maf communication specification

8/3/2019 MAF Communication Specification

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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.

Specification number:

MAF(AC)-C02

The date: April 4, 2006

Communication specifications

At the

deliverydestinationDevicename

Aligner

Modelname

MAF-AMAF-C

This document was accepted.

Date of acceptance Receipt stamp

Date

Please send back a part of this specifications after it stamps it at once after it accepts.

Tatsmo Ltd.

System equipment

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Specification number:

MAF(AC)-C02

Approval

Examination

Making Business

A.RS-485 communication command content explanation1.Link communication specification

(1)Interface RS485(2)Connected method Half duplex multi-drop connection(16 or

less)(3)Synchronize system Start-stop synchronization

(4)Transmission rate9600bps 19200bps 38400bps 57600bps

(5)Data form One start bitEight data bitNo parityOne stop bit

(6)Communication code ASCII 7 bit code(7)Body number(address) 0 F(The hexadecimal number and the 0th are thecontrol stations. )

2.Transmission control character(1)EOT(End of Transmission) Transmission end(04H)

A (2)ENQ(Enquiry) Inquiry(05H)

(3)ACK(Acknowledge) Positive response(06H)

B (4)NAK(Negative Acknowledge) Negative response(15H)

(5)STX(Start of Text) Text beginning(02H)

C (6)ETX(End of Text) Text conclusion(03H)

3.Communication protocol1 Data transmission control procedure(phase)

Phase 1 Connection of data transmission line(regulations and off

the subject)Phase 2 Establishment of data linkPhase 3 Transmission of informationPhase 4 ConclusionPhase 5 Cutting of line(regulations and off the subject)

(2)Polling procedurePolling is operation that the control station regularly solicits the transmission ofthe message to the tributary station by one game to prevent the right tobecome a master station being fought.(procedure 1) Data link initialization(procedure 2) The polling sequence is transmitted. (phase 2)

(procedure 3) Data transfer(phase 3)(procedure 4) End of data transmission

Transmission of all data end

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Mistake of data form etc.(procedure 5) No response of master station

After time of the time-out, the control station is a conclusion of the datalink.(procedure 6) Conclusion of data link(phase 4)

When it wants to discontinue communicating or you want to concludethe data link

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Figure 1. Polling procedure

(3)Selecting procedureSelecting means Control station..plural..bureau..informationmessage..receive..solicit..operation.Farstoserecting is adopted for Selecting.

(procedure 1) Initialization of data link(procedure 2) Transmission of selecting sequence(phase 2)(procedure 3) Data transmission(procedure 4) Positive response(phase 3)(procedure 5) Negative response

Abnormality of data form etc.

(procedure 6) No responseAfter time of the time-out, the master station is a conclusion of the data

link.(procedure 7) Conclusion of data link(phase 4)

Figure 2. Selecting procedure

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ADD : CMD :

( 2 )( 1 )

< ADD> [ ENQ ][ EO T ] [ EO T ] ( 5 )

( 6 )

[E O T ]

( 4 )

[ S T X ]< CMD>< D A T A> [ E T X ]

( 3 )

( )

( 1 )

[ EO T ]

ADD : CMD :

[ S T X ]< CMD> [ E T X ]

( 3 )

( 7 )

[ EO T ]( 6 )

( 5 )

( 4 )[ AC K ]

[N AK ]

( 2 )

< A D D >


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4.Command listNo. Comm

andSummary

1 CPI Reset of CPU2 RST Initialization of Aligner3 PAU Temporary stop4 CNT Temporary stop release5 VVN Aligner chuck vacuum ON6 VVF Aligner chuck vacuum OFF7 NYG It moves to the wafer specification position.8 ALG Alignment execution(After it samples it, move to a

specified position and a specified angle. )9 OCH The wafer is moved to a specified position and a specified

angle. (It is effective only after alignment is executed. )10 DEF Set of default data value11 ERF Release of error12 STS Demand of status

13 WCH Reading of wafer existence(Electromagnetic valveoperation and exist. )14 VCH Reading of wafer existence(There is no electromagnetic

valve operation. )15 RWF Reading of wafer size(It is effective only after the ALG

command is executed. )16 VER Reading of soft version17 RRG Reading of motor control IC and lead register18 DWL Setting of parameter setting value19 UPL Reading of parameter setting value20 RER Reading of error log21 CER Clearness of error log

22 REV Setting of alignment correction value (offset value)23 RRE Reading of alignment correction value (offset value)24 PNO Reading of Aligner software product No.25 TRN Low speed one-wafer rotation26 ADM Reading of alignment execution frequency27 ALS Alignment execution(It is movement, and vacuum OFF in

vacuum ON, sampling, and a specified position and aspecified angle. )

28 RXY Chuck XY positional reading29 SLM Setting of wafer eccentric amount limit value30 RLM Reading of wafer eccentric amount limit value

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5.Command details explanation

D (1)CPI

Sum

mary

CPU is reset.

