manual protomat c40 · 2017-01-15 · manual protomat c40 english, version 1.0 lpkf laser &...

Manual ProtoMat C40

English, Version 1.0

LPKF Laser & Electronics AGOsteriede 7D-30827 Garbsen

Telephone : + 49 - 51 31 - 70 95 - 0 Telefax : + 49 - 51 31 - 70 95 - 90E-mail : [email protected] : http: //www.lpkf.de

2 Revision: 17.9.02 ProtoMat C40

Copyright (C) 2002 LPKF AGNo part of this document may be reproduced or transmitted or used for any purpose without the express written permission of LPKF. The information contained in this document is subject to change without prior notification. LPKF assumes no liability for the use of this document. In particular for damage resulting from information, which is present, not present or erroneous. Trademarks: HP-GL is a trademark of the Hewlett-Packard Corp.All other trademarks are the property of the specific proprietor.

Product Number: 110523

Status: 17. September 2002 08.39

ProtoMat C40 Revision: 17.9.02 3

Notes on this Manual. The information contained in this document is subject to change without previous notice. No part of this document may be reproduced or transmitted for any purposes in any form without express written permission of LPKF AG. All efforts were made to ensure that this document is as accurate as possible and that the information contained therein is complete. Nevertheless, LPKF AG cannot assume any liability for its use or for any violations of patent or other rights held by third parties resulting there from.

The operator of the machine is responsible for ensuring that the following points are observed. Ensure that

• the machine is used only for its intended purpose. • the machine is operated only in a perfect functional

condition and particularly that the safety equipment is checked regularly for proper function.

• required personal protective equipment for the operating, maintenance and repair personnel is available and used.

• the operating instructions are always kept at the location where the machine is operated and are in a legible and complete condition.

• only sufficiently qualified and authorized personnel operate, service and repair the machine.

• this personnel is trained regularly on all questions regarding labor safety and environmental protection as well as is familiar with the operating instructions and particularly the safety precautions contained therein.

• all safety and warning information attached to the machine is not removed and remains legible.


I. Outline. This Manual is subdivided into the following chapters:

1. Introduction 2. Safety precautions 3. Scope of delivery 4. Layout of machine 5. Initial operation 6. Operating procedures 7. Practical tips 8. Appendix

II. Conventions used in this manual

Bold text is used to emphasize important information.

Illustrations are numbered. Example: Fig. 5

› Prompts for actions are identified with an arrow.

Italic sections are used to indicate the reactions consequent on an action.

Word printed in italics mark proper names.

Key inscriptions and menu terms are printed in BOLD CAPITALS.

III. Notes on the symbols used

Danger! This symbol is used to highlight danger to life or health.

Caution! This symbol is used to identify hazards which may cause damage.

Note! This symbol is used for notes intended to help you avoid faults in operation or to help you improve your procedures.

Machine greenhorn:This symbol indicates important tips and information for those not already familiar with LPKF milling technology.


IV. Terminology. Copper laminate : Special extremely thin base material used for

pressing multilayers. Base material : Circuit board material coated with copper foil

Solder resist foil : Special foil with cutouts for solder connections on a circuit board.

BoardMaster : Machine control software.

CircuitCAM : Software for data processing

V. Target Group. This Manual is intended for personnel who already possess basic knowledge of production of circuit boards for the electronic sector.

VI. Intended Use. The machine described in this Manual is intended exclusively for milling and drilling standard commercial circuit board materials in the electronic industry. Any other type of use of the machine is expressly prohibited.


Contents

1.0 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.0 Safety Notes . . . . . . . . . . . . . . . . . . . . . . . . 10

3.0 Scope of Delivery . . . . . . . . . . . . . . . . . . . . 12

3.1 Accessories (available as options) . . . . . . . . . . . . .12

4.0 Layout of Machine . . . . . . . . . . . . . . . . . . . 13

4.1 Initial Setup. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

4.2 Orientation Axis / Positions . . . . . . . . . . . . . . . . . .14

4.3 Machine Components and Connections . . . . . . . .15

4.4 Serial Port(s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

4.5 Function Units . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

4.5.1 Machining Head . . . . . . . . . . . . . . . . . . . . . . . . . . 184.5.1.1 Machining Spindle with Chuck . . . . . . . . . . . . . . . . . 194.5.1.2 Working Depth Limiter . . . . . . . . . . . . . . . . . . . . . . . 20

5.0 Startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

5.1 Switching Off the Circuit Board Plotter . . . . . . . . . .23

6.0 Operating Procedures . . . . . . . . . . . . . . . . 24

6.1 Fastening the Base Material. . . . . . . . . . . . . . . . . .24

6.2 Drilling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

6.3 Insulation Milling . . . . . . . . . . . . . . . . . . . . . . . . . . .26

6.4 Contour Milling in Circuit Board Material . . . . . . . .28


6.5 Milling Wide Insulation Channels . . . . . . . . . . . . . .29

6.6 Front Panel Engraving . . . . . . . . . . . . . . . . . . . . . .29

6.7 Milling Layout Films . . . . . . . . . . . . . . . . . . . . . . . .30

6.7.1 Correction Agent . . . . . . . . . . . . . . . . . . . . . . . . . 31 6.7.2 Tinting Milled Films . . . . . . . . . . . . . . . . . . . . . . . 31 6.7.3 Desizing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

6.8 Milling Solder Resist Foils . . . . . . . . . . . . . . . . . . .32

6.9 Milling with Micrometer Screw (optional) . . . . . . . .32

6.10 Cleaning Circuit Boards . . . . . . . . . . . . . . . . . . . .33

7.0 Practical Tips . . . . . . . . . . . . . . . . . . . . . . . 34

8.0 Appendix. . . . . . . . . . . . . . . . . . . . . . . . . . . 36

8.1 Switching Over the Machine Voltage . . . . . . . . . . .36

8.2 Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39

8.2.1 X Axis. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 398.2.1.1 Filling the Rear Wipers . . . . . . . . . . . . . . . . . . . . . . . 398.2.1.2 Filling the Front Wipers . . . . . . . . . . . . . . . . . . . . . . . 40

8.2.2 Y Axis and Z Axis. . . . . . . . . . . . . . . . . . . . . . . . . 40 8.2.3 Maintenance on Working Depth Limiter. . . . . . . . 41

8.3 Serial Port SERIAL1 . . . . . . . . . . . . . . . . . . . . . . . .42

8.4 Serial Port SERIAL2 . . . . . . . . . . . . . . . . . . . . . . . .43

8.5 Connection of Incremental Motors . . . . . . . . . . . . .44

8.6 Connection of Machining Head . . . . . . . . . . . . . . .44

8.7 EPROMs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44

8.8 ProtoMat C40 Commands . . . . . . . . . . . . . . . . . . .45

8.8.1 Command Structure. . . . . . . . . . . . . . . . . . . . . . . 45


8.8.2 Standard HP-GL Commands . . . . . . . . . . . . . . . . 46 8.8.3 Special Commands . . . . . . . . . . . . . . . . . . . . . . . 47 8.8.4 Special Command for High-Frequency Spindle . . 49 8.8.5 Direct Commands. . . . . . . . . . . . . . . . . . . . . . . . . 49

9.0 Declaration of Conformity . . . . . . . . . . . . . 51

10.0 Technical Data . . . . . . . . . . . . . . . . . . . . . 52

11.0 Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

Introduction


1.0 Introduction

The machine described in this Manual is a circuit board plotter suitable for producing circuit board prototypes and engraved films. It consists basically of a base plate, an X/Y motion system and a machining head. This machining head can be moved along both axes with the aid of the X/Y motion system. The machining head can also be lowered. This results in two basic processing possibilities. First, a channel can be milled with a milling cutter in a piece of base material fastened to the base plate by moving the lower machining head. Second, a hole can be drilled in the base material by lowering the machining head when it is standing still and a drill installed.

