lg t385 service manual

Internal Use Only

Service ManualLG-T385

Date: March, 2012 / Issue 1.0

- � -LGE Internal Use Only Copyright © �01� LG Electronics. Inc. All right reserved.Only for training and service purposes

Table Of Contents

1. INTRODUCTION ................................................................... 3

1.1 Purpose .....................................................................................................3

1.� Regulatory Information ......................................................................3

1.3 Abbreviations..........................................................................................5

2. PERFORMANCE .................................................................... 7

�.1 H/W Features ...........................................................................................7

�.� Technical Specification ........................................................................9

3. TECHNICAL BRIEF ..............................................................14

3.1 Digital Main Processor ...................................................................... 14

3.� Power Management ......................................................................... 19

3.3 FEM with integrated Power Amplifier Module (SKY77550-

�1, U101) ....................................................................................................... 33

3.4 Crystal(�6 MHz, X�01) ...................................................................... 35

3.5 RF Subsystem of PMB8815 (U�01) .............................................. 36

3.6 MEMORY(H9DA�GH1GHMMMR, U301 ) .................................. 41

3.7 BT module ............................................................................................. 44

3.8 SIM Card Interface .............................................................................. 46

3.9 LCD Interface ........................................................................................ 47

3.10 MiniABB (Battery Charger & MUIC) Interface ....................... 50

3.11 Audio Interface ................................................................................ 51

3.1� Camera Interface(�M Fixed Focus Camera) .......................... 57

3.13 Touch Interface ................................................................................. 60

4. TROUBLE SHOOTING ........................................................62

4.1 RF Component .................................................................................... 6�

4.� RX Trouble ............................................................................................. 63

4.3 Power On Trouble ............................................................................... 68

4.4 Charging Trouble ................................................................................ 70

4.5 Vibrator Trouble .................................................................................. 7�

4.6 LCD Trouble .......................................................................................... 75

4.7 Camera Trouble ................................................................................... 79

4.8 Speaker / Receiver Trouble ............................................................. 83

4.9 Earphone Trouble ............................................................................... 85

4.10 Microphone Trouble ....................................................................... 88

4.11 SIM Card Interface Trouble ........................................................... 90

4.1� Micro SD (uSD) Trouble ................................................................. 9�

4.13 Bluetooth Trouble ............................................................................ 94

4.14 WiFi Trouble ........................................................................................ 96

4.15 FM Radio Trouble ............................................................................. 99

4.16 Touch trouble ..................................................................................101

4.17 Memory trouble .............................................................................103

4.18 Proximity Sensor on/off Trouble Shooting ..........................107

5. DOWNLOAD .....................................................................109

6. BLOCK DIAGRAM .............................................................122

7. CIRCUIT DIAGRAM ..........................................................123

8. BGA PIN MAP ..................................................................131

9. PCB LAYOUT .....................................................................133

10. ENGINEERING MODE ....................................................135

11. STAND ALONE TEST ......................................................136

11.1 Introduction .....................................................................................136

11.� Setting Method ..............................................................................136

11.3 Tx Test .................................................................................................138

11.4 Rx Test .................................................................................................139

12.AUTO CALIBRATION .......................................................141

1�.1 Overview ...........................................................................................141

1�.� Tachyon Directory ..........................................................................14�

1�.3 Test Equipment Setup ..................................................................14�

1�.4 Procedure ..........................................................................................14�

1�.5 AGC ......................................................................................................149

1�.6 APC ......................................................................................................149

1�.7 ADC ......................................................................................................149

1�.8 Target Power ....................................................................................149

13. EXPLODED VIEW & REPLACEMENT PART LIST ..........150

13.1 EXPLODED VIEW .............................................................................150

13.� Replacement Parts ........................................................................151

13.3 Accessory ..........................................................................................171

1. INTRODUCTION

- 3 -LGE Internal Use Only Copyright © �01� LG Electronics. Inc. All right reserved.Only for training and service purposes

1. INTRODUCTION

1.1 PurposeThis manual provides the information necessary to repair, calibration, description and download the features of

1. INTRODUCTION

This manual provides the information necessary to repair, calibration, description and download the features of this model.

1.2 Regulatory InformationA. Security

Toll fraud the unauthorized use of telecommunications system by an unauthorized part (for example personsToll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to itit.

The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair canharm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the this phone or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note e use ay ot a e a y c a ges a d/o epa s e pect as spec ca y oted t s a ua . e e o e, otethat unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.


1. INTRODUCTION

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory

2. INTRODUCTION

p g g q y y g y

agencies. In accordance with these agencies, you may be required to provide information such as the following to

the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from

unsuppressed engines or electric motors may cause problemsunsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated

by the sign. Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system

boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat

which is also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective

package as described.

1. INTRODUCTION


1.3 Abbreviations

F th f thi l f ll i bb i ti l

1. INTRODUCTION

For the purposes of this manual, following abbreviations apply:

Bit Error RatioBER

BasebandBB

Automatic Power ControlAPC

Digital Signal ProcessingDSP

dB relative to 1 milli wattdBm

Digital Communication SystemDCS

Digital to Analog ConverterDAC

Constant Current – Constant VoltageCC-CV

Gaussian Minimum Shift KeyingGMSK

Flexible Printed Circuit BoardFPCB

Electrostatic DischargeESD

Electrical Erasable Programmable Read-Only MemoryEEPROM

Digital Signal ProcessingDSP

Intermediate FrequencyIF

International Portable User IdentityIPUI

Global System for Mobile CommunicationsGSM

General Purpose Interface BusGPIB

y g

Off t Ph L k d LOPLL

Light Emitting DiodeLED

Low Drop OutputLDO

Liquid Crystal DisplayLCD

q y

Offset Phase Locked LoopOPLL


1. INTRODUCTION

Power Amplifier ModulePAM

1. INTRODUCTION

Public Switched Telephone NetworkPSTN

Phase Locked LoopPLL

Programmable Gain AmplifierPGA

Printed Circuit BoardPCB

Real Time ClockRTC

Root Mean SquareRMS

Receiving Loudness RatingRLR

Radio FrequencyRF

Sending Loudness RatingSLR

Subscriber Identity ModuleSIM

Surface Acoustic WaveSAW

Real Time ClockRTC

Travel AdapterTA

Side Tone Masking RatingSTMR

Pseudo SRAMPSRAM

Static Random Access MemorySRAM

Voltage Controlled OscillatorVCO

Universal Asynchronous Receiver/TransmitterUART

Time Division Multiple AccessTDMA

Time Division DuplexTDD

Wireless Application ProtocolWAP

Voltage Control Temperature Compensated Crystal OscillatorVCTCXO

2. PERFORMANCE


2. PERFORMANCE

2.1 H/W Features

2. SYSTEM SPECIFICATION

Item Feature Comment

Standard Battery Lithium-Ion, 3.7V 950mAh

Stand by TIME Up to 500 hrs : Paging Period 5, RSSI 85dBm

Talk time Up to 5hrs : GSM Tx Level 7Talk time Up to 5hrs : GSM Tx Level 7

Stand by time Up to 500 hours (Paging Period: 5, RSSI: -85 dBm)

Charging time Approx 3hours

RX Sensitivity GSM, EGSM: -109dBm, DCS: -109dBm

GSM EGSM: 32 5dBm(Level 5)TX output power GSM, EGSM: 32.5dBm(Level 5), DCS , PCS: 29.5dBm(Level 0)

SIM card type 3V / 1.8V

Display MAIN : 2.8” TFT 240 320 pixel 262K Color

GPRS compatibility Class 12

Status Indicator Send Key, End Key, Cancel Key, Volume Up/Down Key, PWR(Lock) Key,

ANT Internal

EAR Phone Jack Yes (3.5Φ)

PC Synchronization Yes

Speech coding EFR/FR/HR

Data and Fax Yes

Vibrator Yes

Loud Speaker Yes

Voice Recoding Yes

Microphone Yes


2. PERFORMANCE


S k /R i 18 12Φ S k / R i

Item Feature Comment

Travel Adapter Yes

Speaker/Receiver 18x12Φ Speaker/ Receiver

MIDI SW MIDI (Mono SPK)

Camera 2.0M FF

Bluetooth / FM Radio Bluetooth version 2.1 / Wired FM radio (Earphone needed)

2. PERFORMANCE


2.2 Technical SpecificationItem Description Specification


1 Frequency Band

GSM850 EGSMTX: 824 ~ 849 MHz TX: 880 ~ 915MHz

RX: 869 ~ 894 MHz RX: 925 ~ 960 MHz DCS

TX: 1710 ~ 1785 MHzRX: 1805 ~ 1880 MHz

PCSTX: 1850 ~ 1910 MHzRX: 1930 ~ 1990 MHz

2 Phase Error RMS < 5 degreesPeak < 20 degrees

3 Frequency Error < 0.1 ppm

Level Power Toler. Level Power Toler.

