mems/nems technology and devices lecture 1: introduction amn- 606 mems/nems technology and devices...
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AMN- 606 MEMS/NEMS Technology and Devices
Lecture 1: Introduction
Dr. Hassan Mostafa
Cairo University
Fall 2018
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Course Information
Course website:
http://scholar.cu.edu.eg/hmostafa/classes/amn606
Office hours by email appointments
Instructor office:
Electronics & Communications building, Top floor, Room 8414
This course
cover basic MEMS/NEMS fabrication technologies
various transduction mechanisms
piezoelectric, thermoelectric, thermionic, and piezoresistive
cover the theory of operation of few sensors/actuators
infrared detectors, radiation sensors, rotation and acceleration sensors, flow sensors, pressure and force sensors, and motion sensors
MEMS/NEMS Cairo University 2
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Course Information
Textbook reference:
An Introduction to Microelectromechanical Systems Engineering (Artech House Mems Library) by Nadim Maluf
Optional references
Fundamentals of Microfabrication by Marc J. Madou
Micromachined Transducers Sourcebook by Gregory T. A. Kovacs
Marking scheme
30% Course Project
70% Final Examination
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Really small devices
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10,000 Meter Scale
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1,000 Meter Scale
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100 Meter Scale
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10 Meter Scale
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1 Meter Scale
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0.1 Meter Scale
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10 mm Scale
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1 mm Scale
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100 micrometer Scale
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10 micrometer Scale
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1 micrometer Scale
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0.1 micrometer (100 nm) Scale
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(<10 nm) Scale
The realm of molecules, DNA, proteins, and atoms.
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What are MEMS/NEMS?
MEMS/NEMS = Micro/Nano-Electro-Mechanical Systems
Tiny machines (micro and nano scale)
Not just micro/nano-fabrication
Enabling technology to augment as they are fabricated for a specific application (non-standardization)
Miniaturization for performance enhancement
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Optical Switch from
Lucent
Lab-chips from
Agilent
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Examples
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Microphone from
Knowles Digital Micro-mirrors
Device (DMD) from TI
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Examples
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Inkjet Nozzle from
HPAccelerometer from
Analog Devices
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Examples
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Micro-scale gear chains
Micro-scale guitar
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Examples
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Needle without pain
Roboroach
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Examples
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History
There’s plenty of room
at the bottom
1959
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Richard Feynman
What I want to talk about is the problem of
manipulating and controlling things on asmall scale.
It is a staggeringly small world that isbelow. In the year 2000, when they lookback at this age, they will wonder why itwas not until the year 1960 that anybodybegan seriously to move in this direction.
Why cannot we write the entire 24volumes of the Encyclopedia Brittanica on
the head of a pin?
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Interdisciplinary
Traditional
Above mm: traditional mechanics
Micron to mm: microelectronics and electrical engineering
Nanometer to micron: chemists
Now
Micro
Nano
Engineering
Biology
Chemistry
Feeds each other
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MEMS Fab in the world
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MEMS Advantages
MEMS devices integrate multiple functions like sensing, decision making and control functions on a single chip
High Sensitivity
Portability
Batch fabrication reduces manufacturing cost and time
Low power consumption
Easy to maintain and replace
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Introduction to MEMS
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Micro/Nano Fabrication
No such thing as “Shrinking machines”
Must learn how to build them small
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Micro/Nano Fabrication
Top-Down
Start from bulk substrate and remove materials to form the desired structure
Similar to forming a statue from a large rock
Example: Photo-lithography
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Micro/Nano Fabrication
Bottom-Up
Start from atoms to form the desired structure
Similar to LEGO bricks
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Micro/Nano Fabrication
Bottom-Up
Example: using Atomic Force Microscope tip
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Micro/Nano Fabrication
Clean room facility:
Originally developed by NASA for satellite manufacturing
Clean rooms now in use for all MEMS and semiconductor
manufacturing.
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Micro/Nano Fabrication
Clean room facility:
Particle free walls, furniture, and accessories must be used
Airflow through 0.3 microns filters
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Micro/Nano Fabrication
Clean room facility:
Main function of clean rooms is control of particle contamination
Requires control of air flow, water and chemical filtrations,
human protocol
Class N clean room means fewer than N particles (>0.5 µm) in
1 cubic foot of air
Classes types:
Class 10,000
Class 1,000
Class 100
Class 10
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Micro/Nano Fabrication
Clean room facility:
Class 10,000 Class 1,000 Class 100 Class 10
PCBs, MEMS, MEMS,ICsPackaging, Packaging, RF/Photonic ICs
Medical devices Hard disk drives
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Photolithography
Coat, protect, expose, etch, repeat…
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Photolithography
Start with wafer (a clean, flat surface)
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Photolithography
Grow a thin film of desired material
Coating in furnace
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Photolithography
Spin coat photo-resist layer Photo-resist goes wet and dried after spin
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Photolithography
Expose photo-resist to UV light through a mask Mask is aligned to wafer before exposure
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Photolithography
Resist is removed from exposed areas
Remaining resist reproduces the mask pattern
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Photolithography
Resist protects selected regions during etch
Pattern is transferred to substrate material
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Packaging
For the micro-device to be useful, it must be “packaged”
80% of the MEMS cost is in packaging
Packaged device can be inserted into system