mc33063a pdf

−

+

QS

1.25-V

Reference

Regulator

R

CT

Ipk

Oscillator

Q2

Q1

Switch

Collector

4

Switch

Emitter

Timing

Capacitor

GND

3

2

18

7

6

5Comparator

Inverting Input

VCC

Ipk

Sense

Drive

Collector

100 W

Product

Folder

Sample &Buy

Technical

Documents

Tools &

Software

Support &Community

MC33063A, MC34063ASLLS636N –DECEMBER 2004–REVISED JANUARY 2015

MC3x063A 1.5-A Peak Boost/Buck/Inverting Switching Regulators1 Features 3 Description

The MC33063A and MC34063A devices are easy-to-1• Wide Input Voltage Range: 3 V to 40 V

use ICs containing all the primary circuitry needed for• High Output Switch Current: Up to 1.5 A building simple DC-DC converters. These devices• Adjustable Output Voltage primarily consist of an internal temperature-

compensated reference, a comparator, an oscillator,• Oscillator Frequency Up to 100 kHza PWM controller with active current limiting, a driver,• Precision Internal Reference: 2% and a high-current output switch. Thus, the devices

• Short-Circuit Current Limiting require minimal external components to buildconverters in the boost, buck, and inverting• Low Standby Currenttopologies.

2 Applications The MC33063A device is characterized for operationfrom –40°C to 85°C, while the MC34063A device is• Blood Gas Analyzers: Portablecharacterized for operation from 0°C to 70°C.• Cable Solutions

• HMIs (Human Machine Interfaces) Device Information(1)

• Telecommunications PART NUMBER PACKAGE (PIN) BODY SIZE• Portable Devices SOIC (8) 4.90 mm × 3.91 mm• Consumer & Computing MC3x063A SON (8) 4.00 mm × 4.00 mm

PDIP (8) 9.81 mm × 6.35 mm• Test & Measurement(1) For all available packages, see the orderable addendum at

the end of the data sheet.

4 Simplified Schematic

1

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,intellectual property matters and other important disclaimers. PRODUCTION DATA.

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MC33063A, MC34063ASLLS636N –DECEMBER 2004–REVISED JANUARY 2015 www.ti.com

Table of Contents8.1 Overview ................................................................... 71 Features .................................................................. 18.2 Functional Block Diagram ......................................... 72 Applications ........................................................... 18.3 Feature Description................................................... 73 Description ............................................................. 18.4 Device Functional Modes.......................................... 74 Simplified Schematic............................................. 1

9 Application and Implementation .......................... 85 Revision History..................................................... 29.1 Application Information.............................................. 86 Pin Configuration and Functions ......................... 39.2 Typical Application .................................................... 97 Specifications......................................................... 4 10 Power Supply Recommendations ..................... 177.1 Absolute Maximum Ratings ...................................... 4

11 Layout................................................................... 177.2 ESD Ratings.............................................................. 411.1 Layout Guidelines ................................................. 177.3 Recommended Operating Conditions....................... 411.2 Layout Example .................................................... 177.4 Thermal Information .................................................. 4

12 Device and Documentation Support ................. 187.5 Electrical Characteristics—Oscillator ........................ 412.1 Related Links ........................................................ 187.6 Electrical Characteristics—Output Switch................. 512.2 Trademarks ........................................................... 187.7 Electrical Characteristics—Comparator .................... 512.3 Electrostatic Discharge Caution............................ 187.8 Electrical Characteristics—Total Device ................... 512.4 Glossary ................................................................ 187.9 Typical Characteristics .............................................. 6

13 Mechanical, Packaging, and Orderable8 Detailed Description .............................................. 7Information ........................................................... 18

5 Revision History

Changes from Revision M (January 2011) to Revision N Page

• Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table,Feature Description section, Device Functional Modes, Application and Implementation section, Power SupplyRecommendations section, Layout section, Device and Documentation Support section, and Mechanical,Packaging, and Orderable Information section. ..................................................................................................................... 1

• Deleted Ordering Information table. ....................................................................................................................................... 1

2 Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated

Product Folder Links: MC33063A MC34063A



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1

2

3

4

8

7

6

5

Switch Collector

Switch Emitter

Timing Capacitor

GND

Driver Collector

Ipk

VCC

Comparator Inverting Input

D (SOIC) OR P (PDIP) PACKAGE

(TOP VIEW)

DRJ (QFN) PACKAGE

(TOP VIEW)

Comparator Inverting Input

Switch Collector

2

3

4

1 8

7

6

5

Switch Emitter

Timing Capacitor

GND

VCC

Ipk

Driver Collector

† The exposed thermal pad is electrically bonded internally to pin 4 (GND) .