GSM850/EGSM


6 31dBm 3dB 14 15dBm 3dB





4 Power Level



12 19dBm 3dB


DCS/PCS










2. PERFORMANCE

Item Description Specification


Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

GSM850/ EGSM

400 -60

600~ <1,200 -60

1,200~ <1,800 -60

1,800~ <3,000 -63

3,000~ <6,000 -65

6 000 715 Output RF Spectrum

(due to modulation)6,000 -71

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

DCS/PCS

250 -33

400 -60

600~ <1,200 -60

1,200~ <1,800 -60

1,800~ <3,000 -65

3,000~ <6,000 -653,000 <6,000 65

6,000 -73

6Output RF Spectrum(due to switching transient)

GSM850/ EGSM

Offset from Carrier (kHz). Max. dBm

400 -19

600 21transient) 600 -21

1,200 -21

1,800 -24

2. PERFORMANCE




6Output RF Spectrum(due to switching transient)

Offset from Carrier (kHz). Max. dBm

400 -22

600 -24

1,200 -24

DCS/PCS

,

1,800 -27

7 Spurious Emissions Conduction, Emission Status

8 Bit Error Ratio

GSM850, EGSMBER (Class II) < 2.439% @-102 dBmDCS,PCSBER (Cl II) 2 439% 100 dBBER (Class II) < 2.439% @-100 dBm

9 RX Level Report Accuracy 3 dB

10 SLR 12 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 --12

11 Sending Response

300 -12

1,000 -6

2,000 -6

3,000 -6

200 -

0

0

4

4

0

4,000 -

3,400 -9

0

4

12 RLR 4 3 dB

- 1� -LGE Internal Use Only Copyright © �01� LG Electronics. Inc. All right reserved.Only for training and service purposes

2. PERFORMANCE


Frequency (Hz) Max (dB) Min (dB)


13 Receiving Response

300 -7

500 -5

1,000 -5


100 -

200 -

2

*

0

-12

0

g p ,

3,000 -5

4,000

3,400 -10

2

2

2

* Mean that Adopt a straight line in between 300 Hzand 1,000 Hz to be Max. level in the range.

14 STMR > 17 dB

15 Stability Margin > 6 dB

dB to ARL (dB) Level Ratio (dB)

-35

-30

17.5

22.5

-20

-10

0

7

10

30.7

33.3

33.7

31.7

25.5

16 Distortion

17 Side Tone Distortion Three stage distortion < 10%

18 System frequency (13 MHz) tolerance ≤ 2.5 ppm

19 32.768KHz tolerance ≤ 30 ppm

20 Ringer VolumeAt least 55 dBspl under below conditions:1. Ringer set as ringer.2. Test distance set as 1 m

dB to ARL (dB) Level Ratio (dB)


2. PERFORMANCE




Fast Charge : Typ 400 mA

21 Charge Current

Fast Charge : Typ. 400 mA

Slow Charge : Typ. 95mA

Total Charging Time : < 3.5 hours

Bar Number Power

7

7 > 5

Over -92

93 2

2 -> 1

4 -> 2

-104 2

-98 2

-101 222 Antenna Display

7 -> 5

5 -> 4

-93 2

1 -> 0 -106 2

0 -> OFF Under -106

Battery icon color : Green Red

Battery Bar Status Percent (%)

Full (16 level)

Decrease gradually 94~10%23 Battery Indicator

≥ 94%

≤10%Battery icon color : Green Red

Empty( 0 level )

24 Low Voltage Warning( Blinking Bar)

10%, 5% 2times (standby) – Speaker

≤ 10% at every 1min. (call) - Receiver

25 Forced shut down 0% ( about 3 35V)

≤10%

≤ 2%

25 Voltage 0% ( about 3.35V)

27 Battery Type

Lithium-Ion BatteryStandard Voltage = 3.7 VBattery full charge voltage = 4.2 VCapacity: 950mAh

Switching mode charger

26 Sustain RTC without battery Over 2 hours

28 Travel ChargerSwitching-mode chargerInput: 100 ~ 240V, 50/60 HzOutput: 4.8V, 400mA

80mA

93~10%

Battery Bar Status Percent (%)


3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

FM- radio

Digital -Microphone

ARM1176

RAM ROMcache

ExternalMemory-IF

USIF

MeasurementIF ( A/D)SD/ MMC SIM

GSM

TEAKLite

RFControl

GSMCipher

GPTU

I² S / DAI

IR - Memory

Loud -speaker

MicSupplygeneration

HSR

HSL

EPP

EPN

LSP

LSN

MICP1

MICN1

MICP2

MICN2

Mic MUX

VMIC

VUMIC

16 Ohm100 mW

8 Ohm700 mW

2x 16 Ohm2x 30 mW

Stereo Headset

Earpiece

Charge Pump ( negative voltage for bipolar audio out )

VMMC

VANALPMU

VUSB

LAUX

ChargeDC/ DC Buck

Vibrator

64 - bit bus 32 - bit bus

IF

GMSKDAC

SDPLL

FEM

32 kHzXO

DSPADC

PA

cs iM

Low -Power DCXO

RF PMU

USB 2.0FS

CIF

DCC

Keypad

4k 7

0 . 15 5 %

1.8V ~2 .5V

VCHARGE 4. 5 V … 20V

2 TA

B V

N ESN

ES

PES N

ES SC C

SB

GH

CD

D V

TN

HSV

BC 847 S

1 2

6

453

for exampleZXTP 25020

min.10 µF

( 0 V ) 3 .05 V … 5 .1 V (6 V)

002

>ef

h

T 1

Am

5.1 .xa

m

7.5 µA

135 mV … 600mV

GH

CV

4 k3

127 k470

1.0V… 1,8V

Vcore

LRTC

LSIM

Back -light

LDO blocking caps, 100nF

DC/ DC

Battery Charger

3.1 Digital Main Processor

Figure. 3.1.1 X-Gold tm 215 Hardware Block Diagram

3. TECHNICAL BRIEF


3. TECHNICAL BRIEF

3.1.1 General

• Technology:• Technology:– SoC, Monolithic, 65 nm CMOS• Package:– eWLB, 8x9 x0.8 mm– 0.5 mm pitch– 240 balls / 6-layer PCB

3 1 2 RF Transceiver3.1.2 RF Transceiver

• Dual-band direct conversion receiver• Tri/Quad-band possible with external circuitry• Fully integrated digital controlled X0• Additional buffer for 2 external system clocks• Fully digital RF-Synthesizer incl. ΣΔ-Transmitter

3.1.3 Baseband

• DSP:– 156 MHz TeakLite™

• MCU:ARM1176® @ 208 MHz– ARM1176 @ 208 MHz

• MCU RAM:– 3.00Mbit

• Memory I/F:– 1 Gbit NOR flash/OneNAND flash/SDR SDRAM – 4 Gbit NAND flash/DDR SDRAM

• Modem:GPRS l 12 (RX/TX CS1 CS4)– GPRS class 12, (RX/TX CS1-CS4)

– EGPRS class 12, (RX MCS1-MCS9, TX MCS1-MCS4)• Cipher Units:– A51/2/3– GEA-1/2/3• Security:– OMTP TR0– Secure Boot– RSA(ROM)/SHA-1(HW accel.)– OCDS disabling– Certificate Management

• DSP:

– 178 MHz TeakLite™

• MCU:

– ARM1176® @ �08 MHz

• MCU RAM:

– 3.00Mbit

• Memory I/F:

– 1 Gbit NOR flash/OneNAND flash/SDR SDRAM

– 4 Gbit NAND flash/DDR SDRAM

• Modem:

– GPRS class 1�, (RX/TX CS1-CS4)

– EGPRS class 1�, (RX MCS1-MCS9, TX MCS1-MCS4)

• Cipher Units:

– A51/�/3

– GEA-1/�/3

• Security:

– OMTP TR0

– Secure Boot

– RSA(ROM)/SHA-1(HW accel.)

