonlinear cir-cuits. It will provide discussions on problems of new ideas likeapplication of wavelets in nonlinear network design or funda-mental aspects of circuit - simulation aspects.

Furthermore, this workshop will supply a forum for discussionon present important topics and possible new developments inthe future. This event will also provide a platform for participantsto introduce their results or suggestions by presenting their trans-parencies and explaining their point of view.

WSG: HIGH POWER RF SI: DEVICES, MODULES AND TRENDS

Date & Time: Sunday, May 20; 1:00 PM to 5:00 PM


Topics & Speakers:

✗ Overview of RF MOSFET DevicesDr. John Walker, Semelab plc

✗ High-Power Silicon Technologies for High-FrequencyAmplifier and Switching ApplicationsKrishna Shenai, PhD, University of Illinois at Chicago

✗ High-Power LDMOS Transistors for Wireless ApplicationsWayne R. Burger, PhD, Motorola Inc.

✗ High-Power Modules and Transistors for Telecommunications,Nagaraj Dixit, Ericsson Microelectronics

Organizer: Murat Eron, MPD

Sponsor: MTT-5, Microwave High-Power TechniquesMTT-17, HF/VHF/UHF Technology

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Not only at low level designs but also at high power levels Sicontinues to be the work horse of high power solid state applica-tions. Device design improvements, new packaging concepts andnew high volume manufacturing approaches have pushed Si farahead of any other competing technology when it comes to pow-er. In fact, Si competes with itself with BJT and MOSFET designs,from SiGe to SiC cousins, racing to fill the need created by thewireless telecommunications boom.

Speakers who specialize in various aspect of device design,modeling, manufacturing and testing, will review the state of theart in Si RF power technology, mechanical and electrical limita-tions, cost drivers, reliability issues and new packaging approach-es. We will try to identify fundamental limitations to performanceand cost. We will ask application experts to predict and rational-ize future trends in power, frequency and integration.

WSH: WEB-BASED RF AND MICROWAVE EDUCATION



Topics & Speakers:

✗ Web-Based Education: Positioning the IEEEPeter Wiesner, IEEE Educational Activities Department

✗ Multimedia Assets and Interactive Modules in Web-BasedMicrowave Education, Magdy Iskander, University of Utah

✗ Concept Modules for Web Based RF and MicrowaveEducation, K.C. Gupta, R. Ramadoss, H. Zhang,University of Colorado

✗ Multi-media Virtual Laboratory Modules based on USF’sLaboratory, Larry Dunleavy, University of South Florida

✗ E-Book as a Tool for Web Based Microwave InstructionAfshin Daryoush, S. Tofigi, Drexel University

✗ WEB-ED: One University’s Approach to Web-basedMicrowave EducationRobert H. Caverly, Kevin Buckley, Villanova University

✗ E-modeling – The Third Pillar of Microwave EducationPoman So, Wolfgang Hoefer, Univ. of Victoria, Canada

✗ Visualization and Involvement: A Key to the IntuitiveUnderstanding of Electromagnetics and Antenna TheoryNatalia Georgieva, McMaster Univ., Canada

Organizer: K.C. Gupta, University of Colorado

Sponsor: MTT-S Education Committee


Recent developments in information technology, in general,and internet technology in particular are changing the functional-ity of our society, and are likely to change current education andcontinuing-education enterprise in profound ways. Today, thecourses offered at various universities are often supplemented bya supporting website and continuing education is becoming in-creasingly web-based. RF and microwave education and continu-ing education need to take advantage of these technological ad-vances in order to (i) attract more students to RF and microwaveareas, and (ii) to help young MTT-S members in their early careerdevelopment through conveniently delivered continuing educa-tion. Recognizing the urgency of this need, MTT Society has spon-sored development of multimedia educational tools at two U.S.universities, and is planning a special issue and an electronicallypublished supplement of IEEE Transactions on Microwave Theo-ry and Techniques dedicated to “RF and Microwave Tutorials” in2002. These are the first steps by MTT Society in making web-based RF and microwave tutorials available to MTT-S members.

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The goal of this workshop is to discuss what is available todayin web-based and web-assisted RF and microwave education,what needs to be done, and how could educators in RF and mi-crowave area could make use of web technology for benefitingMTT-S membership. Participants are encouraged to bring a cou-ple of viewgraphs to express their viewpoints and share theirthoughts.

WSI: ADVANCES IN RF MEMS: COMPONENTS, PACKAGINGTECHNIQUES, RELIABILITY AND MICROPHONICS



Topics & Speakers:

✗ MEMS-Based System Requirements for Radar SystemsVince Sieracki, J.K. Smith, DARPA

✗ Very Low Loss X-Band Phase Shifters and PackagingTechniques, Jeff DeNatale, Rockwell Science Center

✗ RF MEMS Circuits; Recent Developments, Packaging, andReliability , Chuck Goldsmith, Raytheon

✗ Brownian, Acceleration and Microphonic Noise in RF MEMSCircuits, Gabriel M. Rebeiz, University of Michigan

✗ X-Band MEMS Phase Shifters: Development and Phase NoiseMeasurements, Clifton Quan, HRL/Raytheon

✗ RF MEMS Series Switch: Development, Packaging andReliability, Juergen Foerstner, Motorola Inc.

✗ Development of MEMS Switches and Tunable Systems inKorea, Y. Kwon, Seoul National Univ., Korea

✗ High Power RF MEMS SwitchesBernd Schauwecker, DaimlerChrysler Research, Germany

✗ RF MEMS Switch Development and Packaging Using a WaferTransfer ProcessVeljko Milanovic, Univ. of California – Berkeley

One hour of the workshop will be reserved to the latest an-nouncements. Interested parties should contact Prof. Rebeiz ([email protected]) for scheduling information.

Organizers: Gabriel M. Rebeiz, Univ. of MichiganJohn K. Smith, DARPA

Sponsor: MTT-21, RF MEMS and Micromachining


The MEMS area is quickly developing and new devices such aslow loss phase shifters, high-Q varactors, tunable filters, re-config-urable antennas and low-phase noise oscillators are being devel-oped using this technology. The purpose of this workshop is togive the audience an overview of the latest results obtained in USand international laboratories and to emphasize the new re-search/development directions (packaging, reliability, powerhandling issues, Brownian noise, acceleration noise, etc..) need-ed for the success of this field.

The full day workshop will be cover a wide range of areas,such as MEMS phase shifters, MEMS tunable filters, MEMS pack-aging techniques using MEMS switches and varactors. Also, theeffect of Brownian, acceleration, and microphonic noise onMEMS circuits will be considered in this workshop. The work-shop will conclude with a discussion on the reliability and failuremodes of MEMS-based devices.

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WSJ: FERRITE DEVICES AND MATERIALSFOR MILLIMETER-WAVE APPLICATIONS



Topics & Speakers:

✗ Introduction to mm-Wave Ferrite Devices and MaterialsDouglas Adam, Northrop Grumman

✗ mm-Wave Characteristics and Applications of HexagonalFerrite Ceramics and Non-collinear Antiferromagnets Karen N. Kocharyan, Renaissance Electronics Corp.

✗ Materials and Techniques for Fabricating Self-biased mm-Wave Circulators , Steven A. Oliver, Northeastern Univ.

✗ Characterization of Ferrites at Millimeter Wavelengths Mohammed N. Afsar, Tufts Univ.

✗ Radiation Loss of mm-Wave Easy-plane Ferrite Devices Ernst Schloemann, Consultant

✗ Some New Results of Ferrite Devices for Millimeter WavePurposes Adalbert Beyer, Gerhard-Mercator University Duisburg

✗ High Power Ferrite Switches for Spacecraft Millimeter WaveHopping Spot Beam Antennas Todd Vaughn, EMS Technologies Inc.

✗ A High Power W-band Duplexer for Wideband RadarApplications , Jeffrey McHarg, MIT Lincoln Laboratory

✗ Phase Shifters for Broadband Applications Badawy El-Sharawy, Arizona State Univ.

✗ mm-Wave Phase ShiftersSteven Stitzer, Northrop Grumman

✗ Semiconductor Junction Circulators for mm-Wavelengths Lionel Davis, UMIST

Organizers: Douglas Adam, Northrop Grumman Corp;Lionel Davis, UMIST

Sponsor: MTT-13, Microwave Ferrites


Improved phase shifters and nonreciprocal devices are re-quired to support the increasing utilization of the mm-wave spec-trum for commercial and defense applications. Existing defenseapplications, e.g. missile seekers, are typically narrow band andimprovements are aimed at reduced cost, size and insertion loss.However, future high data rate (SATCOM and short-range) com-munications applications and army radars will require increasedbandwidth and improved producibility. The properties, charac-terization and fabrication of mm-wave ferrite materials for mm-wave device applications will be reviewed. The developmentand applications of high power control components for wide-band radar and satellite communications will be described. Com-pact mm-wave ferrite devices will require significant improve-ments in performance and integration into low cost RF packagingand planar phase shifter configurations suitable for LTCC fabrica-tion will be discussed. Alternatives to ferrite devices are also un-der development and cooled semiconductors are candidates forsome very high frequency non-reciprocal device applications.Ferroelectric materials and MEMS are also candidates for mm-wave phase shifters and their performance will be comparedwith the equivalent ferrite devices. Commercial and defense sys-tems requirements for ferrite control components, the currentstate of the art, potential for future device and materials develop-ments and comparisons with non-ferrite approaches will be re-viewed in detail.

WSK: DYNAMICS OF THE MICROWAVE WORKBENCH

Date & Time: Sunday, May 20; 1:00 PM to 5:00 PM


Topics & Speakers:

✗ Introduction to Dynamics of the Microwave WorkbenchJoseph L. Tauritz, University of Twente

✗ Discovery and Resolution of Simulation Challenges forWireless Transmitter and Receiver HardwareLawrence P. Dunleavy, University of South Florida

✗ Trends in RF Power Device Concepts for Future WirelessCommunicationsJohn Gajadharsing, Philips Semiconductors

✗ Design and Verification Infrastructure for 3G Wireless RFICs Nick Kuhn, Agilent Technologies

✗ Multi-disciplinary Design Method for Second and ThirdGeneration Mobile Communication SystemsReza Mahmoudi, Univ. Twente/Philips Semiconductors

✗ Design Verification of 3G and Beyond IMT-2000 CDMATransmitters and Power AmplifiersUpkar Dhaliwal, QUALCOMM

✗ Accurate Hardware Testing with Software “In-The-Loop”Kurt Matis, Applied Wave Research Corp.

✗ Load Pull Measurement Issues and Trends Within theContext of the Total Design ProcessGary R. Simpson, Maury Microwave Corp.

Organizer: Prof. Joseph Tauritz, University of Twente

Sponsor: MTT-9, Digital Signal ProcessingMTT-11, Microwave MeasurementsMTT-16, Microwave SystemsMTT-20, Wireless Communications


The growing use of digital communication systems has compli-cated RF circuit design. The complexity of modern communica-tion systems confronts designers with the non-trivial task of inter-preting and translating system demands into circuit specifica-tions.

Additionally, verification of simulated with measured results isan indispensable part of the design procedure. To excite the RFcircuit one can make use of commercially available instruments.The signals generated are, however, not readily accessible to thesimulator in use and form a significant bottleneck for the verifica-tion. Furthermore, these instruments are limited to the generationof a limited set of complex digital signals, while the designer of-ten requires a broader selection of complex digital signals com-bined with for example noise, phase-noise or pre-correction infor-mation.

This workshop examines the trends in simulation at the systemand circuit level, including the link to hardware realization, mod-eling and test with specific attention being paid to aspects of stan-dardization in software and hardware design.

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WMA: LINEARIZATION FOR 3G SYSTEMS

Date & Time: Monday, May 21; 8:00 AM to 5:00 PM


Topics & Speakers:

✗ Wideband CDMA System Linearity RequirementsKenneth Weller, Conexant Systems Inc.

✗ EDGE Systems and Linearization RequirementsStephan Schell, Tropian Inc.

✗ Linearization Techniques Overview for 3G SystemsEd Niehenke, Niehenke Consulting

✗ Predistortion Techniques Applied to Wireless HandsetsJoe Staudinger, Motorola Inc.

✗ How to Reduce and Eliminate Distortion in Power AmplifiersUsing Linearization, Allen Katz, The College of New Jersey

✗ 3G Transmitter Linearization, A Systems ApproachRichard Ranson, Filtronic plc

Organizers: Edward C. Niehenke, Niehenke ConsultingDouglas W. Maki, Conexant Systems Inc.Bernard D. Geller,

Mitsubishi Electric & Electronics USA

Sponsors: MTT-6, Microwave and Millimeter Wave Integrated Circuits

MTT-20, Wireless Communications


3G systems are essential to provide more access to wirelesscommunication with higher data rates. High data rates with Inter-net access are the objectives of these 3G systems. Modulation for-mats are needed with greater bandwidth efficiency and high datarates are required without losing phone capacity or features.Wideband CDMA as well as Edge for GSM systems are being de-veloped to meet these challenges. With these 3G systems, moredemands are being made on the linearity of systems to meet thespecifications.

This workshop will first focus on the wideband CDMA andEDGE systems describing their operation and linearity require-ments. Next the various linearization techniques will be de-scribed and compared. These include predistortion, feedback,and feed forward including DSP adaptive techniques. Other lin-earization issues will be discussed. Finally speakers will addressthe latest linearization methods for 3G systems showing imple-mentation as well as results.

WMB: STATISTICAL DESIGN AND MODELING TECHNIQUESFOR MICROWAVE CAD



Topics & Speakers:

✗ Space Mapping Technology with Applications in EM-basedDevice Modeling and Statistical DesignJohn Bandler, Bandler Corporation

✗ Using Neural Networks to Develop Measurement-basedNonlinear Device Models, K.C. Gupta, University ofColorado

✗ Multi-threaded Electromagnetic Modeling Paradigm for Multi-processor PlatformsWolfgang Hoefer, University of Victoria

✗ Statistical Construction of a Representative CAD Model froma Measured Population for RF Design ApplicationsBill Leiker, Philips Broadband Networks Inc.

✗ The Role of Exact Synthesis, Statistical Design, ModelingTechniques and Post-Manufacturing Tuning for WaveguideComponents, Mauro Mongiardo, University of Perugia, Italy

✗ Design of Experiments (DOE) and it’s Application to Microwave CircuitsKrishna Naishadham, Philips Broadband Networks Inc.

✗ Monte Carlo Methods in Statistical DesignJohn Purviance, University of Idaho

✗ Space Mapping Based NeuromodelingJose E. Rayas-Sanchez, McMaster University

✗ Space Mapping Models for RF ComponentsJan Snel, Philips Semiconductors

✗ Towards Automation of Model GenerationQ.J. Zhang, Carleton University

Organizers: John Bandler, Bandler CorporationKrishna Naishadham,

Philips Broadband NetworksQ.J. Zhang, Carleton University

Sponsors: MTT-1, Computer-Aided DesignMTT-15, Microwave Field Theory


There have been extraordinary advances in EM-based model-ing capabilities, mixed linear/nonlinear field/circuit simulation,applications of wavelets, and space mapping and knowledgebased artificial neural network (ANN) technology for enhancedempirical modeling and CAD. These technologies address in-creased complexity of VLSI, RF and microwave circuits to fulfillthe industrial demand for faster design cycle and reducing timeto market for electronic products. Competition within the fastgrowing EDA market must lead to incorporation of these tech-nologies in future releases of commercial software.

An objective of this workshop is a tutorial review of the state-of-the-art and discussion of implementable methodologies, strate-gies and software. It will be substantially physically and electro-magnetically oriented. It will also highlight advances in ANNs asan unconventional alternative to modeling and design tasks in RFand microwave CAD. ANN computation is very fast and ANNscan learn and generalize from data allowing model developmenteven when component formulas are unavailable. Initiatives in in-tegration of ANN capabilities into circuit optimization, statisticaldesign, global modeling, and computational electromagneticsare being made.

With the increase in geometrical and physical complexity ofRF, microwave and high-speed digital circuits, techniques to im-prove the yield and reduce the design cycles continue to grow inimportance. An objective of this workshop is to present the theo-ry and application of statistical design tools applicable to RF/mi-crowave circuit design, manufacturing and experimental re-search. By considering component tolerances in terms of a statis-tical distribution around the nominal value instead of a range, wecan apply Monte Carlo methods and other optimization tech-niques over a large sample space. Thus, we can study the influ-ence of random variations of significant factors and their interac-tions upon the circuit performance. Monte Carlo and space-do-main statistical optimization techniques for yield maximizationwill be discussed.

We will consider characterization of random measurement er-rors, parametric effects and their interactions on the outcome ofan experiment. A statistical design tool called Design of Experi-ments (DOE) provides a powerful methodology to systematicallycharacterize the influence of main effects and their interactions.We will briefly cover the theory of DOE and apply it to someRF/microwave problems in the experimental arena.

MONDAY WORKSHOPS

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WMC: ICS FOR 40 GBIT/S DATA RATE COMMUNICATIONS



Topics & Speakers:

✗ Toward 40 Gbit/s and Beyond: Challenges for Systems,Devices and Technologies – An OverviewMichael Rozmann, Multilink Technology Corporation

✗ A SiGe Chipset for 43Gb/s DWDM Data TransmissionErnst Müllner,

Siemens Information and Communication Networks✗ Mixed-Signal Issues for 40-Gbit/s Class InP-based

Multiplexer/Demultiplexer ICsTaiichi Otsuji, Kyushu Institute of Technology

✗ Technologies of mm-Wave (30+GHz) Travelling-waveModulation, Rob Walker, Marconi Caswell Limited

✗ Limiting Amplifiers, Robert Pflieger, MITEQ Inc.✗ Decision Circuits, Jean Godin, OPTO+, France Telecom✗ Beyond 40 Gb/s?

Y. Baeyens, Lucent Technologies – Bell Laboratories

Organizers: Dr. Steve Marsh, Marconi Caswell LimitedJohn A Pierro, Miteq Inc.



Digital communications systems are already developing rapid-ly, and with the explosion in Internet and mobile phone traffic,the demand for high data rate links is likely to rise exponentially.Current high capacity trunk links use fiber-optic cables and datarates defined by the synchronous digital hierarchy (SDH) andsynchronous optical network (SONET) systems. Most of these in-cumbent systems operate at STM-16 or 2.5 Gbit/s, with only themost recent systems operating at STM-64 or 10 Gbit/s data rates.The huge upsurge in demand means that bit rates in long-haulsystems are expected to rise to STM-256 or 40 Gbit/s soon after theyear 2000.

At these data rates the transmitted signal spectrum is extremelybroadband and contains components from as low as 30 kHz,through microwave frequencies, up as high as mm-wave frequen-cies (40GHz). This presents an interesting challenge to the IC de-signer who must multiplex up numerous low data rate signalsinto one 40 Gbit/s signal, drive the optical devices to send the sig-nal down the optical fiber, amplify the detected signal at the farend, extract a clean clock signal and 40 Gbit/s data stream andde-multiplex it down into lower data rate signals. Digital engi-neers are challenged by the non square-wave shape of the highdata rate signal and the need to consider transmission line ef-fects, whilst analogue designers are challenged by jitter specifica-tions and the need for time domain analysis.

The aim of this workshop is to debate the mixed-signal issuesinvolved with integrated circuit design for 40 Gbit/s data ratecommunications systems, and expand on the technology andtechniques being used by industry leaders within this field.

WMD: ADVANCES IN CERAMIC INTERCONNECT TECHNOLOGIESFOR WIRELESS, RF, AND MICROWAVE APPLICATIONS



Topics & Speakers:

✗ Low Temperature Co-fired Ceramic Systems for Low GHzFrequenciesDr. Peter Barnwell, Heraeus Circuit Materials Division

✗ Electrical Properties of Low Loss Green Tape at 77+ GHzDan Amey, DuPont Microcircuit Materials

✗ Electronic Product Design System (EPDeS) Initiative, StatusReport, Don Brown, IWPC

✗ Design of LTCC Integrated RF Front End Modules Chris Barrat, SOREP-ERULEC

✗ Effect of Surface Roughness on Microwave Loss of LTCCSystems, Liang Chai, Ferro Electronic Materials

✗ A Simplified Method for the Design of 3D Integrated PassiveRF Functions in LTCCDongmei Cao, Raymond Brown, National Semiconductor

✗ LTCC Enhances Microwave Module PackagingBob Hunt, C-MAC MicroTechnology

✗ Modeling, Development, and Reliability Testing of a SideInterconnect for Low Temperature Co-Fired MultilayerCeramic Integrated Circuits, Tom Wetteroth, Motorola Labs

✗ Investigation of Ring-Resonators on Multilayer LTCCReinhard Kulke, IMST

✗ RF Electrical Characteristics for a Pure Copper MetalizationSystem over Low Loss Ceramic MaterialsJeff Kramer, Zecal Technology LLC

Organizers: Dr. Peter Barnwell, Heraeus Circuit Materials Division

Dr. Samuel J. Horowitz, DuPont Microcircuit Materials

Sponsors: MTT-12, Microwave and Millimeter WavePackaging/Manufacturing


The purpose of the workshop will be to acquaint engineerswith the capabilities of ceramic technologies for realizing wire-less and microwave circuits and systems. For the year 2001, in-creased emphasis will be placed on more advanced design tech-niques and applications.

The reason for running the workshop is that ceramic technolo-gies are generally less familiar to design engineers and yet offersignificant benefits in terms of circuit performance, weight andreliability. These benefits need to be communicated to design en-gineers to allow them to realize appropriate circuit and system so-lutions. Newer technologies are advancing these benefits further,while at the same time driving costs down.

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WME: ULTRA-HIGH SPEED ICS FOR COMMERCIAL APPLICATIONS –PRESENT STATUS AND FUTURE TRENDS



Topics & Speakers:

✗ An Overview of Electronics for 40+ Gb/s TransmissionMehran Mokhtari, HRL Labs

✗ SiGe HBT/BiCMOS Technology and Multigigabit ICsKatsuyoshi Washio, Hitachi Ltd.

✗ InP-based HBT Circuits for High-speed Lightwave andMillimeterwave ApplicationsYves Baeyens, Lucent Technologies

✗ VHSICs for ETDM transmission in InP DHBT TechnologyAgnieszka Konczykowska, OPTO+, France Telecom R&D

✗ InP HEMT ICs for 40-Gbit/s Optical Fiber CommunicationSystems, Koichi Murata, NTT Labs

✗ High Speed Analog-to-Digital Conversion for RF and DigitalReceiver Applications Joseph Jensen, Robert Walden, HRL Labs.

✗ Optical Networking: Matching Technology to SystemRequirements, Ira Deyhimy, Vitesse Semiconductor

✗ High-speed Electrical Crosspoint Switches for OpticalCrossconnect Systems, Charles Chang, Conexant Systems

✗ Design Considerations for Multigigabit IC PackageMohamed Megahed, Conexant Systems

Organizers: Debabani Choudhury, HRL LabsAlwyn Seeds, University College London

Sponsors: MTT-3, Lightwave TechnologyMTT-7, Microwave and Millimeter-wave

Solid State DevicesMTT-9, Digital Signal Processing


The current worldwide trend is to exploit the ultrahigh trans-mission capacity of lightwave communication technology tomeet the ever-increasing bandwidth demand of long-haul com-munications as well as internet traffic. A large number of indus-tries and academic institutes are investing resources and effortsto increase the data rate in communication and signal processingsystems. The bandwidth of the transmission is dictated by thehigh-speed electronics, which are used for transmission, recep-tion and switching.

The recent advancement in the various semiconductor tech-nologies opened up the possibility to achieve the required multi-gigabit IC performance. While 10 Gbit/s systems are commercial-ly deployed and 40 Gbit/s systems are demonstrated at the labo-ratory level, several research teams are working on 100 Gb/s andbeyond.

This workshop will bring several experts from around theworld working in this area of technology. The presentations willdescribe the latest information on design, fabrication, measure-ment, applications and product development.

The workshop will start with an overview of the ultra-highspeed ICs for commercial applications. The speakers will thenpresent multigigabit circuits implemented with various state-of-the-art integrated circuit technologies like, InP HBT, SiGe HBT,InP HEMT, etc. The workshop will also cover presentations on sig-nal processing including multi GS/s analog-to-digital conversion,optical networking as well as switching VHSICs and embed-ding/MCM issues of multigigabit systems.

WMF: HIGH DENSITY/MULTILAYER RF INTERCONNECTS



Topics & Speakers:

✗ Circuits and Antennas for RF Front EndsLinda Katehi, University of Michigan

✗ Coupling Between Closely Spaced RF Transmission Linesand Methods to Alleviate ProblemsGeorge Ponchak, NASA Glenn Research CenterEmmanouil M. Tentzeris, Georgia Institute of TechnologyJohn Papapolymerou, University of Arizona

✗ Embedded Passive Components/Devices Within HighFrequency Circuit ImplementationsA. Elshabini, University of ArkansasF.D. Barlow, University of Arkansas

✗ Thin-film Approach for Multi-chip Modules at FrequenciesBeyond 20 GHzDr. Wolfgang Heinrich,

Ferdinand Braun Institute, Germany✗ Thick-Film Technology Reduces Cost and Improves

Repeatability at Millimeter-Wave FrequenciesSebastiano Nicotra, MITEL SRL, Italy

Organizers: George E. Ponchak, NASA Glenn Research Center

John Papapolymerou, University of Arizona

Sponsors: MTT-12, Microwave and Millimeter Wave Packaging/Manufacturing


There is a growing need to reduce the size and cost of RFICsand highly integrated RF systems on a chip for smaller consumerproducts and to enable their insertion into microwave and mil-limeter-wave phased array antennas. To satisfy this goal, circuitsand packages are now incorporating multiple layers of wiring.Furthermore, more functions than simple routing are being per-formed in these multilayer circuits through the incorporation ofembedded passive elements and multiple interconnects betweenlayers. This workshop will present the challenges, state of the art,and possibilities of multilayer circuits. Presentations will describemultilayer circuits fabricated with micromachined Si wafers, thinfilm technologies, and thick film technologies.

MONDAY WORKSHOPS

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WMG: HIGH PERFORMANCEAND EMERGING FILTER TECHNOLOGIES FOR WIRELESS

Date & Time: Monday, May 21; 1:00 PM to 5:00 PM


Topics & Speakers:

✗ RF Filtering for Cellular Radio SystemsIan Hunter, Filtronic plc

✗ Trends and Evolution of High-Performance FiltersJerry Fiedziuszko, Space Systems LORAL

✗ Current Status and Future Trends in Acoustic Filters andTheir Wireless Applications, Clemens Ruppel, Siemens AG

✗ Bulk Acoustic Resonators and Filters for WirelessKen Lakin, TFR Technologies Inc.

✗ Superconducting Filters for Basestations in the USAGreg Hey-Shipton, Superconductor Technologies Inc.

✗ A 2-GHz-Band Cryogenic Receiver Front-End for IMT-2000Toshio Nojima, NTT DoCoMo Inc.

✗ Comparison Matrix for Filter TechnologiesDaniel Swanson, Bartley RF Systems Inc.

Organizers: Gregory Lyons, MIT Lincoln LaboratoryDaniel Swanson, Bartley RF Systems Inc.

Sponsors: MTT-16, Microwave SystemsMTT-18, Microwave SuperconductivityMTT-20, Wireless Communications


Wireless applications are growing at a tremendous rate andhigh-performance filters are an integral part of wireless communi-cation systems. Evolution of existing filter technologies and newemerging filter technologies fundamentally influence system im-plementation. New third-generation wireless requirements areeven more demanding than those in existing networks, in part be-cause of the high data rates required for many envisioned appli-cations, such as Internet access. This workshop begins byoverviewing present and future filter requirements for wirelesssystems. Recent evolution of traditional filter technologies will besummarized, including dielectric, cavity, ceramic, waveguide,and SAW filters. New emerging filter technologies will be intro-duced and described, including microelectromechanical sys-tems (MEMS), ferroelectric, micromachined (thin) film bulk-acoustic resonator (FBAR), and high-temperature superconduc-tive (HTS) filter technologies. Some aspects of the workshop willbe tutorial. The goal is to provide an interactive forum in whichthe attendees gain a comprehensive understanding of the variousfilter technologies. At the conclusion of the workshop, a technol-ogy matrix will be presented to compare capabilities of the vari-ous technologies. A particular emphasis will be placed onchanges to this matrix that have effectively occurred in the pastthree years. The matrix will include, for example, a comparisonof SAW, ceramic, and FBAR technologies for wirelesshandset/mobile applications. The workshop will then close withan interactive discussion of the filter technology matrix.

MONDAY WORKSHOPS

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PMA: RF CMOS FOR BLUETOOTH

Date & Time: Monday, May 21; 12:00–1:15 PM

Location: Civic Plaza,

Organizer: Sayfe Kiaei, Arizona State University

Moderator: Sayfe Kiaei

Panelists: Chris Hull, Silicon WaveStephen Heinen, InfineonDalton Walsh, Philips SemiconductorsKC Murphy, BroadcomVladimir Prodanov, Lucent TechnologiesMichael McCullagh, Parthus Technologies Teresa Meng, Atheros Communications

Advances in IC technologies have brought new opportunitiesto the modern-day wireless industry.

These include new wireless LAN methods such as 802.11a,Home RF, and Bluetooth. A new age of wireless LAN will be builton a combination of breakthroughs in wireless communicationmethods and RF processes. However, there are many challengesfacing implementers of low-cost silicon RF solutions. The focus ofthis panel discussion will be on: ✗ Technological barriers to implementing low cost

transceivers. Is CMOS the right solution?✗ What is the most appropriate system partitioning for

implementing Bluetooth in the cellular handset? Single Chip,Module, or an integrated component inside the transceiverbaseband?

MONDAY PANEL SESSION

24

NOTES

25

The MTT-S Student Paper Competition encourages and recog-nizes excellence in research in microwave science and technol-ogy. Two hundred and forty-two student papers were submittedto the competition this year. Among these submissions, 140were accepted for presentation, and the technical programcommittee selected 26 semifinalists. All accepted student pa-pers will be presented at their appropriate paper sessions. In ad-dition, the 26 semifinalists will also present their papers at theStudent Paper Competition Interactive Forums on Tuesday, May22 and Wednesday, May 23 from 2:30 to 5 PM. All Symposium at-tendees are welcome to attend these Student Paper Competi-tion Interactive Forum sessions where final presentation andjudging will occur.

Prizes will be awarded to the six best papers among the final-ists. All student semifinalists will be given certificates and compli-mentary registration to IMS2001. Cash awards in the amount of$2800 have been donated by MTT-S, and additional prizes for thisyear’s contest have been provided through generous donationsfrom Motorola SPS Inc. Travel subsidies to the Symposium for allthe finalists were sponsored by the National Science Foundationand MTT-S.

A student awards luncheon will be held at the Hyatt RegencyHotel on Thursday of IMS Week during which the awards will bepresented. All student participants, including authors and co-au-thors of submitted papers, have been invited.

Following is a listing of the semifinalists’ papers, student leadauthors and their respective institutions:

MTT-S STUDENT PAPER COMPETITION

A Novel Adaptivity for EM Time Domain Methods : Scale AdaptiveTime Steps (SATS) (WE1F-5) IF-WE

A. Rennings, Gerhard Mercator University Duisburg, Duisburg, GermanyDevelopment and Application of an Efficient FDTD/Haar MRTDNumerical Interface (WE1F-4) IF-WE

C. Sarris, University of Michigan, Ann Arbor, USAAn Approach for Knowledge-Aided-Design (KAD) of MicrowaveCircuits using Artificial Neural Networks (WE3E-2) IF-TU

R. Zingg, University of Colorado at Boulder, Boulder, USA Exact Adjoint Sensitivity Analysis for Neural Based MicrowaveModeling and Design (WE3E-3) IF-TU

J. Xu, Carleton University, Ottawa, CanadaAn Improved Behavioral Modeling Technique for High PowerAmplifiers with Memory (WE2C-5) IF-TU

N. Le Gallou, The University of Limoges, FranceImproved Large-Signal Model and Model Extraction Procedure for InGaP/GaAs HBTs Under High Current Operations (WE1C-3)IF-

S. Cherepko, Lehigh University, Bethlehem, USAComparison of Wavelet- and Time-Marching-Based MicrowaveCircuit Transient Analyses (TUIF-13) IF-WE

C.E. Christoffersen, North Carolina State University, Raleigh, USAA Novel CPW Structure for High-speed Interconnects (WE2A-3) IF-WE

S. Yoon, KJIST, Gwangju, South KoreaA Novel Low-Loss Slow-Wave CPW Periodic Structure for FilterApplications (TU4B-3) IF-WE

J. Sor, University of California, Los Angeles, USADevelopment of Vertical Planar Coil Inductors Using PlasticDeformation Magnetic Assembly (PDMA) (TU3B-3) IF-WE

J. Zou, Univ. of Illinois, Urbana, USAA Novel Nonreciprocal Ferrite Image Guide (WE4F-3) IF-TU

A.S. Akyol, UMIST, Manchester, UK 2 and 4-Bit DC-16 GHz Microstrip MEMS Distributed PhaseShifters (TU3C-3) IF-WE

J.S. Hayden, University of Michigan, Ann Arbor, USATunable Lumped Components with Applications to ReconfigurableMEMS Filters (TU4C-6) IF-WE

D. Peroulis, University of Michigan, Ann Arbor, USA.

185 GHz Monolithic Amplifier in InGaAs/InAlAs Transferred-Substrate HBT Technology (TH2F-6) IF-WE

M. Urteaga, University of California, Santa Barbara, Santa Barbara, USAA Full Waveguide Band MMIC Tripler for 75-110 GHz (TU1D-6) IF-TU

M. Morgan, California Institute of Technology, Pasadena, USAA 1W CMOS Power Amplifier for GSM-1800 with 55% PAE (WE3A-1) IF-TU

C. Fallesen, Technical University of Denmark, Copenhagen, DenmarkHigh Power Broadband AlGaN/GaN HEMT MMICs on SiCSubstrates (WE4A-2) IF-TU

B.M. Green, Cornell University, Ithaca, USAUltra-Linear Distributed Class-AB LDMOS RF Power Amplifier for Base Stations (WEIF-42) IF-WE

M.P. van der Heijden, Delft University of Technology, Delft, TheNetherlands

Integrated Electro-Thermal Probe (TH1E-1) IF-WER.M. Reano, University of Michigan, Ann Arbor, USA

A Microwave Radio for Doppler Radar Sensing of Vital Signs(TU1F-8) IF-TU

A.D. Droitcour, Stanford University, Stanford, USAA Novel Millimeter-Wave Beam-Steering Technique Using aDielectric-Image-Line-Fed Grating Film (TU3E-3) IF-WE

C.T. Rodenbeck, Texas A&M University, College Station, USAA Novel Planar Array Smart Antenna System with Hybrid Analog-Digital Beamforming (TU1E-1) IF-TU

S. Jeon, University of California, Los Angeles, Los Angeles, USAA Compact LTCC Ku-Band Transmitter Module with IntegratedFilter for Satellite Communication Applications (WE3B-1) IF-TU

C. Lee, Georgia Institute of Technology, Atlanta, USAA Highly-Integrated Low-Power Direct Conversion Receiver MMICfor Broadband Wireless Applications (WE4B-2) IF-TU

B. Matinpour, Georgia Institute of Technology, Atlanta, USAA Reconfigurable Active Retrodirective/Direct Conversion ReceiverArray for Wireless Sensor Systems (WE4C-4) IF-TU

R.Y. Miyamoto, University of California, Los Angeles, Los Angeles, USAIn-band Optical Crosstalk in Fiber-radio WDM Networks (WE3D-4) IF-TUD. Castleford, University of Melbourne, Australia

TU

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IF-TU: Interactive Forum presentation takes place Tuesday, May 22IF-WE: Interactive Forum presentation takes place Wednesday, May 23

TU1A Techniques for System Level NonlinearAnalysis and Simulation

Chair: P. Draxler, QUALCOMM, Inc.Co-chair: S. Kenney, Georgia Institute of Tech.

