mem-dimm-ddr3 4gb-kit kingston

Memory Module Specifications KHX1333C9D3B1K2/4G 4GB (2GB 256M x 64-Bit x 2 pcs.) DDR3-1333MHz CL9 240-Pin DIMM Kit DESCRIPTION Kingston’s KHX1333C9D3B1K2/4G is a kit of two 256M x 64-bit (2GB) DDR3-1333MHz CL9 SDRAM (Synchronous DRAM) memory modules, based on sixteen 128M x 8-bit DDR3 FBGA components per module. Total kit capacity is 4GB. The SPDs are programmed to JEDEC standard latency DDR3-1333MHz timing of 9-9-9 at 1.5V. Each 240- pin DIMM uses gold contact fingers and requires +1.5V. The JEDEC standard electrical and mechanical specifications are as follows: SPECIFICATIONS CL(IDD) 9 cycles Row Cycle Time (tRCmin) 49.5ns (min.) Refresh to Active/Refresh 110ns Command Time (tRFCmin) Row Active Time (tRASmin) 36ns (min.) Power 1.800 W (operating per module) UL Rating 94 V - 0 Operating Temperature 0° C to 85° C Storage Temperature -55° C to +100° C FEATURES • JEDEC standard 1.5V ± 0.075V Power Supply • VDDQ = 1.5V ± 0.075V • 667MHz fCK for 1333Mb/sec/pin • 8 independent internal bank • Programmable CAS Latency: 5,6,7,8,9,10 • Posted CAS • Programmable Additive Latency: 0, CL - 2, or CL - 1 clock • Programmable CAS Write Latency(CWL) = 7(DDR3-1333) • 8-bit pre-fetch • Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS] • Bi-directional Differential Data Strobe • Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%) • On Die Termination using ODT pin • Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE ≤ 95°C • Asynchronous Reset • PCB : Height 1.180” (30.00mm), double sided component www.technotrend.com.mx

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MEM-DIMM-DDR3 4GB-KIT 1333MHZ KINGSTON

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Memory Module Specifications

KHX1333C9D3B1K2/4G4GB (2GB 256M x 64-Bit x 2 pcs.) DDR3-1333MHzCL9 240-Pin DIMM Kit

DESCRIPTIONKingston’s KHX1333C9D3B1K2/4G is a kit of two 256M x 64-bit (2GB) DDR3-1333MHz CL9 SDRAM (Synchronous DRAM) memory modules, based on sixteen 128M x 8-bit DDR3 FBGA components per module. Total kit capacity is 4GB. The SPDs are programmed to JEDEC standard latency DDR3-1333MHz timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers and requires +1.5V. The JEDEC standard electrical and mechanical specifications are as follows:

SPECIFICATIONS

CL(IDD) 9 cycles

Row Cycle Time (tRCmin) 49.5ns (min.)

Refresh to Active/Refresh 110ns Command Time (tRFCmin)

Row Active Time (tRASmin) 36ns (min.)

Power 1.800 W (operating per module)

UL Rating 94 V - 0

Operating Temperature 0° C to 85° C

Storage Temperature -55° C to +100° C

FEATURES• JEDEC standard 1.5V ± 0.075V Power Supply

• VDDQ = 1.5V ± 0.075V

• 667MHz fCK for 1333Mb/sec/pin

• 8 independent internal bank

• Programmable CAS Latency: 5,6,7,8,9,10

• Posted CAS

• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock

• Programmable CAS Write Latency(CWL) = 7(DDR3-1333)

• 8-bit pre-fetch

• Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]

• Bi-directional Differential Data Strobe

• Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)

• On Die Termination using ODT pin

• Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE ≤ 95°C

• Asynchronous Reset

• PCB : Height 1.180” (30.00mm), double sided component

www.technotrend.com.mx

continued HyperX

MODULE DIMENSIONS:

FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM

All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.

MODULE WITH HEAT SPREADER:

www.technotrend.com.mx

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