Example

(host) (Aligner)[STX]CPI[ETX]

[ACK]

Rema

rks

After ACK is transmitted, CPU is reset.

Please do not transmit the command between 1(sec) after receiving ACK.

E (2)RST

Sum

mary

Aligner is initialized.

Exam

ple

(host) (Aligner)

[STX]RST[ETX][ACK]

Rema

rks

After ACK is transmitted, Aligner is initialized.

(3)PAU

Sum

mary

Aligner is put into the state of the temporary stop.

Exam

ple

(host) (Aligner)

[STX]PAU[ETX][ACK]

Rema

rks

It enters the state of the temporary stop after ACK is transmitted.

(4)CNT

Sum

mary

The temporary stop of Aligner is released.

Exam

ple

(host) (Aligner)

[STX]CNT[ETX][ACK]

Rema

rks

After ACK is transmitted, the temporary stop is released.

(5)VVN

Sum

mary

The vacuum of Aligner chuck is turned on.

Exam

ple

(host) (Aligner)

[STX]VVN[ETX][ACK]

Rema After ACK is transmitted, the vacuum of Aligner chuck is pulled.

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rks

(6)VVF

Sum

mary

The vacuum of Aligner chuck is turned off.

Exam

ple

(host) (Aligner)

[STX]VVF[ETX]

[ACK]

Rema

rks

After ACK is transmitted, the vacuum of Aligner chuck is stopped.

(7)NYG

Sum

mary

Aligner chuck is moved to a specified position.

Exam

ple

(host) (Aligner)

[STX]NYG,*[ETX]

[ACK]

Rema

rks

After ACK is transmitted, Aligner chuck is moved to a specified position.

RST" After the command is executed, the command is accepted.

* :Specified number(18)

(8)ALG

Summary

Alignment is executed. (After it samples it, move to a specified position and aspecified angle. )

Exam

ple

(host) (Aligner)

[STX]ALG,*[ETX]

[ACK]

Rema

rks

After ACK is transmitted, alignment is executed.



(9)OCH

Sum

mary

The wafer is moved to a specified position and a specified angle.

Exam

ple

(host) (Aligner)

[STX]OCH,*[ETX]

[ACK]

Rema

rks

After ACK is transmitted, the wafer is rotated to a specified angle.

ALG" After the command is executed, the command is accepted.


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(10)DEF

Sum

mary

Each parameter is set to the default data.

Exam

ple

(host) (Aligner)

[STX]DEF[ETX]

[ACK]

Rema

rks

After ACK is transmitted, it sets it to the default data.

The stop position data, the speed data, and the axis rotation correction data

are initialized.

(11)ERF

Sum

mary

Aligner error is released.

Exam

ple

(host) (Aligner)

[STX]ERF[ETX] [ACK]

Rema

rks

After ACK is transmitted, Aligner error is released.

(12)STS

Sum

mary

The status of Aligner is read.

Exam

ple

(host) (Aligner)

STS[ENQ]

[STX]STS,***[ETX]

Rema

rks

***:The state of operation and refer to the status following table.

(13)WCH

Sum

mary

The presence of the wafer is read. (Electromagnetic valve operation and exist. )

Exam

ple

(host) (Aligner)

WCH[ENQ]

[STX]WCH,*[ETX]

Rema

rks

*:Wafer existence information(1: wafer having 0: There is no wafer. )

The electromagnetic valve operation is accompanied.

(14)VCH

Sum

mary

The presence of the wafer is read. (There is no electromagnetic valve operation.

)

Exam

ple

(host) (Aligner)

VCH[ENQ]

[STX]VCH,*[ETX]

Rema *:Wafer existence information(1: wafer having 0: There is no wafer. )The electromagnetic valve operation is not accompanied.

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rks

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(15)RWF

Sum

mary

The wafer size is read.