BALLROOM

TU1A-1: Analysis of CDMA Spectral Regrowth and WaveformQualityV. Aparin, QUALCOMM, Inc., San Diego, CA

TU1A-2: Generalized Autocorrelation Analysis of SpectralRegrowth from Bandpass Nonlinear CircuitsK. Gard, QUALCOMM Inc., San Diego, CA; L.E. Larson,University of California San Diego, San Diego, CA; M.B. Steer,North Carolina State University, Raleigh, NC

TU1A-3: Application of Polyspectral Techniques to NonlinearModeling and CompensationC.P. Silva, A.A. Moulthrop, M.S. Muha, C.J. Clark, The Aerospace Corp., El Segundo, CA

TU1A-4: Estimation of Error Vector Magnitude using Two-toneIntermodulation Distortion MeasurementsH. Ku, J.S. Kenney, Georgia Institute of Technology, Atlanta, GA

TU1A-5: Investigation of Behavioral Model Accuracy using aState-space and Convolution-based Transient SimulatorA. Zhu, T.J. Brazil, University College Dublin, Dublin, Ireland

TU1A-6: Efficient Circuit-level Analysis of Large MicrowaveSystems by Krylov-subspace Harmonic BalanceV. Rizzoli, A. Lipparini, D. Masotti University of Bologna,Pontecchio Marconi (BO), Italy; F. Mastri, University of Bologna, Bologna, Italy

8:00

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TU1B Power Combiners/Dividers and Directional Couplers

Chair: C. Buntschuh, Microwave Engineering

TUCSON 36–38

TU1C Microwave Photonics

Chair: P. Yu, UCSDCo-chair: E. Rezek, TRWTUCSON 40–41

TU1B-1: A Novel 3-way Hybrid Combiner/Divider for HighPower C-class Microwave AmplifiersM. Catoiu, Raytheon, Canada, Waterloo, Canada

TU1C-1: Three-dimensional Millimeter-wave PhotonicIntegrated Circuits on SiT. Minotani, Y. Royter, H. Ishii, A. Hirata, K. Machida, A. Sasaki,T. Nagatsuma, NTT Telecommunication Energy Laboratories,Atsugi, Japan

8:10

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TU1B-2: A Novel Design of 1 to 8 Power Divider/CombinerX. Jiang, S. Ortiz, A. Mortazawi, NC State, Raleigh, NC

8:20

AM

TU1B-3: A Low-loss Serial Power Combiner using NovelSuspended Stripline CouplersY. Tahara, H. Oh-hashi, T. Ban, K. Totani, M. Miyazaki,Mitsubishi Electric Corp., Kamakura, Japan

TU1C-2: Wide Bandwidth Traveling-wave InGaAsP/InPElectroabsorption Modulator for Millimeter-wave ApplicationsG. Li, W.S. Chang, P.K. Yu, UC San Diego, La Jolla, CA; S.A. Pappert, C.K. Sun, SPAWAR Systems Center, San Diego, CA

8:30

AM

TU1B-4: A Compact Coaxial Waveguide Combiner Design for Ultra-broadband Power AmplifierP. Jia, R.A. York, University of California, Santa Barbara, CA

8:40

AM

TU1C-3: High-power Photonic Microwave Generation at K- and Ku-bands using a Uni-traveling-carrier PhotodiodeH. Ito, H. Fushimi, Y. Muramoto, T. Furuta, T. Ishibashi, NTTPhotonics Labs, Atsugi, Japan

8:50

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TU1B-5: Broadband Lumped-element 180-degree HybridsUtilizing Lattice CircuitsK. Tadashi, K. Yoshihio, O. Isao, Himeji Institute of Technology,Himeji-shi, Japan

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9:10

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9:20

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TU1B-6: Design of High Directivity Directional Couplers inMultilayer Ceramic Technologies LTCC/HTCCS. Al-taei, P. Lane,University College London, London, UK; G. Passiopoulos,Nokia Networks, Camberley, UK

TU1C-4: Direct Opto-electronic Synthesis of mW-levelMillimeter-wave Signals using an Optical Frequency CombGenerator and a Uni-traveling-carrier PhotodiodeS. Fukushima, Y. Muramoto, NTT Photonics Labs, Atsugi-City,Japan, C.F. Silva, A.J. Seeds, University College London,London; England

TU1C-5: Photodetection, Photonic Feeding Coplanar PatchAntenna and Transmitting Experiment for Radio-on-fiber SystemK. Li, M. Izutsu, CRL, Japan, Koganei-shi, Japan

TU1C-6: Experimental Reduction of Dispersion-induced Effectsin Microwave/Millimeter-wave Optical Systems Employing SOABoostersF. Ramos, J. Herrera, J. Marti, Universidad Politecnica deValencia, Valencia, Spain

9:30

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TUESDAY, MAY 22, 2001 IEEE MTT-S IMS TECHNICAL SESSIONS 8:00–9:40 AM

TU1E Smart Antennas

Chair: M. Thursby, SkyCross Inc.Co-chair: B. Perlman, CECOM

YUMA 26–28, 31–33

TU1E-1: A Novel Planar Array Smart Antenna System with Hybrid Analog-digital BeamformingS. Jeon, Y. Wang, Y. Qian, T. Itoh, University of California, Los Angeles, Los Angeles, CA

TU1E-2: Digital Beamforming for Smart AntennasT. W. Nuteson, G.S. Mitchell, The Aerospace Corp., Chantilly, USA

TU1E-3: Smart Lens Antenna ArraysJ.E. Vian, MIT Lincoln Labs, Lexington, MA; Z. Popovic,University of Colorado, Boulder, CO

TU1E-4: Adaptive Beamforming of ESPAR Antenna using Sequential PerturbationJ. Cheng, Y. Kamiya, T. Ohira, ATR Adaptive CommunicationsResearch Laboratories, Soraku-gun, Japan

TU1E-5: Microwave Device Combining Filtering and RadiatingFunctions for Telecommunication SatellitesH. Blondeaux, D. Baillargeat, P. Leveque, S. Verdeyme, P. Vaudon, P. Quillon, IRCOM, Limoges, France; A. Carlier, Y. Cailloce, Alcatel Space Industries, Toulouse, France

TU1E-6: An Internet Controlled Calibration System for TDMASmart Antenna Wireless Base StationsJ.H. Sinsky, Bell Laboratories – Lucent Technologies, Holmdel, USA

27

TU1D Frequency Converters

Chair: M. Madihian, NECCo-chair: L. Reynolds, RF Micro Devices

TUCSON 42–43

TU1D-1: RF Mixers using Standard Digital CMOS 0.35 µmProcessV. Geffroy, ACCO, Saint-Germain-En-Laye, France; G. De Astis,ATMEL, Rousset, France; E. Bergeault, Ecole NationaleSuperieure des Telecommunications, Paris, France

TU1D-2: Broadband and Compact SiBJT Balanced Up-converterMMIC using Si 3-D MMIC TechnologyK. Nishikawa, T. Nakagawa, B. Piernas, K. Araki, NTT NetworkInnovation Laboratories, Yokosuka-shi, Japan; K. Kamogawa,NTT DoCoMo Inc., Yokosuka-shi, Japan

TU1D-3: A Highly Linear Single Balanced Mixer Based on Heterojunction Interband Tunneling DiodeA. Cidronali, G. Collodi, G. Manes, C. Toccafondi, Univ of Florence, Florence, Italy; M. Deshpande, N. El-Zein, H. Goronkin, V. Nair, Phys Sciences Res Lab, USA

TU1D-4: A 60 GHz Uniplanar MMIC 4X Subharmonic MixerM.W. Chapman, S. Raman, Virginia Polytechnic Institute and State University, Blacksburg, VA

TU1D-5: A Monolithic HEMT Diode Balanced Mixer for 100–140 GHzM. Morgan, California Institute of Technology, Pasadena, CA; S. Weinreb, Jet Propulsion Laboratory, Pasadena, CA

TU1D-6: A Full Waveguide Band MMIC Tripler for 75–110 GHzM. Morgan, California Institute of Technology, Pasadena, CA; S. Weinreb, Jet Propulsion Laboratory, Pasadena, CA

TU1D-7: High Gain PHEMT Frequency Doubler for 76 GHzAutomotive RadarA. Werthof, H. Tischer, T. Grave, Infineon Technologies AG,Munich, Germany

TU1D-8: A Stability Ensuring Design Approach for FrequencyTriplersB. Bunz, G. Kompa, University of Kassel, Kassel, Germany

TU1D-9: A Family of Q, V and W-band Monolithic ResistiveMixersM. Kimishima, T. Ataka, H. Okabe, Advantest Corp., Gyoda, Japan

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8:50

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TU1F Biological Effects and Medical Applications

Chair: J. Pribetich, University of LilleCo-chair: P. Yu, University of California

YUMA 21–23

TU1F-1: Temperature Rise for the Human Head for CellularPhones and for Peak SARs Prescribed in Safety GuidelinesO.P. Gandhi, Q. Li, G. Kang, University of Utah, Salt Lake City, UT

TU1F-2: Power Absorption and Temperature Elevations Inducedin the Human Head by Dual-band PhonesP. Bernardi, M. Cavagnaro, S. Pisa, E. Piuzzi, University “La Sapienza” of Rome, Rome, Italy

TU1F-3: Miniature Sensor for Measurement and Control ofTemperatures by Microwave Radiometry in Medical ApplicationsC. Vanoverschelde, L. Dubois, V. Thomy, J. Sozanski, J. Camart,M. Chive, J.P. Pribetich, Université des Sciences &Technologies de Lille – IEMN, Villeneuve D’Ascq, France

TU1F-4: Analysis of Planar Strip Array Antenna for MRIR.F. Lee, GE Corporate R&D, Niskayuna, USA; C.R. Westgate,Johns Hopkins University, Baltimore, MD

TU1F-5: Resonant Slot Antennas as Transducers of DNAHybridization: A Computational Feasibility StudyC. Wichaidit, J.R. Peck, Z. Lin, R.J. Hamers, S.C. Hagness, D.W.van der Weide, University of Wisconsin – Madison, Madison, WI

TU1F-6: A Zeeman-Stark/Markov Model Approach to Study theEM Exposure of a Potassium ChannelS. Bruna, S. Giordano, E. Moggia, B. Bianco, University ofGenoa, Genoa, Italy; M. Liberti, G. D’Inzeo, University of Rome,Rome, Italy

TU1F-7: Non-invasive Measurement of Blood Sugar Level byMillimeter WavesY. Nikawa/Yoshio, D. Someya/Daisuke, Kokushikan University,Setagaya, Japan

TU1F-8: A Microwave Radio for Doppler Radar Sensing of Vital SignsA.D. Droitcour, Stanford University, Stanford, USA; V.M.Lubecke, J. Lin, O. Boric-Lubecke, Lucent Technologies, MurrayHill, NJ

TUESDAY, MAY 22, 2001 IEEE MTT-S IMS TECHNICAL SESSIONS 1:20–3:00 PM

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TU3B Baluns, Spiral Inductors and Resonators

Chair: A. Fathy, Sarnoff Corp.Co-chair: George Ponchak, NASA Glenn Research

TUCSON 36–38

TU3C MEMS for Antenna Applications

Chair: S. Barker, University of VirginiaCo-chair: T. Weller, University of South Florida

TUCSON 40–41

TU3D Control Devices

Chair: M. Goldfarb, Analog DevicesCo-chair: S. Brozovich, Filtronics Solid State

TUCSON 42–43

TU3B-1: Sandwich Type Ferromagnetic RF Integrated InductorM. Yamaguchi, M. Baba, K. Arai, Tohoku University, Sendai,Japan

TU3C-1: 2-D Mechanical Beam Steering Antenna Fabricatedusing MEMS TechnologyC. Baek, S. Song, Y. Kim, Y. Kwon, Seoul National University,Seoul, Korea, South; C. Cheon, University of Seoul, Seoul,Korea, South

TU3D-1: A Novel Digital Phase Shifter Design at X-bandJ. Zhang, S. Ortiz, A. Mortazawi, North Carolina StateUniversity, Raleigh, NC

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TU3D-2: An Ultra Broad Band Reflection Type 180 degree PhaseShifter with Series and Parallel LC CircuitsK. Miyaguchi, M. Hieda, K. Nakahara, M. Kasahara, T. Takagi,Mitsubishi Electric Corp, Kamakura, Japan; H. Kurusu,Mitsubishi Electric Corp, Itami, Japan; M. Nii, MitsubishiElectric Corp, Amagasaki, Japan

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TU3B-2: Improved Three-dimensional GaAs InductorsB. Piernas, K. Nishikawa, T. Nakagawa, K. Araki, NTT NetworkInnovation Laboratories, Yokosuka-shi, 239-0847 Japan; K. Kamogawa, NTT DoCoMo Inc., Yokosuka-shi, 239-8536 Japan

TU3C-2: Microelectromechanical Systems (MEMS) Actuators for Antenna ReconfigurabilityR.N. Simons, Dynacs Engineering Company Inc./NASA GlennResearch Center, Cleveland, OH; D. Chun, L.P. Katehi,University of Michigan, Ann Arbor, MI

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TU3D-3: A High-performance GaAs SP3T Switch for DigitalCellular SystemsZ. Gu, S. Zhang, D. Johnson, S. Belletete, M. Ayvazian, D. Fryklund, Alpha Industries, Woburn, MA

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TU3B-3: Development of Vertical Planar Coil Inductors using Plastic Deformation Magnetic Assembly (PDMA)J. Zou, J.G. Nickel, D. Trainor, C. Liu, J.E. Schutt-Aine, Univ. of Illinois, Urbana, IL

TU3C-3: 2 and 4-bit DC-16 GHz Microstrip MEMS DistributedPhase ShiftersJ.S. Hayden, G.M. Rebeiz, University of Michigan, Ann Arbor,MI; A. Malczewski, J. Kleber, C.L. Goldsmith, Raytheon SystemsCorp, Dallas, TX

TU3D-4: High Isolation V-band SPDT Switch MMIC for HighPower UseT. Shimura, Y. Mimino, K. Nakamura, Y. Aoki, S. Kuroda,Fujitsu Quantum Devices Limited, Hachiohji-shi, Japan

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TU3B-4: A Low-loss Planar Microwave Balun with an Integrated Bias Scheme for Push-pull AmplifiersJ. Lee, K.J. Webb, Purdue University, West Lafayette, USA

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TU3B-5: Graphical Design of Air-gap Stacked Marchand BalunG. Ryu, LG Electronics Institute of Technology, Seoul, Korea; D. Kim, J. Lee, K. Seo, Seoul National University, Seoul, Korea

TU3B-6: High-Q Frequency Stable Dual-mode WhisperingGallery Sapphire ResonatorM.E. Tobar, E.N. Ivanov, J.G. Hartnett, University of WesternAustralia, Crawley, Australia; D. Cros, University of Limoges,Limoges, France

TU3C-4: MEMS X-band Low Loss Quad Time Delay UnitH.N. Fudem, L. Chen, R.J. March, R.C. Tranchini, D.E. Crockett,J.W. Gipprich, J.E. Kositz, G.K. Sinon, Northrop GrummanCorp., Baltimore, MD

TU3C-5: Lifetime Characterization of Capacitive RF MEMSSwitchesC. Goldsmith, J. Ehmke, A. Malczewski, B. Pillans, S. Eshelman,Z. Yao, J. Brank, M. Eberly, Raytheon Company, Dallas, TX

TU3D-5: Switches with Capacitor Cancelled ParasiticInductance of FETK. Kazuhiko, K. Miyaguchi, M. Hieda, T. Takagi, MitsubishiElectric Corp., Kamakura, Japan; H. Kurusu, Mitsubishi ElectricCorp., Hyogo, Japan

TU3D-6: A V-band MMIC SPDT Passive HEMT Switch using Impedance Transformation NetworksY. Wang, K. Lin, H. Wang, National Taiwan University, Taipei,ROC; D. Niu, Chung-Shan Institute of Science and Technology,Tai-Yuan, ROC

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TU3E Phased Array Antennas

Chair: K. Chang, Texas A&M UniversityCo-chair: R. Sudbury, MIT Lincoln Laboratory

YUMA 26–28, 31–33

TU3E-1: New Phase Shifter and Phased Antenna Array DesignsBased on Ferroelectric Materials and CTS TechnologiesM.F. Iskander, Z. Zhang, Z. Yun, R. Isom, M. Hawkins, Univ. of Utah, Salt Lake City, UT; R. Emrick, B. Bosco, Motorola Inc.,Chandler, AZ; J. Synowczynski, B. Gersten, US Army Res Lab,Aberdeen Proving Ground, USA

TU3E-2: A Bi-directionally Steering Phased Array AntennaControlled by Dual Piezoelectric TransducersT. Yun, K. Chang, Texas A&M University, College Station, TX

TU3E-3: A Novel Millimeter-wave Beam-steering Techniqueusing a Dielectric-image-line-fed Grating FilmC.T. Rodenbeck, M. Li, K. Chang, Texas A&M University,College Station, TX

TU3E-4: A Method for Determining Noise Coupling in a PhasedArray AntennaJ.P. Peeters Weem, A. Popovic, University of Colorado, Boulder,CO

TU3E-5: Performance of Thinned Antenna Arrays usingNonlinear Processing in DBF Radar ApplicationsC. Metz, L.C. Stange, A.F. Jacob, Institut fürHochfrequenztechnik, Braunschweig, Germany; E. Lissel,Volkswagen AG, Wolfsburg, Germany

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TUESDAY, MAY 22, 2001 IEEE MTT-S IMS TECHNICAL SESSIONS 3:30–5:10 PM

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TU4A Low Noise Amplifiers (LNAs)Joint IMS/RFIC Session

Chair: S. Lloyd, Conexant Co.Co-chair: K. Ashby, Microtune Inc.

BALLROOM

TU4B Innovative Structures

Chair: J. Owens, Auburn University

TUCSON 36–38

TU4C MEMS Control Circuits

Chair: C. Goldsmith, Raytheon CompanyCo-chair: C. Nguyen, University of Michigan

TUCSON 40–41

TU4A-1: A Wide Dynamic Range Switched-LNA in SiGe BiCMOST. Nakatani, Matsushita Electric Industrial Co., Ltd., KadomaCity, Japan; J. Itoh, I. Imanishi, O. Ishikawa, MatsushitaElectronics Corp., Takatsuki, Japan.

TU4B-1: Passive Electromagnetic Compensation of PermittivityChanges in Microwave CircuitsJ. Hesselbarth, R. Vahldieck, ETH, Zurich, Switzerland

TU4C-1: MEMS Single-pole Double-throw (SPDT) X and K-bandSwitching CircuitsS.P. Pacheco, D. Peroulis, L. Katehi, University of Michigan,Ann Arbor, MI

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TU4C-2: DC-26 GHz MEMS Series-shunt Absorptive SwitchesG. Tan, G.M. Rebeiz, University of Michigan, Ann Arbor, MI

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TU4A-2: Dual Bias Feed SiGe HBT Low Noise Linear AmplifierE. Taniguchi, K. Maeda, N. Suematsu, T. Takagi, MitsubishiElectric Corp, Kamakura, Japan; T. Ikushima, K. Sadahiro, K. Itoh, Mitsubishi Electric Corp, Amagasaki, Japan

TU4B-2: 360-degree Linear Analog Phase Shifter Design usingTunable Short-circuit Terminated Combline FiltersS. Shin, R.V. Snyder, E. Niver, New Jersey Institute of Technology, Newark, NJ

TU4C-3: MEMS High Q Microwave Inductors using SolderSurface Tension Self-assemblyG.W. Dahlmann, E.M. Yeatman, Imperial College, London, UK;P.R. Young, I.D. Robertson, S. Lucyszyn, University of Surrey,Guildford, UK

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TU4C-4: Micromachined Frequency-variable Impedance Tunersusing Resonant Unit CellsS. Jung, K. Kang, J. Park, Y. Kim, Y. Kwon, Seoul NationalUniversity, Seoul, Korea; K. Chung, WAVICS Co. Ltd., Seoul,Korea

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TU4A-3: A 1.4 dB NF Variable Gain LNA with ContinuousControl for 2 GHz-band Mobile Phone using InGaP Emitter HBTY. Aoki, M. Fujii, H. Dodo, H. Hida, NEC Corp., Tsukuba, Japan;S. Ohkubo, S. Yoshida, T. Niwa, Y. Miyoshi, N. Goto, NEC Corp.,Kawasaki, Japan

TU4B-3: A Novel Low-loss Slow-wave CPW Periodic Structurefor Filter ApplicationsJ. Sor, Y. Qian, T. Itoh, UCLA Microwave Electronics Laboratory,Los Angeles, CA

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TU4C-5: A Reconfigurable Double-stub Tuner using MEMSDevicesK.L. Lange, Raytheon Co., Tucson, AZ; J. Papapolymerou, he University of Arizona, Tucson, AZ; C.L. Goldsmith, A. Malczewski, J. Kleber, Raytheon Co., Dallas, TX

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TU4A-4: A 1.7 mA Low Noise Amplifier with Integrated BypassSwitch for Wireless 0.05-6 GHz Portable ApplicationsH. Morkner, M. Frank, S. Yajima, Agilent Technologies, Newark,NJ

TU4B-4: Overlapping, Multiple CPW Stub Structures for HighDensity MMICsK. Hettak, C.J. Verver, M.G. Stubbs, Communications ResearchCentre, Ottawa, Canada

TU4B-5: LTCC-MLC Balun for WLAN/BluetoothC. Tang, Industrial Technology Research Institute, Chutung,Taiwan

TU4C-6: Tunable Lumped Components with Applications toReconfigurable MEMS FiltersD. Peroulis, S. Pacheco, K. Sarabandi, L.P. Katehi, University of Michigan, Ann Arbor, MI

TU4C-7: A Micromachined Tunable CPW ResonatorT. Ketterl, T. Weller, University of South Florida, Tampa, FL; D. Fries, University of South Florida, St. Petersburg, FL

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Chair: W. Shiroma, University of HawaiiCo-chair: D. McQuiddy, Triquint Inc.

YUMA 26–28, 31–33

TU4D Acoustic Devices for WirelessCommunications and Sensing

Chair: R. Weigel, University of LinzCo-chair: C.C.W. Ruppel, EPCOS, Munich

TUCSON 42–43

TU4E-1: Silicon Based Reconfigurable AntennasA.E. Fathy, A. Rosen, H. Owen, S. Kanamaluru, F. Mcginty, D. Mcgee, G. Taylor, P.K. Swain, S. Perlow, Sarnoff Corp.,Princeton, USA; M. ElSherbiny, Future Technology Inc., Irvine, CA

TU4D-1: Invited: SAW Filter Solutions to the Needs of 3GCellular PhonesG. Fischerauer, T. Ebner, P. Kruck, K. Morozumi, R. Thomas, M. Pitschi, Epcos, 81617 Munich, Germany

TU4E-2: Hilbert Curve Fractal Antennas with ReconfigurableCharacteristicsK.J. Vinoy, K.A. Jose, V.K. Varadan, V.V. Varadan, The Pennsylvania State University, University Park, PA

TU4D-2: Optimized Design and Fabrication of a WirelessPressure and Temperature Sensor Unit Based on SAWTransponder TechnologyG. Schimetta, R. Weigel, Johannes Kepler University, Linz,Austria; F. Dollinger, G. Scholl,Siemens Corporate Research,Munich, Germany

TU4E-3: Active Antenna using Multi-layer Ceramic-polyimideSubstrates for Wireless Communication SystemsT. Seki, H. Yamamoto, T. Hori, M. Nakatsugawa, NipponTelegraph and Telephone Corp., Yokosuka, Japan

TU4D-3: Spurious Suppression Technique of Edge-trap-type SAWResonators and Their Applications to 1-GHz Wide-band SAW-VCOs for Mobile CommunicationsT. Kachi, A. Isobe, K. Asai, M. Hikita, Central ResearchLaboratory, Hitachi, Ltd., Kokubunji-sho, Japan; A. Sumioka,Hitachi Kokusai Electric Inc., Kodaira-shi, Japan

TU4D-4: The Application of Dielectric Thin Films to Enhancethe Properties of SAW DevicesF.S. Hickernell, Motorola Inc., and the University of Arizona,Phoenix, AZ

TU4D-5: A Film Bulk Acoustic Resonator (FBAR) Duplexer for USPCS Handset Applications.P.D. Bradley, R. Ruby, Y. Oshmyansky, Agilent Technologies,Newark, NJ; J.D. Larson, Agilent Technologies, Palo Alto, CA

TU4D-6: FBAR Dispersion Relation and Laser MeasurementsP.T. Tikka, Nokia Mobile Phones Ltd., Helsinki, Finland; G.G. Fattinger, Johannes Kepler University, Linz, Austria

TU4E-4: A Ka-band High-efficiency Dielectric Lens Antennawith a Silicon Micromachined Microstrip Patch RadiatorU. Sangawa, K. Takahashi, H. Yabuki, Kawasaki, Japan; T. Urabe, H. Ogura, Kadoma, Japan

TU4E-5: A Multifunctional Antenna for Terrestrial and SatelliteRadio ApplicationsS.M. Lindenmeier, J.F. Luy, DaimlerChrysler Research and Technology, Ulm, Germany; P. Russer, TechnischeUniversitaet Muenchen, Munich, Germany

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Tuesday, May 22, 5:00–10:00 PM

MTT-S Special Tuesday Evening Event,Corona Ranch & Rodeo Grounds

MTT-S 2001 will sponsor a unique southwestern eventon Tuesday evening. We have reserved a fleet of busesthat will transport you to Corona Ranch and RodeoGrounds, located in the shadow of South Mountain. As youexit your bus, you will be greeted by Mariachis and Mar-garitas. Once inside the grounds, the reception will startwith a variety of hors d’hourves and libations to celebratethe spirit of the southwest. Walk around the grounds andparticipate in several Cowboy events: See how long youcan ride the bucking barrel (er, we mean “bull”)! Ourcowboys will provide roping lessons, after which you willtest your new found skills by roping a mechanical “calf.”And, of course, the activities would not be complete with-out lessons in the quick draw – after which, you will get totry out your fast draw against your fellow conference at-tendees! A Country & Western band will keep you rockin’throughout the night.

This special event will include a Rodeo Show that high-lights the most exciting portions of both Western Rodeoand Mexican Charreada. The Charreada will demonstrateriding, roping, accuracy, and style. The Western Rodeoshowcases wild bull riding and western style wild broncoriding. Other activities will include precision high speedhorse maneuvers, trick roping, the women’s formationdrill team and much more! We will also have two very spe-cial Audience Participation rodeo events set aside forMTT-S attendees! This is one of the best parts of theRodeo and promises to be a hilarious event.

After the Rodeo, the feast begins…our Cowboy cui-sine includes mesquite grilled top sirloin paired with BBQchicken and western ribs. Mixed greens, baked beans,corn-on-the-cob, fabulous dessert and coffee will roundout the dinner. Our buses will whisk you back to your ho-tel at the end of the evening.

There will be plenty of fun, games and prizes. Ticketsare limited. Get ‘em early or miss out on one of the bestevents of this year’s Symposium! Transportation will be-gin boarding at the Civic Plaza at 5:00 PM.

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TUIF-1: LDMOS Electro-thermal Model Validation from Large-signal Time-domainMeasurementsR. Gaddi, J. Benedikt, P.J. Tasker, School of Engineering, Cardiff University, Cardiff, UK; J.A. Pla, Motorola, Tempe, AZ

TUIF-2: Tunnel Diode Non-linear Model for Microwave Circuits and Active AntennasM.R. Deshpande, V. Nair, N. El-Zein, H. Goronkin, Motorola Inc., Tempe, AZ; K. Liu, S.M. El-Ghazaly, Arizona State University, Tempe, AZ; A. Cidronali, G. Manes, University ofFlorence, Firenze, Italy

TUIF-3: A Simple Bias Dependent LF Noise Model for CADI.M. Angelov, R.S. Kozhuarov, H.H. Zirath, Chalmers Univ., Goteborg, Sweden

TUIF-4: Temperature-dependent Modeling of High Power MESFET using Thermal FDTDMethodW. Wojtasiak, D. Gryglewski, Institute of Radioelectronics, Warsaw, Poland

TUIF-5: Full Wave Analysis of FET Fingers using Various Semiconductor Physical ModelsS. Goasguen, M. Tomeh, S. El-Ghazaly, Arizona State University, Tempe, AZ

TUIF-6: Generation of Multicarrier Complex Lowpass Models of RF ICsP. Dobrovolny, P. Wambacq, G. Vandersteen, S. Donnay, M. Engels, I. Bolsens, IMEC, Leuven,Belgium

TUIF-7: A Measurement Based Distributed Low Frequency Noise HEMT Model: Application to Design of Millimeter Wave Automotive Radar Chip SetsA. Laloue, A. Lyoubi, J. Nallatamby, M. Prigent, J. Obregon, University of Limoges, Brive LaGallarde, France; M. Camiade, UMS-SAS, Orsay, France

TUIF-8: Pulse Characterization of Trapping and Thermal Effects of Microwave GaN PowerFETsS. Augaudy, R. Quéré, J. Teyssier, IRCOM CNRS, Brive, France; M. di Forte Poisson, S. Cassette, B. Dessertenne, S. Delage, Thomson CSF, Orsay, France

TUIF-9: Thermal Transients in Microwave Active Devices and Their Influence on Intermodulation DistortionS. David, W. Batty, A.J. Panks, R.G. Johnson, C.M. Snowden, Institut of Microwaves and Photonics, University of Leeds, Leeds, UK

TUIF-10: A Krylov-subspace Technique for the Global Stability Analysis of Large NonlinearMicrowave CircuitsV. Rizzoli, E. Furini, A. Costanzo, University of Bologna, Pontecchio Marconi (BO), Italy; F. Mastri, University of Bologna, Bologna, Italy

TUIF-11: Two-tone Intermodulation Distortion Simulations in the Time Domain using a Quasi-2D Physical pHEMT ModelP.J. Rudge, R. Miles, C. Snowden, University of Leeds, Leeds, UK; M. Steer, North CarolinaState University, Raleigh, NC

TUIF-12: Nonlinear Analysis of a Microwave Synthesizer Based on a Sampling-phase DetectorS. Sancho, S. Ver Hoeye, A. Suarez, J. Chuan, A. Tazon, Universidad de Cantabria, Santander,Spain

TUIF-13: Comparison of Wavelet- and Time-marching-based Microwave Circuit TransientAnalysesC.E. Christoffersen, M.B. Steer, North Carolina State University, Raleigh, NC

TUIF-14: Efficient Algorithm for Steady-state Stability Analysis of Large Analog/RF Circuits.P. Bolcato, C.S. Rumolo, R. Larcheveque, ANACAD-MGC, Meylan, France; J. Nallatamby, M.A. Prigent, J.J. Obregon, IRCOM, Brive, France

TUIF-15: Novel Artificial Frequency Mapping Techniques for Multi-tone Simulation of MixersN.B. de Carvalho, J.C. Pedro, Universidade de Aveiro, Aveiro, Portugal

TUIF-16: New System-level Simulation of Noise Spectra Distortion in FM-CW AutonomousCruise Control Radars.A. Laloue, J. Nallatamby, M. Prigent, J. Obregon, University of Limoges, Brive La Gaillarde,France; M. Camiade, UMS S.A.S., Orsay, France

TUIF-17: Spectrum Management of Pulse Transmission Line by High-cut Filter using Magnetic LossT. Miura, TDK Techno Corp., Ichikawa, Japan; S. Nakagawa, TDK Corp., Ichikawa, Japan

TUIF-18: Null Pattern Synthesis of Ferroelectric Smart AntennasJ. Modelski, Y. Yashchyshyn, Warsaw University of Technology, Warszawa, Poland

TUIF-19: Ferroelectric Thin-film Based Electrically Tunable Ku-band Coplanar WaveguideComponentsG. Subramanyam, N. Mohsina, A.A. Zaman, University of Dayton, Dayton, OH; F.W. Van Keuls, R.R. Romanofsky, F.A. Miranda, J.D. Warner, NASA Glenn Research Center,Cleveland, OH

TUIF-20: Performance and Modeling of Saw Tooth Edge Mode IsolatorsA.H. Aly, B. Elsharawy, Arizona State University, Tempe, AZ

TUIF-21: Possibility of Ultra Fine Isolator for Portable PhoneS. Takdeda, Hitachi Metals, Ltd., Tokyo, Japan; Y. Kishimoto, H. Itoh, Hitachi Metals, Ltd.,Tottori, Japan; K. Ichikawa, Hitachi Metals Ltd., Kumagaya, Japan

TUIF-22: Modeling Coplanar Waveguide Structures Constructed of Ferromagnetic MetalN. Cramer, U. of Colorado, Colorado Springs, Colorado Springs, CO; D.K. Walker, NationalInstitute of Standards and Technology (NIST), Boulder, CO

TUIF-23: Planar Ka-band High Temperature Superconducting Filters for Space ApplicationsC. Lascaux, F. Rouchaud, V. Madreangeas, M. Aubourg, P. Guillon, IRCOM, Limoges, France;B. Theron, M. Maignan, Alcatel Space Industries, Toulouse, France