†

MC33063A, MC34063Awww.ti.com SLLS636N –DECEMBER 2004–REVISED JANUARY 2015

6 Pin Configuration and Functions

Pin FunctionsPIN

TYPE DESCRIPTIONNAME NO.Switch Collector 1 I/O High-current internal switch collector input.Switch Emitter 2 I/O High-current internal switch emitter output.Timing Capacitor 3 — Attach a timing capacitor to change the switching frequency.GND 4 — GroundComparator 5 I Attach to a resistor divider network to create a feedback loop.Inverting InputVCC 6 I Logic supply voltage. Tie to VIN.IPK 7 I Current-limit sense input.Driver Collector 8 I/O Darlington pair driving transistor collector input.

Copyright © 2004–2015, Texas Instruments Incorporated Submit Documentation Feedback 3




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7 Specifications

7.1 Absolute Maximum Ratingsover operating free-air temperature range (unless otherwise noted) (1)

MIN MAX UNITVCC Supply voltage 40 VVIR Comparator inverting input voltage range –0.3 40 VVC(switch) Switch collector voltage 40 VVE(switch) Switch emitter voltage VPIN1 = 40 V 40 VVCE(switch) Switch collector to switch emitter voltage 40 VVC(driver) Driver collector voltage 40 VIC(driver) Driver collector current 100 mAISW Switch current 1.5 ATJ Operating virtual junction temperature 150 °CTstg Storage temperature range –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under Recommended OperatingConditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD RatingsVALUE UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) 2500V(ESD) Electrostatic discharge VCharged device model (CDM), per JEDEC specification JESD22-C101, 1500all pins (2)

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating ConditionsMIN MAX UNIT

VCC Supply voltage 3 40 VMC33063A –40 85

TA Operating free-air temperature °CMC34063A 0 70

7.4 Thermal InformationMC33063A

THERMAL METRIC (1) D DRJ P UNIT8 PINS

RθJA Junction-to-ambient thermal resistance 97 41 85 °C/W

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

7.5 Electrical Characteristics—OscillatorVCC = 5 V, TA = full operating range (unless otherwise noted) (see block diagram)

PARAMETER TEST CONDITIONS TA MIN TYP MAX UNITfosc Oscillator frequency VPIN5 = 0 V, CT = 1 nF 25°C 24 33 42 kHzIchg Charge current VCC = 5 V to 40 V 25°C 24 35 42 μAIdischg Discharge current VCC = 5 V to 40 V 25°C 140 220 260 μAIdischg/Ichg Discharge-to-charge current ratio VPIN7 = VCC 25°C 5.2 6.5 7.5 —VIpk Current-limit sense voltage Idischg = Ichg 25°C 250 300 350 mV





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7.6 Electrical Characteristics—Output SwitchVCC = 5 V, TA = full operating range (unless otherwise noted) (see block diagram) (1)

PARAMETER TEST CONDITIONS TA MIN TYP MAX UNITSaturation voltage –VCE(sat) ISW = 1 A, pins 1 and 8 connected Full range 1 1.3 VDarlington connectionSaturation voltage – ISW = 1 A, RPIN8 = 82 Ω to VCC,VCE(sat) Full range 0.45 0.7 Vnon-Darlington connection (2) forced β ∼ 20

hFE DC current gain ISW = 1 A, VCE = 5 V 25°C 50 75 —IC(off) Collector off-state current VCE = 40 V Full range 0.01 100 μA

(1) Low duty-cycle pulse testing is used to maintain junction temperature as close to ambient temperature as possible.(2) In the non-Darlington configuration, if the output switch is driven into hard saturation at low switch currents (≤300 mA) and high driver

currents (≥30 mA), it may take up to 2 μs for the switch to come out of saturation. This condition effectively shortens the off time atfrequencies ≥30 kHz, becoming magnified as temperature increases. The following output drive condition is recommended in the non-Darlington configuration:Forced β of output switch = IC,SW / (IC,driver – 7 mA) ≥ 10, where ∼7 mA is required by the 100-Ω resistor in the emitter of the driver toforward bias the Vbe of the switch.