Exam

ple

(host) (Aligner)

RWF[ENQ]

[STX]RWF,*[ETX]

Rema

rks

*:Wafer kind(09)(0)300mm NOTCHE

(1)200mmFLATTED

(2)200mmNOTCHE

(3)150mmFLATTED(SEMI)

(4)150mmFLATTED(JEIDA)

(5)150mmNOTCHE

(6)125mmFLATTED

(7)100mmFLATTED

(8) 76mmFLATTED

(9)Uncertainty

ALG" The wafer type is undecided before it executes it.

SEMI/JEIDA is identified based on the following numerical valueswith main orientation flat.

SEMI: Main orientation flat length 57.52.5 (mm)JEIDA: Main orientation flat length 47.52.5 (mm)

The identification of SEMI/JEIDA does only six-inch wafer.

(16)VER

Sum

mary

The version of Aligner software is read.

Exam

ple

(host) (Aligner)

VER[ENQ]

[STX]VER,***[ETX]

Rema

rks

***:The version of Aligner software is shown.

Ver1.23 is shown for VER,123".

(17)RRG

Sum

mary

Reading of lead register of motor control IC

Exam

ple

(host) (Aligner)

RRG,*,#,$[ENQ]

[STX]RRG,*,#,$,%%%%[ETX]

Rema

rks

*:LSI number is specified. (12)

# :The axis number is specified. (1 4)

$ :Specification of register number(0 5)

%%%% :Register information(0000 FFFF)

Refer to the content of the motor control register of the postscript for the

content of each register.

Reading each register is done in two bytes, and replies after it converts it into

ASCII code.(18)DWL

Sum Each parameter is set.

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mary

Exam

ple

(host) (Aligner)

[STX]DWL,*,####,$$$[ETX]

[ACK]

Rema

rks

*:Specification and position numbers

#### :Every 1/10 degrees in the angle(0000 3599)$$$ :1/10mm at position(000 550)

After ACK is transmitted, the parameter is set.

(19)UPL

Sum

mary

A set value of each parameter is read.

Exam

ple

(host) (Aligner)

UPL,*[ENQ]

[STX]UPL,*,####,$$$[ETX]

Rema

rks

*:Specification and position numbers #### :Every 1/10 degrees in the angle(0000 3599)

$$$ :1/10mm at position(000 550)

(20)RER

Sum

mary

The error log is read.

Exam

ple

(host) (Aligner)

RER,****[ENQ]

[STX]RER,****,##[ETX]

Rema

rks

****:History number(00001000)

## :Error code(00 FF)

It becomes the latest error as the figure of the history number grows (1-1000).

When the error code exceeds 1000, it is deleted from the oldest one.

The latest error can be referred to by specifying history number 0.

Refer to the error following code table for the error code.

(21)CER

Sum

mary

The error log is cleared.

Exam

ple

(host) (Aligner)

[STX]CER[ETX]

[ACK]

Rema

rks

After ACK is transmitted, the error log is cleared.



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(22)REV

Sum

mary

The axis rotation correction value (offset value) is set.

Exam

ple

(host) (Aligner)

[STX]REV,****[ETX]

[ACK]

Rema

rks

****:Aligner correction value 1/10 degrees(00003599)On Aligner, it corrects it in the direction of CW (clockwise).

Each stop position and each wafer size is common to the correction value.

After ACK is transmitted, the axis rotation correction value is set.

(23)RRE

Sum

mary

The axis rotation correction value (offset value) is read.

Exam

ple

(host) (Aligner)

RRE[ENQ]

[STX]RRE,****[ETX]

Rema

rks

****:Aligner correction value 1/10 degrees(00003599)


(24)PNO

Sum

mary

Aligner software product No. is read.

Exam

ple

(host) (Aligner)

PNO[ENQ]

[STX]PNO,*********[ETX]

Rema

rks

*********:

Product No.(000000000 999999999)

(25)TRN

Sum

mary

The wafer is made by low speed one rotation.

Exam

ple

(host) (Aligner)

[STX]TRN[ETX]

[ACK]

Rema

rks

After ACK is transmitted, one wafer low-speed gyration is executed.


(note)360 is rotated around the chuck.



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(26)ADM

Sum

mary

The alignment execution frequency is read.

Exam

ple

(host) (Aligner)

ADM[ENQ]

[STX]ADM,**********[ETX]

Rema

rks

**********:Alignment execution frequency

(27)ALS

Sum

mary

Alignment is executed. (It is movement, and vacuum OFF in vacuum ON,

sampling, and a specified position and a specified angle. )

Exam

ple

(host) (Aligner)

[STX]ALS,*[ETX]

[ACK]

Rema

rks




(28)RXY

Sum

mary

XY positional reading of the chuck is done.