TUIF-24: Multi-stage Dual-mode Cross-slotted Superconducting Filters for TelecommunicationApplicationA. Cassinese, R. Vaglio, Università di Napoli, Napoli, Italy; M. Barra, Università di Napoli,Napoli, Italy; G. Panariello, Università di Cassino, Cassino, Italy

TUIF-25: Design of an Image-type Dielectric Resonator to Measure Surface Resistance of a High-TC Superconductor FilmY. Kobayashi, T. Hashimoto, Saitama University, Urawa, Japan

TUIF-26: Planar Superconducting Lumped Element Bandpass Filter with Spiral InductorsA.E. Barinov, S.A. Zhgoon, Moscow Power Engineering Institute, Moscow, Russia

TUIF-27: Performance of a Superconducting Detector Circuit using a Schottky Barrier Diodefor Bandwidth Modulation +M.W. Hosking, University of Portsmouth, Portsmouth, UK

TUIF-28: Bias Circuits for GaAs HBT Power AmplifiersE. Jarvinen, S. Kalajo, Nokia Mobile Phones, Helsinki, Finland; M. Matilainen, Nokia Research Center, Helsinki, Finland

TUIF-29: High-efficiency Low-IM Microwave PA DesignP. Colantonio, F. Giannini, E. Limiti, Università di Roma Tor Vergata, Roma, Italy; G. Leuzzi,Università de L’Aquila, L’Aquila, Italy

TUIF-30: Highly Linear CMOS RF MMIC Amplifier using Multiple Gated Transistors and its Volterra Series AnalysisB. Kim, K. Lee, Korea Advanced Institute of Science and Technology, Taejon, ROK; J. Ko,Samsung Electronics, Suwon, ROK

TUIF-31: A Novel High Efficiency Multioctave Amplifier using Cascaded ReactivelyTerminated Single-stage Distributed Amplifiers for EW System ApplicationsA.S. Virdee, Filtronic Components Ltd., Milton Keynes, UK; B.S. Virdee, University of NorthLondon, London, UK

TUIF-32: A 2.4 GHz Integrated CMOS Power Amplifier with Micromachined InductorsE. Chen, Y. Yoon, J. Laskar, M. Allen, Georgia Institute of Technology, Atlanta, GA

TUIF-33: Monolithic 6W Ka-band High Power Amplifier.R.M. Emrick, Motorola Labs/Motorola Inc., Chandler, USA

TUIF-34: A Novel Method for Closed-loop Error Correction Microwave and Millimeter WaveQPSK ModulatorA. Madjar, Rafael, Haifa, Israel; T. Blum, M. Namer, I. Itzkovic, B. Zusmanovic, Technion,Haifa, Israel

TUIF-35: Micromachined Sub-millimeter and Millimeter Wave Variable PolarisationCompensatorT.D. Drysdale, R.J. Blaikie, University of Canterbury, Christchurch, New Zealand; H.M. Chong, D.R. Cumming, University of Glasgow, Glasgow, Scotland

TUIF-36: Membrane-supported Copper E-plane CircuitsW. Liu, D.P. Steenson, M.B. Steer, University of Leeds, Leeds, UK

TUIF-37: Suppression of Parasitic Substrate Modes in Flip-chip Packaged Coplanar W-bandAmplifier MMICsA. Tessmann, W.H. Haydl, S. Kudszus, Fraunhofer Institute (IAF), Freiburg, Germany; T.V. Kerssenbrock, P. Heide, Siemens AG, Munich, Germany

TUIF-38: A 60 GHz Circular Horn Antenna Excited with Quasi-Yagi AntennaM. Sironen, Y. Qian, T. Itoh, UCLA, Los Angeles, CA

TUIF-39: Design of a Nonradiative Dielectric Rotman Lens in the Millimeter Wave FrequencyJ. Lee, J. Lee, H. Tae, Hongik Univ., Seoul, Korea

TUIF-40: Nonlinear Distortion Suppression in Directly Modulated DFB Lasers by SidemodeOptical InjectionS. Jun-Hyuk/Seo, S. Young-Kwang/Seo, C. Woo-Young/Choi, Yonsei University, Seoul, Korea (South)

TUIF-41: A New, Compact Model for High-speed Electro-optic Modulators Fully IntegratedWithin a Microwave CAD EnvironmentP. Zandano, M. Pirola, G. Ghione, Politecnico di Torino, Torino, Italy

TUIF-42: Electromagnetic and Thermal Modeling of the Lucite Cone Applicator for SuperficialHyperthermiaT. Samaras, J.N. Sahalos, Aristotle University of Thessaloniki, Thessaloniki, Greece; P.J. Rietveld, G.C. van Rhoon, AZR-Daniel, Rotterdam, The Netherlands

TUIF-43: Conformal Imaging with a Non-contacting Microwave Antenna ArrayD. Li, P.M. Meaney, K.D. Paulsen, Dartmouth College, Hanover, NH

TUIF-44: A Low-power Direct Conversion Receiver Module for C-band Wireless ApplicationsB. Matinpour, A. Sutono, J. Laskar, Georgia Tech, Atlanta, GA

TUIF-45: A GaAs HBT 5.8 GHz OFDM Transmitter MMIC Chip SetA. Raghavan, E. Gebara, C. Lee, S. Chakraborty, D. Mukherjee, J. Bhattacharjee, D. Heo, J. Laskar, Georgia Institute of Technology, Atlanta, GA

TUIF-46: A 2.5 V CMOS Differential Active Inductor with Tunable L and Q for Frequencies up to 5 GHzM. Grözing, A. Pascht, M. Berroth, University of Stuttgart, Stuttgart, Germany

TUIF-47: Temperature Dependence of Intermodulation and Linearity in GaN Based AmplifiersA. Ahmed, S. Islam, M. Anwar, University of Connecticut, Storrs, CT

TUIF-48: A New ‘T’ Circuit Topology for the Broadband Modelling of Symmetric InductorsFabricated in CMOS TechnologyW. Tatinian, P. Pannier, Institut Charles Fabry, Marseille, France; R.A. Gillon, AlcatelMicroelectronics, Oudenaarde, Belgium

TUIF-49: Modeling of Inductors and TransformersS.R. Kythakyapuzha, W.B. Kuhn, Kansas State University, Manhattan, KS

TUIF-50: 15 GHz Wideband Amplifier with 2.8 dB Noise Figure in SiGe Bipolar TechnologyH. Knapp, D. Zoeschg, T. Meister, K. Aufinger, S. Boguth, L. Treitinger, InfineonTechnologies AG, Munich, Germany

TUIF-51: 40-Gbit/s D-type Flip-flop and Multiplexer Circuits using InP HEMTT. Suzuki, H. Kano, Y. Nakasha, T. Takahashi, K. Imanishi, H. Ohnishi, Y. Watanabe, FujitsuLaboratories Ltd., Atsugi, Japan

TUIF-52: A Direct Ku-band Linear Subharmonically Pumped BPSK and I/Q Vector Modulatorin Multi-layer Thin-film MCM-DG. J. Carchon, B. Nauwelaers, K.U.Leuven, Leuven, Belgium

TUESDAY, MAY 22, 2001 • INTERACTIVE FORUM • 2:30–5:00 PM

PHOENIX CIVIC PLAZA, PHOENIX ROOM

33

RTA: CHALLENGES AND OPPORTUNITIES FOR MICROWAVE CAD

Date & Time: Tuesday May 22; 7:00–9:30 PM

Location: Hyatt

Organizer: Peter Blakey, ON Semiconductor

Moderator: Peter Blakey

Panelists: C. Mueth, AgilentZ. Cendes, AnsoftS. Maas, Applied Wave ResearchP. Ladbrooke, GaAs Code

The challenges and opportunities for Microwave CAD encom-pass a wide range of business issues and technical issues. Thepanel members, who represent a range of companies involved inMicrowave CAD, will discuss these issues. The questions that willbe addressed include: ✗ Do CAD companies capture an appropriate fraction of the

value provided by CAD tools?✗ What is the anticipated evolution in business models and

licensing trends? ✗ What new CAD tools are needed to meet emerging technical

needs?✗ What new simulation techniques will be more

comprehensive, more efficient, or easier to use than thosethat are presently available?

✗ Will microwave CAD companies seek take advantage of atrend towards the convergence of microwave CAD and high-speed digital CAD, to obtain a slice of the much largerECAD pie?

PTA: ONE CHIP RADIO

Date & Time: Tuesday May 22; 12:00–1:15 PM


Sponsor: MTT-12 Microwave and Millimeter-Wave Packaging Technical Committee

Organizers: Joy Laskar, Georgia Institute of TechnologyAnh-Vu Pham, Clemson University

Moderators: Joy Laskar, (PANEL) Anh-Vu Pham, Mike Harris, and Wolfgang Heinrich(AUDIENCE)

Panelists: Rao Tummula, Georgia Institute of TechnologyFrank Chang,

University of California, Los AngelesRob Christ, TriquintSanjay Moghe, RF SolutionsLawrence Larson, IBM ResearchKare Gustafsson, Ericsson Radio Systems AB

What is one-chip radio? Is this a reality in today’s technology orin the future? Where is the System on Chip (SOC) appropriate:WLAN, CDMA, Bluetooth or ever? What module technologies, ifany, will provide System on Package (SOP) solutions? This panelwill debate the potential of these integration paradigms from vari-ous perspectives including: ✗ Technology mix: RF, MEMS, passive components, DSPs

and sensors✗ Time to market, yield and cost ✗ Device technologies: SiGe, GaAs, CMOS and BiCMOS✗ Reusable functional blocks ✗ Integral and embedded passive components ✗ System architectures and testing ✗ On-chip and off-chip components✗ Communication standards and frequency ✗ Applications and examples of SOC and SOP

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TUESDAY PANEL SESSION TUESDAY RUMP SESSION

TUESDAY SPECIAL SESSION

TU4D: ACOUSTIC DEVICES FOR WIRELESS COMMUNICATIONSAND SENSING

Room: Tucson 42–43

Time: 3:30–5:00 PM

Session Chair: R. Weigel, University of Linz, Austria

Session Co-Chair: C.C.W. Ruppel, EPCOS, Munich, Germany

Description:

This Focused Session deals with surface acoustic wave (SAW)and bulk acoustic wave (BAW) devices for wireless applications.An Invited Paper reports on novel SAW solutions for widebandCDMA mobiles followed by the demonstration of a SAW-basedpassive wireless pressure and temperature sensor system for ve-hicular applications, a new SAW resonator technique for wide-band VCOs, and an investigation of thin films to improve SAWdevice fidelity. The BAW part of the session incorporates twocontributions dealing with a film bulk acoustic wave resonator(FBAR) duplexer for PCS applications and the characterizationand simulation of FBAR devices.

The Forum, held during the International Microwave Symposium, is an annual gatheringof educators from around the world who have professional interests in RF and microwaveengineering. It serves as a platform for discussing novel ideas and proposals in a collegialenvironment; a vehicle for disseminating and sharing information, and provides an opportu-nity for meeting and networking among colleagues with common interests. A different themeis selected each year for the Forum, on which the discussions are centered, so as to allow anin-depth examination of issues despite the short duration.

In RF and microwave engineering, as in most other engineering disciplines, research inthe universities has traditionally differed from that carried out in an industrial environmentin such characteristics as its longer time horizon; emphasis on understanding rather thancircumventing problems; reliance on theoretically rather than empirically based information;and isolation of an idealized problem unencumbered with practical details rather than onemired with real-world constraints and limitations. In recent years, however, a shift appearsto be taking place in the nature of research in RF and microwave engineering, in part due tothe growing importance of civilian work over defense-related work, with its concomitant em-phasis on high volume applications such as wireless communication; cost sensitivity andtradeoff with performance; competitiveness and resulting shorter time scales; and global orsystem-level, rather than local or component-level, optimization. These changes may, in turn,influence the academic researchers in a variety of ways such as in the selection of researchproblems, dissemination of results in view of proprietary considerations, consideration ofthe context of a problem for its optimal solution, and the design of curricula that incorporateresearch results and serve the needs of learners preparing for such diverse careers as re-search and industrial practice. The community of educators in RF and microwave fields willneed both awareness and preparedness in order to identify strategies for dealing with suchan environment.

This year, the RF and Microwave Education Forum will focus on the changing nature ofacademic research in our discipline. It will feature brief remarks by speakers who will ex-plore the changes that may be expected, suggest new and possibly controversial ways fordealing with them, recount from their experience the problems encountered and attemptedsolutions, and propose insightful viewpoints to put the coming changes in perspective. Atten-dees are also invited to participate in the discussion and share their observations; those whowish to address the gathering briefly are urged to bring an overhead transparency summariz-ing the gist of their remarks.

For efficient use of discussion time, the Forum attendees will be provided boxed lunch-es. Although there is no formal registration for this event, an email confirmation of an inter-est in attending the Forum will help the organizers to be better prepared for the event.Please direct all inquiries and communications regarding the 2001 Forum to its organizer,Prof. Madhu S. Gupta, at [email protected] Regency Hotel, Ballroom D

AAAA LLLLSSSSOOOO OOOOCCCCCCCCUUUURRRRRRRRIIIINNNNGGGGTuesday, May 22, 12:00–1:15 PM

RF and Microwave Education Forum“Changes in Academic Research”Organizer: Prof. Madhu S. Gupta

8:00

AM

WE1A Mode Conversion between DissimilarTransmission Media

Chair: C.P. Wen, CPW ConsultingCo-chair: E. Godshalk, Maxim Corp.

BALLROOM

WE1B High Power Amplifiers and Devices

Chair: J. Schellenberg, Schellenberg AssociatesCo-chair: S. Patel, Northrop Grumman

TUCSON 36–38

WE1C Non-linear Device Modeling

Chair: J Hwang, Lehigh University

TUCSON 40–41

WE1A-1: Novel Design for Coplanar Wave Guide to MicrostripTransitionA.M. Safwat, K.A. Zaki, C.H. Lee, University of Maryland at College Park, College Park, MD; W.B. Johnson, Laboratory for Physical Sciences, College Park, MD

WE1B-1: High-voltage GaAs Pwer-HBTs for Base-stationAmplifiersP. Kurpas, F. Brunner, R. Doerner, B. Janke, P. Heymann, A. Maasdorf, J. Würfl, W. Heinrich, Ferdinand-Braun-Institut(FBH), Berlin, Germany; W. Doser, H. Blanck, UMS GmbH, Ulm, Germany; P. Auxemery, D. Pons, UMS Orsay, Orsay

WE1C-1: Nonlinear III-V HBT Compact Models: Do We HaveWhat We Need?J.B. Scott, Agilent Technologies, Santa Rosa, CA

8:20

AM

WE1A-2: Microstrip Fed Coplanar Stripline Tee Junction usingCoupled Coplanar StriplineY. Suh, K. Chang, Texas A&M University, College Station, TX

WE1B-2: A Power pHEMT Device Technology for BroadbandWireless AccessM. Miller, B. Peatman, R. Hooper, Motorola, Tempe, AZ

WE1C-2: Global Electro-thermal CAD of Complex Non Linear 3-D Systems Based on a Fully Physical Time-dependent CompactThermal ModelW. Batty, S. David, A.J. Panks, R.G. Johnson, C.M. Snowden,University of Leeds, Leeds, UK; C.E. Christoffersen, M.B. Steer,North Carolina State University (NCSU), Raleigh, NC

8:30

AM

WE1A-3: Novel Lumped-element Coplanar Waveguide-to-coplanar Stripline TransitionsY. Lin, C. Chen, National Taiwan University, Taipei, ROC

WE1B-3: Silicon Carbide Performances and Application inBroadcast Power AmplifiersF. Temcamani, P. Pouvil, ENSEA, Cergy, France; O. Noblanc, C. Brylinski, THOMSON-CSF LCR, Orsay, France; P. Bannelier,B. Darges, J. Prigent, THOMCAST, Conflans Sainte Honorine,France

8:40

AM

WE1C-3: Improved Large-signal Model and Model ExtractionProcedure for InGaP/GaAs HBTs Under High Current OperationsS. Cherepko, M. Shirokov, J.C. Hwang, Lehigh University,Bethlehem, USA; A. Brandstaedter, Anadigics Inc., Warren, USA

8:50

AM

WE1A-4: Integrated Transition of Coplanar and RectangularWaveguidesD. Deslandes, K. Wu, Ecole Polytechnique de Montreal,Montreal, Canada

WE1B-4: A 240 W Power Heterojunction FET with HighEfficiency for W-CDMA Base StationsI. Takenaka, K. Ishikura, K. Takahashi, K. Hasegawa, H. Takahashi, F. Emori, N. Iwata, NEC Corp., Otsu, Japan; K. Kishi, Y. Ogasawara, NEC Yamagata Ltd., Higashiokishi-Gun,Japan

9:00

AM

WE1C-4: Waveform Characterization and Modeling of DynamicCharge Behavior of InGaP-GaAs HBTsC. Wei, S. Sprinkle, H. Chung, B. Mitchell, P. Dicarlo, D. Bartle,Alpha Industries Inc., Woburn, MA; J. Hu, Network Device Inc.,Sunnyvale, CA

9:10

AM

9:20

AM

9:30

AM

WE1A-5: A Novel Microstrip Mode to Waveguide ModeTransformer and Its ApplicationsN. Jain, Anokiwave, San Diego, CA; N. Kinayman, M/A-COM,Lowell, MA

WE1A-6: Design of HNRD Guide to E-plane WaveguideTransitions and Directional Couplers by Transverse ResonanceTechniqueM. Kishihara, K. Yamane, Okayama Prefectural University,Soja, Japan; I. Ohta, Himeji Institute of Technology, Himeji,Japan

WE1B-5: A Ultra Broad Band 300 W GaAs Power FET for W-CDMA Base StationsK. Ebihara, K. Inoue, H. Haematsu, F. Yamaki, H. Takahashi, J. Fukaya, Fujitsu Quantum Devices Ltd., Nakakoma-gun, Japan

WE1B-6: High Power S-band Solid-state Amplifiers forSurveillance and Traffic Control RadarsT. Murae, K. Fujii, T. Matsuno, Japan Radio Co., Ltd., Mitaka,Japan

WE1B-7: Ku-band Quadri-SSPA for Stentor Satellite TransmitActive AntennaD. Roques, H. Chane-Kee-Sheung, F. Dubos, B. Cogo, J. Cazaux,Alcatel Space Industries, Toulouse, France

WE1C-5: Scalable Large-signal Device Model for High Power-density AlGaN/GaN HEMTs on SiCJ. Lee, S. Lee, K.J. Webb, Purdue University, West Lafayette,USA

WE1C-6: On the Gunn Effect in GaAs HBTsM. Rudolph, R. Doerner, P. Heymann, Ferdinand-Braun-Institutfuer Hoechstfrequenztechnik, Berlin, Germany

8:10

AM

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WEDNESDAY, MAY 23, 2001 IEEE MTT-S IMS TECHNICAL SESSIONS 8:00–9:40 AM

WE1F Advances in Time Domain Methods I

Chair: P. Russer, Technical University of MCo-chair: W. Gwarek, Warsaw University of Tech

YUMA 21–23

WE1F-1: Envelope-finite Element (EVFE) Technique – 2-DGuided Wave ExamplesY. Wang, T. Itoh, UCLA, Los Angeles, CA

WE1F-2: Evaluation and Enhancement of SupraconvergenceEffects on Nonuniform and Conformal FDTD meshesM. Celuch-Marcysiak, Warsaw Univ. of Technology, Warsaw,Poland

WE1F-3: Fundamental Gridding Related Dispersion Effects in Multiresolution Time Domain SchemesC. Sarris, L. Katehi, University of Michigan, Ann Arbor, MI

WE1F-4: Development and Application of an EfficientFDTD/Haar MRTD Numerical InterfaceC. Sarris, L. Katehi, University of Michigan, Ann Arbor, MI

WE1F-5: A Novel Adaptivity for EM Time Domain Methods:Scale Adaptive Time Steps (SATS)A. Rennings, V. Toni, P. Waldow, I. Wolff, Gerhard MercatorUniversity Duisburg, Duisburg, Germany; Y. Qian, T. Itoh,University of California, Los Angeles, Los Angeles, CA

WE1E Dispersion Properties of PeriodicStructures and Uniform Transmission Lines

Chair: P.Lampariello, University of RomeCo-chair: J. Zehentner, Technical University,

YUMA 26–28, 31–33

WE1D Frequency Control Advances or Wireless Applications

Chair: R. Newgard, Rockwell CollinsCo-chair: S. Wetenkamp, Micro Lamba

TUCSON 42–43

WE1E-1: Effect of Losses on the Spectral Transition of ModalPoles between the Improper and the Proper Riemann SheetsA.H. Kamel, RITSEC, Cairo, Egypt, A.S. Omar, University of Magdeburg, Magdeburg, Germany

WE1D-1: Invited: Nonlinear Effects in Oscillators and SynthesizersU.L. Rohde, Synergy Microwave Corp., Paterson, USA

WE1E-2: Low-frequency Dispersion Features of a New ComplexMode for a Periodic Strip Grating on a Grounded Dielectric SlabP. Burghignoli, P. Baccarelli, F. Frezza, A. Galli, P. Lampariello,Università “La Sapienza” di Roma, Roma, Italy; A.A. Oliner,Polytechnic University of Brooklyn, New York, NY

WE1D-2: PLL Synthesizers: PLL Switching Speed and Speed-upMechanismsB. Goldberg, VITCOM Corp., San Diego, CA

WE1E-3: Guided-wave Properties of Synthesized Non-radiativeDielectric Waveguide for Substrate Integrated Circuits (SICs)K. Wu, Ecole Polytechnique, Montreal, Canada; F. Boone,University of Sherbrooke, Sherbrooke, Canada

WE1D-3: An Agile Stored SD Sequence Fractional-N SynthesiserR. Walkington, P. Brennan, University College London, London, UK

WE1E-4: Slow-wave Propagation of Microstrip Consisting of Electric-magnetic-electric (EME) Composite Metal StripsC. Wu, C.C. Tzuang, National Chiao Tung University, Hsinchu,Taiwan

WE1D-4: 6.7 GHz Frequency Synthesizer in 0.8 µm SiliconBipolar Production TechnologyG. Ritzberger, H. Knapp, J. Boeck, M. Rest, L. Treitinger,Infineon Technologies AG, Munich, Germany; A.L. Scholtz,University of Technology, Vienna, Austria

WE1D-5: GSM 900/DCS 1800 Fractional-N FrequencySynthesizer with Very Fast Settling TimeB. Neurauter, G. Maerzinger, R. Weigel, University of Linz,Linz, Austria; T. Lueftner, DICE Danube Integrated CircuitsEngineering, Linz, Austria; M. Scholz, V. Mutlu, J. Fenk,Infineon AG, Munich, Germany

WE1D-6: Phase Decrement Type Direct Frequency SynthesizerDriven by a DDSK. Tajima, M. Tsuru, Y. Isota, O. Ishida, Mitsubishi Electric Co.,Kamakura, Japan; H. Ikematsu, Mitsubishi Electric Co.,Amagasaki, Japan; K. Itoh, Mitsubishi Electric Co., Amagasaki,Japan

WE1E-5: TEM Properties of Shielded HomogeneousMulticonductor Transmission Lines with PEC and PMC WallsA. Borji, S. Safavi-Naeini, S.K. Chaudhuri, University of Waterloo, Waterloo, Canada

WE1E-6: Explicit Eigenvalue Approach to the EfficientDetermination of the Hybrid Spectrum of Ferrite-loaded CircularWaveguideL. Pierantoni, A. Camicia, T. Rozzi, University of Ancona,Ancona, Italy

35

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8:00

AM

8:20

AM

8:30

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8:40

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8:50

AM

9:00

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9:10

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9:20

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9:30

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8:10

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WE2A Novel Transmission Lines, Properties, and ApplicationsChair: M. Dydyk, Motorola Inc.

Co-chair: Ching-Kuang Tzuang, National Chiao TBALLROOM

WE2A-1: Transmission Line Noise from Standard and Proton-implanted SiK.T. Chan, A. Chin, C.M. Kwei, Hsinchu, Taiwan; D.T. Shien,W.J. Lin, Inst. of Nuclear Energy Research, Hsinchu, Taiwan

WE2A-3: Dielectric Properties of Oxidized Porous Silicon in a Low Resistivity SubstrateR.L. Peterson, Princeton University, Princeton, USA; R.F. Drayton, University of Minnesota, Minneapolis, MN

WE2A-3: A Novel CPW Structure for High-speed InterconnectsS. Yoon, KJIST, Gwangju, South Korea; J. Yook, Y. Kim, YonseiUniv., Seoul, South Korea; O. Seo, K. Lim, S. Cho, S. Lee,Samsung Electronics, Suwon, South Korea

WE2A-4: Small-size Delay Line Based on a Periodically LoadedWaveguideJ. Hesselbarth, R. Vahldieck, Swiss Fed. Inst. of Technology,Zurich, Switzerland

WE2A-5: Frequency Dependence of Bloch Impedance in a Periodic Transmission Line StructureE. Takagi, Toshiba Corp. R&D Center, Kawasaki, Japan

WE2A-6: A Photonic Crystal Seam (PCS) for MetallicWaveguidesJ.L. Hesler, University of Virginia, Charlottesville, VA

10:2

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WE2B Techniques to Advance Power AmplifierLinearity and Efficiency

Chair: A. Katz, The College of New JerseyCo-chair: E. James Crescenzi, Jr., UltraRF

TUCSON 36–38

WE2C Nonlinear FET Modeling

Chair: M Mallavarpu, Raytheon Co.Co-chair: M Calcatera, AF Research Lab

TUCSON 40–41

WE2B-1: Efficient Baseband/RF Feedforward Linearizer through a Mirror Power Amplifier using Software-defined Radioand Quadrature Digital Up-conversionE.G. Jeckeln, F.M. Ghannouchi, M.M. Sawan, EcolePolytechnique de Montréal, Montreal, Canada; F. Beauregard,Amplix Wireless & Satcom, Montreal, Canada

WE2C-1: A GaAs MESFET Transient Model Capable of Predicting Trap-induced Memory Effects Under ComplexDigital ModulationF. Wang, W.D. Jemison, Lafayette College, Easton, USA; J.C. Hwang, Lehigh University, Bethlehem, USA

10:3

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WE2B-2: Adaptive RF Cartesian Predistorter Based on the LowFrequency Even Order IM TermsY. Yang, Y.Y. Woo, B. Kim, POSTECH, Pohang, Korea

10:4

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WE2C-2: Intermodulation Distortion Simulation using PhysicalGaAs FET ModelW. Contrata, Y. Ando, M. Kuzuhara, NEC Corp., Otsu, Japan; Y. Hori, NEC Corp., Kawasaki, Japan

10:5

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WE2B-3: A High Efficiency Feedforward Amplifier with a SeriesDiode Linearizer for Cellular Base StationsK. Horiguchi, M. Nakayama, Y. Sakai, K. Totani, H. Senda, Y. Ikeda, O. Ishida, Mitsubishi Electric Corp., 5-1-1 Ofuna,Japan

11:0

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WE2C-3: Full Extraction of pHEMT State Functions using TimeDomain MeasurementsD.G. Morgan, P. Tasker, Cardiff University School of Engineering, Cardiff, Wales; G. Edwards, A. Phillips, MarconiCaswell Ltd., Towcester, England

11:1

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WE2B-4: A Gain/Phase Imbalance Minimization Technique for LINC TransmitterX. Zhang, P. Nanawa, L.E. Larson, P.M. Asbeck, University of California, San Diego, La Jolla, CA

11:2

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:30

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11:4

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WE2B-5: A Novel DSP Architecture of Adaptive FeedforwardLinearizer for RF AmplifiersY. Wang, T. Itoh, UCLA, Los Angeles, CA

WE2C-4: Large-signal Look-up Table Model for InP HEMTsIncluding Non-quasi-static and Impact Ionisation EffectsD. Schreurs, K.U.Leuven, Leuven, Belgium; A. Orzati, L. Pergola, H. Benedickter, O. Homan, W. Baechtold, SwissFederal Institute of Technology, Zurich, Switzerland

WE2C-5: Nonlinear Noise Modeling of a pHEMT Device throughResidual Phase Noise and Low Frequency Noise MeasurementsO. Llopis, J. Juraver, J. Graffeuil, LAAS-CNRS, Toulouse, France;B. Tamen, F. Danneville, A. Cappy, IEMN, Lille, France; M. Chaubet, CNES, Toulouse, France

WE2B-6: The Novel Programmable RF Predistortion LinearizerJ. Sun, M.Y. Chia, National University of Singapore, Singapore,Singapore

WE2C-6: Intrinsic Noise Currents in Deep Submicron MOSFETsC. Chen, J.M. Deen, McMaster University, Hamilton, Canada; Y. Cheng, M. Matloubian, Conexant Systems Inc., NewportBeach, USA

11:5

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WEDNESDAY, MAY 23, 2001 IEEE MTT-S IMS TECHNICAL SESSIONS 10:20 AM–12:00 PM

WE2F Advances in Time-domain Methods II

Chair: A. Beyer, University of DuisburgCo-chair: V. Fouad-Hanna

YUMA 21–23

WE2F-1: A Generalized Approach to Wide-band S-parameterExtraction from FD-TD Simulations Applicable to EvanescentModes In Inhomogeneous GuidesW.K. Gwarek, M. Celuch-Marcysiak, Warsaw University of Technology, Warsaw, Poland

WE2F-2: Modified Yee’s Cell for Finite-difference Time-domainModeling of Periodic Boundary Guiding StructureH. Lee, J. Kim, Korea Advanced Institute of Science and Technology, Yusong, Korea

WE2F-3: A New Multiresolution Near-field to Near-fieldTransform Suitable for Multi-region FDTD SchemesA.V. Laisne, R. Gillard, INSA/RER, Rennes, France; G. Piton,CNES, Toulouse, France

WE2F-4: A Global Modeling Approach using InterpolatingWaveletsS. Goasguen, M. Tomeh, S. El-Ghazaly, Arizona StateUniversity, Tempe, AZ

WE2F-5: Performance of Three-dimensional Graded ADI-FDTDAlgorithmE. Hu, W.J. Hoefer, Department of Electrical & ComputerEngineering, Victoria, Canada

WE2F-6: Reconstruction of Microwave Structures using Two-dimensional Inverse TLM (Transmission LineMatrix) MethodW.A. de Souza, L.R. de Menezes, Universidade de Brasilia,Brasilia, Brazil

WE2E Leaky-wave Excitation and Guidance in Printed Transmission Lines

Chair: N.K. Das, Polytechnic UniversityCo-chair: A.S. Omar, University of Magdeburg

YUMA 26–28, 31–33

WE2E-1: Behavioral Feature of Fast-wave Modes on Printed-circuit Transmission Lines of Open and Packaged TypesM. Tsuji, H. Shigesawa, Doshisha University, Kyotanabe, Japan

10:2

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WE2E-2: Structural Conditions for Offering High-performancePrinted-circuit Devices in Millimeter-wave RangeH. Shigesawa, M. Tsuji, Doshisha University, Kyotanabe, Japan

10:4

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:50

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WE2E-3: High Frequency Leaky-mode Excitation on MicrostripLineF. Mesa, D.R. Jackson, University of Houston, Houston, TX; M. Freire, University of Seville, Seville, Spain

11:0

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WE2E-4: Spurious Radiation from a Practical Source on a LeakyCovered Microstrip LineW.L. Langston, J.T. Williams, D.R. Jackson, University of Houston, Houston, TX; F. Mesa, University of Seville, Seville, Spain

WE2E-5: Proper Definition of Voltage for a Leaky Two-layerStripline Consistent with its Characteristic ImpedanceN. Das, Polytechnic University, Farmingdale, 11735

11:5

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WE2D The NBS/NIST Centennial: One HundredYears of RF Metrology and Standards

Chair: K. Remley, NISTCo-chair: C. Weil, NISTTUCSON 42–43

WE2D-1: NIST: Responding to Basic Needs, Responding to Special NeedsL.A. Greenhouse, National Institute of Standards andTechnology, Gaithersburg, USA

WE2D-2: Radio-frequency Metrology from NBS to NIST, theLegacyD.S. Friday, NIST, Boulder, CO

WE2D-3: Primary Atomic Frequency Standards at NISTD.B. Sullivan, National Institute of Standards and Technology,Boulder, CO

WE2D-4: Broadband Josephson Voltage StandardsC.A. Hamilton, S.P. Benz, National Institute of Standards and Technology, Boulder, CO

WE2D-5: The Electronic KilogramM.H. Kelley, National Institute of Standards and Technology,Gaithersburg, USA

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WEDNESDAY, MAY 23, 2001 IEEE MTT-S IMS TECHNICAL SESSIONS 1:20–3:00 PM

1:20

PM

WE3A Power Amplifiers for Wireless Applications

Chair: D. Teeter, RF Micro DevicesCo-chair: A. Platzker, Raytheon RF Components

BALLROOM

WE3B Wideband Communication Systems

Chair: H.C. Huang, AMCOM CommunicationsCo-chair: L. Raffaelli, LYNX Inc.

