metallization and functional structures by aerosol jet ... · metallization and functional...

117.10.2012

Optomec Aerosol Jet User Group Meeting 2012

Aerosol Jet International User Group Meeting

Metallization and Functional Structures by Aerosol Jet deposition

Andreas Brose

Institut für Mikro-

und SensorsystemeLehrstuhl Mikrosystemtechnik

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Optomec Aerosol Jet User Group Meeting

IntroductionOtto‐von‐Guericke‐University Magdeburg

MEMS MID Reliability

Chair ofMEMS‐Technology

Institute for Micro and Sensor Systems (IMOS)

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Facilities

R & DDesign and Simulation lab

(30m2)

MEMSMEMS-cleanroom

(class: 100, 150m²)

ReliabilityReliability lab

(50m²)

PackagingPackaging labs

(72m² + 100m²)

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3D-MID activities

EquipmentEquipment

• 1&2-shot injection molding

• LDS/Hot embossing/Aerosol-Jet® deposition

• PVD/Galvanic/ElectrolessPlating

• Soldering/Wire Bonding/Flip-Chip

• electric characterization withenvironment simulation

• X-ray Analysis

ServicesServices

• Consultation/Conceptual Design

• Simulation/CAD

• Prototyping/Pilot Run

• Testing & Qualification

• Reliability of Chip on MID/Flex

• Product Miniaturization by MID

• Medical MID Systems

• MID Sensor Structures

Research Research ––

MEMS on MIDMEMS on MID

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Pattern generation

additive subtractive

masked processes maskless processes

Screen printing Stencil printingThin filmprocesses

Inkjet Aerosol Flamecon

Nano particle inks

Catalytic seed layer(MicroCat)

Passivation / Isolation(non conductive)

Function materials(resistors, piezoelectric, medicals, …)

Metallization

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Aerosol Jet System @ IMOS

moving stage

Aerosol generation

deposition head

camera

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Overview: applicated inks

• Nano particle based inks

- Silver, Gold, Platinum, Copper

• Catalytic ink (MicroCat)

-

Seed layer for additional plating

processes

• Function- and isolation layers

-

Dielectrics (adhesives, resists),

Piezoelectrics (PZT)

• Sintering necessary

• Layer thickness < 1µm

• Electroless plating of

Cu/Ni/Au

• No thermal treatment

• Viscosity up to 1000cP

• Particle size up to 500nm

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2D-metallizations

Gold electrodes on MEMS-Chip

Platinum electrodes on Langasite (LGS)

micro cantilever

RF-resonant circuitSilver on glass (Pyrex)

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3D-metallizations

• cooling device for high-power LED module

• Silver deposition on ceramic heat sink (AlN)• challenge: covering the edges

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3D-metallizations

• cooling device for high-power LED module• nano-copper ink (Intrinsiq Materials, Inc)• sinter process: laser sintering (Nd:YAG)

• difficult wetting behavior→ heating substrate and ink

• insufficient jetting stability

• improvable conductivity

Copper issues:

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Catalytic ink process flow

• Aerosol Jet deposition of catalytic ink

- contains Palladium, 2component-adhesive, organic solvent

• Drying step

• Activation by reducing agent

• Electroless plating of

- Copper/Nickel (NiP)/Gold

• Low temperature process→

no sintering

• good conductivity• solderable surface• noncorrosive

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Antenna on 3D-MID

4 working planes

continuous pattern

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Reliability testing

measuring and comparing the shear strength of SMDs mounted on MID-substrates

metallization by aerosol deposition of catalytic ink

LDS-metallization

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Catheter marker for MR imaging• insufficient contrast between polymer

catheter and human tissue

• minimal invasive surgery requires newtools for better imaging

• Idea: local amplification ofmagnetic field with resonantcircuit at the catheter tip

• 1st discrete version: coiledcopper wire and SMD capacitor

• Objective: integration by AerosolJet metallization

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MRI-Marker for catheter devices

printed helix with catalytic ink

electroless plating

return loss S11

loose coupling with measure coil

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MRI-Marker – Multi layer layout

metal 1: Cu (electroless plated)

dielectric: PET heat shrink tubing

metal 2: Cu/Au (electroless plated)

C

L

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Validation with 3T-MRI

• Working Markersprovide positiveimage contrast

• Positive contrastenables computer- assisted tracking

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3 Tesla-MRI installed at University of Magdeburg in September 2012

• Only for scientific use!

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Function materials

• Passivation layers

-

Selective deposited protective

coating for encapsulation of SMD

components

• PZT-layer on silicon membrane

-

PZT-powder containing suspension

(95% of the particles < 300nm)

- average layer thickness: 3µm

- sintering at 600°C

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layer thickness (µm)

perm

ittiv

ity

Function materials

• Permittivity of Aerosol Jet deposited

PZT film higher than screen printed

and electrophoretic deposited films

• X-ray analysis showed inhomogeneous

film thickness

X-ray analysis:

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Aerosol coating of CMUT-gas sensor

membrane

cavity

substrate

0.2 mm

2.6 mm

single element

In cooperation with chair of measurement and sensor technology at OvGU

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Material Abbreviation State Solvent Solvents’ BP (℃)

Concentration(mg/mL)

Methyl-β-Cyclodextrin β-CD Solid Ethanol 78.4 3 or 6

4-tert-Amyl-Calix[8]arene CA Solid Chloroform 61.2 0.5

Polyethylenimine PEI Liquid Water 100 1.5

Cyanopropylphenyl Dimethylpolysiloxane OV 225 Liquid Ethyl

acetate 77.1 3

Polydimethylsiloxane PDMS Liquid Ethyl acetate 77.1 3

• Multi-channel CMUT coated with various sensing materials

- Enables sensor array to analyze gas mixtures

Coating materials:

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Aerosol Jet coating

Advantages:

• precise patterning

• controllable output volume

• thin and uniform layers

Coffee ring

dropping with micro pipette


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Contact

Andreas BroseOtto-von-Guericke-University MagdeburgIMOS

Phone: +49 (0) 391 / 67-58227Fax: +49 (0) 391 / 67-12609eMail: [email protected]

metallization and functional structures by aerosol jet ... · metallization and functional...

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