As more features are integrated into semiconductors, such as processors used in computer graphics, high speed computing etc., these devices require higher power to function. In today’s electronic products, liquid cooling has become a solution for many high power applications such as transportation, blade servers, solar cell conditioners, digital cinema projectors, high power laser generators etc. Microfins is “the real cool ready solution” for high power semiconductors requiring better transient response. It contains microscale copper channels for fluid flow and removes heat with very high efficiency. Microfins removes heat from the device under operation and maintains the desired temperature uniformly at rates 8X faster, 4X smaller in size and 2X better thermal resistance than any air-cooled devices in the market today.

Microfins is formed in copper plates using a proprietary process that creates a microscale structure with extremely high heat transfer coefficient and low resistance to fluid flow. This is embedded in a high temperature plastic housing measuring 56 x 67 x 36 mm, containing a micro pump. The working fluid operates in single- or two-phase regime depending on the application. A small pump circulates the fluid through the Microfins in the housing acquiring heat from the device in operation and maintaining a uniform temperature on the surface of the device. The cooled fluid is pumped to a heat exchanger, converted to a cool temperature, and returned to the Microfins, thus completing the cycle.

How does Microfins work?

Smallin size,Big in performance

8Xfaster in temperature change4Xsmaller in size

2Xbetter thermal resistance

A Liquid Cooled Heat Sink

Microfins (liquid cooled)

KESI located in Phoenix, Arizona designs, manufactures and sells standard products as well as customized solutions for a wide range of applications. For more information, contact customer service at the following address: -

For further information, kindly contact:-KES Systems, Inc.

1407 West Drivers Way, Tempe, AZ 85284Tel: (480) 747-9237 | Email: sales@sunright.com

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Single / Two Phase Micro Channel Cooling Capability Temp vs time for max cooling

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Microfins is ideal for high power semiconductor devices and equipment requiring quick temperature changes and response for testing purposes. As an example, it has the ability to lower the temperature from 95°C to 25°C in 60 seconds.

•23oC hotter than Microfins •Doublingairflowrateonly

improves 3oC •Poorcontrollabilitylimitshigher

power capability

•80Wdevicecanbecooledbelow 50oC

•Excellentmarginforcontrollingdevice transients

•Roomforgrowthintohigherpower & smaller “device under test”

8X Faster In Temperature Change

Heat Sink Microfins

4X Smaller In Package Size

Heat Sink (Air Cooled) Microfins (Liquid Cooled)

Microfins outperforms conventional heat sinks because of a proprietary manufacturing process that enables this new heat transfer technology. The superior performance results are shown below: -

2X Better Thermal Resistance

Heat Sink(Air Cooled)

Microfins(Liquid Cooled)