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Freescale SemiconductorUser’s Manual
M5235EVBUMRev. 2, 08/2007
Contents
Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1M523xEVB. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.1 MCF5235 Microprocessor . . . . . . . . . . . . . . . . . . . . 42.2 System Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . 72.3 Support Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92.4 Communication Ports . . . . . . . . . . . . . . . . . . . . . . 142.5 Connectors and User Components . . . . . . . . . . . . 21Initialization and Setup . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.1 System Configuration . . . . . . . . . . . . . . . . . . . . . . 263.2 Installation and Setup . . . . . . . . . . . . . . . . . . . . . . 273.3 System Power-up and Initial Operation . . . . . . . . . 323.4 Using The BDM Port . . . . . . . . . . . . . . . . . . . . . . . 33Using the Monitor/Debug Firmware. . . . . . . . . . . . . . . . 33
4.1 What is dBUG? . . . . . . . . . . . . . . . . . . . . . . . . . . . 334.2 Operational Procedure . . . . . . . . . . . . . . . . . . . . . 344.3 Command Line Usage. . . . . . . . . . . . . . . . . . . . . . 364.4 Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 374.5 TRAP #15 Functions . . . . . . . . . . . . . . . . . . . . . . . 71Configuring dBUG for Network Downloads . . . . . . . . . . 73
5.1 Required Network Parameters . . . . . . . . . . . . . . . 735.2 Configuring dBUG Network Parameters . . . . . . . . 745.3 Troubleshooting Network Problems . . . . . . . . . . . 75Schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76Evaluation Board BOM . . . . . . . . . . . . . . . . . . . . . . . . . 93
M5235EVB User’s Manualby: Microcontroller Division
1 PrefaceEMC information:
• This product, as shipped from the factory with associated power supplies and cables, has been tested and meets with requirements of EN5022 and EN 50082-1: 1998 as a CLASS A product.
• This product is designed and intended for use as a development platform for hardware or software in an educational or professional laboratory.
• In a domestic environment this product may cause radio interference in which case you may be required to take adequate measures.
• Anti-static precautions must be adhered to when using this product.
• Attaching additional cables or wiring to this product or modifying the products operation from the factory default as shipped may effect its performance and also cause interference with
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© Freescale Semiconductor, Inc., 2007. All rights reserved.
other apparatus in the immediate vicinity. If such interference is detected, suitable mitigating measures should be taken.
WARNINGThis board generates, uses, and can radiate radio frequency energy and, if not installed properly, may cause interference to radio communications. As temporarily permitted by regulation, it has not been tested for compliance with the limits for class a computing devices pursuant to Subpart J of Part 15 of FCC rules, which are designed to provide reasonable protection against such interference. Operation of this product in a residential area is likely to cause interference, in which case you, at your own expense, are required to correct the interference.
2 M523xEVBThis document details the setup and configuration of the ColdFire M523xEVB evaluation board (hereafter referred to as the EVB). The EVB is intended to provide a mechanism for easy customer evaluation of the MCF523x family of ColdFire microprocessors and to facilitate hardware and software development. The EVB can be used by software and hardware developers to test programs, tools, or circuits without having to develop a complete microprocessor system themselves. All special features of the MCF523x family are supported.
The heart of the evaluation board is the MCF5235. All the other M523x family members have a subset of the MCF5235 specification and therefore can be fully emulated using the MCF5235 device. Table 1 below details the full product family.
All of the devices in the same package are pin-compatible.
The EVB provides low cost software testing using a ROM-resident debug monitor, dBUG, programmed into the external flash device. Operation allows you to load code in the on-board RAM, execute applications, set breakpoints, and display/modify registers or memory. No additional hardware or software is required for basic operation.
Table 1. M523x Product Family
Part Number Package eTPU FEC Crypto CAN
MCF5232CAB80 160 QFP 16-channel No No 1
MCF5232CVM100 196 MAPBGA 16-channel No No 1
MCF5232CVM150 196 MAPBGA 16-channel No No 1
MCF5233CVM100 256 MAPBGA 32-channel No No 2
MCF5233CVM150 256 MAPBGA 32-channel No No 2
MCF5234CVM100 256 MAPBGA 16-channel Yes No 1
MCF5234CVM150 256 MAPBGA 16-channel Yes No 1
MCF5235CVM100 256 MAPBGA 16-channel Yes Yes 2
MCF5235CVM150 256 MAPBGA 16-channel Yes Yes 2
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2 Freescale Semiconductor
Specifications:• Freescale MCF5235 Microprocessor (150 MHz max core frequency)• External Clock source: 25 MHz • Operating temperature: 0°C to +70°C• Power requirement: 7–14V DC @ 300 ma Typical• Power output: 5V, 3.3V and 1.5V regulated supplies• Board Size: 10.00 × 5.40 inches, 8 layers
Memory Devices:• 16-Mbyte SDRAM• 2-Mbyte (512K × 16) page mode flash or 4-Mbyte (512K × 32) page mode flash• 1-Mbyte MRAM • 64-Kbyte SRAM internal to MCF523x device
Peripherals:• Ethernet port 10/100Mbps (dual-speed Fast Ethernet transceiver with MII)• UART0 (RS-232 serial port for dBUG firmware)• UART1 (auxiliary RS-232 serial port)• UART2 (auxiliary1 RS-232 serial port jumper selectable with FlexCAN1)• Enhanced Time Processor Unit (eTPU)• I2C interface• QSPI interface to ADC• FlexCAN0 interface• USB Host and Device Interface• BDM/JTAG interface
User Interface:• Reset logic switch (debounced)• Boot logic selectable (dip switch)• Abort/IRQ7 logic switch (debounced)• PLL Clocking options—Oscillator, Crystal or SMA for external clocking signals• LEDs for power-up indication, general purpose I/O, and timer output signals• Expansion connectors for daughter card • UNI-3 connector for motor control cards
Software:• Resident firmware package that provides a self-contained programming and operating
environment (dBUG)
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*A jumper chooses between 16 eTPU channels and Ethernet or 32 eTPU channels and no Ethernet
Figure 1. M523xEVB Block Diagram
2.1 MCF5235 MicroprocessorThe microprocessor used on the EVB is the highly integrated Freescale MCF5235 32-bit ColdFire variable-length RISC processor. The MCF5235 implements a Version 2 ColdFire core with a maximum core frequency of 150 MHz and external bus speed of 75 MHz. Features of the MCF5235 include:
• V2 ColdFire core with enhanced multiply-accumulate unit (EMAC) providing 144 (Dhrystone 2.1) MIPS @ 150 MHz
• eTPU with 16 or 32 channels, 6 Kbytes of code memory and 1.5 Kbytes of data memory with debug support
• 64 Kbytes of internal SRAM• External bus speed of one half the CPU operating frequency (75 MHz bus @ 150 MHz core)• 10/100 Mbps bus-mastering Ethernet controller
ColdFire MCF523X
RS-232 transceivers (2)
DB-9 (2) connector
Ethernet Transceiver*
RJ-45 connector
25 MHz Osc.
(4) 60 pin Daughter Card expansion connectors
Dat
a [3
1:0]
Add
ress
[23:
0]
Con
trol S
igna
ls
SDRAM16 Mbytes
Flash2-4 Mbytes
ASRAM 1 Mbyte
Perip
hera
l sig
nals
CAN Transceiver DB-9 connector
RS-232 / CAN Transceiver
DB-9 connector
26-pin Debug Header
Clocking circuitry
25 MHz Osc.
ADC
USB 2.0 Host & Device
ETPU Headers*
MRAM1 Mbyte
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• 8 Kbytes of configurable instruction/data cache• Three universal asynchronous receiver/transmitters (UARTs) with DMA support• Controller area network 2.0B (FlexCAN module)
— Optional second FlexCAN module multiplexed with the third UART• Inter-integrated circuit (I2C) bus controller• Queued serial peripheral interface (QSPI) module• Hardware cryptography accelerator (optional)
— Random number generator— DES/3DES/AES block cipher engine— MD5/SHA-1/HMAC accelerator
• Four channel 32-bit direct memory access (DMA) controller• Four channel 32-bit input capture/output compare timers with optional DMA support• Four channel 16-bit periodic interrupt timers (PITs)• Programmable software watchdog timer• Interrupt controller capable of handling up to 126 interrupt sources• Clock module with Phase Locked Loop (PLL)• External bus interface module including a 2-bank synchronous DRAM controller• 32-bit non-multiplexed bus with up to 8 chip select signals that support page-mode flash memories
The MCF5235 communicates with external devices over a 32-bit wide data bus, D[31:0]. The MCF5235 can address a 32-bit address range. However, only 24 bits are available on the external bus, A[23:0]. There are internally generated chip selects to allow the full 32-bit address range to be selected. There are regions that can be decoded to allow supervisor, user, instruction, and data each to have the 32-bit address range.
All the processor's signals are available via daughter card expansion connectors. Refer to the Section 6, “Schematics” for their pin assignments.
The MCF5235 processor supports BDM and JTAG. These ports are multiplexed and can be used with third party tools to allow you to download code to the board. The board is configured to boot up in the normal/BDM mode of operation. The BDM signals are available at the port labeled BDM.
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Figure 2 shows the MCF5235 processor block diagram.
Figure 2. MCF5235 Block Diagram
64 KbytesSRAM
(8Kx16)x4
EIM
ETHERNET
V2 ColdFire CPU
INTC0
Watchdog
PIT0
JTAGTAP
CACHE(1Kx32)x2
PIT1 PIT2 PIT3
4 CH DMA
UART0
UART1 I2C QSPI
DTIM0
DTIM1
DTIM2
DTIM3
Timer
PAD
I
PLLCLKGEN
UART2
8 Kbytes
EdgePort
SDRAMC
CHIP
EBI
SELECTS
(To/From PADI)
(To/From
FAST
CONTROLLER(FEC)
FEC
TnIN
TnOUT
UnRXD
UnTXD
SDA
SCL
SDRAMC
QSPI
UnRTS
UnCTS
PORTSCIM(GPIO)
D[31:0]
A[23:0]
R/W
CS[3:0]
TA
TSIZ[1:0]
TEA
BS[3:0]
DIV EMAC
DREQ[2:0]
INTC1Arbiter
(To/From SRAM backdoor)
(To/From Arbiter)
SKHA
RNGA
MDHA
(To/From PADI)
CryptographyModules
DACK[2:0]
BD
M
(To/From INTC)
MU
X
PADI)
JTAG_EN
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2.2 System MemoryThe following diagram shows the external memory implementation on the EVB.
Figure 3. External Memory Scheme
NOTEThe external bus interface signals to the external MRAM and flash (and USB) are buffered. This is in order not to exceed the maximum output load capacitance of the microprocessor on the EVB. The signals to the expansion connectors remain unbuffered to provide a true interface.
2.2.1 External Flash
The EVB is fitted with a single 512K × 16 page-mode flash memory (U19) giving a total memory space of 2Mbytes. Alternatively, a footprint is available for you to upgrade this device to a 512K × 32 page-mode flash memory (U35), doubling the memory size to 4 Mbytes. U19 or U35 should be fitted on the board. Both devices cannot be populated at the same time. Refer to the specific device data sheet and sample software provided for configuring the flash memory.
NOTEThe debug monitor firmware is installed in this flash device. Development tools or your application programs may erase or corrupt the debug monitor. If the debug monitor becomes corrupted and it’s operation is desired, the firmware must be programmed into the flash by applying a development port tool such as BDM. Use caution to avoid this situation. The M523xEVB dBUG debugger/monitor firmware is programmed into the lower sectors of flash (0xFFE0_0000–0xFFE2_FFFF for 2 Mbytes of flash or 0xFFC0_0000–0xFFC2_FFFF for 4 Mbytes of flash).
ExpansionConnectors
SDRAM(16 Mbytes)
MRAM(1 Mbyte)
Flash(512K × 16
or512K × 32)
BuffersMPU
Data
Address
Control
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By default with U19 fitted on the EVB, jumper 64 (JP64) provides an alternative hardware mechanism for write protection.
If you replaced U19 with the 32-bit flash device (U35), jumper 31 (JP31) has the same functionality as JP64. U35 also has it’s own hardware write protect pin (C5) that protects the bottom boot sector when pulled to ground.
2.2.2 SDRAM
The EVB is populated with 16 Mbytes of SDRAM. This is done with two devices (Micron MT48LC4M16A2TG) each with a 16 bit data bus. Each device is organized as 1 Meg × 16 × 4 banks with a 16 bit data bus. One device stores the upper 16-bit word and the other the lower 16 bit word of the MCF523x 32 bit data bus.
2.2.3 MRAM
The EVB is populated with two 512K × 16 MRAM devices (Freescale MR2A16A). Also see Section 2.2.5, “M523xEVB Memory Map”.
2.2.4 Internal SRAM
The MCF5235 processor has 64-Kbytes of internal SRAM memory that may be used as data or instruction memory. This memory is mapped to 0x2000_0000 and configured as data space, but is not used by the dBUG monitor except during system initialization. After system initialization is complete, the internal memory is available to you. The memory is relocatable to any 32-Kbyte boundary within the processor’s four gigabyte address space.
2.2.5 M523xEVB Memory Map
Interface signals to support the interface to external memory and peripheral devices are generated by the memory controller. The MCF5235 supports eight external chip selects: CS[1:0] are used with external memories, CS2 is used for the USB controller, and CS[7:3] are easily accessible to you via the daughter card expansion connectors. CS0 also functions as the global (boot) chip-select for booting out of external flash.
Because the MCF5235 chip selects are fully programmable, the memory banks may be located at any 64-Kbyte boundary within the processor’s four gigabyte address space.
The default memory map for this board, as configured by the debug monitor, is found in Table 2. The internal memory space of the MCF5235 is detailed further in the MCF5235 Reference Manual. Chip selects 0 and 1 can be changed by your software to map the external memory in different locations, but the chip select configuration such as wait states and transfer acknowledge for each memory type should be maintained.
Chip Select Usage:External flash Memory CS0External MRAM Memory CS1
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Table 2 shows the M523xEVB memory map.
2.2.5.1 Reset Vector Mapping
Asserting the reset input signal to the processor causes a reset exception. The reset exception has the highest priority of any exception; it provides for system initialization and recovery from catastrophic failure. Reset also aborts any processing in progress when the reset input is recognized. Processing cannot be recovered.
The reset exception places the processor in the supervisor mode by setting the S-bit and disables tracing by clearing the SR[T] bit. This exception also clears the M bit and sets the processor’s interrupt priority mask in the SR to the highest level (level 7). Next, the VBR is initialized to zero (0x0000_0000). The control registers specifying the operation of any memories (e.g., cache and/or RAM modules) connected directly to the processor are disabled.
After the processor is granted the bus, it then performs two longword read bus cycles. The first longword at address 0x0000_0000 is loaded into the stack pointer and the second longword at address 0x0000_0004 is loaded into the program counter. After the initial instruction is fetched from memory, program execution begins at the address in the PC. If an access error or address error occurs before the first instruction is executed, the processor enters the fault-on-fault halted state.
The memory size that the MCF5235 accesses at address 0x0000_0000 is determined at reset by sampling D[20:19].
2.3 Support Logic
2.3.1 Reset Logic
The reset logic provides system initialization. Reset occurs at power-on or by asserting RESET via SW6.
Table 2. Default M523xEVB Memory Map
Address Range Signal and Device
0x0000_0000–0x00FF_FFFF 16 Mbyte SDRAM
0x2000_0000–0x2000_FFFF 64 Kbytes Internal SRAM
0x3000_0000–0x300F_FFFF External MRAM
0xFFE0_0000–0xFFFF_FFFFor
0xFFC0_0000–0xFFFF_FFFF
2 Mbytes External Flashor
4 Mbytes External Flash
Table 3. D[20:19] External Boot Chip Select Configuration
D[20:19] Boot Device/Data Port Size
00 External (32-bit)
01 External (16-bit)
10 External (8-bit)
11 External (32-bit)
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dBUG configures the MCF5235 microprocessor internal resources during initialization.• Instruction cache is invalidated and disabled• Vector base register (VBR) contains an address that initially points to the flash memory• Contents of the exception table are written to address 0x0000_0000 in the SDRAM• Software watchdog timer is disabled• Bus monitor is enabled• Internal timers are placed in a stop condition• Interrupt controller registers are initialized with unique interrupt level/priority pairs
If the external RCON pin is asserted during reset (SW7-1 ON), then various chip functions, including the reset configuration pin functions after reset, are configured according to the levels driven onto the external data pins. See tables below on settings for reset configurations.
If RCON is not asserted during reset (SW7-1 OFF), the chip configuration and the reset configuration pin functions after reset are determined by the RCON register or fixed defaults, regardless of the states of the external data pins.
Table 4. SW7-1 RCON
SW7-1 Reset Configuration
OFF RCON not asserted, Default Chip configuration or RCON register settings
ON RCON is asserted, Chip functions, including the reset configuration after reset, are configured according to the levels driven onto the external data pins.
Table 5. SW7-2 JTAG_EN
SW1-2 JTAG Enable
OFF JTAG interface enabled
ON BDM interface enabled
Table 6. SW7-[4:3] Encoded Clock Mode
SW7-3 SW7-4 Clock Mode
OFF OFF External clock mode- (PLL disabled)
OFF ON 1:1 PLL
ON OFF Normal PLL mode with external clock reference
ON ON Normal PLL mode w/crystal oscillator reference
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2.3.2 Clock Circuitry
There are three options to supply the clock to the CPU. These options are configured by setting JP[35:37].
Table 7. SW7-5 Chip Configuration Mode
SW7-5 RCON (SW7-1) Mode
OFF ON Reserved
ON ON Master
X OFF Master
Table 8. SW7-[7:6] Boot Device
SW7-6 SW7-7 RCON (SW7-1) Boot Device
OFF OFF ON External (32-bit)
OFF ON ON External (8-bit)
ON OFF ON External (16-bit)
ON ON ON External (32-bit)
X X OFF External (32-bit)
Table 9. SW7-8 Bus Drive Strength
SW7-8 RCON (SW7-1) Drive Strength
OFF ON Partial Bus Drive
ON ON Full Bus Drive
X OFF Partial Bus Drive
Table 10. SW7-[10:9] Address/Chip Select Mode
SW7-9 SW7-10 RCON (SW7-1) Mode
OFF OFF ON PADDR[7:5] = CS[6:4]
OFF ON ON PADDR[7] = CS6, PADDR[6:5] = A[22:21]
ON OFF ON PADDR[7:6] = CS[6:5], PADDR[5] = A21
ON ON ON PADDR[7:5] = A[23:21]
X X OFF PADDR[7:5] = A[23:21]
Table 11. M523xEVB Clock Source Selection
JP35 JP36 JP37 Clock Selection
1-2 1-2 ON 25 MHz Oscillator (default setting)
2-3 1-2 ON 25 MHz External Clock
X 2-3 OFF 25 MHz Crystal (not populated)
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Freescale Semiconductor 11
The 25-MHz oscillator (U23) also feeds the Ethernet chip (U11).
There is also a 12-MHz crystal feeding the USB controller (U33).
2.3.3 Watchdog Timer
The dBUG firmware does not enable the watchdog timer on the MCF5235.
2.3.4 Exception Sources
The ColdFire family of processors supports seven levels of interrupt priorities. When the processor receives an interrupt with a higher priority than the current interrupt mask (in the status register), it performs an interrupt acknowledge cycle at the end of the current instruction cycle. This interrupt acknowledge cycle tells the interrupt source that the request is acknowledged and the source should provide the vector number to indicate where the service routine for this interrupt level is located. If the interrupt source is not capable of providing a vector, its interrupt should be set up as an auto-vector interrupt that directs the processor to a predefined entry in the exception table (refer to the MCF5235 Reference Manual).
The processor goes to an exception routine via the exception table. This table is stored in the flash EEPROM and its address location is stored in the VBR. The dBUG ROM monitor writes a copy of the exception table into the RAM starting at 0x0000_0000. To set an exception vector, place the address of the exception handler in the appropriate vector in the vector table and then point the VBR to 0x0000_0000.
The MCF5235 microprocessor has seven external interrupt request lines IRQ[7:1]. The interrupt controller is capable of providing up to 63 interrupt sources. These sources are:
• External interrupt signals IRQ[7:1] (EPORT)• Software watchdog timer module• Timer modules• UART modules 0, 1 and 2• I2C module• DMA module• QSPI module• FEC module• PIT• Security module• FlexCAN0 and FlexCAN1• eTPU
All external interrupt inputs are edge sensitive. The active level is programmable. An interrupt request must be held valid until an IACK cycle starts to guarantee correct processing. Each interrupt input can have its priority programmed by setting the xIPL[2:0] bits in the interrupt control registers except interrupts 1–7 because they have a fixed priority.
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No interrupt sources should have the same level and priority as another. Programming two interrupt sources with the same level and priority results in undefined operation.
The M523xEVB hardware uses IRQ7 to support the ABORT function using the ABORT switch (SW5). This switch is used to force an interrupt (level 7, priority 3) if your program execution should be aborted without issuing a reset (refer to Section 4, “Using the Monitor/Debug Firmware”, for more information on ABORT). Because the ABORT switch is not capable of generating a vector in response to a level seven interrupt acknowledge from the processor, the dBUG programs this interrupt request for autovector mode.
Refer to the MCF5235 Reference Manual for more information about the interrupt controller.
2.3.5 TA Generation
The processor starts a bus cycle by asserting CSx with the other control signals. The processor then waits for a transfer acknowledgment (TA) from within (auto-acknowledge, AA mode) or from the externally addressed device before it can complete the bus cycle. TA is indicates the completion of the bus cycle. It also allows devices with different access times to communicate with the processor properly asynchronously.
The MCF5235 processor, as part of the chip-select logic, has a built-in mechanism to generate TA for all external devices that cannot generate this signal. For example, the flash ROM cannot generate a TA signal. The chip-select logic is programmed by the dBUG ROM monitor to generate TA internally after a pre-programmed number of wait states. To support future expansion of the M523xEVB, the TA input of the processor is also connected to the processor expansion bus (J9, pin 44). This allows any expansion boards to assert this line to provide a TA signal to the processor. On the expansion boards this signal should be generated through an open collector buffer with no pull-up resistor; a pull-up resistor is included on this board. All TA signals from expansion boards should be connected to this line.
2.3.6 User’s Program
JP64 on the 16-Mbit flash (U19) or JP31 if using 32-Mbit flash (U35) allows you to test code from boot/POR without having to overwrite the ROM monitor.
When the jumper is set between pins 1 and 2, the behavior of the system is normal: dBUG boots and then runs from 0xFFE0_0000 (0xFFC0_0000). When the jumper is set between pins 2 and 3, the board boots from the top half of the flash (0xFFF0_0000).
Procedure:1. Compile and link as though the code was to be placed at the base of the flash.2. Set up the jumper JP64 (JP31) for normal operation, pin 1 connected to pin 2. 3. Download to SDRAM. (If using serial or Ethernet, start the ROM monitor first. If using BDM via
a wiggler cable, download first, then start ROM monitor by pointing the program counter (PC) to 0xFFE0_0400 (0xFFC0_0400) and run.)
4. In the ROM monitor, execute the 'FL write <dest> <src> <bytes>' command.5. Move jumper JP64 (JP31) to pin 2 connected to pin 3 and push the reset button (SW6). Your code
should now be running from reset/POR.
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Freescale Semiconductor 13
2.4 Communication PortsThe EVB provides external communication interfaces for two UART serial ports, a UART/FlexCAN1 port, FlexCAN0 port, QSPI, I2C port, 10/100T Ethernet port, eTPU port (including UNI3 and HS/ENCO connectors for auxiliary motor control cards), USB host port, USB device port, and BDM/JTAG port.
2.4.1 UART0 and UART1 Ports
The MCF5235 device has three built in UARTs, each with its own software-programmable baud rate generator. Two of these UART interfaces are brought out to RS232 transceivers. One channel is the ROM monitor to terminal output and the other is available to you. The ROM monitor programs the interrupt level for UART0 to level 3, priority 2 and autovector mode of operation. The interrupt level for UART1 is programmed to level 3, priority 1 and autovector mode of operation. The signals from these channels are available on expansion connectors J7 and J8. The UART0 and UART1 signals are passed through the RS-232 transceivers (U30) & (U31) and are available on DB-9 connectors (P4) and (P5).
Refer to the MCF5235 Reference Manual for programming the UARTs and their register maps.
2.4.2 UART2/FlexCAN1 Port
The third UART on the MCF5235 is multiplexed with the second FlexCAN module (FlexCAN1). The functionality of these ports is jumper-selectable on the EVB. Table 12 shows the jumper configuration to activate UART2 or FlexCAN1.
The signals of UART2 are passed through RS-232 transceiver U32 and are jumper-selectable (see Table 12) on DB-9 connector P6.
The CAN1TX and CAN1RX signals from FlexCAN1 are brought out to a 3.3-V CAN transceiver (Texas Instruments SN65HVD230D) and are jumper-selectable (see Table 12) on DB-9 connector P6. Jumpers JP3 and JP4 control the CAN hardware configuration.
Table 12. UART2/FlexCAN1 Jumper Configuration
Jumper UART2 Setting FlexCAN1 Setting
JP7 1-2 2-3
JP12 1-2 2-3
JP25 2-3 X
JP26 2-3 X
JP50 2-3 1-2
JP51 2-3 1-2
JP52 2-3 1-2
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2.4.3 FlexCAN0 Port
The EVB provides one dedicated CAN transceiver. The CAN0TX and CAN0RX signals are brought out to a 3.3V CAN transceiver (Texas Instruments SN65HVD230D). Jumper JP1 and JP2 control the CAN hardware configuration.
The CANL and CANH signals are brought out from the CAN transceiver to a female DB-9 connector (P1) in the configuration below.
2.4.4 10/100T Ethernet Port
The MCF5235 microprocessor populated on the EVB is a superset device of the MCF523x family. The upper 16 eTPU channels are multiplexed with the ethernet port giving you the choice of using the full 32-channels of eTPU or 16-channels of eTPU with the Fast Ethernet controller (FEC) activated. Pin M4 on the MCF5235 configures the internal functionality of these 16 pins. If you are using the FEC, pin M4 must be pulled low by setting SW7-11 to the ON position.
