manufacturing considerations for optimum throughput and
TRANSCRIPT
Manufacturing Considerations for Optimum
Throughput and Quality
Factory Automation Critical to US Manufacturers
• To compete domestically with offshore CM’s, to reduce man labor design’s
need to consider reducing use of manually installed (Thru-hole) components to
full extent possible.
•Isolate Thru-Hole from solder side SMT to allow access for selective soldering
and minimize masking requirements. (i.e. Connectors, Transformers, Relays….)
(consider pre-design meeting with manufacturing dept. / company)
• Maximize Computer Integrated Manufacturing - using CAM enables us to
optimize line efficiency, substantially improve our responsiveness and accuracy
•CIM can also be a baseline for a PLM Tools and – establish a forward
compatible package and part number library.
•Establish Consistency Now with component libraries, document formats and
define your Revision Control with PLM and factory automation in mind.
TJM Core Objectives
To deliver electronic hardware that is:
1) Built to print.
2) In conformance with specified standards.
3) Delivered on time.
TJM’s Value Added
• Communication • Response to RFQ’s
• Daily status updates
• Project interface (access to Insightly)
• We verify everything….
• DFM Report• Documents any design, documentation or data concerns
throughout the manufacturing cycle.
• Quality System AS9100• Exceeds commercial standards
• Delivery
• One week is currently standard
What has the most impact to meeting
these 3 main objectives?
1) Kit Condition (when customer supplies parts)
2) Lack of ASCII / CAD / (intelligent machine data)
3) Poor or incomplete documentation -no drawing is
provided, silkscreen does not have ref des, polarity and
orientation markings missing or ambiguous)
4) Layout / Design issues –Most are silkscreen,
panelization or fiducial related.
RFQ or Build Data / Document Checklist
Musts Nice to Have• ASCII CAD Data File
• Revision Controlled BOM
• Revision Controlled DWG
• XY file (if ASCII not avail.)
• Gerber Set
• Bare Board for Oven
Profiling (Baseline)
• Step File
• Schematic
• Board Fabrication Drawing
• Extra parts set for profiling
• Sample
Procurement /
Kit Staging
SMT
ASSEMBLY
Set UpCAM
FIRST
ARTICLE AOI Inspection
Touch up / TH Final Inspection Ship
ASCII CAD
File
CircuitCAM
Pick and
Place
Program
AOI
Inspection
Program
Color
Coded
Visual Aids
Build
Planning
ASCII CAD Design File
• CAD Data Includes: PWB dimensions, Pad geometries , part package geometries and part number information not provided in standard XY file.
• Improves our manufacturing efficiency, expediency, quality, and responsiveness.
• Minimizes the potential for human error (no manual entry)
• CAD Imports build your component library over time, reducing package and part number entry and programming from job to job.
BOM Import Sources and FormatsC
he
ckP
oin
t
Cir
cu
itC
AM
Text
(ASCII)Yes Yes
Fixed
Column or
Character
Excel Yes No N/A
ODBC
(Access)Yes No N/A
Format
Cost, Height
(mils)
Polarity,
Socketed
(Y/N,Yes/No
, T/F,
True/False)
Unlimited
Delimiters
Required
Fields
Preferred
Fields
Optional Text
Fields
Optional
Number
Fields
Optional
Boolean
Fields
Template
Definition, Join
Multiple Files to
Form 1 BOM,
Analysis
Reports, Use
Customer or
Internal Number
as Primary,
AML/AVL
Mgmt, Revision
Control
Additional
Functions in
CheckPoint
Custom
BOM Fields
Supported in…
Part
Number,
Reference
Designators
Description,
Quantity
(CheckPoint)
Part Marking,
Package,
Population
Type,
Customer P/N,
Mfr, Mfr P/N,
Vendor,
Vendor P/N,
Bin Location,
Stock Code,
Software Ver,
Part Rev, URL
Fiducials
• Most common problem we see is……there are none.
• Use of Fids are key to controlling #1 Defect –
(Tombstones)
• Have Global Fids in the design data (preferrably as the
origin 0,0.
• Use Panel Fids
• Once Global fids are used to set up program the panel fids (most often) can be used for production and reduce camera location time.
Fiducial Types
Yield Results using optimized fiducials
• Production Defect rate reduced to .012% (down
from 3%) on modules with 0402, 0201 and uBGA
packages.
• Touch up time reduced by 1/3 of the original
board build that had no fiducial locations.
Most Common Component Kit
Challenges• Exact Quantities ordered – No Attrition.
• Part ID - Customer provides alternates in the kit but does
not identify alternates on pick list and BOM. (we require to
get approval for substitutes to proceed)
• Chopped Tape Dilemma – Need to specify “continuous
tape” from Digikey/Mouser.
• Component Leads on fine pitch items damaged not
protected properly on multipin devices.
• Customer often holds kit until last item is received. Send
kits ahead for review and staging, drop ship final items.
WATCH OUTSome things we have come across recently..
Inconsistent Pad Geometry on BGA
Case sample: Samtec SeaRay
Connectors• Has an interesting interconnect technology (solder
charge)
• Recommends .006” thick stencil and (min of .005”)
• Recommends over sized apertures
Notes:If the solder charge does not collapse, due to incorrect stencil
parameters, part is difficult to remove, and is not re-useable. Note: we use
.004” thick stencils on 80% of our builds due to 0402 and 0201 passives. So
here is a situation where you have one part challenging the other for correct
tooling.
Please Don’t use…unless you have to
• White Solder Mask • Dark Ledger
White mask reflects light and reduces AOI image quality.
Machine operators can not see polarity markings or ledger through machine camera during set up
Panelization
• Stencil data in gerber set is for (1) unit. Array data
requirement must be communicated to, and provided by,
the board house.
• Why is that difficult to get that from Chinese board
vendors?
• Mousebites – Be careful where these are located, keep
away from traces, via, components in general.
• Prefer Scored Tabs – Careful about location.
• Be careful of long, thin scored boarders on boards .063 or
thicker. This inflicts mechanical stress on board while
trying to break border away
Keep Out Areas for Panel Tabs?
• Mousebites • Scored Tab
Fab Issues / Most common
• No Fab drawing and notes or Read-Me files for specs
• Clear stack up instructions
• Clarify material types, Copper Weights
• Trace and spacing should be no less than .005”
• Finished hole sizes .008” or above
•
Summary
• Providing ASCII CAD File is key to throughput and
accuracy
• Use Fids – Both Global and Panel
• Oven Profile is Critical – Spare Board and Parts provded?
• Consider letting CM (TJM) buy parts. It’s cleaner
• Mask vs PAD defined(see image)
• Watch for new component packages with special
requirements (Samtec SEARAY)