TUCSON 36–38

WE3C Nonlinear Modeling of Silicon Devices and Power Amplifiers

Chair: S Goodnick, Arizona State University

TUCSON 40–41

WE3A-1: A 1W CMOS Power Amplifier for GSM-1800 with 55% PAEC. Fallesen, Nokia Denmark, Copenhagen, Denmark; P. Asbeck,Technical University of Denmark, Lyngby, Denmark

WE3B-1: A Compact LTCC Ku-band Transmitter Module with Integrated Filter for Satellite Communication ApplicationsC. Lee, A. Sutono, S. Han, J. Laskar, Georgia Institute of Technology, Atlanta, GA

WE3C-1: RF LDMOS Characterization and Its CompactModelingJ. Jang, K. Banerjee, Z. Yu, R.W. Dutton, Stanford University,Stanford, USA; O. Tornblad, Ericsson Inc., Morgan Hill, USA; T. Arnborg, Q. Chen, Ericsson Microelectronics, Stockholm,Sweden

1:30

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1:40

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WE3A-2: A High Efficiency 0.25-µm CMOS PA with LTCC Multi-layer High-Q Integrated Passives for 2.4 GHz ISM BandD. Heo, A. Sutono, Y.E. Chen, E. Gebara, S. Yoo, Y. Suh, J. Laskar, E.M. Tentzeris, Georgia Institute of Technology,Atlanta, GA

WE3B-2: A Microwave Frequency Generation Unit for SpaceApplicationsL. Dayaratna, L.G. Ramos, M.K. Hirokawa, Lockheed MartinCommunications and Power Center, Newtown, USA

WE3C-2: Direct Extraction and Modeling Method for Temperature Dependent Large Signal CAD Model of Si-BJTY. Suh, D. Heo, A. Raghavan, E. Gebara, S. Nuttnick, K. Lim, J. Laskar, Georgia Institute of Technology, Atlanta, GA

1:50

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WE3A-3: Variable Gain Power Amplifier for Mobile WCDMAApplicationsV.T. Vintola, S.J. Kalajo, E.A. Järvinen, Nokia Mobile Phones,Helsinki, Finland; M.J. Matilainen, Nokia Research Center,Helsinki, Finland

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WE3B-3: Low Cost Ka-band Transmitter Modules for LMDSEquipment Mass ProductionG. Torregrosa-Penalva, A. Asensio-López, F.J. Ortega-González,J. Lluch-Ladrón-de-Guevara, Grupo de Microondas y Radar,Madrid, Spain

WE3C-3: An Accurate Large-signal Model for a High-efficient Si Bipolar GSM Power TransistorR.M. Heeres, M. Versleijen, Philips Semiconductors, Nijmegen,The Netherlands; H. Visser, Philips Semiconductors, Sunnyvale, CA

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WE3A-4: A Single Supply High Performance PA MMIC for GSM Handsets using Quasi-enhancement Mode PHEMTW. Abey, R. Hajji, W. Kennan, H. Dang, Fujitsu CompoundSemiconductor Inc., San Jose, CA; T. Moriuchi, T. Nakamura, Y. Nonaka, E. Mitani, Fujitsu Quantum Devices Ltd., Showa-chou, Japan

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WE3A-5: E-pHEMT, Single Supply, High Efficient PowerAmplifiers for GSM and DCS ApplicationsS. Zhang, Alpha Industries Inc., Woburn, MA; J. Cao, BroadcomCorp., El Segundo, CA; R. Mcmorrow, Analog Devices Inc.,Wilmington, USA

WE3A-6: An Extended Doherty Amplifier with High EfficiencyOver a Wide Power RangeM. Iwamoto, A. Williams, A.G. Metzger, C. Wang, L.E. Larson,P.M. Asbeck, University of California at San Diego, La Jolla, CA;P. Chen, Global Communication Semiconductors, Torrence, CA

WE3A-7: Analysis and Experimental Study of an L-band NewTopology Doherty AmplifierS. Bousnina, F.M. Ghannouchi, Ecole Polytechnique deMontreal, Montreal, Canada

WE3B-4: A Complete Integrated TX/RX Front-end Combining 3DTopologies and Global Synthesis.T. Le Nadan, C. Person, J. Coupez, LEST-ENST Bretagne, Brest,France

WE3B-5: Design and Characterization of a Low Cost ISM-bandSub Carrier Multiplexed Broadband Digital Microwave RadioLinkA.P. Chio, B.H. Galang, R.C. Guevarra, A.A. Manlapat, C.G. Santos, N.G. Toledo, I.C. Wong, D.M. Sabido, AdvancedScience and Technology Institute, Quezon City, Philippines

WE3C-4: Analysis of Low Frequency Memory and Influence on Solid State HPA Intermodulation CharacteristicsN. Le Gallou, H. Buret, Alcatel Space Industries, Toulouse,France; E. Ngoya, J.M. Nebus, University of Limoges, Limoges,France

WE3C-5: An Improved Behavioral Modeling Technique for High Power Amplifiers with MemoryN. Le Gallou, H. Buret, Alcatel Space Industries, Toulouse,France; E. Ngoya, D. Barataud, J. Nebus, IRCOM, University of Limoges, Limoges, France

WE3A-8: Current Mode Class-D Power Amplifiers for High Efficiency RF ApplicationsH. Kobayashi, Fuji Electric Co., Ltd., Matsumoto, Japan; J. Hinrichs, P. Asbeck, UCSD, La Jolla, CA

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WE3F Applications of Time Domain Methods

Chair: R. Vahldieck, ETH ZurichCo-chair: L. Roselli, University of Perugia

YUMA 21–23

WE3F-1: Efficient FDTD Modeling of Irises/Slots in MicrowaveStructuresA. Rong, A.C. Cangellaris, University of Illinois at UrbanaChampaign, Urbana, IL; H. Yang, Southeast University,Nanjing, P.R. China

WE3F-2: Time Domain Characterization of Multichip ModuleElementsW. Dressel, L. Vietzorreck, P. Russer, TU Muenchen,Muenchen, Germany

WE3F-3: Full-wave Analysis and Model-based ParameterEstimation Approaches for Y-matrix Computation of MicrowaveDistributed RF CircuitsV. Chtchekatourov, F. Coccetti, P. Russer, TechnischeUniversitaet Muenchen, Muenchen, Germany

WE3F-4: Analysis of Signal Integrity in High-speed Digital ICsby Combining MOSFET Modeling and the LE-FDTD MethodF. Alimenti, G. Stopponi, P. Placidi, R. Sorrentino, Università diPerugia, Perugia, Italy; P. Ciampolini, Università di Parma,Parma, Italy

WE3F-5: Interpolating Wavelet Galerkin Model of TimeDependent Inhomogeneous Electrically-large Optical WaveguideProblemsM. Fujii, W.J. Hoefer, University of Victoria, Victoria, Canada

WE3F-6: Time Domain Optical Response of Electro-opticModulator using FDTDM.M. Tomeh, S. Goasguen, S.M. El-Ghazaly,Telecommunications Research Center, Tempe, AZ

WE3E CAD with Neural Networks and EM TechniquesChair: A. Sharma, TRW

Co-chair: R. Biernacki, Agilent EEsof EDAYUMA 26–28, 31–33

WE3D Microwave and Optical Broadband Internet Access

Chair: C. Cox, MIT and Photonic Systems Inc.

TUCSON 42–43

WE3E-1: Neural Inverse Space Mapping EM-optimizationJ.W. Bandler, M.A. Ismail, J.E. Rayas-Sanchez, McMasterUniversity, Hamilton, Canada; Q. Zhang, Carleton University,Ottawa, Canada

WE3D-1: Invited: Broadband Access Networks: Evolution and Convergence Implications for Equipment ProvidersT.J. Brophy, Motorola, Horsham, USA

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WE3E-2: An Approach for Knowledge-aided-design (KAD) of Microwave Circuits using Artificial Neural NetworksR. Zingg, K.C. Gupta, University of Colorado at Boulder,Boulder, CO

1:40

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WE3D-2: Invited: Wireless Aspects of Broadband AccessK. Warble, J. Locke, B. Bishop, Motorola, Tempe, AZ

1:50

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WE3E-3: Exact Adjoint Sensitivity Analysis for Neural BasedMicrowave Modeling and DesignJ. Xu, M.C. Yagoub, Q. Zhang, Carleton University, Ottawa,Canada

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WE3D-3: A Combined Optical-wireless Broadband InternetAccess: Transmission ChallengesT. Marozsak, E. Udvary, T. Berceli, Budapest University of Technology and Economics, Budapest, Hungary

WE3D-4: In-band Optical Crosstalk in Fiber-radio WDMNetworksD. Castleford, A. Nirmalathas, D. Novak, R. Tucker, AustralianPhotonics Cooperative Research Centre, Photonics ResearchLaboratory, Melbourne, Australia

WE3E-4: New Technique using Poles and Modes Derivatives for Frequency and Geometry Parameterization of MicrowaveStructuresA. Gati, V.F. Hanna, University of Paris 6, Paris, France; M. Wong, France Telecom R&D, Paris, France

WE3E-5: Extending Spice-like Analog Simulator with a Time-domain Full-wave Field SolverT. Li, Cadence Design Systems, New Providence, USA; W. Sui,Conexant Systems, Chelmsford, MA

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Wednesday, May 23, 5:30–7:30 PM

IEEE Women in Engineering ReceptionHyatt Regency, Cassidy RoomMeet and interact with a panel of distinguished professionals from academia and industry who share common interests in promoting the Women in Engineering Forum. Build connections withpeers, share your background, thoughts and experiences of common interest to women in engineering. Admission not restricted to women. If you’d like to attend and/or would like to knowmore details, please email Kavita Goverdhanam at [email protected] or Katherine J. Herrick at [email protected].

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WE4A Next Generation Power Amplifier TechniquesChair: J. Heaton, BAE Systems

Co-chair: P. Asbeck, UCSDBALLROOM

WE4B New Technologies for WirelessCommunications Systems

Chair: H. Ogawa, Communications Research LabCo-chair: J.K. McKinney, Dura Sales

TUCSON 36–38

WE4C Wireless Sensors for Automotive,RFID and Communications Systems

Chair: H. Kondoh, Hitachi, Central ResearchCo-chair: R. Camisa, Sarnoff Corp.

TUCSON 40–41

WE4A-1: A 6 GHz 50 Watts Low Distortion Push-pull GaAsPower FET Optimized for 12V Class-AB OperationT. Yamamoto, S. Sano, K. Naito, T. Igarashi, J. Fukaya, FujitsuQuantum Devices Limited, Nakakoma-Gun,Showa-Chou, Japan

WE4B-1: A Flexible Multiband Frontend for Software Radiosusing High IF and Active Interference CancellationW. Schacherbauer, A. Springer, R. Weigel, University of Linz,Linz, Austria; T. Ostertag, C.C. Ruppel, Siemens AG, Munich,Germany

WE4C-1: A Low Profile 77 GHz Three Beam Antenna forAutomotive RadarF. Kolak, C. Eswarappa, M/A-COM, Lowell, MA

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WE4A-2: High Power Broadband AlGaN/GaN HEMT MMICs on SiC SubstratesB.M. Green, V. Tilak, H. Kim, J. Smart, J.R. Shealy, L.F. Eastman, Cornell University, Ithaca, NY; S. Lee, K. Webb,Purdue University, West Lafayette, USA

WE4B-2: A Highly-integrated Low-power Direct ConversionReceiver MMIC for Broadband Wireless ApplicationsB. Matinpour, J. Laskar, Georgia Tech, Atlanta, GA

WE4C-2: Proposal of Millimeter-wave Holographic Radar withAntenna SwitchingY. Asano, S. Ohshima, T. Harada, M. Ogawa, K. Nishikawa,Toyota Central Research and Development Laboratories Inc.,Nagakute, Japan

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WE4C-3: Fully Integrated Automotive Radar Sensor with Versatile ResolutionC. Metz, J. Grubert, J. Heyen, A.F. Jacob, L.C. Stange, Institutfür Hochfrequenztechnik, Braunschweig, Germany; S. Janot, G. Oberschmidt (now with: Rhode & Schwarz), München,Germany; E. Lissel, Volkswagen AG, Wolfsburg, Germany

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WE4A-3: New Design Method of Non-uniform DistributedPower Amplifiers. Application to a Single Stage (1 W/4.5–18 GHz) pHEMT MMIC.C. Duperrier, M. Campovecchio, R. Quere, University of Limoges, Faculty of Sciences, Limoges, France; L. Roussel, M. Lajugie, Thomson TCM, Massy, France

WE4B-3: High Speed Low Cost Direct Conversion DigitalReceiverJ. Gagné, J.J. Gauthier, K. Ke Wu, R.G. Renato, G. Bosisio, ÉcolePolytechnique de Montréal, Montreal, Canada

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WE4C-4: A Reconfigurable Active Retrodirective/DirectConversion Receiver Array for Wireless Sensor SystemsR.Y. Miyamoto, Y. Qian, T. Itoh, University of California, Los Angeles, Los Angeles, CA

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WE4A-4: 20–30 GHz Broadband MMIC Power Amplifiers with Compact Flat Gain pHEMT CellsS. Yoshinobu, K. Hitoshi, H. Takayuki, S. Susumu, M. Yasuo,Mitsubishi Electric Corp., Itami, Japan

WE4A-5: X-band MMIC Power Amplifier with an On-chipTemperature Compensation CircuitY. Kazuhisa, I. Yoshitada, Y. Mamiko, I. Yukio, T. Tadashi,Mitsubishi Electric Corp., Kamakura, Japan

WE4A-6: A Novel Base Feed Design for High Power, High Frequency Heterojunction Bipolar Transistors.M.L. Salib, H. Hahn, J. Zingaro, A. Ezis, A.K. Gupta, NorthropGrumman Corp., Baltimore, MD

WE4B-4: A 156 Mbps Compact FSK Modulator Module for 38 GHz Wireless LANsZ. Wen, M. Akiyama, Oki Electric Ind. Co., Ltd., Hachioji, Japan;Y. Hase, Communications Research Laboratory, MPT,Yokosuka, Japan

WE4B-5: An Electromagnetic Characterization of Indoor RadioEnvironment in Microwave WLAN SystemsP.I. Bernardi, R. Cicchetti, O. Testa, University of Rome “La Sapienza,” Rome, Italy

WE4C-5: A Novel Card-type Transponder Designed using Retrodirective Antenna ArrayS.J. Chung, T.C. Chou, Y.N. Chiu, National Chiao TungUniversity, Hsinchu, Taiwan, ROC

WE4A-7: High Efficiency S-band Class AB Push-pull PowerAmplifier with Wide Band Harmonic SuppressionC.Y. Hang, Y. Qian, T. Itoh, University of California at Los Angeles, Los Angeles, CA

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WEDNESDAY, MAY 23, 2001 IEEE MTT-S IMS TECHNICAL SESSIONS 3:30–5:10 PM

Wednesday 7:30–10:00 PM

Awards BanquetHyatt Regency

This evening will consist of an elegantdinner, an MTT-S awards presentation andentertainment. The banquet will feature NativeAmerican Dancers and an after dinnerperformance by comedian Paula Poundstone.

Paula’s ability to create humor on the spot islegendary and with her casual air, impeccabletiming and razor-sharp wit, she raises stand-upto an art form. As a performer, Paula enjoys a

uniquely intimate rapport with her audience.Her relaxed, comfortably humorouswanderings from topic to topic turn each showinto a brilliant stream-of-consciousnessexperience, with no two performances beingexactly alike. Her off-kilter view of the worldand her complete honesty strike a receptivechord, which has led to an impressive list ofachievements.

In keeping with Arizona’s southwesttraditions, the audience will also be delightedby the performance of Native American HoopDancers.

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WE4F Ferrite and Ferroelectric Devices

Chair: D. Webb, Naval Research LaboratoryCo-chair: B. Elsharawy, Arizona State University

YUMA 21–23

WE4F-1: UHF Frequency Selective LimitersJ.D. Adam, S.N. Stitzer, R.M. Young, Northrop Grumman Corp.,Baltimore, MD

WE4F-2: Very Low Loss Wideband Isolators for mm-wavelengthsN.R. Erickson, University of Massachusetts, Amherst, MA

WE4F-3: A Novel Nonreciprocal Ferrite Image GuideA.S. Akyol, L.E. Davis, UMIST, Manchester, UK

WE4F-4: A Ultra Miniature Isolator with Broadband Isolationusing Ferrite GyratorT. Okada, T. Makino, S. Shinmura, S. Hino, T. Nakada, H. Asai,Murata Manufacturing Co., Ishikawa-gun, Japan

WE4F-5: A Method of Effective Use of Ferrite for MicrowaveAbsorberY. Kotsuka, M. Amano, Tokai University, Hiratuka, Japan

WE4F-6: Phase Shifters using (Ba,Sr) TiO3 Thin Films on Sapphire and Glass SubstratesB. Acikel, Y. Liu, A.S. Nagra, T.R. Taylor, P.J. Hansen, J.S. Speck, R.A. York, University of California at Santa Barbara,Santa Barbara, CA

WE4F-7: MOS Varactors with Ferroelectric FilmsS. Gevorgian, S. Abadei, H. Berg, Chalmers University of Technology, Gothenburg, Sweden; H. Jacobsson, EricssonMicrowave Systems, Gothenburg, Sweden

WE4E CAD Procedures and Optimization

Chair: K.C. Gupta, University of ColoradoCo-chair: M. Mongiardo, University of Perugia,

YUMA 26–28, 31–33

WE4D Internet Via Satellites

Chair: R.K. Gupta, Lockheed Martin GlobalCo-chair: B. Geller, Mitsubishi Electric & El.

TUCSON 42–43

WE4E-1: Expanded Space Mapping Design FrameworkExploiting Preassigned ParametersJ.W. Bandler, Bandler Corp., Dundas, Canada; M. Ismail, J.E. Rayas-Sanchez, McMaster University, Hamilton, Canada

WE4D-1: Satellite Systems for Multimedia and Internet TrafficP. Chitre, R. Gupta, Lockheed Martin GlobalTelecommunications, Clarksburg, USA

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3:40

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WE4E-2: Multi-level Passive Order Reduction of InterconnectNetworksR. Khazaka, M. Nakhla, Carleton University, Ottawa, Canada

WE4D-2: Ka-band Satellite System Architecture for Local LoopInternet AccessA.E. Atia, Orbital Sciences Corp., Germantown, USA

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WE4E-3: Fast Analysis and Optimization of Combline Filtersusing FEMD.G. Swanson, Jr., Bartley R.F. Systems Inc., Amesbury, USA;R.J. Wenzel, Wenzel/Erlinger Associates, Agoura Hills, USA

WE4D-3: User Terminal Antennas for Broadband NGSO SatelliteCommunications SystemsR. Kreutel, Teledesic, Bellevue, USA

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WE4D-4: Outdoor Units for Ka/Ku band Satellite InteractiveTerminalsJ.L. Fikart, A. Chan, Norsat International Inc., Burnaby, Canada

WE4D-5: Performance of Multi-carrier 16 QAM over a Linearized TWTA Satellite ChannelR. Schornstaedt, N. Rozario, C. Hayes, J. Sietner, LockheedMartin Commercial Space Systems, Newtown, USA; A. Katz,The College of New Jersey, Ewing, NJ

WE4E-4: Integrated CAD Procedure for Iris Design in a Multi-mode Waveguide EnvironmentW. Steyn, R. Lehmensiek, P. Meyer, University of Stellenbosch,Stellenbosch, South Africa

WE4E-5: Decomposition Synthesis Approach to Design of RF and Microwave Active CircuitsL.I. Babak, Tomsk State University of Control Systems and Radioelectronics, Tomsk, Russia

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WEIF-1: Waveguiding Properties of a Line of Periodically Arranged Passive Dipole ScatterersS. Tretyakov, A. Viitanen, Helsinki University of Technology, Espoo, Finland

WEIF-2: New Type of Millimeter Wave Antenna by using the NRD Guide with LSE ModeTransmissionF. Kuroki, M. Yamaguchi, K. Seto, Kure National College of Technology, Kure, Japan

WEIF-3: Efficient Method for Solving 3D Dielectric Planar Circuit with Parabolic EquationMethodT. Anada, R. Sawada, T. Hiraoka, J. Hsu, Kanagawa University, Yokohama, Japan

WEIF-4: Design of Surface-wave Band-gaps for Planar Integrated Circuits using MultiplePeriodic Metallic Patch ArraysR. Leone, H. Yang, Univ. of Illinois at Chicago, Chicago, IL

WEIF-5: Space Leakage of Power from the SlotlineJ. Zehentner, J. Machac, P. Lorenz, Czech Technical University, Prague 6, Czech Republic

WEIF-6: Derivation of Analytical Dyadic Green’s Function Modifications for MicrostripAttenuation in Transmission Layered StructuresC.M. Krowne, Naval Research Laboratory, Washington, DC

WEIF-7: On the Penetration of the Longitudinal Component of EM Fields into Metals.R.I. Tzontchev, A.E. Chubykalo, J.M. Rivera-Ju’arez, Universidad Aut’onoma de Zacatecas,Zacatec, Mexico; V.V. Onoochin, Sirius, Moscow, Russia

WEIF-8: Modal Cutoff in Coaxial Transmission Lines of Conical and Cylindrical GeometriesC.M. Weil, B.F. Riddle, D.R. Novotny, R.T. Johnk, NIST, Boulder, CO

WEIF-9: Full Wave Analysis of Transverse and Longitudinal Couplings in Silicon RFIC Effectof Buried Diffusions.S. Wane, H. Baudrand, ENSEEIHT, Toulouse, France; D. Bajon, SUPAERO, Toulouse, France; P. Gamand, Philips, Caen, France

WEIF-10: Frequency/Time-domain Modeling of Microstrip Circuits by a Modified SpectralDomain ApproachP. Arcioni, M. Bressan, G. Conciauro, University of Pavia, Pavia, Italy

WEIF-11: Efficient Analysis of Waveguide-to-microstrip and Waveguide-to-coplanar LineTransitionsL. Greda, R. Pregla, University of Hagen, Hagen, Germany

WEIF-12: A 3-D Method of Moments for the Analysis of Real Life MMICsM. Farina, T.E. Rozzi, University of Ancona, Ancona, Italy

WEIF-13: Generalized Polygonal Basis Functions for the Electromagnetic Simulation of Complex Geometrical Planar StructuresL. Knockaert, J. Sercu, Agilent Technologies, Ghent, Belgium; D. De Zutter, Ghent University,Ghent, Belgium

WEIF-14: FD-FD GSM Technique for the CAD and Optimization of Combline FiltersR. Lotz, F. Arndt, University of Bremen, Bremen, Germany

WEIF-15: Electromagnetic Modeling of Multi-layer Microwave Circuits by the LongitudinalDecomposition ApproachA. Kirilenko, D. Kulik, L. Rud, V. Tkachenko, Institute for Radiophysics and Electronics,National Academy of Sciences of Ukraine, Kharkov, Ukraine; P. Pramanick, Salisbury StateUniversity, Salisbury, USA

WEIF-16: A Novel Cold-FET Method for Determining Extrinsic Capacitances using a Capacitive Transmission Line ModelY. Lai, C. Chen, Feng Chia University, Taichung, Taiwan

WEIF-17: Modeling of 3-D Planar Conducting Structures on Lossy Silicon Substrate in HighFrequency Integrated CircuitsJ. Zheng, J. Li, A. Weisshaar, Oregon State University, Corvallis, OR

WEIF-18: Modeling and Investigation of Instabilities in Heterojunction Interband TunnelDiodes for Microwave ApplicationsA. Cidronali, G. Collodi, G. Manes, C. Toccafondi, University of Florence, Florence, Italy; M. Deshpande, N. El-Zein, H. Goronkin, V. Nair, Physical Sciences Research Laboratory,Tempe, AZ

WEIF-19: MOSFET Bulk Effect Behaviour and Estimation for Microwave-frequency ModelingR.V. Reynisson, T.E. Kolding, T. Larsen, Aalborg University, Aalborg, Denmark

WEIF-20: A New Analytical Small-signal Model of Dual-gate GaAs MESFETM.M. Ibrahim, B.A. Syrett, Carleton University, Ottawa, Canada; J. Bennett, Nortel Networks,Ottawa, Canada

WEIF-21: Measurement-based Extrinsic Modeling of RF ComponentsK. Naishadham, Philips Broadband Networks Inc., Manlius, USA

WEIF-22: Design and Implementation of Micromachined Lumped Quadrature HybridsL. Lu, S. Mohammadi, P. Bhattacharya, L.P. Katehi, University of Michigan, Ann Arbor, MI,G.E. Ponchak, NASA Glenn Research Center, Cleveland, OH

WEIF-23: Q-enhancement of Spiral Inductor with N+ Diffusion Patterned Ground ShieldsE. Chen, D. Heo, J. Laskar, Georgia Institute of Technology, Atlanta, GA; D. Bien, NationalSemiconductor Corp., Tucson, AZ

WEIF-24: A Design Mapping Formula of Asymmetrical Multi-element Coupled LineDirectional CouplersJ.B. Kil, C.S. Kim, K.S. Choi, J.S. Park, D. Ahn, Soonchunhyang Univ., Asan, ROK

WEIF-25: A General Design Formula of Multi-section Power Divider Based on SinglyTerminated Filter Design TheoryS. Lee, C. Kim, K. Choi, J. Park, A. Dal, Soonchunhyang Univ., Asan, ROK

WEIF-26: A New Balanced Amplifier using 6-Port Power DividerJ. Lim, J. Han, S. Kim, D. Lee, S. Nam, Seoul National University, Seoul, ROK; S. Eom,Electronics and Telecommunications Research Institute, Taejon, ROK

WEIF-27: 60 GHz Coplanar Waveguide Couplers and Slotline Transition on PolishedBeryllium Oxide.B. Lakshminarayanan, T. Weller, M. Oldenburg, University of South Florida, Tampa, FL

WEIF-28: Integration of Optimized Low-pass Filters in Band-pass Filters for Out-of-bandImprovement.C. Quendo, E. Rius, C. Person, M. Ney, LEST, Brest, France

WEIF-29: Non-adjacent Resonators Effects on Coupling and Resonant Frequency in Combline FiltersM.A. El Sabbagh, K.A. Zaki, University of Maryland at College Park, College Park, MD; M. Yu,ComDev, Inc, Cambridge, Canada

WEIF-30: Evanescent-mode Bandpass Filters Based on Ridged Waveguide Sections and Inductive StripsA. Kirilenko, L. Rud, V. Tkachenko, D. Kulik, Institute for Radiophysics and Electronics,National Academy of Sciences of Ukraine, Kharkov, Ukraine

WEIF-31: A Compact Elliptic-function BPF using Triple-mode Cavities for Terrestrial DigitalTelevision TransmittersK. Konno, M. Kubota, Y. Iwamoto, Antenna Giken Co. Ltd., Ohmiya, Japan

WEIF-32: Circular-to-rectangular Waveguide DiplexersT. Shen, K.A. Zaki, University of Maryland, College Park, MD; T.G. Dolan, K&L MicrowaveInc., Salisbury, USA

WEIF-33: K-band Monolithic Double-balanced Resistive Mixer with Integrated BalancedOscillatorK.S. Ang, I.D. Robertson, University of Surrey, Guildford, UK; D. Kim, M. Ju, H. Seo, Eoncom,Seoul, Korea

WEIF-34: Fundamental Limitations of Conversion Loss and Output Power on an EvenHarmonic Mixer with Junction CapacitanceK. Itoh, Mitsubishi Electric Corp., Amagasaki, Japan; M. Shimozawa, Mitsubishi ElectricCorp., Kamakura, Japan

WEIF-35: A K-band Subharmonic Down-converter in a GaAs Metamorphic HEMT ProcessB. Matinpour, N. Lal, J. Laskar, Georgia Tech, Atlanta, GA; R.E. Leoni, C. Whelan, Raytheon,Andover, MA

WEIF-36: Performance Comparison of Single and Dual Stage MMIC LimitersJ.M. Carroll, TriQuint Semiconductor Texas, Richardson, TX

WEIF-37: Novel Frequency Doubler using Feedforward for Fundamental FrequencyComponent SuppressionN. Siripon, M. Chongcheawchamnan, I.D. Robertson, University of Surrey, Guildford, UK

WEIF-38: A Compact T/R Switching Circuit using Quadrature Couplers and Drain-driven HPAsH. Uchida, M. Nii, Y. Tsukahara, M. Miyazaki, Y. Itoh, Mitsubishii Electric Corp., Kamakura,Japan

WEIF-39: Comparison of Different Adaptation Algorithms for Adaptive Digital Predistortionbased on EDGE StandardK.C. Lee, P. Gardner, University of Birmingham, Birmingham, UK

WEIF-40: An Internally Matched LTCC 3G WCDMA LDMOS 180 W Power AmplifierJ. Rstes, P. Piel, G. Shapiro, A. Pavio, J. Call, G. Funk, Motorola, Tempe, AZ

WEIF-41: Effect of Efficiency Optimization on Linearity of LINC Amplifiers with CDMA SignalJ. Yi, Y. Yang, B. Kim, Pohang University of Science and Technology, Pohang, ROK

WEIF-42: Ultra-linear Distributed Class-AB LDMOS RF Power Amplifier for Base StationsM.P. van der Heijden, H.C. de Graaff, L. de Vreede, J.N. Burghartz, Delft University of Technology, Delft, The Netherlands; J.R. Gajadharsing, Philips Semiconductors, Nijmegen,The Netherlands

WEIF-43: Experimental Investigation on Efficiency and Linearity of Microwave DohertyAmplifierY. Yang, J. Yee, Y.Y. Woo, B. Kim, POSTECH, Pohang, Korea

WEIF-44: Numerical Investigation of Vertical Contactless Transitions for Multilayer CircuitsP. Moretti, L. Manholm, B. Svensson, Ericsson Microwave Systems, 431 84 Mölndal, Sweden;P.J. Starski, Chalmers University of Technology, 412 96 Gothenburg, Sweden

WEIF-45: Direct Conversion Receiver for Digital Beamforming at 8.45 GHzK. Mori, H. Arai, Yokohama National University, Yokohama, Japan; Y. Qian, T. Itoh,University of California, Los Angeles, Los Angeles, CA

WEIF-46: Reflective Antenna Arrays Based on Shorted Ring SlotsA.E. Martynyuk, J.I. Martinez, Facultad de Ingenieria, Universidad Nacional Autonoma deMexico, Mexico, Mexico

WEIF-47: Analysis and Design of Active Antenna ArraysK. Liu, S.M. El-Ghazaly, Telecommunication Research Center, Tempe, AZ; V. Nair, M. Deshpande, N. El-Zein, H. Goronkin, PSRL, Motorola Labs, Tempe, AZ

WEIF-48: Direction Finding using Spectral Estimation with Arbitrary Antenna ArraysT. Do-Hong, W. Fisch, P. Russer, Technische Universität München, München, Germany

WEIF-49: Broadband Planar Antenna with Low Side Lobes Levels Capabilities and High Cross-polarisation Rejection for DBS ReceptionL. Bekraoui, University of Paderborn, Paderborn, Germany

WEIF-50: A Low Noise Active Integrated Antenna Receiver for Monopulse Radar ApplicationsS. Lin, Y. Qian, T. Itoh, University of California Los Angeles, Los Angeles, CA

WEIF-51: A Quasi-optical LinearizerK.Y. Sung, B. Elamaran, W.A. Shiroma, University of Hawaii at Manoa, Honolulu, HI

WEIF-52: Study of Design Parameters in Waveguide-based Spatial Power Combining AmplifierArrays using FDTDM. Ozkar, G. Lazzi, A. Mortazawi, North Carolina State University, Raleigh, NC

WEIF-53: Broadband Analysis of a D-band Holographic Power Combining CircuitM. Hoeft, R. Judaschke, Technical University of Hamburg-Harburg, Hamburg, Germany; J. Weinzierl, University Erlangen-Nuernberg, Erlangen, Germany

WEDNESDAY, MAY 23, 2001 • INTERACTIVE FORUM • 2:30–5:00 PM

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PWA: AUTOMOTIVE RADAR

Date & Time: Wednesday May 23, 12:00–1:15 PM

Location: Civic Plaza

Organizers: Mohammad Madihian, NEC USA Inc.Hiroshi Kondoh, Hitachi

Moderator: Mohammad Madihian, NEC USA Inc.

Panelists: Josef Wenger, DaimlerChryslerTakao Matsumura, NECTatsuya Hirose, FujitsuRalph Rasshofer, InfineonFrank Kolak, Tyco ElectronicsHiroshi Kondoh, Hitachi

This panel discusses circuit and antenna technologies that canbe used for automotive radars, and tries to clarify the features thatmust be met by these components. The panel will address the fol-lowing questions: ✗ What functions should an automotive radar be equipped

with, now and in the future?✗ What is the best automotive radar scheme? ✗ What device and circuit technologies will be most

appropriate?✗ What antenna technologies will be most appropriate? ✗ What issues still need to be addressed and solved?

PWB: UNIVERSITY–INDUSTRY INTERACTIONS

Date & Time: Wednesday May 23, 12:00–1:15 PM

Location: Civic Plaza

Organizers: Mike Golio, Rockwell Collins

Peter Blakey, ON Semiconductor

Moderator: Mike Golio

Panelists: L. Dunleavy, University of South FloridaC. Snowden, FiltronicsR. Trew, Case Western Reserve UniversityJ. Costa, ON Semiconductor

Universities offer digital and VLSI design courses routinely atboth the undergraduate and graduate levels. The availability ofhigh-frequency analog, RF, microwave and millimeter-wave de-sign courses is far less pervasive. This panel will discuss the waysin which universities and industry can work together to increasethe supply of engineers who can design circuits for wireless andbroadband applications. Questions that will be discussed includethe following:✗ Is industry handicapped by a real and persistent shortage of

RF and microwave designers? ✗ What difficulties do universities face in establishing RF and

microwave design courses? ✗ What does the microwave industry need from universities? ✗ What do universities need from the microwave industry? ✗ What different forms of collaboration between industry and

universities are being deployed? ✗ What are the advantages and disadvantages of each form of

collaboration? ✗ Should government play a role in promoting interactions

between industry and universities? ✗ What new approaches to collaboration can meet the needs

of both industry and universities?

WE1D: FREQUENCY CONTROL ADVANCES FOR WIRELESS APPLICATIONS


Time: 8:00–10:00 AM

Session Chair: R. Newgard, Rockwell CollinsCo-Chair: S. Wetenkamp, Micro Lamba

Description:

As the demand for more complex wireless systems grows to meetthe seemingly insatiable appetite of the consumer marketplace, thepressure on the LO sources has kept pace. This session presents avariety of approaches and discussions of problem areas that the de-sign engineer faces in his quest for the perfect signal source.

WE2D: THE NBS/NIST CENTENNIAL: ONE HUNDRED YEARS OF RF METROLOGY AND STANDARDS


Time: 10:30 AM–12:00 PM

Session Chair: K. Remley, NIST Boulder, COCo-Chair: C. Weil, NIST Boulder, CO

Description:

NIST, the successor to the former National Bureau of Standards(NBS), celebrates its centennial year. Five NIST speakers will de-tail significant NBS/NIST contributions in measuring such funda-mental quantities as frequency, time, power, resistance, voltage,and mass. Recent developments in primary NIST standards, suchas the cesium fountain atomic clock, the Josephson AC voltagestandard, and the “electronic kilogram” will also be highlighted.

WE3D: MICROWAVE AND OPTICAL BROADBAND INTERNET ACCESS


Time: 1:30–3:00 PM

Session Chair: C. Cox, MIT and Photonic Systems Inc.

