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©2017 by System Plus Consulting | MEMS Packaging – Reverse Costing Review 1
21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
MEMS Packaging Reverse Technology ReviewEnvironmental Sensor, Inertial, Optical Sensor, Microphones & RF
MEMS report by Audrey LAHRACHOctober 2017 – Version 1
©2017 by System Plus Consulting | MEMS Packaging – Reverse Costing Review 2
Table of Contents
Overview / Introduction 4
o Executive Summary
o Analyzed Devices
o Reverse Costing Methodology
Technology Review 15
o Environmental Sensor
o Pressure Sensors
o Consumer (x5)
o Automotive (4)
o TPMS (x2)
o Humidity Sensors
o Consumer (x10)
o Gas Sensors
o Consumer (x4)
o Combo Sensors
o Consumer (x2)
o Inertial Sensors
o Accelerometer
o Consumer (x7)
o Automotive (x7)
o Gyroscopes
o Consumer (User Motion) (x5)
o Consumer (OIS) (x2)
o Automotive (x2)
o Magnetometers
o Consumer (x16)
o Combo + Sensor Hubs
o 6-Axis e-Compass (x2)
o 6-Axis IMU (x8)
o 9-Axis IMU (x4)
o Sensor Hub (x2)
o Automotive Combo (x6)
o Optical MEMS
o Microbolometers
o Consumer (x3)
o Micromirrors
o Consumer (x2)
o Industrial/ Medical (x1)
o Acoustic Sensors
o Microphones
o Consumer (x6)
o RF Components
o Antenna Tuners
o Consumer (x2)
o RF Filters
o Consumer (x5)
o Oscillators
o Consumer (x2)
Company services 401
©2017 by System Plus Consulting | MEMS Packaging – Reverse Costing Review 3
Overview / Introductiono Executive Summaryo Analyzed Deviceso MEMS Packaging Matrixo Reverse Costing
Methodology
Technologies Review
About System Plus
Executive Summary
This comparative technology review has been conducted to provide insight on structure and technology for over 80 Consumerand 20 Automotive MEMS from the main suppliers (Bosch, TI, Broadcom, STMicroelectronics, Knowles…).
We analyze and compare several types of device: Environmental sensors, including pressure, humidity, gas and combo sensors;Inertial devices including accelerometers, gyroscopes, magnetometers and sensor hubs; Optical MEMS includingmicrobolometers and micromirrors; Microphones; and Radio frequency (RF) MEMS including antenna tuners, RF filters andoscillators. We look at their package dimensions and internal structures, substrate types, die numbers and dimensions andpackage cross-sections to answer key questions about MEMS packaging, including:
- What are the main encapsulation processes used by manufacturers, single-chip wafer level packages or multi-chip moldedpackages?
- What is the preferred interconnection method, wire bonding, flip chip, or through-silicon vias (TSVs)?
- Which innovations can we observe for each manufacturer, and what differences are there between the main competitors?
- Which manufacturers offer the best component integration and which one offers the maximum functionality inside onecomponent?
This 300 page report includes multiple comparisons based on physical analyses of over 100 MEMS components. It offersbuyers the unique possibility of seeing MEMS package technology evolution, tracked by manufacturer.
©2017 by System Plus Consulting | MEMS Packaging – Reverse Costing Review 4
Overview / Introductiono Executive Summaryo Analyzed Deviceso MEMS Packaging Matrixo Reverse Costing
Methodology
Technologies Review
About System Plus
Analyzed Devices
• Environmental SensorsType Manufacturer Reference Application
Pressure Infineon DPS310 Consumer
Pressure STMicroelectronics LPS331AP Consumer
Pressure STMicroelectronics LPS22HB Consumer
Pressure Bosch BMP280 Consumer
Pressure Bosch BMP380 Consumer
Pressure Infineon KP200 Automotive
Pressure Bosch #1 Automotive
Pressure Bosch #2 Automotive
Pressure Melexis MLX90809 Automotive
TPMS Infineon SP37 Automotive
TPMS Freescale FXTH87 Automotive
Type Manufacturer Reference Application
Humidity Sensirion SHT21 Consumer
Humidity Sensirion SHTC1 Consumer
Humidity Sensirion SHT31 Consumer
Humidity STMicroelectronics HTS221 Consumer
Humidity Bosch BME280 Consumer
Humidity ALPS HSHCAA006A Consumer
Humidity SiLabs Si7021 Consumer
Humidity SiLabs Si7034 Consumer
Humidity MEAS HPP845E031R4 Consumer
Humidity TI HDC1000 Consumer
Gas Cambridge (ams) CCS801 Consumer