The machine is controlled and operated almost completely by the BoardMaster software. Always read this Manual carefully before starting work with the machine. After unpacking, set up your circuit board plotter on a suitable table (see chapter „Initial Setup“ on page 13 for a description) and inspect all of the components described in the following chapters precisely, i.e. familiarize yourself with the mechanical control possibilities. This will make it easier when you then start up the machine in combination with the software with the aid of the quick start instructions or the BoardMaster Manual.

In order to ensure that any possible guarantee claims are honored, always follow the instructions in this Manual before starting up the machine. Machines exported to other EU countries are subject to the guarantee terms in that country.

Now we hope you enjoy familiarizing yourself with your circuit board plotter.

Safety Notes

10 Revision: 17.9.02 ProtoMatC40

2.0 Safety Notes

Danger: To ensure safe work with the circuit board plotter, the user should read this Manual as well as the enclosed documentation and particularly the safety precautions in bold face print!

• Keep your workplace orderly. Disorder at the workplace increases the danger of an accident!

• Take surrounding influences into consideration: Do not subject the electric machine to water or water spray. Do not use the circuit board plotter in moist or wet surroundings. Provide for good illumination. Never use the machine in areas endangered by fire or explosion.

• Keep children away from the working area! Ensure that children cannot touch the machine or connection line!

• Wear suitable work clothing! Do not wear wide clothing or jewelry. This can be caught by moving parts!

• Wear a hair net if you have long hair! Otherwise, your hair can get caught in a rotating tool!

• Care for your machine and the accessories properly and observe the maintenance instructions! Check the plug and cable regularly and if damaged have replaced by an authorized electrician!

• Before any type of maintenance or cleaning work on the machine, disconnect the power plug!

• Always be attentive! Observe your work and proceed rationally. Do not use the machine if you are unconcentrated!

• Always work with the vacuum on! Dusts resulting during operation of the machine may pose a health hazard and must therefore be evacuated!

• Check the machine regularly for damage! Ensure that all parts are installed correctly and that all conditions are fulfilled for proper operation as intended.

• Use only accessories and add-on equipment specified in the operating instructions or recommended or prescribed by the manufacturer! Use of other tools or accessories can cause damage to the machine or pose an injury hazard for the user!

• Have the machine repaired by authorized personnel! The circuit board plotter fulfills all applicable safety regulations. Repair should be performed only by qualified personnel using genuine parts, because improper repairs can pose an injury hazard for the user

• Never reach into the machine while running! • Caution! Machine changes motion speed automatically

during operation! • Change tools only with the machining head spindle stopped!

Injury hazard!

Safety Notes


• When changing tools always insert tool into chuck against stop!

• When performing manipulations on the machine, never operate the controlling PC simultaneously.

• The safety of the machine can no longer be guaranteed if modifications are made to the machine by the user and the guarantee is invalidated!

• Observe that some materials can produce carcinogenic dust or dangerous gases during processing. Obtain information from material suppliers.

• Eating, drinking or smoking while working with the circuit board plotter is prohibited! The danger exists of ingesting toxic substances through the mouth! Never leave food or beverages open in the workroom (dust deposit!).

• When using chemicals, please observe the instructions on the containers or any separate safety data sheets!

Scope of Delivery


3.0 Scope of Delivery

• 1 Machine unit LPKF ProtoMat C40 with integrated electronic circuitry

• 1 Null modem cable (Null modem/ LPKF ProtoMat control unit computer) AT adapter 9/25 pin.

• 1 Set accessories (adhesive tape, various Allen wrenches, 5 reference hole pins, tweezers, brush, 7 mm socket wrench, 2 red reference hole strips, 2 reference hole drills 2.95 mm, fuse set)

• 1 Power cable

• 1 Inserting tool for reference hole pins

• 1 Drilling panel (already mounted on machine base plate)

• 1 Piece of base material (already mounted on machine base plate)

• 1 Manual

3.1 Accessories (available as options).

The following accessories are available for this LPKF ProtoMat machine:

• Vacuum with fine filter. Danger: The fine filter is required particularly for processing materials containing fiber glass such as FR4 base material! Otherwise, the hazard exists of carcinogenic dust particles escaping!!

• Noise and dust protection hood

• LPKF AutoSwitchAutomatic switch for vacuum. With this option, the vacuum is switched on and off automatically by the machine spindle on the machining head.

• LPKF AutoContacIntegrated through-plating feature with dispenser and special solderable conductive paste.

• Integrated machining head illumination.

Layout of Machine


4.0 Layout of Machine

4.1 Initial Setup

› Unpack your circuit board plotter carefully (loosen retaining screws 1), see figure 1 on page 13). Then, loosen the transport retainers. These transport retainers are marked red and are located on:

• Arrest for X axis - 2 aluminum brackets (retainer 2)

• Arrest for Y axis - Directly on head on left (retainer 3)

• Arrest for Z axis - Allen screw (retainer 4)

Note: The machine should be positioned on a level and solid surface to prevent malfunctions and erroneous operation!

› Align the circuit board plotter so that the connection cables to the electronic unit are freely movable.

› Remove the protective foil on the machine base plate and then replace the drilling plate with base material as it was previously.

› Then connect the LPKF ProtoMat machine to the computer (COM 1 or COM 2) with the NulModem cable (2x Sub-D 25 pin plug).

› Connect the power cable on the LPKF ProtoMat machine to the line power.

› Attach the vacuum hose to the adapter (to fit retaining tube No. 111124 on Nilfisk industrial vacuum) (see Item 5 in figure below).

Abbildung 1:Transport retainers

› Attach the loose vacuum hose over the circuit board plotter to the appropriate connection on the machining head (Item 6 in figure above).

1- Machine mount on transport base 2- Retainer for X axis 3- Retainer for Y axis 4- Retainer for Z axis (machining head)5- Vacuum connection6- Vacuum hose connection

1

1

234

5

6

Layout of Machine


Note: Please save all transport retainers as well as the packaging for reuse if the machine is transported again.

4.2 Orientation Axis / Positions The machining head can move along 2 axes. These axes are called the X and Y axes. Definition of the axes is important for you during operation so that you always know where the machining head is moving. In the BoardMaster software, the motion paths are described exclusively according to these axis designations.

Abbildung 2:Orientation axes

1- Pause position: The machine is moved to this point to install or turn the material to be processed 2- Home position: This point is located on the reflection axis of the machine (reference hole system) and

serves as a reference position in the BoardMaster program. 3- Reference hole strips with front pilot pin for reference hole system. 4- Reference pin for front reference hole strip.5- Tool change position. The tool can be changed at this position.