Description:

The first and still dominant commercial market for microwavephotonics, is the distribution (unidirectional data flow) such as incable television (CATV) services. However, there is a large mar-ket (potentially larger than CATV distribution) in the communica-tion (bi-directional data flow) of high speed digital data. The mar-ket driving this application is the internet, which has been grow-ing at what can only be described as an explosive rate. Forexample, internet traffic is doubling every 100 days; e-mail trafficalone has reached 95 million per month. Providing broadbandaccess via the existing coax, optical and/or wireless plants meansupgrading the present plants in two ways: 1. converting it to beaddressable from a broadcast network, and 2. implementing bi-directional information flow instead of the present unidirectionalflow. The technologies that are being developed to providebroadband access are coax cable, optical fiber and fixed or mo-bile wireless communications. This session will explore each ofthese approaches and their combination via invited speakerswho are actively working in the field.

WE4D: INTERNET VIA SATELLITES


Time: 3:30–5:00 PM

Session Chair: R.K. Gupta, Lockheed Martin Global TelecomsCo-Chair: B. Geller, Mitsubishi Electric & Electronics

Description:

A number of satellite systems have been proposed for broad-band global/regional multimedia and internet services via satel-lites. Many of these systems are at an advanced stage of develop-ment with projected deployment in 2003 to 2005 time frames. Thetopics to be addressed in this special session include satellite sys-tems for multimedia, Ka-Band satellite architectures, Ku/Ka-Bandinteractive terminals for geostationary and non-geostationary satel-lites and performance issues for a linearized TWTA satellite chan-

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WEDNESDAY PANEL SESSIONSWEDNESDAY SPECIAL SESSIONS

8:00

AM

TH1A Microwave Signal Sources

Chair: Johann-F. LuyCo-chair: O. LlopisBALLROOM

TH1B Active and Tunable Filters

Chair: M. Guglielmi,Co-chair: P. Guillon, IRCOM

TUCSON 36–38

TH1C Passive Filters and Multiplexers 1

Chair: R.V. Snyder, RS MicrowaveCo-chair: Chi Wang, Radio Frequency Systems Inc.

TUCSON 40–41

TH1A-1: Low Phase Noise, Fully Integrated Monolithic VCO InX Band Based on HBT TechnologyZ. Oaurch, M. Camiade, UMS-SAS, Orsay, France; F. Arlot, M. Prigent, University of Limoges, Brive La Gaillarde, France;M. Borgarino, L. Bary, University of Toulouse, Toulouse, France

TH1B-1: Compact High-order Planar Ring-resonator FiltersOptimized in Noise in Coplanar TechnologyL. Nénert, L. Billonnet, B. Jarry, P. Guillon, IRCOM –- Universityof Limoges, Limoges, France; C. Quendo, E. Rius, G. Tanné,LEST – University of Brest, Brest, France

TH1C-1: Design of CT and CQ Filters using Approximation and OptimizationR. Levy, R.Levy Associate, La Jolla, CA; P. Petre, HRLLaboratories, Malibu, CA

8:10

AM

TH1B-2: Tunable Active Filters Having Multilayer Structureusing LTCCK. Kageyama, K. Saito, H. Utaki, Sumitomo Metal (SMI)Electronics Devices Inc., Amagasaki, Japan; H. Murase, T.Yamamoto, Sumitomo Metal Industries Ltd., Amagasaki, Japan

8:20

AM

TH1A-2: Conditions for Broadband MMIC Voltage-controlledOscillators Based on Theory and ExperimentsA. Megej, H.L. Hartnagel, Darmstadt University of Technology,Darmstadt, Germany; K. Beilenhoff, United MonolithicSemiconductors, Orsay, France

TH1B-3: Full Wave Analysis and Design of RF Tunable FiltersJ. Xu, X. Liang, K. Shamsaifar, Paratek Microwave Inc.,Columbia, MD

TH1C-2: A Method for the Direct Synthesis of General SectionsT.B. Reeves, C.W. Rossiter, Trilithic Inc., Indianapolis, IN; N.D.van Stigt, Northeastern Microwave, Halifax, Canada

8:30

AM

8:40

AM

TH1A-3: Solid State High Power RF OscillatorD. Gitsevich, D. Kirkpatrick, L. Dymond, Jr., Fusion Lighting,Rockville, USA

TH1B-4: Tunable RF Filters using Thin Film Barium StrontiumTitanate Based CapacitorsA. Tombak, A. Mortazawi, F.T. Ayguavives, J. Maria, A.I. Kingon,North Carolina State University, Raleigh, NC; G.T. Stauf, ATMIInc., Danbury, CT

TH1C-3: Temperature Characteristics of Combline Resonatorsand FiltersH. Yao, A.E. Atia, Orbital Sciences Corp., Germantown, 20874

8:50

AM

TH1B-5: Hybrid Resonator Microstrip Line Electrically TunableFilterX. Liang, Y. Zhu, Paratek Microwave Inc., Columbia, MD

TH1C-4: Periodic Structures for Original Design of Voluminousand Planar Microwave FiltersB. Lenoir, D. Baillargeat, S. Verdeyme, P. Guillon, IRCOM,Limoges, France; J. Puech, C. Zanchi, CNES, Toulouse, France

9:00

AM

9:10

AM

9:20

AM

TH1A-4: High Power AlGaN/GaN FET-Based VCO SourcesJ.B. Shealy, J.A. Smart, J.R. Shealy, RF Nitro CommunicationsInc., Charlotte, NC

TH1A-5: Reduced Flicker Noise in Microwave Oscillators usingFeedforward AmplifiersJ.K.A. Everard, C.D. Broomfield, University of York, Heslington,UK

TH1B-6: Design of Tunable Ferroelectric Filters with a ConstantFractional Band WidthI. Vendik, O. Vendik, V. Pleskachev, A. Svishchev, St. PetersburgElectrotechnical University, St. Petersburg, Russia; R.Woerdenweber, Forschungszentrum Juelich, Juelich, Germany

TH1C-5: A Design of Planar Elliptic Bandpass Filter using SMDType Partially Metallized Rectangular Dielectric ResonatorsH.Y. Hwang, S.W. Yun, I.S. Chang, Sogang University, Seoul,ROK

TH1C-6: Full-wave Design of Canonical Waveguide Filters by OptimizationT. Shen, K.A. Zaki, University of Maryland, College Park, MD;A.E. Atia, Orbital Sciences Corp., Germantown, USA

TH1C-7: Length Reduction of Evanescent-mode RidgeWaveguide FiltersT. Shen, K.A. Zaki, University of Maryland, College Park, MD

TH1A-6: A Wideband Voltage-tunable Dielectric ResonatorOscillator Controlled by a Piezoelectric TransducerT. Yun, K. Chang, Texas A&M University, College Station, TX;R.S. Tahim, RST Scientific Research Inc., Anaheim, CA

TH1C-8: Zolotarev Bandpass FiltersH.C. Bell, HF Plus, Chatsworth, USA

9:30

AM

44

THURSDAY, MAY 24, 2001 IEEE MTT-S IMS TECHNICAL SESSIONS 8:00–9:40 AM

TH1E Probing and Automated MeasurementsJoint IMS/ARFTG Session

Chair: E. Strid, Cascade MicrotechCo-chair: B. Szendrenyi, Agilent Technologies

YUMA 26–28, 31–33

TH1D HF/VHF/UHF Power Amplifiers

Chair: F.H. Raab, Green Mountain Radio ResearchCo-chair: M. Eron, Ericsson Amplifier Technology

TUCSON 42–43

TH1E-1: Integrated Electro-thermal ProbeR.M. Reano, K. Yang, J.F. Whitaker, L.P. Katehi, University of Michigan, Ann Arbor, MI

TH1F: Al Gross Memorial SessionInvited Speakers

TH1D-1: Current Status and Emerging Trends in RF Power FETTechnologiesK. Shenai, University of Illinois at Chicago, Chicago, IL

8:00

AM

8:10

AM

TH1E-2: Calibrating Electro-optic Sampling SystemsD.F. Williams, P.D. Hale, T.S. Clement, J.M. Morgan, NIST,Boulder, CO

TH1D-2: 7-MHz, 1.1-kW Demonstration of the New E/F2, Odd Switching Amplifier ClassS.D. Kee, I. Aoki, D. Rutledge, California Institute of Technology, Pasadena, CA

8:20

AM

8:30

AM

TH1E-3: A Three-port Vector Network Analyzer-measurementSystem, Calibration and ResultsT. Chu, W. Deng, National Taiwan University, Taipei, ROC

TH1D-3: High-efficiency Inductor-coupled SEPIC for Use inDynamic Envelope Tracking CDMA RF Power AmplifiersD.R. Anderson, W.H. Cantrell, Motorola Research andDevelopment Center, Fort Worth, TX

8:40

AM

TH1E-4: Microwave On-wafer Characterization of Three-portDevices using Shield-based Test-fixturesT.E. Kolding, M.B. Jenner, S. Laursen, RISC Group Denmark,Aalborg, Denmark

8:50

AM

9:00

AM

9:10

AM

9:20

AM

THID-4: Electronically Tunable Class-E Power AmplifierF.H. Raab, Green Mountain Radio Research, Colchester, USA

TH1D-5: A GSM-EDGE High Power Amplifier Utilising DigitalLinearisationP.B. Kenington, M. Cope, R.M. Bennett, J. Bishop, WirelessSystems International Ltd., Bristol, UK

TH1E-5: Accurate Transmission Line Characterization on Highand Low-resistivity SubstratesG.J. Carchon, B. Nauwelaers, K.U. Leuven, Heverlee, Belgium

TH1E-6: Automatic Test and Tuning System for MicrowaveFiltersP.A. Harscher, R. Vahldieck, ETH Zurich, Zurich, Switzerland; S. Amari, RMC Canada, Kingston, Canada

9:30

AM

45

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TH1F Al Gross Memorial Session

V. Nair, Motorola Inc.

YUMA 21–23

10:2

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TH2A Millimeter-wave Signal Sources

Chair: J.H. Kuno, Quinstar Inc.Co-chair: R. Alm, Raytheon Co.

BALLROOM

TH2B Active and Planar Filters

Chair: D.G. Swanson, Jr., Bartley RF Systems

TUCSON 36–38


Chair: J. Modelski, Warsaw University of Tech.Co-chair: H. Clark Bell, HF Plus

TUCSON 40–41

TH2A-1: Low Phase-noise GaInP/GaAs-HBT MMIC Oscillatorsup to 36 GHzH. Kuhnert, F. Lenk, J. Hilsenbeck, J. Würfl, W. Heinrich,Ferdinand-Braun-Institut (FBH), Berlin, Germany

TH2B-1: Negative Resistance Optimized in Noise for LossesCompensation in Microstrip ResonatorsA. Zaitsev, B. Kapilevitch, Siberia State University of Telecommunication & Informatics, Novosibirsk, Russia; L. Billonnet, B. Jarry, P. Guillon, IRCOM - University of Limoges, Limoges, France

TH2C-1: Design of Coupled Resonators Group Delay EqualizersH. Hsu, K. Zaki, University of Maryland, College Park, MD; H. Yao, A. Atia, Orbital Science Corp., Germantown, USA

10:3

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:40

AM

TH2A-2: Monolithic 38 GHz Coplanar Feedback VCOsFabricated by a Production pHEMT TechnologyH.J. Siweris, H. Tischer, E. Rohrer, Infineon Technologies,Munich, Germany

TH2B-2: Using a Negative Capacitance to Increase the TuningRange of a Varactor Diode in MMIC TechnologyB. Delacressonniere, J.L. Gautier, ENSEA, Cergy Pontoise,France; S. Kolev, Corning Inc., Avon, France

TH2C-2: High Power C-band Dielectric Resonator Filters for Output MultiplexersY. Latouche, D. Gasperoni, J.J. Herren, Alcatel Space Industries,Toulouse, France

10:5

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TH2A-3: Low Phase-noise pHEMT-based MMIC VCOs for LMDSApplicationsA. Boudiaf, ATN Microwave, Billerica, MA; M. Ahdjoudj, Philips,Mans, France; P. Pouvil, ENSEA, Cercy, France

TH2B-3: Compact MMIC Active InductorG. Avitabile, B. Chellini, Politecnico di Bari, Bari, Italy; E. Limiti, F. Giannini, Università di Roma 2 “Tor Vergata,”Roma, Italy

TH2C-3: Analysis of Power Handling Capacity of Band PassFiltersC. Wang, Radio Frequency Systems Inc., Marlboro, MA; K.A. Zaki, University of Maryland, College Park, MD

11:1

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TH2B-4: Microstrip Miniaturized Loop-filters with High Out-of-band Rejection for Future Mobile TerminalsY. Toutain, J. Coupez, C. Person, LEST-ENST Bretagne, BrestCedex, France

TH2C-4: Low-loss Filters in Rectangular Waveguide withRigorous Control of Spurious Responses Through a Smart ModalFilterF. Alessandri, University of Perugia, Perugia, Italy; M.C. Comparini, F.M. Vitulli, Alenia Spazio, Rome, Italy

11:2

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:30

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11:4

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TH2A-4: Coplanar and Microstrip Oscillators in SiGe SIMMWICTechnologyK.M. Strohm, C.N. Rheinfelder, J. Luy, DaimlerChrysler, Ulm,Germany; P. Nuechter, T. Hess, EADS, Ulm, Germany; W. Heinrich, H. Kuhnert, Ferdinand-Braun-Institut, Berlin,Germany; M. Nadarassin, C. Warns, W. Menzel, University ofUlm, Ulm, Germany

TH2A-5: Low Jitter Silicon Bipolar Based VCOs for Applicationsin High Speed Communication Systems.A. Khanna, E. Topacio, E. Gane, Agilent Technologies, SantaClara, CA; D. Elad, Rafael, Haifa, Israel

TH2B-5: Wideband Bandpass Filter Design with Three-lineMicrostrip StructuresJ. Kuo, E. Shih, National Chiao Tung University, Hsinchu,Taiwan

TH2B-6: A 60 GHz-band Planar Dielectric Waveguide Filter for Flip-chip ModulesM. Ito, K. Maruhashi, K. Ohata, NEC Corp., Otsu, Japan; K. Ikuina, T. Hashiguchi, NEC Corp., Kawasaki, Japan; S. Iwanaga, NEC Kansai, Ltd., Otsu, Japan

TH2C-5: Observations on the Stopband Performance of TappedLine FiltersR.J. Wenzel, Wenzel/Erlinger Associates, Agoura Hills, USA;D.G. Swanson, Jr., Bartley RF Systems Inc., Amesbury, USA

TH2C-6: Stop-band Improvement of Rectangular WaveguideFilters using Different Width Resonators: Selection of ResonatorWidthsM. Morelli, Filtronic plc, Shipley, UK; I. Hunter, R. Parry, V. Postoyalko, University of Leeds, Leeds, UK

TH2C-7: Diplexer Design using Pre-synthesized WaveguideFilters with Strongly Dispersive InvertersS. Amari, J. Bornemann, University of Victoria, Victoria,Canada; W. Menzel, University of Ulm, Ulm, Germany; F. Alessandri, University of Perugia, Perugia, Italy

TH2A-6: Push-push Oscillators for 94 and 140 GHz Applicationsusing Standard Pseudomorphic GaAs HEMTsS. Kudszus, W.H. Haydl, A. Tessmann, W. Bronner, M. Schlechtweg, Fraunhofer IAF, Freiburg, Germany

TH2C-8: Filter Topologies with Minimum Peak Stored EnergyC. Ernst, Lorch Microwave, Salisbury, USA; V. Postoyalko,University of Leeds, Leeds, UK; R. Parry, Filtronic plc, Shipley,UK; I. Hunter, Filtronic plc, Shipley, UK

11:5

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THURSDAY, MAY 24, 2001 IEEE MTT-S IMS TECHNICAL SESSIONS 10:20 AM–12:00 PM

TH2F High Speed HBT Technology and Applications

Chair: L. Kushner, PhotonExCo-chair: H.A. Hung, GTS/ARL

YUMA 21–23

TH2F-1: Benefits of SiGe over Silicon Bipolar Technology for Broadband Mixers with Bandwidth above 10 GHzS. Hackl, M. Wurzer, J. Boeck, T.F. Meister, H. Knapp, K. Aufinger, S. Boguth, L. Treitinger, Infineon Technologies AG,Munich, Germany; A.L. Scholtz, University of Technology,Vienna, Austria

TH2F-2: 40 Gb/s 4:1 Multiplexer and 1:4 Demultiplexer ICModule using SiGe HBTsT. Masuda, N. Shiramizu, E. Ohue, K. Oda, R. Hayamai, M. Kondo, K. Washio, Central Res Lab, Hitachi, Ltd., Kokubunji,Japan; K. Ohhata, H. Shimamoto, Hitachi Device Eng, Co. Ltd.,Kokubunji, Japan; T. Harada, Device Development Center,Tokyo, Japan

TH2F-3: 40-Gb/s Analog IC Chipset for Optical Receiver – AGC Amplifier, Full-wave Rectifier and Decision Circuit –Implemented using Self-aligned SiGe HBTsK. Ohhata, F. Arakawa, Hitachi Device Engineering Co. Ltd.,Kokubunji, Japan; T. Masuda, N. Shiramizu, K. Washio, HitachiLtd., Kokubunji, Japan

TH2F-4: Low Frequency Noise and Phase Noise Behavior of Advanced SiGe HBTsL. Bary, G. Cibiel, J. Ibarra, O. Llopis, R. Plana, J. Graffeuil,LAAS-CNRS, Toulouse, France; G. Niu, J. Cressler, Z. Jin, S. Zhang, AMSTC, Auburn, USA, A. Joseph, IBM, EssexJunction, USA

TH2F-5: Power SiGe Heterojunction Bipolar Transistors (HBTs)Fabricated by Fully Self-aligned Double Mesa TechnologyL. Lu, S. Mohammadi, Z. Ma, P.K. Bhattacharya, L.P. Katehi,Univ. of Michigan, Ann Arbor, MI; G.E. Ponchak, S.A. Alterovitz,NASA Glenn Res. Cen., Cleveland, OH; K.M. Strohm, J. Luy,DaimlerChrysler Res. Cen., Ulm, Germany

TH2F-6: 185 GHz Monolithic Amplifier in InGaAs/InAlAsTransferred-substrate HBT TechnologyM. Urteaga, D.W. Scott, T. Mathew, P. Krishnan, Y. Wei, M.J. Rodwell, University of California, Santa Barbara, SantaBarbara, CA

TH2E Measurements of Non-linear Devices and Systems — Joint IMS/ARFTG Session

Chair: J. Barr, Agilent TechnologiesCo-chair: L. Dunleavy, University of South Florida

YUMA 26–28, 31–33

TH2D Millimeter Wave Multipliers and Mixers

Chair: D. Choudhury, HRL LaboratoriesCo-chair: P. Saunier, TriQuint Semiconductor

TUCSON 42–43

TH2E-1: A Method to Compare Vector Nonlinear NetworkAnalyzersK.A. Remley, D.C. DeGroot, J.A. Jargon, National Institute of Standards and Technology, Boulder, CO; K.C. Gupta,University of Colorado, Boulder, CO

TH2D-1: 2.7 THz Waveguide Tripler using MonolithicMembrane DiodesF. Maiwald, S. Martin, J. Bruston, A. Maestrini, T. Crawford,P.H. Siegel, JPL, Pasadena, CA

10:2

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TH2D-2: Fabrication of 200 to 2700 GHz Multiplier Devicesusing GaAs and Metal MembranesS.C. Martin, B.J. Nakamura, A. Fung, J. Bruston, A.E. Maestrini,F. Maiwald, P.H. Siegel, E. Schlecht, I. Mehdi, Caltech-JetPropulsion Laboratory, Pasadena, CA; R.P. Smith, Cree Inc.,Durham, NC10

:30

AM

TH2E-2: Analysis and Measurement of Multi-toneIntermodulation Distortion of Microwave Frequency ConvertersJ.C. Pedro, N.B. de Carvalho, Universidade de Aveiro, Aveiro,Portugal

TH2D-3: A 200-300 GHz SIS Mixer-preamplifier with 8 GHz IFBandwidthE.E. Lauria, A.R. Kerr, M.W. Pospieszalski, S. Pan, J.E. Effland,National Radio Astronomy Observatory, Charlottesville, VA; A.W. Lichtenberger, University of Virginia, Charlottesville, VA

10:4

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:50

AM

TH2E-3: NPR & Co-channel Distortion Ratio: A Happy Marriage?A.J. Geens, Y. Rolain, W.R. Van Moer, Vrije Universiteit Brussel,Brussels, Belgium

TH2D-4: 200, 400 and 800 GHz Schottky Diode “Substrateless”Multipliers: Design and ResultsE.T. Schlecht, G. Chattopadhyay, A. Maestrini, A. Fung, S. Martin, D. Pukala, I. Mehdi, Jet Propulsion Laboratory,Pasadena, CA; J. Bruston, ESA ESTEC, Noordwijk, Netherlands

11:0

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TH2E-4: Linearity Optimization of a Distributed Base StationAmplifier using an Automated High-speed Measurement ProtocolM.P. van der Heijden, B. Rejaei, L.C. de Vreede, Delft Universityof Technology, Delft, The Netherlands; J.R. Gajadharsing,Philips Semiconductors, Nijmegen, The Netherlands

11:1

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:20

AM

11:3

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:40

AM

TH2D-5: An I-Q Mixer at 76.5 GHz using Flip-chip MountedSilicon Schottky DiodesM.M. Kaleja, A.J. Herb, E.M. Biebl, Technische UniversitätMünchen, München, Germany; R.H. Rasshofer, InfineonTechnologies AG, München, Germany

TH2D-6: Performance of a 1.2 THz Frequency Tripler using a GaAs Frameless Membrane Monolithic CircuitA. Maestrini, D. Pukala, S. Martin, I. Mehdi, Jet PropulsionLaboratory, Pasadena, CA; J. Bruston, ESA, Noordwijk, TheNetherlands

TH2E-5: Ultra-linear Power Amplifier Characterization using Dynamic Range Extension TechniquesR. Hassun, N. Kuhn, Agilent Technologies, Santa Rosa, CA; R. Posner, R. Sweeney, B. Vassilakis, Powerwave Technologies,Irvine, CA

TH2E-6: Direct Measurement of the Maximum OperatingRegion in GaAs HBTs for RF Power AmplifiersA. Inoue, S. Suzuki, K. Yamamoto, T. Shimura, R. Hattori, Y. Mitsui, Mitsubishi Electric Corp., Itami, Japan; S. Nakatsuka,Miyoshi Electronics Corp., Miyoshi, Japan

TH2D-7: A 5 mW-290 GHz Heterostructure Barrier Tripler in a Waveguide ConfigurationT. David, D. Lippens, S. Arscott, T. Akalin, J. Carbonell, P. Mounaix, Institut d’Electronique et de Microélectronique duNord, Villeneuve d’Ascq, France; M. Guillon, A. Maestrini, B. Lecomte, G. Beaudin, Observatoire de Paris, Paris, France;M. Chaubet, Centre National d’Etudes Spatiales, Cedex, France

11:5

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TH3A Multi-layer Packaging Techniques

Chair: K. Varian, Raytheon Co.Co-chair: J. Pavio, Motorola Inc.

BALLROOM

TH3B Linear Modeling of Devices and Components

Chair: M. Megahed, Conexant Co.Co-chair: R.W. Jackson, University of Massachusetts

TUCSON 36–38


Chair: D. Schmitt, BOSCH SatComCo-chair: J.J. Herren, Alcatel Space

TUCSON 40–41

TH3A-1: A New Via Fence Structure for Crosstalk Reduction in High Density Stripline PackagesJ.W. Gipprich, D.A. Stevens, Northrop Grumman Corp.,Baltimore, MD

TH3B-1: EM-based Multidimensional Parameterized Modelingof General Passive Planar ComponentsT. Dhaene, Agilent Technologies, Ghent, Belgium; J. De Geest,D. De Zutter, Ghent University, Ghent, Belgium

TH3C-1: Dual-mode and Quad-mode Moebius Bandpass FiltersJ.M. Pond, Naval Research Lab., Washington, USA; S. Liu, N. Newman, Arizona State University, Tempe, AZ

1:30

PM

1:40

PM

TH3A-2: Coupling between Microstrip Lines Embedded in Polyimide Layers for 3D-MMICs on SiG.E. Ponchak, NASA Glenn Research Center, Cleveland, OH; E. Tentzeris, Georgia Institute of Technology, Atlanta, GA; J. Papapolymerou, University of Arizona, Tucson, AZ

TH3B-2: Using Efficient Multivariate Adaptive Sampling by Minimizing the Number of CEM Analyses Needed to EstablishAccurate Interpolation Models of Microwave CircuitsR. Lehmensiek, P. Meyer, University of Stellenbosch,Stellenbosch, South Africa

TH3C-2: Analysis and Design of Mass-producible Cross-coupled,Folded E-plane FiltersE. Ofli, R. Vahldieck, Swiss Fed. Inst. of Technology, Zurich,Switzerland; S. Amari, Royal Military College, Kingston, Canada

1:50

PM

2:00

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TH3A-3: Silicon Substrate Coupling Noise Modeling, Analysisand Experimental Verification for Mixed Signal IntegratedCircuit DesignW. Jin, Y. Eo, J. Shim, Hanyang University, Ansan, South Korea;W.R. Eisenstadt, University of Florida, Gainesville, FL; M. Park,H. Yu, ETRI, Taejon, South Korea

TH3B-3: Accurate Closed-form Expressions for the Frequency-dependent Line Parameters of On-chip Interconnectson Lossy Silicon SubstrateA. Weisshaar, H. Lan, Oregon State University, Corvallis, OR

TH3C-3: Modified Conductor Loaded Cavity Resonator with Improved Spurious PerformanceH. Salehi, R.R. Mansour, University of Waterloo, Waterloo,Canada; V. Dokas, COM DEV Ltd., Cambridge, Canada

2:10

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TH3C-4: A Practical Triple-mode Monoblock Bandpass Filter for Base Station ApplicationsC. Wang, W. Wilber, B. Engst, Radio Frequency Systems Inc.,Marlboro, USA

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TH3A-4: RF-microwave Multi-layer Integrated Passives using Fully Organic System on Package(SOP) TechnologyM.F. Davis, A. Sutono, K. Lim, Microelectronics Res. Cen.,Atlanta, GA; J. Laskar, School of ECE, Atlanta, GA; V. Sundaram,J. Hobbs, G. White, R. Tummala, Packaging Res. Cen., Atlanta,GA

TH3A-5: Design of Embedded High-Q Inductors in MCM-LTechnologyS. Dalmia, W. Kim, S.H. Min, M. Swaminathan, V. Sundaram, F. Liu, G. White, R. Tummala, Georgia Institute of Technology,Atlanta, GA

TH3A-6: A Highly Integrated Transceiver Module for 5.8 GHzOFDM Communication System using Multi-layer PackagingTechnologyK. Lim, A. Obatoyinbo, A. Sutuno, S. Chakraborty, C. Lee, E. Gebara, A. Raghavan, J. Laskar, Georgia Institute of Technology, Atlanta, GA

TH3B-4: Microstrip Line on Ground Plane with Closely SpacedPerforations - Simple CAD Formulas by Synthetic AsymptoteY.L. Chow, K. Wan, City University of Hong Kong, Kowloon,China; T.K. Sarkar, Syracuse University, Syracuse, NY; B. Kolundzija, University of Belgrade, Belgrade, Yugoslavia

TH3B-5: An Extrinsic-inductance Independent Approach for Direct Extraction of HBT Intrinsic Circuit ParametersT. Horng, J. Wu, H. Huang, National Sun Yat-Sen University,Kaohsiung, ROC

TH3C-5: Low-cost Dual-mode Asymmetric Filters in RectangularWaveguideM. Guglielmi, ESTEC, Noordwijk, Netherlands; O. Roquebrun, P. Jarry, E. Kerherve, Univ. Bordeaux, Bordeaux, France; M. Capurso, M. Piloni, Siemens, Milano, Italy

TH3C-6: Analysis and Design of Grooved Circular WaveguideDual-mode FiltersN. Yoneda, M. Miyazaki, Mitsubishi Electric Corp., Kamakura,Japan

TH3C-7: Small Filters Based on Slotted Cylindrical RingResonatorsR. Mostafavi, D. Mirshekar-Syahkal, Y. Lim, University of Essex,Colchester, UK

TH3B-6: Consistent Small-signal and RF-noise ParameterModelling of Carbon Doped InP/InGaAs HBTM. Agethen, S. Schueller, P. Velling, W. Brockerhoff, F.J. Tegude, Gerhard-Mercator-University Duisburg, Duisburg,Germany

TH3C-8: Dual-mode Filters for Cellular Base Stations usingMetallized Dielectric ResonatorsM. Fumagalli, G. Resnati, Forem s.r.l., Agrate Brianza, Italy; G. Macchiarella, Politecnico di Milano, Milano, Italy

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48

THURSDAY, MAY 24, 2001 IEEE MTT-S IMS TECHNICAL SESSIONS 1:20–3:00 PM

TH3F High Performance MMIC Technologies

Chair: Z. Bardai, RaytheonCo-chair: T. Lee, Boeing Satellite Systems

YUMA 21–23

TH3F-1: A 1–10 GHz 0.18 µm-CMOS Chipset for Multi-modeWireless ApplicationsM. Madihian, NEC USA Inc., Princeton, USA; H. Fujii, H. Yoshida, H. Suzuki, T. Yamazaki, NEC Electron Devices,Sagamihara, Japan

TH3F-2: A 0.18 & #61549; µm Foundry RF CMOS Technologywith 70 GHz fT for Single Chip System SolutionsH.M. Hsu, J.Y. Chang, C.C. Tsai, C.W. Chen, J.M. Huang, S.C. Wong, C.H. Chen, T.H. Yeh, C.H. Lin, Y.C. Sun, TaiwanSemiconductor Manufacturing Company, HsinChu, ROC; J.G. Su, C.Y. Chang, National Chiao-Tung University

TH3F-3: Deep Trench Guard Technology to Suppress Couplingbetween Inductors in Silicon RF ICsC. Kim, P. Park, J. Park, N. Hwang, H. Yu, ETRI, Taejon, Korea

TH3F-4: Physics and Compact Modeling of SOI Substrates withBuried Ground Plane (GPSOI) for Substrate Noise SuppressionS. Stefanou, University of Southampton, Southampton, UK; J.S.Hamel, University of Waterloo, Waterloo, Canada; M. Bain, P.Baine, B. Armstrong, H.S. Gamble, The Queen’s University ofBelfast, Belfast, UK

TH3F-5: Low-loss Passive Components on BCB-based 3-D MMICTechnologyK. Nishikawa, B. Piernas, K. Araki, NTT Network InnovationLaboratories, Yokosuka-shi, Japan; S. Sugitani, T. Ishii, NTTPhotonics Laboratories, Atsugi-shi, Japan; K. Inoue, NTTIntellectual Property Department, Chiy; K. Kamogawa, NTTDoCoMo Inc., Kanagawa, Japan

TH3F-6: Microwave Noise and Power Performance of Metamorphic InP Heterojunction Bipolar Transistors (HBTs)S. Halder, Y.Z. Xiong, G.I. Ng, H. Wang, H. Zheng, K. Radhakrishnan, Nanyang Technological University,Singapore, Singapore; J.C. Hwang, Lehigh University,Bethlehem, USA

TH3E Spatial Combining and Active Antennas

Chair: J. Harvey, Army Research LaboratoryCo-chair: Z. Popovic, University of Colorado

YUMA 26–28, 31–33

TH3D Millimeter Wave Transceiver Elements and Assemblies

Chair: E.C. Niehenke, Niehenke ConsultingCo-chair: F. Sullivan, Raytheon Systems Co.

TUCSON 42–43

TH3E-1: Fault Tolerance Analysis and Measurement of a SpatialPower AmplifierS.C. Ortiz, M. Ozkar, M. Steer, A. Mortazawi, North CarolinaState University, Raleigh, NC; A. Yakovlev, University of Mississippi, Oxford, MS

TH3D-1: 65145 GHz InP MMIC HEMT Medium PowerAmplifiersL.A. Samoska, Caltech-Jet Propulsion Lab, Pasadena, CA; Y.C. Leong, Univ. of Massachusetts, Amherst, MA

1:20

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TH3E-2: A K-band Full-duplex Transmit-receive Lens ArrayM.A. Forman, J. Vian, Z. Popovic, University of Colorado,Boulder, CO

TH3D-2: A New Direct Millimeter Wave Six Port ReceiverS.O. Tatu, E. Moldovan, R.G. Bosisio, École Polytechnique, Poly-Grames Laboratory, Montréal, Canada

1:40

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TH3E-3: Quasi-optical Power Amplifier using TEM WaveguideConceptM. Belaid, K. Wu, Poly-Grames Research Center, ÉcolePolytechnique, Montreal, Canada

1:50

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TH3E-4: A 16-element Reflection Grid Amplifier with ImprovedHeat SinkingA. Guyette, R. Swisher, F. Lecuyer, A. Al-Zayed, A. Kom, S. Lei,M. DeLisio, Univ. of Hawaii, Honolulu, HI; K. Sato, A. Oki, A. Gutierrez-Aitken, R. Kagiwada, TRW, Redondo Beach, CA; J. Cowles, Analog Devices, Beaverton, OR

TH3D-3: Wireless Multi-channel TV-signal Distribution Systemby using NRD Guide Transmitter and Receiver at 60 GHzF. Kuroki, S. Shinke, M. Yamaguchi, Kure National College of Technology, Kure, Japan; E. Suematsu, H. Sato, Sharp Co.,Tenri, Japan; T. Yoneyama, Tohoku Institute of Technology,Sendai, Japan2:

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TH3E-5: A 1-watt, 38-GHz Monolithic Grid OscillatorB.C. Deckman, Agilent Technologies, Santa Rosa, CA; D. Rutledge, Caltech, Pasadena, CA; J. Rosenberg, Harvey MuddCollege, Claremont, USA, E. Sovero, Vitesse Semiconductor,Camarillo, USA, D. Deakin, Rockwell Science

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TH3D-4: Wideband Low-phase-noise High-power W-band SignalSourcesE.W. Bryerton, D.L. Thacker, K.S. Saini, R.F. Bradley, NationalRadio Astronomy Observatory, Charlottesville, USA

TH3D-5: 155 Mbit/s Data Transmission at 60 GHz using a 1×4Patch Array Antenna with Variable Optical Delay LinesG.H. Grosskopf, R. Eggemann, D. Rohde, M.S. Choi, HeinrichHertz Institut, Berlin, Germany

TH3E-6: A 94-GHz Overmoded-waveguide Oscillator with GunnDiodesJ. Bae, M. Fujita, K. Mizuno, Tohoku University, Sendai, Japan

TH3E-7: A Retrodirective Diode Grid Array using Four-waveMixing W. Ding, Agilent Technologies, Santa Rosa, CA; S.C. Lei, M.P. DeLisio, University of Hawaii, Honolulu, HI

TH3E-8: An Experimental and Theoretical Characterization of a Broadband Arbitrarily-polarized Rectenna ArrayJ. A. Hagerty, Z. Popovic, University of Colorado, Boulder, CO

TH3E-9: 5.8 GHz Circular Polarized Rectifying Antenna for Microwave Power TransmissionB.H. Strassner, K. Chang, Texas A&M University, CollegeStation, TX

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TH4A Packaging Interconnect Techniques

Chair: J. Laskar, Georgia Institute of TechnologyCo-chair: M. Harris, Georgia Institute of Technology

BALLROOM

TH4B Frequency Domain EM Techniques

Chair: R. Sorrentino, University of PerugiaCo-chair: J. Rautio, Sonnet Software Inc.