These 16 pins are also jumper-selectable between the eTPU and the FEC to isolate the external circuitry required to implement the functionality of these modules. Table 16 lists the appropriate jumper settings to enable eTPU or FEC functionality on these pins.
The MCF5235 device performs the full set of IEEE 802.3/Ethernet CSMA/CD media access control and channel interface functions. The MCF5235 Ethernet controller requires an external interface adaptor and
Table 13. FlexCAN1 Jumper Configuration
Jumper Function ON OFF
JP3 Transceiver mode Standby High Speed(No Slope Control)
JP4 CAN Termination Terminating resistor between CANL and CANH
No terminating resistor
Table 14. FlexCAN0 Jumper Configuration
Jumper Function ON OFF
JP1 Transceiver mode Standby High Speed (No Slope Control)
JP2 CAN Termination Terminating resistor between CANL and CANH
No terminating resistor
Table 15. CAN Bus Connector Pinout
DB-9 pin Signal
1,4-6,7-9 Not Connected
2 CANL
3 Ground
7 CANH
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Freescale Semiconductor 15
transceiver function to complete the interface to the ethernet media. The MCF5235 Ethernet module also features an integrated fast (100baseT) Ethernet media access controller (MAC).
The Fast Ethernet controller (FEC) incorporates the following features:• Support for three different Ethernet physical interfaces:
— 100-Mbps IEEE 802.3 MII— 10-Mbps IEEE 802.3 MII— 10-Mbps 7-wire interface (industry standard)
• IEEE 802.3 full duplex flow control• Programmable max frame length supports IEEE 802.1 VLAN tags and priority• Support for full-duplex operation (200Mbps throughput) with a minimum system clock rate of
50 MHz• Support for half-duplex operation (100Mbps throughput) with a minimum system clock rate of
25 MHz• Retransmission from transmit FIFO following a collision (no processor bus utilization)• Automatic internal flushing of the receive FIFO for runts (collision fragments) and address
recognition rejects (no processor bus utilization)• Address recognition
— Frames with broadcast address may be always accepted or always rejected— Exact match for single 48-bit individual (unicast) address— Hash (64-bit hash) check of individual (unicast) addresses— Hash (64-bit hash) check of group (multicast) addresses— Promiscuous mode
For more details see the MCF5235 Reference Manual. The on-board ROM monitor is programmed to allow you to download files from a network to memory in different formats. The current compiler formats supported are S-Record, COFF, ELF or Image.
Table 16. Ethernet/eTPU Jumper Configuration
Jumper PinEthernet Setting
Ethernet Signal
eTPU Setting
eTPU Channel
JP5 D5 2-3 ERXER 1-2 23
JP9 C5 2-3 ETXCLK 1-2 22
JP10 B5 2-3 ETXD2 1-2 18
JP11 A5 2-3 ETXD1 1-2 17
JP13 D6 2-3 ETXEN 1-2 21
JP14 C6 2-3 ETXER 1-2 20
JP15 B6 2-3 ETXD3 1-2 19
JP16 C4 2-3 ERXD0 1-2 24
JP17 B7 2-3 ETXD0 1-2 16
JP18 C3 2-3 ERXD1 1-2 25
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2.4.5 eTPU
The eTPU is an intelligent programmable I/O controller with its own core and memory system, allowing it to perform complex timing and I/O management independently of the CPU. The eTPU is essentially a co-processor designed for timing control, I/O handling, serial communications, motor control. and engine control applications and accesses data without the host CPU’s intervention. Consequently, the host CPU setup and service times for each timer event are minimized or eliminated.
The eTPU is an enhanced version of the TPU module implemented on the MC68332 and MPC500 products. Enhancements of the eTPU include a more powerful processor that handles high-level C code efficiently and has more functionality and increased performance. Although there is no compatibility at the microcode level, the eTPU maintains several features of older TPU versions and is conceptually almost identical. The eTPU library is a superset of the standard TPU library functions modified to take advantage of enhancements in the eTPU. These, along with a C compiler, make it relatively easy to port older applications. By providing source code for the Freescale library, it is possible for the eTPU to support your own function development.
The eTPU has up to 32 timer channels in addition to having 6 Kbytes of code memory and 1.5 Kbytes of data memory that stores software modules downloaded at boot time and that can be mixed and matched as required for any specific application.
As mentioned in Section 2.4.4, “10/100T Ethernet Port,” the upper 16-channels of the eTPU are multiplexed with the Fast Ethernet controller. Refer to Table 16 to set the appropriate jumpers to enable 16 or 32-channels. To configure the device to operate with the top 16-channels of the eTPU activated, pin M4 must be pulled high by setting SW7-11 to the OFF position.
All 32 eTPU channels are available on a 0.1 2x20 Molex connector providing easy access to the eTPU.
JP19 D4 2-3 ERXD2 1-2 26
JP20 D3 2-3 ERXD3 1-2 27
JP21 E3 2-3 ERXCLK 1-2 29
JP22 E4 2-3 ERXDV 1-2 28
JP23 F3 2-3 ECOL 1-2 31
JP24 F4 2-3 ECRS 1-2 30
Table 17. eTPU Header Pin Assignment
Pin eTPU Signal Pin eTPU Signal
1 +3.3V 2 +5V
3 TPUCH16 4 UTPUODIS
5 TPUCH17 6 LTPUODIS
7 TPUCH18 8 TPUCH0
Table 16. Ethernet/eTPU Jumper Configuration (continued)
Jumper PinEthernet Setting
Ethernet Signal
eTPU Setting
eTPU Channel
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There is a UNI3 connector and HS/ENCO connector on the EVB for connection to an auxiliary card. The auxiliary card is intended for evaluation of the eTPU functionality.
2.4.6 BDM/JTAG Port
The MCF5235 processor has a background debug mode (BDM) port, which supports real-time trace and real-time debug. The signals necessary for debug are available at connector J1 as shown in Figure 4.
The BDM connector can also be used to interface to JTAG signals. On reset, the JTAG_EN signal selects between multiplexed debug module and JTAG signals. See Table 5.
9 TPUCH19 10 TPUCH1
11 TPUCH20 12 TPUCH2
13 TPUCH21 14 TPUCH3
15 TPUCH22 16 TPUCH4
17 TPUCH23 18 TPUCH5
19 TPUCH24 20 TPUCH6
21 TPUCH25 22 TPUCH7
23 TPUCH26 24 TPUCH8
25 TPUCH27 26 TPUCH9
27 TPUCH28 28 TPUCH10
29 TPUCH29 30 TPUCH11
31 TPUCH30 32 TPUCH12
33 TPUCH31 34 TPUCH13
35 GND 36 TPUCH14
37 TCRCLK 38 TPUCH15
39 GND 40 GND
Table 17. eTPU Header Pin Assignment (continued)
Pin eTPU Signal Pin eTPU Signal
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Figure 4. J1- BDM Connector Pin Assignment
2.4.7 I2C
The MCF5235’s I2C module includes the following features:• Compatibility with the I2C bus standard version 2.1• Multi-master operation• Software programmable for one of 50 different clock frequencies• Software selectable acknowledge bit• Interrupt driven byte by byte data transfer• Arbitration-lost interrupt with automatic mode switching from master to slave• Calling address identification interrupt• Start and stop signal generation and detection• Repeated start signal generation• Acknowledge bit generation and detection• Bus busy detection
Please see the MCF5235 Reference Manual for more details. The I2C signals from the MCF5235 device are brought out to expansion connector J13.
The I2C functionality of the MCF5235 is multiplexed on the same pins as the QSPI. Jumpers JP6 and JP8 are used to connect/disconnect the I2C signals, SDA and SCL. To enable I2C set JP6 and JP8 between pins 2 and 3.
1
3
5
7
9
11
13
15
17
19
21
23
25
2
4
6
8
10
12
14
16
18
20
22
24
26
BKPT
DSCLK
Developer Reserved
DSI
DSO
PST3
PST1
DDATA3
DDATA1
GND
Freescale Reserved
PSTCLK
TA
GND
GND
RESET
GND
PST2
PST0
DDATA2
DDATA0
Freescale Reserved
GND
Core Voltage
Developer Reserved
I/O or Pad Voltage
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2.4.8 Queued Serial Peripheral Interface (QSPI)
The QSPI module provides a serial peripheral interface with queued transfer capability. It supports up to 16 stacked transfers at one time, minimizing CPU intervention between transfers. Transfer RAMs in the QSPI are indirectly accessible using address and data registers.
Functionality is very similar to the QSPI portion of the QSM (queued serial module) implemented in the MC68332 processor.
• Programmable queue to support up to 16 transfers without user intervention• Supports transfer sizes of eight to 16 bits in one bit increments• Four peripheral chip-select lines for control of up to 15 devices• Baud rates from 147.1-Kbps to 18.75-Mbps at 75 MHz.• Programmable delays before and after transfers• Programmable QSPI clock phase and polarity• Supports wrap-around mode for continuous transfers
Please see the MCF5235 Reference Manual for more details. The QSPI signals from the MCF5235 device are brought out to expansion connector J12.
Some of the QSPI signals are multiplexed with the I2C module. Set JP6 and JP8 between pins 1 and 2 to enable the QSPI module.
The EVB features an analog-to-digital converter (ADC) interfaced to the CPU via the QSPI. The ADC uses QSPI chip select 0. This chip select has a jumper that can be removed if you are not using the ADC and wish to connect QSPI_CS0 to an alternate device.
2.4.9 USB Host and Device
The EVB features a USB controller interfaced externally to the MCF5235 via the DMA and external bus modules. The USB controller can be configured to run in Host or Device mode.
There is a series A connector (host) and a series B connector (device) populated on the EVB. Either can be used depending on whether the USB controller is configured to run in host or device mode. Set JP56 between pins 2 and 3 to configure the controller for host mode or between pin 1 and 2 to configure the controller for device mode.
The USB controller also has On-The-Go (OTG) functionality. There is a footprint on the EVB for an OTG Mini-AB connector if you want to use USB OTG. If using OTG, JP55 must be fitted.
For more details see the Philips Semiconductor datasheet for the ISP1362 USB OTG controller.
There are a series of jumpers connected to the USB controller allowing you to disconnect the DMA and interrupt signals between the CPU and the USB controller if the USB controller is not in use. This gives you access to the DMA timer module channels 1 and 2 and an extra interrupt signal. Table 18 details these jumper settings.
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2.5 Connectors and User Components
2.5.1 Daughter Card Expansion Connectors
Four, 60-way SMT connectors (J7, J8, J9 and J10) provide access to all MCF5235 signals. These connectors are ideal for interfacing to a custom daughter card or for simple probing of processor signals. Below is a pinout description of these connectors.
Table 18. USB DMA Enable and Disable Settings
Jumper Functionality when Jumper is Fitted Functionality when Jumper is NOT Fitted
JP57 USB DMA request signal DMA Timer 1 input enabled
JP58 USB DMA request signal DMA Timer 2 input enabled
JP59 USB DMA acknowledge signal DMA Timer 2 output enabled
JP60 USB DMA acknowledge signal DMA Timer 1 output enabled
JP61 DACK1 not in use - pulled high DMA acknowledge 1 enabled
JP62 Interrupt 4 enabled for USB Interrupt 4 disabled from USB
JP63 DACK2 not in use - pulled high DMA acknowledge 2 enabled
Table 19. J7
Pin Signal Pin Signal
1 +5V 2 +5V
3 +3.3V 4 +3.3V
5 +3.3V 6 +3.3V
7 GND 8 GND
9 TPUCH24 10 TPUCH6
11 TPUCH17 12 TPUCH4
13 TPUCH18 14 TPUCH5
15 TPUCH22 16 TPUCH2
17 TPUCH23 18 TPUCH3
19 TPUCH19 20 TPUCH1
21 TPUCH20 22 TPUCH0
23 TPUCH21 24 GND
25 TPUCH16 26 EMDIO
27 U2CTS 28 EMDC
29 I2C_SCL 30 I2C_SDA
31 QSPI_SCK 32 QSPI_DIN
33 BS3 34 QSPI_DOUT
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35 BS2 36 QSPI_PCS0
37 BS1 38 SD_SCKE
39 BS0 40 CAN1RX
41 U2RTS 42 U2RXD
43 QSPI_PCS1 44 U1CTS
45 U1RTS 46 CAN1TX
47 U1RXD 48 U2TXD
49 U1TXD 50 CS2
51 CS3 52 CS7
53 CS6 54 CS5
55 CS1 56 CS0
57 CS4 58 A23
59 GND 60 GND
Table 20. J8
Pin Signal Pin Signal
1 +5V 2 +1.5V
3 +3.3V 4 +3.3V
5 TPUCH8 6 TPUCH7
7 TPUCH10 8 TPUCH9
9 TPUCH25 10 TPUCH12
11 TPUCH27 12 TPUCH11
13 TPUCH26 14 TPUCH14
15 TPUCH29 16 TPUCH13
17 TPUCH28 18 TCRCLK
19 TPUCH31 20 TPUCH15
21 TPUCH30 22 GND
23 GND 24 U0CTS
25 U0RXD 26 DTOUT0
27 DTIN0 28 U0TXD
29 U0RTS 30 GND
31 CLKMOD0 32 +3.3V
33 CLKMOD1 34 GND
Table 19. J7 (continued)
Pin Signal Pin Signal
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35 GND 36 D28
37 D30 38 D29
39 D31 40 D24
41 D26 42 D25
43 D27 44 D21
45 D23 46 D22
47 EXT_RSTIN 48 D19
49 GND 50 GND
51 D13 52 D20
53 D9 54 D17
55 D12 56 D18
57 D15 58 D16
59 GND 60 GND
Table 21. J9
Pin Signal Pin Signal
1 +5V 2 +1.5V
3 +3.3V 4 +3.3V
5 +3.3V 6 +3.3V
7 GND 8 GND
9 A21 10 A22
11 A19 12 A20
13 A17 14 A18
15 A16 16 A14
17 A15 18 A11
19 A13 20 GND
21 GND 22 A10
23 A12 24 A8
25 A9 26 A7
27 A6 28 A4
29 A5 30 GND
31 A2 32 A0
33 A3 34 A1
Table 20. J8 (continued)
Pin Signal Pin Signal
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35 GND 36 GND
37 DTIN3 38 UTPUODIS
39 DTOUT3 40 LTPUODIS
41 TIP 42 TEA
43 TS 44 TA
45 CAN0RX 46 SD_WE
47 R/W 48 CAN0TX
49 SD_CAS 50 SD_CS0
51 CLKOUT 52 SD_RAS
53 SD_CS1 54 DDATA3
55 XTAL 56 EXTAL
57 GND 58 GND
59 GND 60 GND
Table 22. J10
Pin Signal Pin Signal
1 +5V 2 +1.5V
3 +3.3V 4 +3.3V
5 D14 6 D10
7 D11 8 D6
9 D7 10 D8
11 D5 12 D4
13 GND 14 GND
15 D1 16 D2
17 D3 18 OE
19 D0 20 DTOUT1
21 DTIN1 22 +3.3V
23 +3.3V 24 IRQ6
25 IRQ7 26 TSIZ0
27 TSIZ1 28 IRQ2
29 IRQ3 30 IRQ4
31 IRQ5 32 TCLK/PSTCLK
33 DTOUT2 34 DTIN2
Table 21. J9 (continued)
Pin Signal Pin Signal
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24 Freescale Semiconductor
2.5.2 Reset Switch (SW6)
The reset logic provides system initialization. Reset occurs at power-on or by asserting RESET via SW6.
A hard reset and voltage sense controller (U25) is used to produce an active low power-on reset signal. The reset switch (SW6) is fed into U25 that generates the signal tied to the MCF5235’s RESET. RESET is an open collector signal. Therefore, it can be wire-OR’ed with other reset signals from additional peripherals. On the EVB, RESET is wire OR’d with the BDM reset signal and a reset signal is available on the expansion connectors for use with your hardware.
See Section 2.3.1, “Reset Logic”, for more details on reset.
2.5.3 User LEDs
There are eight LEDs available to you. Each of these LEDs are pulled to +3.3V through a 10 Ω resistor and can be illuminated by driving a logic 0 on the appropriate signal to sink the current. Each of these signals can be disconnected from its associated LED with a jumper. The table below details which MCF5235 signal is associated with which LED.
35 IRQ1 36 TDI/DSI
37 TDO/DSO 38 TMS/BKPT
39 TRST/DSCLK 40 GND
41 GND 42 PST3
43 PST1 44 PST2
45 PST0 46 DDATA0
47 DDATA2 48 DDATA1
49 GND 50 GND
51 JTAG_EN 52 RCON
53 GND 54 RSTOUT
55 GND 56 RESET
57 GND 58 GND
59 GND 60 GND
Table 23. User LEDs
LED MCF5235 Signal Jumper to disconnect
D25 DTOUT0 JP38
D26 DTIN0 JP39
D27 DTOUT1 JP40
D28 DTIN1 JP41
Table 22. J10 (continued)
Pin Signal Pin Signal
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2.5.4 Other LEDs
There are several other LEDs on the M523xEVB to signal various board/processor/component states. Below is a list of those LEDs and their functions:
3 Initialization and Setup
3.1 System ConfigurationThe M523xEVB board requires the following items for minimum system configuration:
• The M523xEVB board (provided).• Power supply, +7V to 14V DC with minimum of 300 mA.• RS232C compatible terminal or a PC with terminal emulation software.• RS232 communication cable (provided).
D29 DTOUT2 JP42
D30 DTIN2 JP43
D31 DTOUT3 JP44
D32 DTIN3 JP45
Table 24. LED Functions
LED Function
D1–D4 Ethernet Phy functionality
D5–D12 eTPU functionality
D14 +3.3V Power Good
D17 +5V Power Good
D23 Abort (IRQ7) asserted
D24 Reset (RSTI) asserted
D25–D32 User LEDs (See Table 23)
Table 23. User LEDs (continued)
LED MCF5235 Signal Jumper to disconnect
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26 Freescale Semiconductor
Figure 5 displays the minimum system configuration.
Figure 5. Minimum System Configuration
3.2 Installation and SetupThe following sections describe all the steps needed to prepare the board for operation. Please read the following sections carefully before using the board. When you are preparing the board for the first time,
dBUG>
+7 to +14 VDCInput Power
RS-232 Terminalor PC
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check that all jumpers are in the default locations. Default jumper markings are documented on the master jumper table and printed on the underside of the board. After the board is functional in its default mode, the Ethernet interface may be used by following the instructions provided in Section 5, “Configuring dBUG for Network Downloads”.
3.2.1 Unpacking
Unpack the computer board from its shipping box. Save the box for storing or reshipping. Refer to the following list and verify that all the items are present. You should have received:
• M523xEVB Single Board Computer• M5235EVB User's Manual (this document)• One RS232 communication cable• One BDM (background debug mode) wiggler cable• MCF5235 Reference Manual• ColdFire® Programmers Reference Manual• A selection of third party developer tools and literature
NOTEAvoid touching the MOS devices. Static discharge can damage these devices.
After you have verified that all the items are present, remove the board from its protective jacket and anti-static bag. Check the board for any visible damage. Ensure that there are no broken, damaged, or missing parts. If you have not received all the items listed above or they are damaged, please contact Freescale Semiconductor immediately. For contact details, please see the end of this manual.
3.2.2 Preparing the Board for Use
The board, as shipped, is ready to be connected to a terminal and power supply without any need for modification. Figure 9 shows the position of the jumpers and connectors.
3.2.3 Providing Power to the Board
The EVB requires an external supply voltage of 7–14 V DC, minimum 1 Amp. This is regulated on-board using three switching voltage regulators to provide the necessary EVB voltages of 5V, 3.3V and 1.5V. There are two different power supply input connectors on the EVB: connector P2 is a 2.1mm power jack (Figure 6), P3 is a lever actuated connector (Figure 7).
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Figure 6. 2.1mm Power Connector
Figure 7. 2-Lever Power Connector
3.2.4 Power Switch (SW4)
Slide switch SW4 isolates the power supply input from the EVB voltage regulators if required:• Moving the slide switch to the left (towards connector P3) turns the EVB on.• Moving the slide switch to the right (away from connector P3) turns the EVB off.
3.2.5 Power Status LEDs and Fuse
When power is applied to the EVB, green power LEDs adjacent to the voltage regulators show the presence of the supply voltage as follows:
If no LEDs are illuminated when the power is applied to the EVB, it is possible that power switch SW4 is in the OFF position or that the fuse F1 has blown. This can occur if power is applied to the EVB in reverse-bias where a protection diode ensures that the fuse blows rather than causing damage to the EVB. Replace F1 with a 20mm 1A fast-blow fuse.
Table 25. Power LEDs
LED Function
D17 Indicates that the +5V regulator is working correctly
D14 Indicates that the +3.3V regulator is working correctly
V+(7-14V)
GND
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3.2.6 Selecting Terminal Baud Rate
The serial channel UART0 of the MCF5235 is used for serial communication and has a built in timer. This timer is used by the dBUG ROM monitor to generate the baud rate used to communicate with a serial terminal. A number of baud rates can be programmed. On power-up or manual reset, the dBUG ROM monitor firmware configures the channel for 19200 baud. When the dBUG ROM monitor is running, a SET command may be issued to select any baud rate supported by the ROM monitor.
3.2.7 The Terminal Character Format
The character format of the communication channel is fixed at power-up or reset. The default character format is eight bits per character, no parity, and one stop bit with no flow control. It is necessary to ensure that the terminal or PC is set to this format.
3.2.8 Connecting the Terminal
The board is now ready to be connected to a PC/terminal. 1. Use the RS-232 serial cable to connect the PC/terminal to the M523xEVB PCB. The cable has a
9-pin female D-sub terminal connector at one end and a 9-pin male D-sub connector at the other end.
2. Connect the 9-pin male connector to connector P4 on the M523xEVB board. 3. Connect the 9-pin female connector to one of the available serial communication channels
normally referred to as COM1 (COM2, etc.) on the PC running terminal emulation software. The connector on the PC/terminal may be male 25-pin or 9-pin. It may be necessary to obtain a 25 pin-to-9 pin adapter to make this connection. If an adapter is required, refer to Figure 8.
3.2.9 Using a Personal Computer as a Terminal
A personal computer may be used as a terminal provided a terminal emulation software package is available. Examples of this software are PROCOMM, KERMIT, QMODEM, Windows 95/98/2000/XP Hyper Terminal or similar packages. The board should then be connected as described in Section 3.2.8, “Connecting the Terminal”.
After the connection to the PC is made, power may be applied to the PC and the terminal emulation software can be run. In terminal mode, it is necessary to select the baud rate and character format for the channel. Most terminal emulation software packages provide a command known as Alt-p (press the p key while pressing the Alt key) to choose the baud rate and character format. The character format should be 8 bits, no parity, one stop bit as described in Section 3.2.7, “The Terminal Character Format”. The baud rate should be set to 19200. Power can now be applied to the board.
Figure 8. Pin Assignment for Female (Terminal) Connector
1
69
5
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Pin assignments are as follows:Table 26. Pin Assignment for Female (Terminal) Connector
DB9 Pin Function
1 Data Carrier Detect, Output (shorted to pins 4 and 6)
2 Receive Data, Output from board (receive refers to terminal side)
3 Transmit Data, Input to board (transmit refers to terminal side)
4 Data Terminal Ready, Input (shorted to pin 1 and 6)
5 Signal Ground
6 Data Set Ready, Output (shorted to pins 1 and 4)
7 Request to Send, Input
8 Clear to send, Output
9 Not connected
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Figure 9 shows the jumper locations for the board.
Figure 9. Jumper Locations
3.3 System Power-up and Initial OperationWhen all of the cables are connected to the board, power may be applied. The dBUG ROM monitor initializes the board and then displays a power-up message on the terminal, which includes the amount of memory present on the board.Hard ResetDRAM Size: 16M
ColdFire MCF5235 on the M523xEVB Firmware v3b.1a.xx (Built on xxx xx xxxx xx:xx:xx)
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Copyright 1995-2004 Freescale Semiconductor, Inc.
Enter 'help' for help.dBUG>
The board is now ready for operation under the control of the debugger as described in Section 4, “Using the Monitor/Debug Firmware”. If you do not get the above response, perform the following checks:
1. Make sure that the power supply is properly configured for polarity, voltage level, and current capability (~1A) and is connected to the board.
2. Check that the terminal and board are set for the same character format and baud.3. Press the RESET button to insure that the board has been initialized properly.
If a proper response does not occur after these steps, your board may have been damaged. Contact Freescale Semiconductor for further instructions. Please see the end of this manual for contact details.
3.4 Using The BDM PortThe MCF5235 microprocessor has a built in debug module referred to as BDM (background debug module). To use BDM, simply connect the 26-pin debug connector on the board, J1, to the P&E BDM wiggler cable provided in the kit. No special setting is needed. Refer to the MCF5235 Reference Manual for additional instructions.
NOTEBDM functionality and use is supported by third party developer software tools. Details may be found on the CD-ROM included in this kit.
4 Using the Monitor/Debug FirmwareThe M523xEVB single board computer has a resident firmware package that provides a self-contained programming and operating environment. The firmware, named dBUG, provides you with a monitor/debug interface, inline assembler and disassembly, program download, register and memory manipulation, and I/O control functions. This section is a how-to-use description of the dBUG package, including the user interface and command structure.
4.1 What is dBUG?dBUG is a traditional ROM monitor/debugger that offers a comfortable and intuitive command line interface to download and execute code. It contains all the primary features needed in a debugger to create a useful debugging environment.
The firmware provides a self-contained programming and operating environment. dBUG interacts with you through pre-defined commands that are entered via the terminal. These commands are defined in Section 4.4, “Commands”.
An additional function called the system call allows your program to use various routines within dBUG. The system call is discussed at the end of this section.
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The operational mode of dBUG is demonstrated in Figure 10. After the system initialization, the board waits for a command-line input from the user terminal. When a proper command is entered, the operation continues in one of the two basic modes. If the command causes execution of your program, the dBUG firmware may or may not be re-entered, at the discretion of your program. For the alternate case, the command is executed under control of the dBUG firmware, and after command completion, the system returns to command entry mode.
