ls t67b · 627 nm 633 nm 639 nm spectral bandwidth at 50% i rel,max ∆λ typ. 15 nm viewing angle...
TRANSCRIPT
LS T67B
1 Version 1.1 | 2018-05-28
Produktdatenblatt | Version 1.1 www.osram-os.com
LS T67B
TOPLED® TOPLED, SMT LED with integrated reflector. With our great experience in SMT LED we are able to of-fer a high quality product for all kind of applications.
Applications — Cluster, Button Backlighting — Electronic Equipment
— Interior Illumination e.g. Ambient Map — White Goods
Features: — Package: white PLCC-2 package, colorless clear resin
— Chip technology: InGaAlP
— Typ. Radiation: 120° (Lambertian emitter)
— Color: λdom = 633 nm (● super red)
— Corrosion Robustness Class: 3B
— ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM)
LS T67B
2 Version 1.1 | 2018-05-28
Ordering Information
Type Luminous Intensity 1) Ordering CodeIF = 30 mAIv
LS T67B-S1T2-1 180 ... 450 mcd Q65111A9318
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Maximum RatingsParameter Symbol Values
Operating Temperature Top min. max.
-40 °C 100 °C
Storage Temperature Tstg min. max.
-40 °C 100 °C
Junction Temperature Tj max. 125 °C
Forward current TS = 25 °C
IF max. 50 mA
Surge Current t ≤ 10 µs; D = 0.1 ; TS = 25 °C
IFS max. 100 mA
Reverse voltage 2) TS = 25 °C
VR max. 12 V
ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM)
VESD 2 kV
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CharacteristicsIF = 30 mA; TS = 25 °C
Parameter Symbol Values
Peak Wavelength λpeak typ. 645 nm
Dominant Wavelength 3) IF = 30 mA
λdom min. typ. max.
627 nm 633 nm 639 nm
Spectral Bandwidth at 50% Irel,max ∆λ typ. 15 nm
Viewing angle at 50 % IV 2φ typ. 120 °
Forward Voltage 4) IF = 30 mA
VF min. typ. max.
1.80 V 2.09 V 2.40 V
Reverse current 2) VR = 12 V
IR typ. max.
0.01 µA 10 µA
Temperature Coefficient of Peak Wavelength -10°C ≤ T ≤ 100°C
TCλpeak typ. 0.15 nm / K
Temperature Coefficient of Dominant Wavelength -10°C ≤ T ≤ 100°C
TCλdom typ. 0.05 nm / K
Temperature Coefficient of Forward Voltage -10°C ≤ T ≤ 100°C
TCVF typ. -3.4 mV / K
Real thermal resistance junction/ambient 5), 6) RthJA real max. 400 K / W
Real thermal resistance junction/solderpoint 5) RthJS real max. 180 K / W
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Brightness Groups
Group Luminous Intensity 1) Luminous Intensity. 1) Luminous Flux 7)
IF = 30 mA IF = 30 mA IF = 30 mAmin. max. typ.Iv Iv ΦV
S1 180 mcd 224 mcd 610 mlm
S2 224 mcd 280 mcd 760 mlm
T1 280 mcd 355 mcd 950 mlm
T2 355 mcd 450 mcd 1210 mlm
Group Name on Label Example: S1-1Brightness Wavelength
S1 1
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LS T67B
350 400 450 500 550 600 650 700 750 800
λ [nm]
0,0
0,2
0,4
0,6
0,8
1,0Irel
: Vλ
: super red
Relative Spectral Emission 7) Irel = f (λ); IF = 30 mA; TS = 25 °C
LS T67B
-100°
-90°
-80°
-70°
-60°
-50°
-40°
-30°
-20°-10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90°
ϕ [°]
0,0
0,2
0,4
0,6
0,8
1,0Irel
Radiation Characteristics 7) Irel = f (ϕ); TS = 25 °C
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LS T67B
1 2 3 4 5 10 20 30 40 50
IF [mA]
0,05
0,1
0,5
1
IVIV(30mA)
Relative Luminous Intensity 7), 8)
Iv/Iv(30 mA) = f(IF); TS = 25 °C
LS T67B
1,6 2,31,8 2,0 2,2
VF [V]
1
10
20
30
40
50IF [mA]
Forward current 7), 8)
IF = f(VF); TS = 25 °C
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LS T67B
-40 -20 0 20 40 60 80 100 120
Tj [°C]
0,0
0,5
1,0
1,5
2,0IvIv(25°C)
Relative Luminous Intensity 7)
Iv/Iv(25 °C) = f(Tj); IF = 30 mA