– OCDS disabling

– Certificate Management


3. TECHNICAL BRIEF

3. TECHNICAL BRIEF• Speech Codec:– FR / HR / EFR / NB-AMR• Audio Codec (running on ARM1176):g– SP-MIDI– SB-ADPCM– MP3– WB-AMR– AAC/AAC+/eAAC+• Others:– DARP (SAIC)DARP (SAIC)– TTY• Customization:– E-Fuses

3.1.4 External Memory

• External Bus Unit External Bus Unit– 16-bit address bus – 16-bit address/data muxed bus – 1.8V support• Flash / RAM– NOR Type– NAND Type (1 bit ECC supported)

Parallel Flash / Cellular RAM(Page & Burst Mode)– Parallel Flash / Cellular RAM(Page & Burst Mode) - 16-bit AD-multiplexed - 16-bit AAD-multiplexed

– iNAND Type e.g. oneNAND– SDRAM

- DDR SDRAM : up to 4 Gbit- SDR SDRAM : up to 1 Gbit

M d• Memory card– SD/MMC card interface with 1 or 4 data lines

3.1.5 Connectivity

• 3xUSIF (configurable either as SPI or UART), I2C, I2S; Interfaces @ 1.8V• Direct (U)SIM 1.8/3V

f• USB2.0 up to 480 Mbit/s (High Speed) w/ external USB Phy over ULPI interface• Stereo Headset (Amplifier integrated)• 3 external analog measurement PIN’s• Bluetooth

3. TECHNICAL BRIEF


3. TECHNICAL BRIEF

3.1.6 Mixed Signal

• Improved audio performance• Improved audio performance• Loudspeaker Audio Class D Amplifier, 700 mW@8 Ω mono for hands-free and ringing• Stereo Headset 2x30 mW@16 Ω w/o coupling C• Mono Earpiece 100 mW@16 Ω• Digital microphone supported• Differential microphone inputs

3.1.7 FM Radio

• Integrated FM radio– FM Stereo RDS Receiver– Sensitivity 2 μV EMF– Support for US & EU bands– Stereo recording

3.1.8 Power Management

• Direct-to-Battery Connection– LDOs (incl. capless)– DC/DC step-down converter– DC/DC step-up for white LED supply• Battery Type– Li-Polymer• Charging control– Battery temperature– Watchdog protection– Start-up on flat battery• External Charger– Switch mode• USB battery charging– USB charging spec 1.0 compliant• Backlight– Up to 4 serial white LEDs (integrated LDO)p ( g )


3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

3.1.9 Main LCD Display

Type• Type– 240*320, QVGA, 262k color (parallel)• Interface– Parallel 8/9bit MIPI-DBI Type B– Serial MIPI-DBI Type C – Interf. voltage at 1.8V or 2.8V • gRacr - Display Controller (Hardware)

30 f Di l d i h DMA ( 60 f ) (f ll i l)– 30 fps Display update without DMA (up to 60 fps) (full or partial)– Video post processing Scaling, Rotation (90 steps), Mirroring– Overlay with alpha blending– Color conversion YUV -> RGB– 2D vector graphics (Lines, filled rectangles, Bit block transfer (e.g. sprites, scrolling, antialiased bitmapfonts)

3 1 10 C3.1.10 Camera

• 2 Mpx YUV parallel interface • HW JPEG encoder (39 Mpx/sec) • 39 MHz Pixel Rate • 15 fps@ 2 Mpx full resolution

3.1.11 Video Capabilities

• Video Decoding MPEG-4/H.263– QCIF@30 fps– QVGA@15fps• Video Encoding MPEG-4/H.263– QCIF@15 fps

3.1.12 Audio Capabilities

• Polyphonic ring tones– 64 voices MIDI, SP-MIDI– FM synthesizer• AMR-WB• True ring tones (MP3)• MP3, eAAC+• G.722 SB-ADPCM encoding/decoding

3.1.10 Camera

• 3 Mpx YUV parallel interface

• HW JPEG encoder (39 Mpx/sec)

• 39 MHz Pixel Rate

• 15 fps@ 3 Mpx full resolution

3. TECHNICAL BRIEF

3.1.9 Main LCD Display

Type• Type– 240*320, QVGA, 262k color (parallel)• Interface– Parallel 8/9bit MIPI-DBI Type B– Serial MIPI-DBI Type C – Interf. voltage at 1.8V or 2.8V • gRacr - Display Controller (Hardware)

30 f Di l d i h DMA ( 60 f ) (f ll i l)– 30 fps Display update without DMA (up to 60 fps) (full or partial)– Video post processing Scaling, Rotation (90 steps), Mirroring– Overlay with alpha blending– Color conversion YUV -> RGB– 2D vector graphics (Lines, filled rectangles, Bit block transfer (e.g. sprites, scrolling, antialiased bitmapfonts)

3 1 10 C3.1.10 Camera

• 2 Mpx YUV parallel interface • HW JPEG encoder (39 Mpx/sec) • 39 MHz Pixel Rate • 15 fps@ 2 Mpx full resolution

3.1.11 Video Capabilities

• Video Decoding MPEG-4/H.263– QCIF@30 fps– QVGA@15fps• Video Encoding MPEG-4/H.263– QCIF@15 fps

3.1.12 Audio Capabilities

• Polyphonic ring tones– 64 voices MIDI, SP-MIDI– FM synthesizer• AMR-WB• True ring tones (MP3)• MP3, eAAC+• G.722 SB-ADPCM encoding/decoding

3. TECHNICAL BRIEF


3.2 Power Management

A mobile platform requires power supplies for different functions. These power supplies are generated in the

3. TECHNICAL BRIEF

integrated power management Unit (PMU). The PMU is designed to deliver the power for a typical standard phone.

Figure. 3-2-1 Block Figure of the PMU Modules X-Gold tm 215

DC/DC Step Down Converter for 1.8V (SD1)

The DC/DC converter generates a 1.8V supply rail. This voltage rail is used to supply main parts of the system,

like the digital core of the chip (via LDO LCORE), some parts of the mixed signal macro, parts of the RF macro and

the external memory if a 1.8V memory is used. The efficiency of the DC/DC converter is optimized for an average

load current of 100mA. That is the load current estimated for the GSM talk mode.

3.2 Power Management

A mobile platform requires power supplies for different functions. These power supplies are generated in the

3. TECHNICAL BRIEF

integrated power management Unit (PMU). The PMU is designed to deliver the power for a typical standard phone.

Figure. 3-2-1 Block Figure of the PMU Modules X-Gold tm 215

DC/DC Step Down Converter for 1.8V (SD1)

The DC/DC converter generates a 1.8V supply rail. This voltage rail is used to supply main parts of the system,

like the digital core of the chip (via LDO LCORE), some parts of the mixed signal macro, parts of the RF macro and

the external memory if a 1.8V memory is used. The efficiency of the DC/DC converter is optimized for an average

load current of 100mA. That is the load current estimated for the GSM talk mode.

- �0 -LGE Internal Use Only Copyright © �01� LG Electronics. Inc. All right reserved.Only for training and service purposes

3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

Linear voltage Regulators (low dropout) LDOs

The LDOs are used to generate the supply for the different supply domains not directly supplied out of the

DC/DC converter.

The VSIM output current is high enough to drive USB SIM cards.

LCORE

Th LCORE LDO id th VCORE l d f t f th di it l t f th hiThe LCORE LDO provides the VCORE supply used for most of the digital parts of the chip

LPMU

The LPMU provides VPMU sued for the PMU supply, e.g. for the startup state machine and analog parts like ADC,

sense amplifier etc.

LUSB

The LUSB LDO generates the supply for the USB transceiver (output driver and input). If no USB interface is

required, LUSB can be used as general purpose LDO.

