MEMS Price+

For a long time, the production cost evaluation of MEMS has been limited by theextreme variability of MEMS processes. MEMS Price+ breaks this barrier with a costmodel mixing global parameters and technologies.

• The simulation is based on a description of the structure (dies dimensions andfunctions), and the selection of the technology from a comprehensive database.

• A fine knowledge of the MEMS or IC processes is no more necessary to operatean accurate cost simulation.

OPEN TECHNOLOGY MODELSEstimate your MEMS wafers for morethan 30 technologies from varioussuppliers. Updated with new processesdetected and analyzed by System PlusConsulting.The model for IC is using a generator tosimulate most of technology variationsdown to 22nm CMOS, includingBiCMOS, BCD and more.

MARKET FEATURESCommercial price versus quantity rulescan be set to fit precisely your market.

System Plus Consulting has published more than 100 devices reverse costingreports on MEMS devices, and has used its expertise to propose an efficient andeasy-to-use cost simulation tool able to simulate most of the MEMS technologies inproduction.

MEMS Price+ allows to calculate the production cost and selling price of a wafer,die, packaged MEMS or System-in-Package including an unlimited number of dies.The tool includes a comprehensive database of the main players MEMS processes.

A SMART TOOL FOR PURCHASING & MARKETING DEPARTMENTS

A POWERFUL TOOL BASED ON SYSTEM PLUS REVERSE COSTING

COSTING TOOL FOR MEMS DEVICESSimulate the production cost & selling price of MEMS devices, including ASICs, packaging and related components.

Database Update - Smart - Powerful

EASY TO SETUPMEMS Price+ is working from a singleMS-Excel™ file and an external andsharable data file.

The tool requires only basic MS-Excel ™or MS-Office™ suite (from 2007 to 2013release).

SUBCONTACTING OPERATIONSCosts of usually externalized operationscan be precisely evaluated by settingtheir individual regional and commercialparameters.

WORKGOUPData are stored in an external MS-Access™ database file. Data cannot beread from the single Excel file andaccess rights to the database areneeded. Multiple access, data sharingand data integrity are secured.

OPEN-FORMATYou can modify or export final results,and build reports your own style as inany Excel workbook.

Reference database includes Fab Units and Technologies, MEMS & ASIC Manufacturers and Packages

PARAMETRICTOOL

MAIN FEATURES

• Support of multiple chips mixingMEMS dies and IC dies

• The MEMS technologiesdatabase includes more than 30processes

• The IC cost model supportsmultiple technologies

• Back-end simulator allows todescribe specific packages andtest conditions

PRICE:

CorporateLicense: EUR 11,0001 year support: EUR 3,300*

SiteLicense: EUR 8,0001 year support: EUR 2,400*

*First year support is compulsory

• Parts description IC or MEMS, die dimensions

• Fab Unit description profile, wafer size, minimum technology size, clean room & equipment parameters

• Technology description, substrate, process parameters OR device type, transistor size, functions, building processes details

• Wafer backend details, temperature range & test flow , back grinding, bumping and dicing, technologies, and parameters, probe test equipment

• Assembly options, Package characteristics, panelizationparameters, PCB description, wire bonding parameters and other options

• Final test details

• Manufacturer & foundry financial statements

• Commercial data delivery schedule, market position of the component, life cycle details, quantity / price data

• Wafer cost breakdown manufacturing cost, raw wafer cost, labor cost, yield losses…

• Die cost breakdown

• Assembly cost breakdown

• Component cost breakdown

• Yields versus time

• Manufacturing cost versus time

• Selling prices versus time

Up to 5 scenarios

MEMS Price+

INPUT OUTPUT

Input/Output

Cost Breakdown

Cost of parts 0.4039$

Substrate / leadframe 0.0780$ 42.6%

Clean Room 0.0060$ 3.3%

Equipment 0.0237$ 12.9%

Consumable 0.0512$ 28.0%

Labour 0.0233$ 12.7%

Scrap 0.0010$ 0.5%

Assembly manufacturing cost 0.1832$ 100.0%

Assembly Overheads 0.0275$ +15.0%

Assembly total cost 0.2107$

Assembly Cost2015

Cost Breakdown Cost Breakdown Cost Breakdown Cost Breakdown Cost Breakdown

Final component Cost 0.8261$ 57.3% 0.8215$ 57.3% 0.8200$ 57.3% 0.8192$ 57.3% 0.8189$ 57.3%