Exam

ple

(host) (Aligner)

RXY[ENQ]

[STX]RXY,*****,#####[ETX]

Rema

rks

*****:Chuck X position(1/100mm unit)

##### :Chuck Y position(1/100mm unit)

Chuck position based on initialization position



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(29)SLM

Sum

mary

The wafer eccentric amount limit value is set.

Exam

ple

(host) (Aligner)

[STX]SLM,****,####,$$$$[ETX]

[ACK]

Rema

rks

****:Eccentric amount limit (0000-0700)1/100mm unit #### :Eccentric amount X element axially limit (0000-0700)1/100mm

unit

$$$$ :Eccentric amount Y element axially limit (0000-0700)1/100mm unit


Limit setting according to amount of wafer of calculating eccentric. It is invalid

by 0000 settings.

(30)RLM

Sum

mary

A set value of the wafer eccentric amount limit value is read.

Exam

ple

(host) (Aligner)

RLM[ENQ]

[STX]RLM,****,####,$$$$[ETX]

Rema

rks

****:Eccentric amount limit (0000-0700)1/100mm unit

#### :Eccentric amount X element axially limit (0000-0700)1/100mm

unit




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B.RS-232C communication command content explanation

1.Link communication specification(1)Interface RS-232C(2)Communication connection method Full duplex serial

communications(crossing cable connection)

(3)Synchronize system Asynchronous (Step synchronization)method

(4)Transmission rate9600bps 19200bps 38400bps 57600bps

(5)Data form One start bitEight data bitNo parityOne stop bit

(6)Communication code ASCII 7 bit code

2.Transmission control character(1)ENQ Telecommunication line confirmation(05H)

(2)ACK Positive response(06H)(3)NAK Negative response(15H)(4)BUSY It is operating. (11H)

3.Error generation report

Sum

mary

When the error occurs, the error-reporting is compulsorily done.

Exam

ple

(host) (Aligner)

Operation command CR

[ACK]

[ACK]

when is operatingERR,***[CR]

Rema

rks

***When the error occurs, status is returned.



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3.Command listNo. Com

mandSummary

1 CPI Reset of CPU2 RST Initialization of Aligner3 PAU Temporary stop4 CNT Temporary stop release5 VVN Aligner chuck vacuum ON6 VVF Aligner chuck vacuum OFF7 NYG It moves to the wafer specification position.8 ALG Alignment execution (After it samples it, move to a

specified position and a specified angle.)9 OCH The wafer is moved to a specified position and a specified

angle. (It is effective only after alignment is executed.)10 DEF Set of default data value11 ERF Release of error12 STS Demand of status13 WCH Reading of wafer existence (Electromagnetic valve

operation and exist.)14 VCH Reading of vacuum valve existence (There is noelectromagnetic valve operation.)

15 RWF Reading of wafer size (It is effective only after the ALGcommand is executed.)

16 VER Reading of soft version17 RRG Reading of motor control IC and lead register18 DWL Setting of parameter setting value19 UPL Reading of parameter setting value20 RER Reading of error log21 CER Clearing of error log22 REV Setting of alignment correction value (offset value)

23 RRE Reading of alignment correction value (offset value)24 PNO Reading of Aligner software product No.25 TRN Low speed one-wafer rotation26 ADM Reading of alignment execution frequency27 ALS Alignment execution (It is movement, and vacuum OFF in

vacuum ON, sampling, and a specified position and aspecified angle. )

28 RXY Chuck XY positional reading29 SLM Setting of wafer eccentric amount limit value30 RLM Reading of wafer eccentric amount limit value

4.Command details explanation

F (1)CPI

Sum

mary

CPU is reset.

Exam

ple

(host) (Aligner)

CPI[CR]

[ACK]

Rema

rks

After ACK is transmitted, CPI is reset.

Please do not transmit the command within 1(sec) after receiving ACK.

(2)RST

Sum

mary

Aligner is initialized.



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Exam

ple

(host) (Aligner)

RST[CR]

[ACK]

[ACK]

when is operating

RST[CR](operation completion response)

Rema

rks

After ACK is transmitted, Aligner is initialized.

After operation is completed, the completion response is transmitted.

(3)PAU

Sum

mary

Aligner is put into the state of the temporary stop.