X axis

Y axis

Z axis: Raising/lowering the machining head

1

2

3

4

5

Layout of Machine


4.3 Machine Components and Connections.

Description of front view:

Abbildung 3:Front view of LPKF ProtoMat

1- Vacuum hose 6- Machine base plate2- Machining spindle 7- Working depth limiter3- Drive motor, Y axis 8- Machining head4- Front reference hole strip 9- Cover hood (Y axis)5- Operating indicator

1

2

3

4

5

6

89

7

Layout of Machine


Description of side view, left:

Abbildung 4:Left side view

Description of right side view:

Abbildung 5:Right side view

1- Vacuum connection 8- On/Off switch with line power con-nection and fuses

2- Serial port (9 pin) for add-ons 9- Shock absorber 3- Serial port (25 pin) for connection to PC 10- X axis drive motor 4- Connection socket for X axis drive motor 5- Connection socket for Y axis drive motor6- Connection socket for machining head (spindle

drive)7- Connection socket for machining head (control

signals)

1 2 3 4 5

6

7 8

9

10

1- Operating indicator 4- Rear reference hole strip2- Front reference hole strip3- Control lever for tool mount

1

2

3 4

Layout of Machine


4.4 Serial Port(s). This circuit board plotter has 2 serial ports. The first (SERIAL1) serves for connection to the controlling computer (PC). The second port (SERIAL2) is provided for future applications.

SERIAL1 can be connected to a serial port on the computer with the aid of the NullModem cable supplied.

The Nullmodem cable is wired as follows:

The cable shield is connected only on the PC side (socket).

Observe the following parameters:

Note: The serial port on the PC can be configured under Windows in the system control.

Baud rate: 9600 Parity: NoneData bit: 8Stop bit: 1Hardware hand-

shake:FIFO buffer: off

Layout of Machine


4.5 Function Units.

4.5.1 Machining Head

The machining head has a number of purposes. It is the guide and mounting unit for the operating spindle in which the specific tool is clamped. In addition, the raising/lowering unit is integrated for raising and lowering the machining head. Moreover, the working depth limiter is attached to the bottom of the machining head. This limits the penetration depths of the drilling or milling tool in the base material to be processed.

Abbildung 6:Side view of machining head

1- Shock absorber 7- Adjustment screws for knurled nut (Caution! Do not readjust!)

2- Bottom head stop adjustment (Caution! Do not readjust!)

8- Knurled nut for milling depth adjustment

3- Solenoid 9- Arresting screw for working depth limiter

4- Retaining block for machining spindle 10- Clamping lever for tool change

5- Base plate 11- Clamping ring for machining spindle

6- Working depth limiter 12- Machining spindle

13- Connection socket for machining spindle

1

2

3

4

5

6

7

89

10

11

12

13

Layout of Machine


Abbildung 7:Top view of machining head

4.5.1.1 Machining Spindle with Chuck

The machining spindle is responsible for driving the machining tools and the chuck for holding them tightly and precisely. The chuck is permanently mounted on the machining spindle and only its tool opening can be seen from the outside (see figure 9, "Working depth limiter" on page 21).

On this circuit board plotter, the working spindle chuck is actuated with a lever, which simultaneously separates the working spindle via a coupling and opens the chuck over a spring assembly.

Caution! A tool should always be present in the working spindle chuck when switched on. The chuck must be closed under all circumstances. (For this purpose, the lever should be in the upper position A in the illustration below). If the lever is actuated with the motor running, the coupling between the motor and the chuck can be damaged. Never switch on the working spindle with the chuck opened or without a tool! To change the tool, it is first necessary to move the machining head to the tool change position.

1- Solenoid 6- Machining spindle

2- Adjustment nut for upper head stop 7- Arresting screw for working depth limiter

3- Z height adjustment nut 8- Clamping lever for shock (for tool change)

4- Threaded hole for transport container and options

9- Base plate

5- Shock absorber 10- Retaining block for machining spindle

11- Motor- clamping ring

1 2 3 4 5 6 7

8

9

1011

Layout of Machine


Abbildung 8:Control of chuck on machining spindle

Position A: Lever in normal position, chuck closed. The motor is connected to the spindle via the coupling.

Position B: To open the chuck, press the lever down. This separates the motor with the coupling and opens the chuck over a spring assembly. In this position, the tool can be removed or inserted with the aid of tweezers (only in tool change position!!).

Note: A “dummy tool” is clamped in at the factory to protect the machining head chuck (tool mount). It is absolutely necessary to remove this dummy tool before performing the first milling/drilling operation and replace it with a functional tool. The BoardMaster software indicates that tool change is required and the type of tool at the appropriate point.

4.5.1.2 Working Depth Limiter

When milling insulation channels in frequently uneven circuit board material, it is particularly important to keep the milling depths constant. With this circuit board plotter, this is achieved using a mechanical working depth limiter.

The following positive effects result:

• The material is sensed. The working depth limiter follows slightly bent base material.

• The material is held down within certain limits by the working depth limiter.

The head is lowered by the solenoid and lifted by a spring.

A

B

Layout of Machine


Abbildung 9:Working depth limiter

The milling depth can be adjusted by turning the knurled nut (2) on the working depth limiter. When the wheel is turned clockwise, the milling depth is increased, turning counterclockwise reduces the milling depth.

• Turning the knurled nut by one increment changes the milling depth by approx. 4 µm.

• Turning the knurled nut one complete rotation changes the milling depth by approx. 0.5 mm.

Danger! Always keep your hands outside of the motion range of the machine during operation! The hazard of pinching is present particularly in the area of the working depth limiter!

1- Retaining plate 4-Vacuum fitting2- Knurled nut for milling depth adjustment 5- Tool mount (chuck) 3- Retaining block for working depth limiter 6- Sensing ring in working depth limiter

1

2

3

4

5 6

Startup


5.0 Startup

This chapter describes the switch-on operation for your circuit board plotter. Some operating steps are explained with the aid of the BoardMaster software. This assumes that you have already installed this software on the PC with which you intent to control the circuit board plotter. Therefore, before continuing here, connect the circuit board plotter to the intended PC (see "Initial Setup" on page 13) and install the BoardMaster software on the PC (see BoardMaster Manual)!

Caution! Always check whether the line voltage present coincides with the voltage set on the machine. If not, see „Switching Over the Machine Voltage“ on page 36.

Before switching on, remove all objects from the machine and out of its motion range. Ensure that reference hole pins do not extent out of the base material. Reference hole pin serves for locating and, when turning the base material, as a reference point for the reflection axis of the base material

Danger! Never reach into machine during switch on!

It is necessary to observe the following switch-on sequence: 1. PC 2. LPKF ProtoMat 3. Start BoardMaster program

› Therefore, switch on the PC first.

› Then switch on the circuit board plotter with the main switch.After switching on, the machine moves to the x and y limit switches. The machine then stops at the tool change position. It then waits for commands from the machine drivers.

Note: If the machine does not move after switching on, check the following:

• Does the POWER LED illuminate (illuminates only after moving to tool change position)

• Are all cables connected correctly?

• If applicable, check fuses on line power connection.

› Start the BoardMaster software by clicking the corresponding button.

› The machine is now ready for operation.

Note: If the machine is switched off and back on again for any reason whatsoever, it is necessary to change to the menu CONFIGURATION/SETTINGS in BoardMaster. All required settings such as speeds, waiting times, positions, etc. are reloaded in the circuit load plotter after clicking OK.

Startup


Other control possibilities are described in detail in the BoardMaster Manual. However, always read this manual through completely before continuing to work with the BoardMaster Manual in order to properly familiarize yourself with the circuit board plotter and accessories (tools, etc.)!

Note: A “dummy tool” is clamped in at the factory to protect the machining head chuck (tool mount). It is absolutely necessary to remove this dummy tool before performing the first milling/drilling operation and replace it with a functional tool. The BoardMaster software indicates that tool change is required and the type of tool at the appropriate point.