TUCSON 36–38

TH4C Low Noise Components and Techniques

Chair: P. Smith, BAE SystemsCo-chair: L. Boglione, Conexant Systems

TUCSON 42–43

TH4A-1: Broadband Time-domain Characterization of MultipleFlip-chip InterconnectsP. Li, K. Chin, New Jersey Institute of Technology, Newark, NJ;H. Wu, Bell Labs, Murray Hill, USA; T. Li, Cadence DesignSystems, New Providence, USA; W. Sui, Conexant Systems,Chelmsford, MA

TH4B-1: MoM/BI-RME Analysis of Boxed Microwave CircuitsBased on Arbitrarily Shaped ElementsM. Bozzi, L. Perregrini, G. Conciauro, Univ. of Pavia, Pavia,Italy; A. Alvarez Melcon, Tech Univ. of Carthagene, Carthagene,Spain; M. Guglielmi, European Space Res. and Tech. Cen., ESA-ESTEC, Noordwijk, The Netherlands

TH4C-1: A 183 GHz Low Noise Amplifier Module 7.1 dB NoiseFigure for the Conical-scanning Microwave Imager (CMIS)ProgramB. Osgood, M. Barsky, M. Sholley, R. Quon, G. Barber, P. Liu, P. Chin, R. Lai, M. Nishimoto, R. Raja, TRW, Redondo Beach,CA; F. Hinte, AIL Systems, Deer Park, USA

TH4A-2: Ka band Power pHEMT Technology for Space PowerFlip-chip AssemblyE. Rogeaux, S. George, Alcatel , Toulouse, France; D. Pons, P. Fellon, D. Geiger, United Monolithic, Ors, France; D. Theron,N. Haese, Institut d’Electronique, Cedex, France; S. Verdeyme,R. Quere, D. Baillargeat, R. Ngoya, Institute de Recherche,Cedex, France; S. Long, L. Escotte, Laboratoire, Cedex, France

TH4B-2: Fast Electromagnetic Analysis of Dense ShieldedIntegrated Circuits using the Adaptive Integral Method (AIM)V.I. Okhmatovski, A.C. Cangellaris, Univ. of Illinois at Urbana-Champaign, Urbana, IL

TH4C-2: Low Noise Amplifiers in InP Technology for PseudoCorrelating Millimeter Wave RadiometerP. Kangaslahti, N. Hughes, T. Cong, Ylinen Elect, Kauniainen,Finland; P. Kangaslahti, Helsinki Univ of Tech, Espoo, Finland; J. Tuovinen, T. Karttaavi, MilliLab, Espoo, Finland; T. Gaier, D. Dawson, S. Weinreb, Jet Prop. Lab, Pasadena, CA; P. Sjöman,Metsahovi Radio Ob., Kirkkonummi, Finland

TH4A-3: Design and Analysis of Low Cost IC Package Solutionfor 10 Gbit/s ApplicationsM.A. Megahed, P. Zilaro, M. Khaw, Conexant Systems Inc.,Newport Beach, VA

TH4B-3: Full Wave Analysis of Electromagnetic Coupling in Realistic RF Multilayer PCB Layouts using Cascaded ParallelPlate Waveguide ModelM.R. Abdul-Gaffoor, H.K. Smith, Motorola, Harvard, USA; A.A. Kishk, A.W. Glisson, University of Mississippi, University, MS

TH4C-3: Simple Model for Dynamic Range Estimate of GaAsTransistorsZ. M. Nosal, Warsaw University of Technology, Warsaw, Poland

TH4A-4: LTCC as MCM Substrate: Design of Strip-lineStructures and Flip-chip InterconnectsF.J. Schmückle, A. Jentzsch, W. Heinrich, Ferdinand-Braun-Institut (FBH), Berlin, Germany; J. Butz, M. Spinnler, Bosch SatCom GmbH, Backnang, Germany

TH4A-5: Vertical Transitions in Low Temperature Co-firedCeramics for LMDS ApplicationsA. Panther, J.S. Wight, Carleton University, Ottawa, Canada; C. Glaser, M.G. Stubbs, Communications Research Centre,Ottawa, Canada

TH4A-6: Characterization of High-density MicromachinedInterconnectsJ.L. Haley, University of Illinois, Urbana, IL; R.F. Drayton,University of Minnesota, Minneapolis, MN

TH4A-7: Design and Optimization for Coaxial-to-microstripTransition on Multilayer SubstrateH. Liang, J. Laskar, Georgia Institute of Technology, Atlanta,GA; H. Barnes, D. Estreic, Agilent Technologies, Santa Rosa, CA

TH4B-4: A New Global-analysis Model for Microwave Circuitswith Lumped ElementsC. Wang, H. Wang, C. Chen, National Taiwan University, Taipei,ROC

TH4B-5: Analysis of Multi-layer Integrated Inductors with WaveConcept Iterative Procedure(WCIP)S. Akatimogool, D. bajon, ENSAE(SUPAERO), Toulouse,France; H. Baudrand, INP(ENSEEIHT), Toulouse, France

TH4B-6: Numerical Cost of Gradient Computation within the Method of Moments and its Reduction using a NovelBoundary-layer ConceptS. Amari, Royal Military College of Canada, Kingston, Canada

TH4C-4: Modeling of Low-frequency Noise in GaInP/GaAsHetero-bipolar TransistorsP. Heymann, M. Rudolph, R. Doerner, F. Lenk, Ferdinand-Braun-Institut (FBH), Berlin, Germany

TH4C-5: Microwave Noise and Small-signal Parameters Scalingof InP/InGaAs DHBT with High DC Current GainY. Xiong, G. Ng, H. Wang, C. Law, R.K., Nanyang Tech. Univ.,Singapore, Singapore

TH4A-8: Temperature Compensated Planar Narrow-band NotchFilter with Fully Automated Laser-trimmingM. Schallner, Marconi Communications GmbH, Backnang,Germany

TH4B-7: Automated Intelligent Mode Selection for Fast ModeMatching Analysis of Waveguide DiscontinuitiesC.A. Vale, P. Meyer, Stellenbosch University, Stellenbosch,South Africa

50

THURSDAY, MAY 24, 2001 IEEE MTT-S IMS TECHNICAL SESSIONS 3:30–5:10 PM

9:40

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TH4D Microwave Applications of Superconductivity

Chair: C. Jackson, TIA MobileCo-chair: M. Nisenoff, M. Nisenoff Associates

TUCSON 42–43

TH4D-1: An All-cryogenic Low Phase Noise Hybrid K-bandOscillator for Satellite CommunicationS. Vitusevich, I.S. Ghosh, N. Klein, Forschungszentrum JuelichGmbH, Juelich, Germany; K. Schieber, M. Spinnler, BoschSatCom GmbH, Backnang, Germany

3:30

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3:40

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TH4D-2: Dual 5 MHz PCS Receiver Front EndE.R. Soares, K.F. Raihn, J.D. Fuller, SuperconductorTechnologies Inc., Santa Barbara, CA

3:50

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4:00

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TH4D-3: Compact Quasi-lumped Element HTS Microstrip FiltersH.T. Su, F. Huang, M.J. Lancaster, The University of Birmingham, Birmingham, UK

4:10

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4:20

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4:30

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4:40

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TH4D-4: Optoelectronic RF Harmonic Generation and Mixing in High-Tc Superconducting FilmA.H. Majedi, S.K. Chaudhuri, R. Mansour, S. Safavi-Naeini,University of Waterloo, Waterloo, Canada

TH4D-5: Novel Method for Calculation and Measurement ofUnloaded Q-factor of Superconducting Dielectric ResonatorsM.V. Jacob, J. Mazierska, K. Leong, James Cook University,Townsville, Australia; J. Krupka, Politechniki Warszawskiej,Koszykowa 75, Poland

THIF-1: Generalized Multi-gridding Technique for the TLM Method using the SymmetricalSuper-condensed Node (SSCN)G.N. Mulay, Maharashtra Institute of Technology, Pune, India; D.S. Jog, Government Collegeof Engineering, Pune, India

THIF-2: A Novel Adaptive Approach to Modeling MEMS Tunable Capacitors using MRTD and FDTD TechniquesN.A. Bushyager, M.M. Tentzeris, Georgia Institute of Technology, Atlanta, GA; L.J. Gatewood,Rockwell Collins, Cedar Rapids, IA; J.F. DeNatale, Rockwell Science Center, Thousand Oaks,CA

THIF-3: A Multi-threaded Time Domain TLM Algorithm for Symmetric Multi-processingComputersP.P. So, W.J. Hoefer, University of Victoria, Victoria, Canada

THIF-4: Construction of Solutions to Electromagnetic Problems in Terms of Two Co-linearVector PotentialsN. Georgieva, McMaster University, Hamilton, Canada

THIF-5: Analysis of Lumped Element Transistor Structures using MRTD: The EquivalentSource MethodR.L. Robertson, L.P. Katehi, University of Michigan, Ann Arbor, MI

THIF-6: Efficient Time-domain Electromagnetic Analysis using CDF Biorthogonal WaveletExpansionT. Dogaru, L. Carin, Duke University, Durham, USA

THIF-7: A Wavelet-based FDTD-multigrid-methodM. Walter, P. Waldow, I. Wolff, Universitaet Duisburg, Duisburg, Germany

THIF-8: Analysis and Design of a Planar Antenna for a Millimetre-wave Emitter using TLMK.P. Heppenheimer, L. Vietzorreck, P. Russer, TU Muenchen, Muenchen, Germany

THIF-9: Analysis of Differential Vias in a Multilayer Parallel Plate Environment using a Physics-based CAD ModelR. Abhari, G.V. Eleftheriades, E. van Deventer-Perkins, University of Toronto, Toronto,Canada

THIF-10: 3D-FDTD Subgridding Technique Applied to Radiating StructuresM. Bonilla, G. Alquie, V. Fouad Hanna, Universite Pierre et Marie Curie, Paris, France; M. Wong, J. Wiart, France Telecom R&D, Issy les Moulineaux, France

THIF-11: Enhanced Forward Coupling Phenomena between Microstrip Lines on PeriodicallyPatterned Ground PlaneC. Chang, Y. Qian, T. Itoh, University of California Los Angeles, Los Angeles, CA

THIF-12: Coupled TLM-thermal Analysis in the Time DomainW. Liu, P.P. So, W.J. Hoefer, University of Victoria, Victoria, Canada

THIF-13: Lumped and Distributed Device Embedding Techniques in Time Domain TLM FieldModelsJ. Park, P.P. So, W.J. Hoefer, Department of Electrical and Computer Engineering,Universityof Victoria, Victoria, Canada

THIF-14: Analysis of Multiport Waveguide Structures by a Higher-order FDTD MethodologyBased on Non-orthogonal Curvilinear GridsN.V. Kantartzis, T.I. Kosmanis, T.D. Tsiboukis, Aristotle University of Thessaloniki,Thessaloniki, Greece; M. Gatzianas, Arizona State University, Tempe, AZ

THIF-15: FDTD Study of Resonance Processes in Microstrip Ring Resonators with DifferentExcitation GeometriesE. Semouchkina, W. Cao, Penn State Univ., University Park, PA; R. Mittra, Penn State Univ.,University Park, PA

THIF-16: An Unconditionally Stable Finite Element Time Domain Solution of ActiveNonlinear Microwave Circuits using Perfectly Matched LayersH. Tsai, Y. Wang, T. Itoh, University of California, Los Angeles, Los Angeles, CA

THIF-17: Optimal Shape Design of Dielectric Structure using FDTD and TopologyOptimizationY. Chung, C. Cheon, University of Seoul, Seoul, Korea

THURSDAY, MAY 24, 2001

INTERACTIVE FORUM • 2:30–5:00 PM


52

THIF-18: Electronic Design Assistance Tool for Circuit Optimization. Application to Microwave Power Amplifiers.C. Duperrier, M. Campovecchio, J. Rousset, R. Quere, University of Limoges, Faculty of Sciences, Limoges, France; S. Mons, A. Mallet, L. Lapierre, CNES, Toulouse, France

THIF-19: Nonlinear Statistical Modeling of Large-signal Device BehaviorW. Stiebler, F. Rose, J. Selin, Raytheon Commercial Electronics, Andover, USA

THIF-20: A Computer Aided Design Technique for Hybrid and Monolithic MicrowaveAmplifiers Employing Distributed Equalizers with Lumped DiscontinuitiesA. Aksen, B. Yarman, ISIK University, Istanbul, Turkey

THIF-21: Statistical Construction of a Representative CAD Model from a Measured Populationfor RF Design ApplicationsW. Leiker, K. Naishadham, Philips Broadband Networks Inc., Manlius, 13104

THIF-22: SMX - A Novel Object-oriented Optimization SystemM.H. Bakr, University of Victoria, Victoria, Canada; J.W. Bandler, Bandler Corp., Dundas,Canada; Q.S. Cheng, M.A. Ismail, J.E. Rayas-Sanchez, McMaster University, Hamilton,Canada

THIF-23: A Robust Algorithm for Automatic Development of Neural Network Models for Microwave ApplicationsV.K. Devabhaktuni, M.C. Yagoub, Q. Zhang, Carleton University, Ottawa, Canada

THIF-24: Steady-state Determination for RF Circuits using Krylov-subspace Methods in SPICEM.A. Kleiner, M.N. Afsar, Tufts University, Medford, MA

THIF-25: Interactive “Visual” Design of Matching and Compensation Networks for MicrowaveActive CircuitsL.I. Babak, M.V. Cherkashin, Tomsk State University of Control Systems and Radioelectronics, Tomsk, Russia

THIF-26: Efficient Sensitivity Analysis of Lossy Multiconductor Transmission Lines with Nonlinear TerminationsA. Dounavis, R. Achar, M. S. Nakhla, Carleton University, Ottawa, Canada

THIF-27: Software Tool for the Design of Narrow Band Band-pass FiltersA. García-Lampérez, M. Salazar-Palma, ETSI Telecomunicación, Univ. Politécnica de Madrid,Madrid, Spain; M. Padilla, I. Hidalgo-Carpintero, Alcatel Espacio, Tres Cantos, Spain

THIF-28: Optimization of Waveguide Diplexers using Shadow SpecificationsD.A. Cargill, University of Saskatchewan, Saskatoon, Canada; T. Dolan, P. Pramanick, K&L Microwave Inc., Salisbury, USA

THIF-29: Micromachined RF MEMS Tunable Capacitors using Piezoelectric ActuatorsJ.Y. Park, Y.J. Yee, J.U. Bu, LG Electronics Institute of Technology, Seoul, Korea

THIF-30: Digitally Controllable Variable High-Q MEMS Capacitor for RF ApplicationsN.D. Hoivik, Y.C. Lee, K.C. Gupta, V.M. Bright, University of Colorado at Boulder, Boulder, CO

THIF-31: Nonlinear Electro-mechanical Modeling of MEMS SwitchesJ.B. Muldavin, G.M. Rebeiz, University of Michigan, Ann Arbor, MI

THIF-33: An Electromechanical Model for MEMS SwitchesD. Mercier, P. Blondy, D. Cros, P. Guillon, IRCOM, Limoges France

THIF-34: Digital Generation of RF Signals for Wireless Communications with Band-passDelta-Sigma ModulationJ.S. Keyzer, J.M. Hinrichs, A.G. Metzger, M. Iwamoto, I. Galton, P.M. Asbeck, University of California, San Diego, La Jolla, CA

THIF-35: A CMOS 6-bit, 1 GHz ADC for IF Sampling ApplicationsK. Uyttenhove, M. Steyaert, K.U. Leuven, Heverlee, Belgium

THIF-36: A Silicon-on-insulator 28-V RF Power LDMOSFET for 1-GHz Integrated PowerAmplifier ApplicationsE.A. McShane, K. Shenai, University of Illinois at Chicago, Chicago, IL; S. Leong, PolyFET RFDevices Inc., Camarillo, CA

THIF-37: Receiving Weak Signals with a Software GPS ReceiverD.M. Lin, J.B. Tsui, Air Force Research Laboratories, Sensors Directorate, WPAFB, USA

THIF-38: Simple Design Equations for Broadband Class E Power Amplifiers with ReactanceCompensationA. Grebennikov, M/A-COM, Cork, Ireland

THIF-39: Multi-harmonic Tuning Behavior of MOSFET RF Power AmplifiersY. Zhang, C. Salama, University of Toronto, Toronto, Canada

THIF-40: Study of Self-heating Effects in GaN HEMTsS. Nuttinck, E. Gebara, J. Laskar, Georgia Institute of Technology, Atlanta, GA; M. Harris,Georgia Tech Research Institute, Atlanta, GA

THIF-41: InGaP PHEMTs for Wireless Power ApplicationsE.Y. Lan, B. Pitts, O. Hartin, Semiconductor Product Sector, Motorola Inc., Tempe, AZ; M. Mikhov, Semiconductor Product Sector, Motorola Inc., Tempe, AZ

THIF-42: Novel Asymmetric Gate-recess Fabrication Technique for Sub-millimeter-wave InP-based HEMTsK. Shinohara, T. Matsui, Communications Research Laboratory, Koganei, Japan; T. Mimura,Fujitsu Laboratories Ltd., Atsugi, Japan; S. Hiyamizu, Osaka University, Toyonaka, Japan

THIF-43: A Calibrated RF/IF Monolithic Vector AnalyzerJ.C. Cowles, B. Gilbert, Analog Devices - Northwest Labs, Beaverton, OR

THIF-44: Design Techniques of Reducing Chip Area and Highly Integrated MMIC for W-bandApplicationY. Mimino, K. Nakamura, K. Sakamoto, Y. Aoki, S. Kuroda, T. Tokumitsu, Fujitsu QuantumDevices Limited, Hachiohji-shi, Japan

THURSDAY, MAY 24, 2001 • INTERACTIVE FORUM (cont) • 2:30–5:00 PM

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THIF-45: A Novel Accurate Design Method for the Hairpin Type Coupled Line Bandpass FiltersJ.S. Yun, J.S. Park, D. Ahn, K.S. Choi, Soonchunhyang Univ., Asan, ROK; J. Kim, BetheltronixInc., Cerritos, USA

THIF-46: Hairpin Filters with Tunable Transmission ZerosC. Tsai, S. Lee, C. Tsai, National Cheng Kung University, Tainan, Taiwan

THIF-47: Adjustment of a Temperature Compensated Ka-band Ring Resonator VCO using Fully Automated Laser-trimmingM. Schallner, W. Konrath, Marconi Communications GmbH, Backnang, Germany

THIF-48: Monolithic Quantum Tunnel Diode-based C-band Oscillator and LNAJ.I. Bergman, S. Han, J. Laskar, Georgia Institute of Technology, Atlanta, GA; N. El-Zein, S. Ageno, M. Deshpande, V. Nair, Motorola Inc., Tempe, AZ

THIF-49: Calibrated Linear and Nonlinear Pulsed RF Measurements on an AmplifierP. Vael, Y. Rolain, Vrije Universiteit Brussel, Brussel, Belgium; C. Gaquiere, H. Gerard, IEMN,Villeneuve d’Ascq Cedex, France

THIF-50: Measurement of Group Velocities of Various Microwave Transmission Lines via FMReflectometryY. Park, J. Lee, H. Tae, Hongik Univ., Seoul, Korea

THIF-51: Millimeter Wave Measurements of Temperature Dependence of ComplexPermittivity of GaAs Plates by a Circular Waveguide MethodT. Shimizu, Y. Kobayashi, Saitama University, Urawa, Japan

THIF-52: Infrared Temperature Characterization of High Power RF DevicesM. Mahalingam, E.C. Mares, Motorola, Tempe, AZ

THIF-53: Near-field Microwave Microscopy of Thin Film ResonatorsJ. Herbsommer, H. Safar, P.L. Gammel, B.P. Barber, M. Zierdt, Lucent Technologies, Murray Hill, USA

THIF-54: 28 GHz LMDS Channel Measurements and Modeling for Parameterized UrbanEnvironmentsC. Briso, UPM, Madrid, Spain; M. Vazquez, Universidad Carlos III, Leganes, Spain; J.I. Alonso,UPM, Madrid, Spain

THIF-55: C/Ku-band Pulsed Transmitters for Poseidon 2 AltimeterA. Darbandi, G. Michaud, H. Buret, J. Touchais, J. Fourcroy, J. Bulgarelli, Alcatel Space,Toulouse, France

THIF-56: The RF Module Design for W-CDMA/GSM Dual Band and Dual Mode HandsetX.W. Zhu, W. Hong, J.Y. Zhou, L. Tian, Southeast University, Nanjing, P.R. China

THIF-57: Bias Control Technique for CDMA Driver Amplifier to Decrease CurrentJ. Ko, H. Kim, S. Yang, B. Kim, B. Park, Samsung Electronics Co, Suwon, Korea

THIF-58: Multi-carrier Microwave Breakdown in Air-filled ComponentsU. Jordan, D. Anderson, M. Lisak, Chalmers Univ. of Tech., Göteborg, Sweden; T. Olsson,Allgon Systems AB, Täby, Sweden; V.E. Semenov, Inst. of Applied Physics, Russian Academyof Sciences, Nizhny Novgorod, Russia

THIF-59: Analysis of Proposals to Reduce SAR Levels from GSM TerminalsV. Ferrer Perez, Ericsson Spain, Madrid, Spain; L. Nuño Fernandez, J. Balbastre Tejedor,Technical University of Valencia, Valencia, Spain

THIF-60: High-accuracy Digital 5-bit 0.8-2 GHz MMIC RF Attenuator for Cellular PhonesN. Kinayman, M. Bonilla, M. Kelcourse, J. Redus, K. Anderson, M/A-COM, Lowell, MA

THIF-61: Micromachined 60 GHz GaAs Power Sensor with Integrated Receiving AntennaK. Mutamba, A. Megej, E. Genc, A. Fleckenstein, H. L. Hartnagel, Darmstadt Univ. of Tech.,Darmstadt, Germany; K. Beilenhoff, United Monolithic Semiconductors, Orsay, France; R. Doerner, P. Heyman, Ferdinand-Braun-Institut, Berlin, Germany; J. Dickmann, C. Woelk,DaimlerChrysler, Ulm, Germany

THIF-62: A Sensor System Based on SiGe MMICs for 24 GHz Automotive ApplicationsC.N. Rheinfelder, S.M. Lindenmeier, J.F. Luy, DaimlerChrysler Res and Tech, Ulm, Germany;C. Willner, DaimlerChrysler Corp., Rochester Hills, USA; A. Schüppen, TemicSemiconductors, Heilbronn, Germany

THIF-63: Acoustic Sensing using Radio Frequency Detection and Capacitive MicromachinedUltrasonic TransducersS.T. Hansen, A.S. Ergun, B.T. Khuri-Yakub, Edward L. Ginzton Laboratory, Stanford, USA

THIF-64: Millimeter-wave Printed Circuit Antenna System for Automotive ApplicationsV.V. Denisenko, A.G. Shubov, A.V. Majorov, Joint-Stock Co. Radiophyzika, Moscow, Russia;E.N. Egorov, Res. Technological Cen. REIS, Moscow, Russia; N.K. Kashaev, Res. Inst. of Microdevices, Moscow, Russia

THIF-65: Spectrum Correlation of Beat Signals in the FM-CW Radar Level Meter and Application for Precise Distance MeasurementJ.C. Chun, T.S. Kim, Uiduk University, Kyung-Ju, ROK; J.M. Kim, Z.S. Lim, RIST, Pohang,ROK; W.S. Park, POSTECH, Pohang, ROK

THIF-66: K-band Direct Detect MMIC SI Micromachined RadiometerM. Smith, J. Culver, B.S. Roeder, Raytheon, St. Petersburg, FL; T. Weller, C. Trent, J. Naylor,University of South Florida, Tampa, FL

THIF-67: A Rugged Active Sensor for Microwave AquametryG. Avitabile, N. Sottani, Politecnico di Bari, Bari, Italy; G. Biffi Gentili, University of Florence,Florence, Italy

53

PTHA: COMMERCIAL EXPLOITATION OF 92–96 GHZ SPECTRUM

Date & Time: Thursday, May 24; 12:00–1:15 PM


Organizer: Michael Marcus, FCC

Moderator: Michael Marcus, FCC

Panelists: John Reddick, Raytheon Commercial Electronics

Al Lawrence, TRW Space Electronics GroupShey Hakasui, Harmonix Corp.Donnie Burt, e-xpedient/CAVU Inc.Douglas Lockie, Endgate Corp.Randall Olsen, Trex Enterprises Corp.Jonathan Wells, DMC Wave

The FCC is planning an initiative to remove existing regulatorybarriers to commercial use at 92–95 GHz, an area where MIMIC-developed device technology exists. Panelists will discuss whatcommercial applications are possible, and what the regulatoryframework should be. This will be a rare opportunity to partici-pate in the creation of a new commercial band for microwavetechnology.

TH1F: AL GROSS MEMORIAL SPECIAL SESSION

Room: Yuma 21–23

Time: 8:00–10:00 AM

Session Chair: Vijay Nair, Motorola Labs, Motorola Inc.

Description:

Al Gross is considered the “founding father” of wireless com-munications. In 1938, while only in his teens, he invented a hand-held mobile radio operating above 200 MHz, an unexplored partof the radio frequency spectrum at that time. Other ham radio op-erators, commenting on Al Gross’ habit of walking and talking atthe same time, inspired the name of his invention: “WalkieTalkie.”

The US Department of Defense recruited Al Gross to the Officeof Strategic Services (OSS) in late 1930. He helped develop aground-to-air battery operated radio that could transmit up to 30miles. With the outbreak of World War II Al helped design thehighly secretive, “Joan-Eleanor,” the ultra-high frequency minia-ture two-way radio system. This “Joan-Eleanor” was consideredone of the most spectacular radio developments during thewartime. After the war Al Gross started his own company to de-velop the hand held radio technology. He created a citizen’sband radio. He also invented a prototype pager in 1949. One ofhis inventions, the two-way wrist watch radio, was immortalizedin Chester Gould’s famous cartoon strip, Dick Tracy

In this session speakers will discuss several of Al Gross’ inven-tions and the impact of these inventions in today’s wireless com-munication system.

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THURSDAY PANEL SESSION THURSDAY SPECIAL SESSIONS

54

WFA: INDUSTRIAL APPLICATIONSOF ELECTROMAGNETIC (EM) SOLVERS

Date & Time: Friday, May 25; 8:00 AM to 12:00 PM


Topics & Speakers:

✗ Applications of Commercial Time Domain ElectromagneticSolvers, Eric Holzman, Telaxis Communications

✗ Industrial Applications of Electromagnetic SolversSteven Gellar, AIL SystemsJoseph Levy, LayerOne Wireless

✗ Successful Applications of Electromagnetic SimulationMasayuki Nakajima, Motorola Japan Research Lab

Prof. Shigeo Kawasaki, Tokai University, Japan✗ Electromagnetic Solvers Applied to Millimeter Wave

Transceivers, Edward Niehenke, Niehenke Consulting✗ (EM Field-Solvers: Issues and Applications

Daniel Swanson, Bartley R.F. Systems

Organizers: Barry E. Spielman, Washington UniversityWolfgang Hoerfer, University of Victoria


MTT-15, Microwave Field Theory


This workshop will explore the extent to which electromagnet-ic (EM) solvers are being successfully used in industrial applica-tions. The workshop will attempt to identify the successful uses,the practical ramifications of solver limitations, and identify thoseareas where solver developers need to focus their future work.Accordingly, the workshop will have a three-fold focus as follows:

1. To learn about the successful applications of EM solvers toproblems faced by the industrial community. It is anticipatedthat frequency-domain solvers are more mature and are find-ing their way into use. We want to learn about these success-es. However it will also be of considerable interest to learnwhether industry has made progress in applying time-domainsolvers. It will be of interest to learn whether EM solvers arebeing used to study EM interactions of circuit features that aresupposed to be isolated within packages

2. To learn about how the time- (and possibly storage-) intensivenature of these computations is limiting the application of EMsolvers in the industrial setting. It will be of interest to learnhow this affects the types of problems for which industrialusers find them valuable. It will be of interest to learn whetherindustry is making use of the ability of time-domain EM solversto address nonlinear behavior in components.

3. To learn about those aspects of EM solvers that industrial userswould like to see improved. Are solvers as user-friendly asthey need to be? To what extent can a traditional RF or mi-crowave design engineer make use of these solvers withoutdedicating their career to becoming the guru on this subjectwithin their company? What kind of advancements need tobe made in the state of commercially available EM solvers?For which computing platforms and operating systems is it de-sired to have EM solvers available?

WFB: RF PASSIVE COMPONENT EVALUATION TECHNIQUES

Date & Time: Friday, May 25; 8:00 AM to 12:00 PM


Topics & Speakers:

✗ RF Passive Component Evaluation TechniquesGreg Amorese, Agilent Technologies

✗ Demonstration of Modeling and Compensation ProcessesShegeki Tanaka, Agilent Technologies

Organizer: Greg Amorese, Agilent TechnologiesPat Tiedeman, Agilent Technologies

Sponsors: MTT-11, Microwave MeasurementsMTT-20, Wireless Communications


Today’s wireless electronic equipment is continuing to placemore stringent requirements on RF components. The advent ofnew technology RF components is giving circuit designers theability to meet their requirements if they can verify how thosecomponents actually will work in their designs.

This workshop will cover impedance measurements includingdefinitions, measurement technique selection, compensationand error-correction, and fixturing. The impedance portion willclose with a discussion and measurement examples of RF induc-tors and capacitors. The workshop will also review basic 2-portdevice evaluation with an emphasis on RF filters.

FRIDAY WORKSHOPS

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AUTOMATIC RF TECHNIQUES GROUP

We welcome you to our 57th Conference being held at the Crowne Plaza Hotel onFriday, May 25. The main conference theme “Best Practices and Strategies for RF Test”will focus on alternatives, tradeoffs, practical considerations and particular examplesof industrial microwave test and measurement methods. Technical considerations(e.g., accuracy, equipment selection, test methodology) and non-technical issues (e.g.,cost of test, cost of equipment, speed of test) will be discussed in detail by the invitedpresentations. In addition, papers concerning traditional ARFTG interests such asmetrology, S-parameter, noise figure and non-linear measurements will be presented.

The invited presentations include Stavros Iezekiel of the University of Leeds dis-cussing lightwave S-parameter measurement techniques, John Mahon of M/A-COM onpractical test considerations in a production microwave component manufacturing en-vironment, and Eric Strid of Cascade Microtech on high-throughput microwaveprobing.

You may register for this conference using the IMS Conference Registration or on Fri-day, May 25 at the ARFTG registration site. The ARFTG registration fee includes a con-ference digest, continental breakfast, luncheon and one-year ARFTG membership.

LOCATION

The 57th ARFTG Conference will be held in the Grand Ballroom of the CrownPlaza Hotel, 101 North 1st Street, Phoenix, AZ 85004, (602)-333-0000. This hotel islocated two blocks from the Phoenix Civic Plaza. You may reserve your room us-ing the IMS Conference Housing Form. Visit www.arftg.org for more information.

SCHEDULE

Friday, May 25 Activity Crowne Plaza Hotel

7:00 AM – 4:00 PM Registration Grand Ballroom Foyer7:00 AM – 4:00 PM Exhibition Grand Ballroom South7:00 AM – 8:00 AM Continental Breakfast Grand Ballroom South7:00 AM – 8:00 AM Speaker’s Breakfast Hopi Room B

8:00 AM – 10:00 AM Technical Session 1 Grand Ballroom North10:00 AM – 11:00 AM Exhibition/Poster Session Grand Ballroom South

11:00 AM – 12:00 NOON Technical Session 2 Grand Ballroom North12:00 NOON – 1:30 PM Luncheon Pueblo Room

1:30 PM – 3:00 PM Technical Session 3 Grand Ballroom North3:00 PM – 4:00 PM Exhibition/Poster Session Grand Ballroom South4:00 PM – 5:00 PM Technical Session 4 Grand Ballroom North

EXHIBITS

The 57th ARFTG Conference also offers an outstanding exhibition opportunity.Please contact our Exhibits Chair directly for further information.