Exam

ple

(host) (Aligner)

PAU[CR]

[ACK]

Rema

rks

It enters the state of the temporary stop after ACK is transmitted.

(4)CNT

Sum

mary

The temporary stop of Aligner is released.

Exam

ple

(host) (Aligner)

CNT[CR]

[ACK]

Rema

rks

After ACK is transmitted, the temporary stop is released.

(5)VVN

Sum

mary

The vacuum of Aligner chuck is turned on.

Exam

ple

(host) (Aligner)

VVN[CR]

[ACK]

[ACK]

when is operatingVVN[CR](operation completion response)

Rema

rks

After ACK is transmitted, the vacuum of Aligner chuck is pulled.


(6)VVF

Sum

mary

The vacuum of Aligner chuck is turned off.

Exam (host) (Aligner)



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ple VVF[CR]

[ACK]

[ACK]

when is operating

VVF[CR](operation completion response)

Rema

rks

After ACK is transmitted, the vacuum of Aligner chuck is stopped.


(7)NYG

Sum

mary

Aligner chuck is moved to a specified position.

Exam

ple

(host) (Aligner)

NYG,*[CR]

[ACK]

[ACK]

when is operating

NYG[CR](operation completion response)

Rema

rks

*:Specified number(18)

After the command RST" is executed, the command is accepted.

After ACK is transmitted, Aligner chuck is moved to a specified position.


(8)ALG

Sum

mary

Alignment is executed. (After it samples it, move to a specified position and a

specified angle.) have to turn on and off vacuum valve manually

Exam

ple

(host) (Aligner)

ALG,*[CR]

[ACK]

[ACK]

when is operating

ALG[CR](operation completion response)

Rema

rks


After the commandRST" is executed, the command is accepted.



(9)OCH

Sum

mary

It is moved to a wafer specification position and a specified angle.

Exam

ple

(host) (Aligner)

OCH,*[CR]

[ACK]

[ACK]

when is operating

OCH[CR](operation completion response)

Rema

rks


Only after the commandALG" is executed, it accepts.After ACK is transmitted, the wafer is rotated to a specified angle.




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(10)DEF

Sum

mary

Each parameter is set to the default data.

Exam

ple

(host) (Aligner)

DEF[CR]

[ACK]

[ACK]

when is being set

DEF[CR](completion response)

Rema

rks

After ACK is transmitted, it sets it to the default data.

After the setting is completed, the completion response is transmitted.

(11)ERF

Sum

mary

Aligner error is released.

Exam

ple

(host) (Aligner)

ERF[CR]

[ACK]

Rema

rks

After ACK is transmitted, Aligner error is released.

(12)STS

Sum

mary

The status of Aligner is read.

Exam

ple

(host) (Aligner)

STS[CR]

STS,***[CR]

Rema

rks

***:The state of operation and refer to the postscript status table.

(13)WCH

Sum

mary

The presence of the wafer is read.

Exam

ple

(host) (Aligner)

WCH[CR]

WCH,*[CR]

Rema

rks

*:Wafer existence information(1: wafer having 0: There is no wafer. )

Vacuum ON OFF operation is accompanied.

(14)VCH

Sum

mary

The presence of the vacuum sensor is read.




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ple VCH[CR]

VCH,*[CR]

Rema

rks

*: vacuum sensor existence information(1: wafer having 0: There is no wafer.

)

Vacuum ON OFF operation is not accompanied.

(15)RWF

Sum

mary

The wafer size is read.

Exam

ple

(host) (Aligner)

RWF[CR]

RWF,*[CR]

Rema

rks

*:Wafer kind(09)(0)300mm NOTCHE

(1)200mmFLATTED

(2)200mmNOTCHE(3)150mmFLATTED(SEMI)

(4)150mmFLATTED(JEIDA)

(5)150mmNOTCHE

(6)125mmFLATTED

(7)100mmFLATTED

(8) 76mmFLATTED

(9)Uncertainty

ALG" The wafer type is undecided before it executes it.SEMI/JEIDA is identified based on the following numerical valueswith main orientation flat.

SEMI: Main orientation flat length 57.52.5 (mm)

JEIDA: Main orientation flat length 47.52.5 (mm)The identification of SEMI/JEIDA does only six-inch wafer.

(16)VER

Sum

mary

The version of Aligner software is read.