During command execution, additional user input may be required depending on the command function.
For commands that accept an optional <width> to modify the memory access size, the valid values are:• B 8-bit (byte) access• W 16-bit (word) access• L 32-bit (long) access
When no <width> option is provided, the default width is W, 16-bit.
The ColdFire core register set is maintained by dBUG. These are listed below:• A0-A7• D0-D7• PC• SR
All control registers on ColdFire are not readable by the supervisor-programming model, and thus not accessible via dBUG. Your code may change these registers, but caution must be exercised as changes may render dBUG inoperable.
A reference to SP (stack pointer) actually refers to general purpose address register seven, A7.
4.2 Operational ProcedureSystem power-up and initial operation are described in detail in Section 3, “Initialization and Setup”. This information is repeated here for convenience and to prevent possible damage.
4.2.1 System Power-up• Be sure the power supply is connected properly prior to power-up.• Make sure the terminal is connected to the TERMINAL (P4) connector.• Turn power on to the board.
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Figure 10 shows the dBUG operational mode.
Figure 10. Flow Diagram of dBUG Operational Mode
4.2.2 System Initialization
After the EVB is powered-up and initialized, the terminal displays:Hard ResetDRAM Size: 16M
ColdFire MCF5235 on the M523xEVB Firmware v3b.1a.xx (Built on xxx xx xxxx xx:xx:xx)Copyright 1995-2004 Freescale Semiconductor, Inc.
Enter 'help' for help.dBUG>
Other means can be used to re-initialize the M523xEVB firmware, as discussed in the following paragraphs.
4.2.2.1 External RESET Button
External RESET (SW6) is the red button. Depressing this button causes all processes to terminate, resets the MCF5235 processor and board logic, and restarts the dBUG firmware. Pressing the RESET button would be the appropriate action if all else fails.
Command lineinput from terminal
Does
cause user programexecution?
No
Yes
Yes
Execute commandfunction
Initialize
No
Jump to userprogram and
begin execution
command line
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4.2.2.2 ABORT Button
ABORT (SW5) is the button located next to the RESET button. The abort function causes an interrupt of the present processing (a level 7 interrupt on MCF5235) and gives control to the dBUG firmware. This action differs from RESET in that no processor register or memory contents are changed, the processor and peripherals are not reset, and dBUG is not restarted. Also, in response to depressing the ABORT button, the contents of the MCF5235 core internal registers are displayed.
The abort function is most appropriate when software is being debugged. You can interrupt the processor without destroying the present state of the system. This is accomplished by forcing a non-maskable interrupt that calls a dBUG routine that saves the current state of the registers to shadow registers in the monitor for display. You are returned to the ROM monitor prompt after exception handling.
4.2.2.3 Software Reset Command
dBUG does have a command that causes the dBUG to restart as if a hardware reset was invoked. The command is RESET.
4.3 Command Line UsageThe user interface to dBUG is the command line. A number of features have been implemented to achieve an easy and intuitive command line interface.
dBUG assumes that an 80x24 ASCII character dumb-terminal is used to connect to the debugger. For serial communications, dBUG requires eight data bits, no parity, and one stop bit (8-N-1). The baud rate default is 19200 bps — a speed commonly available from workstations, personal computers and dedicated terminals.
The command line prompt is: dBUG>
Any dBUG command may be entered from this prompt. dBUG does not allow command lines to exceed 80 characters. Wherever possible, dBUG displays data in 80 columns or less. dBUG echoes each character as it is typed, eliminating the need for any local echo on the terminal side.
The <Backspace> and <Delete> keys are recognized as rub-out keys for correcting typographical mistakes.
Command lines may be recalled using the <Control> U, <Control> D and <Control> R key sequences. <Control> U and <Control> D cycle up and down through previous command lines. <Control> R recalls and executes the last command line.
In general, dBUG is not case-sensitive. Commands may be entered in uppercase or lowercase, depending upon your equipment and preference. Only symbol names require that the exact case be used.
Most commands can be recognized by using an abbreviated name. For instance, entering h is the same as entering help. Thus it is not necessary to type the entire command name.
The commands DI, GO, MD, STEP and TRACE are used repeatedly when debugging. dBUG recognizes this and allows for repeated execution of these commands with minimal typing. After a command is
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entered, press the <Return> or <Enter> key to invoke the command again. The command is executed as if no command line parameters were provided.
4.4 CommandsThis section lists the commands that are available with all versions of dBUG. Some board or CPU combinations may use additional commands not listed below.
Table 27. dBUG Command Summary
Mnemonic Syntax Description
ASM asm <<addr> stmt> Assemble
BC bc addr1 addr2 length Block Compare
BF bf <width> begin end data <inc> Block Fill
BM bm begin end dest Block Move
BR br addr <-r> <-c count> <-t trigger> Breakpoint
BS bs <width> begin end data Block Search
DC dc value Data Convert
DI di<addr> Disassemble
DL dl <offset> Download Serial
DLDBUG dldbug Download dBUG
DN dn <-c> <-e> <-i> <-s <-o offset>> <filename> Download Network
FL fl erase addr bytesfl write dest src bytes
Flash Utilities
GO go <addr> Execute
GT gt addr Execute To
HELP help <command> Help
IRD ird <module.register> Internal Register Display
IRM irm module.register data Internal Register Modify
LR lr<width> addr Loop Read
LW lw<width> addr data Loop Write
MD md<width> <begin> <end> Memory Display
MM mm<width> addr <data> Memory Modify
MMAP mmap Memory Map Display
RD rd <reg> Register Display
RM rm reg data Register Modify
RESET reset Reset
SD sd Stack Dump
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SET set <option value> Set Configurations
SHOW show <option> Show Configurations
STEP step Step (Over)
SYMBOL symbol <symb> <-a symb value> <-r symb> -C|l|s> Symbol Management
TRACE trace <num> Trace (Into)
UP up begin end filename Upload Memory to File
VERSION version Show Version
Table 27. dBUG Command Summary (continued)
Mnemonic Syntax Description
ASM asm <<addr> stmt> Assemble
BC bc addr1 addr2 length Block Compare
BF bf <width> begin end data <inc> Block Fill
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ASM AssemblerUsage: ASM <<addr> stmt>
The ASM command is a primitive assembler. The <stmt> is assembled and the resulting code placed at <addr>. This command has an interactive and non-interactive mode of operation.
The value for address <addr> may be an absolute address specified as a hexadecimal value, or a symbol name. The value for stmt must be valid assembler mnemonics for the CPU.
For interactive mode, enter the command and the optional <addr>. If the address is not specified, then the last address is used. The memory contents at the address are disassembled, and you are prompted for the new assembly. If valid, the new assembly is placed into memory, and the address incremented accordingly. If the assembly is not valid, then memory is not modified, and an error message produced. In either case, memory is disassembled and the process repeats.
You may press the <Enter> or <Return> key to accept the current memory contents and skip to the next instruction, or enter a period to quit the interactive mode.
In the non-interactive mode, specify the address and the assembly statement on the command line. The statement is then assembled, and if valid, placed into memory. Otherwise, an error message is produced.
Examples:
To place a NOP instruction at address 0x0001_0000, the command is:asm 10000 nop
To interactively assemble memory at address 0x0040_0000, the command is:asm 400000
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BC Block CompareUsage: BC addr1 addr2 length
The BC command compares two contiguous blocks of memory on a byte-by-byte basis. The first block starts at address addr1 and the second starts at address addr2, both of length bytes.
If the blocks are not identical, the address of the first mismatch is displayed. The value for addresses addr1 and addr2 may be an absolute address specified as a hexadecimal value or a symbol name. The value for length may be a symbol name or a number converted according to the user-defined radix (hexadecimal by default).
Example:
To verify that the data starting at 0x2_0000 and ending at 0x3_0000 is identical to the data starting at 0x8_0000, the command is:
bc 20000 80000 10000
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BF Block FillUsage: BF<width> begin end data <inc>
The BF command fills a contiguous block of memory starting at address begin, stopping at address end, with the value data. <Width> modifies the size of the data that is written. If no <width> is specified, the default of word-sized data is used.
The value for addresses begin and end may be an absolute address specified as a hexadecimal value, or a symbol name. The value for data may be a symbol name, or a number converted according to the user-defined radix, normally hexadecimal.
The optional value <inc> can be used to increment (or decrement) the data value during the fill.
This command first aligns the starting address for the data access size, and then increments the address accordingly during the operation. Thus, for the duration of the operation, this command performs properly-aligned memory accesses.
Examples:
To fill a memory block starting at 0x0002_0000 and ending at 0x0004_0000 with the value 0x1234, the command is:
bf 20000 40000 1234
To fill a block of memory starting at 0x0002_0000 and ending at 0x0004_0000 with a byte value of 0xAB, the command is:
bf.b 20000 40000 AB
To zero out the BSS section of the target code (defined by the symbols bss_start and bss_end), the command is:
bf bss_start bss_end 0
To fill a block of memory starting at 0x0002_0000 and ending at 0x0004_0000 with data that increments by 2 for each <width>, the command is:
bf 20000 40000 0 2
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BM Block MoveUsage: BM begin end dest
The BM command moves a contiguous block of memory starting at address begin and stopping at address end to the new address dest. The command copies memory as a series of bytes, and does not alter the original block.
The values for addresses begin, end, and dest may be absolute addresses specified as hexadecimal values, or symbol names. If the destination address overlaps the block defined by begin and end, an error message is produced and the command exits.
Examples:
To copy a block of memory starting at 0x0004_0000 and ending at 0x0008_0000 to the location 0x0020_0000, the command is:
bm 40000 80000 200000
To copy the target code’s data section (defined by the symbols data_start and data_end) to 0x0020_0000, the command is:
bm data_start data_end 200000
NOTERefer to the upuser command for copying code/data into flash memory.
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BR BreakpointsUsage: BR addr <-r> <-c count> <-t trigger>
The BR command inserts or removes breakpoints at address addr. The value for addr may be an absolute address specified as a hexadecimal value, or a symbol name. Count and trigger are numbers converted according to the user-defined radix, normally hexadecimal.
If no argument is provided to the BR command, a listing of all defined breakpoints is displayed.
The -r option to the BR command removes a breakpoint defined at address addr. If no address is specified in conjunction with the -r option, then all breakpoints are removed.
Each time a breakpoint is encountered during the execution of target code, its count value is incremented by one. By default, the initial count value for a breakpoint is zero, but the -c option allows setting the initial count for the breakpoint.
Each time a breakpoint is encountered during the execution of target code, the count value is compared against the trigger value. If the count value is equal to or greater than the trigger value, a breakpoint is encountered and control returned to dBUG. By default, the initial trigger value for a breakpoint is one, but the -t option allows setting the initial trigger for the breakpoint.
If no address is specified in conjunction with the -c or -t options, then all breakpoints are initialized to the values specified by the -c or -t option.
Examples:
To set a breakpoint at the C function main() (symbol _main; see symbol command), the command is:br _main
When the target code is executed and the processor reaches main(), control is returned to dBUG.
To set a breakpoint at the C function bench() and set its trigger value to 3, the command is:br _bench -t 3
When the target code is executed, the processor must attempt to execute the function bench() a third time before returning control back to dBUG.
To remove all breakpoints, the command is:br -r
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BS Block SearchUsage: BS<width> begin end data
The BS command searches a contiguous block of memory starting at address begin, stopping at address end, for the value data. <Width> modifies the size of the data that is compared during the search. If no <width> is specified, the default of word sized data is used.
The values for addresses begin and end may be absolute addresses specified as hexadecimal values, or symbol names. The value for data may be a symbol name or a number converted according to the user-defined radix, normally hexadecimal.
This command first aligns the starting address for the data access size, and then increments the address accordingly during the operation. Thus, for the duration of the operation, this command performs properly-aligned memory accesses.
Examples:
To search for the 16-bit value 0x1234 in the memory block starting at 0x0004_0000 and ending at 0x0008_0000:
bs 40000 80000 1234
This reads the 16-bit word located at 0x0004_0000 and compares it against the 16-bit value 0x1234. If no match is found, then the address is incremented to 0x0004_0002 and the next 16-bit value is read and compared.
To search for the 32-bit value 0xABCD in the memory block starting at 0x0004_0000 and ending at 0x0008_0000:
bs.l 40000 80000 ABCD
This reads the 32-bit word located at 0x0004_0000 and compares it against the 32-bit value 0x0000_ABCD. If no match is found, then the address is incremented to 0x0004_0004 and the next 32-bit value is read and compared.
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DC Data ConversionUsage: DC data
The DC command displays the hexadecimal or decimal value data in hexadecimal, binary, and decimal notation.
The value for data may be a symbol name or an absolute value. If an absolute value passed into the DC command is prefixed by 0x, data is interpreted as a hexadecimal value. Otherwise data is interpreted as a decimal value.
All values are treated as 32-bit quantities.
Examples:
To display the decimal and binary equivalent of 0x1234, the command is:dc 0x1234
To display the hexadecimal and binary equivalent of 1234, the command is:dc 1234
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DI DisassembleUsage: DI <addr>
The DI command disassembles target code pointed to by addr. The value for addr may be an absolute address specified as a hexadecimal value, or a symbol name.
Wherever possible, the disassembler uses information from the symbol table to produce a more meaningful disassembly. This is especially useful for branch target addresses and subroutine calls.
The DI command attempts to track the address of the last disassembled opcode. If no address is provided to the DI command, then the DI command uses the address of the last opcode that was disassembled.
The DI command is repeatable.
Examples:
To disassemble code that starts at 0x0004_0000, the command is:di 40000
To disassemble code of the C function main(), the command is:di _main
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DL Download ConsoleUsage: DL <offset>
The DL command performs an S-record download of data obtained from the console, typically a serial port. The value for offset is converted according to the user-defined radix, normally hexadecimal. Please reference the ColdFire Microprocessor Family Programmer’s Reference Manual for details on the S-Record format.
If offset is provided, then the destination address of each S-record is adjusted by offset.
The DL command checks the destination download address for validity. If the destination is an address outside the defined user space, then an error message is displayed and downloading aborted.
If the S-record file contains the entry point address, then the program counter is set to reflect this address.
Examples:
To download an S-record file through the serial port, the command is:dl
To download an S-record file through the serial port, and add an offset to the destination address of 0x40, the command is:
dl 0x40
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DLDBUG Download dBUGUsage: DL <offset>
The DLDBUG command is used to update the dBUG image in flash. It erases the flash sectors containing the dBUG image, downloads a new dBUG image in S-record format obtained from the console, and programs the new dBUG image into flash.
When the DLDBUG command is issued, dBUG prompts you for verification before any actions are taken. If the command is affirmed, the flash is erased and you are prompted to begin sending the new dBUG S-record file. The file should be sent as a text file with no special transfer protocol.
CAUTIONUse this command with extreme caution, as any error can render dBUG useless!
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DN Download NetworkUsage: DN <-c> <-e> <-i> <-s> <-o offset> <filename>
The DN command downloads code from the network. The DN command manages files that are S-record, COFF, ELF or image formats. The DN command uses trivial file transfer protocol (TFTP) to transfer files from a network host.
In general, the type of file to be downloaded and the name of the file must be specified to the DN command.
• -c option indicates a COFF download• -e option indicates an ELF download• -i option indicates an image download• -s indicates an S-record download• -o option works only in conjunction with the -s option to indicate an optional offset for S-record
download.
The filename is passed directly to the TFTP server and therefore must be a valid filename on the server.
If neither of the -c, -e, -i, -s or filename options are specified, then a default filename and filetype is used. Default filename and filetype parameters are manipulated using the SET and SHOW commands.
The DN command checks the destination download address for validity. If the destination is an address outside the defined user space, then an error message is displayed and downloading aborted.
For ELF and COFF files that contain symbolic debug information, the symbol tables are extracted from the file during download and used by dBUG. Only global symbols are kept in dBUG. The dBUG symbol table is not cleared prior to downloading. So, it is your responsibility to clear the symbol table as necessary prior to downloading.
If an entry point address is specified in the S-record, COFF or ELF file, the program counter is set accordingly.
Examples:
To download an S-record file with the name srec.out, the command is:dn -s srec.out
To download a COFF file with the name coff.out, the command is:dn -c coff.out
To download a file using the default filetype with the name bench.out, the command is:dn bench.out
To download a file using the default filename and filetype, the command is:dn
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FL Flash UtilitiesInfo Usage: FLErase Usage: FL erase addr bytesWrite Usage: FL write dest src bytes
The FL command provides a set of flash utilities that displays information about the flash devices on the EVB, erases a specified range of flash, or erases and programs a specified range of flash.
When issued with no parameters, the FL command displays usage information, as well as device specific information for the flash devices available. This information includes size, address range, protected range, access size, and sector boundaries.
When the erase command is given, the FL command attempts to erase the number of bytes specified on the command line beginning at addr. If this range doesn’t start and end on flash sector boundaries, the range is adjusted automatically and you are prompted for verification before proceeding.
When the write command is given, the FL command programs the number of bytes specified from src to dest. An erase of this region is first attempted. As with the erase command, if the flash range to be programmed does not start and end on flash sector boundaries, the range is adjusted and you are prompted for verification before the erase is performed. The specified range is also checked to insure that the entire destination range is valid within the same flash device and that the src and dest are not within the same device.
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GO ExecuteUsage: GO <addr>
The GO command executes target code starting at address addr. The value for addr may be an absolute address specified as a hexadecimal value, or a symbol name.
If no argument is provided, the GO command begins executing instructions at the current program counter.
When the GO command is executed, all user-defined breakpoints are inserted into the target code, and the context is switched to the target program. Control is only regained when the target code encounters a breakpoint, illegal instruction, trap #15 exception, or other exception that causes control to be handed back to dBUG.
The GO command is repeatable.
Examples:
To execute code at the current program counter, the command is:go
To execute code at the C function main(), the command is:go _main
To execute code at the address 0x0004_0000, the command is:go 40000
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GT Execute ToUsage: GT addr
The GT command inserts a temporary breakpoint at addr and then executes target code starting at the current program counter. The value for addr may be an absolute address specified as a hexadecimal value, or a symbol name.
When the GT command is executed, all breakpoints are inserted into the target code, and the context is switched to the target program. Control is only regained when the target code encounters a breakpoint, illegal instruction, or other exception that causes control to be handed back to dBUG.
Examples:
To execute code up to the C function bench(), the command is:gt _bench
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HELP HelpUsage: HELP <command>
The HELP command displays a brief syntax of the commands available within dBUG. In addition, the address of where your code may start is given. If command is provided, then a brief listing of the syntax of the specified command is displayed.
Examples:
To obtain a listing of all the commands available within dBUG, the command is:help
To obtain help on the breakpoint command, the command is:help br
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IRD Internal Register DisplayUsage: IRD <module.register>
This command displays the internal registers of different modules inside the MCF5235. In the command line, module refers to the module name where the register is located and register refers to the specific register to display.
The registers are organized according to the module to which they belong. Use the IRD command without any parameters to get a list of all the valid modules. Refer to the MCF5235 Reference Manual for more information on these modules and the registers they contain.
Example:ird sim.rsr
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IRM Internal Register ModifyUsage: IRM module.register data
This command modifies the contents of the internal registers of different modules inside the MCF5235. In the command line, module refers to the module name where the register is located and register refers to the specific register to modify. The data parameter specifies the new value to be written into the register.
Example:
To modify the TMR register of the first timer module to the value 0x0021, the command is:irm timer1.tmr 0021
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LR Loop ReadUsage: LR<width> addr
The LR command continually reads the data at addr until a key is pressed. The optional <width> specifies the size of the data to be read. If no <width> is specified, the command defaults to reading word-sized data.
Example:
To continually read the longword data from address 0x2_0000, the command is:lr.l 20000
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LW Loop WriteUsage: LW<width> addr data
The LW command continually writes data to addr. The optional width specifies the size of the access to memory. The default access size is word.
Examples:
To continually write the longword data 0x1234_5678 to address 0x2_0000, the command is:lw.l 20000 12345678
The following command writes 0x78 into memory:lw.b 20000 12345678
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MD Memory DisplayUsage: MD<width> <begin> <end>
The MD command displays a contiguous block of memory starting at address begin and stopping at address end. The values for addresses begin and end may be absolute addresses specified as hexadecimal values, or symbol names. Width modifies the size of the data that is displayed. If no <width> is specified, the default of word-sized data is used.
Memory display starts at the address begin. If no beginning address is provided, the MD command uses the last address that was displayed. If no ending address is provided, then MD displays memory up to an address that is 128 beyond the starting address.
This command first aligns the starting address for the data access size, and then increments the address accordingly during the operation. Thus, for the duration of the operation, this command performs properly-aligned memory accesses.
Examples:
To display memory at address 0x0040_0000, the command is:md 400000
To display memory in the data section (defined by the symbols data_start and data_end), the command is:md data_start
To display a range of bytes from 0x0004_0000 to 0x0005_0000, the command is:md.b 40000 50000
To display a range of 32-bit values starting at 0x0004_0000 and ending at 0x0005_0000:md.l 40000 50000
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MM Memory ModifyUsage: MM<width> addr <data>
The MM command modifies memory at the address addr. The value for addr may be an absolute address specified as a hexadecimal value, or a symbol name. Width specifies the size of the data that is modified. If no <width> is specified, the default of word sized data is used. The value for data may be a symbol name, or a number converted according to the user-defined radix, normally hexadecimal.
If a value for data is provided, then the MM command immediately sets the contents of addr to data. If no value for data is provided, then the MM command enters into a loop. The loop obtains a value for data, sets the contents of the current address to data, increments the address according to the data size, and repeats. The loop terminates when an invalid entry for the data value is entered, i.e., a period.
This command first aligns the starting address for the data access size, and then increments the address accordingly during the operation. Thus, for the duration of the operation, this command performs properly-aligned memory accesses.
Examples:
To set the byte at location 0x0001_0000 to be 0xFF, the command is:mm.b 10000 FF
To interactively modify memory beginning at 0x0001_0000, the command is:mm 10000
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MMAP Memory Map DisplayUsage: mmap
This command displays the memory map information for the M523xEVB evaluation board. The information displayed includes the type of memory, the start and end address of the memory, and the port size of the memory. The display also includes information on how the chip selects are used on the board and which regions of memory are reserved (protected) for dBUG use.
Here is an example of the output from this command:Type Start End Port Size
-----------------------------------------------------------------SDRAM 0x00000000 0x00FFFFFF 32-bitSRAM (Int) 0x20000000 0x2000FFFF 32-bitMRAM (Ext) 0x30000000 0x3007FFFF 32-bitIPSBAR 0x40000000 0x7FFFFFFF 32-bitFlash (Ext) 0xFFE00000 0xFFFFFFFF 16-bit
Protected Start End----------------------------------------dBUG Code 0xFFE00000 0xFFE3FFFFdBUG Data 0x00000000 0x0000FFFF
Chip Selects----------------CS0 Ext FlashCS1 Ext MRAM
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RD Register DisplayUsage: RD <reg>
The RD command displays the register set of the target. If no argument for reg is provided, then all registers are displayed. Otherwise, the value for reg is displayed.
dBUG preserves the registers by storing a copy of the register set in a buffer. The RD command displays register values from the register buffer.
Examples:
To display all the registers and their values, the command is:rd
To display only the program counter:rd pc
Here is an example of the output from this command:PC: 00000000 SR: 2000 [t.Sm.000...xnzvc]An: 00000000 00000000 00000000 00000000 00000000 00000000 00000000 01000000Dn: 00000000 00000000 00000000 00000000 00000000 00000000 00000000 00000000
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RM Register ModifyUsage: RM reg data
The RM command modifies the contents of the register reg to data. The value for reg is the name of the register, and the value for data may be a symbol name, or it is converted according to the user-defined radix, normally hexadecimal.
dBUG preserves the registers by storing a copy of the register set in a buffer. The RM command updates the copy of the register in the buffer. The actual value is not written to the register until target code is executed.
Examples:
To change register D0 to contain the value 0x1234, the command is:rm D0 1234
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RESET Reset the Board and dBUGUsage: RESET
The RESET command resets the board and dBUG to their initial power-on states.
The RESET command executes the same sequence of code that occurs at power-on. If the RESET command fails to reset the board adequately, cycle the power or press the reset button.
Examples:
To reset the board and clear the dBUG data structures, the command is:reset
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SD Stack DumpUsage: SD
The SD command displays a back trace of stack frames. This command is useful after some user code has executed that creates stack frames (i.e,. nested function calls). After control is returned to dBUG, the SD command decodes the stack frames and display a trace of the function calls.
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SET Set ConfigurationsUsage: SET <option value>
The SET command allows the setting of user-configurable options within dBUG. With no arguments, SET displays the options and values available. The SHOW command displays the settings in the appropriate format. The standard set of options is listed below.
• baud—This is the baud rate for the first serial port on the board. All communications between you and dBUG occur using 9600 or 19200 bps, eight data bits, no parity, and one stop bit (8-N-1) with no flow control.
• base—This is the default radix for use in converting a number from its ASCII text representation to the internal quantity used by dBUG. The default is hexadecimal (base 16), and other choices are binary (base 2), octal (base 8), and decimal (base 10).
• client—This is the network Internet Protocol (IP) address of the board. For network communications, the client IP is required to be set to a unique value, usually assigned by your local network administrator.
• server—This is the network IP address of the machine that contains files accessible via TFTP. Your local network administrator has this information and can assist in properly configuring a TFTP server if one does not exist.
• gateway—This is the network IP address of the gateway for your local subnetwork. If the client IP address and server IP address are not on the same subnetwork, then this option must be properly set. Your local network administrator has this information.
• netmask—This is the network address mask to determine if use of a gateway is required. This field must be properly set. Your local network administrator has this information.
• filename—This is the default filename to be used for network download if no name is provided to the DN command.
• filetype—This is the default filetype to be used for network download if no type is provided to the DN command. Valid values are: srecord, coff, and elf.
• mac—This is the ethernet Media Access Control (MAC) address (hardware address) for the evaluation board. This should be set to a unique value, and the most significant nibble should always be even.