5.1 Switching Off the Circuit Board Plotter.

When switching off the circuit board platter, always observe the following sequence:

1. Exit BoardMaster software 2. Switch off circuit board plotter 3. Switching off PC

Operating Procedures


6.0 Operating Procedures

This chapter explains all common operating procedures with the circuit board plotter as well as the tools and their application possibilities. Special applications are also explained, which are not necessarily important immediately for “beginners” and therefore may be confusing at the beginning. As “beginners”, you should, however, always work your way through the following subchapters:

• Fastening the base material

• Drilling

• Insulation milling

• Contour milling in circuit board material

• Cleaning the circuit board

The remaining subchapters in this chapter can be read later if required when you are familiar with the circuit board plotter.

6.1 Fastening the Base Material

When the machine is started up for the first time, you will note that a double-sided piece of base material is already present on the machine base plate. Moreover, a reference hole system is preset at the factory for DIN-A4 format. This can also be used for production of your other circuit boards. If you have to process different sizes of base material, it will be necessary for you to first create a new reference hole system. This procedure is described in detail in the BoardMaster Manual.

The primary preparations are explained in keywords here. If you are working with a LPKF circuit board plotter for the first time, perform this work only when working through the BoardMaster Manual. You will be referred to it at the corresponding point in the manual!

› Drill coincidental reference holes in the base material and drilling plate in the X direction (diameter 3.05 mm). This can also be accomplished with any desired drill press. Note that the diameter is reduced by galvanic throughplating.

› Move the machining head to the PAUSE position. Insert reference hole pins into the front and rear reference hole strips. Always ensure that the front reference hole strip is pushed against the front reference pin in the machine groove!

› First position the drilling plate and then the predrilled base material on the reference hole pins.

› Then fasten the positioned base material in addition with adhesive tape (we recommend Tesakrepp 5250) on all sides. This prevents the corners of the circuit board from bending up.



Abbildung 10:Fastening circuit board

The reference hole pins hold the circuit board in position. This is particularly necessary during contour milling. On the other hand, they are also used as a reference when turning double-sided circuit boards.

Danger! Switch on the vacuum before milling/drilling! Remember to replace the vacuum filter as required! Inhaling the material dust poses a health hazard!

Note: It is important that no contamination (adhesive tape residues, drilling or milling chips) is present between the individual layers so that the base material lays perfectly flat. Small particles below the base material would have a negative effect on the uniformity of the milling depths.

6.2 Drilling

In addition to milling, drilling is one of the primary purposes of the circuit board plotter. Circuit boards are drilled with special circuit board drills.

It is only possible to drill one circuit board at a time. Never attempt to drill a number of circuit boards on top of one another! A drilling cover plate is not required. All drills have a length of 38 mm. Further instructions are contained in the Chapter „Practical Tips“ on page 34.

Caution! Before drilling, ensure that the base material is seated tightly! Switch on the vacuum!

1- Machine bed (aluminum base plate) 4- Drilling plate 2 mm thick 2- Reference hole pins, 3 mm diameter 5- Adhesive tape 3- Base material approx. 1.6 mm thick 6- Reference hole strip



6.3 Insulation Milling

Insulation milling is the designation for cutting milled tracks around the later conductors. This insulates the conductors from the remaining copper coating. Various types of tools are available for the different materials and applications (see below). Each of these tools produces different milling tracks (see figure 12 on page 27).

Abbildung 11:LPKF universal micro and HF milling cutters

Before milling, it is necessary to ensure that only sharp LPKF universal milling cutters (36 mm long) are used. The milling width can be adjusted between 0.2 and 0.5 mm according to the thickness of the tool by changing the milling depth.

Note: It is advisable to degrease the base material with a cleaning spray before processing (degreaser for electronic components). This allows the drilling chips to be vacuumed up more easily.

As a matter of principle the milling depth (milling width) should be set as deep as possible. If work if accomplished only with the front-most tip of the milling cutter (<0.2 mm insulation), the tool wears more quickly than at greater milling depths.

Finer insulation channels can be produced with the LPKF micro milling cutters, however, the service life of these cutters is approx. 10% of that of the LPKF universal milling cutters mentioned above.

Caution! Do not mix up micro milling cutters and universal milling cutters! The two can only be differentiated under a microscope.

A special cutter which produces a rectangular insulation channel in one cut has been developed specially for HF technology.

1- Universal milling cutter2- Micro milling cutter3- HF milling cutter



Abbildung 12:Milling channel for LPKF universal, micro and HF milling cutters

Further information is given in the Chapter „Practical Tips“ on page 34.

After processing, it is necessary to clean the circuit boards. This can be accomplished with a brush machine or manually with board cleaners (LPKF accessory). In all cases, it is necessary to rinse the circuit boards thoroughly with water to rinse off any copper dust resulting from brushing.

After rinsing, it is necessary to dry the circuit board well (hot air gun) and then protect it against oxidation with soldering varnish.

Caution! Before milling, ensure that the base material is seated tightly! Switch on the vacuum!

1- Milling track, universal milling cutter

2-Milling track micro milling

cutter

3-Milling track HF milling cutter

1 2 3



6.4 Contour Milling in Circuit Board Material

The contour milling cutters should always be used for cutting out the circuit board after it is completely machined or for drilling holes with a diameter greater than 2.4 mm when the circuit board is to be cut through in the entire material thickness.

Abbildung 13:Contour cutter (1) End mill (2)

The motion rate should be reduced for contour milling. The speed varies from material to material. Use only special contour cutters (38 mm long) with a diameter of 1 or 2 mm if possible:.

The 1 mm contour cutter should be used for internal cutouts (small inner radius). Due to the lower stability, the feed rate should be reduced to a minimum.

The 2 mm milling cutters are considerably more sturdy, however, remove less material than the 3 mm contour cutters.

With a 3 mm contour cutter, a great deal of material is removed during contour milling. However, the machining spindle can be overloaded if the motion rate is set too high!

So-called “End mill” cutters are used for contour milling on soft HF base materials instead of contour cutters.

Caution! All speeds and feed rates specified in BoardMaster refer to FR4 material. Lower feed rates should be used initially for all other materials.

Danger! Remember that carcinogenic dust (from fiber glass) can occur when machining material such as FR4. Therefore, always work with vacuum switched on. Always use microfilter.

Danger! Vitally hazard gases can occur when machining some materials (e.g. Teflon)!

1- Contour cutter2-End mill



6.5 Milling Wide Insulation Channels Abbildung 14:Two-tip cutter

Wide insulation channels can be cut with a 36 mm long two-tip cutter. Various diameters are available.

The 3 mm two-top cutter is particularly suited for milling very wide insulation channels (VDE specifications)

6.6 Front Panel Engraving

It is possible to engrave the front panel (e.g. on electronic housings) with the circuit board plotter. Symbols and labels can be created in this manner.

Abbildung 15:Two-top cutter (top) and universal milling cutter (bottom)

When engraving it is necessary to adapt the feed rate to the engraving depth and material.

Use LPKF universal milling cutters or LPKF two-tip cutters.

Danger! When engraving always work with vacuum!

It is possible to cut trough aluminum front panels with a material thickness of up to 3 mm.

1- Two-tip cutter 2-Universal cutter

1

2



6.7 Milling Layout Films

Another application possibility for the circuit board plotter is produciton of layout files, which are required for exposure of circuit boards before etching. In this process a piece of plastic foil coated with lacquer is used as the base material. The upper coat of lacquer on this foil is removed by milling until only the conductor pattern for production of the circuit boards to be produced later remains. The HF cutter can be used for this machinging process.

If you are reading this manual for the first time and are a beginner in the field of circuit board milling, skip this section for the time being. It is sufficient for you to read this in detail later if you are confronted with this application.