Exam

ple

(host) (Aligner)

VER[CR]

VER,***[CR]

Rema

rks

***:The version of Aligner software is shown.Ver1.23 is shown for VER,123".

(17)RRG

Sum

mary

Reading of lead register of motor control IC

Exam

ple

(host) (Aligner)

RRG,*,#,$[CR]

RRG,*,#,$,%%%%[CR]

Rema

rks

*:LSI number is specified. (12)

# :The axis number is specified. (1 4)

$ :Specification of register number(0 5)

%%%% :Register information(0000 FFFF)



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Refer to the content of the motor control register of the postscript for the

content of each register.

Reading each register is done in two bytes, and replies after it converts it into

ASCII code.

(18)DWL

Sum

mary

Each parameter is set.

Exam

ple

(host) (Aligner)

DWL,*,####,$$$[CR]

[ACK]

Remarks

*:Specification and position numbers #### :Every 1/10 degrees in the angle(0000 3599)

$$$ :1/10mm at position(000 550)


(19)UPL

Sum

mary

A set value of each parameter is read.

Exam

ple

(host) (Aligner)

UPL,*[CR]

UPL,*,####,$$$[CR]

Rema

rks

*:Specification and position numbers

#### :Every 1/10 degrees in the angle(0000 3599)

$$$ :1/10mm at position(000 550)

(20)RER

Sum

mary

The error log is read.

Exam

ple

(host) (Aligner)

RER,****[CR]

RER,****,##[CR]

Rema

rks

****:History number(00001000)

## :Error code(00 FF)

It is the latest error (1-1000). grow the figure of the history number

When the error code exceeds 1000, it is deleted from the oldest one.

The latest error can be referred to by specifying history number 0.

Refer to the postscript error code for the error code.

(21)CER

Sum

mary

The error log is cleared.




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ple CER[CR]

[ACK]

Rema

rks

After ACK is transmitted, the error log is cleared.



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(22)REV

Sum

mary

The axis rotation correction value (offset value) is set.

Exam

ple

(host) (Aligner)

REV,****[CR][ACK]

Rema

rks

****:Aligner correction value 1/10 degrees(00003599)On Aligner, it corrects it in the direction of CW (clockwise).


After ACK is transmitted, the axis rotation correction value is set.

(23)RRE

Sum

mary

The axis rotation correction value (offset value) is read.

Exam

ple

(host) (Aligner)

RRE[CR]

RRE,****[CR]

Rema

rks

****:Aligner correction value 1/10 degrees(00003599)


(24)PNO

Sum

mary

Reading of Aligner software product No.

Exam

ple

(host) (Aligner)

PNO[CR]

PNO,*********[CR]

Rema

rks

*********:Product No.(000000000 999999999)

(25)TRN

Sum

mary

The wafer is made by low speed one rotation.

Exam

ple

(host) (Aligner)

TRN[CR]

[ACK]

[ACK]

when is operating

TRN[CR](operation completion response)

Rema

rks

After ACK is transmitted, one wafer low-speed gyration is executed.

After the command ALG" is executed, the command is accepted.


(note)360 is rotated around the chuck.

26)ADM

Sum The alignment execution frequency of operation is read.



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mary

Exam

ple

(host) (Aligner)

ADM[CR]

ADM,**********[CR]

Remarks

**********:Alignment effect frequency

(27)ALS

Sum

mary

Alignment is executed. (It is movement, and vacuum OFF in vacuum ON,

sampling, and a specified position and a specified angle.). Vacuum valve is turn

on/off automatically.

Exam

ple

(host) (Aligner)

ALS,*[CR]

[ACK]

[ACK]

when is operating

ALS[CR](operation completion response)

Rema

rks

*:Specified number(18)After the command RST" is executed, the command is accepted.



ALS = VVN + ALG + VVF

(28)RXY

Sum

mary

XY positional reading of the chuck is done.

Exam

ple

(host) (Aligner)

RXY[CR]

RXY,*****,#####[CR]

Rema

rks

*****:Chuck X position(1/100mm unit)

##### :Chuck Y position(1/100mm unit)

Chuck position based on initialization position



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(29)SLM

Sum

mary

The wafer eccentric amount limit value is set.

Exam

ple

(host) (Aligner)

SLM,****,####,$$$$[CR]

[ACK]

Rema

rks

****:Eccentric amount limit (0000-0700)1/100mm unit #### :Eccentric amount X element axially limit (0000-0700)1/100mm

unit



Limit setting according to amount of wafer of calculating eccentric. It is invalid

by 0000 settings.