LAUX

The LAUX generates VAUX. It is a general purpose LDO and can be used for different functions depending on the

phone application, e.g. for the display or Camera.

LMMC

The LMMC generates VMMC. It is a general purpose LDO and can be used e,g. for memory cards

LSIM

The LSIM LDO generates the VSIM supply for the SIM card and interface. It is designed to supply Standard SIM

cards.

Other LDOs

The RF module has implemented several LDO’s for different RF Power domain.

The mixed signal module has some LDO’s for the audio driver and microphone supply.

3. TECHNICAL BRIEF


3. TECHNICAL BRIEF

Table. 3-2-1 Power supply Domains (without RF)

- �� -LGE Internal Use Only Copyright © �01� LG Electronics. Inc. All right reserved.Only for training and service purposes

3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

3.2.1 Power on and startup

Analog startup Circuit

Because the POR circuit and the LPBG are directly connected to the battery, it is not possible to switch them

off. If the battery voltage exceed the power on reset threshold (2.5V), the power on reset is released, the LPMU

regulator and the LRTC voltage regulator are switched on. The LPMU regulator starts in its ultra-low power

dmode

The LPMU regulator generates a control signal (lpmu_OK) that enables the 50KHZ PMU oscillator. The output

clock of the oscillator is checked with a fully coded counter. A counter overflow releases the reset

(vpmu_rst_n) signal for the small PMU state-machine.

Small first digital State-Machine

The small PMU state-machine is always connected to VPMU After starting from reset the small startup state

machine enters the SYSTEM OFF state and only continuous the startup procedure if a switch on event like first

connect, on-key, wake up or charge detect occurs.

PMU-main State-Machine

The main PMU state-machine is always connected to VPMU also. The power up sequence driven by the PMU

state-machine can be seen in Figure18. After enabling the reference (HPGB) and waiting for the settling time,

the battery voltage is measured and compared with the power on threshold. If the battery voltage is high

enough, the SD1 DC/DC converter and the LCORE LDO are started. A timer ensures that the supply voltageenough, the SD1 DC/DC converter and the LCORE LDO are started. A timer ensures that the supply voltage

will be stable before the DCXO is enabled. The DCXO settling time is ensured using a fixed timer. After an

overflow of this timer, the reset is released for the rest of the system. The PMU state machine remains in this

System-ON state until the system is switched into the OFF state. For example the system sleep mode is

completely configured by software( for example switching off the LDO’s, switching of the DCXO etc.) and

controlled by the VCXO_enable signal. The reason for the startup is stored in the ResetSourceRead register.

Battery Measurement

3. TECHNICAL BRIEF


The ADC and the oscillator for the ADC needs the VDD_ADC supply voltage from the LADC LDO. LADC uses

either the charger voltage VDD_CHARGE or VDDRTC as input voltage. The input voltage is selected

3. TECHNICAL BRIEF

automatically by a bulk switch circuit. LADC, the ADC and the oscillator are enabled on request for every battery

measurement if the charger unit is not running. This is handled by an ADC control block in one of the state-

machines. If the charger unit is running the ADC is controlled by the charger state-machine

Figure.3.2.1 First Part of the State Machine, Running in Different Power Domains than the Second Part

The ADC and the oscillator for the ADC needs the VDD_ADC supply voltage from the LADC LDO. LADC useseither the charger voltage VDD_CHARGE or VDDRTC as input voltage. The input voltage is selectedautomatically by a bulk switch circuit. LADC, the ADC and the oscillator are enabled on request for every batterymeasurement if the charger unit is not running. This is handled by an ADC control block in one of the state-machines. If the charger unit is running the ADC is controlled by the charger state-machine

Figure.3.3.2 First Part of the State Machine, Running in Di�erent Power Domains than the Second Part

BAT low

all LDO’s o�PMU lpmu_pd=0

LPBG on

BAT OK

LRTC onoscillator on

LPMU-ULPM path on

50kHz OSC setting

wait for oscillator o.k.

PMU SM1 ON

start PMU SM1release reset of PMU SM1

PMU SM1 SYSOFF

VBAT < 2.5V-e

SYSTEM_OFF

smal

l dig

ital s

tate

mac

hine

inul

tra

low

pow

er L

PMU

dom

ain

anal

og c

ircui

t im

plem

enta

tion

VBAT < SYSOFF

VBAT > 2.5V

VBAT > 2.5VVPMU o.k.

VBAT > 2.5VLPMU o.k.

Oscillator o.k.

VBAT > 2.5VLPMU o.k.

Oscillator o.k.

ON key eventRTC alarm

charger delect�rst_connect

Figure.3.2.2 First Part of the State Machine, Running in Dierent Power Domains than the Second Part


3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

Figure 3.2.2 Second (Main) Part of the Startup State Machine in the VPMU Domain

ON key event orRTC alarm orcharger detect orrst connect

VPMU prepare

release reset_pmufsm_n_o

power reagion setting

SM1 ready

release reset_pmufsm_n_owait for system o

wait

SM1 goto SYSOFF

set reset_pmufsm_n_oswitch o PMU power region

LPMU to ULPM

sm1_goto_syso

reset_pmufsm_n_o

go to statePMU SM1 SYSOFF

HPBG onstart HPBG in fast settie mode

default trim valueLPMU low power mode

wait for HPBG timer (~�ms)

System SHUTDOWN

reset_pmu_n=0all LDOs o (not LRTC, LPMU)

HPBG o DCXO o

Check Batteryenble battery periodic

supervisionswitch HPBG to active mode > SYSONLEV or VBAT >

SYSONPRE if prechare

LCORE, SD1 startup

LDO, SD1 startup sequence

wait for timer (~400μs)

bit ALL OFF

DCXO startup

rf_sysclk_en

System ON

reset_pmu_n=1

wait for DCXO timer (16ms)

mai

n di

gita

l sta

te m

achi

ne o

f PM

Usm

all d

igita

l sta

te m

achi

ne in

ultr

a lo

wpo

wer

LPM

U d

omai

n

3. TECHNICAL BRIEF


3. TECHNICAL BRIEF

3.2.2 Switching on due to first connect

If the battery voltage is connected the first time that means the system enters the first time the SYSOFF stateIf the battery voltage is connected the first time, that means the system enters the first time the SYSOFF state,

this is stored in a first connect flag. If the first connect flag is set, the system will start immediately and not wait

for any other system on event in the SYSOFF state.

3.2.3 Switching on due to on-Key event

The on key is connected to the ONKEY pad. The ESD protection and the input structure of this pad are

connected to VRTC. If the ONKEY pad is forced to VRTC by an external key or similar circuit, the system starts.

The ONKEY is sampled with the PMU clock. It has to be sampled four times high before a valid on event is

generated. The status of the ON key can be read in the PMU registers, so it can be used as a functional key

during phone operation also

3.2.4 Switching on due to RTC alarm

The real time clock can generate a wakeup signal called RTC alarm. This signal is sampled from the state-

machine and after successfully detecting a high, the system is switched on.

3.2.5 Switching on due to charging

When a battery with a voltage below the SSONLEV level is inserted, the state machine will not start the system.

As long as the battery voltage stays lover than SYSONLEV the system will stay off. The only possibility to start

up the system is due to an external charger.

If an external charger is connected and detected and the battery is charged above the SYSONPRE voltage level

the system will start up.

The PMU main state machine waits in the Check battery state until the battery voltage condition is fulfilled. The

charger state machine provides the necessary pre-charge indication signal. This pre-charge signal is

denounced in a small counter to have a stable signal. This is important, especially in half/full-wave charging

where the charger detection is switching between charger detected/not detected according the AC supply

frequency. reasons


3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

For details on pre-charging see the charger chapter. The charger is controlled by an independent state

machine. The pre-charge signal is used to trigger the pre-charge signal is used to trigger the pre-charge

functionality. The charger state machine fully control the pre-charge, the PMU-state machine now changes to

state HPBG on state and the system starts. This state change is indicated to the charger state-machine to

enable the charger watchdog for safety

3.2.6 Power Supply Start-up sequence

In order to avoid an excessive drop on the battery voltage caused by in-rush current during system power-on,

possibly leading to system instability and “hick-ups” a staggered turn-on approach for the regulators is

implemented. The regulators are turned on in a well defined sequence, thus spreading the in-rush current

transients over time.

