© Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 1

MEMS CLEAN ROOM

1500 m2, class 10

150 mm (6”) Wafer line

3 shift preparation for R&D and pilot fabrication (24x5)

Access to external services

Technological parameter supervising system

MES / PPS based planning and documentation

ISO 9001 certification

© Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 2

MEMS Clean Room Layout Aktuelle Clusterung

HIGH TEMPERATURE

LITHOGRAPHY

WET ETCH / CLEANING

DRY ETCH / PVD

BA

CK

EN

D

BA

CK

EN

D

CVD

INLINE METROLOGY

CHARACTERIZATION &

TEST

LAB

CMP

EXTERNAL PARTNERS

SEM

LOGISTICS

GOWNING AREA

© Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 3

MEMS Clean Room: Characterization & Test

© Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 4

MEMS Clean Room: Lithography

© Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 5

MEMS Clean Room: Wet Etch / Cleaning

© Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 6

MEMS Clean Room: Wet Etch / Cleaning

© Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 7

MEMS Clean Room: Dry Etch / Strip Resist

© Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 8

MEMS Clean Room: Backend (Bonding, Dispense)

© Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 9

MEMS Clean Room: Inline Metrology

© Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 10

MEMS Clean Room: Inline Metrology

© Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 11

MEMS Clean Room: SEM