(30)RLM

Sum

mary

A set value of the wafer eccentric amount limit value is read.

Exam

ple

(host) (Aligner)

RLM[CR]

RLM,****,####,$$$$[CR]

Rema

rks

****:Eccentric amount limit (0000-0700)1/100mm unit

#### :Eccentric amount X element axially limit (0000-0700)1/100mm

unit




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C. Parallel signal command content explanation1.Input signal table- Command input (input)

Nu

mbe

r

1 2 4 8 16 32 Content of operation

0 0 0 0 0 0 0

1 1 0 0 0 0 0 CPU reset

2 0 1 0 0 0 0 Initialization operation(The power supply is

turned on or the error occurs. )

3 1 1 0 0 0 0 Chuck vacuum ON

4 0 0 1 0 0 0 Chuck vacuum OFF

5 1 0 1 0 0 0 (laser sensor ON)

6 0 1 1 0 0 0 (laser sensor OFF)

7 1 1 1 0 0 0

8 0 0 0 1 0 0 Wafer rotation position fine-tuning value

clearing

9 1 0 0 1 0 0 Error release

10 0 1 0 1 0 0 Temporary stop

11 1 1 0 1 0 0 Temporary stop release

12 0 0 1 1 0 0 Wafer rotation position fine-tuning value set

+0.1

13 1 0 1 1 0 0 Wafer rotation position fine-tuning value set

0.1

14 0 1 1 1 0 0 Start of calibration

15 1 1 1 1 0 0 Default set of parameter value and speed

value

16 0 0 0 0 1 0 After alignment is executed, it moves a

specified position and angling. (..setting.. 1)17 1 0 0 0 1 0 (..setting.. 2)

18 0 1 0 0 1 0 (..setting.. 3)

19 1 1 0 0 1 0 (..setting.. 4)

20 0 0 1 0 1 0 (..setting.. 5)

21 1 0 1 0 1 0 (..setting.. 6)

22 0 1 1 0 1 0 (..setting.. 7)

23 1 1 1 0 1 0 (..setting.. 8)

24 0 0 0 1 1 0 The wafer or the chuck is moved a specified

position and angling. (..setting.. 1)

25 1 0 0 1 1 0 (..setting.. 2)

26 0 1 0 1 1 0 (..setting.. 3)27 1 1 0 1 1 0 (..setting.. 4)

28 0 0 1 1 1 0 (..setting.. 5)

29 1 0 1 1 1 0 (..setting.. 6)

30 0 1 1 1 1 0 (..setting.. 7)

31 1 1 1 1 1 0 (..setting.. 8)

- When the vacuum sensor is turning off, note 24-31 moves the chuck.

- The note operation beginning strobe signal is input with 20mS or more and turnedoff at once.

The following command cannot be received the repetition of reset as it is turningon.



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2.Output signal table- Command reception lady (output)

Numb

er

1 Content of operation

0 0 It is operating.

1 1 The command can be received.

- Error generation report (output)Numb

er


0 0 It is operating normally.

1 1 Error generation stop- Wafer existence (output)

Numb

er


0 0 There is no wafer.

1 1 Wafer having- Size of wafer (output)

Numb

er

1 2 4 Content of operation

0 0 0 0

1 1 0 0 76mm

2 0 1 0 100mm

3 1 1 0 125mm

4 0 0 1 150mm

5 1 0 1 200mm

6 0 1 1 300mm

7 1 1 1- Notch identification orientation flat/(output)

Numb

er


0 0 Flat

1 1 Notch- SEMI/JEIDA identification (output)

Numb

er


0 0 SEMI

1 1 JEIDA

Note SEMI/JEIDA is identified based on the following numerical values with main

orientation flat.SEMI :Main orientation flat length 57.52.5 (mm)JEIDA :Main orientation flat length 47.52.5 (mm)The identification of SEMI/JEIDA does only six-inch wafer.



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- Error signal (output)

Numb

er

1 2 4 8 Content of operation

0 0 0 0 0

1 1 0 0 0 The wafer disappeared in alignment.

2 0 1 0 0 Alignment is not completed exaggeratedly at

time.3 1 1 0 0

4 0 0 1 0 The size of the wafer cannot be judged.

5 1 0 1 0 The wafer is not set in Aligner.

6 0 1 1 0

7 1 1 1 0 It exceeded it to the range of detection of the line

sensor.

8 0 0 0 1 The sampling operation unprocesses it.

