The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.196

091416

MECHANICAL SPECIFICATIONS

Input / output pads shown in Blue. Grounding pads shown in gray.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed

Multilayer Organic (MLO®)

Footprint AMechanical Specifications, Pad Layout, and Mounting Recommendations

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 197

091416

SUGGESTED PCB LAYOUT

Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.

Multilayer Organic (MLO®)

Footprint AMechanical Specifications, Pad Layout, and Mounting Recommendations

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.198

091416

PAD CONNECTIONS

Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in gray.Dimensions in inches [mm]

3

3 3 3 3

33333

3 3 3 3

22

Multilayer Organic (MLO®)

Footprint AMechanical Specifications, Pad Layout, and Mounting Recommendations

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 199

091416

MECHANICAL SPECIFICATIONS

Input / output pads shown in Blue. Grounding pads shown in gray.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed

Multilayer Organic (MLO®)

Footprint BMechanical Specifications, Pad Layout, and Mounting Recommendations

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.200

SUGGESTED PCB LAYOUT

Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.

Multilayer Organic (MLO®)

Footprint BMechanical Specifications, Pad Layout, and Mounting Recommendations

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 201

PAD CONNECTIONS

Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in gray.Dimensions in inches [mm]

Multilayer Organic (MLO®)

Footprint BMechanical Specifications, Pad Layout, and Mounting Recommendations

3

3 3 3 33

3 33333

3 3 3 3 3

22

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.202

MECHANICAL SPECIFICATIONS

Input / output pads shown in Blue. Grounding pads shown in gray.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed

Multilayer Organic (MLO®)

Footprint CMechanical Specifications, Pad Layout, and Mounting Recommendations

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 203

SUGGESTED PCB LAYOUT

Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.

Multilayer Organic (MLO®)

Footprint CMechanical Specifications, Pad Layout, and Mounting Recommendations

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.204

PAD CONNECTIONS

Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in gray.Dimensions in inches [mm]

Multilayer Organic (MLO®)

Footprint CMechanical Specifications, Pad Layout, and Mounting Recommendations

3

3

3

3

31 2

3

3

3

3

3

3

3

3

3

3

3

3

3

3

3

3

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 205

MECHANICAL SPECIFICATIONS

Input / output pads shown in Blue. Grounding pads shown in gray.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed

Multilayer Organic (MLO®)

Footprint DMechanical Specifications, Pad Layout, and Mounting Recommendations

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.206

SUGGESTED PCB LAYOUT

Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.

Multilayer Organic (MLO®)

Footprint DMechanical Specifications, Pad Layout, and Mounting Recommendations

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 207

PAD CONNECTIONS

Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in gray.Dimensions in inches [mm]

Multilayer Organic (MLO®)

Footprint DMechanical Specifications, Pad Layout, and Mounting Recommendations

3

3

3 3 3 3 3 3 3

3 3 3 3 3 3 3

3 3 3 3 3 3 3

1 2

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.208

MECHANICAL SPECIFICATIONS

Input / output pads shown in Blue. Grounding pads shown in gray.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed

Multilayer Organic (MLO®)

Footprint EMechanical Specifications, Pad Layout, and Mounting Recommendations

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 209

SUGGESTED PCB LAYOUT

Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.

Multilayer Organic (MLO®)

Footprint EMechanical Specifications, Pad Layout, and Mounting Recommendations

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.210

PAD CONNECTIONS

Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in gray.Dimensions in inches [mm]

Multilayer Organic (MLO®)

Footprint EMechanical Specifications, Pad Layout, and Mounting Recommendations

3

3 3 3 3 3 3 3 3 3 3

3 3 3 3 3 3 3 3 3

3 3 3 3 3 3 3 31 2

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 211

MECHANICAL SPECIFICATIONS

Input / output pads shown in Blue. Grounding pads shown in black.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed

Multilayer Organic (MLO®)

Footprint E1Mechanical Specifications, Pad Layout, and Mounting Recommendations

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.212

SUGGESTED PCB LAYOUT

Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.

