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Confidential HITACHI CHEMICAL HITACHI CHEMICAL Low Dielectric Constant & Low Dissipation Factor Low Dielectric Constant & Low Dissipation Factor Multilayer Material for RF & High Multilayer Material for RF & High - - Speed Applications Speed Applications MCL MCL - - LX LX - - 67Y 67Y GXA GXA - - 67Y(prepreg) 67Y(prepreg) Hitachi Chemical Co., Ltd. PWB Materials Business Unit Technical Report 0 Technical Report 0 Technical Report 0 Technical Report 0 Technical Report 0 Technical Report 0 Technical Report 0 Technical Report 0 40415 40415 40415 40415 40415 40415 40415 40415 Apr., 2004 Attn. The data shown here are based on the technical information and available as of Apr. 2004 and not intended to guarantee the quality. The contents may be revised as necessary according to new findings.

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Page 1: Low Dielectric Constant & Low Dissipation Factor ... · Low Dielectric Constant & Low Dissipation Factor Multilayer Material for RF & High-Speed ... TMA ℃ 185~190 180 185 171

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HITACHI CHEMICALHITACHI CHEMICALLow Dielectric Constant & Low Dissipation FactorLow Dielectric Constant & Low Dissipation Factor

Multilayer Material for RF & HighMultilayer Material for RF & High--Speed ApplicationsSpeed Applications

                                                                MCLMCL--LXLX--67Y67Y                                                        GXAGXA--67Y(prepreg)67Y(prepreg)

Hitachi Chemical Co., Ltd.PWB Materials Business Unit

Technical Report 0Technical Report 0Technical Report 0Technical Report 0Technical Report 0Technical Report 0Technical Report 0Technical Report 04041540415404154041540415404154041540415 Apr., 2004

Attn. The data shown here are based on the technical information and available as of Apr. 2004and not intended to guarantee the quality. The contents may be revised as necessary according to new findings.

Page 2: Low Dielectric Constant & Low Dissipation Factor ... · Low Dielectric Constant & Low Dissipation Factor Multilayer Material for RF & High-Speed ... TMA ℃ 185~190 180 185 171

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General Properties of LaminatesTable Characteristics of Laminates

Glass Fabric Type - - E E E E E

Dielectric Constant (Dk)*1 1GHz 3.45~3.55 3.71 3.65 3.55 4.203GHz 3.45~3.55 3.69 3.64 3.54 4.10

Dissipation factor (Df)*1 1GHz 0.0048~0.0055 0.0058 0.0055 0.0063 0.02153GHz 0.0058~0.0065 0.0074 0.0068 0.0081 0.0230

Copper Peel Strength(18µm) Standard (Rz:7-9µm) - 1.5 0.9 0.9 1.5VLP (Rz:2-3µm) 1.0~1.1 <0.9 <0.5 <0.5 1.1

Glass Transition Temperature(Tg) TMA 185~190 180 185 171 130CTE αx1 14~15 15 16 18 16

αz1 50~55 62 84 65 60αz2 280~300 236 360 194 282

Flexural Modulus A 18~19 21 17 18 20200 10~15 8 5 6 4

Flexural Strength A 590~620 498 358 384 500200 200~250 97 132 185 85

Heat Resistance 260/20s*2 >5h 4h 4h 4h 3h

288/20s*3 >168h - - - >168hWater Absorption PCT-5h 0.45~0.50 0.45 0.40 0.50 1.10

C-168/40/90 0.25~0.30 0.28 0.26 0.24 0.43

CAF Restraining Property*4 - h >1000 - - - >1000

Hole Wall Roughness*5 - µm 10~20 15~25 15~20 - 15~25Flammability UL-94 - V-0 V-0 V-0 V-0 V-0Prepreg - - available available available available available*1) Triplate-line resonator by Network Analyzer(25), *2) Moisture treatment cond.:PCT(121/0.22MPa), *3) Moisture treatment cond.:40/90%RH*4) TH/TH wall apart 0.3mm,cond.:85/85%RH,applied 100V, *5) Drilling cond.:φ0.4mm,80000rpm,2400mm/min,10000hits

