mems mass storage syatem

18
MEMS BASED INTEGRATED CIRCUIT MASS STORAGE SYSTEMS Presented by prashant singh (imi2011003)

Upload: prashant-singh

Post on 14-Jun-2015

336 views

Category:

Education


0 download

TRANSCRIPT

Page 1: Mems mass storage syatem

MEMS BASED INTEGRATED CIRCUIT

MASS STORAGE SYSTEMS

Presented by

prashant singh(imi2011003)

Page 2: Mems mass storage syatem

Highlights New secondary storage technology that could revolutionize computer

architecture.

-Faster than hard drives

-Lower entry cost

-Lower weight and volume

-Lower power consumption

Discuss physical description of device.

Page 3: Mems mass storage syatem

Disk Drive limitations Disk-drive capacities double every 18 months

-better 60% per year growth rate of semiconductor memories

Two major limitations of disk drives are…..

-Access times decreases have been minimal

-Minimum entry cost remains too high for many applications

Page 4: Mems mass storage syatem

Problem Specification

Requirement of mass storage system that can break both barrier

-Access times

-Minimum entry cost

New mass storage should also be significantly cheaper than non-volatile RAM

-$100 now buys 1 GB of flash memory

Page 5: Mems mass storage syatem

MEMS MEMS use

-Same parallel wafer-fabrication process as semiconductor memories

-Keeps the prices low

-Same mechanical positioning of R/W heads as disk drives

-Data can be stored using higher density thin film technology

Page 6: Mems mass storage syatem

Main Advantages Of MEMS

Potential for dramatic decrease in-Entry cost(10x cheaper than RAM)

-Access time

-Volume

-Mass

-Power dissipation

-Failure rate

-Shock sensitivity

Integrate storage with computation

-Complete system-on-chip integration

-Processing unit

-RAM

-Non-volatile storage

Page 7: Mems mass storage syatem

MEMS storage prototype

Like a disk drive, it has

-recording heads

-a moving magnetic recording medium

Major departures from disk drive architecture are

-MEMS recording heads-probe tips-are fabricated in a parallel wafer level manufacturing process

-Media surface does not rotate(Data latency decreases)

Page 8: Mems mass storage syatem

Data Organization

disk

MEMS

Page 9: Mems mass storage syatem

Media Surface Movement

Media surface that rotate requires ball bearings

Very small ball bearing may have “striction” problem that prevent accurate positioning

-Element would move by sticking and slipping

Best solution is to have media sled moving in X-Y directions

-Sled moves in Y-direction for data access

-Sled is suspended by spring

Page 10: Mems mass storage syatem

Read/writetips

Read/writetips

Conceptual View of “Moving Media”(CMU prototype)

Read/Writetips

Read/Writetips

MagneticMedia

MagneticMedia

ActuatorsActuators

Bits storedunderneath

each tip

Bits storedunderneath

each tipMediaMedia

side view

SpringsSprings

Page 11: Mems mass storage syatem

Operation (A) (B) (C)

(D) (E) (F)

Page 12: Mems mass storage syatem

The Media Sled

Actuator pull sled in both dimensions

Size 8mm X 8mm X 500µm

Held over the probe tip array by a network of springs

Motion applied through electrostatic actuators

-Motion limited to 10% or less of suspension/actuator length

-Each probe tip can sweep 1% of the media sled

Include large number of probe tips for

-Improving data throughput

-Increasing system reliabilityRead write operation

Page 13: Mems mass storage syatem

Probe Tip Positioning Most MEMS include some form of tip height control because

-Media surface is not perfectly flat

-Probe tip height may vary

CMU(Carnegie Mellon University,Pennsylvania,US) prototype places each probe tip on a separate cantilever

-Cantilever is electrostatically actuated to a fixed distance from the media surface

IBM Millipede

-Uses 32 x 32 array of probe tips

-Each tip is placed at the end of a flexible cantilever

-Cantilever bends when tip touches surface

HP design places media surface and probe tips sufficiently apart

-No need to control probe tips heightIBM Millipede

Page 14: Mems mass storage syatem

Probe Tip Fabrication Major challenge is fabricating read/write probe tips in a way that is

compatible with the underlying CMOS circuitry

This includes

-thermal compatibility

-geometrical compatibility

-chemical compatibility……..

Page 15: Mems mass storage syatem

Failure Management MEMS devices will have internal failures

-Tips will break during fabrication/assembly, use

-Media can wear(erosion/sideways displacement)

Page 16: Mems mass storage syatem

Storing, Reading and Writing Bits CMU prototype uses same magnetic recording technology as current

disk drives

-Minimum mark size around 80µm x 80µm

Other solutions include

-Melting pits in a polymer (IBM Millipede)

-Raises tip wear issues

Page 17: Mems mass storage syatem

Potential Application Lighter and less shock sensitive than disk drives

-Great for notebook PC’s,PDA’s and video camcorders

Lower cost than disk drives in 1 to 10 GB range

-Will open many new applications

High areal densities

-Great for storing huge amounts of data

Can combine computing and storage on a single chip

E.g. Average service time around 0.52 ms

-Disk drive service time is 10.1 ms

-Key factor for service time is X-seek time

Page 18: Mems mass storage syatem

Thank You