lithography options for the 32nm half pitch node · 2014-11-27 · lithography options for the 32nm...
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![Page 1: Lithography options for the 32nm half pitch node · 2014-11-27 · Lithography options for the 32nm half pitch node. Luc Van den hove and Kurt Ronse ... 1995 2000 2005 2010 2015 2020](https://reader031.vdocuments.us/reader031/viewer/2022011900/5f0211c37e708231d4026bad/html5/thumbnails/1.jpg)
imec 2006 1
Lithography options for the 32nm half pitch node
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Luc Van den hove and Kurt Ronse
Lithography options for the 32nm half pitch node
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imec 2006 3
Fig 7&8 Simplified – Option 12005 ITRS Product Technology Trends -
Half-Pitch, Gate-Length
1.0
10.0
100.0
1000.0
1995 2000 2005 2010 2015 2020
Year of Production
Prod
uct H
alf-P
itch,
Gat
e-Le
ngth
(nm
)
DRAM M1 1/2 Pitch
MPU M1 1/2 Pitch(2.5-year cycle)
Flash Poly 1/2 Pitch
MPU Gate Length -Printed
MPUGate Length -Physical
MPU M1.71X/2.5YR
GLpr IS =1.6818 x GLph
MPU & DRAM M1& Flash Poly
.71X/3YR
Flash Poly.71X/2YR
Gate Length.71X/3YR
Before 1998.71X/3YR
After 1998.71X/2YR
ITRS roadmap:32 nm half pitch requirement
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imec 2006 4
32nm half pitch options
NA k1 λNA
kresolution λ.1=
Lens complexityNew liquid (nf>1.8)
New optical material(n>1.9)
Technical challenges:
ArF Immersion1.65 NA
(k1=0.275)
Single exposure
EUVL0.25 NA(k1=0.6)
Single exposure
Source powerOptics lifetimeResist infrastructureMask infrastructure
ArF Immersion with
double patterning1.35 – 1.40 NA
(k1=0.20)
Overlay requirementProcess integration
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imec 2006 5
Outline
• Introduction
• 193 nm immersion lithography
• EUV Lithography
• Double patterning
• Conclusions
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imec 2006 6
193nm immersion lithography
from RESEARCH IDEA…
in WORLD RECORD TIME
to DEVELOPMENT
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imec 2006 7
193nm immersion lithography
to MANUFACTURING ???
DEFECTIVITYfrom DEVELOPMENT…
Is immersion ready ?
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imec 2006 8
Status 193nm immersion lithographyDefectivity
Air bubbles
Water marks and drying stains
Particles
Resist / TC – water interaction
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imec 2006 9
Air bubbles
Status 193nm immersion lithographyDefectivity
Early config. Latest XT:1250i config.
24 bubbles 0 bubbles
: no longer an issue
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imec 2006 10
Water marks and drying stains
Status 193nm immersion lithographyDefectivity
Receding contact angle approaching 0Depends on material hydrophobicityDepends on scan speed (500mm/s)…
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imec 2006 11
Status 193nm immersion lithographyDefectivity
Receding Contact Angle
Num
ber o
f Wat
er D
ropl
ets
Water marks and drying stains
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imec 2006 12
Status 193nm immersion lithographyDefectivity
Leachingof resist components in the water
Water uptakeby resist / TC…
Resist / TC – water interaction
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imec 2006 13
Status 193nm immersion lithographyDefectivity
Leaching statusMethod in place for dynamic leaching measurements
0.0E+00
5.0E-12
1.0E-11
1.5E-11
2.0E-11
2.5E-11
0 2 4 6 8 10time (s)
leac
hing
(mol
/cm
2 )
0.E+001.E-122.E-123.E-124.E-125.E-126.E-127.E-128.E-129.E-121.E-11
leac
hing
rate
(mol
/cm
2 .s)
PAR-817
Amount of leaching during first 1-2 seconds is key (for a high throughput immersion scanner)
Resist / TC – water interaction
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imec 2006 14
0.0E+00
5.0E-12
1.0E-11
1.5E-11
2.0E-11
2.5E-11
0 2 4 6 8 10time (s)
leac
hing
(mol
/cm
2 )
PAR-817
0.0E+00
5.0E-14
1.0E-13
1.5E-13
2.0E-13
2.5E-13
0 2 4 6 8 10
time (s)
leac
hing
(mol
/cm
2 )
PAR-817 + TCX-007
Status 193nm immersion lithographyDefectivity
Leaching statusMethod in place for dynamic leaching measurementsTop coats very efficient in preventing leaching (~100 x less)
Leaching currently prime reason to use top coatRecent immersion specific resists much lower leaching (factor 4)
(5.10-12mol/cm plateau)
Resist / TC – water interaction
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imec 2006 15
Status 193nm immersion lithographyDefectivity
Wafer edge film peelingEdge bead engineering !