MPa

-

wt%

-

-

ppm/

GPa

kN/m

Material A Material C FR-4Material BItem Cond. Unit LX-67Y

Page 3: Low Dielectric Constant & Low Dissipation Factor ... · Low Dielectric Constant & Low Dissipation Factor Multilayer Material for RF & High-Speed ... TMA ℃ 185~190 180 185 171

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High-Frequency Property (Transmission Loss)< Measurement Conditions >/ Triplate-Line Resonator Method(S21) by Vector Network Analyzer/ Temperature & Humidity: 25oC / 60%RH/ Laminate Thickness: 0.8mm(Signal/Ground: 800µµµµm), Copper foil: 18µµµµm/ Signal Conductor Line Width: 1mm(Zo: approx.50ΩΩΩΩ)

02468

101214161820

0 2 4 6 8 10Frequency (GHz)

Atte

nuat

ion

Cons

tant

(dB/

m)

BLX-67Y

FR-4AC

Page 4: Low Dielectric Constant & Low Dissipation Factor ... · Low Dielectric Constant & Low Dissipation Factor Multilayer Material for RF & High-Speed ... TMA ℃ 185~190 180 185 171

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0.0040

0.0050

0.0060

0.0070

0.0080

0.0090

0.0100

0 2 4 6 8 10Frequency(GHz)

Dis

sipa

tion

Fact

or;

Df

3.3

3.4

3.5

3.6

3.7

3.8

0 2 4 6 8 10Frequency(GHz)

Die

lctri

c C

onst

ant;

Dk

Dielectric Properties (vs. Frequency)

< Measurement Conditions >/ Triplate-Line Resonator Method(S21) by Vector Network Analyzer/ Temperature & Humidity: 25oC / 60%RH

C

LX-67Y

B

A

A BC

LX-67Y

Page 5: Low Dielectric Constant & Low Dissipation Factor ... · Low Dielectric Constant & Low Dissipation Factor Multilayer Material for RF & High-Speed ... TMA ℃ 185~190 180 185 171

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0.0040

0.0050

0.0060

0.0070

0.0080

-40 -20 0 20 40 60 80 100Temperature()

Df(

1GH

z)3.4

3.5

3.6

3.7

3.8

-40 -20 0 20 40 60 80 100Temperature()

Dk(

1GH

z)

< Measurement Conditions >/ Triplate-Line Resonator Method(S21) by Vector Network Analyzer/ Temperature Range: ----30~~~~90

Dielectric Properties (vs. Temperature)

C

LX-67Y

B

A C

LX-67Y

BA

Page 6: Low Dielectric Constant & Low Dissipation Factor ... · Low Dielectric Constant & Low Dissipation Factor Multilayer Material for RF & High-Speed ... TMA ℃ 185~190 180 185 171

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0.00400.00600.00800.01000.01200.01400.01600.01800.0200

0 1 2 3 4 5PCT-Treating Time(h)

Df(

1GH

z)3.4

3.5

3.6

3.7

3.8

3.9

0 1 2 3 4 5PCT-Treating Time(h)

Dk(

1GH

z)

< Measurement Conditions >    / Triplate-Line Resonator Method(S21) by Network Analyzer    / Moisture Absorption Treatment : PCT-1~~~~5h(121oC/0.22MPa)

Dielectric Properties (vs. Moisture Absorption)

C

LX-67Y

B

AC

LX-67Y

B

A

Page 7: Low Dielectric Constant & Low Dissipation Factor ... · Low Dielectric Constant & Low Dissipation Factor Multilayer Material for RF & High-Speed ... TMA ℃ 185~190 180 185 171

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0

0.1

0.2

0.3

0.4

0.5

0 100 200 300 400Treatment time(h)

