lga sensor packages. - sensitec gmbh · 2019. 5. 20. · (lga) packages. there are various...

For SMD Mounting of FreePitch and FixPitch Sensors.

LGA Sensor Packages.

Winner of the Innovation Prize 2013 & 2016 in Rhineland- Palatinate!

LGA SENSOR PACKAGES.

Simply robust, smart and flexible.

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LGA6SChip type Sensor type Information

LGA6S

Dimensions in mm3.0 x 2.6 x 1.5

AA745 FreePitch

AL798 FixPitch

GF705 Field sensor

GF708 Reference sensor

LGA6BChip type Sensor type Information

LGA6B


TA903 FreePitch

LGA6LChip type Sensor type Information

LGA6L


AA746 FreePitch

AL794 FixPitch, high resistance

AL795 FixPitch

AL796 FixPitch

AL797 FixPitch

AL780 FixPitch

LGA8Chip type Sensor type Information

LGA8


AFF756 Field sensor

Dimensions of the LGA Family.

Advantages and Benefits.

Packages.

Technical Data.Parameter Value Unit

Supply voltage (typical) 5 V

Ambient temperature range -40 .... +125 °C

Moisture sensitivity level (MSL) 2 -

Delivery form Tape & Reel -

Delivery batch size LGA6S, LGA6L & LGA6B 2500 pcs.

Delivery batch size LGA8 5000 pcs.The data given in the table are characteristic values. Datasheets with complete technical specifications can be found at www.sensitec.com.

LGA6S

Markerr = Sensor typeP = Production weekD = Production year

Length (L): 3.0 mm Width (B): 2.6 mmHeight (H): 1.5 mm

LGA6L

Markerd = Sensor typeH = Production weekE = Production year


LGA6B



LGA8



• Deliverable in production packaging (Tape & Reel) » Fully automatic SMD assembly possible

• Sensor modules with extended functionality integrated in only one housing » Extremely flexible

• Flexible package technology » Customized solutions possible

• Very small and compact size » Small footprint on the PCB

• Broad temperature range » Usable even under extreme operating conditions

• Identical pin-out (LGA6S / LGA6L) » Different sensor types (e.g. 2 mm and 5 mm)

can be used with one main PCB

• Sensor element completely enclosed » Even more robust and mechanically protected

LGA6L

Identical pin-out

LGA6S

H

B

L

www.sensitec.com

C

B

A

D

E

F

Zeichnungsnr.

Benennung

Maßstab

NameDatumÄnderung

allgemeingültige Werkstückkantenallgemeingültige Oberflächezul. Abweichungen

Blatt

Bl.

Werkstoff, Halbzeug

Zwischenerzeugnis

Datum Name

Bearb.

Gepr.

Norm

Änd.Z.

Copyright by Sensitec

41 32

Kurzzeichen

Confidential

Länge : 3mmBreite : 3mmHöhe : 1,4 mm

LGA8

DIN ISO2768 T1-m

5:1

H

B

L

www.sensitec.com

C

B

A

D

E

F

Zeichnungsnr.

Benennung

Maßstab

NameDatumÄnderung


Blatt

Bl.

Werkstoff, Halbzeug

Zwischenerzeugnis

Datum Name

Bearb.

Gepr.

Norm

Änd.Z.


41 32

Kurzzeichen

Confidential


LGA8

DIN ISO2768 T1-m

5:1

H

B

L

www.sensitec.com

C

B

A

D

E

F

Zeichnungsnr.

Benennung

Maßstab

NameDatumÄnderung


Blatt

Bl.

Werkstoff, Halbzeug

Zwischenerzeugnis

Datum Name

Bearb.

Gepr.

Norm

Änd.Z.


41 32

Kurzzeichen

Confidential


LGA8

DIN ISO2768 T1-m

5:1

www.sensitec.com

C

B

A

D

E

F

Zeichnungsnr.

Benennung

Maßstab

NameDatumÄnderung


Blatt

Bl.

Werkstoff, Halbzeug

Zwischenerzeugnis

Datum Name

Bearb.

Gepr.

Norm

Änd.Z.


41 32

Kurzzeichen

Confidential

L

B

H

Länge : 3,0mmBreite : 2,6mmHöhe : 1,4 mm

LGA6 S

DIN ISO2768 T1-m

5:1

www.sensitec.com

C

B

A

D

E

F

Zeichnungsnr.