Particle transportfrom chuck onto wafer
Wafer Stage
Resist
Shower Head
Wafer Stage
Resist
Shower Head
Particles
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imec 2006 16
Status 193nm immersion lithographyDefectivity
Wafer edge film peelingEdge bead engineering !
BARC
Resist
Before exposure After exposure Before develop
SEM after develop
BARC
Resist Resist
BARC BARC
Resist
Particles
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imec 2006 17
Breakthroughs by strong partnership
Defect reduction trend (daily monitor)
Spectacular progress over the past 12 months
Immersion defects
050
100150200250300350400450500
1 2 3 4 5 1 2 3 1 2 3 4 5 1 2 3 4 5 1 2 3 4 5 1 2 3 1 2 3 1 2 3 1 2 1 1 2 3 1 2 3 1 2 3 1 2 3 1 2 3 1 2 3 1 2 3 1 2 3 1 2 3 1 2 3 1 2 3
9-Nov
9-Nov
9-Nov
9-Nov
9-Nov
23-Nov
23-Nov
23-Nov
29-Nov
29-Nov
29-Nov
29-Nov
29-Nov
6-Dec
6-Dec
6-Dec
6-Dec
6-Dec
13-Dec
13-Dec
13-Dec
13-Dec
13-Dec
23-Jan
23-Jan
23-Jan
24-Jan
24-Jan
24-Jan
25-Jan
25-Jan
25-Jan
26-Jan
26-Jan
27-Jan
30-Jan
30-Jan
30-Jan
31-Jan
31-Jan
31-Jan
1-Feb
1-Feb
1-Feb
2-Feb
2-Feb
2-Feb
3-Feb
3-Feb
3-Feb
5-Feb
5-Feb
5-Feb
6-Feb
6-Feb
6-Feb
7-Feb
7-Feb
7-Feb
8-Feb
8-Feb
8-Feb
9-Feb
9-Feb
9-Feb
10-Feb
10-Feb
10-Feb
date
Coun
t (#
defe
cts/
waf
er)
2005 2006
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imec 2006 18
“Litho friendly 6T SRAM design”
193nm immersion lithographyPolarization
0.186μm2 cell size32nm node
ASML XT:1250i0.85 NA
Poly hp : 75nm (0.330 k1)Fin hp : 62nm (0.273 k1)
SRAM array after spacer etch
SRAM array after spacer etch
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imec 2006 19
“Litho friendly 6T SRAM design”
193nm immersion lithographyPolarization
ASML XT:14000.93 NA
Dipole Y illumination
BE+15.4% BE+10.3% BE+5.1% BE BE-5.1% BE-10.2% BE-15.4%
BE+6.6% BE+3.3% BE BE-3.3% BE-6.6%
Un-polarized
Polarized
Fin hp 55nm (0.265 k1)22nm node
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imec 2006 20
193nm immersion lithographyHyper NA 193i
-240nm NF +120nm +210nm-300nm -120nm +60nm500nm DoF
-150nm NF +150nm +210nm-210nm -90nm +90nm400nm DoF
50nm k1=0.31 1.2NA, σ=0.74/0.94, annular
45nm k1=0.28 1.2NA, σ=0.82/0.97, C-Quad-30
-300nm NF +300nm +450nm-500nm -180nm +180nm950nm DoF
42nm k1=0.26 1.2NA, σ=0.89/0.98, Dipole X-35
-240nm NF +120nm +210nm-300nm -120nm +60nm500nm DoF
-150nm NF +150nm +210nm-210nm -90nm +90nm400nm DoF
50nm k1=0.31 1.2NA, σ=0.74/0.94, annular
45nm k1=0.28 1.2NA, σ=0.82/0.97, C-Quad-30
-300nm NF +300nm +450nm-500nm -180nm +180nm950nm DoF
