material approval record (gi-091204-03) · material approval record (gi-091204-03) part name...
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Material Approval Record (GI-091204-03)
Part Name Coaxial Micro Jack (CMJ-S00-001)
Standard GI-091204-03
Date Dec.04, 2009
Customer
Dec. 04, 2009
Supplier GigaLane Co., Ltd.
Address 1-1, Seokwoo-dong,Hwaseong-si, Gyeonggi-do, KOREA, 445-170
Tel 82-31-233-7325
Fax 82-31-233-7317
Writer Lee, Nam-Sik
Manufacturer GigaLane Co., Ltd.
Supplier
Person in Charge Examine Approve
Duty Manager General Manager Director
Name N.S. Lee J.H.Oh K.S.Yoon
Sign
Date Nov.30,2009 Nov.30,2009 Nov.30,2009
Copyright 2008 GigaLane CO.,LTD. All rights reserved
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Date Format Part Name Rev. Page GigaLane CO.,LTD. Dec. 04, 2009 Approval Record CMJ-S00-001 1.0 1/33
HISTORY
Rev. REVISION Date Department Writer
1.0 Registration Dec. 04,2009 Manufacturing Tech.
N.S. Lee
Copyright 2008 GigaLane CO.,LTD. All rights reserved
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Date Format Part Name Rev. Page GigaLane CO.,LTD. Dec. 04, 2009 Approval Record CMJ-S00-001 1.0 2/33
INDEX
1. OUTLINE................................................................................................................................................. 3
2. SPECIFICATIONS ................................................................................................................................. 4
3. DESIGN.................................................................................................................................................... 6
4. TEST PROCESS ..................................................................................................................................... 7
4.1. CONSTRUCTION ............................................................................................................................ 7
4.2. RF TEST............................................................................................................................................ 8
4.3. CONTACT RESISTANCE ................................................................................................................ 9
4.4. INSULATION RESISTANCE......................................................................................................... 10
4.5. VOLTAGE PROOF ..........................................................................................................................11
4.6. MOISTURE RESISTANCE(DAMP HEAT) ................................................................................... 12
4.7. THERMAL SHOCK........................................................................................................................ 13
4.8. CORROSION.................................................................................................................................. 14
5. TEST REPORT ..................................................................................................................................... 15
6. PART LIST............................................................................................................................................. 17
7. ROHS COMPLIANT............................................................................................................................ 18
8. PACKAGING ........................................................................................................................................ 18
9. QUALITY ASSURANCE ..................................................................................................................... 33
Copyright 2008 GigaLane CO.,LTD. All rights reserved
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Date Format Part Name Rev. Page GigaLane CO.,LTD. Dec. 04, 2009 Approval Record CMJ-S00-001 1.0 3/33
1. OUTLINE This is prescribed in the standards of the Coaxial Micro Jack(CMJ).
Copyright 2008 GigaLane CO.,LTD. All rights reserved
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2. SPECIFICATIONS
2.1. CMJ
2.1.1. Material Specification
No Description Material Finish 1 Shell Phosphor bronze Gold plated 2 Insulator LCP Natural 3 Center Contact Brass Gold plated
2.1.2. Electrical Specification
Impedance 50Ω ± 1 Rated Voltage 60V AC (rms)
Rated Frequency DC to 6GHz Temperature range -40°C~+90°C
Insulation Resistance 500 MΩ min VSWR 1.5 max up to 6GHz
Inner : 20 m ohms max Contact Resistance outer : 10 m ohms max
Dielectric withstanding voltage 200V AC / 1 min. Durability 30 mating cycle
2.1.3. Recommended PCB Pattern standard
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2.1.4. Recommended Temperature Profile
100
80
120
140
160
180
200
220
240
260
Within 2 minutes 40 t0 50 Seconds
Heating peak240 degree C 3 Seconds
183 degree C
Preheating(130 to 165 degree C)
Temperature(Degree C)
Time
1) The temperature profile above is for mounting the receptacles
(Part No. CMJ-S00-001) on Printed Circuit Board.