7.7 Electrical Characteristics—ComparatorVCC = 5 V, TA = full operating range (unless otherwise noted) (see block diagram)

PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT25°C 1.225 1.25 1.275

Vth Threshold voltage VFull range 1.21 1.29

ΔVth Threshold-voltage line regulation VCC = 5 V to 40 V Full range 1.4 5 mVIIB Input bias current VIN = 0 V Full range –20 –400 nA

7.8 Electrical Characteristics—Total DeviceVCC = 5 V, TA = full operating range (unless otherwise noted) (see block diagram)

PARAMETER TEST CONDITIONS TA MIN MAX UNITVCC = 5 V to 40 V, CT = 1 nF,

ICC Supply current VPIN7 = VCC, VPIN5 > Vth, Full range 4 mAVPIN2 = GND, All other pins open





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0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6

IC, Collector Current (A)

VC

E(S

AT

), O

utp

ut

Sw

itch

Satu

rati

on

Vo

ltag

e (

V)

Darlington Connection

VCC = 5 V

Pin 7 = VCC

Pin 2, 3, 5 = GND

TA = 25°C

Force Beta = 20

00 1

0.0

0.4

0.8

1.2

1.6

2.0

2.4

2.8

3.2

3.6

0 5 10 15 20 25 30 35 40

VCC, Supply Voltage (V)

I CC

, S

up

ply

Cu

rren

t (m

A)

CT = 1 nF

Pin 7 = VCC

Pin 2 = GND

TA = 25°C

1

10

100

1000

0.01 0.1 1 10CT, Oscillator Timing Capacitor (nF)

t ON

-OF

F,O

utp

ut

Sw

itch

On

-Off

Tim

e(µ

s)

VCC = 5 V

Pin 7 = VCC

Pin 5 = GND

TA = 25°C

tON

tOFF

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6

IE, Emitter Current (A)

VC

E(S

AT

), O

utp

ut

Sw

itch

Satu

rati

on

Vo

ltag

e (

V)

VCC = 5 V

Pin 1, 7, 8 = VCC

Pin 3, 5 = GND

TA = 25°C

110


7.9 Typical Characteristics

Figure 2. Output Switch Saturation Voltage vsFigure 1. Output Switch On-Off Time vsEmitter Current (Emitter-Follower Configuration)Oscillator Timing Capacitor

Figure 4. Standby Supply Current vs Supply VoltageFigure 3. Output Switch Saturation Voltage vsCollector Current (Common-Emitter Configuration)





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−

+

QS

1.25-V

Reference

Regulator

R

CT

Ipk

Oscillator

Q2

Q1

Switch

Collector

4

Switch

Emitter

Timing

Capacitor

GND

3

2

18

7

6

5Comparator

Inverting Input

VCC

Ipk

Sense

Drive

Collector

100 W


8 Detailed Description

8.1 OverviewThe MC33063A and MC34063A devices are easy-to-use ICs containing all the primary circuitry needed forbuilding simple DC-DC converters. These devices primarily consist of an internal temperature-compensatedreference, a comparator, an oscillator, a PWM controller with active current limiting, a driver, and a high-currentoutput switch. Thus, the devices require minimal external components to build converters in the boost, buck, andinverting topologies.

The MC33063A device is characterized for operation from –40°C to 85°C, while the MC34063A device ischaracterized for operation from 0°C to 70°C.

8.2 Functional Block Diagram

8.3 Feature Description• Wide Input Voltage Range: 3 V to 40 V• High Output Switch Current: Up to 1.5 A• Adjustable Output Voltage• Oscillator Frequency Up to 100 kHz• Precision Internal Reference: 2%• Short-Circuit Current Limiting• Low Standby Current

8.4 Device Functional Modes

8.4.1 Standard operationBased on the application, the device can be configured in multiple different topologies. See the Application andImplementation section for how to configure the device in several different operating modes.





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8

7

6

1

2

R*

* R 0 for constant Vin

8

7

6

1

2

VOUT

RSC

VIN

RSC

VIN

VOUT

a) EXTERNAL npn SWITCH b) EXTERNAL npn SATURATED SWITCH (see Note A)

7

→


9 Application and Implementation

NOTEInformation in the following applications sections is not part of the TI componentspecification, and TI does not warrant its accuracy or completeness. TI’s customers areresponsible for determining suitability of components for their purposes. Customers shouldvalidate and test their design implementation to confirm system functionality.