The IO’s of X-GOLD TM 215 are isolated in OFF mode (core supply is off). The isolation signal is controlled by

the PMU state machine. This ensures that the PADs are in a well defined state during core supply settling. This

allows to power up the LCORE core regulator and wait for the core to reach reset state before powering up the

I/O supply regulators.

3. TECHNICAL BRIEF


3. TECHNICAL BRIEF

Figure 3.2.3 Start Up Sequence (triggered by First Connect Event)

rf_sysclk_en

reset_pmu_n

pad_isolation_n

SystemOFF

SystemON

LCORE

SD1

check batterycontinue if battery voitage is ok.:

HPBG

reset_pmufsm_n_o

PMU_CLK

LPMU

VRTC

lpmu_pd

LPBG

VBAT

LPM (ES1)ULPM LPM

Batteryin

start upbecause of

first connectevent


3. TECHNICAL BRIEF3. TECHNICAL BRIEF

3.2.7 External Reset Handling

The chip reset can be controlled by an external RESET_N ball. If this ball is pulled low, the chip will be reset. All

PMU registers are reset during the external reset including LSIM control bits. The PMU statemachines are also

not reset from the external reset. An SW or watchdog reset will not reset the PMU registers. A SW and

Watchdog reset is seen on the reset n pad to allow the reset of external devices Basically there are three resetWatchdog reset is seen on the reset_n pad to allow the reset of external devices. Basically there are three reset

sources, first the reset signal controlled by the PMU (reset_pmu_n_o), second the reset signal controlled by the

SCU (resetout_o) and third the external reset (RESET_N). The SCU reset is triggered by SW (for example due to a

SW reset or watchdog reset). The PMU reset is controlled by the PMU state machine. The output of the reset

handling block is the reset_postscu_n_o signal. This signal controls for example the μC subsystem and releases

reset for the controller. During normal start up, the PMU releases the reset_pmu_n_o signal after entering the

SYSTEM ON state. At this time the resetout_o signal is high, the RESET_N pad is not pulled low and therefore

the reset_postscu_n_o signal follows the reset_pmu_n_o signal. That means the μC reset will be released and

the μC starts operation. If the SW triggers an external reset via the SCU, signal resetout_o will be forced to low

for a certain time and RESET_N will be forced to low by the open drain driver. At the same time the feedback to

the SCU will be masked to not reset the baseband. The RESET_N pad is in the VDDRTC domain but the internal

pull up is connected to the VDD_VDIG1 (1.8V) domain. That allows the pad to be used as reset for external

devices running in the VDD1V8 domain. The RESET_N pad can also be used to monitor the chip internal reset

condition during startup.

The open drain driver is a weak driver, that means it can be forced to high during debug from external pushing

some current into the pad. In testmode signal reset_pmu_n_o is high, that means the chip reset is fully

controlled from external

3.2.7 External Reset Handling

3. TECHNICAL BRIEF


3. TECHNICAL BRIEF

3.2.8 Sysclock Switching

Figure 3.2.4 PMU, CGU and External Reset

The PMU controls the rf_sysclk_en signal of the DCXO in the RF macro. During startup the PMU enables the

DCXO. After the system is running the DCXO is controlled by the SCU of the baseband by using the

vcxo_enable signal. This is handled by a dedicated logic in the PMU, see Figure 21. As long as

rf_sysclk_en_pmu, the output of the PMU state-machine is high, vcxo_enable controls the rf_sysclk_en signal

to the RF. If rf_sysclk_en_pmu is low, the DXCO is switched off, independent from vcxo_enable.

resetout_o reset_postscu_n_o

reset_pmu_n_o

reset_pmu_n_o

lsoation&LS

reset for externalcomponents

input to systemcontrol unit

for example µCreset

open drainpad driver

�0k

ESDESDVDD_VRTC

VDD_VDIG1

VPMU voltage domain


3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

Figure 3 4 2 How sysclock Enable is Routed in the PMU

3.2.9 Undervoltage Shutdown

In active mode the PMU periodically measures the battery voltage using the ADC from the charger unit. If the

b i d b b l h bl h d l l ( ll d SYSOFF) h h

Figure 3.4.2 How sysclock Enable is Routed in the PMU

3.2.10 Software Reset

A f d ff PMU i Th PMU i i h h f

battery is measured to be below the programmable shut-down level (called SYSOFF), the system changes to

OFF mode. This is done via the SHUTDOWN state of the PMU state machine. (see chapter switch OFF)

A software reset does not affect any PMU register. The PMU register are reset with the reset_pmufsm_n_o

signal. That means all PMU register are reset in OFF state. For details about the SW reset see chapter External

Reset Handling

rf_sysclk_en_pmu

vcxo_enable

VPMU

VDDCORE

LS

LS

Isolation to 1& LS

rf_s

yscl

k_en

to the RF macro via thecore domain in reset

vcxo

_ena

ble

rf_s

yscl

k_en

_pm

u

rf_s

yscl

k_en

3. TECHNICAL BRIEF


3. TECHNICAL BRIEF

3.2.11 PMU Clock

During the first startup (for example plugging in a battery) a PMU internal oscillator is used for generation of

the PMU clock (pmu_clock). The frequency is slightly above 32 kHz (typ. 50 kHz) to be out of the audio band

also for worst case devices. After first startup the software shall enable the 32 kHz crystal oscillator. It is not

possible to use the 32 kHz oscillator during first startup, because the settling time of the oscillator can be

quite long. After the 32 kHz oscillator is running and settled the software shall switch the PMU clock to the 32

kHz clock and disable the internal PMU oscillator for power saving reasons. The 32 kHz oscillator shall neverkHz clock and disable the internal PMU oscillator for power saving reasons. The 32 kHz oscillator shall never

be disabled after the PMU clock has been switched. The ADC in the charger unit has it’s own oscillator

generating a frequency of about 10 MHz. This oscillator is running during charging and during battery

measurements triggered by the PMU. It is off otherwise.

3.2.12 System Sleep Mode y p

The sleep mode is controlled by using the VCXO_enable signal. This signal is used to switch the LDO’s and the

DC/DC converter SD1 in a programmable way into its low power mode (PFM). In addition DC/DC converter

SD1 can be configured to change the output voltage to a lower value for additional power saving.

VCXO_enable is also used to deactivate the HPBG and setting LDO LPMU in the ultra-low-power mode. In

addition the DCXO is switched off by the VCXO enable signal The VCXO enable signal is also used to switchaddition the DCXO is switched off by the VCXO_enable signal. The VCXO_enable signal is also used to switch

some LDO’s (software configured) to sleep and/or off mode or to change the output voltages of said LDO’s.

The state of the main PMU state machine is not changed due to VCXO_enable.

3.2.13 DC/DC Pre-Load Register Handling

The DC/DC converter works in different modes. If the mode is switched from PFM to PWM the pulse-width of

the DC/DC converter depends on the current battery voltage (and on the output voltage). The PMU state-

machine knows the battery voltage because of the battery supervision function. Depending on this value it

selects a startup pulse-width for the DC/DC converter out of a register table. (4-values)


3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

3.2.14 Power Down Sequence

Setting bit OFF in the GeneralControl register switches the system into OFF mode. After the turn off event, the

state-machine switches to the SHUTDOWN state. The reset_pmu_n_o signal changes to low, the I/O pads are

isolated using the padisolation_n signal, the LCORE LDO and the SD1 DC/DC converter are switched off, the

LPMU LDO is switched to ultra-low power mode, the DCXO is turned off and the bandgap buffer is disabled.