Examples: To set the baud rate of the board to be 19200, the command is:set baud 19200
NOTESee the SHOW command for a display containing the correct formatting of these options.
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SHOW Show ConfigurationsUsage: SHOW <option>
The SHOW command displays the settings of the user-configurable options within dBUG. When no option is provided, SHOW displays all options and values.
Examples:
To display all options and settings, the command is:show
To display the current baud rate of the board, the command is:show baud
Here is an example of the output from a show command:dBUG> show
base: 16baud: 19200server: 0.0.0.0client: 0.0.0.0gateway: 0.0.0.0netmask: 255.255.255.0filename: test.s19filetype: S-Recordethaddr: 00:CF:52:82:CF:01
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66 Freescale Semiconductor
STEP Step OverUsage: STEP
The STEP command steps over a subroutine call, rather than tracing every instruction in the subroutine. The command sets a temporary breakpoint one instruction beyond the current program counter and then executes the target code.
The STEP command steps over BSR and JSR instructions. The command works for other instructions as well, but if STEP is used with an instruction that does not return (i.e. BRA) then the temporary breakpoint may never be encountered and dBUG may never regain control.
Examples:
To pass over a subroutine call, the command is:step
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Freescale Semiconductor 67
SYMBOL Symbol Name ManagementUsage: SYMBOL <symb> <-a symb value> <-r symb> <-c|l|s>
The SYMBOL command adds or removes symbol names from the symbol table. If only a symbol name is provided to the SYMBOL command, then the symbol table is searched for a match on the symbol name and its information displayed.
• -a option adds a symbol name and its value into the symbol table• -r option removes a symbol name from the table• -c option clears the entire symbol table• -l option lists the contents of the symbol table• -s option displays usage information for the symbol table
Symbol names contained in the symbol table are truncated to 31 characters. Any symbol table lookups, by the SYMBOL command or by the disassembler, only use the first 31 characters. Symbol names are case-sensitive.
Symbols can also be added to the symbol table via inline assembly labels and ethernet downloads of ELF formatted files.
Examples:
To define the symbol main to have the value 0x0004_0000, the command is:symbol -a main 40000
To remove the symbol junk from the table, the command is:symbol -r junk
To see how full the symbol table is, the command is:symbol -s
To display the symbol table, the command is:symbol -l
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68 Freescale Semiconductor
TRACE Trace IntoUsage: TRACE <num>
The TRACE command allows single-instruction execution. If num is provided, then num instructions are executed before control is handed back to dBUG. The value for num is a decimal number.
The TRACE command sets bits in the processors’ supervisor registers to achieve single-instruction execution, and the target code executed. Control returns to dBUG after a single-instruction execution of the target code.
This command is repeatable.
Examples:
To trace one instruction at the program counter, the command is:tr
To trace 20 instructions from the program counter, the command is:tr 20
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Freescale Semiconductor 69
UP Upload DataUsage: UP begin end filename
The UP command uploads the data from a memory region (specified by begin and end) to a file (specified by filename) over the network. The file created contains the raw binary data from the specified memory region. The UP command uses the trivial file transfer protocol (TFTP) to transfer files to a network host.
Example:
To upload a portion of SDRAM to a file sdram.bin, the command is:up 40000 50000 sdram.bin
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70 Freescale Semiconductor
VERSION Display dBUG VersionUsage: VERSION
The VERSION command displays the version information for dBUG. The dBUG version, build number and build date are all given.
The version number is separated by a decimal, for example, v 2b.1c.1a:
The version date is the day and time the entire dBUG monitor was compiled and built.
Examples:
To display the version of the dBUG monitor, the command is:version
4.5 TRAP #15 FunctionsAn additional utility within the dBUG firmware is a function called the TRAP 15 handler. This function can be called by your program to use various routines within the dBUG, to perform a special task, and to return control to the dBUG. This section describes the TRAP 15 handler and how it is used.
There are four TRAP #15 functions. These are: OUT_CHAR, IN_CHAR, CHAR_PRESENT, and EXIT_TO_dBUG.
4.5.1 OUT_CHAR
This function (function code 0x0013) sends a character, which is in the lower eight bits of D1, to the terminal.
Assembly example:/* assume d1 contains the character */move.l #$0013,d0 Selects the functionTRAP #15 The character in d1 is sent to terminal
C example:void board_out_char (int ch){
/* If your C compiler produces a LINK/UNLK pair for this routine, * then use the following code that takes this into account*/
#if l/* LINK a6,#0 -- produced by C compiler */asm (“ move.l8(a6),d1”); /* put ‘ch’into d1 */
In this example, v 2b . 1c . 1a{ { {
dBUG commonmajor and minor revision
CPU major and minor revision
board majorand minor revision
M5235EVB User’s Manual, Rev. 2
Freescale Semiconductor 71
asm (“ move.l#0x0013,d0”); /* select the function */asm (“ trap#15”); /* make the call *//* UNLK a6 -- produced by C compiler */
#else/* If C compiler does not produce a LINK/UNLK pair, the use * the following code.*/ asm (“ move.l4(sp),d1”); /* put ‘ch’into d1 */asm (“ move.l#0x0013,d0”); /* select the function */asm (“ trap#15”); /* make the call */
#endif}
4.5.2 IN_CHAR
This function (function code 0x0010) returns an input character (from terminal) to the caller. The returned character is in D1.
Assembly example:move.l #$0010,d0 Select the functiontrap #15 Make the call, the input character is in d1.
C example:int board_in_char (void){
asm (“ move.l#0x0010,d0”); /* select the function */asm (“ trap#15”); /* make the call */asm (“ move.ld1,d0”); /* put the character in d0 */
}
4.5.3 CHAR_PRESENT
This function (function code 0x0014) checks if an input character is present to receive. A value of zero is returned in D0 when no character is present. A non-zero value in D0 means a character is present.
Assembly example:move.l #$0014,d0 Select the functiontrap #15 Make the call, d0 contains the response (yes/no).
C example:int board_char_present (void){
asm (“ move.l#0x0014,d0”); /* select the function */asm (“ trap#15”); /* make the call */
}
4.5.4 EXIT_TO_dBUG
This function (function code 0x0000) transfers the control back to the dBUG, by terminating your code. The register context are preserved.
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72 Freescale Semiconductor
Assembly example:move.l #$0000,d0 Select the functiontrap #15 Make the call, exit to dBUG.
C example:void board_exit_to_dbug (void){
asm (“ move.l#0x0000,d0”); /* select the function */asm (“ trap#15”); /* exit and transfer to dBUG */
}
5 Configuring dBUG for Network DownloadsThe dBUG module has the ability to perform downloads over an Ethernet network using the trivial file transfer protocol, TFTP.
NOTEThis requires a TFTP server to be running on the host attached to the board.
Prior to using this feature, several parameters are required for network downloads to occur. The information that is required and the steps for configuring dBUG are described below.
5.1 Required Network ParametersFor performing network downloads, dBUG needs six parameters; four are network-related, and two are download-related. The parameters are listed below, with the dBUG designation following in parenthesis.
All computers connected to an Ethernet network running the IP protocol need three network-specific parameters. These parameters are:
• Internet Protocol (IP( address for the computer (client IP)• IP address of the gateway for non-local traffic (gateway IP)• Network netmask for flagging traffic as local or non-local (netmask)
In addition, the dBUG network download command requires the following three parameters:• IP address of the TFTP server (server IP),• Name of the file to download (filename),• Type of the file to download (filetype of S-record, COFF, ELF, or Image).
Your local system administrator can assign a unique IP address for the board, and also provide you the IP addresses of the gateway, netmask, and TFTP server. Fill out the lines below with this information.
Client IP: ___.___.___.___ (IP address of the board)Server IP: ___.___.___.___ (IP address of the TFTP server)Gateway: ___.___.___.___ (IP address of the gateway)Netmask: ___.___.___.___ (Network netmask)
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5.2 Configuring dBUG Network ParametersAfter the network parameters have been obtained, the dBUG ROM monitor must be configured. The following commands are used to configure the network parameters.
set client <client IP>set server <server IP>set gateway <gateway IP>set netmask <netmask>set mac <addr>
For example, the TFTP server is named santafe and has IP address 123.45.67.1. The board is assigned the IP address of 123.45.68.15. The gateway IP address is 123.45.68.250, and the netmask is 255.255.255.0. The MAC address is chosen arbitrarily and is unique. The commands to dBUG are:
set client 123.45.68.15set server 123.45.67.1set gateway 123.45.68.250set netmask 255.255.255.0set mac 00:CF:52:82:EB:01
The last step is to inform dBUG of the name and type of the file to download. Prior to giving the name of the file, keep in mind the following.
Most, if not all, TFTP servers only allow access to files starting at a particular sub-directory. (This is a security feature that prevents reading of arbitrary files by unknown persons.) For example, SunOS uses the directory /tftp_boot as the default TFTP directory. When specifying a filename to a SunOS TFTP server, all filenames are relative to /tftp_boot. As a result, you normally are required to copy the file to download into the directory used by the TFTP server.
A default filename for network downloads is maintained by dBUG. To change the default filename, use the command:
set filename <filename>
When using the Ethernet network for download, S-record, COFF, ELF, or image files may be downloaded. A default filetype for network downloads is maintained by dBUG as well. To change the default filetype, use the command:
set filetype <srecord|coff|elf|image>
Continuing with the above example, the compiler produces an executable COFF file, a.out. This file is copied to the /tftp_boot directory on the server with the command:
rcp a.out santafe:/tftp_boot/a.out
Change the default filename and filetype with the commands:set filename a.outset filetype coff
Finally, perform the network download with the DN command. The network download process uses the configured IP addresses and the default filename and filetype for initiating a TFTP download from the TFTP server.
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74 Freescale Semiconductor
5.3 Troubleshooting Network ProblemsMost problems related to network downloads are a direct result of improper configuration. Verify that all IP addresses configured into dBUG are correct. This is accomplished via the SHOW command.
• Using an IP address already assigned to another machine causes dBUG network download to fail, and probably other severe network problems. Make certain the client IP address is unique for the board.
• Check for proper insertion or connection of the network cable. Is the status LED lit indicating that network traffic is present?
• Check for proper configuration and operation of the TFTP server. Most Unix workstations can execute a command named tftp that can be used to connect to the TFTP server as well. Is the default TFTP root directory present and readable?
• If ICMP_DESTINATION_UNREACHABLE or similar ICMP message appears, then a serious error has occurred. Reset the board, and wait one minute for the TFTP server to time out and terminate any open connections. Verify that the IP addresses for the server and gateway are correct. Also, verify that a TFTP server is running on the server.
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6 Schematics
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HIERARCHICAL INTERCONNECTS
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M5235EVB User’s Manual, Rev. 2
76 Freescale Semiconductor
5 5
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DTI
N3
LTP
UO
DIS
UTP
UO
DIS
TPU
CH
[15:
0]
U0R
XD
QS
PI_
PC
S1
/U1C
TS
/RS
TOU
T
/RC
ON
DTO
UT0
TDO
/DS
O
/U0C
TS
SD
_SC
KE
/U1R
TS
TRS
T/D
SC
LK
QS
PI_
DO
UT
/U0R
TS
QS
PI_
PC
S0
U1R
XD
TMS
/BK
PT
U0T
XD
QS
PI_
DIN
U2R
XD
TDI/D
SI
QS
PI_
SC
K
U2T
XD
DTI
N0
TPU
CH
[31:
16]
EM
DIO
EM
DC
TCR
CLK
/RE
SE
T
CA
N1R
XC
AN
1TX
I2C
_SD
AI2
C_S
CL
ER
XE
R
ETX
D2
ETX
D1
ETX
EN
ETX
D3
ETX
ER
ER
XD
0E
RX
D1
ER
XD
2E
RX
D3
ER
XC
LK
ER
XD
V
ETX
CLK
ETX
D0
EC
OL
EC
RS
/U2R
TS/U
2CTS
ETP
U/E
TH
She
et 9
eTP
U
TCRCLKUTPUODISLTPUODISTPUCH[15:0]TPUCH[31:16]
QSPI_DINQSPI_SCK
QSPI_DOUTQSPI_PCS0
/TIP/TEATSIZ0TSIZ1
She
et 1
2P
SU
She
et 8
Eth
erne
t
/RSTOUT
ETH_CLK
EMDIOEMDC
/IRQ[7:1]
ECOLECRSERXDVERXERERXCLKERXD0ERXD1ERXD2ERXD3ETXENETXERETXCLKETXD0ETXD1ETXD2ETXD3
M5235EVB User’s Manual, Rev. 2
Freescale Semiconductor 77
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
B_A
[23:
0]
/BS
2
B_D
20
B_A
[23:
0]
/BS
0/C
S1
B_A
[23:
0]
/BS
1
/BS
3
/BS[3:0]
/CS
1
B_D
10
B_D
18
B_D
11
B_D
24
B_D
16
B_D
13
B_D
5
B_D
0
B_D
8
B_D
19
B_D
25
B_D
17
B_D
7
B_D
12
B_D
1
B_D
28
B_D
31
B_D
23
B_D
26
B_D
[31:
0]
B_D
[31:
0]
B_D
15
B_D
22
B_D
29
B_D
21B
_D27
B_D
9
B_D
2B
_D3
B_D
6
B_D
4
B_D
14
B_D
30
B_A
5
B_A
3
B_A
18
B_A
18
B_A
9
B_A
7
B_A
4
B_A
10B
_A11
B_A
17
B_A
2
B_A
5
B_A
19
B_A
14
B_A
19
B_A
9B
_A15
B_A
15
B_A
12
B_A
4
B_A
2
B_A
10
B_A
7
B_A
16
B_A
3
B_A
6
B_A
13
B_A
12B
_A11
B_A
16B
_A8
B_A
13
B_A
17
B_A
6
B_A
8B
_A14
/CS
[7:0
]
B_A
[23:
0]
/BS
[3:0
]
/OE
B_D
[31:
0]
/CS
[7:0
]
R/W
+3.3
V+3
.3V
+3.3
V+3
.3V
+3.3
V
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
MR
AM
C
M52
3xE
VB
B
316
Tues
day,
Aug
ust 1
4, 2
007
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
MR
AM
C
M52
3xE
VB
B
316
Tues
day,
Aug
ust 1
4, 2
007
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
MR
AM
C
M52
3xE
VB
B
316
Tues
day,
Aug
ust 1
4, 2
007
MR
AM
Upp
er 1
6-bi
t wor
d
NO
TE: /
BS
3 se
lect
s th
e m
ost
sign
ifica
nt b
yte
lane
acc
ess
and
/BS
0 th
e le
ast s
igni
fican
t.
MR
AM
Low
er 1
6-bi
t wor
d
TSO
P II
TSO
P II
Eac
h M
RA
M is
256
K x
16b
it (5
12K
B)
Tota
l MR
AM
ava
ilabl
e =
1MB
NO
TE: A
SR
AM
's w
ith th
e sa
me
PC
B fo
otpr
int
and
func
tiona
lity
are
:- R
enes
as H
M62
W16
255H
CJP
-12,
Cyp
ress
CY
7C10
41C
V33
10ZC
Mot
orol
a S
PS
TS
PG
- TE
CD
Col
dFire
Gro
up
C8
0.1u
FC
80.
1uF
C2
1nF
C2
1nF
C3
1nF
C3
1nF
C7
0.1u
FC
70.
1uF
U1
MR
2A16
ATS
35C
U1
MR
2A16
ATS
35C
A0
1A
12
A2
3A
34
A4
5/C
E6
I/00
7I/0
18
I/02
9I/0
310
VC
C11
VS
S12
I/04
13I/0
514
I/06
15I/0
716
/WE
17A
518
A6
19A
720
A8
21A
922
A10
23A
1124
A12
25A
1326
A14
27N
C28
I/O8
29I/O
930
I/O10
31I/O
1132
VC
C33
VS
S34
I/O12
35I/O
1336
I/O14
37I/O
1538
/BLE
39/B
HE
40/O
E41
A15
42A
1643
A17
44
C4
1nF
C4
1nF
C6
0.1u
FC
60.
1uF
U2
MR
2A16
ATS
35C
U2
MR
2A16
ATS
35C
A0
1A
12
A2
3A
34
A4
5/C
E6
I/00
7I/0
18
I/02
9I/0
310
VC
C11
VS
S12
I/04
13I/0
514
I/06
15I/0
716
/WE
17A
518
A6
19A
720
A8
21A
922
A10
23A
1124
A12
25A
1326
A14
27N
C28
I/O8
29I/O
930
I/O10
31I/O
1132
VC
C33
VS
S34
I/O12
35I/O
1336
I/O14
37I/O
1538
/BLE
39/B
HE
40/O
E41
A15
42A
1643
A17
44
C5
0.1u
FC
50.
1uF
C1
1nF
C1
1nF
M5235EVB User’s Manual, Rev. 2
78 Freescale Semiconductor
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
B_A
18
B_A
15
B_D
17
D7
A0
B_D
8
D18
D28
D[3
1:0]
B_A
17
A18
B_D
16
A11
A7
B_D
30
D10
D23
B_D
21
B_D
10
D30
B_D
1D
2
B_A
19
B_A
4
B_D
18
D20
B_D
[31:
0]
A1
D8
B_D
9
D16
A19
B_D
13
B_D
2
D6
B_D
26
A12
A8
D17
B_D
31
B_D
11
B_D
22
B_A
20
B_A
5
B_D
19
A2
B_D
27
B_D
3
A13
A9
D11
B_D
12
D0
B_A
21
B_A
6
A20
A3
B_A
10
A15
D9
B_D
28
A14
B_A
22
B_A
7
B_D
0
B_D
23
D19
D22
D21
D24
A4
D25
B_A
0
B_A
11
B_D
4
B_A
16
B_A
8
D5
A[2
3:0]
B_D
24
D3
A21
D26
B_A
12
B_A
1
B_D
5
D14
B_A
[23:
0]
B_A
9
D12
B_D
25
B_A
2
B_A
13
B_D
6
D13
D15
A22
A16
B_D
14
A5
B_A
14
B_A
3
D4
B_D
7
D1
D27
A17
B_D
15
A10
A6
B_D
29
B_D
20
D31
D29
B_A
23A
23
/CS
2
/CS
0
/CS
1
D[3
1:0]
B_D
[31:
0]
R/W
A[2
3:0]
B_A
[23:
0]
/CS
[7:0
]
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
Buf
fers
C
M52
3xE
VB
B
416
Tues
day,
Aug
ust 1
4, 2
007
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
Buf
fers
C
M52
3xE
VB
B
416
Tues
day,
Aug
ust 1
4, 2
007
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
Buf
fers
C
M52
3xE
VB
B
416
Tues
day,
Aug
ust 1
4, 2
007
AD
DR
ES
S B
US
BU
FFE
RS
Add
ress
and
Dat
a B
us b
uffe
rs/tr
ansc
eive
rs u
sed
to b
uffe
rth
e si
gnal
s fo
r the
MR
AM
and
Fla
sh m
emor
ies
and
the
US
B c
ontro
ller.
DA
TA B
US
TR
AN
SC
EIV
ER
S
AN
D G
ate
Mot
orol
a S
PS
TS
PG
- TE
CD
Col
dFire
Gro
up
C14
1nF
C14
1nF
U4
MC
74LC
X16
245D
T
U4
MC
74LC
X16
245D
T
1B1
21B
23
1B3
51B
46
1B5
81B
69
1B7
111B
812
2B1
132B
214
2B3
162B
417
2B5
192B
620
2B7
222B
823
1DIR
11O
E48
2OE
252D
IR24
GN
D4
GN
D10
GN
D15
GN
D21
GN
D28
GN
D34
GN
D39
GN
D45
1A1
471A
246
1A3
441A
443
1A5
411A
640
1A7
381A
837
2A1
362A
235
2A3
332A
432
2A5
302A
629
2A7
272A
826
VC
C7
VC
C18
VC
C31
VC
C42
RP
2
4x 4
.7K
RP
2
4x 4
.7K
11
22
33
44
55
66
77
88
U7
MC
74LC
X24
5DT
U7
MC
74LC
X24
5DT
T/R
1A
02
A1
3A
24
A3
5A
46
A5
7A
68
A7
9G
ND
10
VC
C20
OE
19B
018
B1
17B
216
B3
15B
414
B5
13B
612
B7
11
C11
0.1u
FC
110.
1uF
U3
MC
74LC
X16
245D
T
U3
MC
74LC
X16
245D
T
1B1
21B
23
1B3
51B
46
1B5
81B
69
1B7
111B
812
2B1
132B
214
2B3
162B
417
2B5
192B
620
2B7
222B
823
1DIR
11O
E48
2OE
252D
IR24
GN
D4
GN
D10
GN
D15
GN
D21
GN
D28
GN
D34
GN
D39
GN
D45
1A1
471A
246
1A3
441A
443
1A5
411A
640
1A7
381A
837
2A1
362A
235
2A3
332A
432
2A5
302A
629
2A7
272A
826
VC
C7
VC
C18
VC
C31
VC
C42
C9
0.1u
FC
90.
1uF
C15
1nF
C15
1nF
RP
1
4x 4
.7K
RP
1
4x 4
.7K
11
22
33
44
55
66
77
88
U6
MC
74LC
X16
245D
T
U6
MC
74LC
X16
245D
T
1B1
21B
23
1B3
51B
46
1B5
81B
69
1B7
111B
812
2B1
132B
214
2B3
162B
417
2B5
192B
620
2B7
222B
823
1DIR
11O
E48
2OE
252D
IR24
GN
D4
GN
D10
GN
D15
GN
D21
GN
D28
GN
D34
GN
D39
GN
D45
1A1
471A
246
1A3
441A
443
1A5
411A
640
1A7
381A
837
2A1
362A
235
2A3
332A
432
2A5
302A
629
2A7
272A
826
VC
C7
VC
C18
VC
C31
VC
C42
C12
1nF
C12
1nF
U5 SN
74LV
C1G
11
U5 SN
74LV
C1G
11
A GN
DB
CV
CC Y
C10
0.1u
FC
100.
1uF
C13
1nF
C13
1nF
M5235EVB User’s Manual, Rev. 2
Freescale Semiconductor 79
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
CA
NL1
CA
NH
1
CA
N1R
X
CA
N1T
X
CA
N0R
X
CA
N0T
X
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
CA
N T
rans
ceiv
ers
C
M52
3xE
VB
B
516
Frid
ay, A
ugus
t 10,
200
7
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
CA
N T
rans
ceiv
ers
C
M52
3xE
VB
B
516
Frid
ay, A
ugus
t 10,
200
7
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
CA
N T
rans
ceiv
ers
C
M52
3xE
VB
B
516
Frid
ay, A
ugus
t 10,
200
7
Def
ault
setti
ng fo
r JP
2 is
fitte
d.
Def
ault
setti
ng fo
r JP
4 is
fitte
d.
Def
ault
setti
ng fo
r JP
1 is
NO
T fit
ted.
CA
N B
us C
onne
ctor
- 9
way
D-ty
pe(F
emal
e)
CA
N1
and
UA
RT2
sha
re th
e sa
me
DB
9 co
nnec
tor o
n S
heet
15
Def
ault
setti
ng fo
r JP
3 is
NO
T fit
ted.
CAN
Cha
nnel
0
CAN
Cha
nnel
1
Tran
scei
ver M
ode
CA
N T
erm
inat
ion
CA
N T
erm
inat
ion
Tran
scei
ver M
ode
Mot
orol
a S
PS
TS
PG
- TE
CD
Col
dFire
Gro
up
JP1
JP1
12
C17
0.1u
FC
170.
1uF
U8
SN
65H
VD
230D
U8
SN
65H
VD
230D
D1
GN
D2
VC
C3
R4
VR
EF
5C
AN
L6
CA
NH
7R
S8
JP3
JP3
12
R4
62R4
62C
181n
FC
181n
F
U9
SN
65H
VD
230D
U9
SN
65H
VD
230D
D1
GN
D2
VC
C3
R4
VR
EF
5C
AN
L6
CA
NH
7R
S8
JP2
JP2
12
R1
1KR1
1K
R2
62R2
62
C19
1nF
C19
1nF
JP4
JP4
12
R3
1KR3
1K
P1
P1
5 9 4 8 3 7 2 6 1
C16
0.1u
FC
160.