42nm k1=0.26 1.2NA, σ=0.89/0.98, Dipole X-35-240nm NF +120nm +210nm-300nm -120nm +60nm500nm DoF
-150nm NF +150nm +210nm-210nm -90nm +90nm400nm DoF
50nm k1=0.31 1.2NA, σ=0.74/0.94, annular
45nm k1=0.28 1.2NA, σ=0.82/0.97, C-Quad-30
-300nm NF +300nm +450nm-500nm -180nm +180nm950nm DoF
42nm k1=0.26 1.2NA, σ=0.89/0.98, Dipole X-35
-240nm NF +120nm +210nm-300nm -120nm +60nm500nm DoF
-150nm NF +150nm +210nm-210nm -90nm +90nm400nm DoF
50nm k1=0.31 1.2NA, σ=0.74/0.94, annular
45nm k1=0.28 1.2NA, σ=0.82/0.97, C-Quad-30
-300nm NF +300nm +450nm-500nm -180nm +180nm950nm DoF
42nm k1=0.26 1.2NA, σ=0.89/0.98, Dipole X-35
ASML XT1700i – NA=1.2
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imec 2006 21
193nm immersion lithographyHyper NA 193i
41nm, approaching 0.25k1
P82 – k1 0.25441nm dense
P84 – k1 0.26142nm dense
P86 – k1 0.26743nm dense
1.2NA, Y-pol, dipole X 35° s=0.98-0.89CPL – chromeless lines42nm barc, 120nm resist, topcoat
41nm dense
41nm, approaching 0.25k1
P82 – k1 0.25441nm dense
P84 – k1 0.26142nm dense
P86 – k1 0.26743nm dense
1.2NA, Y-pol, dipole X 35° s=0.98-0.89CPL – chromeless lines42nm barc, 120nm resist, topcoat
41nm dense
ASML XT:1700i1.2 NA41nm, approaching 0.25k1
P82 – k1 0.25441nm dense
P84 – k1 0.26142nm dense
P86 – k1 0.26743nm dense
1.2NA, Y-pol, dipole X 35° s=0.98-0.89CPL – chromeless lines42nm barc, 120nm resist, topcoat
41nm dense
41nm, approaching 0.25k1
P82 – k1 0.25441nm dense
P84 – k1 0.26142nm dense
P86 – k1 0.26743nm dense
1.2NA, Y-pol, dipole X 35° s=0.98-0.89CPL – chromeless lines42nm barc, 120nm resist, topcoat
41nm dense
ASML XT:1700i1.2 NA41nm, approaching 0.25k1
P82 – k1 0.25441nm dense
P84 – k1 0.26142nm dense
P86 – k1 0.26743nm dense
1.2NA, Y-pol, dipole X 35° s=0.98-0.89CPL – chromeless lines42nm barc, 120nm resist, topcoat
41nm dense
41nm, approaching 0.25k1
P82 – k1 0.25441nm dense
P84 – k1 0.26142nm dense
P86 – k1 0.26743nm dense
1.2NA, Y-pol, dipole X 35° s=0.98-0.89CPL – chromeless lines42nm barc, 120nm resist, topcoat
41nm dense
ASML XT:1700i1.2 NA
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imec 2006 22
1520253035404550556065
0.75 0.85 0.95 1.05 1.15 1.25 1.35 1.45 1.55 1.65
NA
Hal
f Pitc
h (n
m) k1 < 0.27
k1 < 0.4
193nm immersion lithography Ultimate limits
• k1 as function of NA and half pitch (λ=193nm)
32nm half pitch limit requires 1.65 NA
32nm
45nm
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imec 2006 23
BS
Excimer laser
Prism
PC
D
WDS
Stages
Pol
Waveplate
Wafer
High index liquid testing on ASML Immersion Interference Printer
193nm immersion lithographyLiquids beyond water?