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9 Version 1.1 | 2018-05-28
˚C
OHL00176
00 20 6040 80
mAIF
100
temp. solder pointΤS
Τ
10
20
30
40
50
60
temp. ambientAΤ
SΤ
ΤA
Max. Permissible Forward CurrentIF = f(T)
0
A
OHL01318
pt
FI D
Pt
= TPt
T
FI
1
0.05
0.50.2
0.02
0.1
=
0.010.005D
-5 110-410 10-3 -2 1010-1 0 10 10s 210
0.02
0.04
0.06
0.08
0.10
0.14
Permissible Pulse Handling CapabilityIF = f(tp); D: Duty cycle; TS = 85 °C
OHL00193
FI
0
0.02
0.04
0.06
0.08
0.10
0.12
A
pt-510 -410 -310 -210 -110 010 110 210
0.0050.05
0.5
s
Permissible Pulse Handling CapabilityIF = f(tp); D: Duty cycle; TS = 25 °C
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10 Version 1.1 | 2018-05-28
Dimensional Drawing 9)
GPLY6724
0.7 (0.028)0.9 (0.035)
1.7 (0.067)
2.1 (0.083)
0.12 (0.005)0.18 (0.007)
0.5
(0.0
20)
1.1
(0.0
43)
3.3
(0.1
30)
3.7
(0.1
46)
0.4 (0.016)0.6 (0.024)
2.6 (0.102)3.0 (0.118)
2.1 (0.083)
2.3 (0.091)
Cathode marking
3.0
(0.1
18)
3.4
(0.1
34)
(2.4
) (0.
095)
0.1 (0.004) (typ.)
4˚±1 A
C
Approximate Weight: 34.0 mg
Package marking: Cathode
Corrosion test: Class: 3B Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter then IEC 60068-2-43)
LS T67B
11 Version 1.1 | 2018-05-28
For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning.
Recommended Solder Pad 9)
OHLPY970
4.5
(0.1
77)
2.6 (0.102)1.
5 (0
.059
)
Cu-area > 16 mmCu-Fläche > 16 mm
2
2
Solder resistLötstopplack
4.5
(0.1
77)
1.5
(0.0
59)
2.6 (0.102)
Padgeometrie für
improved heat dissipation
verbesserte Wärmeableitung
Paddesign for
For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning.
Recommended Solder Pad 9)
OHLPY440
Padgeometrie fürverbesserte Wärmeableitung
improved heat dissipationPaddesign for
LötstoplackSolder resist
0.8 (0.031)
3.7
(0.1
46)
1.1
(0.0
43)
2.3 (0.091)
3.3 (0.130)
1.5
(0.0
59)
11.1
(0.4
37)
Cu Fläche / 16 mm per pad2
Cu-area_<
3.3 (0.130)
Kathode/Cathode
Anode
0.7 (0.028)
Fläche darf bei Verwendung von TOPLED®
For TOPLED® assembly do not use
elektrisch nicht beschaltet werden.
this area for electrical contact
Fläche darf bei Verwendung von TOPLED®
For TOPLED® assembly do not use
elektrisch nicht beschaltet werden.
this area for electrical contact
LS T67B
12 Version 1.1 | 2018-05-28
Reflow Soldering ProfileProduct complies to MSL Level 2 acc. to JEDEC J-STD-020E
00
s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300t
T
˚C
St
t
Pt
Tp240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
Profile Feature Symbol Pb-Free (SnAgCu) Assembly UnitMinimum Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C2 3 K/s
Time tSTSmin to TSmax
tS 60 100 120 s
Ramp-up rate to peak*)
TSmax to TP
2 3 K/s
Liquidus temperature TL 217 °C
Time above liquidus temperature tL 80 100 s
Peak temperature TP 245 260 °C
Time within 5 °C of the specified peaktemperature TP - 5 K
tP 10 20 30 s
Ramp-down rate*TP to 100 °C
3 6 K/s
Time25 °C to TP
480 s
All temperatures refer to the center of the package, measured on the top of the component* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
LS T67B
13 Version 1.1 | 2018-05-28
Taping 9)
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14 Version 1.1 | 2018-05-28
Tape and Reel 10)
Reel dimensions [mm]A W Nmin W1 W2 max Pieces per PU
180 mm 8 + 0.3 / - 0.1 60 8.4 + 2 14.4 2000
330 mm 8 + 0.3 / - 0.1 60 8.4 + 2 14.4 8000
LS T67B
15 Version 1.1 | 2018-05-28
Barcode-Product-Label (BPL)
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
Dry Packing Process and Materials 9)
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately afterbag opening.