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ARFTG 57th MICROWAVE MEASUREMENTS CONFERENCE

BEST PRACTICE AND STRATEGIES FOR RF TEST

CONFERENCE STEERING COMMITTEE

Conference ChairCharles WilkerDuPontT (302) 999-3075 F (302) 999-2928charles.wilker!usa.dupont.com

Technical Program ChairJohn BarrAgilent TechnologiesT (707) 577-2350 F (707) [email protected]

David WalkerNISTT (303) 601-1580 F (503) [email protected]

Exhibits ChairLeonard HaydenCascade Microtech Inc.T (503) 601-1508 F (503) [email protected]

ARFTG EXECUTIVE COMMITTEE

Robert M. Judish, PresidentNIST

Charles Wilker, Vice-PresidentDuPont Superconductivity

Dr. Edward M. Godshalk, SecretaryMaxim Integrated Products

Ken Wong, TreasurerAgilent Technologies

Leonard Hayden, ExhibitsCascade Microtech

Raymond W. Tucker, MembershipAir Force Research Lab

J. Gregory Burns, PublicationsNorthrop Grumman

John Cable, StandardsHoneywell FM&T

Dr. Dylan Williams, Technical CoordinatorNIST

Brian Pugh, E-communicationSiliconWave

Kate Remley, PublicityNIST

David Walker, EducationNIST

EX-OFFICIO MEMBERS

Dr. Roger Pollard, ARMMS LiaisonUniversity of Leeds

Dr. Roger Marks, MTT-S LiaisonNIST

Jim L. Taylor, Executive Secretary

56

MESSAGE FROM THE 2001 µAPS CHAIRMAN

A New Family of Si LDMOS Power Devices for 3G Communications ApplicationsE. James Crescenzi, Jr., UltraRF Company 1:00–1:20 PM

High Voltage Silicon Device Structures Increase Peak Power CapabilityBob Davidson, Motorola Inc. 1:20–1:40 PM

Application of Digital Predistortion to RF LDMOS Power Amplifiers for Narrow-band CDMA SystemsDavid Runton, Chris Thron and Emmanuel Roy, Motorola Inc. 1:40–2:00 PM

Characterization of 125 Watt Single-ended Power Discrete LDMOS Device for W-CDMA Base Station Amplifier ApplicationAntoine Rabany, Long Nguyen and John Kinney, Motorola Inc. 2:00–2:20 PM

LDMOS vs. VDMOS — How to ChooseS.K. Leong, Polyfet RF Devices 2:20–2:40 PM

Commercial MMIC Solutions for Broadband Wireless Access and Optoelectronic ApplicationsG.D. Edwards, R.J. Cleaver, A.S. Cornelius, M.W. Green, Marconi Caswell 2:40–3:00 PMSilicon Carbide (SiC) MESFET Power Transistors — Ideal for 3G SystemsTom Dekker, Cree 3:00–3:20 PM

Plastic, A New Packaging Option for High Power RF DevicesDarin Wagner, Alex Elliot, Antoine Rabany, Long Nguyen, Motorola Inc. 3:20–3:40 PM

RF Components for Multi-band Mobile PhonesShigeru Kemmochi, Hitachi Metals, Ltd. 3:40–4:00 PM

MHPA19120 — LDMOS Power Amplifier for 1.9 GHz CDMA ApplicationsJeffrey Jones, Motorola Inc. 4:00–4:20 PM

CATV Power Amplifiers — Improved Performance with GaAs PHEMTScott Craft, Motorola Inc. 4:20–4:40 PM

High Power Pulse Amplifiers Using LDMOSDouglas M. Macheel, Lee B. Max, Staff Consultant, Zeta 4:40–5:00 PM

Microwave Application & Product Seminars

µAPS are technical,product-oriented seminars presented on the trade show floor adjacent to the exhibition booths.

The µAPS are in their sixth year serving as a forum for ex-hibitors. The µAPS provide technical information related to com-mercially available state-of-the-art products of interest to the mi-crowave community. The products seminars will cover CADtools, simulation tools and techniques, active and passive com-ponents and system applications. Individual presentations will be20 minutes long including questions and answers. Provisions aremade for presenters to display and share product literature relat-ed to their presentations. The µAPS are open to all technical con-ference and exhibit attendees. The seminars will be held on theexhibit floor in the Phoenix Civic Plaza on Tuesday, Wednesdayand Thursday, May 22–24, in conjunction with IMS 2001.

Mali MahalingamµAPS Chair

2001 µAPS SCHEDULE

The 2001 Microwave Application & Product Seminars willbe held on Tuesday, Wednesday and Thursday, May 22–23,2001 in conjunction with the 2001 International MicrowaveSymposium at the Phoenix Civic Plaza. The series of individ-ual presentations is open to any exhibition or conference at-tendee.

Tuesday, May 22, 2001 1:00–5:00 PM

Wednesday, May 23, 2001 9:30 AM–4L20 PM

Thursday, May 24, 2001 9:00 AM–2:00 PM

µAPS

µAPS — MICROWAVE APPLICATION & PRODUCT SEMINARS — TECHNICAL PROGRAM

TUESDAY, May 22, 2001 — EXHIBITION FLOOR, PHOENIX CIVIC PLAZA

Session 11:00–5:00 PM

Devices, PAs

57

QuickWave Electromagnetic SoftwareMalgorzata Celuch, QWED 9:00–9:20 AM

IE3D 8.0 — Memory and Time Efficient Electromagnetic Simulator for Open and Boxed StructuresJian-X. Zheng, Seland Software Inc. 9:20–9:40 AM

MDSPICE 2.0 — A Robust S-0 parameter SPICE Simulator Meets the Causality ConditionJian-X. Zheng, Seland Software Inc. 9:40–10:10 AM

MEFiSTo-3D Pro — A Multipurpose Electromagnetic Field Simulation Tool with Powerful Global Modeling FeaturesWolfgang J.R. Hoefer, Poman P.M. So, Faustus Scientific Corp. 10:00–10:20 AM

EMPIRE — 3D EM Field Solver — New Speed-up Techniques for FDTD AlgorithmAndreas Wien, Andreas Lauer, IMST GmbH 10:20–10:40 AM

Coplanar Circuit Design with COPLAN for ADSAnreas Bettray, Rudiger Follmann, IMST GmbH 10:40–11:00 AM

Efficient Modeling of Helix Antennas Using Micro-stripesDavid Johns, R. Aitmehdi, Flomerics 11:00–11:20 AM

emPiCASSO™: An Advanced Design Tool for Multilayer Printed Microwave Circuits and AntennasK.F. Sabet, EMAG Technologies Inc. 11:20–11:40 AM

TOPAS — A Non-linear FET Model and the Extraction SoftwareRudiger Follmann, IMST GmbH 1:00–1:20 PM

High Power LDMOS Performance Prediction Using a Nonlinear ModelPascal Gola, Jean-Christophe Nanan, Motorola Inc. 1:20–1:40 PM

Developing Neural Models for Linear-Nonlinear Microwave DesignQ.J. Zhang, Carleton University 1:40–2:00 PM

CONCERTO — 3D Microwave and RF Design SoftwareCris Emson, Jonathan Oakley, David Carpenter, Vector Fields Ltd. 2:00–2:20 PM

Active Load Pull System for the Characterization of Power DevicesAndrea Ferrero, Gary Simpson, Surinder Bali, Maury Microwave Corp. 2:20–2:40 PM

Automated Tuner System (ATS) for Fundamental and Independent Harmonic Load Pull Measurements for Device ModelingGary Simpson, Surinder Bali, Maury Microwave Corp. 2:40–3:00 PM

Techniques for Accurate Measurement of Error Vector MagnitudeKurt Matis, Applied Wave Research Corp. 3:00–3:20 PM

DSP Techniques Perform Accurate Analyses of Hardware DistortionJoel Kirshman, Applied Wave Research Corp. 3:20–3:40 PM

Mode Stirrer Method Measurement of Shield Effectiveness for Microwave Coaxial CableWayne Love, Storm Products 3:40–4:00 PM

Measurement of the Dielectric Constant of a Glass BeadBruce Bullard, Kaman Instrumentation 4:00–4:20 PM

WEDNESDAY, May 23, 2001 — EXHIBITION FLOOR, PHOENIX CIVIC PLAZA

THURSDAY, May 24, 2001 — EXHIBITION FLOOR, PHOENIX CIVIC PLAZA

Enhanced Thermal Performance Cu/W Flanges for Next Generation Power PackagingBrian Simmons, Juan L. Sepulveds, Zentrix Technologies Inc. 9:00–9:20 AM

Low Loss Green Tape™ for Wireless, Microwave and Fiber Optic ApplicationsD.I. Amey, S.J. Horowitz, R.R. Draudt, P.C. Donohue, M.A. Smith, DuPont Microcircuit 9:20–9:40 AM

Fast Response Detector for Wide-band Input NoiseYoav Koral, ELISRA Ltd. 9:40–10:10 AM

Phase Invariant AttenuatorsGeorge Apsley, GT Microwave Inc. 10:00–10:20 AM

Power Splitter with Excellent Amplitude and Phase Accuracy over a Wide Temperature RangeD. Kother, G. Pautz, G. Mollenbeck, P. Uhlig, U. Gollor, W. Poppelreuter, IMST GmbH 10:20–10:40 AM

Modularity and Miniaturization — The New MMBX ConnectorJack Nee, Huber+Suhner Inc. 10:40–11:00 AM

The Design of Three Ports OMT Network with Dual Polarization ReceivingM.H. Chen, R.C. Hsieh, Victory Industrial Corp. 11:00–11:20 AM

Roll-Rings: A High Performance Alternative to Slip RingsPeter E. Jacobson, Roltran Inc. 11:20–11:40 AM

High Linearity Direct Launch RF Quadrature Modulator in SOS CMOSDan Nobbe, Peregrine Semiconductor 1:00–1:20 PM

Latching RF MEMs Microrelay Based on 5 V Thermal ActuationVivek Agrawal, JDS Uniphase Co. 1:20–1:40 PM

A Novel MMIC High Frequency OscillatorJ.T. Harvey, A.C. Young, Mimix Broadband 1:40–2:00 PM

Session 19:30–11:50 AM

EM Simulation


Non-linear Models, Circuit/System Simulation


Measurements


Materials


Passive Components


Modulator, MEMs, Oscillator

A-Alpha WaveguideAC MicrowaveAccumet EngineeringACE TechnologyAdvance ReproductionsAdvanced Chemical Co.Advanced Control Comp.Advanced ElectromagneticsAdvanced Switch TechAeroflexAeroflex Circuit TechAeroflex ComstronAeroflex LintekAeroflex MIC TechnologyAeroflex RDLAerowave Inc.Aethercomm Inc.Agilent TechnologiesAir Precision / SiversAKON Inc.Alan Industries Inc.Aliner Industries Inc.Alpha IndustriesAMCOM CommunicationsAmerican Technical CeramicsAmetek Specialty Metal Prod.AMITRONAmkor TechnologyAMOTECH Co., Ltd.Amphenol RFAmplifier ResearchAmplifonix Corp.AnadigicsAnalog Devices Inc.Anaren Microwave Inc.Anritsu CompanyAnsoft Corp.API Delevan Inc.Aplac Solutions Corp.Applied Engineering Prod.Applied Microwave & WirelessApplied Specialties Inc.Applied Thin-Film ProductsApplied Wave Research Inc.AR KalmusARC TechnologiesArcom Inc.Arlon - M.E.D.Arrow RF VisionArtech HouseAssemblies Inc.Astrolab Inc.Atlantic MicrowaveAtmel Wireless & MicrocontrollersATN Microwave Inc.Avnet Electronics MarketingAVX Corp.BAE SystemsBarry IndustriesBelden Wire & Cable CompanyBesser Associates Inc.Bird ElectronicsBliley Electric CompanyBoonton Electronics Corp.Bradley UniversityBrush WellmanC-MAC MicroTechnologyC.E. Precision AssembliesCAD Design Services Inc.Cal Crystal Lab Inc.California Eastern LabsCambridge ProductsCarleton UniversityCascade MicrotechCeleritek Inc.Cernex Inc.Channel Microwave Corp.Circuits Processing TechCirqon TechnologiesCITEL Inc.Clarisay Inc.ClearComm TechnologiesCMC Wireless ComponentsCMP Media Inc.CMR CircuitsCoilcraftCommunication Tech Inc. (CTI)Communications & Power-CanadaComNav EngineeringCompac Development Corp.Compel Electronics SpaCompel Electronics Inc.Compex Corp.Component DistributorsCOMSOL Inc.Comtech PSTConec Corp.ConexantConnecting Devices Inc.Connectronics Inc.Continental Microwave & ToolCoorsTekCottonwood Technology GroupCougar ComponentsCoventor Inc. (Microcosm)CRC PressCredence SystemsCree Inc.Cronos, A JDS Uniphase Co.

CSIRO AustraliaCST of AmericaCTT Inc.Cuming Microwave Corp.Custom Cable AssembliesDaico Industries Inc.DB ProductsDelta Electronics Mfg. Corp.Dexter Magnetic TechnologiesDiamond AntennaDielectric Labs Inc. (DLI)Discovery SemiconductorsDitom Microwave Inc.DML Microwave, Ltd.Dorado International Corp.Dow-Key MicrowaveDRC - MetrigraphicsDucommun Technologies Inc.DuPont Microcircuit MaterialsDuPont SuperconductivityDynawave Inc.Eagleware Corp.Ecliptek Corp.EDO - AILEE - Evaluation EngineeringEiC Corp.Elcom TechnologiesElectromagnetic Tech Inc.Elisra Electronic SystemsElva-1 Ltd.EMAG TechnologiesEMC Technology Inc.Emerson & Cuming MicrowaveEMF SystemsEmhiser Micro-TechEMS Technologies Inc.Ericsson MicroelectronicsExcelics SemiconductorEZ Form Cable Corp.F&K Delvotec Inc.Farran Technology, Ltd.Faustus Scientific Corp.FCT Electronics LPFilm Microelectronics Inc.Filtel Microwave Inc.Filtran Microcircuits Inc.Filtronic Components - FerretecFiltronic Compound SemiconductorFiltronic Sigtek Inc.Filtronic Solid StateFirst TechnologyFlann Microwave Inc.Flexco Microwave Inc.FlomericsFlorida RF Labs, Smiths IndsFocus Microwaves Inc.Foranne Mfg.Fotofabrication (Fotofab)Fox ElectronicsFrequency ManagementFSY Microwave Inc.Fujitsu Compound SemiconductorFujitsu MicroelectronicsG.T. MicrowaveGaAs Code Ltd.Gaiser Tool Co.GaltronicsGavish Inc.GEL-PAKGeneral Microwave Corp.Georgia Institute of TechGGB Industries Inc.GHz Technology Inc.Giga Solution Tech Co.Giga-tronicsGigatech Co., Ltd.GIL TechnologiesGilbert Engineering Co.Charles E. Gillman Co.Gold Conn. LTDW. L. Gore & AssociatesGowanda ElectronicsGradient TechnologiesHabia Cable Inc.Harbour IndustriesHaverhill Cable & Mfg. Co.HD Communications Corp.HEI Inc.Heraeus Inc.Herley-MDIHerotek Inc.Hexawave Inc.Hitachi Metals AmericaHitachi SemiconductorHittite MicrowaveHoll Technologies Co.HoneywellHTA PhotomaskHuber + Suhner Inc.Hybond Inc.Hypertronics Corp.Hytronics Corp.IBMIFRIMI Inc.IMS Connector SystemsIMST GmbHIn Phase TechnologiesInfineon Technologies

Inmet Corp.Insulated Wire Inc.Integra TechnologiesIntegrated Microwave Corp.International Crystal Mfg.International ManufacturingIon Beam Milling Inc.IQE PlcITT Industries Microwave Sys.Janco Electronics Inc.JCA TechnologyJFW Industries Inc.Johanson ManufacturingJohanson Technology Inc.Johnson Components Inc.Jye Bao Co., Ltd.K & L Microwave Inc.Kaman InstrumentationKarl SussKDI/Triangle Corp.Keithley Instruments Inc.Kevlin (Chelton Gp)KMW USA Inc.Knowledge*on Inc.Korea Sangshin Electric Co.Krytar Inc.KW Microwave Corp.Kyocera America Inc.Kyocera Industrial CeramicsL-3 Communication/CelerityLabtechLaser Processing TechLaser Services Inc.Laserage Technology Corp.Lehman ChambersLitton AirtronLitton Electron DevicesLitton Winchester/RetconnLogus Microwave Corp.Lorch MicrowaveLPKF Laser & ElectronicM/A-COMM2 Global TechnologyMarconi Caswell Ltd.Maryatt TechnologiesMaury Microwave Corp.MCE Companies Inc.Mega Circuit Inc.Mega IndustriesMegaPhase CableMeggitt Safety SystemsMEMSCAP Inc.Merrimac IndustriesMetclad InternationalMetelics Corp.Metropole Products Inc.MH&W Int’l Corp./ThermalMI TechnologiesMI.TEL SRLMICA Microwave Corp.MicianMicralyneMicro Hybrid DimensionsMicro Lambda Inc.Micro MetalsmithsMicro Metrics Inc.Micro Networks/Andersen LabsMicro Substrates Corp.Micro-Chem Inc.Micro-Coax Inc.Microelectronics CapacitorsMicromanipulator Co. Inc.MicroneticsMicrosemi Corp.Microsource Inc.Micross Components Corp.Microtech Inc.Microwave Applications GroupMicrowave CircuitsMicrowave Comm. & ComponentsMicrowave Communications LabsMicrowave Concepts Inc.Microwave Development Co.Microwave Development LabsMicrowave Device TechnologyMicrowave Devices Inc.Microwave DynamicsMicrowave Engineering EuropeMicrowave JournalMicrowave Solutions LimitedMicrowave TechnologyMicrowave Test SolutionsMicrowaves & RFMid Atlantic RF SystemsMidcom Inc.Millitech, LLCMilmegaMimix BroadbandMini-CircuitsMini-Systems Inc.Mission Telecom Co. Ltd.MITEQMitsubishi ElectronicsMMCOMM Inc.Modco Inc.Modular Components/Maryland MPCMolex RF/Microwave ConnectorMorgan Advanced Ceramics

Morgan Electro CeramicsMotorola SPSMRSIMTI - Milliren TechnologiesMurata Electronics N.A.MVS-Microwave & Video SystemsMWTG TelecomNagano Japan Radio Co.Nanowave Inc.Narda (L-3 Communications)Narda DBSNarda WestNational InstrumentsNational SemiconductorNEL America (NTT Electronics)Net Shape TechnologiesNetcom Inc.Nextec Microwave & RFNJR Corp.Noble Publishing Corp.Noise ComNTK Technical CeramicsNurad TechnologiesOctagon CommunicationsOEA International Inc.Olin AegisOphir RF Inc.Optotek Ltd.Orbit/FR Inc.Osprey Metals Ltd.Pacific Aerospace & ElectronicsPalomar Technologies Inc.Paratek Microwave Inc.PAWANETPC Dynamics/Performance InterconnectPCB Engineering Inc.Penn Engineering ComponentsPenton Media Inc.Peregrine SemiconductorPhotofabrication EngineeringPiconics Inc.Picosecond Pulse Labs Inc.Piezo Technology Inc. (PTI)Pletronics Inc.Polaris Electronics Corp.Polese CompanyPoly CircuitsPolyfet RF DevicesPolyflon CompanyPolyphaser Corp.Poseidon Scientific InstrumentsPrecision Ferrites & CeramicsPrecision Photo-Fab Inc.Precision TubePrentice HallPresidio Components Inc.Pulsar Microwave Corp.Q MicrowaveQ-Tech Corp.Quasar Microwave TechnologyQUEST Microwave Inc.Questech Services Corp.QuinStar Technology Inc.QWEDR & K Company LimitedRadio Frequency InvestigationRadio WavesRaytheon RF ComponentsRDLReactel Inc.RelComm TechnologiesREMECRemtecRenaissance ElectronicsRes-Net MicrowaveResin SystemsRF Depot.comRF DesignRF IndustriesRF Micro DevicesRF Nitro CommunicationsRF Solutions Inc.Richardson ElectronicsRJR Polymers Inc.RLC ElectronicsRobinson LaboratoriesRogers Corp.H. Rollet & Co. Ltd.Roos Instruments Inc.Rosenberger of North AmericaSabritecSage Labs (Filtronic plc)Salisbury Engineering Inc.San-Tron Inc.SaRonixSawtek Inc.Schwarzkopf Technologies Corp.Scientific Microwave Corp.SDP Components Inc.Semflex Inc.Semi Dice Inc.Shadow Technologies Inc.Sheldahl Inc.SierraComSierratherm Production FurnacesSigma Systems Corp.Signal Technology Corp.Sinclair Manufacturing Co.

EXHIBITORS

The MTT-S Exhibition is an annual event that has taken place since 1970. It com-prises more than 400 microwave, subassembly, component, device, material, instru-ment and design software suppliers and each year draws approximately 10,000 to10,200 microwave engineers involved in the design of systems, subsystems, compo-nents and devices.

The 2001 Exhibition will be held in the Phoenix Civic Plaza. Exhibition hours areTuesday, May 22 and Wednesday, May 23 from 9:00 AM to 5:00 PM, and Thursday, May24 from 9:00 AM to 3:00 PM. Following is a list of exhibiting companies. The list is com-plete as of press time, but may not include all companies.

SIWARD International Inc.Smiths Group PlcSonnet Software Inc.Sonoma Scientific Inc.Sophia WirelessSouthwest MicrowaveSpectra-Mat Inc.Spinner North AmericaSPMSprague-Goodman ElectronicsSRC CablesSRI Connector Gage Co.SSI Cable Corp.SSPA Microwave Corp.Stanford Microdevices Inc.State Of The Art Inc.Stealth MicrowaveStetco Inc.STISTMicroelectronicsStorm ProductsStratEdge Corp.Sumitomo ElectricSV Microwave Inc.C. W. Swift & AssociatesSynergy MicrowaveT-Tech Inc.TCI (TRAK Ceramics Inc.)Tecan ComponentsTecdia Inc.Tech TimeTech-Ceram Corp.Technical Research & Mfg.Tecom IndustriesTegam Inc.Tektronix Inc.Teledyne Electronic TechTeledyne MicroelectronicsTeledyne Microwave Comp.Teledyne RelaysTeledyne WirelessTelegartner Inc.Telephus Inc.Temex ElectronicsTemptronic Corp.TensoliteTestMartThales MicrowaveThermax/CDT Inc.Thin Film Concepts Inc.Thunderline-ZTimes Microwave SystemsTLC Precision Wafer TechToshiba America ElectronicTRAK Ceramics Inc.TRAK Communications Inc.TRAK EuropeTRAK MicrowaveTrans-TechTranscom Inc.TrilithicTriQuint SemiconductorTronser Inc.Tru-Connector Corp.TRWTTE Inc,A.J. Tuck Co.Ube Electronics, Ltd.UltraRFUltraSource Inc.United Monolithic SemiconductorsUnited Satcom Inc.United Western EnterprisesUnity Wireless Systems Corp.Universal Microwave Corp.University Of California, UCLAUniversity of MassachusettsUTE Microwave Inc.Vacuum Engineering & MaterialsValPey Fisher Corp.Vari-L Company Inc.Vector Fields Inc.Vectron InternationalVerticom Inc.Victory Industrial Corp.Voltronics Corp.VXI Technology Inc.A.T. Wall CompanyWavetronixWeinschel Corp.Wenzel Associates Inc.Werlatone Inc.Wessex Electronics Ltd.West Bond Inc.John Wiley & Sons Inc.Williams Advanced MaterialsWIN SemiconductorsWireless Design & Dev.Wireless Systems DesignWJ CommunicationsXemodXL Microwave Inc.Xpedion Design SystemsYageo AmericaZeland Software Inc.Zentrix TechnologiesZeta, Division Of Sierra TechZIFOR Enterprise Co., Ltd.

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HISTORICAL EXHIBIT

The Microwave Theory and Techniques Society Historical Ex-hibit will be located at the Phoenix Civic Plaza. Symposium atten-dees are encouraged to visit the Historical Exhibit during the reg-ular exhibition hours, Tuesday through Thursday.

The Historical Exhibit includes the MTT-S library collection ofbooks and documents with descriptions of early theoretical andexperimental achievements in microwaves. A collection of histor-ical artifacts will be on display, including electron devices fromthe early 1930s (klystrons, magnetrons, traveling-wave tubes),modern MMIC chips and T/R modules. There will also be sched-uled showings of videotapes describing historic developments inmicrowaves.

SPECIAL EXHIBIT ON THE INVENTIONS OF AL GROSS

The Phoenix symposium will also feature a special exhibit ofthe inventions of Al Gross, who is recognized for his contribu-

tions as a pioneer in the field.The role that Al Gross played inthe development of miniatur-ized, portable communicationdevices, as a forerunner of thecommunication revolution willbe recognized in the exhibition.The first invention that Al devel-oped in 1938 was the walkie-talkie, a small hand-held radiowith two-way communication

features. This device is still in use today, used by law enforce-ment, firefighters etc. In addition, he developed a two-way air-to-ground communications system used in World War II.

NIST CENTENNIAL:

CELEBRATING ADVANCES IN RF TECHNOLOGY

In addition, there will be an exhibit from the National Instituteof Standards and Technology (NIST) celebrating its centennial.NIST, the successor to the former National Bureau of Standards(NBS), celebrates its centennial this year. This exhibit contains ar-tifacts, photographs, seminal papers, and descriptions of sevenimportant NIST contributions to RF metrology: This includes theSix-Port Network Analyzer, Microcalorimeter for Power Measure-ment, Reentrant Cavity for Dielectric Measurements, WaveguideBelow Cut-off Attenuation Standard, Cryogenic Primary NoiseStandard, On-wafer TRL Calibration and Near-Field Antenna Mea-surements

Learn more about both NIST history and current technologicaladvances in Special Session WE-2D “The NBS/NIST Centennial:One Hundred Years of RF Metrology and Standards,” Wednesdayat 10:10 AM.

HISTORICAL ELECTRONICS MUSEUM

The Historical Electronics Museum is the permanent home ofthe MTT-S Historical Collection between Symposia. The Museumholds many microwave-related items besides the MTT-S Collec-tion, including parts of the SCR-270 (Pearl Harbor) radar and acomplete SCR-584 radar, which was used with the proximity fuzein World War II. It also contains an impressive library of over7,000 books and 11,000 journals. The Museum is located near Bal-timore-Washington International Airport, and is approximately 20minutes from the downtown Baltimore. Additional informationon the Museum can be found on its Web site at http://www.erols.com/radarmus, or call (410) 765-2345.

ADDITIONAL MEETINGS (Check www.ims2001.org for updates.)

Saturday, May 19 8:00 AM–11:30 AM AdCom Budget Committee Hyatt1:00 PM–5:30 PM AdCom Long Range Planning Hyatt6:00 PM–8:30 PM AdCom Reception and Dinner Hyatt8:00 PM–11:00 PM AdCom Meeting Hyatt

Sunday, May 20 7:00 AM–8:30 AM Speakers’ Breakfast Hyatt7:00 AM–8:30 AM AdCom Breakfast Hyatt7:00 AM–8:00 AM Workshops Breakfast Symphony Terrace7:00 AM–5:30 PM Speakers’ Preparation Civic Plaza, Yuma 2912:00 PM–1:00 PM Workshops Lunch Symphony Terrace8:00 AM–5:30 PM AdCom Meeting Hyatt12:00 PM–1:30 PM AdCom Lunch Hyatt7:00 PM–10:00 PM RFIC Reception Crowne Plaza

Monday, May 21 7:00 AM–9:00 AM Speakers’ Breakfast Hyatt7:00 AM–8:00 AM Workshops Breakfast Symphony Terrace7:00 AM–9:00 AM Members’ Breakfast Symphony Terrace7:00 AM–5:30 PM Speakers’ Preparation Civic Plaza, Yuma 2912:00 PM–1:00 PM Workshops Lunch Symphony Terrace6:00 PM–8:00 PM Microwave Journal Reception Hyatt

Tuesday, May 22 7:00 AM–9:00 AM Speakers’ Breakfast Hyatt7:00 AM–9:00 AM Members’ Breakfast Symphony Terrace7:00 AM–5:30 PM Speakers’ Preparation Civic Plaza, Yuma 2912:00 PM–1:30 PM RF and Microwave Education Forum Civic Plaza, Flagstaff 2–512:00 PM–1:30 PM TCC Meeting Hyatt4:30 PM–6:30 PM Chapter Chairman’s Reception & Meeting Hyatt5:00 PM–10:00 PM Corona Ranch Event Corona Ranch & Rodeo Grounds7:00 PM–9:30 PM Rump Session Hyatt

Wednesday, May 23 7:00 AM–9:00 AM Speakers’ Breakfast Hyatt7:00 AM–9:00 AM Members’ Breakfast Symphony Terrace7:00 AM–5:30 PM Speakers’ Preparation Civic Plaza, Yuma 2912:00 PM–1:30 PM 2002 IMS TPC Lunch Hyatt6:00 PM–7:30 PM Industry-hosted Cocktail Reception Hyatt7:30 PM–10:00 PM MTT-S Awards Banquet Hyatt

Thursday, May 24 7:00 AM–9:00 AM Speakers’ Breakfast Hyatt7:00 AM–9:00 AM Members’ Breakfast Symphony Terrace7:00 AM–5:30 PM Speakers’ Preparation Civic Plaza, Yuma 2912:00 PM–1:30 PM 2001/2002 IMS Steering Committee Lunch Hyatt12:00 PM–1:00 PM Students Awards Luncheon Hyatt

Friday, May 25 7:00 AM–8:00 AM Workshops Breakfast Symphony Terrace7:00 AM–9:00 AM Speakers’ Breakfast Hyatt7:00 AM–5:30 PM Speakers’ Preparation Civic Plaza, Yuma 2912:00 PM–1:00 PM Workshops Lunch Symphony Terrace

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2001 DISTINGUISHED SERVICE AWARD

The Distinguished Service Award is presented to recognize an individual who has giv-en outstanding service for the benefit and advancement of the Microwave Theory andTechniques Society.

This year’s recipient is Dr. Reynold Kagiwada.

Citation:

“FOR HIS OUTSTANDING AND DEDICATED SERVICE TO THE SOCIETY.”

2001 DISTINGUISHED EDUCATOR AWARD

This award was inspired by the untimely death of Prof. F.J. Rosenbaum (1937–1992),an outstanding teacher of microwave science and a dedicated Administrative CommitteeMember and contributor. The award recognizes a distinguished educator in the field ofmicrowave engineering and science who best exemplifies the special human qualities ofFred Rosenbaum who considered teaching a high calling and demonstrated his dedica-tion to the Society through tireless service.

This year’s recipient is K.C. Gupta.

Citation:

“FOR OUTSTANDING ACHIEVEMENTS AS AN EDUCATOR, MENTOR AND ROLEMODEL OF MICROWAVE ENGINEERS AND ENGINEERING STUDENTS.”

2001 MICROWAVE PIONEER AWARD

The Microwave Pioneer Award recognizes an individual or a team not exceeding threepersons having made outstanding pioneering technical contributions that advance mi-crowave theory and techniques and described in an archival paper published at least 20years prior to the year of the award.

This year’s recipient is Prof. Om P. Gandhi.

Citation:

“FOR CONTRIBUTIONS TO DOSIMETRY OF ELECTROMAGNETIC RADIATION ANDRESULTING REVISIONS OF RF/MICROWAVE SAFETY STANDARDS.”

2001 APPLICATION AWARD

The Microwave Application Award recognizes an individual or team for outstandingapplication of microwave theory and techniques. This year’s recipient is James C. Rautio.

Citation:

“FOR DEVELOPMENT OF WIDELY-USED FULL-WAVE ELECTROMAGNETICSOLUTION SOFTWARE FOR THE COMPUTATION OF PRINTED CIRCUITCHARACTERISTICS.”

2001 MICROWAVE PRIZE

The Microwave Prize recognizes, on an annual basis, the most significant contributionby a published paper to the field of interest of the Microwave Theory and Techniques So-ciety. Papers under consideration are those published during the period January 1 to De-cember 31 of the year preceding the Fall Meeting of the Administrative Committee atwhich the award is considered.

This year’s recipients are Dan Anderson, Mitek Lisak, Ulf Jordan, Torbjörn Olsson,and Mats Ahlander.

Citation:

“FOR A SIGNIFICANT CONTRIBUTION TO THE FIELD OF ENDEAVOR OF THE IEEEMTT SOCIETY IN THE PAPER ENTITLED, “MICROWAVE BREAKDOWN IN RESONATORS AND

FILTERS,” IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, MTT-48, PP. 2547–2556 (1999)”

2001 N. WALTER COX AWARD

The N. Walter Cox Award has been established in recognition of the qualities of N.Walter Cox and his service to the MTT Society prior to his untimely death in 1988. It is giv-en to a Society volunteer whose efforts on behalf of MTT-S best exemplify Walter’s spiritand dedication.

This year’s recipient is John W. Wassel.

Citation:

“FOR EXEMPLARY SERVICE, GIVEN IN A SPIRIT OF SELFLESS DEDICATION ANDCOOPERATION.”

2001 IEEE ELECTROMAGNETICS AWARD

The IEEE Electromagnetics Award was established in 1996, and is presented to an in-dividual for outstanding contributions to electromagnetics in the areas of theory, appli-cation or education. The Award consists of a bronze medal, certificate and a cash prize.

This year’s recipient is Fawwaz Ulaby.

Citation:

“FOR CONTRIBUTIONS TO MICROWAVE REMOTE SENSING AND TECHNOLOGY,ITS GEOSCIENTIFIC APPLICATIONS, AND RELATED EDUCATION.”

2001 MTT-S AWARDS

IEEE FELLOWS: CLASS OF 2001

The Member Grade of fellow is conferred in recognition of unusual and outstand-ing professional distinction. It is awarded at the initiative of the IEEE Board of Direc-tors following a rigorous nomination and evaluation process. Individuals receivingthis distinction have demonstrated extraordinary contributions to one or more fieldsof electrical engineering, electronics, computer engineering and related sciences.This Grade is not conferred automatically on nomination; only a fraction of thosenominated are elected.

Fifteen MTT-S Members who were evaluated by our society were elected to theGrade of Fellow, effective 1 January 2001:

NAME CITATION

Charles Howard Cox, III For contributions to the analysis, designand implementation of analog optical links.

Samir M. El-Ghazaly For contributions to the analysis and simulations of microwave devices and circuits.

Pierre Guillon For contributions to the theory and applications of dielectric resonators and to computer aided design of microwave passive and active devices.

Aditya Kumar Gupta For contributions to the advancement of microwave monolithic integrated circuit technology and leadership in the development of manufacturable processes.

Wojciech Kazimierz Gwarek For contributions to the theory and applications of electromagnetic modeling

Dieter Stefan Jäger For contributions to the development of device concepts in microwaves and photonics.

Raafat R. Mansour For contributions to the development of high temperature superconductive filters and multiplexers.

Wolfgang S. Menzel For contributions to the development of microwavefin-line circuits.

Jozef Wieslaw Modelski For contributions to microwave semiconductor phase modulators and phase shifters.

Martin Nisenoff For leadership in the application of high temperature superconductivity and cryogenics to microwave components and systems.

Edward Anthony Rezek For contributions to GaAs and InP monolithic microwave integrated circuits and optoelectronic devices.

Arvind Kumar Sharma For contributions to active device and passive component modeling, and design of high power monolithic millimeter-wave integrated circuits.

Peter H. Siegel For contributions to the field of millimeter and submillimeter-wave radiometry, technology and spaceborne instruments.

Wai-Cheung Tang For contributions to the miniaturization of microwave filters and multiplexers for satellite applications.

Ke Wu For contributions to hybrid integration of planar and non-planar microwave and millimeter-wave circuits and guided-wave structures.

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In addition, the following twelve MTT-S Members of the Class of 2001 Fel-lows were evaluated by other Societies:

John D. Cressler For contributions to the understanding and optimization of silicon and silicon-germanium bipolar transistors.