2) This profile is subject to change according to different conditions.
3) The maximum temperature does not exceed 260 degree C.
4) The recommended maximum temperature for manual soldering is 350 degree C for 5
seconds.
260
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3. DESIGN
3.1. DRAWINGS
C H EC K
R E V I S I O N S
SIG ND ATE SIG NR ev.N o. D ESC R IPTIO N
±
D W G N O .
PR O D U C T
PAR T N A M E
A4D R AW NU N IT
C H EC KED
APPR O VED
S C A LE
D ATE
SH EETTolerance
N o. Part N am e M aterial Plating Sub. Etc.
D irection Point updated 09.10.14 N S Lee
<CMJ-S00-001>
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4. TEST PROCESS
4.1. CONSTRUCTION
4.1.1. PURPOSE GENERAL EXAMINATION
4.1.2. STANDARD Original Specification : MIL-STD-202, Method 302, Condition B
4.1.3. METHOD & REQUIREMENTS
METHOD A. VISUALLY AND BY CALIPERS
B. MARKING : CONFIRMED VISUALLY
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4.2. RF TEST
4.2.1. PURPOSE The purpose of the RF test is to determine the insertion loss and return loss offered to a
propagation of signal during its passage between the electrical contacting surfaces of
connecting components, such as CMP, CMJ or between the electrical contacts of current
controlling components.
4.2.2. STANDARD Original specification : JIS C5402 4.1 , 4.3
4.2.3. METHOD & REQUIREMENTS
PREPARATION & PRECAUTION A. DUT
① Assembled CMP
② CMJ
B. Instrument: Vector Network Analyzer measured by 2-port procedure.
PROCEDURE A. Connect CMP & CMJ
B. Measure S21 ro S11 as below figure
REQUIREMENTS A. S11 : -14dB MAX
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4.3. CONTACT RESISTANCE
4.3.1. PURPOSE The purpose of the contact resistance test is to determine the resistance offered to a flow of
current during its passage between the electrical contacting surfaces of connecting
components, such as plugs, jacks, connectors, and sockets or between the electrical
contacts of current controlling components.
4.3.2. STANDARD Original specification : JIS C5402 4.1 , 4.3
4.3.3. METHOD & REQUIREMENTS
PREPARATION & PRECAUTION A. DUT
① CMP
② CMJ
B. Instrument: measured by 4-terminal procedure, using a Kelvin bridge, or by voltmeter-
ammeter method.
PROCEDURE A. Connect Plug & Jack
B. Measure Ri as below figure
C. Measure Ro as below figure
REQUIREMENTS
B. Center contact resistance 90mΩ MAX
C. Outer contact resistance 25mΩ MAX
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Date Format Part Name Rev. Page GigaLane CO.,LTD. Dec. 04, 2009 Approval Record CMJ-S00-001 1.0 10/33
4.4. INSULATION RESISTANCE
4.4.1. PURPOSE This test is to measure the resistance offered by the insulating members of a component
part to an impressed direct voltage tending to produce a leakage of current through or on
the surface of these members.
4.4.2. STANDARD
Original Specification : JIS C5402 5.2
4.4.3. METHOD & REQUIREMENTS
PREPARATION & PRECAUTION A. DUT
① Assembled CMP
② CMJ
B. Instrument: measured by 4-terminal procedure, using a Kelvin bridge, or by voltmeter-
ammeter method.
PROCEDURE A. Connect Plug & Jack
B. 100V DC
C. Measure R as below figure
REQUIREMENT
R : 500MΩ min
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Date Format Part Name Rev. Page GigaLane CO.,LTD. Dec. 04, 2009 Approval Record CMJ-S00-001 1.0 11/33
4.5. VOLTAGE PROOF
4.5.1. PURPOSE The dielectric withstanding voltage test consists of the application of voltage higher than
rated voltage for specific time between mutually insulated portion of a component part or
between insulated portion and ground. This is used to prove that the component part can
operate safely at its rated voltage withstand momentary over potentials due to switching.
4.5.2. STANDARD
Original specification : JIS C5402 5.1
4.5.3. METHOD & REQUIREMENT
PREPARATION & PRECAUTION A. DUT
① Assembled CMP
② CMJ
B. Instrument: High voltage source(All alternating potentials shall be expressed as root-
mean-square values, unless other-wise specified.
PROCEDURE A. Connect Plug & Jack
B. 200V AC for 1 min current leakage 2mA MAX
C. Confirmed Visually
REQUIREMENT No flashover or breakdown
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Date Format Part Name Rev. Page GigaLane CO.,LTD. Dec. 04, 2009 Approval Record CMJ-S00-001 1.0 12/33
4.6. MOISTURE RESISTANCE(DAMP HEAT)
4.6.1. PURPOSE The moisture resistance test is performed for the purpose of evaluating, in an accelerated
manner, the resistance of component parts and constituent materials to the deteriorative
effects of the high humidity and heat conditions typical of tropical environments.
4.6.2. STANDARD
Original specification : JIS C5402 7.3
4.6.3. METHOD & REQUIREMENT
PREPARATION & PRECAUTION A. DUT
① Assembled CMP
② CMJ
B. Instrument: A test chamber shall be used which can meet the temperature and humidity
cycling specified. The material used to fabricate the platforms and
standoffs, which support the specimens, shall be non-reactive in high
humidity.
PROCEDURE A. Connect Plug & Jack
B. Examine as below condition
Temperature 40±2
Humidity 90~95%
Exposed Time 96hr
REQUIREMENT
A. Center contact resistance 100mΩ MAX
B. Outer contact resistance 50mΩ MAX
C. Insulation resistance 500MΩ min
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4.7. THERMAL SHOCK
4.7.1. PURPOSE This test is conducted for the purpose of determining the resistance of a part to exposures
at extremes of high and low temperatures, and to the shock of alternate exposures to
these extremes, such would be experienced when equipment or part are transferred to
and from heated shelters in arctic areas. These conditions may also be encountered in
equipment operated non-continuously in low temperature areas or during transportation.
4.7.2. STANDARD Original specification : JIS C5402 7.2
4.7.3. METHOD & REQUIREMENT
PREPARATION & PRECAUTION A. DUT
① Assembled CMP
② CMJ
B. Instrument: A systems of sufficient thermal capacity shall be used to change ambient
chamber conditions to meet test requirements and to reach specified
temperature conditions.
PROCEDURE A. Connect Plug & Jack
B. Examine as bellow condition
REQUIREMENT
A. Center contact resistance 95mΩ MAX
B. Outer contact resistance 30mΩ MAX
C. Insulation resistance 500MΩ min
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Date Format Part Name Rev. Page GigaLane CO.,LTD. Dec. 04, 2009 Approval Record CMJ-S00-001 1.0 14/33
4.8. CORROSION
4.8.1. PURPOSE The salt spray test, in which specimens are subjected to a fine mist of salt solution, has
several more or less useful purposes when utilized with full recognition of its deficiencies
and limitations. Originally proposed as an accelerated laboratory corrosion test simulating
the effects of seacoast atmospheres on metals, with or without protective coatings, this test
has been erroneously considered by many as an all purpose accelerated corrosion test,
which if “withstood successfully” will guarantee that metals or protective coatings will prove
satisfactory under any corrosive condition.
4.8.2. STANDARD
Original specification : JIS C5402 7.1
4.8.3. METHOD & REQUIREMENT
PREPARATION & PRECAUTION A. DUT
① Assembled CMP
② CMJ
B. Instrument: The chamber and all accessories shall be made of material which will not
affect the corrosiveness of the fog, such as glass, hard rubber, or
plastic. Wood or plywood should not be used because they are resiniferous.
In addition, all parts which come in contact with test specimens shall be
of materials that will not cause electrolytic corrosion.
PROCEDURE A. Prepare Specimen
B. Exposed in 5% salt water spray for 48h (salt water temperature: 35)
REQUIREMENT
A. Center contact resistance 95mΩ MAX
B. Outer contact resistance 30mΩ MAX
C. No Heavy Corrosion
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5. Test Report
5.1. Construction Test
Measuring Visually Test
Dimension Measured Plating Crack OPEN/SHORTL 3.0(+0.1) 3.04 OK OK OK W 0.6(±0.1) 0.62 OK OK OK H 1.3(±0.1) 1.33 OK OK OK
5.2. RF Test
S-parameter
-60
-50
-40
-30
-20
-10
0
0 1 2 3 4 5 6
Frequency[GHz]
Mag
nit
ud
e[d
B]
-5
-4
-3
-2
-1
0
S11[dB]
S21[dB]
S21
S11
Frequency : DC~6GHz VSWR : 1.30 @DC to 6GHz
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5.3. Contact Resistance Specimens 1 2 3 4 5
Ri [mΩ ] 28.01 30.52 28.23 29.32 30.31 Ro[mΩ ] 11.75 10.92 12.18 11.46 11.44
5.4. Insulation Resistance Specimens 1 2 3 4 5
R [MΩ ] 500 500 500 500 500
5.5. Voltage Proog Specimens 1 2 3 4 5 Before No Breakdown No Breakdown No Breakdown No Breakdown No Breakdown
After No Breakdown No Breakdown No Breakdown No Breakdown No Breakdown
5.6. Damp Heat
Specimens 1 2 3 4 5
Before After Before After Before After Before After Before After
Ri [mΩ ] 28.01 29.43 30.52 28.32 28.23 29.06 29.32 29.00 30.31 30.08Ro[mΩ ] 11.75 11.40 10.92 11.79 12.18 11.67 11.46 11.15 11.44 11.54Insulation
Resistance[MΩ ] 500 500 500 500 500 500 500 500 500 500
5.7. Thermal Shock
Specimens 1 2 3 4 5
Before After Before After Before After Before After Before After
Ri [mΩ ] 30.59 31.76 29.90 29.93 29.11 29.07 29.68 28.86 29.37 31.10Ro[mΩ ] 10.35 11.00 14.00 11.24 13.81 12.98 12.76 13.97 11.04 13.66Insulation
Resistance[MΩ ] 500 500 500 500 500 500 500 500 500 500
5.8. Corrosion
Specimens 1 2 3 4 5
Before After Before After Before After Before After Before After
Ri [mΩ ] 31.14 56.90 30.61 62.90 29.98 30.00 29.98 47.50 29.05 40.40Ro[mΩ ] 13.01 10.29 11.93 10.08 13.85 13.11 12.79 10.33 12.25 10.61Insulation
Resistance[MΩ ] 500 500 500 500 500 500 500 500 500 500
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6. Part List
No Component Q’ty Material Type No. Color
1 Body 1 Phosphor Bronze C5210 Gold
2 Insulator 1 LCP Natural
3 Contact Pin 1 Brass C2680 Gold
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7. RoHS COMPLIANT
7.1. Phosphor Bronze C5210(BODY)
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7.2. BrassC2680 (Center Contact)
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7.3. LCP(Insulator)
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7.4. Ag Plating
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7.5. Au Plating
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7.6. Ni Plating
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8. Packaging Description Q'ty Material Method
Reel 1000 pcs Plastic Embossed Carrier Type
Out Box 1 Box Corrugated Cardboard Tape
APPR O VED
C H EC KED
D R A W N
Tolerance
D ATE
SC A LE
U N ITA4
Title
D W G .N O .
SH EET1 of 1
C H EC K
R E V I S I O N S
D ATE SIG NR ev.N o. D ESC R IPTIO N
PART NOPART NameLot NoQTY
RoHS Complicance LEAD-FREE
QC
RoHSCompliant
Em boss Tape Specification
9. Quality Assurance
If product is defective we will repair or change it