Wat

er A

bsor

ptio

n(w

t%)

0

0.2

0.4

0.6

0.8

1.0

1.2

0 1 2 3 4 5 6Treatment time(h)

Wat

er A

bsor

ptio

n(w

t%)

Water Absorption

PCT(121/0.22MPa)PCT(121/0.22MPa) 40/90%RH40/90%RH

FR-4

(t0.8mm) (t0.8mm)

B

LX-67YAC

FR-4

BLX-67Y

AC

Page 8: Low Dielectric Constant & Low Dissipation Factor ... · Low Dielectric Constant & Low Dissipation Factor Multilayer Material for RF & High-Speed ... TMA ℃ 185~190 180 185 171

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0

100

200

300

400

500

600

700

Flex

ural

Stre

ngth

(M

Pa)

0

5

10

15

20

25

Flex

ural

Mod

ulus (

GPa)

Mechanical Properties

Flexural ModulusFlexural Modulus

t0.8mm(X Direction)

200R.T.t0.8mm(X Direction)

Flexural StrengthFlexural Strength

R.T.

LX-67Y     A     B     C FR-4

200

LX-67Y     A     B     C FR-4

Page 9: Low Dielectric Constant & Low Dissipation Factor ... · Low Dielectric Constant & Low Dissipation Factor Multilayer Material for RF & High-Speed ... TMA ℃ 185~190 180 185 171

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0 200 400 600 800 1000 1200

Insulation Reliability (CAF Preventing Property)CAF : Conductive Anodic Filaments

1015

1014

1013

1012

1011

1010

109

108

107

106

105

< Conditions >85oC / 85%RH, 100V t0.8mm (Cu:18µm)

Diameter:φ0.4mm

TH/TH distance:0.3mm

FR-4

LX-67Y

Treating Time (h)

Insu

latio

n R

esis

tanc

e (Ω

)

(Treating Condition: 85/85%RH, 100V)

Page 10: Low Dielectric Constant & Low Dissipation Factor ... · Low Dielectric Constant & Low Dissipation Factor Multilayer Material for RF & High-Speed ... TMA ℃ 185~190 180 185 171

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Electrical Performance in High Frequencies

<<<< Contents of Evaluation >>>>①①①①Transmission Loss ②②②②Eye Pattern Diagram

Approach to the Evaluation

<<<< Specifications of Testing Board >>>>/Size::::510mm××××510mm    /Layer Count::::8 Layers/Line Structure:Strip-line/Dimension Parameters・・・・Line-Width::::0.06~~~~0.184mm・・・・Dielectric Thickness(G/G)::::0.16~~~~0.32mm・・・・Conductor Thickness::::approx.12, 18, 35, 70μμμμm・・・・Line-Length::::500mm

/Connector::::SMA(φφφφ3.5mm)/Connection(SMA/TH)::::Solder joint

Layer structure

Core

PrepregGround(G)

Ground(G)Ground(G)

Ground(G)

Signal Line(S-a)

Signal Line(S-b)

Signal Line(S-a, 500mm)SMA Connector

Line Layout

Signal Line(S-b,500mm)

Page 11: Low Dielectric Constant & Low Dissipation Factor ... · Low Dielectric Constant & Low Dissipation Factor Multilayer Material for RF & High-Speed ... TMA ℃ 185~190 180 185 171

Confidential-60

-50

-40

-30

-20

-10

00 1 2 3 4 5 6

Frequency(GHz)

Tran

smiss

ion

Los

s(dB

/m)

Electrical Performance in High Frequencies

<<<<Measurement Conditions >>>> / Materials::::LX-67Y vs. Conventional FR-4

/ Temperature & humidity::::25////60%RH/ Dimension Parameters

・Line-Width(w):0.138mm(LX-67Y)/0.124mm(FR-4)・Dielectric Thickness(b):0.22mm・Copper Thickness(t):18μm・Line-Length:500mm