Gas Ams AS-MLV-P2 Consumer
Gas Sensirion SGP30 Consumer
Gas Sensirion SGPC3 Consumer
Gas Bosch BME680 Consumer
Combo Sensor Bosch BME280 Consumer
Combo Sensor Bosch BME680 Consumer
©2017 by System Plus Consulting | MEMS Packaging – Reverse Costing Review 5
Overview / Introductiono Executive Summaryo Analyzed Deviceso MEMS Packaging Matrixo Reverse Costing
Methodology
Technologies Review
About System Plus
Analyzed Devices
• Inertial Sensors
Type Manufacturer Reference Application
Accelerometer
mCube MC3413 Consumer
mCube MC3635 Consumer
mCube MC3672 Consumer
Bosch Sensortec BMA222 Consumer
Bosch Sensortec BMA255 Consumer
Bosch Sensortec BMA280 Consumer
Bosch Sensortec BMA355 Consumer
STMicroelectronics LIS2DH Consumer
STMicroelectronics LIS302DL Consumer
STMicroelectronics LIS3DSH Consumer
STMicroelectronics IIS328DQTR Consumer
STMicroelectronics AIS1120SX/2120SX/3684
Automotive
Bosch SMA582 + 2 Ref. Automotive
Analog Devices ADXL278 Automotive
Analog Devices ADXL189 Automotive
Murata (VTI) SCA3100 Automotive
Murata(VTI) SCA2120 Automotive
NXP (Freescale) MMA5248 Automotive
Colibrys VS1000 Industrial
Type Manufacturer Reference Application
Gyroscope
Bosch BMG160 Consumer (User Motion)
Bosch BMG250 Consumer (User Motion)
STMicroelectronics L3GD20H Consumer (User Motion)
NXP FXAS21002CQR1 Consumer (User Motion)
Maxim MAX210000 Consumer (User Motion)
Invensense IDG-2030 Consumer (OIS)
STMicroelectronics L2G2IS Consumer (OIS)
Bosch SMG550 Automotive
STMicroelectronics A3G4250D (Navigation)
Automotive
©2017 by System Plus Consulting | MEMS Packaging – Reverse Costing Review 6
Overview / Introductiono Executive Summaryo Analyzed Deviceso MEMS Packaging Matrixo Reverse Costing
Methodology
Technologies Review
About System Plus
Analyzed Devices
• Inertial Sensors
Type Mfr. Ref. Package Application
Magnetometer3-Axis
ALPS HSCDTD008A LGA Consumer
AKM AK8973 WLCSP Consumer
AKM AK8975 WLCSP Consumer
AKM AK8963 WLCSP Consumer
AKM AK09911 WLCSP Consumer
AKM AK09918C WLCSP Consumer
Bosch BMM150 LGA Consumer
Freescale MAG3110 QFN Consumer
Honeywell HMC5883 LGA Consumer
MEMSIC MMC3316xMT LGA Consumer
STMicro LIS3MDL LGA Consumer
Yamaha YAS529 WLCSP Consumer
Yamaha YAS532B WLCSP Consumer
Yamaha YAS537 WLCSP Consumer
eCompass6-Axis
STMicro LSM303D LGA Consumer
Bosch BMC150 LGA Consumer
Type Mfr. Ref. Application
6-Axis IMU
Bosch BMI055 Consumer
Bosch BMI160 Consumer
Bosch iPhone 8 Consumer
Bosch Apple Watch 3 Consumer
STMicroelectronics LSM6DS3 Consumer
STMicroelectronics LSM6DSL/M Consumer
On Semi (Fairchild) FIS110 Consumer
Invensense iPhone 7 (6-axis) Consumer
Invensense ICM-20789 Consumer
9-Axis IMU
Bosch BMX055 Consumer
STMicroelectronics LSM9DS0 Consumer
STMicroelectronics LSM9DS1 Consumer
Invensense MPU-9250 Consumer
Sensor HubBosch BMF055 Consumer
Invensense ICM-30630 Consumer
Automotive Combo
Bosch SMI540 Automotive
Bosch SMI500/510 Automotive
Bosch SMI130 (Navigation)
Automotive
Murata SCC2000 Automotive
Murata SCC1300 Automotive
Silicon Sensing CMS300 Automotive
©2017 by System Plus Consulting | MEMS Packaging – Reverse Costing Review 7
Overview / Introductiono Executive Summaryo Analyzed Deviceso MEMS Packaging Matrixo Reverse Costing
Methodology
Technologies Review
About System Plus
Analyzed Devices
• Acoustic Sensors
Type Manufacturer Reference Application
Microphone
Invensense ICS43432 Consumer
Knowles iPhone 5S Consumer
AAC iPhone 5S Consumer
Knowles iPhone 7 Consumer
STMicroelectronics iPhone 7 Consumer
Goertek iPhone 7 Consumer
Vesper VM1000 Consumer
Wolfson WM7121 Consumer
Wolfson WM7132 Consumer
©2017 by System Plus Consulting | MEMS Packaging – Reverse Costing Review 8
Overview / Introductiono Executive Summaryo Analyzed Deviceso MEMS Packaging Matrixo Reverse Costing
Methodology
Technologies Review
About System Plus
Analyzed Devices
• Optical Sensors
Type Manufacturer Reference Application
Microbolometer
Ulis PICO384P Consumer
Raytheon EXC001 Consumer
Flir ISC1406L Consumer
Type Manufacturer Reference Application
Micromirror DLP Texas Instruments DLP1700 Consumer
Micromirror DLP Texas Instruments DLP3000 Industrial/Medical
Resonant Mirror STMicroelectronics PM53A Consumer