Abbildung 16: HF cutter

Note: The instructions below on creating layout film assume that you are already familiar with operation of the circuit board plotter and also familiar with operation of the BoardMaster software. Instructions for creating layout films (!only after familiarization with BoardMaster!):

› Fasten film base (Plexiglas or glass pane) on the machine table with tape.

› Place film material on base with coated side (dull side) down.

› Then rub film material firmly and flat on the film base until no more air is in between.

› Then fasten the film air tight with transparent tape on all 4 sides (tape should not be stretchable). Ensure that no air bubbles are present between the film and base.

The milling depth can then be adjusted at the edge of the film. You can check the depth by milling a frame around the film surface (manual motion).

› The motion rate should be reduced to approx. 15 mm/sec.

Note: The 0.25 mm HF cutter is used for milling layout films.

› Switch on vacuum and reduce vacuum to one half with electronic control. If an electronic control is not present, the vacuum can be reduced to one half by allowing air to be sucked in at the vacuum fitting.

The film milling program can now be started.

Film material is available in DIN A3 and DIN A4 format. (Special sizes on request).



Notes: The film coating is sensitive to scratching and water soluble. Therefore, do not allow film to come into contact with water. If desired, the film can be recopied with a tinter. See also additional recommendations in the Chapter „Practical Tips“ on page 34.

6.7.1 Correction Agent

Engraving foils can be repaired with the correction agent “Duroscal“ red correction layer. It is very easy to use. Brush on to faulty points, allow to dry for approx. 5 min and then continue processing the engraving foil as usual.

The corrected points can only be desized with rapid desizer.

Caution! Observe safety precautions on correction agent container!

6.7.2 Tinting Milled Films

Black “Duroscal“ tinter is available for milled negative foils for creating positives. The completely milled engraved foil can be tinted with “Duroscal“ tinter by pouring the liquid onto a SAFIR tampon and distributing it uniformly over the entire foil. Wash off excess tinter with cellulose. Hold tinted foil up to light to check in order to find any weakly covered points and retint them. Then desize immediately. The tinter should not be allowed to dry.

Caution! Observe safety precautions on tinter container! Do not allow tinter to get on the back of the film, because it cannot be removed! It is also very difficult to remove the tinter from other surfaces (textiles, skin) (wear apron and rubber gloves)!

6.7.3 Desizing

Caution! Observe safety precautions on quick desizer container!

When desizing, process only one film per container, so that the rear of the second film is not damaged if the surface is still moist with tinter.

There are two possibilities for desizing:

Quick desizing. Pour quick desizer onto foil and wipe off the dissolved protective layer immediately with cellulose under slight pressure. Then dry foil with cellulose, blotting paper or rag.

Water desizing.

Place foil in a tray with luke-warm water (containing small quantity of dishwashing detergent). The protective layer dissolves after approx. 30 minutes. Remove any remaining coating residues with a fine hand



brush. This method is more economical and environmentally sound! The film can remain in the water bath for any desired length of time.

6.8 Milling Solder Resist FoilsSo-call solder resist foils such as are frequently used in circuit board production, can be completed with the circuit board plotter. The following description assumes complete knowledge of the operation of the circuit board plotter including the BoardMaster software. This chapter can be skipped by beginners for the time being during initial familiarization and read later as required.

Settings:

Tool: Unimill 100 micro cutterTool diameter: 0.15 mmRotary speed: 40,000 (20,000) rpmFeed rate: 10 (5) mm/s

Values in parenthesis apply for circuit board plotters with DC motor!

Adjust the milling depths in the unused marginal area of the solder resist foil as follows:

› Mill a square with dimensions of 2 x 2 mm with the Go to button in BoardMaster with motor and vacuum switched on to determine the milling depth.

› Measure the current milling depth (width), correct as required and mill another square to check.

› Then start the milling operation with the data prepared with the data edited with CircuitCAM.

› After completion of the milling operation, check whether all pads have been cut out. If not, start the milling operation a second time.

6.9 Milling with Micrometer Screw (optional)

The micrometer screw serves for precise adjustment of the depths. Regardless of the material surface and therefore allows processing of circuit boards with equipment as well as mechanical parts. In this application, the bottom rod on the micrometer screw serves as a stop and prevents the machine head from lowering further.



6.10 Cleaning Circuit Boards Before installing the equipment, it is necessary to carefully clean the completely milled circuit boards. This can be accomplished with a circuit board brushing machine or by hand.

To clean by hand, place the circuit board on a level surface. Brush the circuit board in the primary direction of the conductors with a wet circuit board cleaner (e.g. LPKF board cleaner PAD). Brushing is required to remove the oxidation layer and also remove chips in the insulation channel. After brushing, the circuit board should be metallically bright. From now on, the circuit board should only be touched at the edges with gloves. Then rinse off the circuit board preferably under hot flowing water to remove any brushing chips from the insulation channels and then dry with a hot air gun.

Caution! Never blow off with compressed air, because the oil particles contained in the compressed air can cause problems during further processing.

After drying, spray the circuit board with solder varnish on both sides.

Practical Tips


7.0 Practical Tips

This chapter contains tips gained from practical experience on various aspects of circuit board production with your circuit board plotter. We recommend reading these tips before operating the circuit board plotter to familiarize yourself with a few possible sources of error and exclude them.

Milling depth: Adjust the milling depth so that engraving is too deep rather than too shallow. If the engraving is too shallow, the milling tool wear more quickly.

Evacuation of the milling and drilling chips with the vacuum attachment is also important for precise milling depth.

Milling depth irregular:

Is the machine bed really clean? Adhesive tape residues or similar can have a high effect on the milling depth. Milling chips between the machine bed, drilling plate and base material can also reduce the accuracy.

Deformed based material:

Bend highly deformed material so that the sag points downward; then fasten the edges well with adhesive tape.

Loops between milling tracks:

Loops between the milling tracks can occur from incorrect milling sequence, particularly with circles. When a circle is milled counterclockwise with a tool which rotates clockwise, overlapping milling tracks can lead to fine loops between the copper sur-faces. The cause is a reduction of the cutting speed at the outer edges. The solution here is to define the correct milling sequence in LPKF CircuitCAM. The LPKF CircuitCAM standard processing already contains the correct milling directions (see LPKF CircuitCAM Manual).

Milling burr: A milling burr can be caused by dull tools or incorrect feed rate. If the structure to be milled allows, this can be corrected by setting deeper. Otherwise, replace tool.

Burr during contour milling:

Burrs during contour milling or unclean cut edges result either from a dull tool or incorrect feed rate.

Color of milled channel:

The color of the milled channel provides information on the condition of the tool with some materials. With epoxy materials, dark insulation tracks indicate that the tool is sharp, light tracks that the tool is dull.

Drill burrs: Drill burrs occur with dull tools: In this case, replace the tool (drill).

Practical Tips


Deviation of drill: Deviation of the drill occurs particularly with thin tools which are no longer fully sharp. However, it also depends on the surface structure of the material. For example, when the fiber glass structure on FR4 materials is pressed through by the copper, deviation of the drill is unavoidable even with a sharp tool. On materials with additional, removable copper foil (FR4 material with 18 µm or 9 µm Cu coating), deviation of the drill is very low. The holes can be center-punched first in an additional step. This also prevents deviation of the drill.

Glazing of hole: The hole tends to become glazed by the base material melting when the drill remains in the hole too long after drilling through. These holes then present problems for through-contacting. If necessary, reduce drilling times.