1uF
M5235EVB User’s Manual, Rev. 2
80 Freescale Semiconductor
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
CLK
MO
D[1
:0]
A[2
3:0]
PST0
/IRQ3
D31
TPU
CH
11
TPU
CH
10
/CS
[7:0
]
/CS7
A10
A5
A1
A3
/IRQ1
D3
D17
CLK
MO
D1
/BS0
A16
D21
D29
A23
/CS3
DDATA0
D5
CLK
MO
D0
TPU
CH
14
D[31:0]
A[23:0]
D27
TPU
CH
8
D14
/BS3/BS2
A14
/IRQ7
D18
D23
A20
A15
A0
D0
D1
D6
A8
D8
D15
D13
D20
TPU
CH
13
/BS
[3:0
]
A19
A12
A13
A7
DD
ATA
[3:0
]
PST1
D11
D9
/CS6
/CS4
A17
D19
D26
D30
TPU
CH
12
PS
T[3:
0]
/BS1
A6
/IRQ5/IRQ4
D10
D16
D12
D28
/IRQ
[7:1
]
D[3
1:0]
A21
A18
PST2
D2
A11
A9
A2
D22
D24
TPU
CH
15
TPU
CH
7
PST3/CS0
/CS1/CS5
TPU
CH
4
TPU
CH
0
TPU
CH
3
TPU
CH
1
TPU
CH
5TP
UC
H6
TPU
CH
2
TPUCH[15:0]
DDATA3
TPU
CH
19
TPU
CH
29
TPU
CH
28
TPU
CH
31
TPUCH[31:16]
TPU
CH
16
TPU
CH
23
TPU
CH
22
TPU
CH
27
TPU
CH
26
TPU
CH
17
TPU
CH
18
TPU
CH
21
TPU
CH
20
TPU
CH
25
TPU
CH
24
TPU
CH
30
A4
DDATA1
D7
/IRQ2
D4
D25
A22
DDATA2
/IRQ6
/CS2
TPU
CH
9
A[2
3:0]
D[3
1:0]
/CS
[7:0
]
U1TXD
/BS
[3:0
]
/OE
/IRQ
[7:1
]
TSIZ0TSIZ1
CLK
MO
D[1
:0]
DTOUT1DTIN1
DTOUT2DTIN2
TCLK/PSTCLK
PS
T[3:
0]
DD
ATA
[3:0
]
XTA
L
EX
TAL
/SD
_CS
1
/SD
_CS
0
JTA
G_E
N
CLK
OU
T
/SD
_RA
S/S
D_C
AS
R/W
CA
N0R
XC
AN
0TX
/SD
_WE
/TS
/TIP
/TA
/TE
AD
TOU
T3
DTI
N3
LTP
UO
DIS
UTP
UO
DIS
TPU
CH
[15:
0]
U0R
XD
QSPI_PCS1
/U1CTS
/RSTOUT
/RCON
DTO
UT0
TDO/DSO
/U0C
TS
SD_SCKE
/U1RTS
TRST/DSCLK
QSPI_DOUT
/U0R
TS
QSPI_PCS0
U1RXD
TMS/BKPT
U0T
XD
QS
PI_
DIN
TDI/DSI
QS
PI_
SC
K
DTI
N0
EMDIOEMDC
TCR
CLK
/RESET
U2R
XD
CA
N1R
X
U2T
XD
CA
N1T
X
ETX
CLK
ETX
D1
ER
XE
R
ETX
EN
ETX
D2
ETX
ER
ETX
D3
ETX
D0
ER
XD
0
ER
XD
1
ER
XD
2
ER
XD
3
ER
XC
LK
ER
XD
V
EC
OL
EC
RS
TPU
CH
[31:
16]
I2C
_SD
AI2
C_S
CL
/U2C
TS
/U2R
TS
ETP
U/E
TH
+1.5
VP
+3.3
VP
+3.3
VP
VS
SP
LLV
SS
PLL
VS
SP
LL
+3.3
VP
+3.3
VP
+1.5
VP
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
CP
UC
M52
3xE
VB
C
616
Tues
day,
Aug
ust 1
4, 2
007
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
CP
UC
M52
3xE
VB
C
616
Tues
day,
Aug
ust 1
4, 2
007
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
CP
UC
M52
3xE
VB
C
616
Tues
day,
Aug
ust 1
4, 2
007
NO
TE: P
lace
C33
, C34
& L
1 as
clo
seto
pin
s P
15 &
R15
as
poss
ible
usi
ng a
sepa
rate
gro
und
plan
e.
Pla
ce R
5 as
clos
e to
pin
C10
as p
ossi
ble.
Pla
ce R
6 as
clos
e to
pin
N15
as p
ossi
ble.
Pla
ce R
P3
as c
lose
to p
ins,
L13,
M13
, M14
& M
15 a
spo
ssib
le.
PLL
Filt
er C
ircu
it
eTP
U/E
ther
net E
nabl
e- s
ee p
age
13
256M
apB
GA
Def
ault
setti
ng fo
r JP
5, J
P9,
JP
10,
JP11
, JP
13-2
4 is
2 &
3 c
onne
cted
Def
ault
setti
ng fo
rJP
6 &
JP
8 is
pin
s 1&
2D
efau
lt se
tting
for J
P7
& J
P11
is p
ins
2&3
Def
ault
setti
ng fo
r JP
25 &
JP26
is b
ewte
en p
ins
1&2
Mot
orol
a S
PS
TS
PG
- TE
CD
Col
dFire
Gro
up
Mot
orol
a C
oldF
ire
Mic
ropr
oces
sor M
CF5
235
TM
JP5
JP5
12
3
C18
50.
1uF
C18
50.
1uF
R28
22R
2822
C29
0.1u
FC
290.
1uF
JP10
JP10
12
3
JP13
JP13
12
3
C18
70.
1uF
C18
70.
1uF
C21
100p
FC
2110
0pF
JP15
JP15
12
3
JP6
JP6
12
3
JP16
JP16
12
3
C25
1nF
C25
1nF
C31
0.1u
FC
310.
1uF
C18
31n
FC
183
1nF
U10
MC
F523
5
U10
MC
F523
5
VS
SA
1
TPU
CH
8B
1TP
UC
H7
B2
TPU
CH
10C
1TP
UC
H9
C2
TPU
CH
25/E
RX
D1
C3
TPU
CH
12D
1TP
UC
H11
D2
TPU
CH
27/E
RX
D3
D3
TPU
CH
26/E
RX
D2
D4
TPU
CH
14E
1TP
UC
H13
E2
TPU
CH
29/E
RX
CLK
E3
TPU
CH
28/E
RX
DV
E4
TCR
CLK
F1TP
UC
H15
F2TP
UC
H31
/EC
OL
F3TP
UC
H30
/EC
RS
F4
U0C
TSG
1U
0RX
DG
2
DTO
UT0
G3
DTI
N0
G4
Cor
e V
DD
H1
U0T
XD
H2
U0R
TSH
3
NC
H4
VS
SJ1
CLK
MO
D0
J2C
LKM
OD
1J3
D28
K1
D29
K2
D30
K3
D31
K4
D24
L1D
25L2
D26
L3D
27L4
D21
M1
D22
M2
D23
M3
D19
N1
D20
N2
D13
N3
D9 N4
D17
P1
D18
P2
D12 P3
D16
R1
D15 R2
VSS T1
D14 T2
D10 T3D11 R3
D6 T4D7 R4D8 P4
Core VDD T5
D4 R5D5 P5
VSS T6
D1 R6D2 P6D3 N6
OE T7
DTOUT1 R7DTIN1 P7
D0 N7
IRQ6 T8IRQ7 R8
TES
TJ4
eTP
U/E
thE
NB
M4
NC N5
TSIZ0 P8TSIZ1 N8
IRQ2 T9IRQ3 R9IRQ4 P9IRQ5 N9
TCLK/PSTCLK T10DTOUT2 R10DTIN2 P10
IRQ1 N10
TDI/DSI T11TDO/DSO R11TMS/BKPT P11TRST/DSCLK N11
PST3 T12PST2 R12PST1 P12PST0 N12
DDATA1 T13DDATA0 R13
RCON P13
RSTOUT T14
PLL_TEST R14
RESET T15VS
ST1
6
XTA
LR
16
VS
SP
LLR
15
EX
TAL
P16
VD
DP
LLP
15
DD
ATA
2P
14
VS
SN
16
SD
_CS
1N
15
DD
ATA
3N
14
JTA
G_E
NN
13
CLK
OU
TM
16
SD
_CA
SM
15S
D_R
AS
M14
SD
_CS
0M
13
R/W
L16
I2C
_SD
A/C
AN
0RX
L15
I2C
_SC
L/C
AN
0TX
L14
SD
_WE
L13
TSK
16TI
PK
15TA
K14
TEA
K13
DTO
UT3
/U2R
TSJ1
6D
TIN
3/U
2CTS
J15
LTP
UO
DIS
J14
UTP
UO
DIS
J13
A3
H16
A2
H15
A1
H14
A0
H13
Cor
e V
DD
G16
A6
G15
A5
G14
A4
G13
VS
SF1
6
A9
F15
A8
F14
A7
F13
A13
E16
A12
E15
A11
E14
A10
E13
A16
D16
A15
D15
A14
D14
CS0D13
A17
C16
A18
C15
A22C14
A19
B16
A20B15
VSSA16
A21A15
CS4A14
A23B14
CS6A13 CS1B13 CS5C13
U1TXDA12
CS3B12 CS7C12 CS2D12
U1RXDA11 U1RTSB11 U1CTSC11 U2TXD/CAN1TXD11
BS0A10
QSPI_PCS1B10
SD_SCKEC10
U2RXD/CAN1RXD10
BS1A9 BS2B9 BS3C9
QSPI_PCS0D9
Core VDDA8
QSPI_SCK/I2C_SCLB8 QSPI_DIN/I2C_SDAC8 QSPI_DOUTD8
TPUCH0A7 TPUCH16/ETXD0B7
EMDIOC7 EMDCD7
TPUCH1A6 TPUCH19/ETXD3B6 TPUCH20/ETXERC6 TPUCH21/ETXEND6
TPUCH17/ETXD1A5 TPUCH18/ETXD2B5 TPUCH22/ETXCLKC5 TPUCH23/ERXERD5 TPUCH2A4 TPUCH3B4 TPUCH24/ERXD0C4 TPUCH4A3 TPUCH5B3 TPUCH6A2
VS
SE
5
VD
DF5
VS
SF6
VD
DG
5V
DD
G6
VS
SG
7
VD
DH
5V
DD
H6
VS
SH
7V
SS
H8
VD
DJ5
VD
DJ6
VS
SJ7
VD
DK
5V
DD
K6
VD
DL5
VSS M5
VDD M6VSS L6
VDD M7VDD L7VSS K7
VDD M8VDD L8VSS K8VSS J8
VDD M9VDD L9VSS K9
VDD M10VDD L10
VDD M11
VS
SM
12
VD
DL1
2V
SS
L11
VD
DK
12V
DD
K11
VS
SK
10
VD
DJ1
2V
DD
J11
VS
SJ1
0V
SS
J9
VD
DH
12V
DD
H11
VS
SH
10
VD
DG
12V
DD
G11
VD
DF1
2
VSSE12
VDDE11 VSSF11
VDDE10 VDDF10 VSSG10
VDDE9 VDDF9 VSSG9 VSSH9
VDDE8 VDDF8 VSSG8
VDDE7 VDDF7
VDDE6
JP19
JP19
12
3
C18
40.
1uF
C18
40.
1uF
C22
100p
FC
2210
0pF
VIA
2V
IA21
JP21
JP21
12
3
C18
110
0pF
C18
110
0pF
JP26
JP26
12
3
JP23
JP23
12
3
C32
10uF
TA
NT.
C32
10uF
TA
NT.
C34
1000
pFC
3410
00pF
L1 10uH
L1 10uH
C23
100p
FC
2310
0pF
C18
60.
1uF
C18
60.
1uF
C18
21n
FC
182
1nF
JP9
JP9
12
3
RP
3
4x 2
2
RP
3
4x 2
211
22
33
44
55
66
77
88
JP11
JP11
12
3R
522
R5
22
C33
0.1u
FC
330.
1uF
JP12
JP12
12
3
C28
0.1u
FC
280.
1uF
JP14
JP14
12
3
C27
1nF
C27
1nF
JP17
JP17
12
3
JP8
JP8
12
3
JP7
JP7
12
3
JP18
JP18
12
3
JP20
JP20
12
3
C26
1nF
C26
1nF
C30
0.1u
FC
300.
1uF
VIA
1V
IA1
1
C18
010
0pF
C18
010
0pF
C20
100p
FC
2010
0pF JP
25JP
25
12
3
JP22
JP22
12
3
R6
22R6
22
R29
22R29
22
TP1 PLL Test Point
TP1 PLL Test Point1
JP24
JP24
12
3
C24
1nF
C24
1nF
M5235EVB User’s Manual, Rev. 2
Freescale Semiconductor 81
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
DD
ATA
2D
DA
TA1
DD
ATA
0
DD
ATA
[3:0
]
PS
T0
DD
ATA
[3:0
]
PS
T3P
ST2
DD
ATA
3P
ST1
PS
T[3:
0]P
ST[
3:0]
DD
ATA
[3:0
]
PS
T[3:
0]
TDO
/DS
O
TMS
/BK
PT
TDI/D
SI
TRS
T/D
SC
LK
BD
M_/
RS
TIN
/TA
TCLK
/PS
TCLK
+1.5
V+3
.3V
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
BD
M/J
TAG
Deb
ug P
ort
C
M52
3xE
VB
A
716
Frid
ay, A
ugus
t 10,
200
7
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
BD
M/J
TAG
Deb
ug P
ort
C
M52
3xE
VB
A
716
Frid
ay, A
ugus
t 10,
200
7
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
BD
M/J
TAG
Deb
ug P
ort
C
M52
3xE
VB
A
716
Frid
ay, A
ugus
t 10,
200
7
Def
ault
setti
ng fo
rJP
27 is
fitte
d.
NO
TE: J
P27
is re
quire
d fo
r som
e of
the
lega
cy B
DM
cabl
es th
at c
onne
ct p
ins
9 &
25
of th
e B
DM
inte
rface
inte
rnal
ly. M
ore
rece
nt c
able
s su
ppor
t bot
h co
re &
I/O
volta
ges.
Ple
ase
chec
k w
ith y
our B
DM
cab
le s
uppl
ier.
Cor
e V
olta
ge
IMP
OR
TAN
T N
OTE
: ON
LY 3
.3V
BD
M d
ebug
ging
cab
les
can
be u
sed
with
the
MC
F523
x pr
oces
sors
.
I/O V
olta
ge
NO
TE: 4
.7K
pul
l up
resi
stor
s ar
e us
ed o
n si
gnal
s /B
KP
T, D
SC
LK, D
SI,
DS
O&
/RE
SE
T. A
1K
pul
l up
is u
sed
for /
TA. S
ee p
age
13 o
f the
sch
emat
ics.
Def
ault
setti
ng -
FITT
ED
Mot
orol
a S
PS
TS
PG
- TE
CD
Col
dFire
Gro
up
JP28
JP28
12
R7
10K
R7
10K
J1J1 1 3 5 7 9 11 13 15 17 19 21 23 25
2 4 6 8 10 12 14 16 18 20 22 24 26
JP27
JP27
12
M5235EVB User’s Manual, Rev. 2
82 Freescale Semiconductor
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
/IRQ
[7:1
]/IR
Q2
/RS
TOU
T
ETH
_CLK
EM
DIO
EM
DC
/IRQ
[7:1
]
ER
XD
3E
RX
D2
ER
XD
1E
RX
D0
ER
XD
VE
RX
CLK
ER
XE
RE
TXC
LK
ETX
ER
ETX
EN
ETX
D0
ETX
D1
ETX
D2
ETX
D3
EC
OL
EC
RS
+3.3
V
+3.3
V
+2.5
VP
LL+2
.5V
A
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+2.5
VA
+2.5
VA
+2.5
VA
+2.5
VA
+2.5
VA
+2.5
VA
+2.5
VP
LL
+2.5
V
+2.5
V
+2.5
V
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
10/
100B
aseT
Eth
erne
t Tra
nsce
iver
C
M52
3xE
VB
B
816
Frid
ay, A
ugus
t 10,
200
7
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
10/
100B
aseT
Eth
erne
t Tra
nsce
iver
C
M52
3xE
VB
B
816
Frid
ay, A
ugus
t 10,
200
7
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
10/
100B
aseT
Eth
erne
t Tra
nsce
iver
C
M52
3xE
VB
B
816
Frid
ay, A
ugus
t 10,
200
7
Pla
ce s
ilk s
cree
n LE
D la
bels
next
to D
1 th
ru' D
4.
Sep
arat
e R
J45
conn
ecto
rch
assi
s gr
ound
.
NO
TE: E
ther
net C
h. p
hysi
cal a
ddr.
defa
ult s
ettin
g is
add
r. =
1 se
lect
ed v
ia in
tern
al re
sist
or b
iasi
ng d
urin
g re
set.
Pla
ce R
P4
& R
P5
as c
lose
to U
11 a
s po
ssib
le.
Pla
ce R
P6
& R
P7
as c
lose
to th
eM
CF5
23x
(CP
U) a
s po
ssib
le.
Link
LE
D
Col
lisio
nLE
D
100B
T LE
D
Full
Dup
lex
LED
Ana
log
Eth
erne
t Pla
ne
GR
EE
N
GR
EE
N
GR
EE
N
GR
EE
N
Pla
ce th
e ca
paci
tors
abo
vecl
ose
to p
ins
7 an
d 24
on
U11
.
Pla
ce R
8, R
9, R
10 &
R11
clo
se to
U11
.
NO
TE: U
11 K
S87
21B
L ha
s an
on-
chip
LD
O th
atde
rives
the
+2.5
V s
uppl
y fro
m th
e +3
.3V
sup
ply.
Mot
orol
a S
PS
TS
PG
- TE
CD
Col
dFire
Gro
up
NO
TE: R
P27
is p
rese
nt to
ens
ure
the
corr
ect c
onfig
urat
ion
of U
11ou
t of r
eset
.
C44
0.1u
FC
440.
1uF
D3
D3
R8
49.9
1%
R8
49.9
1%
C45
47uF
C45
47uF
R12
4.7K
R12
4.7K
C46
0.1u
FC
460.
1uF
C48
0.1u
FC
480.
1uF
U11
KS
8721
BL
U11
KS
8721
BL
MD
IO1
MD
C2
RX
D3/
PH
YA
D1
3R
XD
2/P
HY
AD
24
RX
D1/
PH
YA
D3
5R
XD
0/P
HY
AD
46
VD
DIO
7G
ND
8R
XD
V/P
CS
_LP
BK
9R
XC
10R
XE
R/IS
O11
GN
D12
VDDC 13TXER 14TXC/REFCLK 15TXEN 16TXD0 17TXD1 18TXD2 19TXD3 20COL/RMII 21CRS/RMII_LPBK 22GND 23VDDIO 24IN
T#/P
HY
AD
025
LED
0/TE
ST
26LE
D1/
SP
D10
027
LED
2/D
UP
LEX
28LE
D3/
NW
AY
EN
29P
D#
30V
DD
RX
31R
X-
32R
X+
33FX
SD
/FX
EN
34G
ND
35G
ND
36
REXT37 VDDRCV38 GND39 TX-40 TX+41 VDDTX42 GND43 GND44 XO45 XI46 VDDPLL47 RST#48
RP
6
4x 5
1
RP
6
4x 5
1
1 1223 3445 5667 788
C42
0.1u
FC
420.
1uF
R17
220
R17
220
R15
220
R15
220
C40
0.1u
FC
400.
1uF
C38
0.1u
FC
380.
1uF
C50
10nF
C50
10nF
J2 Hal
o H
FJ11
-245
0E
J2 Hal
o H
FJ11
-245
0E
TX+
1TX
-2
RX
+3
CT_
TX4
CT_
RX
5R
X-
6N
C7
GN
D8
D2
D2
C36
0.1u
FC
360.
1uF
C35
0.1u
FC
350.
1uF
FB2
STE
WA
RD
HI1
206T
500R
-00
FB2
STE
WA
RD
HI1
206T
500R
-00
12
RP
27
4x 1
8K
RP
27
4x 1
8K
1 1223 3445 5667 788
R10
49.9
1%
R10
49.9
1%
C51
10uF
C51
10uF
R18
220
R18
220
C43
0.1u
FC
430.
1uF
C39
1nF
C39
1nF
RP
54x
51
RP
54x
51
11
22
33
44
55
66
77
88
C47
0.1u
FC
470.
1uF
R13
6.49
K 1
%
R13
6.49
K 1
%
D4
D4
R11
49.9
1%
R11
49.9
1%
RP
44x
51
RP
44x
51
11
22
33
44
55
66
77
88
RP
7
4x 5
1
RP
7
4x 5
1
1 1223 3445 5667 788
R16
220
R16
220
D1
D1
R9
49.9
1%
R9
49.9
1%
C41
47uF
C41
47uF
FB1
STE
WA
RD
HI1
206T
500R
-00
FB1
STE
WA
RD
HI1
206T
500R
-00
12
C49
0.1u
F
C49
0.1u
FC
371n
FC
371n
F
R14
10K
R14
10K
M5235EVB User’s Manual, Rev. 2
Freescale Semiconductor 83
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
AN
6
TPU
CH
1
TPU
CH
2
TPU
CH
3
TPU
CH
4
TCR
CLK
AN
7
TPU
CH
29
TPU
CH
13
TPU
CH
7
LTP
UO
DIS
TPU
CH
22
TPU
CH
30
TPU
CH
4
TPU
CH
16
TPU
CH
19
TPU
CH
10
TPU
CH
5
TPU
CH
12
TPU
CH
31
TPU
CH
7
TPU
CH
9
TPU
CH
5
TPU
CH
23
TPU
CH
20
TPU
CH
26
TPU
CH
8
TPU
CH
2
TPU
CH
11
TPU
CH
24
TPU
CH
12
TPU
CH
11
TPU
CH
10
TPU
CH
27
TPU
CH
8
TPU
CH
17
TPU
CH
6
TPU
CH
1
TPU
CH
3
TPU
CH
25
TPU
CH
9
TPU
CH
21
TPU
CH
28
TPU
CH
0
TPU
CH
15
TPU
CH
10
TPU
CH
13
TPU
CH
6
TPU
CH
18
TPU
CH
14
TPU
CH
[15:
0]
TPU
CH
8
TPU
CH
9
TPU
CH
11
TPU
CH
12
TPU
CH
13TP
UC
H4
TPU
CH
3TP
UC
H2
TPU
CH
1
AN
5
AN
0A
N1
TPU
CH
14
TPU
CH
[15:
0]
AN
4A
N3
AN
2
TPU
CH
15
TSIZ
1
/TE
A
TSIZ
0
/TIP
QS
PI_
DIN
QS
PI_
SC
K
QS
PI_
DO
UT
TCR
CLK
UTP
UO
DIS
TPU
CH
[31:
16]
LTP
UO
DIS
TPU
CH
[15:
0]
QS
PI_
PC
S0
VS
SA
+3.3
V
+5V
+3.3
V+5
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
VS
SA
VS
SA
+3.3
V+5
VA
+5V
A
VS
SA
+3.3
V
+3.3
V
+3.3
V
VS
SA
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+5V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+5V
+3.3
V
VS
SA
VS
SA
+3.3
V
+3.3
V
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
eTP
U c
onne
ctor
s an
d A
DC
C
M52
3xE
VB
C
916
Frid
ay, A
ugus
t 10,
200
7
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
eTP
U c
onne
ctor
s an
d A
DC
C
M52
3xE
VB
C
916
Frid
ay, A
ugus
t 10,
200
7
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
eTP
U c
onne
ctor
s an
d A
DC
C
M52
3xE
VB
C
916
Frid
ay, A
ugus
t 10,
200
7
Zero
_cro
ss_B
She
ildin
g
I_se
nse_
DC
B
PW
M_B
T
Zero
_cro
ss_A
PW
M_A
B
BE
MF_
sens
e_C
I_se
nse_
A
UN
I3 c
onne
ctio
n
BE
MF_
sens
e_B
I_se
nse_
BI_
sens
e_C
BE
MF_
sens
e_A
PW
M_C
B
PW
M_A
T
She
ildin
g
She
ildin
g
She
ildin
g
She
ildin
g
Zero
_cro
ss_C
PW
M_C
TS
heild
ing
She
ildin
g
V_s
ense
_DC
B_3
.3
PW
M_B
B
Ove
rcur
rent
com
para
tor
Hal
l sen
sors
/Enc
oder
con
nect
or
But
tons
& s
witc
h
Yel
low
led:
PW
M_A
B, P
WM
_BB
, PW
M_C
BG
reen
led:
PW
M_A
T, P
WM
_BT,
PW
M_C
T, L
ED
_STA
TUS
Red
led:
I_D
CB
_FA
ULT
Ple
ase
ensu
re th
ere
is th
icke
r gau
ge c
oppe
r be
twee
n V
out o
n U
13 a
nd R
EFI
N o
n U
12.
Ple
ase
ensu
re V
SS
A h
as a
pla
ne o
f cop
per u
nder
J4,
U11
& U
12.
Pla
ce C
87 a
ndC
88 a
s cl
ose
as p
ossi
ble
topi
ns 1
& 2
on
J6
Usi
ng G
PIO
(sec
onda
ryfu
nctio
n on
the
/TE
A p
in)
Usi
ng G
PIO
(sec
onda
ryfu
nctio
n on
the
TSIZ
0 pi
n)
Usi
ng G
PIO
(sec
onda
ryfu
nctio
n on
the
TSIZ
1 pi
n)
Usi
ng G
PIO
(sec
onda
ry fu
nctio
non
the
/TIP
pin
)
EX
OR
Log
ic G
ate
Inve
rterIn
verte
r
Pla
ce C
86 a
scl
ose
to U
17 a
spo
ssib
le
Pla
ce C
69 a
scl
ose
to U
16as
pos
sibl
e
AN
D G
ate
Logi
c
Pla
ce C
65as
clo
se to
U14
as
poss
ible
Pla
ce C
89as
clo
se to
U18
as
poss
ible
PW
M_A
T
PW
M_A
B
PW
M_B
T
PW
M_C
B
PW
M_C
T
PW
M_B
B
LED
_STA
TUS
I_D
CB
_FA
ULT
Plac
e th
ese
resi
stor
s at
an
acce
sibl
epo
int t
o al
low
rem
oval
if re
quire
d.
Pla
ce th
ese
zero
ohm
resi
stor
s as
clo
se to
the
junc
tion
with
the
eTP
U s
igna
ls a
s po
ssib
le a
nd a
t an
acce
ssib
lepo
int t
o al
low
rem
oval
if re
quire
d.
Pla
ce C
67 a
scl
ose
to U
15as
pos
sibl
e
Pla
ce th
e ca
paci
tors
& re
sist
ors
imm
edia
tely
bel
ow a
s cl
ose
aspo
ssib
le to
the
Vin
X p
ins
on U
12, a
s th
ey re
pres
ent a
n R
C fi
lter
for t
he A
DC
inpu
ts.
Ple
ase
plac
e H
S/E
NC
0 on
the
silk
scre
en c
lose
to J
6
Ple
ase
plac
e U
NI3
on
the
silk
scre
en c
lose
to J
4
AD
C H
eade
r
eTP
U H
eade
r
HS
/EN
CO
Hea
der
-UP
-DO
WN
Mot
orol
a S
PS
TS
PG
- TE
CD
Col
dFire
Gro
up
QS
PI c
hip
sele
ctju
mpe
r, de
faul
t FIT
TED
defa
ult F
ITTE
D
R44
270
R44
270
C61
2.2n
F
C61
2.2n
F
C68
100n
FC
6810
0nF
C93
470p
FC
9347
0pF
R25
0R
250
U12 AD
7928
BR
U
U12 AD
7928
BR
U
SC
LK1
DIN
2C
S3
AG
ND
4A
VD
D5
AV
DD
6R
EFI
N7
AG
ND
8V
in7
9V
in6
10V
in5
11V
in4
12V
in3
13V
in2
14V
in1
15V
in0
16A
GN
D17
DO
UT
18V
driv
e19
AG
ND
20
C66
10nF
C66
10nF
R57
24R
5724
D12
D12
C65
100n
FC
6510
0nF
D11
D11
C85
0.1u
FC
850.