©2017 by System Plus Consulting | MEMS Packaging – Reverse Costing Review 9
Overview / Introductiono Executive Summaryo Analyzed Deviceso MEMS Packaging Matrixo Reverse Costing
Methodology
Technologies Review
About System Plus
Analyzed Devices
• RF Sensors
Type Manufacturer Reference Application
Antenna Tuner Cavendish 32CK417R Consumer
Antenna Tuner Wispry A2101 Consumer
Filter Broadcom BAW Filters Consumer
Filter Qorvo BAW & SAW Filters Consumer
Filter Murata SAW Filters Consumer
Filter Tayio Yuden SAW Filters Consumer
Oscillator SiTime Si1552 Consumer
Oscillator Microchip DSC6003 Consumer
©2017 by System Plus Consulting | MEMS Packaging – Reverse Costing Review 10
Overview / Introductiono Executive Summaryo Analyzed Deviceso MEMS Packaging Matrixo Reverse Costing
Methodology
Technologies Review
About System Plus
The analysis is conducted in 3 phases:
Teardown analysis
• Package is analyzed and measured
Die
•The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking
Comparison
•Innovations we can observe for each manufacturer, and differences between the main competitors
Executive Summary
©2017 by System Plus Consulting | MEMS Packaging – Reverse Costing Review 11
TECHNOLOGIESR E V I E W
©2017 by System Plus Consulting | MEMS Packaging – Reverse Costing Review 12
Overview / Introduction
Technologies Reviewo Environmental Sensor
o Pressure Sensoro TPMSo Humidity Sensoro Gas Sensoro Combo Sensor
o Inertial Sensoro Accelerometero Gyroscopeo Magnetometero Combo + Sensor
Hubo Microbolometero Micromirroro Microphoneo RF Components
o Antenna Tunero RF Filtero Oscillators
About System Plus
Pressure Sensor - Technology Summary
• 9 references from 4 companies of pressure sensor component manufacturer has been analyzed.
©2017 by System Plus Consulting | MEMS Packaging – Reverse Costing Review 13
Overview / Introduction
Technologies Reviewo Environmental Sensor
o Pressure Sensoro TPMSo Humidity Sensoro Gas Sensoro Combo Sensor
o Inertial Sensoro Accelerometero Gyroscopeo Magnetometero Combo + Sensor
Hubo Microbolometero Micromirroro Microphoneo RF Components
o Antenna Tunero RF Filtero Oscillators
About System Plus
Infineon – DPS310 – Package View & Dimensions
©2017 by System Plus Consulting | MEMS Packaging – Reverse Costing Review 14
Overview / Introduction
Technologies Reviewo Environmental Sensor
o Pressure Sensoro TPMSo Humidity Sensoro Gas Sensoro Combo Sensor
o Inertial Sensoro Accelerometero Gyroscopeo Magnetometero Combo + Sensor
Hubo Microbolometero Micromirroro Microphoneo RF Components
o Antenna Tunero RF Filtero Oscillators
About System Plus
Infineon – DPS310 – Package Cross-Section
©2017 by System Plus Consulting | MEMS Packaging – Reverse Costing Review 15
Overview / Introduction
Technologies Reviewo Environmental Sensor
o Pressure Sensoro TPMSo Humidity Sensoro Gas Sensoro Combo Sensor
o Inertial Sensoro Accelerometero Gyroscopeo Magnetometero Combo + Sensor
Hubo Microbolometero Micromirroro Microphoneo RF Components
o Antenna Tunero RF Filtero Oscillators
About System Plus
Pressure Sensor - Comparison
Melexis – MLX90809Bosch #2Bosch #1Infineon – KP200
Component Ref Package size Footprint Volume Dies nb Wire bonding Nb
KP200 7.0 x 7.0 x 2.8mm 49mm² 137mm3 x x (Material)
Bosch #1 8.2 x 4.4 x 2.4mm 36.1mm² 86.6mm3 x x (Material)
Bosch #2 13.9 x 8.6 x 3.2mm 119.5mm² 382.5mm3 x x (Material)
MLX90809 10.3x7.5x2.4mm 77.25mm² 185mm3 x x (Material)
©2017 by System Plus Consulting | MEMS Packaging – Reverse Costing Review 16
Overview / Introduction
Technologies Review
About System Pluso Company serviceso Related reportso Feedbackso Contacto Legal
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MEMS & SENSORS• MEMS Packaging Market and Technology Trends 2017• Status of the MEMS industry 2017• Status of Advanced Packaging Industry 2017
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MEMS & SENSORS
©2017 by System Plus Consulting | MEMS Packaging – Reverse Costing Review 17
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©2017 by System Plus Consulting | MEMS Packaging – Reverse Costing Review 19
Overview / Introduction
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