Drills break: Drills tend to break when the drilling plate has already been used numerous times. The drilling plate should be changed with each new circuit board: If a drill hits against the edge of a hole already present in the base plate, breakage can hardly be avoided. Always remove broken tools from circuit boards and drilling plates.

Uneven milling channels:

Milling channels when milling foil become uneven when air is present below the film. If the film is fastened with stretchable adhesive tape, the film can become wavy after a time. Particularly important here is the evenness of the milling base (LPKF engraving foil base).

Burr with foil milling:

Burrs during foil milling occur either as a result of a dull tool or milling too deeply.

Offsets between top and bottom sides:

Offset between the top and bottom side occurs when the HOME position has not been programmed precisely, the reference hole pins are positioned at an angle or loose.

Appendix


8.0 Appendix

8.1 Switching Over the Machine Voltage.

If it is necessary to change the machine voltage, proceed as follows:

Danger! Before working on the fuses or opening the machine, always disconnect the line power plug to exclude electric shocks!

The LPKF ProtoMat electronic box is fused on the primary side as well as secondary side. The line power side fuses (primary side) are located in the line power connection for the control and are accessible from the outside.

The voltage value located at the mark (2) is always set (see illustration below)

› Carefully pry the labeled cover (1 in figure below) out of the line power filter housing with the aid of a screwdriver.

› Then insert the fuse module into the line power filter housing turned around.

Abbildung 17:Voltage setting and fuses

The secondary side fuses are located inside the control. To replace the fuses, it is first necessary to separate the control from the mechanical stage. For this purpose, loosen the rubber feet as well as the two M4 Allen screws (3 mm) on the bottom of the machine and separate the cable connections between the mechanical stage and control stage.

12

Appendix


Abbildung 18:Position of screws for separating electronic stage from mechanical stage

› Remove the cover with the X limit switches. The control now accessible is laid out as shown in figure 19 on page 37:

Abbildung 19:View of circuit board

The secondary circuits are protected by fine fuses as follows:

1- 4x rubber feet2- 2x Allen screws (3 mm)

1

1

1

12

2

A- Line power filter I- DIL switch for setting baud rate (with standard setting

B- Transformer J- Power supply C- Transformer connection K- ProcessorD- Output stage for machining head L- EPROM L E- Output stage for Z axis (not used) M- EPROM H F- Output stage for Y axis N- EPROM of the EC motor

(electronics below cover)G- Output stage for X axis O- Processor for machining spindle

(electronics below cover)H- Processor stage 701-705 = Various fuses

(see table below)

Appendix


Reassemble the units in the opposite order as described above for disassembly.

Caution! Never mix-up incremental motor and machining head cables!

Before switching on, always ensure that the head and motor cables are positioned correctly.

The fuses in the primary fuses are located in the line power switch which also contains the line power filter and line power changeover switch (e.g. 230 V/115 V). The fuses should be slow-blow:

• 230 V fuse with 3.15 A / T

• 115 V fuse with 3.15 A / T

Fuse Type CircuitF701 3.15 A M Output stagesF703 5 A M Motor voltage for milling spindle

24V

F704 2.00 A M +5V and VREFF705 0.50 A M RS 232 C / SER1

Appendix


8.2 MaintenanceTo ensure long term reliable operation of the circuit board plotter, it is necessary to perform certain maintenance work at certain time intervals. However, this is limited to simple activities which can be accomplished simply and require hardly any time at all. The maintenance intervals specified are based on daily use of the circuit board plotter.

General checks (every 6 months):

8.2.1 X Axis

On the circuit board plotter, it is necessary to ensure that wipers for the X axis carriage guides are always moistened with oil. The wipers for the X axis are located on both sides of the carriage in front of and in back of the cheeks (total 4 each). To attain access to these wipers, a hole is located in the guide rail cover on the left and right (see figure below).

Abbildung 20:

8.2.1.1 Filling the Rear Wipers

› Move the carriage to the tool change position. The service openings are now located behind the guide cheek.

Oil can then be filled into the wiper hole in each side through the opening with the syringe supply (0.5 ml).

1- Tool carriage2- Machine base plate 3- Guide rail cover 4- Service opening

2

Appendix


8.2.1.2 Filling the Front Wipers

› Move the carriage (BoardMaster) from the tool change position 112 mm to the rear (+X).

The service openings are now located in front of the guide cheek and the wipers can be filled with the syringe (0.5 ml).

Caution! Wipe excess oil off the housing, because it could dissolve the paint. Never move the carriage by hand, because otherwise the incremental motor output stages could be damaged by inductive voltage!

8.2.2 Y Axis and Z Axis

• Check the guide shafts for the Y and Z axis for cleanliness and grease. If the shafts are dirty first clean them (brush or rag) and then regrease lightly with standard commercial machine grease, under all circumstances.

Caution! Grease the transport spindle for the Y axis regularly (LPKF special grease)!

Abbildung 21:Y and Z axis guide shafts

• Always keep the transport spindles clean.

1- Y axis guide shafts 3- Y axis transport spindle 2- Z axis guide shafts

1

2

3

Appendix


8.2.3 Maintenance on Working Depth Limiter

Disassemble and clean the working depth limiter according to the instructions below every 3 months when the circuit board plotter is used daily.

Abbildung 22:Sequence for cleaning working depth limiter

Danger: Always switch off the circuit board plotter with the main switch before disassembling and cleaning the working depth limiter. Otherwise, a pinching hazard exists from uncontrolled motion of the machining head!

After switching off the machine, proceed as follows (the numbers in parenthesis refer to the numbers in the illustration above):

› Disconnect plug from working spindle (1).

› Loosen Allen screws (2) for clamping the spindle in the retaining block.

› Remove chuck lever (3) by turning out (to left).

› The spindle can then be pulled out upward (4).

› Remove retaining block (5).

› The working depths limiter (6) can then be pressed downward and pulled out to the side for cleaning.

› Unscrew knurled nut (7) from working depth limiter, clean thread and lubricate with graphite grease.

› Clean both parts of the working depth limiter with the brush supplied.

› After cleaning reinstall the working depth limiter in the opposite order and reposition the spindle in the retaining block. Ensure that the retaining block coincides with the groove in the working depth limiter and the Woodruff key (see figure below)!:

1

2

3

4

56

7

Appendix


Abbildung 23:Assembly of retaining block with working depth limiter

› Before starting up, always check to ensure that the spindle is installed at the correct depths. The distance between the tip of the drill and machine plate should be 0.5 mm when the head is lowered (see figure 24 on page 42).

Caution! If the interval is too small, the machine plate can be damaged when drilling. If the interval is too large, the machine can no longer drill through the material.

› Then retighten the screws (2) and reconnect the plug to the spindle.

› Finally screw the chuck lever back in.

Abbildung 24:Check interval for working depth limiter

8.3 Serial Port SERIAL1 The serial data channel SERIAL1 corresponds to an RS 232-C standard interface with galvanic decoupling and serves for communication with a PC for control. The DCD signal input on the control allows the control to be stopped quickly when the signal level changes from Low to High. This makes it possible to STOP the machine directly with the PC by activating the signal DTR. The transfer rate for SERIAL1 can be programmed with the DIL switches 1 and 2.

Appendix


SERIAL1 pin assignment:

All signals are electrically decoupled, contacts not designated are not used.

8.4 Serial Port SERIAL2 The serial data channel SERIAL2 corresponds to an RS 232-C standard interface and can be used for communication between the control and another system. The transfer rate for SERIAL2 can be programmed with DIL switches 3 and 4.