1uF
R34
120
R34
120
R46
270
R46
270
SW
2
KS
11R
22C
QD
SW
2
KS
11R
22C
QD
13
24
C77
1nF
C77
1nF
C55
0.1u
F
C55
0.1u
F
C71
1nF
C71
1nF
R36
120
R36
120
J5J5
12
34
56
78
910
1112
1314
1516
1718
1920
2122
2324
2526
2728
2930
3132
3334
3536
3738
3940
U18 NL2
7WZ8
6
U18 NL2
7WZ8
6
A1
B1
Y2
GN
D
VC
C Y1
B2
A2
D10
D10
C62
2.2n
F
C62
2.2n
F
R52
1kR52
1k
C17
9
2.2n
F
C17
9
2.2n
F
R59
1kR59
1k
R51
1k8
R51
1k8
C57
0.1u
F
C57
0.1u
F
C69
100n
FC
6910
0nF
C80
0.1u
FC
800.
1uF
J4
Mol
ex/3
9-26
-740
5
J4
Mol
ex/3
9-26
-740
5
12345678910111213141516171819202122232425262728293031323334353637383940
R61
24R
6124
J3J3
1 2 3 4 5 6 7 8 9 10 11 12
C86
100n
FC
8610
0nF
C92
470p
FC
9247
0pF
U13
AD
780B
R
U13
AD
780B
R
NC
1+V
in2
TEM
P3
GN
D4
TRIM
5V
out
6N
C7
2.5/
3.0V
8
R48
270
R48
270
R60
4K7
R60
4K7
R41
10K
R41
10K
13
2
J6J6
1 2 3 4 5 6
R38
22K
R38
22K
U15
LM39
3M
U15
LM39
3M
Out
putA
1In
putA
2In
putA
3G
ND
4In
putB
5In
putB
6O
utpu
tB7
V+
8
C63
2.2n
F
C63
2.2n
F
C72
1nF
C72
1nF
C90
470p
FC
9047
0pF
R40
150
R40
150
C76
1nF
C76
1nF
R33
120
R33
120
R56
1kR56
1k
D6
D6
R35
120
R35
120
R22
0R
220
R39
100
R39
100
C56
10uF
C56
10uF
R24
0R
240
D9
D9
U16
NL2
7WZ0
4
U16
NL2
7WZ0
4
A1
GN
D
A2
Y1
VC
C Y2
C58
2.2n
F
C58
2.2n
F
C64
2.2n
F
C64
2.2n
F
C81
0.1u
FC
810.
1uF
D8
D8
C53
0.1u
F
C53
0.1u
F
R23
0R
230
R64
24R
6424
C91
470p
FC
9147
0pF
SW
1
RU
N/S
TOP
SW
1
RU
N/S
TOP
21 3
C73
1nF
C73
1nF
C83
0.1u
FC
830.
1uF
C79
0.1u
FC
790.
1uF
R43
270
R43
270
C75
1nF
C75
1nF
R63
1kR63
1k
C84
0.1u
FC
840.
1uF
C89
100n
FC
8910
0nF
JP30
JP30
12
C59
2.2n
F
C59
2.2n
F
R62
1K8
R62
1K8
JP29
JP29
12
R30
120
R30
120
R55
4k7
R55
4k7
R27
120
R27
120
R45
270
R45
270
U14
NL1
7SZ0
8
U14
NL1
7SZ0
8
B A GN
D
VC
C Y
R58
1K8
R58
1K8
R42
270
R42
270
R26
120
R26
120
D5
D5
R54
1K8
R54
1K8
R53
24R
5324
U17
SN
74H
C04
D
U17
SN
74H
C04
D
1A1
1Y2
2A3
2Y4
3A5
3Y6
GN
D7
4Y8
4A9
5Y10
5A11
6Y12
6A13
VC
C14
R37
1MR
371M
C88
100n
FC
8810
0nF
R65
1K8
R65
1K8
R19
0R
190
R49
4K7
R49
4K7
C67
100n
FC
6710
0nF
+C
872.
2uF
+C
872.
2uF
C60
2.2n
F
C60
2.2n
F
R31
120
R31
120
C74
1nF
C74
1nF
C70
1nF
C70
1nF
C54
10uF
C54
10uF
R21
0R
210
C78
0.1u
FC
780.
1uF
D7
D7
R32
0R
320
R50
270
R50
270
R47
270
R47
270
C82
0.1u
FC
820.
1uF
R20
0R
200
C52
0.1u
F
C52
0.1u
F
SW
3
KS
11R
22C
QD
SW
3
KS
11R
22C
QD
13
24
M5235EVB User’s Manual, Rev. 2
84 Freescale Semiconductor
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
TPU
CH
7TP
UC
H8
TPU
CH
12TP
UC
H11
D28
D24
D25
D19
D16
TPU
CH
26TP
UC
H29
TPU
CH
28TP
UC
H31
TPU
CH
30
CLK
MO
D1
D31
D26
D27
D13
A9
A7
A20
A19
A3
DD
ATA
3
A0
A5
A16
A22
A17
A14
A4
A8
/CS2
/CS6
TPUCH20TPUCH21
TPUCH1
TPUCH2
TPUCH24
TPUCH5
TPUCH6
TPUCH16
/BS1
TPUCH23
D7D11
PST1 PST2
/IRQ2
D3
DDATA1
D1
/IRQ1
/IRQ6
DDATA2
D8
DDATA0
D4
D0
D5
TPU
CH
[15:
0]
TPU
CH
[15:
0]TP
UC
H[1
5:0]
TPU
CH
10TP
UC
H9
TPU
CH
[31:
16]
TPU
CH
[31:
16]
TPU
CH
25TP
UC
H27
TPU
CH
14TP
UC
H13
TPU
CH
15
CLK
MO
D0
D[3
1:0]
D[3
1:0]
D[3
1:0]
D29
D30
D23
D21
D22
D20
D17
D18
D9
D12
D15
D[3
1:0]
D14 D10D6
D2
/IRQ
[7:1
]
/IRQ
[7:1
]
/IRQ7
/IRQ3 /IRQ4/IRQ5
/IRQ
[7:1
]
PS
T[3:
0]
PS
T[3:
0]
PS
T[3:
0]
PST0
PST3
DD
ATA
[3:0
]D
DA
TA[3
:0]
DD
ATA
[3:0
]
A[2
3:0]
A[2
3:0]
A[2
3:0]
A2
A1
A12
A6
A10
A11
A13
A15
A18
A21
/CS
[7:0
]
/CS4
/CS
[7:0
]
/CS1
/CS3
A23/CS0/CS5/CS7
/CS
[7:0
]
/BS
[3:0
]
/BS0
/BS2/BS3
TPUCH0TPUCH19
TPUCH22TPUCH18TPUCH17
TPUCH3
TPUCH4
TPU
CH
[15:
0]
TPU
CH
[31:
16]
TCR
CLK
/U0C
TSU
0RX
DD
TOU
T0D
TIN
0U
0TX
D/U
0RTS
CLK
MO
D[1
:0]
D[3
1:0]
/OEDTOUT1
DTIN1
/IRQ
[7:1
]
TSIZ0
TCLK/PSTCLKDTOUT2 DTIN2
TDI/DSITDO/DSO TMS/BKPT
TRST/DSCLKP
ST[
3:0]
DD
ATA
[3:0
]
JTAG_EN /RCON/RSTOUT
/RESET
EX
TAL
XTA
L/S
D_C
S1
CLK
OU
T/S
D_C
AS
/SD
_CS
0/S
D_R
AS
R/W
CA
N0T
XC
AN
0RX
/SD
_WE
/TS
/TIP
/TA
/TE
AD
TOU
T3D
TIN
3LT
PU
OD
ISU
TPU
OD
IS
A[2
3:0]
/CS
[7:0
]
TSIZ1
U1TXDU1RXD/U1RTS
U2TXD
/U1CTSU2RXD
CAN1RXSD_SCKE
QSPI_PCS1/U2RTS
/BS
[3:0
]
QSPI_PCS0QSPI_DOUT
QSPI_DINI2C_SDA
QSPI_SCKI2C_SCL
EMDCEMDIO
/EX
T_R
STI
N
CAN1TX
/U2CTS
+3.3
V+1
.5V
+3.3
V+5
V+3
.3V
+1.5
V+3
.3V
+5V
+3.3
V
+1.5
V
+3.3
V
+5V
+3.3
V
+5V
+1.5
V
+3.3
V
+5V
+3.3
V
+1.5
V
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
Exp
ansi
on C
onne
ctor
sC
M52
3xE
VB
C
1016
Frid
ay, A
ugus
t 10,
200
7
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
Exp
ansi
on C
onne
ctor
sC
M52
3xE
VB
C
1016
Frid
ay, A
ugus
t 10,
200
7
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
Exp
ansi
on C
onne
ctor
sC
M52
3xE
VB
C
1016
Frid
ay, A
ugus
t 10,
200
7
NO
TE: i
f des
igni
ng a
dau
ghte
r car
d to
fit t
hese
exp
ansi
on c
onne
ctor
spl
ease
ens
ure
all s
igna
ls a
re b
uffe
red
on th
e da
ught
er c
ard. M
otor
ola
SP
S T
SP
G -
TEC
D C
oldF
ire G
roup
C99
1nF
C99
1nF
C10
210
nFC
102
10nF
C96
470p
FC
9647
0pF
C10
510
nFC
105
10nF
C10
947
0pF
C10
947
0pF
C10
00.
1uF
C10
00.
1uF
C10
310
nFC
103
10nF
J10 AM
P 1
7798
3-2
J10 AM
P 1
7798
3-2
2468
1012141618202224262830323436384042444648505254565860
1357911131517192123252729313335373941434547495153555759
C10
410
nFC
104
10nF
C10
847
0pF
C10
847
0pF
J7 AM
P 1
7798
3-2
J7 AM
P 1
7798
3-2
2468
1012141618202224262830323436384042444648505254565860
1357911131517192123252729313335373941434547495153555759
C94
10nF
C94
10nF
C10
747
0pF
C10
747
0pF
C97
470p
FC
9747
0pF
J9 AM
P 1
7798
3-2
J9 AM
P 1
7798
3-2
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 60
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59
J8 AM
P 1
7798
3-2
J8 AM
P 1
7798
3-2
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 60
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59
C98
1nF
C98
1nF
C95
10nF
C95
10nF
C10
10.
1uF
C10
10.
1uF
C10
647
0pF
C10
647
0pF
M5235EVB User’s Manual, Rev. 2
Freescale Semiconductor 85
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
B_D
[31:
0]
B_A
14B
_A2
B_A
21
B_A
8
B_A
19
B_A
9
B_A
20
B_A
17
B_A
6
B_A
4
B_A
7
B_A
5B
_A11
B_A
10
B_A
18
B_A
16
B_A
12
B_A
15
B_A
3
B_A
13
B_A
[23:
0]B
_A[2
3:0]
B_A
[23:
0]
B_D
31B
_D23
B_D
22B
_D29
B_D
21B
_D28
B_D
16B
_D24
B_D
17B
_D25
B_D
18B
_D26
B_D
19B
_D27
B_D
20
B_D3
B_D4
B_D16
B_D26
B_D27
B_D
[31:
0]
B_D10
B_D18
B_D20
B_D11
B_D13
B_D14
B_D24
B_D25
B_D12
B_D
[31:
0]
B_D2
B_D5
B_D15 B_D0
B_D6
B_D22
B_D28
B_D31
B_D21
B_D1
B_D19
B_D7B_D8
B_D9
B_D30
B_D23
B_D29
B_D17
B_D
[31:
0]
B_D
[31:
0]
B_A
1B
_A2
B_A
3B
_A4
B_A
5B
_A6
B_A
7B
_A8
B_A
18B
_A19
/CS
0
B_A
[23:
0]
B_D
30
B_A
9B
_A10
B_A
11B
_A12
B_A
13B
_A14
B_A
15B
_A16
B_A
17
B_A
20
/OE
R/W
B_A
[23:
0]
B_D
[31:
0]/C
S[7
:0]
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
Fla
sh M
emor
y (F
ujits
u S
SO
P O
R A
MD
BG
A)
C
M52
3xE
VB
C
1116
Frid
ay, A
ugus
t 10,
200
7
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
Fla
sh M
emor
y (F
ujits
u S
SO
P O
R A
MD
BG
A)
C
M52
3xE
VB
C
1116
Frid
ay, A
ugus
t 10,
200
7
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
Fla
sh M
emor
y (F
ujits
u S
SO
P O
R A
MD
BG
A)
C
M52
3xE
VB
C
1116
Frid
ay, A
ugus
t 10,
200
7
NO
TE: T
he w
rite
prot
ect p
in (C
5)sh
ould
not
be
left
float
ing
asin
cons
ista
nt b
ehav
iour
of t
heFl
ash
devi
ce c
ould
resu
lt.To
use
har
dwar
e pr
otec
t on
the
top/
botto
m b
oot s
ecto
r set
JP
32be
twee
n pi
ns 2
& 3
. To
disa
ble
hard
war
e pr
otec
t set
bet
wee
npi
ns 1
& 2
(def
ault)
.
Mot
orol
a S
PS
TS
PG
- TE
CD
Col
dFire
Gro
up
32M
Bit
Flas
hB
oot
Def
ault
setti
ng -
JP31
fitte
dac
ross
pin
s 1
& 2
Onl
y on
e or
the
othe
r foo
tprin
tsw
ill b
e po
pula
ted
- BG
A (U
35)
OR
SS
OP
(U19
)
16 M
Bit
Flas
h B
oot
Def
ault
setti
ng -
JP64
fitte
d ac
ross
pin
s 1
& 2
Mem
ory
Siz
e: 1
M x
16-
bit =
2M
BM
emor
y S
ize:
1M
x 3
2-bi
t = 4
MB
C11
90.
1uF
C11
90.
1uF
C11
70.
1uF
C11
70.
1uF
C11
11n
FC
111
1nF
C11
81n
FC
118
1nF
R68
4.7K
R68
4.7K
R66
4.7K
R66
4.7K
U35
Am
29P
L320
D
U35
Am
29P
L320
D
CE
A8
VS
SB
8N
CA
7W
OR
DB
7O
EC
7W
EA
6N
CB
6N
CC
6N
CA
5A
CC
B5
WP
C5
NC
D5
NC
E5
A1
A4
A2
B4
A3
C4
A0
D4
A4
A3
A5
B3
VC
CB
2
DQ30B9VCCC9
DQ15C8DQ13D9DQ29D8DQ14D7
DQ31/A-1D6DQ12E9DQ28E8
VSSE7NCE6
DQ27F9DQ11F8DQ10F7
NCF6DQ26G9
VSSG8DQ25G7DQ8G6VCCH9
DQ24H8DQ9J9
A19
K8
VC
CJ8
A16
K7
A17
J7A
18H
7A
13K
6A
14J6
A15
H6
NC
K5
NC
J5N
CH
5N
CG
5N
CF5
A10
K4
A9
J4A
11H
4A
12G
4A
7K
3A
6J3
A8
H3
VS
SK
2
DQ17 C1DQ1 C2
VCC D1VSS D2DQ16 D3
DQ0 C3
DQ3 E1DQ19 E2DQ18 E3DQ2 E4DQ20 F1DQ4 F2DQ5 F3NC F4VSS G1DQ6 G2DQ21 G3VCC H1
DQ22 J1DQ23 J2
DQ7 H2
JP31
JP31
1
2
3
C11
21n
FC
112
1nF
C11
60.
1uF
C11
60.
1uF
C12
00.
1uF
C12
00.
1uF
JP32
JP32
1
2
3
C11
31n
FC
113
1nF
JP64
JP64
1
2
3
C11
50.
1uF
C11
50.
1uF
R67
4.7KR67
4.7K
R69
4.7K
R69
4.7K
U19
AM
D A
m29
PL1
60C
B-6
5RS
U19
AM
D A
m29
PL1
60C
B-6
5RS
WE
#1
A18
2A
173
A7
4A
65
A5
6A
47
A3
8A
29
A1
10A
011
CE
#12
Vss
13O
E#
14D
Q0
15D
Q8
16D
Q1
17D
Q9
18D
Q2
19D
Q10
20D
Q3
21D
Q11
22V
cc23
DQ
424
DQ
1225
DQ
526
DQ
1327
DQ
628
DQ
1429
DQ
730
DQ
15/A
-131
Vss
32B
YTE
#33
A16
34A
1535
A14
36A
1337
A12
38A
1139
A10
40A
941
A8
42A
1943
NC
44
C11
40.
1uF
C11
40.
1uF
C11
01n
FC
110
1nF
M5235EVB User’s Manual, Rev. 2
86 Freescale Semiconductor
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
+3.3
VP
+5V+3
.3V
+3.3
V
+3.3
V+1
.5V
+1.5
V+1
.5V
P
+5V
+1.5
V
VS
SP
LL
VS
SA+5
V+5
VA
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
Pow
er S
uppl
yC
M52
3xE
VB
B
1216
Frid
ay, A
ugus
t 10,
200
7
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
Pow
er S
uppl
yC
M52
3xE
VB
B
1216
Frid
ay, A
ugus
t 10,
200
7
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
Pow
er S
uppl
yC
M52
3xE
VB
B
1216
Frid
ay, A
ugus
t 10,
200
7
Aug
at 2
5V-0
2
+
NO
TE: t
he p
ositi
ve te
rmin
al o
f eac
hpo
wer
con
nect
or m
ust b
e sh
own
on th
esi
lksc
reen
of t
he P
CB
-
2-w
ay B
are
Wire
Pow
er C
onne
ctor
JP33
SH
OU
LD B
EIN
STA
LLE
D D
UR
ING
AS
SE
MB
LY
DC
vol
tage
inpu
t ran
ge +
7 to
+14
V
5.0V
Reg
ulat
or
-
3.3V
Reg
ulat
or
+
Pow
er J
ack
Con
nect
or -
2.1m
m d
iam
eter
NO
TE: D
iode
s pr
even
t exc
essi
vedi
ffere
nce
betw
een
3.3V
& 1
.5V
rails
, at p
ower
up
NO
TE: S
chot
tky
Dio
de p
reve
nts
exce
ssiv
edi
ffere
nce
betw
een
3.3V
& 1
.5V
rails
, at p
ower
dow
n
JP34
SH
OU
LD B
EIN
STA
LLE
D D
UR
ING
AS
SE
MB
LY
1.5V
Reg
ulat
or
VS
SA
- an
alog
gro
und
for e
TPU
cha
nnel
s
VS
SP
LL -
filte
red
grou
nd fo
r CP
U P
LL m
odul
e
Filte
red
grou
nd fo
r pla
ne fo
r eth
erne
t RJ4
5 co
nnec
tor
+5V
A -
filte
red
pow
er fo
r eTP
U A
DC
Mot
orol
a S
PS
TS
PG
- TE
CD
Col
dFire
Gro
up
D15
MB
RS
340T
3
D15
MB
RS
340T
3
21
L3
25uH
L3
25uH
U20
LM25
96S
-3.3
U20
LM25
96S
-3.3
VIN
1V
OU
T2
~ON
/OFF
5
GND 3
FB4
TAB 6
C12
3
0.1u
F
C12
3
0.1u
F
D18
MR
A40
03T3
D18
MR
A40
03T3
FB3
FB3
12
FB4
FB4
12
L2 25uH
L2 25uH
C13
0
0.1u
F
C13
0
0.1u
F
D17
+5V
GR
EE
N P
OW
ER
LE
D
D17
+5V
GR
EE
N P
OW
ER
LE
D
C12
133
0uF
C12
133
0uF
SW
4
PO
WE
R S
W S
LID
E-S
PS
T(B
oard
Edg
e)
SW
4
PO
WE
R S
W S
LID
E-S
PS
T(B
oard
Edg
e)
54 6
21 3
F1
5A F
ast b
low
.
F1
5A F
ast b
low
.
C12
510
00uF
C12
510
00uF
C12
20.
1uF
C12
20.
1uF
C12
633
0uF
C12
633
0uF
D16
MB
RS
340T
3D
16M
BR
S34
0T3
21
D14 +3
.3V
GR
EE
N P
OW
ER
LE
D
D14 +3
.3V
GR
EE
N P
OW
ER
LE
D
U22
LT10
86C
MU
22LT
1086
CM
VIN
3
ADJ 1
VO
UT
2
R71 56
0
R71 56
0
FB6
FB6
12
FB5
FB5
12
U21
LM25
96S
-5U
21LM
2596
S-5
VIN
1V
OU
T2
~ON
/OFF
5
GND 3
FB4
TAB 6
D22
MB
RS
340T
3
D22
MB
RS
340T
3
21
C12
4
1nF
C12
4
1nF
P2
Sw
itchc
raft
RA
PC
712
P2
Sw
itchc
raft
RA
PC
712123
JP33
JP33
12
JP34
JP34
12
R70
270
R70
270
R73
120
R73
120
C12
810
uF T
AN
T.C
128
10uF
TA
NT.
P3
P3
1 2
D20
MB
RS
340T
3
D20
MB
RS
340T
3
21
C12
70.
1uF
C12
70.
1uF
D19 M
RA
4003
T3
D19 M
RA
4003
T3
D13
MB
RS
340T
3D
13M
BR
S34
0T3
21
C12
933
0uF
C12
933
0uF
R74
22R
7422
M5235EVB User’s Manual, Rev. 2
Freescale Semiconductor 87
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
/IRQ
7/IR
Q[7
:1]
D16
D20
D[3
1:0]
D19
D25
D24
D21
CLK
MO
D[1
:0]
CLK
MO
D1
CLK
MO
D0
/IRQ
2
/CS
6/C
S5
/IRQ
7/C
S7
/IRQ
6
/IRQ
[7:1
]
/CS
4/IR
Q5
/CS
3/IR
Q3
/IRQ
1
/CS
2
/IRQ
4
/CS
0
/CS
[7:0
]
/CS
0/C
S1
/BS
[3:0
]
/BS
0/B
S1
/BS
2/B
S3
/RE
SE
T/B
DM
_RS
TIN
/EX
T_R
STI
N
ETH
_CLK
XTA
L
/IRQ
[7:1
]
JTA
G_E
N
/RS
TOU
T
D[3
1:0]
/RC
ON
CLK
MO
D[1
:0]
/RS
TOU
T
/CS
[7:0
]
R/W
/BS
[3:0
]
TDI/D
SI
/OE
TDO
/DS
O
/IRQ
[7:1
]
/TA
TRS
T/D
SC
LK
TSIZ
0
TMS
/BK
PT
TSIZ
1
CLK
OU
T
/TS
/TA
/CS
[7:0
]
R/W
/OE
/TE
A
/TIP
/TS
EX
TAL
UTP
UO
DIS
LTP
UO
DIS
DTO
UT2
DTO
UT3
DTO
UT1
DTO
UT0
DTI
N2
DTI
N1
DTI
N0
DTI
N3
ETP
U/E
TH
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V+3
.3V
VS
SP
LL
VS
SP
LL
VS
SP
LL
+3.3
V
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
Res
et C
onfig
urat
ion
& C
lock
sel
ectio
nC
M52
3xE
VB
C
1316
Tues
day,
Aug
ust 1
4, 2
007
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
Res
et C
onfig
urat
ion
& C
lock
sel
ectio
nC
M52
3xE
VB
C
1316
Tues
day,
Aug
ust 1
4, 2
007
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
Res
et C
onfig
urat
ion
& C
lock
sel
ectio
nC
M52
3xE
VB
C
1316
Tues
day,
Aug
ust 1
4, 2
007
AB
OR
T/-IN
T7
DE
BO
UN
CE
D /I
RQ
7S
IGN
AL
HA
RD
RE
SE
T &
VO
LTA
GE
SE
NS
E C
ON
TRO
LLE
R
Buf
fere
d an
d "O
R'd
" /R
STI
sig
nal t
o th
e C
PU
from
the
BD
M p
ort,
expa
nsio
n co
nnec
tors
or r
eset
sw
itch.
NO
TE: s
igna
l tra
ck le
ngth
s be
twee
n th
ese
cloc
kci
rcui
ts a
nd th
e M
CF5
23x
shou
ld b
e m
inim
ised
.
OS
CIL
LATO
R -
dual
layo
ut fo
otpr
int
for 8
AN
D 1
4 pi
n so
cket
ed D
IL o
sc.'s
D24
D21
D20
D19
D16
CLK
MO
D0
CLK
MO
D1
JTA
G_E
NR
CO
N
IMP
OR
TAN
T N
OTE
: TH
E /R
STO
UT
SIG
NA
L M
US
T B
E U
SE
D T
O D
RIV
E T
HE
OU
TPU
T E
NA
BLE
PIN
S O
F U
7 T
O A
LLO
W T
HE
D16
, D17
, D18
, D19
, D21
, D24
, D25
& D
26 S
IGN
ALS
TO
BE
LA
TCH
ED
CO
RR
EC
TLY
BY
THE
MC
F523
x FO
R C
ON
FIG
UR
ATI
ON
AT
RE
SE
T.
Clo
sed/
On
Ope
n/O
ff
D25
Enc
oded
Add
ress
/Chi
p S
elec
t Mod
eS
W7-
9
S
W7-
10
Mod
e--
----
----
-
----
----
---
----
----
----
----
----
----
-- O
FF
OFF
PF[
7:5]
= /C
S[6
:4]
OFF
O
N
P
F7 =
/CS
6, P
F[6:
5] =
A[2
2:21
] O
N
OFF
PF[
7:6]
= /C
S[6
:5],
PF[
5] =
A21
ON
O
N
P
F[7:
5] =
A[2
3:21
]
NO
TE: P
leas
e pl
ace
thes
e ta
bles
on
the
silk
scre
en o
n th
e to
psid
e of
the
PC
B c
lose
to S
W7.
