Microsoft Word - LIN-PCB LAYOUT-REPORT -0612.doc2. SOLDER SIDE()
4. TOP PAD PAD
5. BOTTOM PAD PAD
6. POSITIVE LAYER

9. ANTI-PAD NEGATIVE LAYER
10. THERMAL PAD NEGATIVE LAYER PAD

11. PAD () SMD PAD PAD TOP PADBOTTOM PAD
INNER PAD
13. Grid :
ICT LAYOUT :
1. 30-35mil 30mil.
PAD 40mil
3. PCB
4. (VIA)(Solder Side)
7. :Setup pads stacks
3. () -for SMD:
PICK & PLACE SMD
1.
SOLDER MASK TRACE SILK SCREEN VIA

PIN IC pin1 1.0mm
PAD SOLDER MASK 3.0mm SOLDER MASK
* 100 %Test Point
DOT 1.0mm
Solder Mask 3.0mm

5

4. SMD DOT 5.0mm
5.1. PCB V-CUT (RJ45), 8mm V-CUT XY 5‚5mm
4mm
5.2. pcb RJ45 XY 5‚5mm
4. (LABEL ING)
PCB “R Logo TOP Label ”
pcb SILK SCREEN
PCB
5. VIA HOLE PAD
6. PCB Layer

CONNECTOR )…
4.
10mil 20mi 30mil 4
12mil 24mil 32mil 2
14mil 26mil 32mil GND Via(all pcb)
Layer D efinitio n 1 S ignal 2 V C C 3 G N D 4 Signal
L ayer D efin it io n 1 S ig na l 2 G N D 3 V C C 4 S ig na l
6
7. a. PAD 4MM,( 3MM)
b. SMD DIP PAD 3MM()
c.H4 RJ-45 , X=5 ,Y =5MM,
d.RJ-45 7MM
2. : Draftin Icon Boardoutline
3. :
5. :,,
Import no error
7.
: Setup layer Definition
9.,
,,
:
7
4
Microstrip : Trace Microstrip Component size solder
size Trace
Microstrip& Stripline

VCC GND Plan ,
: 2 Plane AGND DGND()Clock trace AGND
DGND
Trace
3-W5mils(W)TraceSpace
10mils(2W)2Crosstalk(
CLK)3-WCrosstalkGND
Damping : source Damping
clock signals Damping resistor source
()
RJ45 Transformer 20mils Differential pair Trace
Transformer To PHY : Differential pair Trace PHY
Transformer Termination resister49.9Ω&0.01uf giga port
PHY pin 10/100port Source RX+ -
Termination resister Transformer TX+ - Termination
resister PHY Differential pair Trace GND
3-W
PX3_6
36
G
P3_TD2N3
P3_TD0N3
PX3_7
9
64
VCT1
MVCT1
; Return Path

CLK Trace Vcc Plane
15. OSC & CRYSTAL Guideline
13 15 17
19 GND VCC
4 6 8
1 GND VCC
OSCLayout:60-80mils
17. General Guidelines –Decoupling Capacitor
Power : IC Power Power IC VCC Gnd pin
Decoupling : IC VCC pin Decoupling
. Decoupling IC
_
10-20 mils 1 40 mils.
.Power Trace Power Drop
.Vref
. chips PLL power L /C Filter power
L/C filter chips /
power plane
L /C Filter
power , power swithing
PWM power MOS, ground pin via hole
power-in connector(or dc-jack), ground power
PWM power output output ,power trace ,
via power plane,,, via ,
PWM power outputfeedback,(1%),output
power ground plane via hole plane ,,
,
ground plane power plane
, via, gnd via
.

IC FB Trace 15-20 mils Vcc Plan
:
Trace 1.2pin 1.2pin

17
()
Vcc Plan Vcc Via 6-12 Vcc Plan
()
Plan Thermal():
19. GND & Vcc Plan
RJ45 TO Transformer: Transformer& GND CHASSIS&GND SINGLE
MOAT80-120milGAPEMIBEAD
Differential
20. DRC : Design Rule Check :
Trace width PCB “”“”,“”

Via to trace space pad to outline space
Via to via space trace to trace space
PCB


*

20
PCB PCB,
2. Solder Mask (Top / Bottom) pad pad 4mil
3. Paste Mask (Top / Bottom)SMD ,pad pad
4. Silkscreen (Top / Bottom)
5. Drill Drawing
6. NC Drill
CAM350 Import Gerber , Solder Mask Bottom pcb
pin1 ,, Export Gerber ,


,()
21
PIN PIN ( PIN)
2. TEST POINT: PCB ,, GERBER TEST POINT
, , ICT
1.5mm 1.5mm
23
2. : FR-4
,
5. PCB :””or””

6. u ,: 96.5% 3.5% 0.5%,
1~3u or 3~5u
7. :,,
10.Via hole :
11.PCB Logo UL Type PCB and
12.~~~~, PCB
13.:: or , CNC Routing
14.
10%
,10%,,PCB
,,,,


19.,