Switch 1 Switch 2 Baud rateOFF OFF 4800 baudsON OFF 9600 baudsOFF ON 19200 baudsON ON -

Pin Signal Meaning2 TXD Transmit Data3 RXD Receive Data4 RTS Request to Send5 CTS Clear to Send7 GND-I Ground (insulated) 8 DCD Data Carrier Detect20 DTR Data Terminal Ready

Switch 3 Switch 4 Baud RateOFF OFF 4600 bauds ON OFF 9600 baudsOFF ON 19200 baudsON ON -

Appendix


SERIAL2 assignment

Contacts not designated are not used.

8.5 Connection of Incremental Motors The incremental motors are connected with a 15-pin SUB-D connector for each axis. Actuation of a limit switch immediately disables further motion along the axis in the direction of the limit switch. The position of the sockets is described in Chapter „Machine Components and Connections“ on page 15.


8.6 Connection of Machining HeadThe machining head is connected to the control unit by a 15-pin socket. The position of the socket is described in the Chapter „Machine Components and Connections“ on page 15. Another 5-pin cable serves for power supply to the machining head spindle.


8.7 EPROMs The software for the control is located in 2 EPROMs. If the EPROMs are to be replaced (updates), it is necessary to partially disassemble the circuit board plotter. Disassemble the electronic box as described in the Chapter „Switching Over the Machine Voltage“ on page 36.

The EPROMs should only be removed with the so-called IC-puller to avoid damaging the contacts in the sockets. When installing the new EPROMs, support the circuit board from below to prevent it from bending too much. Ensure that the EPROMs are positioned correctly.

PIN Signal Meaning3 TXD Transmit Data2 RXD Receive Data7 RTS Request to Send8 CTS Clear to Send5 GND Ground

Appendix


8.8 ProtoMat C40 Commands

This chapter is not intended for beginners in LPKF machining technology. Commands are described here, for which beginners do not require precise knowledge. This chapter is intended exclusively for specialists for circuit board plotters to help in troubleshooting and eliminating problems.

8.8.1 Command Structure

The SMCU control (Signal Motion Control Unit) for the machine interprets the HP-GL commands described below and converts them to defined reactions.

The resolution of the machine is 0.0079375 mm. It therefore deviates from the resolution of standard HP-GL plotters. When original com-mands are used, output is therefore smaller.

Syntax:

The SMCU expects a separator between the parameters for the com-mands which is not a number or capital letter. A new command can fol-low a parameter without a separator. The last character in the transmitted command file must be a semicolon or line feed symbol (0A Hex).

Unfamiliar commands are ignored by the control. However, their para-meters can lead to undesired “Plot absolute” or “Plot relative” com-mands.

Symbol Meaning{...} Contents can be repeated as frequently as required.() The parameters for the command are located between these

parenthesis.[] The contents of these brackets is optional and can be

eliminated.

Appendix


8.8.2 Standard HP-GL Commands

AA (x,y,a{,}){;} Arc Absolute Draws an arc around the absolute coordinates (x,y) starting from the current position with arc angle a=[degrees]. For negative arc angle a, drawing is accomplished clockwise, otherwise vice versa.

AR (x,y,a{,}){;} Arc Relative Draws an arc around the relative coordinates (x,y) starting from the current position with arc angle a=[degrees]. For negative arc angle a, drawing is accomplished clockwise, otherwise vice versa.

CI (r{,}){;} Circle Draws a full circle around the current position with radius r. The resolution is ignored, because it always draws with maximum resolution. EA (x,y){;} Edge Rectangle Absolute Draws a rectangle defined by two diagonally opposing corner points. The first corner point is determined by the current position, the second by the absolute coordinates (x,y).

ER (x,y){;} Edge Rectangle Relative Draws a rectangle defined by two diagonally opposing corner points. The first corner point is determined by the current position, the second by the relative coordinates (x,y).

IN {;} Initialize Sets control to same status as after switch on. All standard settings are therefore valid.

IW (x0,y0,x1,y1){;} Input Windows Limits the operating range XY axis to a window with the specified corner coordinates.

OH {;} Output Hard Clip Limits The control automatically determines its maximum motion range within the limit switches and sends the coordinates determined in this manner as an ASCII string in the form (“W Xmin,Ymin,Zmin,Xmax,Ymax,Zmax <cr>“) to the PC.

OS {;} Output Status The control sends its status line as ASCII-Hex („S xxxx <cr>“) to the PC.

PA (x1,y1{,...xn,yn}){;} Plot Absolute Draws a line from the current position to the absolute coordinates entered one after another. The commands PU and PD can be specified as parameters between the coordinate pairs. If other coordinate pairs are transmitted, the command word PA can be eliminated. All coordinate pairs without command word are related to the last PA or PR commands sent and executed accordingly.

Appendix


PD {;} Pen Down Lowers the tool.

PR (x1,y1{,...xn,yn}){;} Plot Relative Draws a line from the current position to the relative coordinates entered one after another. The commands PU and PD can be specified as parameters between the coordinate pairs. If other coordinate pairs are transmitted, the command word PA can be eliminated. All coordinate pairs without command word are related to the last PA or PR commands sent and executed accordingly.

PU {;} Pen Up Lifts the tool.

VS (v{,n}){;} Velocity Select Defines the path speed in the XY plane v=[m/s] with lowered tool and assigns this speed to a tool with the number in.

8.8.3 Special Commands

All special commands start with an “!“ mark and the further syntax corresponds to the HP-GL standard commands.

!AS (a){;}Acceleration SetDefines a new acceleration constant a=mm/s².The valid value range is 10...50000.

!CC {;} Close Channel Ends data transmission started with !OC.

!CM (n){;} Change Mode Changes between the working modes Drilling (n=0) and Milling (n=1).

!CT (n){;} Command Counter Changes between Echo mode (n=1) and Non-echo mode (n=0). In the Echo mode, the machine acknowledges each correctly executed command with the message “C<cr>“.

!EM (n){;} External Motor Switches the machining motor ON (n=1) or OFF (n=0)

!ES (n){;}Enable Stop Enable (n=1) and disable (n=0) for external Stop function: After switching on, the external stop function is disabled.

!FP {;} Full Power Switches the motors for the XYZ axis to full power.

Appendix


!HP {;} Half Power Switches the motor for the XYZ axis to half power.

!OC {;} Open Channel Opens direct data transfer from serial data channel SER1 to serial data channel SER2. All characters received on data channel SER1 are transmitted to data channel SER2 until the character string !CC is received

!ON (a){;} Output Nominal Position The control sends the nominal position (set position) for the motor access addressed with the parameter a. The motor axes are assigned the following addresses

• 0 = X,Y,Z axis

• 1 = X axis

• 2 = Y axis

• 3 = Z axis

!RD (a){;} Read Port Reads import port with address a=<0..15>. The data is output via the serial port from which the command came as ASCII numbers.

!RS (r){;} Resolution Set Sets the increment (r=m/step) for the machine in the control. The valid value range is 1...32000.

!TA (x,y,z){;} Plot Three-D Absolute Completes a spatial motion from the current position to the absolute coordinates (x,y,z).

!TD (t1,t2,t3,t4){;} Time for Drilling Sets the new drilling times t=[ms].

!TM (t1,t2,t3,t4){;} Time for Milling Sets the new milling time t=[ms].

!TR (x,y,z){;} Plot Three-D Relative Completes a spatial motion from the current position to the relative coordinates (x,y,z).

!TS (t){;} Time to Stabilize Sets the stabilizing time t=[ms] between the individual commands.