Multilayer Organic (MLO®)

Footprint E1Mechanical Specifications, Pad Layout, and Mounting Recommendations

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 213

PAD CONNECTIONS

Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in black.Dimensions in inches [mm]

Multilayer Organic (MLO®)

Footprint E1Mechanical Specifications, Pad Layout, and Mounting Recommendations

3

3 3 3 3 3 3 3 3 3 3

3 3 3 3 3 3 3 3 3

3 3 3 3 3 3 3 31 2

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.214

MECHANICAL SPECIFICATIONS

Input / output pads shown in Blue. Grounding pads shown in black.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed

Multilayer Organic (MLO®)

Footprint E2Mechanical Specifications, Pad Layout, and Mounting Recommendations

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 215

SUGGESTED PCB LAYOUT

Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.

Multilayer Organic (MLO®)

Footprint E2Mechanical Specifications, Pad Layout, and Mounting Recommendations

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.216

PAD CONNECTIONS

Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in Black.Dimensions in inches [mm]

Multilayer Organic (MLO®)

Footprint E2Mechanical Specifications, Pad Layout, and Mounting Recommendations

3

3 3 3 3 3 3 3 3 3 3

3 3 3 3 3 3 3 3 3

3 3 3 3 3 3 3 31 2

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 217

MECHANICAL SPECIFICATIONS

Input / output pads shown in Blue. Grounding pads shown in gray.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed

Multilayer Organic (MLO®)

Footprint FMechanical Specifications, Pad Layout, and Mounting Recommendations

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.218

SUGGESTED PCB LAYOUT

Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.

Multilayer Organic (MLO®)

Footprint FMechanical Specifications, Pad Layout, and Mounting Recommendations

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 219

PAD CONNECTIONS

Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in gray.Dimensions in inches [mm]

Multilayer Organic (MLO®)

Footprint FMechanical Specifications, Pad Layout, and Mounting Recommendations

3 3 3 3 3 3 3 3 3 3

3 3 3 3 3 3 3 3 3

3 33 3 3 3 3 3 3

3

1 2

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.220

MOUNTING RECOMMENDATIONS

AUTOMATED SMT ASSEMBLYThe following section describes the guidelines for automated SMT assembly of MLO® RF devices which are typically Land Grid Array (LGA) packages or side termination SMT pacages.Control of solder and solder paste volume is critical for surface mount assembly of MLO® RF devices onto the PCB.

Stencil thickness and aperture openings should be adjusted according to the optimal solder volume. The following are general recommendations for SMT mounting of MLO® devices onto the PCB.

SMT REFLOW PROFILECommon IR or convection reflow SMT processes shall be used for the assembly. Standard SMT reflow profiles, for eutectic and Pb free solders, can be used to surface mount the MLO® devices onto the PCB. In all cases, a temperature gradient of 3°C/sec, or less, should be maintained to prevent warpage of the package and to ensure that all joints reflow properly. Additional soak time and

slower preheating time may be required to improve the out-gassing of solder paste. In addition, the reflow profile depends on the PCB density and the type of solder paste used. Standard no-clean solder paste is generally recommended. If another type of flux is used, complete removal of flux residual may be necessary. Example of a typical lead free reflow profile is shown below.

Critical ZoneTL to Tp

Ramp-down

Ramp-up

Ts max

25t 25ºC to Peak

Ts min

tsPreheat

Tptp

TL tL

Time

Tem

per

atur

e

Figure A. Typical Lead Free Profile and Parameters

Profile Parameter Pb free, Convection, IR/ConvectionRamp-up rate (Tsmax to Tp 3ºC/second max.Preheat temperature (Ts min to Ts max) 150ºC to 200ºCPreheat time (ts) 60 – 180 secondsTime above TL, 217ºC (tL) 60 – 120 secondsPeak temperature (Tp) 260°CTime within 5ºC of peak temperature (tp) 10 – 20 secondsRamp-down rate 4ºC/second max.Time 25ºC to peak temperature 6 minutes max.

Multilayer Organic (MLO®)Mechanical Specifications, Pad Layout, and Mounting Recommendations