manufacturing technologymanufacturing...
TRANSCRIPT
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Manufacturing TechnologyManufacturing TechnologyManufacturing Technology
Trim and Form
Deflash
Plating
Wafer Saw Die Attach
Wire Bond Mold
Test / Mark /
Reel
High Speed
Wafer Sort
Boxstock
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Manufacturing TechnologyManufacturing TechnologyManufacturing Technology
Trim and FormPlating
Deflash
Wafer Saw Die Attach
Wire Bond Mold
Test / Mark /
Reel
High Speed
Wafer Sort
Boxstock
High Speed
Wafer Sort
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Gate /Base
ProbeSource/
Emitter ProbeHSWS process HSWS process
sorts out sorts out
electrically bad electrically bad
dice and ink it out.dice and ink it out.
High Speed Wafer SortHigh Speed Wafer SortSemiconductor Manufacturing ProcessSemiconductor Manufacturing Process
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Manufacturing TechnologyManufacturing TechnologyManufacturing Technology
Trim and FormPlating
Deflash
Wafer Saw Die Attach
Wire Bond Mold
Test / Mark /
Reel
High Speed
Wafer Sort
Boxstock
Wafer Saw
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DICING / WAFER SAWINGDICING / WAFER SAWING
unsawnunsawn waferwafer
connected diceconnected dice
wafer holderwafer holder
wafer tapewafer tape
sawn wafersawn wafer
singulated dicesingulated diceWafer sawing is to separate the Wafer sawing is to separate the
dice in wafer into individual chips.dice in wafer into individual chips.
Semiconductor Manufacturing ProcessSemiconductor Manufacturing Process
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Manufacturing TechnologyManufacturing TechnologyManufacturing Technology
Trim and FormPlating
Deflash
Wafer Saw Die Attach
Wire Bond Mold
Test / Mark /
Reel
High Speed
Wafer Sort
Boxstock
Die Attach
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Die Attach is a process of bonding Die Attach is a process of bonding
the microchip on the leadframe.the microchip on the leadframe.
Cu Leadframe
Die Attach Material
Die or MicrochipDie or Microchip
Die AttachDie AttachSemiconductor Manufacturing ProcessSemiconductor Manufacturing Process
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EUTECTIC DIE ATTACH SETEUTECTIC DIE ATTACH SET--UPUP
LEADFRAME w/ PLATINGLEADFRAME w/ PLATING
CAVITY COLLETCAVITY COLLET
DIE w/ BACKMETALDIE w/ BACKMETAL
HEATER BLOCK
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SOFT SOLDER DIE ATTACH SETSOFT SOLDER DIE ATTACH SET--UPUP
SOFT SOLDER WIRE SOFT SOLDER WIRE
Semiconductor Manufacturing ProcessSemiconductor Manufacturing Process
CAVITY COLLETCAVITY COLLET
DIE w/ BACKMETALDIE w/ BACKMETAL
HEATER BLOCK
LEADFRAME w/ PLATINGLEADFRAME w/ PLATING
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EPOXY DIE ATTACH SETEPOXY DIE ATTACH SET--UPUP
SYRINGE SYRINGE
EPOXYEPOXY
NOZZLESNOZZLES
DIEDIE
FLAT FACE FLAT FACE
COLLETCOLLET
Semiconductor Manufacturing ProcessSemiconductor Manufacturing Process
HEATER BLOCK
LEADFRAME w/ PLATINGLEADFRAME w/ PLATING
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Manufacturing TechnologyManufacturing TechnologyManufacturing Technology
Trim and FormPlating
Deflash
Wafer Saw Die Attach
Wire Bond Mold
Test / Mark /
Reel
High Speed
Wafer Sort
Boxstock
Wirebond
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99.99% Gold wires99.99% Gold wires
ThermosonicThermosonic wire bonding employs wire bonding employs
heat and ultrasonic power to bond Au heat and ultrasonic power to bond Au
wire on die surface.wire on die surface.
ThermosonicThermosonic WirebondWirebondSemiconductor Manufacturing ProcessSemiconductor Manufacturing Process
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THERMOSONIC WIREBOND SETTHERMOSONIC WIREBOND SET--UPUP
Au WIRE
SPOOL
DIE BONDED LEADFRAME
CERAMIC
CAPILLARY
Au BALL
Semiconductor Manufacturing ProcessSemiconductor Manufacturing Process
HEATER BLOCK
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WIREBONDSWIREBONDS
DIE DIE
BALL BONDBALL BOND
(1ST bond)(1ST bond) WEDGE BOND OR WELDWEDGE BOND OR WELD
(2nd bond)(2nd bond)
LEADFRAME LEADFRAME
Semiconductor Manufacturing ProcessSemiconductor Manufacturing Process
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Manufacturing TechnologyManufacturing TechnologyManufacturing Technology
Trim and FormPlating
Deflash
Wafer Saw Die Attach
Wire Bond Mold
Test / Mark /
Reel
High Speed
Wafer Sort
Boxstock
Mold
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Transfer molding is a Transfer molding is a
process of encapsulating process of encapsulating
the the wirebondedwirebonded microchip. microchip.