9.1 Application Information

9.1.1 External Switch Configurations for Higher Peak Current

A. If the output switch is driven into hard saturation (non-Darlington configuration) at low switch currents (≤300 mA) andhigh driver currents (≥30 mA), it may take up to 2 μs to come out of saturation. This condition will shorten the off timeat frequencies ≥30 kHz and is magnified at high temperatures. This condition does not occur with a Darlingtonconfiguration because the output switch cannot saturate. If a non-Darlington configuration is used, the output driveconfiguration in Figure 7b is recommended.

Figure 5. Boost Regulator Connections for IC Peak Greater Than 1.5 A





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QS

R

CT

Ipk

Q2

Q1

2

1

Oscillator

_

+

1.25-V

Reference

Regulator

45

3

8

7

6

RSC

0.24 W

953 W

R1

CO

1N5819

1500 pF

R28.2 kW

100 mF+

VCC

VOUT

−12 V/100 mA

1.0 mH

100 mF

Optional Filter

VIN

4.5 V to 6.0 V

++1000 mF

+

L88 mH

Comparator

VOUT = –1.25 (1+R2

R1)

VIN

VOUT

VIN

VOUT

8

7

6

4

3

2

1 8

7

6

4

3

2

1

5 5

a) External NPN Switch b) External PNP Saturated Switch

VIN

8

7

6

1

2

8

7

6

1

2

RSC

VIN

RSCVOUT

VOUT

a) EXTERNAL npn SWITCH b) EXTERNAL pnp SATURATED SWITCH


Application Information (continued)

Figure 6. Buck Regulator Connections for IC Peak Greater Than 1.5 A

Figure 7. Inverting Regulator Connections for IC Peak Greater Than 1.5 A

9.2 Typical Application

9.2.1 Voltage-Inverting Converter Application





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Typical Application (continued)Figure 8. Voltage-Inverting Converter





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R21.25 1

R1

æ ö- +ç ÷

è ø

( )

out on

ripple pp

I t9

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V Vt

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1

f

out F

in sat

V V

V V

+

-


Typical Application (continued)9.2.1.1 Design RequirementsThe user must determine the following desired parameters:

Vsat = Saturation voltage of the output switch

VF = Forward voltage drop of the chosen output rectifier

The following power-supply parameters are set by the user:Vin = Nominal input voltageVout = Desired output voltageIout = Desired output currentfmin = Minimum desired output switching frequency at the selected values of Vin and IoutVripple = Desired peak-to-peak output ripple voltage. The ripple voltage directly affects the line and loadregulation and, thus, must be considered. In practice, the actual capacitor value should be larger than thecalculated value, to account for the capacitor's equivalent series resistance and board layout.

9.2.1.2 Detailed Design Procedure

CALCULATION VOLTAGE INVERTING

ton/toff

(ton + toff)

toff

ton

CT

Ipk(switch)

RSC

L(min)

CO

Vout

See Figure 8





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200

220

240

260

280

300

320

340

360

380

−50 −25 0 25 50 75 100 125

TA, Ambient Temperature (°C)

VIP

K,

Cu

rren

t L

imit

Sen

se

Vo

ltag

e (

mV

)

VCC = 5 V

ICHG = IDISCHG


9.2.1.3 Application Performance

Figure 9. Current-Limit Sense Voltage vs Temperature

TEST CONDITIONS RESULTSLine regulation VIN = 4.5 V to 6 V, IO = 100 mA 3 mV ± 0.12%Load regulation VIN = 5 V, IO = 10 mA to 100 mA 0.022 V ± 0.09%Output ripple VIN = 5 V, IO = 100 mA 500 mVPP

Short-circuit current VIN = 5 V, RL = 0.1 Ω 910 mAEfficiency VIN = 5 V, IO = 100 mA 62.2%Output ripple with optional filter VIN = 5 V, IO = 100 mA 70 mVPP





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QS

R

CT

Ipk

Q2

Q1

2

1

CT

Comparator_

+

1.25-V

Reference

Regulator

45

3

8

180 W

7

6

RSC

0.22 W

47 kW

R2

L

170 mH

CO

1N5819

330 mF

1500 pF

R1

2.2 kW

100 mF+

+

VCC

VOUT

28 V/175 mA

1.0 mH

100 mF+

Optional Filter

VIN

12 V

VOUT

= 1.25 (1+ R2R1

)


9.2.2 Step-Up Converter Application

Figure 10. Step-Up Converter

9.2.2.1 Design RequirementsThe user must determine the following desired parameters:








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R21.25 1

R1

æ ö+ç ÷

è ø

( )

out on

ripple pp

I t9

V

( )( )( )