Enc
oded
Boo
t Dev
ice
(Por
t Siz
e)S
W7-
6
S
W7-
7
Mod
e--
----
----
-
----
----
---
----
----
----
----
----
----
-- O
FF
OFF
Ext
erna
l (32
-bit)
OFF
O
N
E
xter
nal (
8-bi
t) O
N
OFF
Ext
erna
l (16
-bit)
ON
ON
Ext
erna
l (32
-bit)
Enc
oded
Ope
ratin
g M
ode
SW
7-5
Mod
e--
----
----
-
----
----
---
OFF
R
eser
ved
ON
M
aste
r
Enc
oded
Clo
ck M
ode
SW
7-3
S
W7-
4
Mod
e--
----
----
- -
----
----
--
---
----
----
----
----
----
----
----
----
----
----
----
---
OFF
O
FF
Ext
erna
l Clo
ck -
(No
PLL
) O
FF
ON
1
:1 P
LL O
N
OFF
N
orm
al P
LL o
pera
tion
(Ext
. Clo
ck)
ON
O
N
Nor
mal
PLL
ope
ratio
n (E
xt. C
ryst
al)
----
----
----
----
----
----
O
FF -
SW
7 - O
N
----
----
----
----
----
----
Chi
p C
onfig
. Off
1
Chi
p C
onfig
. On
JTA
G In
terfa
ce E
nabl
ed
2
BD
M In
terfa
ce E
nabl
edE
ncod
ed C
lock
Mod
e
3
E
ncod
ed C
lock
Mod
eE
ncod
ed C
lock
Mod
e
4
E
ncod
ed C
lock
Mod
eE
ncod
ed O
per.
Mod
e
5
E
ncod
ed O
per.
Mod
eE
ncod
ed B
oot D
evic
e
6
E
ncod
ed B
oot D
evic
eE
ncod
ed B
oot D
evic
e
7
E
ncod
ed B
oot D
evic
eP
artia
l Bus
Driv
e
8
Fu
ll B
us D
rive
Enc
oded
Add
ress
Mod
e
9
Enc
oded
Add
ress
Mod
eE
ncod
ed A
ddre
ss M
ode
1
0
Enc
oded
Add
ress
Mod
eeT
PU
Ena
bled
11
Eth
erne
t Ena
bled
Not
e: d
efau
lt se
tting
for S
W7
is a
ll sw
itche
s cl
osed
/on.
Impo
rtant
Not
e - a
ll un
conn
ecte
d pu
ll-up
and
pul
l-dow
nre
sist
or p
ack
conn
ectio
ns, o
n al
l sch
emat
ics
page
s, n
eed
to b
e co
nnec
ted
to a
n un
mas
ked
via.
NO
TE: P
lace
TP
9, T
P10
, TP
11 &
TP
12 a
t the
cor
ners
of t
he P
CB
to a
llow
eas
y co
nnec
tion
of 's
cope
pro
be g
roun
d le
ads.
NO
TE: P
leas
e pl
ace
D25
thro
ugh
D32
toge
ther
in a
line
.
DTI
N0
LED
DTI
N1
LED
DTI
N2
LED
DTI
N3
LED
DTO
UT0
LE
D
DTO
UT1
LE
D
DTO
UT2
LE
D
DTO
UT3
LE
D
Cry
stal
Ena
ble
Def
ault
setti
ng fo
r JP3
8 th
roug
h JP
45 is
fitte
d.
Ext
erna
l Clo
ck In
put (
SM
A c
onne
ctor
)
Pla
ce T
P6
ascl
ose
to E
XTA
Las
pos
sibl
e
Eth
erne
t/eTP
U M
ode
(eTP
U c
hann
els
16 to
31)
SW
7-11
Mod
e--
----
----
-
----
----
---
OFF
eT
PU
ena
bled
ON
E
ther
net e
nabl
ed
Mot
orol
a S
PS
TS
PG
- TE
CD
Col
dFire
Gro
up
TP5
CH
IP S
ELE
CT
0
TP5
CH
IP S
ELE
CT
01
SW
6
KS
11R
23C
QD
RE
SE
T
SW
6
KS
11R
23C
QD
RE
SE
T
RP
15
4x 4
.7K
RP
15
4x 4
.7K
11
22
33
44
55
66
77
88
RP
17
4x 4
.7K
RP
17
4x 4
.7K
11
22
33
44
55
66
77
88
RP
18
4x 1
0
RP
18
4x 1
0
1 1223 3445 5667 788
TP9
GR
OU
ND
TP9
GR
OU
ND
1
SW
7
Con
figur
atio
n D
IP s
witc
h - G
rayh
ill 7
8RB
12
SW
7
Con
figur
atio
n D
IP s
witc
h - G
rayh
ill 7
8RB
12
JP38
JP38
12
R77
100
R77
100
C13
110
pFC
131
10pF
D30
D30
R80
1KR80
1K
TP4
RE
AD
NO
T W
RIT
E
TP4
RE
AD
NO
T W
RIT
E1
JP37
JP37
12
RP
13
4x 1
0K
RP
13
4x 1
0K
1 1223 3445 5667 788
SW
5
KS
11R
22C
QD
SW
5
KS
11R
22C
QD
U25
AD
M70
8SA
R
U25
AD
M70
8SA
R
MR
1V
CC
2G
ND
3P
FI4
PFO
5N
.C.
6R
ES
ET
7R
ES
ET
8
TP7
TRA
NS
FER
AC
KN
OW
LED
GE
TP7
TRA
NS
FER
AC
KN
OW
LED
GE
1
RP
10
4x 4
.7K
RP
10
4x 4
.7K
11
22
33
44
55
66
77
88
D28
D28
U26 SN
74LV
C1G
11
U26 SN
74LV
C1G
11
A GN
DB
CV
CC Y
R76
10K
R76
10K
JP42
JP42
12
TP3
OU
TPU
T E
NA
BLE
TP3
OU
TPU
T E
NA
BLE
1
D31
D31
D24
RE
D R
ES
ET
LE
DD
24R
ED
RE
SE
T L
ED
JP35
JP35
1
2
3
U24
AD
M70
8SA
R
U24
AD
M70
8SA
R
MR
1V
CC
2G
ND
3P
FI4
PFO
5N
.C.
6R
ES
ET
7R
ES
ET
8
RP
14
4x 4
.7K
RP
14
4x 4
.7K
11
22
33
44
55
66
77
88
D23
RE
D -I
NT7
LE
DD
23R
ED
-IN
T7 L
ED
JP39
JP39
12
TP6
CP
U C
LOC
K I/
P
TP6
CP
U C
LOC
K I/
P1
J11
J11
1
2345
RP
21
4x 4
.7K
RP
21
4x 4
.7K
11
22
33
44
55
66
77
88
R79
100
R79
100
D26
D26
RP
11
4x 4
.7K
RP
11
4x 4
.7K
11
22
33
44
55
66
77
88
R78
270
R78
270
D29
D29
JP41
JP41
12
RP
20
4x 4
.7K
RP
20
4x 4
.7K
11
22
33
44
55
66
77
88
RP
12
4x 4
.7K
RP
12
4x 4
.7K
11
22
33
44
55
66
77
88
R75
270
R75
270
RP
19
4x 1
0
RP
19
4x 1
0
1 1223 3445 5667 788
Y1 25
MH
z
Y1 25
MH
z
JP43
JP43
12
TP8
CP
U C
LOC
K O
/P
TP8
CP
U C
LOC
K O
/P1
RP
16
4x 4
.7K
RP
16
4x 4
.7K
11
22
33
44
55
66
77
88
D25
D25
TP12
GR
OU
ND
TP12
GR
OU
ND
1
RP
22
4x 4
.7K
RP
22
4x 4
.7K
11
22
33
44
55
66
77
88
D27
D27
JP44
JP44
12
JP45
JP45
12
RP
8
4x 4
.7K
RP
8
4x 4
.7K
11
22
33
44
55
66
77
88
TP11
GR
OU
ND
TP11
GR
OU
ND
1
U23
25M
Hz
U23
25M
Hz
OE
1
GN
D7
CLK
8
VD
D14
OE
4V
DD
11
JP40
JP40
12
C13
210
pFC
132
10pF
R72
22R72
22
U27
MC
74LC
X54
1DT
U27
MC
74LC
X54
1DT
OE
11
D0
2D
13
D2
4D
35
D4
6D
57
D6
8D
79
GN
D10
O7
11O
612
O5
13O
414
O3
15O
216
O1
17O
018
OE
219
VC
C20
TP10
GR
OU
ND
TP10
GR
OU
ND
1
D32
D32
RP
9
4x 4
.7K
RP
9
4x 4
.7K
11
22
33
44
55
66
77
88
TP2
TRA
NS
FER
STA
RT
TP2
TRA
NS
FER
STA
RT
1
JP36
JP36
1
2
3
M5235EVB User’s Manual, Rev. 2
88 Freescale Semiconductor
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
/IRQ
7/IR
Q[7
:1]
D16
D20
D[3
1:0]
D19
D25
D24
D21
CLK
MO
D[1
:0]
CLK
MO
D1
CLK
MO
D0
/IRQ
2
/CS
6/C
S5
/IRQ
7/C
S7
/IRQ
6
/IRQ
[7:1
]
/CS
4/IR
Q5
/CS
3/IR
Q3
/IRQ
1
/CS
2
/IRQ
4
/CS
0
/CS
[7:0
]
/CS
0/C
S1
/BS
[3:0
]
/BS
0/B
S1
/BS
2/B
S3
/RE
SE
T/B
DM
_RS
TIN
/EX
T_R
STI
N
ETH
_CLK
XTA
L
/IRQ
[7:1
]
JTA
G_E
N
/RS
TOU
T
D[3
1:0]
/RC
ON
CLK
MO
D[1
:0]
/RS
TOU
T
/CS
[7:0
]
R/W
/BS
[3:0
]
TDI/D
SI
/OE
TDO
/DS
O
/IRQ
[7:1
]
/TA
TRS
T/D
SC
LK
TSIZ
0
TMS
/BK
PT
TSIZ
1
CLK
OU
T
/TS
/TA
/CS
[7:0
]
R/W
/OE
/TE
A
/TIP
/TS
EX
TAL
UTP
UO
DIS
LTP
UO
DIS
DTO
UT2
DTO
UT3
DTO
UT1
DTO
UT0
DTI
N2
DTI
N1
DTI
N0
DTI
N3
ETP
U/E
TH
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V+3
.3V
VS
SP
LL
VS
SP
LL
VS
SP
LL
+3.3
V
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
Res
et C
onfig
urat
ion
& C
lock
sel
ectio
nC
M52
3xE
VB
C
1316
Tues
day,
Aug
ust 1
4, 2
007
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
Res
et C
onfig
urat
ion
& C
lock
sel
ectio
nC
M52
3xE
VB
C
1316
Tues
day,
Aug
ust 1
4, 2
007
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
Res
et C
onfig
urat
ion
& C
lock
sel
ectio
nC
M52
3xE
VB
C
1316
Tues
day,
Aug
ust 1
4, 2
007
AB
OR
T/-IN
T7
DE
BO
UN
CE
D /I
RQ
7S
IGN
AL
HA
RD
RE
SE
T &
VO
LTA
GE
SE
NS
E C
ON
TRO
LLE
R
Buf
fere
d an
d "O
R'd
" /R
STI
sig
nal t
o th
e C
PU
from
the
BD
M p
ort,
expa
nsio
n co
nnec
tors
or r
eset
sw
itch.
NO
TE: s
igna
l tra
ck le
ngth
s be
twee
n th
ese
cloc
kci
rcui
ts a
nd th
e M
CF5
23x
shou
ld b
e m
inim
ised
.
OS
CIL
LATO
R -
dual
layo
ut fo
otpr
int
for 8
AN
D 1
4 pi
n so
cket
ed D
IL o
sc.'s
D24
D21
D20
D19
D16
CLK
MO
D0
CLK
MO
D1
JTA
G_E
NR
CO
N
IMP
OR
TAN
T N
OTE
: TH
E /R
STO
UT
SIG
NA
L M
US
T B
E U
SE
D T
O D
RIV
E T
HE
OU
TPU
T E
NA
BLE
PIN
S O
F U
7 T
O A
LLO
W T
HE
D16
, D17
, D18
, D19
, D21
, D24
, D25
& D
26 S
IGN
ALS
TO
BE
LA
TCH
ED
CO
RR
EC
TLY
BY
THE
MC
F523
x FO
R C
ON
FIG
UR
ATI
ON
AT
RE
SE
T.
Clo
sed/
On
Ope
n/O
ff
D25
Enc
oded
Add
ress
/Chi
p S
elec
t Mod
eS
W7-
9
S
W7-
10
Mod
e--
----
----
-
----
----
---
----
----
----
----
----
----
-- O
FF
OFF
PF[
7:5]
= /C
S[6
:4]
OFF
O
N
P
F7 =
/CS
6, P
F[6:
5] =
A[2
2:21
] O
N
OFF
PF[
7:6]
= /C
S[6
:5],
PF[
5] =
A21
ON
O
N
P
F[7:
5] =
A[2
3:21
]
NO
TE: P
leas
e pl
ace
thes
e ta
bles
on
the
silk
scre
en o
n th
e to
psid
e of
the
PC
B c
lose
to S
W7.
Enc
oded
Boo
t Dev
ice
(Por
t Siz
e)S
W7-
6
S
W7-
7
Mod
e--
----
----
-
----
----
---
----
----
----
----
----
----
-- O
FF
OFF
Ext
erna
l (32
-bit)
OFF
O
N
E
xter
nal (
8-bi
t) O
N
OFF
Ext
erna
l (16
-bit)
ON
ON
Ext
erna
l (32
-bit)
Enc
oded
Ope
ratin
g M
ode
SW
7-5
Mod
e--
----
----
-
----
----
---
OFF
R
eser
ved
ON
M
aste
r
Enc
oded
Clo
ck M
ode
SW
7-3
S
W7-
4
Mod
e--
----
----
- -
----
----
--
---
----
----
----
----
----
----
----
----
----
----
----
---
OFF
O
FF
Ext
erna
l Clo
ck -
(No
PLL
) O
FF
ON
1
:1 P
LL O
N
OFF
N
orm
al P
LL o
pera
tion
(Ext
. Clo
ck)
ON
O
N
Nor
mal
PLL
ope
ratio
n (E
xt. C
ryst
al)
----
----
----
----
----
----
O
FF -
SW
7 - O
N
----
----
----
----
----
----
Chi
p C
onfig
. Off
1
Chi
p C
onfig
. On
JTA
G In
terfa
ce E
nabl
ed
2
BD
M In
terfa
ce E
nabl
edE
ncod
ed C
lock
Mod
e
3
E
ncod
ed C
lock
Mod
eE
ncod
ed C
lock
Mod
e
4
E
ncod
ed C
lock
Mod
eE
ncod
ed O
per.
Mod
e
5
E
ncod
ed O
per.
Mod
eE
ncod
ed B
oot D
evic
e
6
E
ncod
ed B
oot D
evic
eE
ncod
ed B
oot D
evic
e
7
E
ncod
ed B
oot D
evic
eP
artia
l Bus
Driv
e
8
Fu
ll B
us D
rive
Enc
oded
Add
ress
Mod
e
9
Enc
oded
Add
ress
Mod
eE
ncod
ed A
ddre
ss M
ode
1
0
Enc
oded
Add
ress
Mod
eeT
PU
Ena
bled
11
Eth
erne
t Ena
bled
Not
e: d
efau
lt se
tting
for S
W7
is a
ll sw
itche
s cl
osed
/on.
Impo
rtant
Not
e - a
ll un
conn
ecte
d pu
ll-up
and
pul
l-dow
nre
sist
or p
ack
conn
ectio
ns, o
n al
l sch
emat
ics
page
s, n
eed
to b
e co
nnec
ted
to a
n un
mas
ked
via.
NO
TE: P
lace
TP
9, T
P10
, TP
11 &
TP
12 a
t the
cor
ners
of t
he P
CB
to a
llow
eas
y co
nnec
tion
of 's
cope
pro
be g
roun
d le
ads.
NO
TE: P
leas
e pl
ace
D25
thro
ugh
D32
toge
ther
in a
line
.
DTI
N0
LED
DTI
N1
LED
DTI
N2
LED
DTI
N3
LED
DTO
UT0
LE
D
DTO
UT1
LE
D
DTO
UT2
LE
D
DTO
UT3
LE
D
Cry
stal
Ena
ble
Def
ault
setti
ng fo
r JP3
8 th
roug
h JP
45 is
fitte
d.
Ext
erna
l Clo
ck In
put (
SM
A c
onne
ctor
)
Pla
ce T
P6
ascl
ose
to E
XTA
Las
pos
sibl
e
Eth
erne
t/eTP
U M
ode
(eTP
U c
hann
els
16 to
31)
SW
7-11
Mod
e--
----
----
-
----
----
---
OFF
eT
PU
ena
bled
ON
E
ther
net e
nabl
ed
Mot
orol
a S
PS
TS
PG
- TE
CD
Col
dFire
Gro
up
TP5
CH
IP S
ELE
CT
0
TP5
CH
IP S
ELE
CT
01
SW
6
KS
11R
23C
QD
RE
SE
T
SW
6
KS
11R
23C
QD
RE
SE
T
RP
15
4x 4
.7K
RP
15
4x 4
.7K
11
22
33
44
55
66
77
88
RP
17
4x 4
.7K
RP
17
4x 4
.7K
11
22
33
44
55
66
77
88
RP
18
4x 1
0
RP
18
4x 1
0
1 1223 3445 5667 788
TP9
GR
OU
ND
TP9
GR
OU
ND
1
SW
7
Con
figur
atio
n D
IP s
witc
h - G
rayh
ill 7
8RB
12
SW
7
Con
figur
atio
n D
IP s
witc
h - G
rayh
ill 7
8RB
12
JP38
JP38
12
R77
100
R77
100
C13
110
pFC
131
10pF
D30
D30
R80
1KR80
1K
TP4
RE
AD
NO
T W
RIT
E
TP4
RE
AD
NO
T W
RIT
E1
JP37
JP37
12
RP
13
4x 1
0K
RP
13
4x 1
0K
1 1223 3445 5667 788
SW
5
KS
11R
22C
QD
SW
5
KS
11R
22C
QD
U25
AD
M70
8SA
R
U25
AD
M70
8SA
R
MR
1V
CC
2G
ND
3P
FI4
PFO
5N
.C.
6R
ES
ET
7R
ES
ET
8
TP7
TRA
NS
FER
AC
KN
OW
LED
GE
TP7
TRA
NS
FER
AC
KN
OW
LED
GE
1
RP
10
4x 4
.7K
RP
10
4x 4
.7K
11
22
33
44
55
66
77
88
D28
D28
U26 SN
74LV
C1G
11
U26 SN
74LV
C1G
11
A GN
DB
CV
CC Y
R76
10K
R76
10K
JP42
JP42
12
TP3
OU
TPU
T E
NA
BLE
TP3
OU
TPU
T E
NA
BLE
1
D31
D31
D24
RE
D R
ES
ET
LE
DD
24R
ED
RE
SE
T L
ED
JP35
JP35
1
2
3
U24
AD
M70
8SA
R
U24
AD
M70
8SA
R
MR
1V
CC
2G
ND
3P
FI4
PFO
5N
.C.
6R
ES
ET
7R
ES
ET
8
RP
14
4x 4
.7K
RP
14
4x 4
.7K
11
22
33
44
55
66
77
88
D23
RE
D -I
NT7
LE
DD
23R
ED
-IN
T7 L
ED
JP39
JP39
12
TP6
CP
U C
LOC
K I/
P
TP6
CP
U C
LOC
K I/
P1
J11
J11
1
2345
RP
21
4x 4
.7K
RP
21
4x 4
.7K
11
22
33
44
55
66
77
88
R79
100
R79
100
D26
D26
RP
11
4x 4
.7K
RP
11
4x 4
.7K
11
22
33
44
55
66
77
88
R78
270
R78
270
D29
D29
JP41
JP41
12
RP
20
4x 4
.7K
RP
20
4x 4
.7K
11
22
33
44
55
66
77
88
RP
12
4x 4
.7K
RP
12
4x 4
.7K
11
22
33
44
55
66
77
88
R75
270
R75
270
RP
19
4x 1
0
RP
19
4x 1
0
1 1223 3445 5667 788
Y1 25
MH
z
Y1 25
MH
z
JP43
JP43
12
TP8
CP
U C
LOC
K O
/P
TP8
CP
U C
LOC
K O
/P1
RP
16
4x 4
.7K
RP
16
4x 4
.7K
11
22
33
44
55
66
77
88
D25
D25
TP12
GR
OU
ND
TP12
GR
OU
ND
1
RP
22
4x 4
.7K
RP
22
4x 4
.7K
11
22
33
44
55
66
77
88
D27
D27
JP44
JP44
12
JP45
JP45
12
RP
8
4x 4
.7K
RP
8
4x 4
.7K
11
22
33
44
55
66
77
88
TP11
GR
OU
ND
TP11
GR
OU
ND
1
U23
25M
Hz
U23
25M
Hz
OE
1
GN
D7
CLK
8
VD
D14
OE
4V
DD
11
JP40
JP40
12
C13
210
pFC
132
10pF
R72
22R72
22
U27
MC
74LC
X54
1DT
U27
MC
74LC
X54
1DT
OE
11
D0
2D
13
D2
4D
35
D4
6D
57
D6
8D
79
GN
D10
O7
11O
612
O5
13O
414
O3
15O
216
O1
17O
018
OE
219
VC
C20
TP10
GR
OU
ND
TP10
GR
OU
ND
1
D32
D32
RP
9
4x 4
.7K
RP
9
4x 4
.7K
11
22
33
44
55
66
77
88
TP2
TRA
NS
FER
STA
RT
TP2
TRA
NS
FER
STA
RT
1
JP36
JP36
1
2
3
M5235EVB User’s Manual, Rev. 2
Freescale Semiconductor 89
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
A13
D5 A
23
D27
D2
D13
D20
D[3
1:0]
A20
D4
A11
/BS
[3:0
]
A17
D23
A[2
3:0]
D24
D3 A
12A
11
A12
D6
D25
A21
A17
A9
/BS
3 /BS
1
D17
D28
D9
D11
D8
D19
A13
D21
D26
/BS
2
A14
D16
A22
/BS
0
D7
A10
D0A
20
D15
A19
D10
D31
A19
D14
A22
A10
D30
D12
A[2
3:0]
A15
A23
D29
D18 D
1
A18
D[3
1:0]
A9
A21
A14
A15
A18
D22
/BS
[3:0
]
/SD
_CS
0
/SD
_WE
SD
_SC
KE
D[3
1:0]
/SD
_RA
SC
LKO
UT
/SD
_CA
S
A[2
3:0]
A[2
3:0]
+3.3
V
+3.3
V
+3.3
V+3
.3V
+3.3
V
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
SD
RA
MC
M52
3xE
VB
B
1416
Frid
ay, A
ugus
t 10,
200
7
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
SD
RA
MC
M52
3xE
VB
B
1416
Frid
ay, A
ugus
t 10,
200
7
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
SD
RA
MC
M52
3xE
VB
B
1416
Frid
ay, A
ugus
t 10,
200
7
SDR
AM U
pper
16-
bit W
ord.
SD
RA
M L
ower
16-
bit W
ord.
NO
TE: M
emor
y si
ze: E
ach
SD
RA
Mm
emor
y is
con
figur
ed 4
M x
16b
it(8
MB
). To
tal a
vaila
ble
SD
RA
M is
16M
B.
NO
TE: A
ltern
ativ
e S
DR
AM
's w
ith th
e sa
me
PC
B fo
otpr
int a
re:
Sam
sung
K4S
6416
32E
Hyu
ndai
HY
57V
6416
20H
GTo
shib
a TC
59S
6416
CFT
Infin
eon
HY
B39
S64
160E
TW
inbo
nd W
9864
16D
H
Mot
orol
a S
PS
TS
PG
- TE
CD
Col
dFire
Gro
up
C14
00.
1uF
C14
00.
1uF
C13
41n
FC
134
1nF
U29
MT4
8LC
4M16
A2T
G (T
SO
P II
400
mil)
U29
MT4
8LC
4M16
A2T
G (T
SO
P II
400
mil)
VD
D1
DQ
02
VD
DQ
3D
Q1
4D
Q2
5V
SS
Q6
DQ
37
DQ
48
VD
DQ
9D
Q5
10D
Q6
11V
SS
Q12
DQ
713
VD
D14
DQ
ML
15W
E#
16C
AS
#17
RA
S#
18C
S#
19B
A0
20B
A1
21A
1022
A0
23A
124
A2
25A
326
VD
D27
VS
S28
A4
29A
530
A6
31A
732
A8
33A
934
A11
35N
C36
CK
E37
CLK
38D
QM
H39
NC
40V
SS
41D
Q8
42V
DD
Q43
DQ
944
DQ
1045
VS
SQ
46D
Q11
47D
Q12
48V
DD
Q49
DQ
1350
DQ
1451
VS
SQ
52D
Q15
53V
SS
54
U28
MT4
8LC
4M16
A2T
G (T
SO
P II
400
mil)
U28
MT4
8LC
4M16
A2T
G (T
SO
P II
400
mil)
VD
D1
DQ
02
VD
DQ
3D
Q1
4D
Q2
5V
SS
Q6
DQ
37
DQ
48
VD
DQ
9D
Q5
10D
Q6
11V
SS
Q12
DQ
713
VD
D14
DQ
ML
15W
E#
16C
AS
#17
RA
S#
18C
S#
19B
A0
20B
A1
21A
1022
A0
23A
124
A2
25A
326
VD
D27
VS
S28
A4
29A
530
A6
31A
732
A8
33A
934
A11
35N
C36
CK
E37
CLK
38D
QM
H39
NC
40V
SS
41D
Q8
42V
DD
Q43
DQ
944
DQ
1045
VS
SQ
46D
Q11
47D
Q12
48V
DD
Q49
DQ
1350
DQ
1451
VS
SQ
52D
Q15
53V
SS
54C
135
1nF
C13
51n
FC
139
0.1u
FC
139
0.1u
FC
136
1nF
C13
61n
FC
138
0.1u
FC
138
0.1u
FC
137
0.1u
FC
137
0.1u
FC
133
1nF
C13
31n
F
M5235EVB User’s Manual, Rev. 2
90 Freescale Semiconductor
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
/IRQ
[7:1
]/IR
Q1
QS
PI_
PC
S1
QS
PI_
PC
S0
U0R
XD
/U1R
TS
/U0C
TS
/U1C
TS
/U0R
TS
U2R
XD
U1R
XD
QS
PI_
DIN
QS
PI_
DO
UT
QS
PI_
SC
K
QS
PI_
PC
S0
I2C
_SC
L
I2C
_SD
A
CA
NH
1C
AN
L1
QS
PI_
PC
S1
U0T
XD
U1T
XD
U2T
XD
/U2C
TS
/U2R
TS
/IRQ
[7:1
]
/RS
TOU
T
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+5V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V+3
.3V
+3.3
V
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
Ser
ial I
/OC
M52
3xE
VB
C
1516
Frid
ay, A
ugus
t 10,
200
7
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
Ser
ial I
/OC
M52
3xE
VB
C
1516
Frid
ay, A
ugus
t 10,
200
7
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
Ser
ial I
/OC
M52
3xE
VB
C
1516
Frid
ay, A
ugus
t 10,
200
7
TER
MIN
AL
PO
RT
9-W
AY
D-T
YP
E(F
emal
e)
RS2
32 T
rans
ceiv
er.