Before switching OFF the software shall have enabled the 32 kHz oscillator and has switched the PMU clock to

the 32 kHz clock to archive the target OFF currentthe 32 kHz clock to archive the target OFF current

3. TECHNICAL BRIEF


3.3 FEM with integrated Power Amplifier Module (SKY77550-21, U101)

3. TECHNICAL BRIEF

3.3.1 Internal Block Diagram

Figure. 3-3-1 SKY77550-21 FUNCTIONAL BLOCK DIAGRAM

3.3.2 General Description

TX_HB_IN(10)

VBATT (3)VBATT (4)

VRAMP (16)

TxEN (18)BS (1�)

VSW_EN (11)

Tx_LB_IN (9)

HBT POWER AMPLIFIER

CURRENT SENSEPOWER AMPLIFIER

CONTROL

LOGIC DECODER

Match

Match

SKY77550-21

(�1) RX�

(�6) ANT

(19) RX1

�01643_001


3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

Figure 3 3 2 Band SW Logic TableFigure 3.3.2 Band SW Logic Table

Figure 3.3.3 FEM CIRCUIT DIAGRAM

n8.1

93 1C

L112

5.6n

R102

12

L106

1.8n

1.8n

L110

C1092.2n

701L

n8.6

U101

SKY77550-21

92

32

42

52

62

72

82

15

16

17

18

19

20

21

22

8

7

6

5

4

3

2

1

41

31

21

11

01 9

NI

_B

L_

xT

NI

_B

H_

xT

NE

_W

SV

SB

1D

VS

R

2D

VS

R

GND1

GND2

VBATT1

VBATT2

GND3

GND4

GND5

GND6

GND7

Rx2

RSVD3

Rx1

RSVD

TxEN

VRAMP

GND8

9D

NG

01

DN

G

TN

A

11

DN

G

21

DN

G

31

DN

G

DN

GP

L105

0.5p

0

L101

FL101

105

8

3

72

6

4

9

1U_P_1960/

B_P_1960/1842_5MHz_2

U_P_1842_5/

B_P_942_5/881_5MHz_1

GND1 B_P_942_5/881_5MHz_2

GND2

B_P_1960/1842_5MHz_1

GND3 GND4

942_5MHz

881_5MHz

C111

DNI

L111 10n

10nL114

L109

0.75p

0.5p

C114

401L

n8.1

SW101

43

2

1ANT COMMON

G3 G4

DNI

L138

DNI

L139

C11639p39p

C11539p

C117

C10833u

DNI

L108

C107

15p

C102

33p

C104

DNI

C101

33p

C103

DNIVBAT

1KR104

C106

10n

C10539p

L103

DNI

L113

DNI

L102

DNI

RF_HB_TX

RF_LB_TX

RF_HB_RXN

RF_LB_RXP

RF_TX_EN

RF_ANT_SEL[0]

RF_ANT_SEL[1]

RF_TX_RAMP

ANT_FEED

RF_HB_RXP

RF_LB_RXN

(50V,J,NP0)

GSM850 / DCS

(10V,2012)

EGSM / PCS

(16V,K,X7R)

Figure 3.3.3 FEM CIRCUIT DIAGRAM

3. TECHNICAL BRIEF


3.4 Crystal(26 MHz, X201)The X-GOLDTM215 RF-Subsystem contains a fully

3. TECHNICAL BRIEF

y y

integrated 26 MHz digitally controlled crystal

oscillator, designed for 8 pF crystals. The only

external part of the oscillator is the crystal itself.

Overall pulling range of the DCXO is

approximately 55 ppm, controllable by a 13-bit

tuning word

Figure. 3.4.1 Crystal Oscillator External Connection

tuning word.

This frequency serves as comparison frequency

within the RF-PLL and as clock frequency for the

digital circuitry.

The 26 MHz reference clock can also be applied

to external components like Bluetooth or GPS, via

the two buffered output signals FSYS1 and FSYS2

Figure. 3.4.2 Digital PREDISTORTION with LUXO

The DCXO tuning characteristic should be a first order linear function of the programming word AFC. The

variable capacitance array is a first order linear function of the digital word DIG, which leads to a nonlinear curve

ppm vs. DIG (and also a nonlinear ppm vs. AFC for DIG=AFC). In order to linearize the ppm vs. AFC curve the

implementation of a predistortion is necessary.

To get the wanted linear ppm vs. AFC tuning curve some digital predistortion of the AFC word is required. ThisTo get the wanted linear ppm vs. AFC tuning curve some digital predistortion of the AFC word is required. This

predistortion is performed by the linearization unit for crystal oscillator (LUXO). The LUXO calculates the

corresponding DIG value according to the given AFC value.

FSYS1

FSYS�

�6 MHz XO

XOX

TDC

VBAT3.05V-5.5V

LUXO

DIG = Y

DIGFILTCap

Array

AFC = X

DCXO_LUXO_PREDISTORTION


3. TECHNICAL BRIEF

3.5 RF Subsystem of PMB8815 (U201)

3. TECHNICAL BRIEF

Figure. 3-5-1 Block DIAGRAM of RF Subsystem

3.5.1 GENERAL DESCRIPTION

The PMB8815 RF subsystem is designed for dual-band GSM voice and data applications (GPRS class 12). The

g y

system can be configured to support one low band, GSM850 or EGSM900, and one high band, DCS1800 or

PCS1900. A block diagram of the RF subsystem is given in Figure 3-4-1.

3.5 RF Subsystem of PMB8815 (U201)

3. TECHNICAL BRIEF


- 37 -LGE Internal Use Only Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes

3.5.2 FUNCTIONAL DESCRIPTION

3. TECHNICAL BRIEF

3.5.2.1 Receiver

The X-GOLD™215 dual-band receiver is based on a Direct Conversion Receiver (DCR) architecture. Input

impedance of the LNAs is optimized to achieve a matching without (external) high quality inductors. By use of

frequency dividers (by 2/4) the LO frequency is derived from the RF frequency synthesizer.

The receive path is fully differential to suppress the on-chip interferences and reduce DC-offsets. The analog p y pp p g

chain of the receiver contains two LNAs (low/high band), a quadrature mixer followed by an analog baseband

filter and 14-bit continuous-time delta-sigma analog-to-digital converter. The filtered and digitized signal is fed

into the digital signal processing chain, which provides decimation, DC offset removal and programmable gain

control.

Figure. 3.5.2 RECEIVER CHAIN BLOCK DIAGRAM

GSM850/900

GSM1800/1900

RX1

RX1X

RX�

RX�X

LNA_GAIN

DCO

RXBBFG[�:0] DGAIN[5:0]

RXTXDA

RXTXENDigRF

RX


3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

3.5.2.2 Transmitter

The GMSK transmitter supports power class 4 for GSM850 or GSM900 as well as power class 1 for DCS1800 or

PCS1900. The digital transmitter architecture is based on a fractional-N sigma-delta synthesizer for constant

envelope GMSK modulation. This configuration allows a very low power design without any external

components.

Up- and down-ramping is performed via the ramping DAC connected to VRAMP.

Figure. 3.5.3 TRANSMITTER CHAIN BLOCK DIAGRAM

RF synthesizerRF synthesizer

The RF subsystem contains a fractional-N sigma-delta synthesizer for the frequency synthesis. Respective to

the chosen band of operation the phase locked loop (PLL) operates at twice or forth of the target signal

frequency. In receive operation mode the divided output signal of the digital controlled oscillator output (DCO)

serves as local oscillator signal for the balanced mixer. For transmit operation the fractional-N sigma-delta

h i i d d l i l h h /f i l Th MH f i l fsynthesizer is used as modulation loop to process the phase/frequency signal. The 26 MHz reference signal of

the phase detector incorporated in the PLL is provided by the reference oscillator.

3. TECHNICAL BRIEF

3.5.2.2 Transmitter

The GMSK transmitter supports power class 4 for GSM850 or GSM900 as well as power class 1 for DCS1800 or

PCS1900. The digital transmitter architecture is based on a fractional-N sigma-delta synthesizer for constant

envelope GMSK modulation. This configuration allows a very low power design without any external

components.

Up- and down-ramping is performed via the ramping DAC connected to VRAMP.

Figure. 3.5.3 TRANSMITTER CHAIN BLOCK DIAGRAM

RF synthesizerRF synthesizer

The RF subsystem contains a fractional-N sigma-delta synthesizer for the frequency synthesis. Respective to

the chosen band of operation the phase locked loop (PLL) operates at twice or forth of the target signal

frequency. In receive operation mode the divided output signal of the digital controlled oscillator output (DCO)

serves as local oscillator signal for the balanced mixer. For transmit operation the fractional-N sigma-delta

h i i d d l i l h h /f i l Th MH f i l fsynthesizer is used as modulation loop to process the phase/frequency signal. The 26 MHz reference signal of

the phase detector incorporated in the PLL is provided by the reference oscillator.

