Micro mechatronics 1part 2: substratesbasic informations

Prof. Fritz J. NeffDirector of the Laboratory for Micro mechatronics and Hybrid integrated thick film circuitSat the University of AppliedSciences Karlsruhe (FH), 16. August 2004

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Some important materials

Glass substratesceramic substratesenamel laminated metal- / steel

substrates until 650°Cenamel of Kaolin, Feldspat, Quarz

ceramic laminated metal substratesup to 900°Cpolymer laminated metal substratessolid and flexible materials

Kapton or Mylar for foil key boardssilicon

Prof. Fritz J. Neff, Steinbeis TZ Mechatronik-Karlsruhe 3

3 important technologies

Substrate materials used for

Thick film technology Thin film technology Printed circuit boards

ceramicslaminated metal

substrates amorph kristalin solid materials flexible materials

diamond glass

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Thick film technology

Thick film technology

ceramics laminated metal substrates

enameldmetal substrates

ceramic laminated metal substrates

Polymer laminated metal substrates

Aluminiumoxid-ceramics

Berylliumoxid- ceramics

Aluminiumnitrid- ceramics

Siliziumcarbid and Siliziumnitrid- ceramics

diamond glass

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Metal laminated ceramic substrateslaminated metal substrates

Isolation (enamel, ceramics, Polymer)

Through hole contacts

Metal coreMetal core

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CVD-diamond substrates

Thermal conductivity (W/m·K)

0 500 1000 1500 2000

AlN

BeO

Cu

TM100

TM150

TM180

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Technologies for PCBs

Technologies for PCDs

Solid basic materials Flexible basic materials

Polyester resin

Polyimid resin

Liquid Crystalline Polymer LCP

Carrier materials:-Paper

-Glass fleece-Glass tissue

-ceramics-aramid

-Quartz glass

Polyethylen-Naphtalat PEN

Glass tissue

Fixing agents:-Phenolic resin

-epoxies-Polyester resin-Polyimid resin

-Bismaleinimid-Triazin-Cyanat ester

-Polyetrafluorethylen

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Materials for printed circuitboards

Carrier material Fixing agent Standard abreviation(NEMA LI-1)

Papier Phenolharz XXXP, XXXPC

Papier Phenolharz (selbstverlöschend

FR2

Papier Epoxidharz(selbstverlöschend)

FR3

Glasgewebe Epoxidharz G10, G11

Glasgewebe Epoxidharz(selbstverlöschend)

FR4, FR5

Glasmatte Polyesterharz FR6

Papier-Glasgewebe Epoxidharz CEM1, CEM2

Glasmatte-Glasgewebe Epoxidharz CEM3, CEM4

Glasmatte-Glasgewebe Polyesterharz CRM5, CRM6

Glasvlies-Glasmatte Polyesterharz CRM7, CRM8

NEMA = National Electrical Manufactures Association, USA // FR = Flame resistantSelbstverlöschend: durch Zersetzung von Tetrabromdian entsteht flammlöschendes Gas

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Multilayer solid and flexible

Copper foil

Carriermaterial

Layer of fixing agent

a b c d e

a, e: copper (roled copper or electrolythic copper foil)b, d: glue (Epoxid resin, …)c: carrier foil (Polyester, PEN, Polyimid, Glass tissue, special foils f.e.

Kapton)

Prof. Fritz J. Neff, Steinbeis TZ Mechatronik-Karlsruhe 10

Substrates for thin film technology

Thin film technology

amorph cristallin

Silicon

Silicon oxid

Silicon nitrid

Bor-Silicat-glass

Quartz glass

Aluminiumsilicat-glass

Alkali glassdiamond

Silicon

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3-D Molded Interconected Devices(3-D MID)

Conductor lines arerealized by laser treatment

and metalisation.

