microbond sop 91121 lead free solder paste platform · the data given here is valid. we reserve the...
TRANSCRIPT
Microbond SOP® 91121Lead Free Solder Paste Platform
The
data
giv
en h
ere
is v
alid
. We
rese
rve
the
right
to m
ake
tech
nica
l alte
ratio
ns.
E 02
.201
6/N
Layo
ut: d
ata-
grap
his_
HET-
Mar
ComThe SOP 91121 Solder Pastes Series is a state of the art
no clean lead free solder paste that promotes outstandingwetting. The fl ux system is specifi cally optimized for lead free alloys such as the SAC series. This formula providessuperior performance on a variety of surfaces and leavesa clear residue after refl ow.
Key Features: § Flux Platform for several alloys with outstanding results:
■ Switching from one alloy to the other without costqualifi cation
■ SAC305, SAC405, SAC105 and SAC0307,Innolot § The Microbond SOP 91121 solder paste is based ona no clean fl ux “L0” (acc. J-std 004A) § Flux after soldering is very clear and transparentHigh printing defi nition § Good wetting on all fi nishing surfaces when solderedin air as well as N2 § Optimized voiding behaviour on BGA and Large Area § Over 1 day stencil life and tack time
Further members of the Microbond SOP lead free solderpaste family:
Microbond SOP 91123 § Type 4 Platform § Anti Capillary §Halogen Zero § Incl. Innolot High Reliability version
Microbond SOP 82141Halogen zero §Water Soluble §Halogen Zero
Outstanding WettingThe fl ux formulation of thenew lead free platform has been developed to provideexcellent wetting with different alloys, as well as for application on different metal surfaces.
Voiding OptimizationUnder BGAs, as well as under large area components, the solder paste does not produce big voids. It represents the right compromise within both conditions, ball and area.
Print Defi nitionLine resolution and print defi nition stability is one of the major benefi ts of our long experience in printing technology. The SOP 91121 provides high defi nition at T0 and after long printing waiting time.
Flux AppearanceThe SOP 91121 was also developed to provide aesthetic appearance with transparent fl ux, without showing air bubbles inside.
PBC-FinishAtmosphere
chmSn
NiAu
OSP
Wetting with Profi le HLFPPrint
Nitrogen
Stencil-Thickness 150µm
Line
Res
olut
ion
[µm
]
260
240
220
200
180
160
140
45˚
vertical
horizontal
2 5 9 10 15
Print Direction
Stencil Underside Cleaning after 10th print
Stencil-Thickness 120µm
Line
Res
olut
ion
[µm
] 260
240
220
200
180
160
140
45˚
vertical
horizontal
2Stencil Underside Cleaning after 10th print
5 9 10 15
Print Direction
Heraeus ElectronicsHeraeus Deutschland GmbH & Co. KG Heraeusstraße 12-1463450 Hanau, Germanywww.heraeus-electronics.com
AmericasPhone +1 610 825 6050 [email protected]
Asia PacificPhone +65 6571 7677 [email protected]
ChinaPhone +86 21 3357 5457 [email protected]
Europe, Middle East and Africa Phone +49 6181 35 3069
+49 6181 35 3627 [email protected]
The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to determine materials suitability for particular application.