Def
ault
setti
ng fo
r JP
46 to
JP
49 is
fitte
d.
RS2
32 T
rans
ceiv
er.
AU
XIL
IAR
Y P
OR
T 1
9-W
AY
D-T
YP
E(F
emal
e)
RS2
32 T
rans
ceiv
er.
AU
XIL
IAR
Y P
OR
T 2
9-W
AY
D-T
YP
E(F
emal
e)
NO
TE: t
he I2
C b
us o
n th
e M
CF5
23x
proc
esso
r is
3.3V
tole
rant
onl
y. If
con
nect
ion
to a
5V
sys
tem
is re
quire
d hi
gh fr
eque
ncy
volta
ge le
vel s
hifte
rs w
ill b
e re
quire
d be
twee
nth
e pe
riphe
ral a
nd p
roce
ssor
.
Def
ault
setti
ng fo
r JP
53 &
JP
54 is
NO
T fit
ted.
Def
ault
setti
ng fo
r JP
50 to
JP
52 is
fitte
d be
twee
n pi
ns 1
& 2
.
NO
TE: L
abel
as
"UA
RT0
"an
d "T
erm
inal
"
NO
TE: L
abel
as
"UA
RT1
"an
d "A
uxili
ary"
NO
TE: L
abel
as
"UA
RT2
"an
d "C
AN
1"
I2C
0.1
" pitc
h th
ru' b
oard
con
nect
or
QS
PI 0
.1" p
itch
thru
' boa
rd c
onne
ctor
Mot
orol
a S
PS
TS
PG
- TE
CD
Col
dFire
Gro
up
U32
MA
X32
25C
AP
or I
CL3
225C
A
U32
MA
X32
25C
AP
or I
CL3
225C
A
RE
AD
Y1
C1+
2V
+3
C1-
4C
2+5
C2-
6V
-7
T2O
UT
8R
2IN
9R
2OU
T10
INV
ALI
D11
T2IN
12T1
IN13
FOR
CE
ON
14
GN
D18
R1O
UT
15R
1IN
16T1
OU
T17
VC
C19
FOR
CE
OFF
20
C14
60.
1uF
C14
60.
1uF
JP48
JP48
12
C15
51n
FC
155
1nF
JP49
JP49
12
JP53
JP53
12
C14
40.
1uF
C14
40.
1uF
J13
J13 1 2 3 4
C14
10.
1uF
C14
10.
1uF
JP54
JP54
12
JP51
JP51
12
3
C14
20.
1uF
C14
20.
1uF
P4
P4
5 9 4 8 3 7 2 6 1
C14
70.
1uF
C14
70.
1uF
C15
00.
1uF
C15
00.
1uF
C15
20.
1uF
C15
20.
1uF
C15
40.
1uF
C15
40.
1uF
U30
MA
X32
25C
AP
or I
CL3
225C
A
U30
MA
X32
25C
AP
or I
CL3
225C
A
RE
AD
Y1
C1+
2V
+3
C1-
4C
2+5
C2-
6V
-7
T2O
UT
8R
2IN
9R
2OU
T10
INV
ALI
D11
T2IN
12T1
IN13
FOR
CE
ON
14
GN
D18
R1O
UT
15R
1IN
16T1
OU
T17
VC
C19
FOR
CE
OFF
20
RP
26
4x 4
.7K
RP
26
4x 4
.7K
11
22
33
44
55
66
77
88
C15
60.
1uF
C15
60.
1uF
C15
10.
1uF
C15
10.
1uF
C14
50.
1uF
C14
50.
1uF
U31
MA
X32
25C
AP
or I
CL3
225C
A
U31
MA
X32
25C
AP
or I
CL3
225C
A
RE
AD
Y1
C1+
2V
+3
C1-
4C
2+5
C2-
6V
-7
T2O
UT
8R
2IN
9R
2OU
T10
INV
ALI
D11
T2IN
12T1
IN13
FOR
CE
ON
14
GN
D18
R1O
UT
15R
1IN
16T1
OU
T17
VC
C19
FOR
CE
OFF
20
RP
24
4x 4
.7K
RP
24
4x 4
.7K
11
22
33
44
55
66
77
88
RP
254x
4.7
KR
P25
4x 4
.7K
11
22
33
44
55
66
77
88
C14
90.
1uF
C14
90.
1uF
C14
30.
1uF
C14
30.
1uF
C15
31n
FC
153
1nF
C15
80.
1uF
C15
80.
1uF
JP46
JP46
12
P5
P5
5 9 4 8 3 7 2 6 1
J12
J12
1 2 3 4 5 6 7 8 9 10
P6
P6
5 9 4 8 3 7 2 6 1
C14
80.
1uF
C14
80.
1uF
JP50
JP50
12
3
RP
234x
4.7
KR
P23
4x 4
.7K
11
22
33
44
55
66
77
88
C15
71n
FC
157
1nF
JP47
JP47
12
JP52
JP52
12
3
M5235EVB User’s Manual, Rev. 2
Freescale Semiconductor 91
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
B_A
[23:
0]
B_D
21
B_D
25B
_D24
B_D
[31:
0]
/CS
2
B_D
17
B_D
28B
_D27
B_D
26
B_D
18
B_D
31
B_D
23
B_D
19
B_D
30
B_D
16
/CS
[7:0
]
B_D
29
B_D
22
B_A
1
B_D
20
/IRQ
3
/IRQ
[7:1
]
/IRQ
4
B_A
0B
_D[3
1:0]
B_A
[23:
0]
/CS
[7:0
]
/OE
R/W
/IRQ
[7:1
]
DTI
N1
DTI
N2
DTO
UT1
DTO
UT2
/RS
TOU
T +3.3
V
+3.3
V+5
V
+3.3
V+3
.3V
+3.3
V+3
.3V
+3.3
V
+5V
+3.3
V+3.3
V
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
US
B C
ontro
ller
C
M52
3xE
VB
B
1616
Frid
ay, A
ugus
t 10,
200
7
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
US
B C
ontro
ller
C
M52
3xE
VB
B
1616
Frid
ay, A
ugus
t 10,
200
7
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
SC
H-2
0380
US
B C
ontro
ller
C
M52
3xE
VB
B
1616
Frid
ay, A
ugus
t 10,
200
7
Dec
oupl
ing
capa
cito
rs
Hos
t
Dev
ice
500m
A p
er c
hann
el
HO
STE
NB
1 (J
P56
) - s
et b
etw
een
pins
2 &
3 if
usin
g P
ort 1
in H
OS
T m
ode.
Set
betw
een
pins
1 &
2 if
usi
ng P
ort 1
in O
TGor
DE
VIC
E m
ode
(def
ault)
.
OTG
Min
i-AB
Rec
epta
cle
Do
not p
opul
ate
OTG
Ena
ble
- NO
T FI
TTE
D b
y de
faul
t
The
ISP
1362
can
be
conf
igur
ed to
op
erat
e in
PIO
or D
MA
mod
e.Ju
mpe
r Set
tings
are
as
follo
ws:
D
MA
PIO
JP57
O
N
OFF
JP58
O
N
OFF
JP59
O
N
OFF
JP60
O
N
OFF
JP62
O
FF
O
NJP
63
OFF
ON
Def
ault
setti
ng is
DM
A e
nabl
ed
US
B S
erie
s "B
" CO
NN
US
B S
erie
s "A
" CO
NN
Def
ault
for J
P61
is F
ITTE
D
Mot
orol
a S
PS
TS
PG
- TE
CD
Col
dFire
Gro
up
Y2
12M
Hz
Y2
12M
Hz
C16
710
uF 1
6VC
167
10uF
16V
C17
20.
1uF
C17
20.
1uF
U34
MIC
2026
U34
MIC
2026
EN
A1
FLG
A2
FLG
B3
EN
B4
OU
TB5
GN
D6
IN7
OU
TA8
R91
10K
R91
10K
R93
1MR
931M
C16
81n
FC
168
1nF
J15
J15 1 2 3 4
C17
60.
1uF
C17
60.
1uF
R85
100K
R85
100K
C16
510
uF 1
6VC
165
10uF
16V
R84
22R
R84
22R
JP60
JP60
12
JP62
JP62
12
R88
22R
R88
22R
C16
047
pFC
160
47pF
C17
822
pFC
178
22pF
C16
60.
1uF
C16
60.
1uF
R86
100K
R86
100K
R92
100K
R92
100K
C17
31n
FC
173
1nF
R89
1KR
891K
R81
10K
R81
10K
JP57
JP57
12
J16
J16 1 2 3 4
JP59
JP59
12
JP61
JP61
12
C16
347
pFC
163
47pF
C17
010
nFC
170
10nF
C16
147
pFC
161
47pF
D33
D33
JP56
JP56
123
U33
ISP
1362
U33
ISP
1362
DG
ND
1
VC
C(5
.0)
56
AG
ND
51
VB
US
55
OTG
_DM
149
OTG
_DP
150
CP
_CA
P2
54C
P_C
AP
153
OTG
MO
DE
45
RE
SE
T32
DR
EQ
124
DR
EQ
225
DA
CK
128
DA
CK
229
INT2
31
H_P
SW
236
H_D
M2
46H
_DP
247
H_S
US
PD
/WU
P33
D_S
US
PD
/WU
P34
H_P
SW
135
GL
39
DG
ND
9
VC
C(3
.3)
4
CS
21R
D20
WR
22
INT1
30
ID48
A0
61A
162
VC
C(3
.3)
52V
CC
(3.3
)58
TES
T023
TES
T159
DG
ND
19
VC
C(3
.3)
14
TES
T260
CLK
OU
T38
D0
63D
164
DG
ND
27
VC
C(3
.3)
26
D2
2D
33
D4
5D
56
D6
7D
78
D8
10D
911
D10
12D
1113
D12
15D
1316
D14
17D
1518
VC
C(3
.3)
40
X2
44X
143
DG
ND
37
H_O
C1
42H
_OC
241
DG
ND
57
C17
40.
1uF
C17
40.
1uF
R87
22R
R87
22R
R82
10K
R82
10K
C17
722
pFC
177
22pF
JP63
JP63
12
R83
22R
R83
22R
C16
222
nFC
162
22nF
C16
447
pFC
164
47pF
JP58
JP58
12
C16
90.
1uF
C16
90.
1uF
C17
11n
FC
171
1nF
JP55
JP55
12
C17
51n
FC
175
1nF
J14
US
B M
ini-A
B C
ON
N
J14
US
B M
ini-A
B C
ON
N
1 2 3 4 5
C15
910
uF 1
6VC
159
10uF
16V
R90
10K
R90
10K
TP13
VB
US
1
TP13
VB
US
1
1
M5235EVB User’s Manual, Rev. 2
92 Freescale Semiconductor
F
Part Number Notes
170-20380
AVX 08051C102KAT2A
AVX 08055C104KAT2A
TA016TCM106KBR
TPSC476K016R0350
C0805X7R250-103KNE
TPSD106K035R0300
AVX 08055C104KAT2A
T494A225K010AS
M5235E
VB
User’s M
anu
al, Rev. 2
reescale Sem
iconductor93
7 Evaluation Board BOMTable 28. M523xEVB Bill of Materials
Item Qty Reference Description Mfgr
1 1 N/A BARE PWB ; RE Rev X for M523XEVB RapidPCB
2 46 C1, C2, C3, C4, C12, C13, C14, C15, C18, C19, C24, C25, C26, C27, C37, C34, C39, C70, C71, C72, C73, C74, C75, C76, C77, C98, C99, C110, C111, C112, C113, C118, C124, C133, C134, C135, C136, C153, C155, C157, C168, C171, C173, C175, C182, C183
1nF 50V 0805, 5% COG Surface Mount Caps KOA
3 77 C5, C6, C7, C8, C9, C10, C11, C16, C17, C28, C29, C30, C31, C33, C35, C36, C38, C40, C42, C43, C44, C46, C47, C48, C49, C52, C53, C55, C57, C78, C79, C80, C81, C82, C83, C84, C85, C100, C101, C114. C115, C116, C117. C119, C120, C122, C123, C127, C130, C137, C138, C139, C140, C141, C142, C143, C144, C145, C146, C147, C148, C149, C150, C151, C152, C154, C156, C158, C166, C169, C172, C174, C176, C184, C185, C186, C187
0.1uF 25V 0805, 10% X7R Surface Mount Caps KOA
4 6 C20, C21, C22, C23, C180, C181 100pF 50V 0805 NPO or COG Surface Mount Caps
Venkel
5 2 C32, C128 10uF 16V 10% B Case Tant. AVX
6 2 C41, C45 47uF 16V C Case Tant. AVX
7 9 C50, C66, C94, C95, C102, C103, C104, C105, C170
10nF 25V X7R 0805 Surface Mount Caps Venkel
8 3 C51, C54, C56 10uF D Case 7343. Tant. AVX
9 8 C58, C59, C60, C61, C62, C63, C64, C179 2.2nF 25V NPO Venkel
10 7 C65. C67, C68, C69, C86, C88, C89 0.1uF 25V X7R 0805, 10% AVX
11 1 C87 2.2uF 10V A Case Tant. AVX
12 10 C90, C91, C92, C93, C96, C97, C106, C107, C108, C109
470pF 50V NPO or COG 0805, 5% Venkel
9
TPSE337K010R0100
ECA-1VM102 or UVZ1H102MHH
TA016TCM106KBR
AA3528SGC
AA3528SRC
AA3528YC
MBRS340T3
MRA4003T3
AA3528MBC
HI1206T500R-00
4527K Fuse Holder by KEYSTONE +0216005.H: Fuse by Littlefuse, 5A, 250V, 5 x 20mm glass
Part Number Notes
M5235E
VB
User’s M
anu
al, Rev. 2
4Freescale S
emiconductor
14 3 C121, C126, C129 330uF 10V D Case Tant AVX
15 1 C125 1000uF 35V Panasonic
16 3 C159, C165, C167 10uF 16V 10% B Case Tant. Venkel
17 2 C131, C132 10pF SMD 50V 0805 5% KOA or Philips
18 4 C160, C161, C163, C164 47pF SMD 50V 0805 5% KOA or Philips
19 1 C162 22nF SMD 50V 0805 5% KOA or Philips
20 2 C178, C177 22pF SMD 50V 0805 5% KOA or Philips
21 12 D1, D2, D3, D4, D6, D7, D9, D11, D14, D17, D33
GREEN LED Kingbright
22 3 D5, D23, D24 RED LED Kingbright
23 3 D8, D10, D12 YELLOW LED Kingbright
24 5 D13, D15, D16, D20, D22 Shottky Power Diodes On-Semi
25 2 D18, D19 SMA On-Semi
26 8 D25, D26, D27, D28, D29, D30, D31, D32 BLUE LED Kingbright
27 6 FB1, FB2, FB3, FB4, FB5, FB6 Ferrite Beads STEWARD
28 1 F1 5A Fast Blow FUSE Keystone
Table 28. M523xEVB Bill of Materials (continued)
Item Qty Reference Description Mfgr
F
S2105-02 or M22-2510205
S2105-03 or M22-2510305
609-2627
HFJ11-2450E
22-10-7128
39-26-7405
10-89-6404
22-27-2061
177983-2
1053378-1
22-10-2101
22-10-2041
440479-1 A
787780-1
787616-1
Part Number Notes
M5235E
VB
User’s M
anu
al, Rev. 2
reescale Sem
iconductor95
29 33 JP1, JP2, JP3, JP4, JP27, JP28, JP29, JP30, JP33, JP34, JP37, JP38, JP39, JP40, JP41, JP42, JP43, JP44, JP45, JP46, JP47, JP48, JP49, JP53, JP54, JP55, JP57, JP58, JP59, JP60, JP61, JP62, JP63
2-way Jumper Sullins or Harwin
30 30 JP5, JP6, JP7, JP8, JP9, JP10, JP11, JP12, JP13, JP14, JP15, JP16, JP17, JP18, JP19, JP20, JP21, JP22, JP23, JP24, JP25, JP26, JP31, JP32, JP35, JP36, JP50, JP51, JP52, JP56
3-way Jumper Sullins or Harwin
31 1 J1 2 x 13 BDM Connector - Shrouded Headers Thomas &Betts
32 1 J2 RJ45 Connector Halo
33 1 J3 1 x 12 ADC Header 0.1 Male Molex
34 1 J4 2 x 20 shrd. UNI3 Connector Male Molex
35 1 J5 2 x 20 eTPU Header 0.1 Male Molex
36 1 J6 1 x 6 HS/ENCO Header Male Molex
37 4 J7, J8, J9, J10 60 way Fine Pitch Surface Mount Connector AMP
38 1 J11 External Clock Input SMA Connector AMP
39 1 J12 1 x 10 QSPI Header Male Molex
40 1 J13 1 x 4 I2C Header 0.1 Male Molex
41 1 J14 USB MiniAB Connector AMP
42 1 J15 USB "series B" Connector AMP
43 1 J16 USB "series A" Connector AMP
Table 28. M523xEVB Bill of Materials (continued)
Item Qty Reference Description Mfgr
9
ies CT1210LSC-100_ or 1210-103J
B82111-B-C24
747844-3
t RAPC722
2SV-02
4 X 4.7K, 4 X 0603
4 X 22
4 X 51
4 X 10K
4 X 10
1K
62
22.1R, 1%
Bourns 3314J-1 or Spectral Vishay 4G-103
10K
Part Number Notes
M5235E
VB
User’s M
anu
al, Rev. 2
6Freescale S
emiconductor
44 1 L1 10uH Inductor Central Technologor Delaven
45 2 L2, L3 Power Inductor Thru Hole Siemens
46 4 P1, P4, P5, P6 DB9 RS232 Port Thru Hole AMP
47 1 P2 2.1mm Barrel Power Connector Switchcraf
48 2 P3 2-way Bare Wire Power Connector Augat
49 18 RP1, RP2, RP8, RP9, RP10, RP11, RP12, RP14, RP15, RP16, RP17, RP20, RP21, RP22, RP23, RP24, RP25, RP26
ARV241, 4 x 4.7K ohm resistor pack KOA or Philips
50 1 RP3 ARV241, 4 x 22 ohm resistor pack KOA or Philips
51 4 RP4, RP5, RP6, RP7 ARV241, 4 x 51 ohm resistor pack KOA or Philips
52 1 RP13 ARV241, 4 x 10 K ohm resistor pack KOA or Philips
53 2 RP18, RP19 ARV241, 4 x 10 ohm resistor pack KOA or Philips
54 8 R1, R3, R52, R56, R59, R63, R80, R89 1K ohm 0805 Surface Mount Resistor KOA or Philips
55 2 R2, R4 62 ohm 0805 Surface Mount Resistor KOA or Philips
56 8 R5, R6, R28, R29, R72, R74, R83, R84, R87, R88
22R ohm 0805 Surface Mount Resistor KOA or Philips
57 1 R41 SMT POT Bourns
58 7 R7, R14, R76, R81, R82, R90, R91 10K ohm 0805 Surface Mount Resistor KOA or Philips
Table 28. M523xEVB Bill of Materials (continued)
Item Qty Reference Description Mfgr
F
49.9R, 1%
4.7K
6.49K
220R
330
120
1M
22.1K, 1%
150
270R
1.8K
24.9R, 1%
560R
100
100K
108-2MS1T1B1M2QE
Part Number Notes
M5235E
VB
User’s M
anu
al, Rev. 2
reescale Sem
iconductor97
59 4 R8, R9, R10, R11 49.9R ohm 0805 Surface Mount Resistor KOA or Philips
60 8 R12, R49, R55, R60, R66, R67, R68, R69 4.7K ohm 0805 Surface Mount resistor KOA or Philips
61 1 R13 6.49K ohm 0805 Surface Mount Resistor KOA or Philips
62 4 R15, R16, R17, R18 220R ohm 0805 Surface Mount Resistor KOA or Philips
63 8 R19, R20, R21, R22, R23, R24, R25, R32 0 ohm 0805 Surface Mount Resistor KOA or Philips
64 9 R26, R27, R30, R31, R33, R34, R35, R36, R73
120 ohm 0805 Surface Mount Resistor KOA or Philips
65 2 R37, R93 1M ohm 0805 Surface Mount Resistor KOA or Philips
66 1 R38 22.1K ohm Surface Mount Resistor KOA or Philips
67 2 R39 150 ohm 0805 Surface Mount Resistor KOA or Philips
68 11 R42, R43, R44, R45, R46, R47, R48, R50, R70, R75, R78
270R ohm 0805 Surface Mount Resistor KOA or Philips
69 5 R51, R54, R58, R62, R65 1.8K ohm 0805 Surface Mount Resistor KOA or Philips
70 4 R53, R57, R61, R64 24R ohm 0805 Surface Mount Resistor KOA or Philips
71 1 R71 560R ohm 0805 Surface Mount Resistor KOA or Philips
72 2 R40, R77, R79 100 ohm 0805 Surface Mount Resistor KOA or Philips
73 3 R85, R86. R92 100K ohm 0805 Surface Mount Resistor KOA or Philips
74 1 SW1 Toggle Switch Apem
Table 28. M523xEVB Bill of Materials (continued)
Item Qty Reference Description Mfgr
9
KS11R22CQD
25546NA6 (silver preferred) or 25546NLD (gold plate)
KS11R23CQD
78RB12
5015K
MR2A16ATS35C A
MC74LCX16245DT
SN74LVC1G11DBVR
MC74LCX245DT
SN65HVD230D
MCF5235CVM150
KS8721BL
AD9728BRU
AD780BR
NL17SZ08DFT2
LM393M
NL27WZ04DFT2
SN74HC04D
NL27WZ86US
Am29PL160CB-65RS
LM2596S-3.3
LM2596S-5
Part Number Notes
M5235E
VB
User’s M
anu
al, Rev. 2
8Freescale S
emiconductor
75 3 SW2, SW3, SW5 Surface Mount Switch - Black C & K
76 1 SW4 Slide Switch Apem
77 1 SW6 Surface Mount Switch - Red C & K
78 1 SW7 Configuration DIP switch 10 position SPDT Grayhill
79 13 TP1, TP2, TP3. TP4, TP5, TP6, TP7, TP8, TP9, TP10, TP11, TP12, TP13
Surface Mount Test Points Keystone
80 2 U1, U2 MRAM Freescale
81 3 U3, U4, U6 Buffers On-Semi
82 2 U5, U26 AND Gate TI
83 1 U7 Buffers On-Semi
84 2 U8, U9 CAN Transceivers TI
85 1 U10 ColdFire MCF5235 microprocessor Freescale
86 1 U11 Ethernet Transceiver Micrel
87 1 U12 A to D Converter Analog Devices
88 1 U13 Voltage Regulator Analog Devices
89 1 U14 AND Gate On-Semi
90 1 U15 Comparator
91 1 U16 2 Gate Inverter On-Semi
92 1 U17 6 Gate Inverter
93 1 U18 EXOR Logic Gate On-Semi
94 1 U19 16-bit flash memory AMD
95 1 U20 3.3V Regulator National
96 1 U21 5V Regulator National
Table 28. M523xEVB Bill of Materials (continued)
Item Qty Reference Description Mfgr
F
h. LT1086CM
H5C-2E3 or F5C-2E3 or P1100-HCV or P1145-HCV
ADM708SAR
MC74LCX541DT
MT48LC4M16A2TG75L
MAX3225CAP or ICL3225CA
ISP1362BD
MIC2026-2BM
Am29PL320DB60RWP or MBM29PL3200BE70PBT
A
FOXS/250F-20 A
FOXS/120-20
Part Number Notes
M5235E
VB
User’s M
anu
al, Rev. 2
reescale Sem
iconductor99
97 1 U22 1.5V Regulator Linear Tec
98 1 U23 OSC. 3.3V 25MHz 4-pin Thru Hole FOX or Pletronics
99 2 U24, U25 Voltage Monitoring uP Supervisory Circuit Analog Devices
100 1 U27 Buffer Freescale
101 2 U28, U29 SDRAM Micron
102 3 U30, U31, U32 RS232 Transceiver Maxim
103 1 U33 USB OTG controller Philips
104 1 U34 Power Distrubution Switch Micrel
105 1 U35 32-bit flash memory AMD or Fujitsu
106 2 VIA1, VIA2 SMTP
107 1 Y1 25MHz Crystal FOX
108 1 Y2 12MHz Crystal FOX
Note: A = not populated at assembly.
Table 28. M523xEVB Bill of Materials (continued)
Item Qty Reference Description Mfgr
Document Number: M5235EVBUMRev. 208/2007
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