/ Characteristic Impedance:::: 50ΩΩΩΩ

Transmission Loss((((S-Parameter(S21)))))

V-NA

Testing Board

wb t

LX-67Y

FR-4

<<<< Evaluation System >>>>

Page 12: Low Dielectric Constant & Low Dissipation Factor ... · Low Dielectric Constant & Low Dissipation Factor Multilayer Material for RF & High-Speed ... TMA ℃ 185~190 180 185 171

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Electrical Performance in High FrequenciesEye Pattern Diagrams

<<<<Measurement Conditions >>>>  / Same as the Preceding Sheet 100mV/div

50ps/div

Pulse Generator

Testing Board

Oscilloscope

Input Pulse(Bit Rate:5Gbps)

150ps 97ps57mV186mV

LX-67Y (@5Gbps) FR-4 (@5Gbps)

<<<< Evaluation System >>>>

Page 13: Low Dielectric Constant & Low Dissipation Factor ... · Low Dielectric Constant & Low Dissipation Factor Multilayer Material for RF & High-Speed ... TMA ℃ 185~190 180 185 171

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Interconnection Reliability (IST Testing)

Good Interconnection Reliability

The traditional mean performance baseline of 225 cycles

Test condition ; 150,,,,3min←→←→←→←→ 25,,,,2min PWB (LX-67Y) ;;;; 34 layerererer

No.No.No.No. ISTISTISTIST cycle totototo failfailfailfail Failure mode1 613 Interconnect2 753 〃〃〃〃3 916 PTH Barrel4 663 〃〃〃〃5 794 〃〃〃〃6 699 〃〃〃〃

mean 740

φφφφ0.25mm(.010") Vias

No.No.No.No. ISTISTISTIST cycle totototo failfailfailfail Failure mode7 971 PTH Barrel8 1193 〃〃〃〃

9 957 〃〃〃〃

10 706 Interconnect11 699 〃〃〃〃

12 1244 〃〃〃〃

mean 962

φφφφ0.30mm(.012") Vias

The traditional mean performance baseline of 225 cycles

Page 14: Low Dielectric Constant & Low Dissipation Factor ... · Low Dielectric Constant & Low Dissipation Factor Multilayer Material for RF & High-Speed ... TMA ℃ 185~190 180 185 171

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Nominal Thickness*1 (mm) Copper Foil (μm) Tolerance (mm)

0.06 ±0.010.10 ±0.010.13 ±0.020.20 ±0.020.26 ±0.030.40 ±0.040.60 ±0.060.80 ±0.101.00 ±0.101.20 ±0.121.60 ±0.13

12183570

Product Line-Up of MCL-LX-67Y & GXA-67YMCL-LX-67Y(Laminate)

GXA-67Y(Prepreg)

*1 Thickness not listed above will be available at a customer's request.

Nominal Thickness(mm) Glass Style Type Name Resin Content(wt%)

0.03 #1037 YZNC 70±20.06 #1080 YUQC 61±20.08 #3313 YGHB 54±20.10 #2116 YAGB 52±2

Page 15: Low Dielectric Constant & Low Dissipation Factor ... · Low Dielectric Constant & Low Dissipation Factor Multilayer Material for RF & High-Speed ... TMA ℃ 185~190 180 185 171

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Contact UsOn Hitachi Chemical’s Products

R&D GroupYoshihiro NakamuraE-mail: [email protected] MinamiE-mail: [email protected]

Phone : +81-296-20-2217 Fax : +81-296-28-61281500 Ogawa, Shimodate-shi Ibaraki 308-8521 Japan

Shibaura- Square Building, 9-25, Shibaura 4-chome Minato-ku Tokyo 108-0023 Japan

Electronic Laminates Sales Dept.Toshinari ItakuraE-mail: [email protected]

Phone : +81-3-5446-9495 Fax : +81-3-5446-9462

PWB Materials Business UnitShimodate Production Center