HIL stays between prism and wafer during stage motion
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imec 2006 24
193nm immersion lithographyOutlook high index liquids
25
30
35
40
45
50
3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0
Exposure dose (uncalibrated)
Line
CD
(nm
)Water (n=1.44) : 14.6 % EL
• Lithographic results 2nd generation fluids (n=1.65) :36nm HP
25
30
35
40
45
50
2.5 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5
Exposure dose (uncalibrated)
Line
CD
HIL (n=1.65) : 18 % EL
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imec 2006 25
2nd generation HI liquidsContact angle measurements
• Much lower surface tension : containment ?
H20
HI Liquid
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imec 2006 26
2nd generation HI liquidsInteraction HI liquid with resist (defect formation ?)
• Purpose: – apply droplets of the liquid on either an inert substrate or resist
surface in a controlled way
– Analyse what is left after drying (profilometry)
100 µm
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imec 2006 27
NA=1.65 requirements
Fluid recycling systemRadiation & contamination evaluation
Fluid containmentScanning tests & IH evaluation
High nf Fluid characterization (nf>1.9)Defectvity: Leaching & drying stains
High nf Resist developmentimaging characterization, defectivity
Optical systemHRI glass evaluation (nf > 1.8)
appl
icat
ion
imm
ersi
onsy
stem
lens
Can we use HI fluids?
Can we make the system?
Can we make the lens?
TIMING is most critical
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imec 2006 28
1520253035404550556065
0.75 0.85 0.95 1.05 1.15 1.25 1.35 1.45 1.55 1.65
NA
Hal
f Pitc
h (n
m) k1 < 0.27
k1 < 0.4
193nm immersion lithography Ultimate limits
• k1 as function of NA and half pitch (λ=193nm)
32nm
45nm
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imec 2006 29
Outline
• Introduction
• 193 nm immersion lithography
• EUV Lithography
• Double patterning
• Conclusions
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imec 2006 30
EUV LithographyCritical challenges
• 2005 International Symposium on EUVL
Top 3 Critical Issues 2004 Rank1. Resist resolution, sensitivity and LER 32. Collector lifetime 23. Availability of defect free masks 14. Source power
Remaining Critical Issues• Reticle protection during storage, handling and use• Projection and illuminator optics quality and lifetime
*** Significant concern: Timing and cost / business case for EUVLdevelopment.
Critical Technical Issues for EUV Lithography
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imec 2006 31
Experimental : Interference LithographyPaul Scherrer Institute (PSI), Switzerland
Mask:
2mask
waferPP =
beamlineExposure chamber
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imec 2006 32
EUV Resist progress40
nm
32.5
nm
30 n
m
2004 2005 2006
20 mJ/cm2 7.5 mJ/cm2 12.4 mJ/cm2
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imec 2006 33
AD-tool imaging results :40nm scanning H-lines/spaces ‘through focus’
-100 nm -50 nm near focus
+50 nm +100 nm
>200 nm DOF
Resist: MET-2D~18 mJ/cm2NA=0.25, σ=0.5no process optimization yet
40nm L/S
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imec 2006 34
AD-Tool imaging results :40nm scanning H-lines/spaces ‘through slit’
-10.6 mm -6.36 mm 0.0 mm 6.36 mm 10.6 mm
(22-May-’06)Full slit coverage
40nm L/S
Resist: MET-2D~18 mJ/cm2NA=0.25, σ=0.5no process optimization yet
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imec 2006 35
AD imaging results: 55 nm CH
55 nm CH
Resist: MET-2Dno process optimization
~40 mJ/cm2
NA=0.25, σ=0.5
Dense (aligned)
Dense (staggered)
Iso(aligned)
Iso(staggered)
All at same conditions:
- NA/Illumination/focus/dose
- Binary mask
- No OPC applied!
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imec 2006 36
1520253035404550556065
0.75 0.85 0.95 1.05 1.15 1.25 1.35 1.45 1.55 1.65
NA
Hal
f Pitc
h (n
m) k1 < 0.27
Double patterningOutlook
k1 = 0.4
k1 = 0.27
• k1 as function of NA and half pitch (λ=193nm)
20 0.25 0.30 0.350.2
EUVL
32nm
45nm
193 nm
22nm
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imec 2006 37
Outline
• Introduction
• 193 nm immersion lithography
• EUV Lithography
• Double patterning
• Conclusions
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imec 2006 38
Double patterning (2x litho + 2x etch)Possible integration flow
SiNitride HM
Resist
Int.Exposure 1
& development
Transfer tohardmask
Int.Int.