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Specifications for special substrates

Standardabreviation

Organisation Land of origin

IEC International Electrotechnical Commission International

DIN Deutscher Industrie Normenausschuss Deutschland

BS British Standards Institution Japan

JIS Japanese Industrial Standard Association USA

IPC The Institute for Interconnecting and Packaging Electronic Circuit

USA

MIL Department of Defence(Military Specifications and Standards)

USA

UL Underwriter’s Laboratories Inc. USA

NEMA National Electrical Manufactures Association USA

ANSI American National Standards Institute USA

ASTM American Society for Testing Materials USA

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series of materials

Silicat ceramics Oxid ceramics

carbidicnone oxide ceramics

nitridicnone oxide ceramics

none oxide ceramics

technical ceramics

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High-performance ceramicsHigh performance cermics

Silicat ceramics Oxid ceramics None oxide ceramics

porcelain

Steatit

Forsterit

Cordierit

Mullit

Aluminium oxide

Silicon oxide

Zirkonium oxide

Magnesium oxide

Oxid of titanium

Beryllium oxide

Silicon carbid

Bor carbid

Aluminium nitrid

Silicon nitride

Nitride of titanium

Bor nitride

Boride of titanium

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Silica ceramics (technical porcelaine)

Essential components: fire clay, chamotte, kaolin, feldspar und steatiteas carrier of silicat. With the high presence of theese raw materials the prices are low.Further componts like alumina and zircon areused to realize special features:

examples:Steatit MgSi4O10(OH)2 good for thin film layersCordierit 2MgO*2Al2O3*5SiO2Porcelaine (feldspar/quartz/kaolin)

surfaces

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Problems of technical surfaces

contaminationadsorption layer

oxide layer

deformed layer

base metal

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oxide ceramicsmore than > 90% monophase and single

component metal oxide, synthetic raw materials with high degree of

percentage purity, manufactured with high tempertures while sintering offer veryhomogenous texture. examples:

Aluminium oxide (alpha-Al2O3)Magnesium oxide (MgO)Zirkonium oxide (ZrO2)Aluminium titanat (Al2TiO5)

Prof. Fritz J. Neff, Steinbeis TZ Mechatronik-Karlsruhe 18

None oxide ceramicsAre compounds of silicon and aluminium withnitrogen or carbon.They have a high degree of covalent bonds, which result in very good mechanical featuresalso during high temperatures.examples:Silicon carbid (SiC)Silicon nitrid (Si3N4)Aluminium nitride (AlN)Bor carbide (B4C)Bor nitride (BN)

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Aluminium oxide ceramics

Most important substrate materialAl2O3 is a white powder transforming to ionic α-Phase (Korund) when reaching1100°C.α –Al2O3 builds with O²-Ions a hexagonal dense shere packing.Because of high linkage energy theoxide-bonds are very stable, insulatingand chemical resistant.

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Types of lattice

HexagonalSphere packing:each atomis surrounded by 6other atoms.

Z1

Z2

Z3

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Effects of Al2O3-quotaAl2O3-quota(%)

85 99 99,7

Compressivestrength(N/mm²)

1800 2000 2500

Spec. resistance (Ωmbei 600°C)

4 x 10 4 5 x 10 7 4 x 10 8

Max. hardeningtemperatur(°C)

1300 1500 1700

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Influence of surface structure

Oberflächenstruktur Rubalit 708S: 96% Al2O3 – Rubalit 710: 99,6% Al2O3

/CERAMTEC/

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Al2O3-application

Fireproofed material (meltingtemp. 2050°C)chemical and mechanicalstressed parts/detailsMaterial for insulationCutting toolsGrinding pastesMedical implants

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More Oxid-ceramics

Berylliumoxidemelting temp. 2585°Ctoxic

Zirkoniumoxidemelting temp. 2690°Cat ca. 1100°C change of lattice from monoklin to tetragonal and thereby 3% growth of volume

Magnesiumoxidemelting temp. 2800°C

Micro mechatronics 1�part 2: substrates�basic informationsSome important materials3 important technologiesThick film technologyMetal laminated ceramic substrates� laminated metal substratesCVD-diamond substratesTechnologies for PCBsMaterials for printed circuit boardsMultilayer solid and flexibleSubstrates for thin film technology3-D Molded Interconected Devices (3-D MID)Specifications for special substratesseries of materialsHigh-performance ceramicsSilica ceramics (technical porcelaine)Problems of technical surfacesoxide ceramicsNone oxide ceramicsAluminium oxide ceramicsTypes of latticeEffects of Al2O3-quotaInfluence of surface structureAl2O3-applicationMore Oxid-ceramics