( )satin min

on maxpk switch

V Vt

I

æ ö-ç ÷ç ÷ç ÷è ø

( )pk switch

0.3

I

( )on

out max

off

t2I 1

t

æ ö+ç ÷

è ø

5

on4 10 t-

´


on off

on

off

t t

t1

t

+

+

1

f

( )

( )

out F Vin min

satin min

V V

V V

-+

-



CALCULATION STEP UP

ton/toff

(ton + toff)

toff

ton

CT

Ipk(switch)

RSC

L(min)

CO

Vout

See Figure 10


TEST CONDITIONS RESULTSLine regulation VIN = 8 V to 16 V, IO = 175 mA 30 mV ± 0.05%Load regulation VIN = 12 V, IO = 75 mA to 175 mA 10 mV ± 0.017%Output ripple VIN = 12 V, IO = 175 mA 400 mVPP

Efficiency VIN = 12 V, IO = 175 mA 87.7%Output ripple with optional filter VIN = 12 V, IO = 175 mA 40 mVPP





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QS

R

CT

Ipk

Q2

Q1

2

1

CT

Oscillator

_

+

1.25-V

Reference

Regulator

45

3

8

7

6

RSC

0.33 W

3.8 kW

R2

L220 mH

CO

1N5819

470 mF

470 pF

R1

1.2 kW

100 mF+

+

VCC

VOUT

5 V/500 mA

1.0 mH

100 mF+

Optional Filter

VIN

25 V

Comparator

VOUT = 1.25 (1+ R2

R1)


9.2.3 Step-Down Converter Application

Figure 11. Step-Down Converter

9.2.3.1 Design RequirementsThe user must determine the following desired parameters:








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R21.25 1

R1

æ ö+ç ÷

è ø

( )( )

( )

pk on offswitch

ripple pp

I t t

8V

+

( )( )( )

( )sat outin min

on maxpk switch

V V Vt

I

æ ö- -ç ÷ç ÷ç ÷è ø

( )pk switch

0.3

I

( )out max2I

5

on4 10 t-

´


on off

on

off

t t

t1

t

+

+

1

f

( )

out F

sat outin min

V V

V V V

+

- -



CALCULATION STEP DOWN

ton/toff

(ton + toff)

toff

ton

CT

Ipk(switch)

RSC

L(min)

CO

Vout

See Figure 11


TEST CONDITIONS RESULTSLine regulation VIN = 15 V to 25 V, IO = 500 mA 12 mV ± 0.12%Load regulation VIN = 25 V, IO = 50 mA to 500 mA 3 mV ± 0.03%Output ripple VIN = 25 V, IO = 500 mA 120 mVPP

Short-circuit current VIN = 25 V, RL = 0.1 Ω 1.1 AEfficiency VIN = 25 V, IO = 500 mA 83.7%Output ripple with optional filter VIN = 25 V, IO = 500 mA 40 mVPP





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MC33063A

1

2

3

4

8

7

6

5

0.33

R1

VIN

100 PF

CT

COR2

VOUT


10 Power Supply RecommendationsThis device accepts 3 V to 40 V on the input. It is recommended to have a 1000-µF decoupling capacitor on theinput.

11 Layout

11.1 Layout GuidelinesKeep feedback loop layout trace lengths to a minimum to avoid unnecessary IR drop. In addition, the loop for thedecoupling capacitor at the input should be as small as possible. The trace from VIN to pin 1 of the device shouldbe thicker to handle the higher current.

11.2 Layout Example

Figure 12. Layout Example for a Step-Down Converter





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12 Device and Documentation Support

12.1 Related LinksThe table below lists quick access links. Categories include technical documents, support and communityresources, tools and software, and quick access to sample or buy.

Table 1. Related LinksTECHNICAL TOOLS & SUPPORT &PARTS PRODUCT FOLDER SAMPLE & BUY DOCUMENTS SOFTWARE COMMUNITY

MC33063A Click here Click here Click here Click here Click hereMC34063A Click here Click here Click here Click here Click here

12.2 TrademarksAll trademarks are the property of their respective owners.

12.3 Electrostatic Discharge CautionThese devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foamduring storage or handling to prevent electrostatic damage to the MOS gates.

12.4 GlossarySLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable InformationThe following pages include mechanical, packaging, and orderable information. This information is the mostcurrent data available for the designated devices. This data is subject to change without notice and revision ofthis document. For browser-based versions of this data sheet, refer to the left-hand navigation.





