S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal

Micro Electro Mechanical SystemsMEMS - Small Devices for Large Jobs

S. MeenatchisundaramFaculty

ICE, MIT, Manipal

meenasundar@gmail.com

1

S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal

Lecture #01

Micro Electro Mechanical Systems

– An Overview

2

S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal

Reference Books & Materials

� Tai Ran Hsu, MEMS and Microsystems Design and Manufacture, Tata McGraw Hill, 2002.

� Chang Liu, Foundations of MEMS, 2 ed., Prentice Hall, 2012.

� M. Bao, Analysis and Design Principles of MEMS Devices, 1 ed., Elsevier,2005.

� S. Beebey, G. Ensell and N. White, MEMS Mechanical Sensors,Boston: Artech House, 2004.

� Stephen Senturia, Microsystem Design, Springer, 2001.

� An Introduction to MEMS, Prime Faraday Technology Watch – January 2002

3

S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal

Contents

1. What is MEMS?

2. Evolution of MEMS

3. Moore’s law and beyond

4

� Micro-Electro-Mechanical Systems (MEMS) is the integration ofmechanical elements, sensors, actuators, and electronics on a commonsilicon substrate through micro fabrication technology.

� A technology to create any integrated devices or systems that combinemechanical and electrical components. These devices have the ability tosense, control and actuate on a micro scale and generate effects on macroscale.

� A device that consists of micro machines and microelectronics where micromachines are controlled by microelectronics.

� A system or a device that has static and movable components with somedimension on the scale of micron.

� By combining IC’s with mechanical parts, MEMS are complete systems ona chip.

What is MEMS?

5S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal

What is MEMS?

6S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal

� In the most general form, MEMS consist of mechanicalmicrostructures, microsensors, microactuators and microelectronics, allintegrated onto the same silicon chip.

What is MEMS?

7S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal

What is MEMS?

8S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal

What is MEMS?

9S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal

Evolution of MEMS

10S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal

1950’s

• 1958 Silicon strain gauges commercially available

• 1959 “There’s Plenty of Room at the Bottom” – Richard Feynman gives amilestone presentation at California Institute of Technology. Issues a publicchallenge by offering $1000 to the first person to create an electrical motor smallerthan 1/64th of an inch.

1960’s

• 1961 First silicon pressure sensor demonstrated

• 1967 Invention of surface micromachining. Westinghouse creates the Resonant Gate Field Effect Transistor, (RGT). Description of use of sacrificial material to free micromechanical devices from the silicon substrate.

1970’s

• 1970 First silicon accelerometer demonstrated

• 1979 First micro machined inkjet nozzle

History of MEMS

11S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal

1980’s

• Early 1980’s first experiments in surface micro machined silicon. Late 1980’s micromachining leverages microelectronics industry and widespread experimentation and documentation increases public interest.

• 1982 Disposable blood pressure transducer

• 1982 “Silicon as a Mechanical Material”. Instrumental paper to entice the scientific community – reference for material properties and etching data for silicon.

• 1982 LIGA Process

• 1988 First MEMS Conference

1990’s

• Methods of micromachining aimed toward improving sensors.

• 1992 MCNC starts the Multi-User MEMS Process (MUMPS) sponsored by Defense Advanced Research Projects Agency (DARPA)

• 1992 First micro machined hinge

• 1993 First surface micro machined accelerometer sold (Analog Devices, ADXL50)

• 1994 Deep Reactive Ion Etching is patented

• 1995 BioMEMS rapidly develop

• 2000 MEMS Optical-networking components become big business

History of MEMS

12S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal

History of MEMS

13S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal

Moore’s Law

Gordon Moore (Co-founder of Intel) predicted in 1965 that the transistor density ofsemiconductor chips would double roughly every 18 months.

14S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal

Beyond Moore’s Law

MOSFETs using new materials must be fabricated on Si substrates in order to fullyutilize Si CMOS platform, meaning the necessity of the co-integration of III-V/Ge on Si.

15S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal