Designing the futurenew technologies that enable exciting new designs for the IoT

Martin Keenan – Technical Director, Avnet Abacus

Avnet

We are one of the world’s

largest global distributors

of electronic components

and embedded technology

serving customers in more

than 125 countries, with

revenues of $17.4bn in the

FY to July 1st 2017

What we do

We connect the world's leading

technology companies with more

than 2,000,000 customers by

providing cost-effective, value-added

services and solutions.

Avnet supports our customers,

from entrepreneurs to enterprises,

through every stage of the

technology product lifecycle.

15,700+

employees

worldwide

600+

suppliers

2,000,000+

customers

Avnet’s connected ecosystem with distinct brands

From idea to design and from prototype to production, Avnet supports

customers at each stage of the product lifecycle.

Online Community

& Education Sites

Online Resource

Directory for StartupsE-commerce

for Prototyping

Supply Chain

Support

Learn & Design Create Companies Pilot Build Mass Scale Production

Technology trends and highlights

in the key IoT building blocks

Wireless connectivity A case study in miniaturisation, accessibility

and ultra low power

Wireless solutions – making machines listen & talk

Adding connectivity – buy or make?

Wireless module vs discrete design

Module Discrete/chip down Module Advantages

RF Design Supplier’s

investment & core

expertise

Expertise required for layout,

routing, interference, shielding etc

Less pcb iterations, less

expertise required

Size Size optimised Non-module area on PCB will be

larger than module

Saves board space

Procurement 1 component More components and suppliers to

manage

Reduced production costs

Assembly 1 component Full BOM Reduced production costs

Test Module fully tested Individual testing required Reduced production costs

Quality Fully tested, known

good

RF and test expertise to cover RF

and connectivity

Increased quality

Yield loss Pre-yielded

modules

Yield losses in production, resulting

in failure analysis and re-work costs

Reduced production costs

Bluetooth® v5.0 overview2x Speed

2M PHY will double the bandwidth up to

1.4Mbps

15-50% lower power consumption

4x Range

125/500kbps codec PHYs improve

sensitivity /range

New channel selection algorithm enables

+20dBm TX

8x Advertisement Capacity

Advertisement payload grows from 31B

to 254B

37 new advertisement channels help

offload

New advertisement schemes for

advanced beacons

Murata’s MBN52832 Bluetooth® v5.0

low energy moduleFeatures

Chipset Nordic nRF52832

Processor ARM Cortex -M4

Antenna On-board

RF Conn/ Antenna PCB antenna on-board

System Clock Internal X'tal

Operating Temperature °C -40 (min) to °C (max) 85

Package LGA

Dimension 7.4 x 7.0 x 0.9mm

Supply Voltage (Vdc) 1.7v to 3.6v

Transmit Power BT +4dBM (LDO mode)

Receiver Sensitivity BT -93 dBm (LDO mode)

Transmit Mode Current 7mA (DCDC mode)

Receive Mode Current 6mA (DCDC mode)

Sleep Mode Current BT 0.36uA (system off)

Data Rate Bluetooth 1 Mbps

Applications

Home Automation

Proximity Services

Building automation

Medical/Healthcare

Beacon

Taiyo Yuden’s EYSHSNZWZ ultra-small Bluetooth®

v5.0 module

Features

Supports Bluetooth® v5.0 low energy technology specification

High-speed 2Mbps, Advertisement extensions

Features nRF52832 WLCSP (Nordic Semiconductor)

ARM® Cortex® M4F 32bit processor

512kB Flash and 64kB RAM

Supports SPI, UART, I2C, I2S, PDM and 12bit ADC

2402 to 2480 MHz ISM Band, +4dBm typ. output power

1.7V to 3.6V single power supply

Integrated 32MHz system clock

Integrated high performance PCB antenna

Supports NFC-A Type-2 for touch-to-pair application

Very small outline with shielded molding package technology

3.25 x 8.55 x 0.9 mm MAX

Applications

Wearable/Mobile accessories

Smart wristband

Smart glasses

Remote control ring

Smart pen

Heart rate monitor

Blood pressure monitor

Glucose meter

Thermometer

LoRa® global coverage

Source : LoRa AllianceTM

Modules from Murata for LoRa®

Features

Radio Chip - Semtech SX1276

MCU – STMicro STM32L (Cortex M0+ )

Flash – 192Kbytes

Dimension – 12.5 x 11.6 x 1.7 max mm

Antenna configurations – external

Host interfaces – UART/SPI/I2C

Other interfaces – GPIO/ADC

LGA (57 pads)

EU / USA / APAC ISM bands (860~930MHz)

RF Tx Power - +14dBm (+20dBm with PA boost)

Vdd – 2.2V ~ 3.6V

Operating Temperature Range – -40ºC ~ +85ºC

Metal Shield Can

FCC/IC certified and ETSI compliant

LoRa AllianceTM Certified

Part Number

Modules : CMWX1ZZABZ-078

Sample Modules : CMWX1ZZABZ-TEMP

EVB : B-L072Z-LRWAN1 STMicro

Note * - Non-Export Controlled Versions

Sensor End Node for LoRa® network

SX1276<1GHz LoRa

STM32LCortex M0

SP3T

UART

SPI

I2C

GPIO

ADC

TCXO

X’tal

Secure

ElementOptional

I2C

Match

Battery

VDD_TCXOVDD_RF VDD_MCUVDD_USB

Sensor

Sensor

Sensor

Sensor

Sigfox network coverage

Source : Sigfox

Open MCU ABZ module for Sigfox

Hardware same as for LoRa – open MCU Module

STMicro supporting Stack as downloadable Firmware for

Murata Module

– Supports AT Commands

– Will allow Application to be added to Module

Murata will support authentication in development stages

– Limited number of keys

– Header file provided for network access

Sigfox will provide network Token for development, register on portal

In production customers get Token from Sigfox portal

Murata LPWAN developments

Open

MCU

(-078)

Modem

Use-Case

(-093)

Open

MCU

(-091)

October 2017Open

MCU

Sigfox

(-078)

November 2017470MHz

Open

MCU

(1NM)

October 2017

Open

MCU

+

STSAFE

(-096/7/8)

January 2018

NB-IoT

Q4 2018

Generic Part Number : CMWX1ZZABZ-xxx

Smart Sensors for the IoT

From TE Sensor Solutions (TESS)

Avnet Abacus sensor portfolio

Internet connected sensors

Sensors for IoT - digital sensorsDigital parts can have very low power consumption.

Low power is attractive for battery applications.

Digital data works better with wireless protocols.

Electronics are becoming more bus oriented.

Digital parts integrate easily onto a bus (I²C & SPI).

Attractive for energy harvesting applications.

Digital sensors can incorporate features in firmware.

Firmware features can be manipulated in real time.

Anatomy of a digital sensor

All functions except the sensors are typically embedded on a

single chip.

A temperature sensor is often included in the uC chip.

Firmware to operate all the functions must be developed.

The firmware is then stored in non-volatile memory on the chip.

Power

Management

Low Power uC

Data

Registers

A/D

Convert

Sensor 1

Sensor 2

MUX

Power In

Data I/O

Sensor n

All on one chip

IoT and digital sensors?

Sensors are inherently analog with infinite resolution

Data to and from the Cloud is digital

Sensor data has to be translated into digital

That translation can be accomplished externally via an

ADC or internally

Digital sensors can save time, processor bandwidth and

board real estate

Other growth areas that require sensors

– Connected car

– Connected home

– Smart appliances

– Smart phones/wireless

– IIoT/Smart factory/Connected Factory

Broad range of digital sensor products from TESS Pressure Temperature Non-contact

Temperature

Humidity Position Development

Boards + Demo

MS5837-02BA

MSP100

M5600

U5600

MS5534C

MS5535C

MS5536C

MS5541C

MS5561C

MS5607

MS5611

MS5637

MS5803

MS5805

MS5806

MS4515DO

MS4525DO

MS5525DSO

85(F)BSD

86BSD

89BSD

TSYS02-12D

TSTS02-08D

TSYS01

TSYS02D

TSYS02P

TSYS02S

KPSI 380

TSD305-1C55

TSEV01CL55

TSEV0108L39

TSEV01S01C90

TSEV01S01C05

TSEV01S01C10

TPT300V

HTG3500

HTF3000LF

HTF3226LF

HTU20X

HTU21X

H2TG

H2TD3680

HTG383

ED-17

ED-19

ED-20

MRLF-30

MRLF-100

HC485

RVIT-Z

DPG

DLP/DPN

DOG2

D-Series

P-Series

KMA36

CS-15

CH-25

RT8000

RT9000

• Pmod – HTU21,

TSYS02D, TSYS01,

MS5637, MS8607,

KMA36

• Xplained Pro Wing

Boards – HTU21,

MS5637, MS8607,

TSYS01, TSYS02D,

KMA36

• Grove – HTU21,

TSYS02D, TSYS01,

MS5637, MS8607,

KMA36

• Weather Boards –

Microchip, Pictail,

Aduino

• Bluetooth Sensor

Tag & + USB

• Lora WAN PTH

• MultiSensor

Module

Multi-function sensors

Some sensors are actually two or more sensors in a single package. This provides advantages if:

Space is limited – Several sensors in a single package use less space than many individual sensors, particularly on printed circuit boards.

System power is limited – Multi-function sensors typically use less power and energy than several individual sensors. This is particularly important in battery powered applications.

Cost is an issue – Multi-function sensors will generally have a lower cost than several individual sensors. One enclosure houses several sensing elements. Material costs are reduced.

Accuracy improvements are needed – The information from one sensor can be used to improve the performance of another sensor in the package.

Additional data can be derived – In some cases the readings from two different sensors in the same package can be used to calculate another parameter of interest.

Multi-function sensors examples

Measures:

• Relative Humidity

• Air Temperature

Advantage:

By knowing both relative humidity

and air temperature, the dew point

can be calculated. All three

parameters are important for

meteorology.

HTU21D Humidity Sensor MS8607 PTH SensorMS5607 AltimeterMeasures:

• Barometric Pressure

• Air Temperature

Advantage:

The temperature reading can be

used independently for other

purposes, or can be used to apply

additional compensation to the

pressure reading, increasing

accuracy.

Measures:

• Relative Humidity

• Air Temperature

• Barometric pressure

Advantage:

Enhanced capability with digital 24-

bit pressure and temperature and

16-bit relative humidity readings.

Very low profile with a 5mm x 3mm x

1mm QFN package and utilizes a

standard I2C interface

Wireless pressure sensor – M5600/U5600

Industrial Pressure & Temperature Sensor

Dedicated Pressure sensor gage and ASIC interface

to meet low power requirements.

Embedded Antenna & RF communication.

Powered by a simple CR2032 battery.

Android / iOS Suite available for equipment health

record and diagnostic

Application

Predictive Maintenance and diagnosis, Equipment

health monitoring, Factory Automation, Manufacturing

Process & Control

Battery selection for low power

IoT applications

Powering low-power long-range wireless designs

For long life applications, optimal battery selection is critical

Key factors include:• Space available

• Application working voltage

• Battery capacity required

• System cut-off voltage

• Background current of the application

• Pulse profile of the application

• Environmental conditions that the device will be used in, especially the

temperature conditions

• Life expectancy of the device

• Cost of the battery solution

• Shelf life and self-discharge of the battery technology chosen

Smart meter example: hybrid solution for

GSM/UMTS peak pulse support

10.11.201733

3.6V Lithium-SOCL2 primary battery + Supercapacitor / Hybridcapacitor

Combining highest energy storage density with peak pulse discharge capability

Extends battery life (up to 20 years), less service cost

Hybrid-Capacitor with lowest ESR but still very low leakage current is required

Smart meter example: Low-power WAN standards

can enable a switch to CR-technology

10.11.201734

3.0V Lithium-MnO2 primary battery + Supercapacitor (if needed)

Peak pulse requirements dramatically lower than GSM (50mA instead of 2000mA)

A small Supercap with low leakage current may still be required

Avnet Abacus is offering the leading brands in

Energy StorageSUPER-CAPACITORS/

HYBRID-CAPACITORS

Primary batteries for IoT applications

Getting started with IoT – the

fast way!

ALPS Sensor network module IoT evaluation

platform

ALPS Sensor network module IoT evaluation

platform

ALPS sensor network module IoT evaluation

platform

Reaching further with Avnet

Owlet – this is further• Smart Sock is a health monitor for newborns to wear at home, designed to notify parents

if heart rate and oxygen levels fall outside preset zones

• The Owlet Smart Sock first went on sale in October 2015 on Owlet’s website. Today, it’s

available on the shelves of Buy Buy Baby

• The journey from idea to high-volume production took three years of blood, sweat, tears

and, ironically, some sleepless nights.

• The Owlet team had assumed that the sensor module on the baby’s foot could send data

straight to a smartphone through Bluetooth. But further testing uncovered range

constraints and communication reliability issues.

• As the team was frantically trying to identify the right Wi-Fi chip set, Avnet introduced

them to another start-up that happened to be developing just the module Owlet needed.

• “In the product development process, a lot of times, it feels like you’re in a dark room with

a dim flashlight, stumbling around and looking for the right path. When you have Avnet

come in with their experience and knowledge and industry experts, they’re able to really

turn on a bright light in that room and say hey, this is the path you want to take.” Zack

Bomsta, Owlet Co-founder/CTO

Braster – this is further• The Braster device captures a thermographic image of the breast tissue that can

show temperature anomalies

• Because of the life-saving potential the device offers, Braster and its backers

wanted to get it to market as fast as possible but required urgent help to secure

the best image capture solution

• Avnet introduced an established camera module manufacturer who could build a

camera module customised to their exact specifications, fully optimised for their

application at a lower cost than some of the options initially considered

• Avnet and the manufacturer were able to support lower volume for preproduction

and a product lifecycle compatible with Braster’s needs

• Avnet then provided the technical support necessary to integrate the module into

Braster’s existing design and to ensure processor compatibility.

• “Thanks to the strong cooperation between Braster and Avnet’s technical and

sales teams in the Netherlands and Poland, we delivered a successful design on

time and within budget.” - Michael Uyttersprot, Avnet

How will technology influence our

lives in the near future?

The future of fruit and veg – grown locally

The future of healthcare – connected

The future of tourism – from home

The future tourism – Palmyra arch

The future of scanning – stereo 3D camera

The future of footwear – custom trainers

Summary

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Mr Jesper Thomsen Technical Specialist, Denmark

Jesper.Thomsen@avnet-abacus.eu

Thank you