It gives the package its It gives the package its
distinct shape.distinct shape.Mold flashesMold flashes
(Molded Body)
Transfer MoldingTransfer MoldingSemiconductor Manufacturing ProcessSemiconductor Manufacturing Process
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TRANSFER MOLDING SETTRANSFER MOLDING SET--UPUP
CAVITIESCAVITIES
PLUNGERPLUNGER
PISTONPISTON
MOLD BASEMOLD BASE
MOLD MOLD
COMPOUNDCOMPOUND
MOLD TOOLMOLD TOOLWIREBONDED WIREBONDED
LEADFRAMELEADFRAME
Semiconductor Manufacturing ProcessSemiconductor Manufacturing Process
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MOLD TOOLMOLD TOOLMOLD COMPOUND MOLD COMPOUND
PELLETSPELLETS
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MOLD TOOLMOLD TOOL
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MOLD TOOLMOLD TOOL
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MOLD TOOLMOLD TOOL
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MOLD TOOLMOLD TOOL
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MOLD TOOLMOLD TOOL
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MOLD TOOLMOLD TOOL
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MOLD TOOLMOLD TOOL
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MOLD TOOLMOLD TOOL
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MOLD TOOLMOLD TOOL
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MOLD TOOLMOLD TOOL
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MOLD TOOLMOLD TOOL
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MOLD TOOLMOLD TOOL
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Manufacturing TechnologyManufacturing TechnologyManufacturing Technology
Trim and FormPlating
Deflash
Wafer Saw Die Attach
Wire Bond Mold
Test / Mark /
Reel
High Speed
Wafer Sort
Boxstock
Deflash
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DeflashingDeflashing is a mechanical is a mechanical
process of removing the process of removing the
mold flashes and bleeds.mold flashes and bleeds.
DeflashDeflashSemiconductor Manufacturing ProcessSemiconductor Manufacturing Process
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MOLD MOLD
FLASHESFLASHES
HIHI--PRESSURE NOZZLESPRESSURE NOZZLES MOLDED MOLDED
PACKAGEPACKAGE
BLASTING BLASTING
MEDIAMEDIA
Semiconductor Manufacturing ProcessSemiconductor Manufacturing Process
DEFLASH SET UPDEFLASH SET UP
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MOLD MOLD
FLASHESFLASHES
HIHI--PRESSURE NOZZLESPRESSURE NOZZLES MOLDED MOLDED
PACKAGEPACKAGE
BLASTING BLASTING
MEDIAMEDIA
Semiconductor Manufacturing ProcessSemiconductor Manufacturing Process
DEFLASH SET UPDEFLASH SET UP
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Manufacturing TechnologyManufacturing TechnologyManufacturing Technology
Trim and FormPlating
Deflash
Wafer Saw Die Attach
Wire Bond Mold
Test / Mark /
Reel
High Speed
Wafer Sort
Boxstock
Plating
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Solder plating is the Solder plating is the
process of coating the leads process of coating the leads
with with SnSn--PbPb solder by solder by
electrolysis.electrolysis.
SnSn--PbPb coated leadscoated leads
Solder PlatingSolder PlatingSemiconductor Manufacturing ProcessSemiconductor Manufacturing Process
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SOLDER PLATING SET UPSOLDER PLATING SET UP
Semiconductor Manufacturing ProcessSemiconductor Manufacturing Process
SnSn--PbPb
SOLDER SOLDER
ANODESANODES
MOLDED MOLDED
LEADFRAMESLEADFRAMES
+ -
e-
Sn-Pb
PLATING
SOLUTION
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Manufacturing TechnologyManufacturing TechnologyManufacturing Technology
Trim and FormPlating
Deflash
Wafer Saw Die Attach
Wire Bond Mold
Test / Mark /
Reel
High Speed
Wafer Sort
Boxstock
Trim & Form
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Trim & Form is a Trim & Form is a
mechanical process of mechanical process of
trimming and trimming and leadformingleadforming
the leads.the leads.
Singulated packages/ unitsSingulated packages/ units
Trim and FormTrim and FormSemiconductor Manufacturing ProcessSemiconductor Manufacturing Process
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Manufacturing TechnologyManufacturing TechnologyManufacturing Technology
Trim and FormPlating
Deflash
Wafer Saw Die Attach
Wire Bond Mold
Test / Mark /
Reel
High Speed
Wafer Sort
Boxstock
Test / Mark /
Reel
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Electrical testing process Electrical testing process
sorts out fallsorts out fall--outs from outs from
electrically good units.electrically good units.
Electrical FallElectrical Fall--outsouts
Electrically good unitsElectrically good units
Electrical TestingElectrical TestingSemiconductor Manufacturing ProcessSemiconductor Manufacturing Process
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LASER marking process LASER marking process
imprints device name, imprints device name,
datecodedatecode & company & company
logo on the package.logo on the package. FFFF 8328304F8
32
8304
F832
8304
F832
8304
F832
8304
F832
8304
Laser MarkingLaser MarkingSemiconductor Manufacturing ProcessSemiconductor Manufacturing Process
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F832
8304
F832
8304
Tape & reel is the standard Tape & reel is the standard
packing for surface mount packing for surface mount
packages/ devices.packages/ devices.
Carrier tape
F832
8304
Tape and Reel PackingTape and Reel PackingSemiconductor Manufacturing ProcessSemiconductor Manufacturing Process
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Manufacturing TechnologyManufacturing TechnologyManufacturing Technology
Trim and FormPlating
Deflash
Wafer Saw Die Attach
Wire Bond Mold
Test / Mark /
Reel
High Speed
Wafer Sort
BoxstockBoxstock
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Static DissipativeStatic DissipativeEmbossed Carrier TapeEmbossed Carrier Tape
Antistatic Cover TapeAntistatic Cover Tape
Tape and Reel PackingTape and Reel PackingSemiconductor Manufacturing ProcessSemiconductor Manufacturing Process
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Manufacturing TechnologyManufacturing TechnologyManufacturing Technology
Trim and FormPlating
Deflash
Wafer Saw Die Attach
Wire Bond Mold
Test / Mark /
Reel
High Speed
Wafer Sort
Boxstock
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