9 1 0 0 1 It is impracticability as for alignment. (It is not

possible to judge with Kiz etc.)

10 0 1 0 1 Execution command reception of initialization

of Aligner while unprocessed11 1 1 0 1 Reception error of D-I/O command

12 0 0 1 1

13 1 0 1 1 Command execution error(other error)

14 0 1 1 1 The input value of the line sensor is abnormal.

15 1 1 1 1 Aligner cannot be initialized. Operation stops to

interlock.The note error signal is cleared by executing the reset command.



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D. Status list

Code Content Remarks

100 It is standing by.

101 It is standing by.

102 The alignment normality ended.

103 Aligner is operating.

104

105

106 The calibration is being executed.

107 It is stopping temporarily.

108 It is interlocking.

109 Initialization is operating.

10A

10B

10C

10D

10E

10F

110 It is standing by by the initialization not processed.

111 The wafer disappeared while alignment was operating. Error112 The alignment operation is not completed exaggeratedly at

time.

Error

113

114 The wafer size cannot be judged. Error

115 The wafer is not set in Aligner. Error

116

117 It exceeded it to the range of detection of the line sensor. Error

118 The sampling operation is not processed. Error

119 Alignment cannot be executed. Error

11A Aligner has not been initialized. Error

11B It is a reception of D-I/O command error. Error

11C

11D It is a command execution error (other errors). Error

11E The input value of the line sensor is abnormal. Error

11F The initialization operation of Aligner cannot be normally done.

Operation stopped to interlock.

Error



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E. Error code list

Code Content of error

00 There is no error.

31 The wafer disappeared while alignment was operating.

32 The alignment operation is not completed exaggeratedly at time.

33

34 The wafer size cannot be judged.

35 The wafer is not set in Aligner.

36

37 It exceeded it to the range of detection of the line sensor.

38 The sampling operation is not processed.

39 Alignment cannot be executed.

3A Aligner has not been initialized.

3B It is a reception of D-I/O command error.

3C

3D It is a command execution error (other errors).

3E The input value of the line sensor is abnormal.

3F The initialization operation of Aligner cannot be normally done. Operation

stopped to interlock.



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F. Motor control IC lead register allocation

It is done with the following cracks by each LSI and axis, register (RG), and bit (BIT) of MA Aligner.

LSI Axis RG BIT With crack

1 1 4 0

1 1 4 1 X axis and starting point sensor(0" at HI level)

1 1 4 2 X axis and limit sensor(0" at HI level)

1 1 4 3

1 1 4 4

1 1 4 5

1 1 4 6

1 1 4 7

1 1 4 8

1 1 4 9 Y axis and sensor of ..-.. limit(0" at HI level)

1 1 4 10 Y axis and starting point positional sensor(0" at HI level)

1 1 4 11 Y axis and + limit sensor(0" at HI level)

1 1 4 12

1 1 4 13 Aligner vacuum pressure(0" at HI level)

1 1 4 14

1 1 4 15 Driving power supply ON(0" at HI level)

2 1 4 0

2 1 4 1 Laser comparison output(0" at HI level)2 1 4 2 Laser power supply ON(0" at HI level)

2 1 4 3

2 1 4 4

2 1 4 5

2 1 4 6

2 1 4 7

2 1 4 8

2 1 4 9 I/O control and command 1(0" at HI level)2 1 4 10 I/O control and command 2(0" at HI level)

2 1 4 11 I/O control and command 4(0" at HI level)




2 1 4 15 I/O control and start signal(0" at HI level)



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G. Default fact sheet

- Rotation angle and Y bearing delivery position of alignment end

No. angle(unit: 1/10

degrees)Rotation angle when

alignment ends

Y bearing delivery position(unit:

1/10mm)Distance from starting point position

1 0000 0000

2 0450 0000

3 0900 0000

4 1350 0000

5 1800 0000

6 2250 0000

7 2700 0000

8 3150 0000- The line sensor position can be angling specified up to 359.9 clockwise by 0.

- Y bearing delivery position is specified by the number of movement millis of chucks from the

starting point position.

Setting of amount of orientation flat angle fine-tuning correction (offset value)

Amount of angle fine-tuning(unit:

1/10 degrees)

0000

Setting of eccentric amount limit value

Eccentric amount limit(unit:

1/100mm)

0500

X eccentric axially limit(unit:

1/100mm)

0000

Y eccentric axially limit(unit:

1/100mm)

0000

maf communication specification

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