1nm alignment error -> 1nm CD change
Exposure 2
& development
Transfer tohardmask
k1=0.19
40 nm L&Setched in oxide
hard mask on poly-Si
ASML XT:14000.93 NA
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imec 2006 39
Design Split exercises NAND FLASHDouble Line for Poly
Annular 0.8/0.4Unpolarized
1.35NA
SPLIT + OPC PROCESS CHECKTARGET
min pitch 64nmk1=0.22 intuitive split
Cr - ImB
Cr - ImA
min pitch 128nmk1=0.44
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imec 2006 40
Design Split exercises NAND FLASHDouble Trench for Poly
Annular 0.85/0.55Unpolarized
1.35NA
PROCESS CHECKTARGET SPLIT + OPC
Cr - ImB
Cr - ImA
min pitch 128nmk1=0.44
min pitch 64nmk1=0.22
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imec 2006 41
Design Split exercises Logic NOR Double Line for Poly
Annular 0.8/0.4Unpolarized
1.35NA
TARGET SPLIT + OPC PROCESS CHECK
min pitch 90nmk1=0.31
Cr - ImB
Cr - ImA
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imec 2006 42
Design Split exercises Logic NOR Double Trench for Poly
Annular 0.8/0.4Unpolarized
1.35NA
TARGET SPLIT + OPC PROCESS CHECK
Cr - ImB
Cr - ImA
min pitch 90nmk1=0.31
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imec 2006 43
resist 48.7nm at 130nm pitchLER(3s) 3.1nm
HM etch&strip 38nm at 130nm pitchLER(3s) 5nm
resist+HM48.7nm at 130nm pitchLER(3s) 3.1nm
Si
Poly Si
BARCHM
Resist
Litho Etch/strip Litho Etch/strip
Double Line for PolyDP k1=0.14
/1250i – 193nm 0.85NA – Dipole DP 32nm 1:1
Poly32nm at 65nm pitch
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imec 2006 44
1520253035404550556065
0.75 0.85 0.95 1.05 1.15 1.25 1.35 1.45 1.55 1.65
NA
Hal
f Pitc
h (n
m)
Double patterningOutlook
k1 = 0.4
k1 = 0.20
k1 = 0.27
• k1 as function of NA and half pitch (λ=193nm)
20 0.25 0.30 0.350.2
EUVL
32nm
22nm
45nm
193 nm
Double patterning
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imec 2006 45
Double patterningOutlook
• Lowest risk route to 32nm half pitch in time
• But… worst in terms of CoO– Requires 2 critical masks per critical layer
– Reduces throughput (~ factor 2)
– Adds cost of second etch step
– Impacts total cycle time (additional photo, etch, …)
– Some integration approaches very critical for alignment
• Any development improving CoO issues is a plus for double patterning
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imec 2006 46
Outline
• Introduction
• 193 nm immersion lithography
• EUV Lithography
• Double patterning
• Conclusions
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imec 2006 47
Summary and conclusions
• Still 3 lithography options for 32nm half pitch critical levels
• Immersion lithography beyond water urgently needs a 3rd
generation fluid (n>1.8) to be identified• EUV lithography makes steady progress
– First ASML EUV alpha demo tools about ready to ship to the field
– EUV resist has become issue number one and requires a lot of focus
– EUVL is the solution for small contact holes !
• Double patterning is the lowest-risk route towards 32nm but CoO needs to be controlled
• Towards 22nm volume production, EUVL is the only option
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imec 2006 48
1520253035404550556065
0.75 0.85 0.95 1.05 1.15 1.25 1.35 1.45 1.55 1.65
NA
Hal
f Pitc
h (n
m)
Double patterningOutlook
k1 = 0.4
k1 = 0.20
k1 = 0.27
• k1 as function of NA and half pitch (λ=193nm)
20 0.25 0.30 0.350.2
EUVL
32nm
22nm
45nm
193 nm
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imec 2006 49
Aknowledgements
LamRESEARCH
Equi
pmen
tSu
pplie
rsM
ater
ial S
uppl
iers
Softw
are
Supp
liers
Mas
k sh
ops
The world’s largest 193nm immersion lithography effort
STMicroelectronicsSTMicroelectronics
IC c
ompa
nies
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imec 2006 50
Thank you!