Daniel De Zutter For the application of Maxwell’s equations and for the development of numerical solution methods in electromagnetic scattering, antennas, and microwave circuits.

Ronald Dale Esman For contributions to the development of fiber optic systems for microwave applications and optical fiber research.

Peter S. Hall For contributions to the development and application of microstrip antennas and active integrated antenna arrays.

Jian-Ming Jin For contributions to computational electromagnetics and its applications to antennas, radar scattering, microwave circuits, and biomedical technology.

Kei May Lau For contributions to III-V compound semiconductor heterostructure materials and devices.

GENERAL INFORMATION

NOTES

Krzysztof A. Michalski For the development of numerical solution methods in electromagnetic scattering, antennas, and microwave circuits.

Donald Ralph Pflug For contributions to the development and promotion of electromagnetic analysis code validation.

Roberto G. Rojas For contributions to the understanding of high frequency electromagnetic radiation and scattering.

Krishna Shenai For contributions to the understanding, development and application of power semiconductor devices and circuits.

Toshiyuki Shiozawa For contributions to engineering-oriented relativistic electromagnetic theory and theoretical study of free-electron lasers.

Winston I. Way For contributions in applying subcarrier multiplexing techniques to lightwave technologies for hybrid fiber-coax access systems.

Information Booth: Pamphlets and information on thePhoenix area will be available at a booth centrally located inLobby I of the Civic Plaza. Representatives of the Phoenix Con-vention and Visitors Bureau will man the booth. The HospitalitySuite is located in the Sundance Room of the Hyatt Hotel.

IEEE/MTT-S Memberships: An IEEE/MTT-S membership boothwill be located in Lobby II. (In addition, a membership applica-tion is provided on page 6 of this program.) Those who applyfor membership on site will be eligible for the discounted mem-ber rates on registration fees. IEEE members (or on-site appli-cants) who register for the full Symposium and have not beenMTT-S members in the past year will be offered a free basicMTT-S membership good until the end of the year, which willinclude admission to the MTT-S members’ breakfasts.

Drinks and Refreshments: Free coffee and soft drinks will beavailable during mid-morning and mid-afternoon breaks in therefreshment areas in the exhibition hall.

Smoking: Smoking is not permitted in the Civic Plaza. Manyrestaurants in Phoenix are completely smoke-free but, general-ly, if there is a lounge attached, some smoking is permitted. It isbest to inquire when making reservations.

Recruiting: Businesses do not send their personnel to the IMS tobe recruited by other businesses. To ensure that these meetingscontinue in the future, IEEE policy insists that recruiting doesnot occur at the Symposium.

Recording of Technical Presentations: The recording oftechnical presentations by video or audio recorders or camerasis not allowed without the permission of the speaker and notifi-cation of the session organizer.

Mohamed AbouzahraDouglas AdamFazal AliDavid AllstotRoberto AlmFritz ArndtPeter AsbeckKirk AshbyJohn S. AthertonAli AtiaInder BahlJohn BandlerRajeev BansalZaher BardaiScott BarkerJohn BarrH. Clark BellAdalbert BeyerSarjit BharjRadek BiernackiLuciano BoglioneJens BornemannHermann BossAli BoudiafTom BrazilGailon BrehmKlaus BreuerSteve BrozovichCharles BuntschuhMark CalcateraEdmar CamargoNatalino CamilleriRaymond CamisaRichard CampbellAndreas CangellarisKenneth CarrChristopher ChangKai ChangFrank ChangeThomas Cho John ChomaDebabani ChoudhuryTerry CiscoEliot CohenJames CrescenziNirod DasLionel DavisJohn DavisJames DegenfordMichael DeLisioEdgar DenlingerYann DevalNorman DietrichGuglielmo D’InzeoRahul DixitPaul DraxlerLawrence DunleavyMichael DydykSamir El-GhazalyBadawy ElsharawySherif EmbabiMurat EronRonald EsmanAly FathyS. Jerry FiedziuszkoVictor Fouad HannaIan GaltonCarol GeeBernard GellerEd Godshalk

Ravindra GoelJitendra GoelMarc GoldfarbCharles GoldsmithMike GolioStephan GoodnickAnand GopinathMark GoukerEd GriffinMarco GuglielmiPierre GuillonK.C. GuptaMadhu S. GuptaRamesh GuptaAditya GuptaWojciech GwarekRon HamRamesh HarjaniMike HarrisJames HarveyJohn HeatonPatric HeideStefan HeinenWolfgang HeinrichGeorge HeiterRudolf E. HenningPeter HerczfeldWolfgang J.R. HoeferKazuhiko HonjoDerry HornbuckleJohn B. HortonCharles HuangHo HuangH. Alfred HungJames HwangKiki IkossiTatsuo ItohFerdo IvanekDavid JacksonRobert W. JacksonCharles JacksonDieter JaegerRolf H. JansenGeorge JerinicAlbert JerngReynold KagiwadaSridhar KanamaluruLinda KatehiAllen KatzRoger KaulSteve KenneyAmarpal KhannaSayfe KiaeiMarek KitlinskiReinhard KnerrKevin Kobayashi Hiroshi KondohYouji KotsukaChandra KudsiaBill KuhnMahesh KumarH. John KunoLarry KushnerPaolo LamparielloMike LancasterJoy LaskarTimothy LeeChi LeeRalph LevyGuo-Chun Liang

Olivier LlopisStephen LloydDavid LovelaceJohann LuyGregory LyonsStephen MaasMohamad MadihianAsher MadjarRaghu MallavarpuDonald MalochaRaafat MansourEdgar MartinezMehran MatloubianJ.K. McKinneyDavid McQuiddyMohamed MegahedDavid MeharryJames Minkkoji MizunoJozef ModelskiJyoti MondalMauro MongiardoAmir MortazawiVijay NairKrishna NaishadhamBrad NelsonDavid NGOEdward NiehenkeMartin NisenoffToshio NishikawaMichal OdyniecHiroyo OgawaAaron OkiArthur OlinerAbbas OmarJohn OwensTerry OxleyJohn PapapolymerouDon ParkerSuman PatelAnthony PavioJeanne PavioSong-Tsuen PengBarry PerlmanJohn PierroAryeh PlatzkerRoger D. PollardGeorge PonchakJeffrey PondZoya PopovicMarian PospieszalskiReinhold PreglaSam PritchettFrederick RaabLamberto RaffaelliRichard RansonJames RautioGabriel RebeizDon ReidKate RemelyLeonard D. ReynoldsEdward RezekAlfy RiddleVittorio RizzoliDavid RootLuca RoselliArye RosenPeter RusserMagdalena Salazar-PalmaTapan Sarkar

Paul SaunierJames SchellenbergManfred SchindlerDietmar SchmittFranco SechiAlwyn SeedsJohn SevicArvind SharmaTsugumichi ShibataWayne ShiromaBernard SigmonZbynek SkvorPhillip SmithChris SnowdenRichard SnyderHarold SobolElissa SobolewskiMoise SolomonRoberto SorrentinoEmilio Sovero easoveroRichard A. SparksBarry SpielmanPeter StaeckerJoe StaudingerMichael SteerSteven StitzerEric StridRoger W. SudburyFrank SullivanDan SwansonBela SzendrenyiSalvador TalisaWai-Cheung TangDouglas TeeterBruce ThompsonMichael ThorburnMike ThursbyYevgeniy TkachenkoKiyo TomiyasuRobert J. TrewJames TsuiChing-Kuang TzuangYohtaro Umeda*Ruediger VahldieckAndré Vander VorstKarl VarianKikuo WakinoChi WangDenis WebbRobert WeigelClaude WeilSander WeinrebAndreas WeisshaarCharles WeitzelThomas WellerCheng P. WenScott WetenkampJames WhelehanLarry WhickerLawrence WilliamsDylan WilliamsKe WuHungYu David YangTsukasa YoneyamaRobert YorkPaul YuKawthar ZakiJan ZehentnerDavid Zimmermann

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2001 IEEE MTT-S TECHNICAL PROGRAM COMMITTEE

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General ChairSamir [email protected] 480-965-5322F 480-965-8325

Stephen Goodnick, [email protected] 480-965-6410F 480-965-3837

Adolfo Reyes, [email protected] 480-413-5110F 480-413-4453

Joe Staudinger, Liaison, [email protected] 480-413-4456F 480-413-4034

Michael Majerus, Liaision, [email protected] 480-413-3461F 480-413-4453

FinanceRodolfo Diaz, [email protected] 480-965-4281F 480-965-1384

George Norris, [email protected] 480-413-3958F 480-413-6744

Local ArrangementsHoward Patterson, [email protected] 480-413-5537F 480-413-4433

Michael Majerus, [email protected] 480-413-3461F 480-413-4453

Echo Farrell, [email protected] 480-607-9990F 480-607-9995

Mary Young, [email protected] 480-968-7559F 480-968-7560

Special EventsDeborah Patterson, Sub-Committee [email protected] 602-431-6020 x212F 602-431-6021

Monica C. de Baca, [email protected] 480-413-4536F 480-413-4453

TransportationMarcel Tutt, Sub-Committee [email protected] 480-413-6671F 480-413-4453

Murray Sirkis, [email protected] 480-967-2738

Audio/VisualGary Sadowniczak, Sub-Committee [email protected] 480-413-6625F 480-413-6744

Polka Lesley, [email protected] 480-554-1728F 480-554-7615

SignsTom Post, Sub-Committee [email protected]

VIP Arrangements & GiftsEllen Lan, Sub-Committee [email protected] 480-413-4128F 480-413-4453

DaybookRic Uscola, Sub-Committee [email protected] 480-413-5966F 480-413-4453

PublicityTrevor Thornton, [email protected] 480-965-3808F 480-965-8058

Web siteSiham El-Ghazaly, [email protected]

Neil Tracht, [email protected] 480-413-4999F 480-413-4453

Eric M. Johnson, [email protected] 480-413-4673F 480-413-4453

Jeff Pond, [email protected] 202-767-2862F 202-767-0455

Technical ProgramVijay Nair, [email protected] 480-755-5590F 480-755-5002

Chuck Weitzel, [email protected] 480-413-5406F 480-413-4453

Publications (CD-ROM, Digest)Bernard Sigmon, Digest [email protected] 480-545-4096F 480-545-4096

Rudy Emrick, [email protected] 480-732-6938F 480-732-6550

Steve Rockwell, [email protected] 480-732-6948F 480-732-5559

Debabani Choudhury,CD-ROM [email protected] 310-317-5584F 310-317-5450

Rashaunda Henderson,CD-ROM [email protected] 480-413-5374F 480-413-7918

Panel/Rump SessionsPeter Blakey, Sub-Committee ChairT 480-413-4225

George Pan, Sub-Committee [email protected]

Special SessionsMike Golio, Sub-Committee [email protected] 319-295-3926F 319-295-2751

Student PaperJohn Papapolymerou, Sub-Committee [email protected] 520-621-4462F 520-626-3144

Navid Yazdi, [email protected] 480-965-4456

Transactions Special IssueConstantine Balanis, [email protected] 480-965-3909

Michael Dydyk, [email protected] 480-441-2074

WorkshopBadawy El-Sharawy, Sub-Committee [email protected] 480-965-8591

Tarek Ismail, [email protected] 480-752-6462F 480-752-6122

Gamal Fahmy, Web [email protected] 480-804-0591

Mohamed Megahed, [email protected] 949-483-7244

Deborah Dendy, MemberBill Agar, [email protected] 480-539-2553

Ken Buer, Member

Interactive ForumPeter Okrah, Sub-Committee [email protected] 480-413-6414F 480-413-6780

ARFTG ConferenceDave Lovelace, [email protected] 480-759-0200 x213F 480-704-1500

Robert [email protected] 480-965-1750

Irving [email protected] 480-965-5974

ExhibitionHarlan Howe, [email protected] 781-769-9750F 781-769-5037

Kristen Dednah, [email protected] 781-769-9750F 781-769-5037

Program PublicationKeith [email protected] 781-769-9750F 781-769-5037

At-Large MembersHoward Ellowitz, [email protected] 781-769-9750F 781-769-5037

2001 IEEE MTT-S IMS STEERING COMMITTEE

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2001 OFFICERSPresident . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .C.M. Jackson

Vice President . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .J.T. Barr, IV

Treasurer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .J.S. Kenney

Secretary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .W. Shiroma

ELECTED ADCOM MEMBERS2001 2002 2003

R.B. Marks J.T. Barr, IV S.M. El-Ghazaly

J. Modelski M.D. DeLisio M. Harris

S.J. Fiedziuszko K.C. Gupta K. Honjo

F.J. Sullivan C.M. Jackson J.S. Kenney

R.J. Trew M.J. Schindler J.M. Pond

S. Wetenkamp K.V. Varian R. Sorrentino

G. Thoren

IMMEDIATE PAST PRESIDENTS2000 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .R.W. Sudbury

1999 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .E.A. Rezek

1998 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .R.D. Pollard

HONORARY LIFE MEMBERSA.C. Beck A.A. Oliner K. Tomiyasu

S.B. Cohn T.S. Saad L. Young

T. Itoh

IEEE MTT-S ADMINISTRATIVE COMMITTEE

FUTURE IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIA

2002 — SEATTLE, WA — JUNE 3–7, 2002General Chairman Operations Chairman Technical Program Technical ProgramDonn Harvey Tom Raschko Ed Godshalk Eric StridMetawave Seaport Technical Sales Maxim Cascade MicrotechTel (425) 702-5816 Tel (425) 391-6714 Tel (503) 641-3737, ext. 1633 Tel (503) [email protected] [email protected] [email protected] [email protected]

Finance Local Arrangements Publications Publicity/Web MasterSteve Peters Jim Freeman Rob Hamilton Garth SundbergRadio Frames Networks Boeing Consultant OSUTel (425) 844-9307 Tel (253) 657-9110 [email protected] [email protected]

2003—PHILADELPHIA, PA 2005—LONG BEACH, CA 2007—HONOLULU, HIJune 8–13, 2003 June 12–17, 2005 June 2007Chairman Chairman Chairman

Richard Snyder Charlie Jackson Mike DeLisioRS Microwave TRW University of HawaiiTel (973) 492-1207 Tel (310) 812-0283 Tel (808) 956-7898 • Fax (808) [email protected] [email protected] [email protected]

2004—FORT WORTH, TX 2006—SAN FRANCISCO, CA 2008—ATLANTA, GAJune 6–11, 2004 June 11–16, 2006 June 2008Chairman Co-Chairmen Chairman

Karl Varian Jerry Fiedziuszko Joy LaskarRaytheon Space Systems/LORAL Georgia TechTel (972) 344-2616 Tel (650) 852-6868 Tel (404) 894-5268 • Fax (404) [email protected] [email protected] [email protected]

John T. Barr, IVHewlett-PackardTel (707) [email protected]

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TRAVEL TO PHOENIXDue to the summer heat, Phoenix was more of a seasonal destination in years past

and airport crowds were winding down in late May. Now the city has grown so much thatit is a popular destination year-round. A number of airlines serve the Phoenix area withboth national and international arrivals. If you travel with America West Airlines, the offi-cial airline of the IMS2001, and the one with the most direct flights into Phoenix, you willfly into Sky Harbor International Airport at Terminal 4 which also serves Southwest Air-lines. There are two other terminals at the airport, numbered 2 and 3 (there is no termi-nal 1) which serve the other airlines. As you exit the passenger areas of the terminalsand follow the signs to baggage claim you will see rental car counters and courtesyphones with which to arrange hotel transportation. Taxis can be hailed outside the termi-nals, usually on the north side. Phoenix is very spread out and it is not easy to walk to anybut the closest destinations, especially if the weather is very hot. The local committeehas addressed transportation needs by arranging shuttle buses between distant hotels,the convention center, and special event destinations. City buses are also available andthe downtown area has a “DASH” shuttle locally, but a rental car is recommended forthose who would like to see more of the city. Parking is abundant and inexpensive any-where in the city, quite unlike many older cities in the United States. Take advantage ofthe convenience of a car if you can.

The area around the convention center is called “Copper Square” and reflects thehistoric importance of copper mining in the development of Arizona. Maps are availablein the main lobby of the convention center and at the concierge desks of the hotels to in-form you of parking areas, attractions, dining, etc. Walking distances downtown aresmaller than in other parts of the city and walking to some museums, restaurants, andshopping can be a great experience. Be careful to protect yourself from too much sunexposure.

LOCALPhoenix, Arizona is a city built on the ruins of an ancient Indian civilization, and prides

itself today in having truly risen from these ashes to become the southwest’s greatestcity. Archaeological evidence indicates that people have been living in the area for morethan 8000 years. From the 8th century through the 14th century the Hohokam people, asociety of desert farmers inhabiting the region, used water from the Salt River in an ex-tensive irrigation canal system. Phoenix was founded by farmers who used the samecanals of the ancient people to irrigate their crops. Many of the present canals that crossthe landscape are the re-dug canals of the ancient Indians, which serve the modern in-habitants quite well. Unlike older cities that trace their heritage back centuries to Euro-pean settlers, the Arizona capitol dates only to the late 1860s. There are no great antiqui-ties, no old ethnic neighborhoods. The city is young, vibrant, and growing, with the metroarea home to almost 3 million people at the present time, and with more moving in everymonth. Over the years, Phoenix has both enjoyed the benefits and suffered the problemsof rapid urban growth. It has gone from a tiny agricultural village to sprawling metropolisin little more than a century. Along the way it has lost its past amid urban sprawl andunchecked development; but at the same time, it has forged an environment that’s quin-tessentially 20th-century American. Shopping malls, the new gathering places of America,are raised to an art form in Phoenix. Luxurious resorts create fantasy worlds of water-falls and swimming pools. Perhaps it’s this willingness to create a new world on top of anold one that attracts people to the area. Then again, perhaps it’s just all that sunshine.Many people have moved to the city for its combination of mild weather, beautifulscenery, and relaxed lifestyle.

Called the “Valley of the Sun,” Phoenix averages 300 sunny days per year. The weatheris warm, sunny and usually dry. Many summer days average over 100°F but low humiditymakes the heat more comfortable than in other hot climates. For all those spendingmuch time outdoors, sunscreen is a necessity to avoid painful sunburn. Be careful todrink plenty of water to avoid dehydration and wear adequate clothing such as a light,long-sleeved shirt and loose-fitting cotton pants. A wide brimmed hat is also a good ideafor outdoor protection. Remember, very little clothing may seem cooler but protectionfrom the sun is very important if you will be under its rays for extended periods.

Phoenix is located in the northern end of the Sonoran Desert, an arid region covering120,000 square miles in southwestern Arizona, southeastern California, and Mexico. Thedesert probably takes its name from the Papago Indian term Sonota, which means “placeof plants”. The Sonoran is probably one of the world’s lushest deserts. The most con-spicuous flora are cacti, including the saguaro, prickly pear, cholla, staghorn, organ-pipe,and barrel cactus varieties. Many cacti can be seen within the city itself, being planted inmany public area and in private yards. The famous saguaro cactus, the “sentinel of thedesert” is found only in the Sonoran Desert and may live to be 200 years old, reach 50feet tall and weigh as much as six tons. At 75 or so, when most humans are headed fortheir last roundup, a saguaro will sprout its first arm. Many saguaros have two to fivearms and a grandpa saguaro may have 50. The region’s reptilian wildlife includes thedesert tortoise, Gila monster, chuckwalla, banded gecko, Colorado desert fringe-toedlizard, desert horned lizard, and numerous species of rattlesnake. If you have the oppor-tunity to view the desert up close, you will see a fascinating, haunting, rock-strewn placefilled with spectacular mountains and unusual plants which in some areas approaches a

fairy landscape. It is highly recommended that you take the time to do a desert tour ofsome type in order to experience this beautiful and wild country first-hand.

Geographically, most of the city is built upon a flat plane with dramatic and jaggedmountain ranges to the north, south, and east. A flat-topped mountain range due east ofPhoenix is the famous Superstition Mountains, site of the “Lost Dutchman Gold Mine.”Several smaller mountain ranges within the city limits are spectacular backdrops to themany palm trees which grace the streets and highways of the city. Phoenix has a high-risedowntown but not to the extent of older cities. Due to the ready availability of empty flatland on which to build, the city has moved out rather than up. Because of the large dis-tances within, Phoenix is best seen by car. Many excellent restaurants, shopping areas,and cultural attractions exist for the visitor. Not to be missed is old-town Scottsdalewhere many fine art galleries and quaint shops can be found. The local committee hasprepared a diverse guest program for those who wish to see Phoenix and various South-west attractions. We hope you enjoy the desert and the city of Phoenix. There is some-thing exhilarating about the dryness, warmth, brilliant light, and the Southwestern expe-rience which we are sure you will not soon forget.

SOCIAL EVENTSRFIC Symposium Reception: All RFIC Symposium attendees are invited to attend a receptionhosted by the RFIC Steering Committee and several leading RF/Wireless IC vendors on Sunday,May 20 from 6:00 PM to 10:00 PM at the Crowne Plaza Hotel. Admission tickets for attendees andone guest will be included in the registration packets.Microwave Journal/MTT-S Reception: All Microwave Week attendees and exhibitors areinvited to attend a reception hosted by Microwave Journal and MTT-S on Monday, May 21 from6:00 PM to 8:00 PM at the Heard Museum, 2301 North Central Ave., Phoenix. Transportation willleave the Civic Plaza starting at 5:30 PM.Industry Hosted Cocktail Reception: Symposium exhibitors will host a cocktail receptionon Wednesday, May 23 from 6:00 PM to 7:30 PM at the Hyatt Regency Hotel. Complementary bever-age tickets will be included in the registration packages.IEEE MTT-S Awards Banquet: The Annual Awards Banquet will be held on Wednesday, May23rd from 7:30 PM to 10:00 PM at the Hyatt Regency. This evening will consist of an elegant dinner,awards presentation and entertainment. The banquet will feature Native American dancers andan after dinner performance by comedian Paula Poundstone.Student Awards Banquet: Student paper awards will be presented at the Student AwardsBanquet on Thursday, May 24 at noon. The banquet is free of charge for all Symposium studentregistrants and advisors.IEEE Women in Engineering Reception: Meet and interact with a panel of distinguishedprofessionals from academia and industry who share common interests in promoting theWomen in Engineering Forum. Build connections with peers, share your background, thoughtsand experiences of common interest to women in engineering. Admission not restricted towomen. This event takes place on Wednesday, May 23, from 5:30–7:30 PM at the Hyatt Regency,Cassidy Room.

MTT-S SPECIAL TUESDAY EVENING EVENTCORONA RANCH & RODEO GROUNDS

TUESDAY, MAY 22, 2001MTT-S 2001 will sponsor a unique southwestern event on Tuesday evening. We have

reserved a fleet of buses that will transport you to Corona Ranch and Rodeo Grounds, lo-cated in the shadow of South Mountain. As you exit your bus, you will be greeted by Mari-achis and Margaritas. Once inside the grounds, the reception will start with a variety ofhors d’hourves and libations to celebrate the spirit of the southwest. Walk around thegrounds and participate in several Cowboy events: See how long you can ride the buckingbarrel (er, we mean “bull”)! Our cowboys will provide roping lessons, after which youwill test your new found skills by roping a mechanical “calf.” And, of course, the activitieswould not be complete without lessons in the quick draw – after which, you will get to tryout your fast draw against your fellow conference attendees! A Country & Western bandwill keep you rockin’ throughout the night.

This special event will include a Rodeo Show that highlights the most exciting por-tions of both Western Rodeo and Mexican Charreada. The Charreada will demonstrateriding, roping, accuracy, and style. The Western Rodeo showcases wild bull riding andwestern style wild bronco riding. Other activities will include precision high speed horsemaneuvers, trick roping, the women’s formation drill team and much more! We will alsohave two very special Audience Participation rodeo events set aside for MTT-S atten-dees! This is one of the best parts of the Rodeo and promises to be a hilarious event.

After the Rodeo, the feast begins…our Cowboy cuisine includes mesquite grilled topsirloin paired with BBQ chicken and western ribs. Mixed greens, baked beans, corn-on-the-cob, fabulous dessert and coffee will round out the dinner. Our buses will whisk youback to your hotel at the end of the evening.

There will be plenty of fun, games and prizes. Tickets are limited. Get ‘em early ormiss out on one of the best events of this year’s Symposium! Transportation will beginboarding at the Civic Plaza at 5:00 PM.

PHOENIX INFORMATION

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Sunday, May 20, 2001, 12:30 PM–4:30 PM Phoenix Valley Area HighlightsThe tour will include the Phoenix, Paradise Valley and Scottsdale areas. As you drive through thedowntown Phoenix area, your guide will point out the Civic Center, America West Arena, Merca-do, Arizona Center, Symphony Hall, Herberger Theater and other points of interest, as well asthe financial and historical areas including the State Capitol. Enjoy views of Mummy and Camel-back Mountain. On your drive through Paradise Valley and Scottsdale, you will see such famoushomes as the Wrigley Mansion, the Hormel Mansion, Barry Goldwater’s home, as well as many ofour famous resorts. Enjoy an hour of shopping in Scottsdale’s famous “Old Town.”Cost of Tour: $27 pp (advance registration); $32 pp (on-site registration) including gratuity

Children under 12: price of adult fare (on-site registration only)

Sunday, May 20, 2001, 8:30 AM–4:30 PM Boyce Thompson ArboretumThe Boyce Thompson Arboretum features more than 2,900 different desert plants. Exoticspecies from around the world thrive alongside native Sonoran Desert plants in this setting. Thisstate park features short trails though Sonoran and Chihuahuan desert areas, a cactus garden,greenhouses and other Southwest desert highlights. The Smith Interpretive Center, between thedisplay greenhouses, houses exhibits on plants and local history. The arboretum’s Demonstra-tion Garden offers tips and examples of water-efficient landscaping design.Cost of Tour: $58 pp (advance registration); $68 pp (on-site registration) including gratuity


Monday, May 21, 2001, 9:00 AM–2:30 PM Native American Cultures TourEnjoy a five-hour tour featuring two of the Valley’s best-known attractions. First visit the PuebloGrande Museum. This excavation of an ancient Hohokam village is an ongoing archaeological dig,with many items from the local Native American cultures on display in the museum. Next, visitthe Heard Museum with its outstanding collection of Native American primitive and modern artsand cultural displays. An included audio tour will let you experience the lives of 15 Native Ameri-cans as they share their stories with you. (Museum admissions and a Native American audio tapetour of the Heard included.)Cost of Tour: $38 pp (advance registration); $45 pp (on-site registration) including gratuity


Monday, May 21, 2001, 8:30 AM–12:00 PM Desert Botanical GardenThe Desert Botanical Garden features a 1.5-mile loop Desert Discovery Trail winds past thou-sands of plants including more than half of the cactus species in the world. Learn what the quali-fications are to be classified as a “cactus.” While you are on the loop, short trails branch off toallow you to learn about other aspects of desert life. Discover how early desert inhabitants mettheir needs from the desert’s resources; how desert plants and animals interact and how Valleyof the Sun residents live in harmony with the desert. Cost of Tour: $38 pp (advance registration); $45 pp (on-site registration) including gratuity

Children under 12: 1/2 price of adult fare (on-site registration only)

Tuesday, May 22, 2001, 8:00 AM–12:00 PM Taliesin WestTour Taliesin West, the distinctive home of renowned American architect Frank Lloyd Wright.Upon arrival at Taliesin West, you will join Panorama, the one-hour guided tour showcasingWright’s brilliant ability to integrate indoor and outdoor spaces through architecture. You willalso visit Taliesin West’s Cabaret Cinema, Music Pavilion, Seminar Theater and Wright’s privateoffice. The compound, linked by dramatic terraces, walkways and splashing fountains, overlooksthe Valley of the Sun and the beautiful Sonoran Desert from the base of the McDowell Moun-tains. Taliesin West is now the home, studio, workshop and office of 70 architects, faculty andstudents associated with the Frank Lloyd Wright Foundation. Cost of Tour: $41 pp (advance registration); $49 pp (on-site registration) including gratuity


Wednesday, May 23, 2001, 8:00 AM–12:00 PM Phoenix Art MuseumAt over 160,000 square feet, the Phoenix Art Museum is one of the largest general visual arts in-stitutions in the Southwest. Phoenix Art Museum offers something for everyone in the family! Itscollection of nearly 16,000 works spans the centuries and emphasizes American art, Asian art,European art of the 14th-19th centuries, Spanish Colonial and Latin American art, 18-20th centuryfashion design and the Thorne Miniature Rooms. In addition, the museum also features specialexhibits that change throughout the year. Recent exhibits include works by of Claude Monet, An-nie Leibowitz and Norman Rockwell.Cost of Tour: $34 pp (advance registration); $40 pp (on-site registration) including gratuity


Wednesday, May 23, 2001, 9:00 AM–6:30 PM Verde Canyon TrainClimb aboard for your panoramic rail experience to Perkinsville through the Verde River Canyon.While on board this four-hour ride, you will have plenty of time to relax and enjoy the views. Thisdistinctive geographical area includes desert rock faces, crimson cliffs and towering bridges ac-cessible only by rail. Don’t be surprised if you see bald eagle, coyote, antelope and other wildlifethat make their home in this rugged terrain! All passengers have access to fantastic open-airviewing cars and the trip features strolling musicians and informative narration. Cost of Tour: $88 pp; 1st class (advance registration) including gratuity

$72 pp; coach (advance registration) including gratuity $105 pp; 1st class (on-site registration) including gratuity$85 pp; coach (on-site registration) including gratuityChildren under 12: 1/2 price of adult fare (on-site registration only)

Thursday, May 24, 2001, 8:00 AM–5:30 PM Sedona/Montezuma CastleVisit Montezuma Castle to view prehistoric Indian cliff dwellings dating back to 1200 A.D. Contin-ue on to Sedona with views of the Chapel of the Holy Cross and a scenic tour of the dramatic redrock areas, which have long been an inspiration to artists, filmmakers and visitors from all overthe world. Enjoy time for lunch and shopping in the many art galleries and shops before headingup Oak Creek Canyon for a spectacular view before returning to Phoenix.Cost of Tour: $56 pp (advance registration); $65 pp (on-site registration) including gratuity


Departs: Thursday, May 24, 2001 at 7:30 AM Sedona/Grand Canyon Combo (overnight in Sedona)Returns: Friday, May 25, 2001 at 8:30 PM

Day One: Begin with a tour through the Sonoran Desert to Montezuma Castle National Monu-ment then on to red rock country. Upon arrival in Sedona, your guide will familiarize you with themany art galleries and shops, and will assist you with check-in to your hotel. You will have the af-ternoon free to shop, take an optional jeep tour, a horseback or mountain bike ride or just takein the local beauty. A trolley pass is included for transportation to galleries or other points ofinterest. Day Two: Arrive at Grand Canyon Village around lunchtime. Enjoy an IMAX theater presentationprior to entering the Grand Canyon. Once at Grand Canyon Village, you will have approx. one-hour for lunch, gift shops, or walk along the rim on your own. Then continue with a 23-mile touralong the rim with stops at additional lookout points. Continue out of the Grand Canyon NationalPark to an authentic trading post on the Navajo Indian Reservation to learn about the cultures ofthe Navajo people and shop for arts and crafts. Cost of Tour: $180 pp double; $212 single occ. (advance registration) including gratuity

$214.50 pp double; $254.50 single occ. (on-site registration) including gratuityChildren under 17 staying with parent: $143 pp (on-site registration only)

Departs: Friday, May 25, 2001 at 7:00 AM Grand Canyon (overnight stay)Returns: Saturday, May 26, 2001 at 8:30 PM

Day One: This tour offers a perfect way for a visitor to spend extra time at the Grand Canyon.Our overnight tour begins with a visit to the dramatic red rock country of Sedona where yourguide will point out some of the scenic highlights and include a coffee and photo stop. Arrive atthe Grand Canyon Village around lunchtime and the guide will assist with check-in at your GrandCanyon area hotel. You will have the afternoon and following morning free to explore on yourown. (Optional air tours are available.) Day Two: Your guide will meet you at your hotel about 12:30 PM to continue with a 22-mile after-noon rim tour with stops at additional overlooks. You will return via the Painted Desert with avisit to an authentic trading post on the Navajo Reservation for shopping before returning toPhoenix. Cost of Tour: $193 pp double; $240 single occ. (advance registration) including gratuity

$230 pp double; $290 single occ. (on-site registration) including gratuity Children under 17 staying with parent: $160 pp (on-site registration only)

Friday, May 25, 2001, 7:00 AM–8:30 PM Grand Canyon via Sedona & Navajo Nation Begin with a fully narrated tour of the Sonoran Desert en route to the beautiful red rock countryof Sedona for a coffee break and rest stop. Continue on the scenic 17-mile drive through OakCreek Canyon, through the pine forests of Flagstaff and arrive at the Grand Canyon at lunchtime.Approximately 3–4 hours will be spent at the Canyon, allowing time to enjoy lunch at one of theGrand Canyon Lodges or picnic and take a walk along the rim, as well as shop in the gift shops.After the lunch hour there will be a 23-mile rim tour with stops at a few of our favorite view-points. Your next stop will be at a trading post on the Navajo Reservation with the Painted Desertas a backdrop. There, you may buy directly from the Navajo people and learn about their culture. Cost of Tour: $83 pp (advance registration); $99 pp (on-site registration) including gratuity


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IMS 2001 Symposium Week at a Glance

M N A E M N A E M N A E M N A E M N A E M N A E

SUN/20 MON/21 TUE/22 WED/23 THU/24 FRI/25

2001 IEEE MTT-S INTERNATIONALMICROWAVE SYMPOSIUMPhoenix, AZ • May 20–25, 2001

Activity Location

IMS Technical Sessions Civic PlazaWorkshops & Short Courses Civic PlazaPlenary Session Symphony HallInteractive Forum Civic PlazaPanel Sessions Civic PlazaRump Session Hyatt

Exhibits µAPS Civic Plaza

RFIC Technical Sessions Civic PlazaIMS Joint Session Civic PlazaPlenary Session Civic PlazaInteractive Forum Civic PlazaWorkshops Civic PlazaPanel Session Civic Plaza

ARFTG Conference Crowne PlazaExhibits Crowne Plaza

Social Workshop Bkfst, Lunch TerraceMTT Member Breakfast TerraceRFIC Reception Crowne PlazaMJ Reception Heard MuseumIndustry Reception HyattMTT Awards Banquet HyattStudents Awards Banquet HyattSpeakers Breakfast HyattARFTG Breakfast Crowne PlazaARFTG Awards Lunch Crowne Plaza

microwave conference

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