Benennung

Maßstab

NameDatumÄnderung


Blatt

Bl.

Werkstoff, Halbzeug

Zwischenerzeugnis

Datum Name

Bearb.

Gepr.

Norm

Änd.Z.


41 32

Kurzzeichen

Confidential

L

B

H


LGA6 S

DIN ISO2768 T1-m

5:1

www.sensitec.com

C

B

A

D

E

F

Zeichnungsnr.

Benennung

Maßstab

NameDatumÄnderung


Blatt

Bl.

Werkstoff, Halbzeug

Zwischenerzeugnis

Datum Name

Bearb.

Gepr.

Norm

Änd.Z.


41 32

Kurzzeichen

Confidential

L

B

H


LGA6 S

DIN ISO2768 T1-m

5:1

B

LGA6 L

DIN ISO2768 T1-m

5:1

H

www.sensitec.com

C

B

A

D

E

F

Zeichnungsnr.

Benennung

Maßstab

NameDatumÄnderung


Blatt

Bl.

Werkstoff, Halbzeug

Zwischenerzeugnis

Datum Name

Bearb.

Gepr.

Norm

Änd.Z.


41 32

Kurzzeichen

Confidential


L

B

LGA6 L

DIN ISO2768 T1-m

5:1

H

www.sensitec.com

C

B

A

D

E

F

Zeichnungsnr.

Benennung

Maßstab

NameDatumÄnderung


Blatt

Bl.

Werkstoff, Halbzeug

Zwischenerzeugnis

Datum Name

Bearb.

Gepr.

Norm

Änd.Z.


41 32

Kurzzeichen

Confidential


L

BLGA6 L

DIN ISO2768 T1-m

5:1

H

www.sensitec.com

C

B

A

D

E

F

Zeichnungsnr.

Benennung

Maßstab

NameDatumÄnderung


Blatt

Bl.

Werkstoff, Halbzeug

Zwischenerzeugnis

Datum Name

Bearb.

Gepr.

Norm

Änd.Z.


41 32

Kurzzeichen

Confidential


L

H

L

B

LGA Sensor Packages for SMD Assembly. The new, extremely compact packages for SMD assembly combine simple handling with high robustness. The magnetoresistive MR sensor chips are completely enclosed and the packages allow operation up to 125 °C. An integrated redistribution of the internal connections means that all the sensors in LGA6L/S housing have identical pin-out, so avoiding the need for different PCB layouts for different sensors in one family.

The requirements for packages for MR sensors are complex and demanding. In a nationally-fun-ded R & D project Sensitec has developed a new package family to fulfill the following demands:

• The package has to protect the sensor chip from mechanical and chemical influences.

• The complete module, comprising material, assembly and packaging technology, as well the sensor chip must be extremely reliable.

• No magnetic materials should be used in the package, to avoid affecting the performance of the MR sensor chip.

• Materials should be used that minimize thermal stresses as far as possible.

• The package should be cost-effective to ensure a good price-performance ratio.

• The dimensions should be as small as possible to provide adequate protection, yet allow a high component density on the PCB.

The result is a family of very small Land Grid Array (LGA) packages. There are various different sizes to cover a wide range of MR sensor chips. Those MR sensors for angle, length and magnetic field measurement, which are typically mounted at the edge of the PCB, are available in three package sizes: LGA6S, LGA6B and LGA6L. The distance from the active edge of the sensor chip to the outside edge of the pack-age has been kept to a minimum, to avoid any significant loss in the permissible air gap between sensor and magnetic scale.

Since different chip types can be integrated in one package variant, the pin-out of the LGA6L/S packaged sensors is the same thanks to internal rewiring. The footprint for LGA6S and LGA6L is also identical, eleminating the need for different PCB layouts for each sensor type.

All variants are possible and can be realized as customized solution upon request.

www.sensitec.com

Sensitec GmbHGeorg-Ohm-Str. 1135633 Lahnau · GermanyTel.: +49 6441 9788-0Fax: +49 6441 9788-17E-Mail: [email protected]

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lga sensor packages. - sensitec gmbh · 2019. 5. 20. · (lga) packages. there are various...

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