Sales, G&A 0.1600$ 11.1% 0.1591$ 11.1% 0.1588$ 11.1% 0.1587$ 11.1% 0.1586$ 11.1%

R&D 0.2595$ 18.0% 0.2581$ 18.0% 0.2576$ 18.0% 0.2573$ 18.0% 0.2572$ 18.0%

Floor price 1.2457$ 86.4% 1.2388$ 86.4% 1.2364$ 86.4% 1.2353$ 86.4% 1.2348$ 86.4%

Operational margin 0.1961$ 13.6% 0.1950$ 13.6% 0.1946$ 13.6% 0.1944$ 13.6% 0.1944$ 13.6%

Manufacturer price 1.4418$ 100.0% 1.4338$ 100.0% 1.4310$ 100.0% 1.4297$ 100.0% 1.4292$ 100.0%

market position factor x 1.000 x 1.000 x 1.000 x 1.000 x 1.000

life cycle factor x 2.108 x 1.492 x 1.126 x 1.046 x 0.996

quantity factor x 0.649 x 0.850 x 0.944 x 0.979 x 0.994

Selling price 1.9726$ 1.8171$ 1.5214$ 1.4641$ 1.4143$

2019Component Price

2015 2016 2017 2018

MEMS Processes (as of February 2015):• Accelerometers:

Analog Devices iMEMS process Analog Devices surface micromachining process Bosch surface micromachining process Freescale surface micromachining process Freescale HARMEMS process Kionix dry micromachining process mCube 3D MEMS processMurata (VTI) 3D-MEMS with cSOI process Murata (VTI) 3D-MEMS with SOI processSensonor bulk micromachining (TP4) processSTMicroelectronics THELMA process

• Gyroscopes:Bosch surface micromachining process InvenSense Nasiri ProcessMaxim (SensorDynamics) PSM-X2 processMurata (VTI) 3D-MEMS with cSOI processSensonor bulk micromachining (TP5) processSTMicroelectronics THELMA process

• Pressure Sensors:Bosch APSM process Freescale CMOS/MEMS process Freescale MEMS Pressure Capacitive processInfineon CMOS/MEMS processInfineon bulk micromachining processSensonor bulk micromachining (TP4) process STMicroelectronics VENSENS process

• Microphones:Akustica CMOS/MEMS processEpcos micromachining processInfineon micromachining processInvenSense (Analog Devices) SOI micromachining process Knowles SiSonic MEMS process Omron micromachining process Wolfson micromachining process

• Oscillators:Discera micromachining with Silex Microsystems TSI processSilicon Labs CMEMS processSiTime MEMS First process

• RF:Avago FBAR processWispry MEMS over CMOS process

Cost Breakdown

Final product characteristics Back-End description Delivery schedule Final test description Economical description

Description Assembly Equipment Final product manufacturer

Name Package type Outputs Manufacturer f inancial income Cost of Sales

24 pins Freescale - 2013 57.30%

Manufacturer Description Equipment Price Paralelism Test nb Test duration Life cycle Intro date

$1,000,000 8 in // 2 30.00 sec Automotive 8/1/2014

Die characteristics Front-End description Fab Unit Description Back-End 0 description Economical description

Description Technology Name Probe test equipment Part Outsourcer

Name Material Min. dimension Start production Outsourcer f inancial income Cost of Sales

Si 0.250 µm 12/19/1999

Type Manufacturer Functions Country City Equipment Price Paralelism Test nb Test duration Life cycle Intro date

Standard $407,200 8 in // 1 5.00 sec 3/1/2014

Die Parameters Parameters Other operations IC Foundry

Width Length Area Device Gate oxide nb Polysilicon nb Minimum dim. Wafer size Creation Date Capacity Foundry f inancial income Cost of Sales

2.850 mm 3.000 mm 8.550 mm2 CMOS 1 ox 2 poly 0.080 µm 200 mm 1/1/1995 100000 W/m TSMC - 2013 52.90%