Discard if circles overrun.Avoid metal contact.
WET
Do not eat.
Comparatorcheck dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%bake units
bake units
If wet,
change desiccant
If wet,
Humidity IndicatorMIL-I-8835
If wet,
Mois
ture
Level 3
Flo
or tim
e 168 H
ours
Mois
ture
Level 6
Flo
or tim
e 6
Hours
a) H
umid
ity In
dicato
r C
ard is
> 1
0% w
hen read a
t 23 ˚
C ±
5 ˚C
, or
reflo
w, v
apor-phase r
eflow
, or equiv
alent p
rocessin
g (peak p
ackage
2. Afte
r th
is b
ag is o
pened, devic
es that w
ill b
e subje
cted to
infrare
d
1. Shelf
life in
seale
d bag: 2
4 month
s at <
40 ˚
C a
nd < 9
0% rela
tive h
umid
ity (R
H).
Mois
ture
Level 5
a
at facto
ry c
onditions o
f
(if b
lank, s
eal date
is id
entical w
ith d
ate c
ode).
a) M
ounted w
ithin
b) S
tore
d at
body tem
p.
3. Devic
es require
bakin
g, befo
re m
ounting, i
f:
Bag s
eal date
Mois
ture
Level 1
Mois
ture
Level 2
Mois
ture
Level 2
a4. If b
aking is
require
d,
b) 2a o
r 2b is
not m
et.
Date
and ti
me o
pened:
refe
rence IP
C/J
ED
EC
J-S
TD
-033 fo
r bake p
rocedure
.
Flo
or tim
e see b
elow
If bla
nk, see b
ar code la
bel
Flo
or tim
e > 1
Year
Flo
or tim
e 1
Year
Flo
or tim
e 4
Weeks10%
RH
.
_<
Mois
ture
Level 4
Mois
ture
Level 5
˚C).
OPTO
SEM
ICO
NDUCTORS
MO
ISTURE S
ENSITIV
E
This b
ag conta
ins
CAUTION
Flo
or tim
e 72 H
ours
Flo
or tim
e 48 H
ours
Flo
or tim
e 24 H
ours
30 ˚C
/60%
RH
.
_<
LE
VE
L
If bla
nk, see
bar code la
bel
LS T67B
16 Version 1.1 | 2018-05-28
Transportation Packing and Materials 9)
OHA02044
PACKVAR:
R077Additional TEXT
P-1+Q-1
Multi TOPLED
Muste
r
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
10
(9D) D/C:
11(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY: 2000
0144
(G) GROUP:
260 C RT240 C R
3
220 C R
MLBin3:Bin2: Q
-1-20
Bin1: P-1-20
LSY T6762
2a
Temp ST
R18DEMY
PACKVAR:
R077Additional TEXT
P-1+Q-1
Multi TOPLED
Muste
r
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
10
(9D) D/C:
11(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY: 2000
0144
(G) GROUP:
260 C RT240 C R
3
220 C R
MLBin3:Bin2: Q
-1-20
Bin1: P-1-20
LSY T6762
2a
Temp ST
R18DEMY
OSRAM
Packing
Sealing label
Barcode label
Mois
ture
Level 3
Flo
or tim
e 168 H
ours
Mois
ture
Level 6
Flo
or tim
e 6
Hours
a) H
umid
ity In
dicato
r C
ard is
> 1
0% w
hen read a
t 23 ˚
C ±
5 ˚C
, or
reflo
w, v
apor-phase r
eflow
, or e
quivale
nt pro
cessing (p
eak package
2. Afte
r th
is b
ag is o
pened,
devices th
at will
be s
ubjecte
d to in
frare
d
1. Shelf
life in
seale
d bag: 2
4 month
s at <
40 ˚
C a
nd < 9
0% rela
tive h
umid
ity (R
H).