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PACKAGE OPTION ADDENDUM

www.ti.com 15-Apr-2017

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status(1)

Package Type PackageDrawing

Pins PackageQty

Eco Plan(2)

Lead/Ball Finish(6)

MSL Peak Temp(3)

Op Temp (°C) Device Marking(4/5)

Samples

MC33063AD ACTIVE SOIC D 8 75 Green (RoHS& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 M33063A

MC33063ADE4 ACTIVE SOIC D 8 75 Green (RoHS& no Sb/Br)


MC33063ADG4 ACTIVE SOIC D 8 75 Green (RoHS& no Sb/Br)


MC33063ADR ACTIVE SOIC D 8 2500 Green (RoHS& no Sb/Br)


MC33063ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS& no Sb/Br)


MC33063ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS& no Sb/Br)


MC33063ADRJR ACTIVE SON DRJ 8 1000 Green (RoHS& no Sb/Br)

CU NIPDAU Level-3-260C-168 HR -40 to 85 ZYF

MC33063ADRJRG4 ACTIVE SON DRJ 8 1000 Green (RoHS& no Sb/Br)

CU NIPDAU Level-3-260C-168 HR -40 to 85 ZYF

MC33063AP ACTIVE PDIP P 8 50 Pb-Free(RoHS)

CU NIPDAU N / A for Pkg Type -40 to 85 MC33063AP

MC33063APE4 ACTIVE PDIP P 8 50 Pb-Free(RoHS)

CU NIPDAU N / A for Pkg Type -40 to 85 MC33063AP

MC34063AD ACTIVE SOIC D 8 75 Green (RoHS& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM 0 to 70 M34063A

MC34063ADE4 ACTIVE SOIC D 8 75 Green (RoHS& no Sb/Br)


MC34063ADG4 ACTIVE SOIC D 8 75 Green (RoHS& no Sb/Br)


MC34063ADR ACTIVE SOIC D 8 2500 Green (RoHS& no Sb/Br)


MC34063ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS& no Sb/Br)


MC34063ADRJR ACTIVE SON DRJ 8 1000 Green (RoHS& no Sb/Br)

CU NIPDAU Level-3-260C-168 HR 0 to 70 ZYF

MC34063ADRJRG4 ACTIVE SON DRJ 8 1000 Green (RoHS& no Sb/Br)

CU NIPDAU Level-3-260C-168 HR 0 to 70 ZYF

http://www.ti.com/product/MC33063A?CMP=conv-poasamples#samplebuy



















Addendum-Page 2

Orderable Device Status(1)

Package Type PackageDrawing

Pins PackageQty

Eco Plan(2)

Lead/Ball Finish(6)

MSL Peak Temp(3)

Op Temp (°C) Device Marking(4/5)

Samples

MC34063AP ACTIVE PDIP P 8 50 Pb-Free(RoHS)

CU NIPDAU N / A for Pkg Type 0 to 70 MC34063AP

MC34063APE4 ACTIVE PDIP P 8 50 Pb-Free(RoHS)

CU NIPDAU N / A for Pkg Type 0 to 70 MC34063AP

(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availabilityinformation and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finishvalue exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.



http://www.ti.com/productcontent



Addendum-Page 3

OTHER QUALIFIED VERSIONS OF MC33063A :

• Automotive: MC33063A-Q1

NOTE: Qualified Version Definitions:

• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

http://focus.ti.com/docs/prod/folders/print/mc33063a-q1.html

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device PackageType

PackageDrawing

Pins SPQ ReelDiameter

(mm)

ReelWidth

W1 (mm)

A0(mm)

B0(mm)

K0(mm)

P1(mm)

W(mm)

Pin1Quadrant

MC33063ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

MC33063ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

MC33063ADRJR SON DRJ 8 1000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2

MC34063ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

MC34063ADRJR SON DRJ 8 1000 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2

PACKAGE MATERIALS INFORMATION

www.ti.com 17-Oct-2015

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

MC33063ADR SOIC D 8 2500 367.0 367.0 35.0

MC33063ADR SOIC D 8 2500 340.5 338.1 20.6

MC33063ADRJR SON DRJ 8 1000 367.0 367.0 35.0

MC34063ADR SOIC D 8 2500 340.5 338.1 20.6

MC34063ADRJR SON DRJ 8 1000 210.0 185.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 17-Oct-2015

Pack Materials-Page 2

http://www.ti.com/lit/slua271

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