microscribe.pdf
TRANSCRIPT
go measure3d.co m http://gomeasure3d.com/products/lbp/microscribe/
Portable Measurement Made Easy
MicroScribe
MicroScribe Systems: Solutions for Inspection, Reverse-engineering,and 3D Digitizing
MicroScribe® articulated-arm digit izers and portable CMMs, along with the industry’s leading sof twarepackages, let you easily, quickly, and af f ordably construct detailed computer models, perf orm accurate partinspections, and complete reverse engineering projects.
MicroScribe M Series
MicroScribe MX
portable CMMs of f er metrology level accuracy, an easy-to-usearticulated arm design, and seamless integration with the most popularreverse engineering and metrology sof tware packages.
The MicroScribe portable CMM supplies a new, more cost-ef f ectivealternative f or manuf actured parts inspection, reverse engineering, andhigh-accuracy 3D digit izing.
Flexible articulated arm technology
Metrology- level accuracy
Portable and easy to use
Third party sof tware compatible
Reliable, proven MicroScribe technology
MicroScribe G Series
MicroScribe® G is an accurate, af f ordable 3D digit izing system. A f avoriteof animators, engineers and designers, MicroScribe products capture thephysical properties of three-dimensional objects and accurately translatethem into complete 3D models.
Kreon Skiron Laser Scanner
The new laser scanner f rom Kreon f or six degrees-of - f reedom (6DOF)MicroScribe digit izers and portable CMMs sets a new price/perf ormancepoint, supplying a f ast, non-contact laser scanning solution f or 3Dapplications.
For a f raction the cost of comparable 3D laser scanners,MicroScribe digit izers and portable CMMs with the Kreon Skiron 3Dlaser system quickly collects point-cloud data of 3D objects. Whereconventional point-and-click digit izing or measurement may takehours or days, laser scanning can produce the same or higherresolution data in minutes. Sof tware transf orms point cloud datainto polygon data stored in industry-standard f ile f ormats. Polygonsare suf f icient f or many applications including rendering andvisualization, rapid prototyping, and physical analysis.