3. TECHNICAL BRIEF



3. TECHNICAL BRIEF

3.5.2.3 Front-end/PA Control Interface

Two outputs (FE1, FE2) for direct control of antenna switch modules enable to select RX- and TX-mode as well

as low- and high-band operation.

An extra band select signal PABS for the power amplifier is used, to support discrete PA and switching

modules. Time accurate power dissipation of the PA is achieved by the control signal PAEN.

A minor set of power amplifiers require a bias voltage to enhance power efficiency. Support of this power

amplifiers is achieved by the implemented bias DACamplifiers is achieved by the implemented bias DAC.

Fi 3 5 4 PA AND FEM CONTROL BLOCK DIAGRAMFigure. 3.5.4 PA AND FEM CONTROL BLOCK DIAGRAM

biasdac_datato

basebandas rf_fe4_0

INIT_PAFEM_APABIASFE 3_SEL

BIASDAC

PAMPDAC

CHANNEL_BSW[1]

INIT_PAFEM_A.PABS_INV

ramping signal

GSM 850/900

GSM 1800/1900TX2

TX1

RFINHB

RFINLB

RFOUTHB

RFOUTLB

to ASM / FEM

to ASM / FEM

GMSK PA

VBIA

S

BSTX_E

N

VPA

MP

VPAMP

PABS

PAEN

PABIAS/FE3

FE2

FE1

FE2

FE1

FE3FE4 PAEN


3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

3.5.2.4 Power Supply

To increase power efficiency most parts of the RF subsystem are supplied by the DCDC converter situated in

the PMU subsystem. Conversion of the 1.8 V output voltage of the DCDC to the 1.3 V/1,4 V circuit supply

voltages is achieved by several Low-DropOut regulators (LDO).

One embedded direct-to-battery LDO provides the 2.5 V supply voltage for the remaining circuits.

Figure. 3.5.5 POWER SUPPLY BLOCK DIAGRAM

Figure. 3.5.5 POWER SUPPLY BLOCK DIAGRAM

3. TECHNICAL BRIEF


3.6 MEMORY(H9DA2GH1GHMMMR, U301 )

3. TECHNICAL BRIEF

i O OC

Hynix NAND Flash is a 128Mx16bit with spare 4Mx16 bit capacity.

The device is offered in 1.8 Vcc Power Supply, and with x16 I/O interface.

Its NAND cell provides the most cost-effective solution for the solid state mass storage market.

The memory is divided into blocks that can be erased independently so it is possible to preserve valid data while

old data is erased

Figure. 3.6.1 MEMORY BLOCK DIAGRAM

old data is erased.

The device contains 2048 blocks, composed by 64 pages.

Memory array is split into 2 planes, each of them consisting of 1024 blocks.

Like all other 2KB - page NAND Flash devices, a program operation allows to write the 2112-byte page in typical

250us and an erase operation can be performed in typical 3.5ms on a 128K-byte block.

In addition to this, thanks to multi-plane architecture, it is possible to program 2 pages at a time (one per each

plane) or to erase 2 blocks at a time (again, one per each plane). As a consequence, multi-plane architecture allows

program time to be reduced by 40% and erase time to be reduction by 50%. In case of multi-plane operation, there

is small degradation at 1.8V application in terms of program/erase time..

3.6 MEMORY(H9DA2GH1GHMMMR, U301 )


3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

[ NAND Flash ]

MULTIPLANE ARCHITECTURE

SUPPLY VOLTAGESUPPLY VOLTAGE

- Vcc = 1.7 - 1.95 V

MEMORY CELL ARRAY

- (1K + 32) Words x 64 pages x 2048 blocks

PAGE SIZE

- (1K+ 32 spare) Words

BLOCK SIZE

- (64K + 2K spare) Words

PAGE READ / PROGRAM

- Random access : 25us (max.)

- Sequential access : 45ns (min.)

- Page program time : 250us (typ.)

- Multi-page program time (2 pages): 250us (Typ.)

BLOCK ERASE / MULTIPLE BLOCK ERASE

- Block erase time: 3.5 ms (Typ)

- Multi-block erase time (2 blocks): 3.5ms (Typ.)

SEQURITY

- OTP area

- Sreial number (unique ID)

- Hardware program/erase disabled duringHardware program/erase disabled during

- power transition

ADDITIONAL FEATURE

- Multiplane Architecture:

Array is split into two independent planes.

Parallel operations on both planes are available, having program and erase time.

- Single and multiplane copy back program with auto matic EDC (error detection code)

- Single and multiplane page re-program

- Single and multiplane cache program

- Cache read

- Multiplane block erase

RELIABILITY

- 100,000 Program / Erase cycles (with 1bit /528Byte ECC)

10 Year Data retention- 10 Year Data retention

ONFI 1.0 COMFLIANT COMMAND SET ELECTRICAL SIGNATURE

- Munufacture ID: ADh

- Device ID

3. TECHNICAL BRIEF


3. TECHNICAL BRIEF

[ DDR SDRAM ]

Double Data Rate architecture

- two data transfer per clock cycle

x16 bus width

Supply Voltage

- VDD / VDDQ = 1.7 - 1.95 V

Memory Cell Array

- 16Mb x 4Bank x 16 I/O

Bidirectional data strobe (DQS)

Input data mask signal (DQM)

Input Clock

- Differential Clock Inputs (CK, /CK)

MRS, EMRS

- JEDEC Standard guaranteed

CAS LatencyCAS Latency

- Programmable CAS latency 2 or 3 supported

Burst Length

- Programmable burst length 2 / 4 / 8 with both sequential and interleave mode


3. TECHNICAL BRIEF

3.7 BT module

3. TECHNICAL BRIEF

Figure 3_7_1. BT BLOCK DIAGRAM

This module has an integrated radio transceiver that has been optimized for use in 2.4GHz Bluetooth

Wireless systems. It has been designed to provide low-power, robust communications for applications

Operating in the globally available 2.4GHz unlicensed ISM band. It is fully compliant with the Bluetooth

Radio Specification and enhanced data rate specification and meets or exceed the requirement to

provide the highest communication link quality of service.

3.7 BT module

3. TECHNICAL BRIEF


3.7.1 Transmitter path

3. TECHNICAL BRIEF

This module features a fully integrated zero IF transmitter. The baseband transmitted data

Is digitally modulated in the modem block and up-converted the 2.4GHz ISM band in the

Transmitter path. The transmitter path consists of signal filtering, I/Q up-conversion, high

-output power amplifier(PA), and RF filtering. It also incorporates modulation schemes

P/4-DQPSK for 2 Mbps and 8-DPSK for 3 Mbps to support enhanced data rate.

• Digital modulator

The digital modulator performs the data modulation and filtering required for the GFSK,

/4DQPSK, and 8-DPSK signal. The fully digital modulator minimizes any frequency drift

Or anomalies in the modulation characteristics of the transmitted signal and is much more

Stable than direct VCO modulation schemes.

• Power Amplifier

The integrated PA for the BCM2070 is configurable for Class 2 operation, transmitting up to+4 dBm as well as Class 1 operation and transmit power up to +12 dBm at the chip, gFSK, >2.5V supply. Due to the linear nature of the PA, combined with some integrated filtering, noExternal filters are requires for meeting Bluetooth and regulatory harmonic and spuriousrequirements. For integrated mobile handset applications, where Bluetooth is integrated nextq g pp , gto the celluar radio, minimal external filtering can be applied to achieve near thermal noise levels for spurious and radiated noise emissions. Using a highly linearized, temperature compensated design the PA can transmit +12 dBm forBasic rate and +10 dBm for enhanced data rates(2 to 3 Mbps). A flexible supply voltage rangeAllows the PA to operate from 1.2V to 3.0V. The minimum supply voltage at VDDTF is 1.8Vto achieve +10dBm of transmit power.

3.7.2 Receiver path

The receiver path uses a low IF scheme to down-convert the received signal for demodulationin the digital demodulator and bit synchronizer. The receiver path provides a high degree of Linearity, an extended dynamic range, and high order on-chip channel filtering to ensurereliable operation in the noisy 2.4GHz ISM bnad. The front-end topology, with built-in out-of-bnad attenuation enables the device to be used in most applications with no off-chip-of-bnad attenuation, enables the device to be used in most applications with no off-chip Filtering. For integrated handset operation where the Bluetooth function is integrated close to the celluar transmitter, minimal external filtering is required to eliminate the desensitization ofThe receiver by the cellular transmit signal.