!TW (t){;} Time to Wait The subsequent command is processed only after expiration of the waiting time t=[ms].

Appendix


!VU (v){;} Velocity if Pen Up Defines the track speed v=[m/s) for motion in the XY plane when the tool is up.

!VZ (v){;} Velocity Z Axis Defines the speed v=[m/s] for motion along the Z axis.

!WR (a,d{,m}){;}Write Port Writes the data word d to the port address a=<0..15>, whereby assignment of a bit mask is possible.

!ZA (z){;} Plot Z Axis Absolute Moves the Z axis from the current position to the absolute coordinate (z).

!ZR (z){;} Plot Z Axis Relative Moves the Z axis from the current position to the relative coordinate (z).

8.8.4 Special Command for High-Frequency Spindle

Before communicating with the high-frequency spindle, it is necessary for the command to open the SERIAL2 port to be set (!OC;), then SERIAL2 port must be closed again (!CC;)

!RM (r){;} Revolutions Motor, r=0...60. Sets the rotary speed (r)*1000 for the high-frequency spindle.

8.8.5 Direct Commands

The direct commands are special commands which are processed immediately after their interpretation bypassing the command buffer.

!CB{;} Clear Buffer Deletes all commands in the command buffer.

!GO{;} Go On Deactivates the Stop command and continues processing of the commands.

!RC{;} Repeat Command Repeats the last command processed.

Appendix


!ST{;} Stop Interrupts processing of the commands after completion of the current command.

The implemented commands represent a subset of the HP-GL commands. If the machine is to be controlled by a desired CAD system, it is necessary to note for the HP-GL commands that the increments are significantly less than with normal pin plotters.The increment width is 7.9375 m/step. (6,35 mm/800 Steps).

Declaration of Conformity


9.0 Declaration of Conformity

EC Declaration of Conformity

according to EU Machine Guidelines 98/37 EC.

We hereby confirm that the machine

ProtoMat C40

is a machine according to EU Machine Guideline 98/37 EC.Any modification to the designated machine not coordinated with us invalidates this declaration for this machine.

We maintain a quality assurance system certified by Daimler-Chrysler according to ISO 9001 and have therefore observe the following EC Guidelines and EN Standards in development and production of the machine:

EC Guidelines:

• EC Machine Guidelines 98/37 EC

• Low voltage operating equipment 73/23 EEC

• EMC 89/336 EEC

Harmonized Sstandards:

CE approval symbol was attached to the machine in accordance with Guideline 97/37 EC.

Manufactured by LPKF Laser & Electronics AGOsteriede 7D-30827 GarbsenGermany

Garbsen, 1 August 2002 Bernd Hackmann (CEO)

This Declaration confirms conformance with the specified guidelines, however, is not a guarantee of properties. The safety precautions in the product documentation supplied are to be observed..

• EN 292-1 • EN 292-2• EN 294 • EN 349• EN 547-2 • EN 614-1• EN 626-1 • EN 1050• EN 1873 • EN 4871• EN 11203

Technical Data


10.0 Technical Data

Machine operating voltage: ........... 200-240V (switchable: 100-120V)Power consumption: ...................... 150 VAWorking spindle speed: ................. 40.000 rpm.Permissible humidity:..................... max. 60%Operating temperature: ................. 15-25°C (59-77°F)Weight: .......................................... approx. 24 kgDimensions (WxHxD): ................... 420 x 350 (365) x 565 mmAirborne noise at workplace: ......... 71dB (A) without vacuum

Minimum conductor width:............. 0.1 mmMinimum conductor interval:.......... 0.2 mmMinimum hole diameter: ................ 0.3 mmMotion range:................................. 340 mm x 200 mmRepetition accuracy: ...................... +/- 0.005 mmAccuracy of reference hole system:+/- 0.02 mmMachine spindle:............................ EC motor 10,000 - 40,000/min.

(variable)Tool change: .................................. Semi-automaticTool mount: .................................... 1/8“ quick clamp chuckDrilling capacity: ............................ max. 78 strokes/min.Resolution (minimum motion step):0.0079375 mmMotion rate:.................................... 40 mm /sec.Milling depth adjustment:............... Mechanical sensingX/Y drive: ....................................... Incremental motors, precision....................................................... spindleZ drive:........................................... Electromagnetic with shock absorber Applications: All 1 and 2-sided types of circuit

board with usual equipment density(FR3, FR4, G10) as well as SMD fine conductor technology, contourmilling, front panel/plate engraving,multilayer up to 4 layers in combination with MiniContac-II and

MultiPress-II.

Index


11.0 Index

AAccessories .................................................................................................................... 12Airborne noise ............................................................................................................... 52AutoContac ..................................................................................................................... 12AutoSwitch ...................................................................................................................... 12

BBase Material ................................................................................................................. 24Base material ................................................................................................................... 5BoardMaster ................................................................................................................ 5, 9

CC40 Commands ........................................................................................................... 45Caution ................................................................................................................................ 4Chuck ................................................................................................................................. 19CircuitCAM ........................................................................................................................ 5Clamping lever for tool change ............................................................................ 18Cleaning ........................................................................................................................... 33Command Structure ................................................................................................... 45Conventions ..................................................................................................................... 4Copper laminate ............................................................................................................. 5

DDanger ................................................................................................................................ 4Dimensions ..................................................................................................................... 52Drilling ................................................................................................................................ 25dummy tool ............................................................................................................... 20, 23

EEngraving ........................................................................................................................ 29EPROMs .......................................................................................................................... 44

FFront Wipers ................................................................................................................... 40

Hhead illumination .......................................................................................................... 12High-Frequency Spindle .......................................................................................... 49HP-GL Commands ..................................................................................................... 46

IIntended Use ................................................................................................................... 5

Index


KKnurled nut for milling depth adjustment .........................................................18

LLoops ..................................................................................................................................34

MMachine greenhorn .......................................................................................................4Machine Voltage ...........................................................................................................36Machining Head ......................................................................................................18, 44Machining Spindle .......................................................................................................19Maintenance ...................................................................................................................39Micrometer Screw ........................................................................................................32Milling .........................................................................................................26, 28, 29, 30, 32Milling depth ....................................................................................................................34

NNote .......................................................................................................................................4Notes ....................................................................................................................................3Nullmodem cable .........................................................................................................17

OOperating temperature ..............................................................................................52

PPermissible humidity ..................................................................................................52Power consumption ....................................................................................................52POWER LED ..................................................................................................................22Practical Tips ..................................................................................................................34

RRear Wipers ....................................................................................................................39

SSafety Notes ...................................................................................................................10Serial Port ..................................................................................................................17, 42serial ports .......................................................................................................................17Shock absorber .............................................................................................................18SMCU .................................................................................................................................45Solder resist foil ..............................................................................................................5Solder Resist Foils ......................................................................................................32Sources of error ............................................................................................................34Special Commands .....................................................................................................47Switching Off ..................................................................................................................23switching on ....................................................................................................................22symbols ...............................................................................................................................4

Index


TTarget Group .................................................................................................................... 5Terminology ...................................................................................................................... 5Transport retainers ..................................................................................................... 13

VVacuum ............................................................................................................................. 25

WWeight ............................................................................................................................... 52Working Depth Limiter .............................................................................................. 41Working depth limiter ................................................................................................. 18Workplace ....................................................................................................................... 10

XX axis ................................................................................................................................. 39

Index


manual protomat c40 · 2017-01-15 · manual protomat c40 english, version 1.0 lpkf laser &...

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