Pad number Stack option Core area Metal layers Litho steps Type

44 7.886 mm2 4 met 25 lithos

Die characteristics MEMS Technology description MEMS Fab Unit Description Back-End 0 description Economical description

Description Technology Name Probe test equipment Part Outsourcer

Name Family Start production Outsourcer f inancial income Cost of Sales

1/1/2003

Type Manufacturer Process Country City Equipment Price Paralelism Test nb Test duration Life cycle Intro date

Standard $126,800 4 in // 1 1.50 sec 3/1/2014

Die Parameters Parameters Other operations MEMS Foundry

Width Length Area Name : Value Minimum dim. Wafer size Creation Date Capacity Foundry f inancial income Cost of Sales

1.100 mm 1.320 mm 1.452 mm2 0.250 µm 200 mm 1/1/1991 24000 W/m

Pad number Stack option Core area Type

5

Die characteristics MEMS Technology description MEMS Fab Unit Description Back-End 0 description Economical description

Description Technology Name Probe test equipment Part Outsourcer

Name Family Start production Outsourcer f inancial income Cost of Sales

1/1/2005

Type Manufacturer Process Country City Equipment Price Paralelism Test nb Test duration Life cycle Intro date

Standard $126,800 4 in // 1 2.00 sec 3/1/2011

Die Parameters Parameters Other operations MEMS Foundry

Width Length Area Name : Value Minimum dim. Wafer size Creation Date Capacity Foundry f inancial income Cost of Sales

1.590 mm 1.670 mm 2.655 mm2 0.250 µm 200 mm 1/1/1991 24000 W/m

Pad number Stack option Core area Type

10

Dicing: Mechanical saw ing

All products in low v olume. More than 20 different technologies.

Standard product low volumeMEMS Accelerometer Accelerometers

(same as product) Freescale surface micromachining process USA Austin (Texas)

Freescale - Oak Hill Fab

Dicing: Mechanical saw ing

All products in low v olume. More than 20 different technologies.

Standard product low volumeMEMS Pressure Sensor Pressure Sensors

(same as product) Freescale MEMS Pressure Capacitive USA Austin (Texas)

Freescale - Oak Hill Fab

Dicing: Mechanical saw ing

All products in low v olume. More than 20 different technologies.

High-performance microcontroller (< 400MHz)

medium pin numberASIC Die

(same as product) Digital, Analog, Flash SA or ELD FLASH,SRAM Taiw an Hsinchu

TSMC - Fab 3

Freescale - 2013 Wire Bond. on leadframe 1/1/2018 / 1,000,000

TPMS - Tire Pressure Monitoring Sensor FAM QFN with Metal Lid 1/1/2016 / 1,000,000

1/1/2017 / 1,000,000

Date / Quantity Date / Quantity

1/1/2015 / 1,000,000 1/1/2019 / 1,000,000Inertial Tester

1 – Set one or several parts data:a) Give a brief description of the IC or MEMS die dimensions,b) Select the technology in the reference database, or build a new one using the technology generator wizard,c) Select the Fab unit in the database,d) Set final operations on wafer, using preset options, e) Set supply chain economics options.

2 - Set the backend data:a) Set assembly options or select the

package of the IC in the reference

database,

b) Set some parameters on final test, if

needed.

3 - Set the economical data:a) Set the delivery schedule,

b) Set outsourcing options or foundry data for parts if needed,

c) Select the manufacturer and market option for final product.

Manufacturer financials can be selected from reference database.

THE RESULTS ARE READY !

TECHNICAL INPUT IS

ACHIEVED !

All commands are available on top ribbon menu

Working with MEMS Price+

Please process my order for “MEMS Price+” Costing Tool:

Corporate license price: EURO 11 000*

Site license price: EURO 8 000*

*For price in dollars please use the day’s exchange rate / For French customer, please add 20 % for VAT **First year support is compulsory

one year support price: EURO 3 300 **

one year support price: EURO 2 400**

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System Plus Consulting is specialized in the costanalysis of electronics from semiconductor devicesto electronic systems.A complete range of services and costing tools toprovide in-depth production cost studies and toestimate the objective selling price of a product isavailable.

Our services:TECHNOLOGY ANALYSIS - REVERSE COSTING -COSTING TOOLS - TRAININGS

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