Mois
ture
Level 5
a
at facto
ry c
onditions o
f
(if b
lank, s
eal date
is id
entical w
ith d
ate c
ode).
a) M
ounted w
ithin
b) S
tore
d at
body te
mp.
3. Devic
es require
bakin
g, befo
re m
ounting, i
f:
Bag s
eal date
Mois
ture
Level 1
Mois
ture
Level 2
Mois
ture
Level 2
a4. If b
aking is
require
d,
b) 2a o
r 2b is
not m
et.
Date
and ti
me o
pened:
refe
rence IP
C/J
ED
EC
J-S
TD-0
33 for bake p
rocedure
.
Floor
time s
ee belo
w
If bla
nk, see b
ar code la
bel
Flo
or tim
e > 1
Year
Floor
time
1 Y
ear
Flo
or tim
e 4
Weeks10%
RH
.
_<
Mois
ture
Level 4
Mois
ture
Level 5
˚C).
OPTO
SEM
ICONDUCTO
RS
MO
ISTURE S
ENSITIV
E
This b
ag conta
ins
CAUTION
Flo
or tim
e 72 H
ours
Flo
or tim
e 48 H
ours
Flo
or tim
e 24 H
ours
30 ˚C
/60%
RH
.
_<
LE
VE
L
If bla
nk, see
bar code la
bel
Barcode label
Dimensions of transportation box in mmWidth Length Height
200 ± 5 mm 195 ± 5 mm 30 ± 5 mm
352 ± 5 mm 352 ± 5 mm 33 ± 5 mm
LS T67B
17 Version 1.1 | 2018-05-28
Chip Technology: 1: TSN 3: standard InGaN 4: AlGaAs (RECLED) 5: HOP 2000 6: Standard InGalP 9: TSN low current B: HOP 2000 C: ATON D: Low cost ThinGaN/ Thinfilm (e.g. 6mil) F: Thinfilm InGaAlP G: ThinGaN(Thinfilm InGaN) (Subcon:Sapphire) K: InGaAlP low current S: standard InGaN low current 0: TSN
´
Encapsulant Type / Lens Properties 7: Colorless clear or white volume conversion
(resin encapsulation) S: Silicone (with or without diffuser)
Wavelength Emission Color Color coordinates according (λdom typ.) CIE 1931/Emission color: A: 617 nm amber W: white S: 633 nm super red UW: ultra white T: 528 nm true green CB: color on demand blue Y: 587 nm yellow CG: color on demand green O: 606 nm orange CL: color on demand lagune G: 570 nm green P: 560 nm pure green R: 625 nm red B: 470 nm blue H: 645 nm hyper-red V: 505 nm verde green L: Light emitting diode
Package Type T: TOPLED
Lead / Package Properties 6: folded leads 7: reverse gullwing leads T: folded leads, improved corrosion stability Au-LF), w/o TiO2 jetting V: folded leads and UX:3 w/ improved
corrosion stability (Au-LF), TiO2 jetting
Type Designation System
L A T 6 7 6
LS T67B
18 Version 1.1 | 2018-05-28
NotesThe evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specified in this data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this LED contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There-fore, we recommend that customers minimize LED exposure to aggressive substances during storage, pro-duction, and use. LEDs that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810.
For further application related informations please visit www.osram-os.com/appnotes
LS T67B
19 Version 1.1 | 2018-05-28
Disclaimer
DisclaimerLanguage english will prevail in case of any discrepancies or deviations between the two language word-ings.
Attention please!The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances.For information on the types in question please contact our Sales Organization.If printed or downloaded, please find the latest version on the OSRAM OS webside.
PackingPlease use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.
Product safety devices/applications or medical devices/applicationsOSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices.
In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi-nate the customer-specific request between OSRAM OS and Buyer and/or Customer.
LS T67B
20 Version 1.1 | 2018-05-28
Glossary1) Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal
reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of k = 3).
2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera-tion is not allowed.
3) Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal repro-ducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k = 3).
4) Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage factor of k = 3).
5) Thermal Resistance: Rth max is based on statistic values (6σ).6) Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size 16 mm² per pad)7) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data
or calculated correlations of technical parameters can only reflect statistical figures. These do not nec-essarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.
8) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ-ences between single LEDs within one packing unit.
9) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm.
10) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.
LS T67B
21 Version 1.1 | 2018-05-28
Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.