3. TECHNICAL BRIEF

C318

33pC323

33pC320

33p

33p

C317C316

33p33p

C315203D

Z

713R

K7.4

0.1uC321

S3015000-12P-2_95D-A1-R0EAG63211701

C7

41

C1_1

51

C1

31

C3_1

C6

C2

C5

C5_1

C2_1

C3 C7_1

C6_1

616

DN

G

VPP2

I/O2CLK1

RST2

GND2

GND1

RST1

VPP1

CLK2

3D

NG

VCC1

5D

NG

VCC2

4D

NG

I/O1

VA308VA309

VA312VA311

VA310

813R

K7.4

2V85_VSIM2V85_VSIM2V85_VSIM 2V85_VSIM

0.1u

C319

SIM_CLK

SIM_CLKSIM_DATA_1

SIM_RST_N

SIM_DATA_2

SIM_RST_2

FSA2259UMX

U302

EUSY01865046

5

7

4

8

3

9

2

10

1C

CV

2B1

1B1

2A

1A

S2

S1

0B2

1B0

DN

G

2V85_VSIM

R325

100K100K

R324

C322 1u

10K

R3232V85_VSIM

IN

D

723R

SIM_DATASIM_RST_SELSIM_SEL

SIM_DATA_1

SIM_DATA_2SIM_RST_2

3.8 SIM Card Interface

Figure 3-8-1.Dual SIM CARD Interface

The Main Base Band Processor(XMM�15) provides SIM Interface Module.

The XMM�15 checks status Periodically During established call mode whether SIM card is inserted or not, but it doesn’t

check during deep sleep mode. In order to communicate with SIM card, 5 signals SIM_DATA_1, SIM_DATA_�, SIM_CLK,

SIM_RST_N, SIM_RST_�

And This model supports �.85V SIM Card.

Signal Description

SIM_RST_N This signal makes SIM card to HW default status.

SIM_CLK This signal is transferred to SIM card.

SIM_DATA_1 This signal is interface datum.

3. TECHNICAL BRIEF


3.9 LCD Interface

3. TECHNICAL BRIEF

Figure 3-9-1. LCD Interface (B to B Connector on Main PCB)

The LM320DN1A module is a Color Active Matrix Liquid Crystal Display with an Light Emission

Diode(LED) Back Light system. The matrix employs a-Si Thin Film Transistor as the active element.

It is a transmissive type display operating in the normally Black mode. This TFT-LCD has a 3.19 inch

diagonally measured active display area with 240 * RGB * 320 resolution. Each pixel is divided into

R,G,B dots which are arranged in vertical stripes. Gray scale or the brightness of the dots

Color is determined with a 6 bit gray scale signal for each dot, thus, presenting a palette of

More than 262,144 colors.

3.9 LCD Interface

VA601

1u

C607

18p

1u

C622

106R

0

506R

0

VBAT

C603

2.2u

TP603

100K

R604R602DNI

606R

0

DNIR603

TP602

VPA_2V85

VDD_IO_1V8

CN601

21 20

22 19

23 18

24 17

25 16

26 15

27 14

28 13

29 12

30 11

31 10

32 9

33 8

34 7

35 6

36 5

37 4

38 3

39 2

40 1

1u

C606

LCD_LED_CA5LCD_LED_CA4LCD_LED_CA3LCD_LED_CA2LCD_LED_CA1

LCD_PWM

LCD_VSYNC_OUT

LCD_F_DATA[2]LCD_F_DATA[3]


LCD_F_DATA[7]


LCD_F_WR_N

LCD_F_CS_NLCD_F_RS

LCD_F_DATA[6]

LCD_RST_N

LCD_ID

LCD_IFMODE

LCD_F_RD

ENBY0036001GB042-40S-H10-E3000


3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

Figure 3-9-2. RT9396 CIRCUIT DIAGRAM

The RT9396 is a power management IC (PMIC) for backlighting and phone camera

applications. The PMIC contains a 6-Channel charge pump white LED driver and

four low dropout linear regulators.

The charge pump drives up to 6 white LEDs with regulated constant current for uniform

intensity. Each channel (LED1 to LED6) supports up to 25mA of current. These 6-Channels

can be also programmed as 4 plus 2-Channels or 5 plus 1-Channels with different current

setting for auxiliary LED application. The RT9396 maintains highest efficiency by utilizing a

x1/ x1.5/ x2 fractional charge pump and low dropout current regulators. An internal 6-bit

DAC is used for backlight brightness control Users can easily configure up to 64 steps ofDAC is used for backlight brightness control. Users can easily configure up to 64-steps of

LED current via the I2C interface control. The RT9396 also comprises low noise, low

dropout regulators, which provide up to 200mA of current for each of the four channels. The

four LDOs deliver 3% output accuracy and low dropout voltage of 200mV @ 200mA.

Users can easily configure LDO output voltage via the I2C interface control. The LDOs also

provide current limiting and over-temperature functions. The RT9396 is available in a

WQFN-24L 3x3 package.

U601

24

23

22

21

20

19

18

8

7

6

5

9

4

10

3

11

2

12

1

31 41 51 61 71L

CS

AD

S

NE

MW

P

FC

DN

GP

LDO1

N2C

LDO2

N1C

LDO3

P1C

LDO4

P2C

AGND

VIN

LDOIN

LED6

LED5

LED4

LED3

LED2

LED1

VOUT

VPROX_3V0

VTOUCH_3V0

VCAM_DIG_1V8

106B

F 01

VCAM_IO_1V8

R620 0

C619

1u

0R619

0R608

0R609

2.2u

C610

C604

1u

C605

2.2u

VCAM_ANA_2V8

1u

C608

1u

C609C611

1u

1u

C601

C602

1u

VBAT

100K

R611

LCD_LED_CA5

LCD_LED_CA4LCD_LED_CA3LCD_LED_CA2LCD_LED_CA1

LCD_PWM

I2C_SDA

I2C_SCL

BACKLIGHT_KEY

LCD_BL_CTRL

3. TECHNICAL BRIEF


3. TECHNICAL BRIEFLED Backlight Current

RT9396 communicates with a host (master) Using the standard I2C 2-wire interface.

The two bus lines of SCL and SDA must be pulled high when the bus is not in use InternalThe two bus lines of SCL and SDA must be pulled high when the bus is not in use. Internal

pull-up resistors are installed. After the START condition, the I2C master sends a chip

address. This address is eight bits long, consisting of seven address bits and a following data

direction bit (R/W). The RT9396 address is 10101000 (A8h) and is a receive-only (slave)

device. The second word selects the register to which the data will be written. The third word

contains data to write to the selected register. Figure 2 shows the writing information for the

four LDOs as well as for each LED current. In the second word, the sub-address of the four

LDOs is “001” and the sub-address of the LED Driver for different dimming modes are

respectively “010”, “011” and “100”. For the LDO output voltage setting, bits B1 to B4

represent each LDO channel respectively where a “1” indicates selected and a “0” means not

selected. The B0 bit controls on/off (1/0) mode for the selected LDO channel(s). Then, in the

third word, bite C0 to C3 control a 16-step setting of LDO1 to LDO4.The voltage values are

listed in Table 1. For LED dimming, there are three operating modes (Backlight I, Backlight

II and Backlight III) to select from by writing respectively “010”, “011” and “100” into the

First three bits of the second word, It should be noticed that no matter which mode is

selected, LED1 to LED3 must be turned on, else LED4 to LED6 can not be Turned on. When

Backlight I is selected, all six LEDs have the same behavior. Their 64-step dimming

currents are set by bits C0 to C5, which are listed in Table 2. The bits C6 and C7 determine

Backlight Quiescent Current

currents are set by bits C0 to C5, which are listed in Table 2. The bits C6 and C7 determine

the fade in/out time of each step as shown in Figure 2. For Backlight II and Backlight III,

two sets of LEDs, called Main and Sub, can work separately.

The quiescent current required to operate all four backlights is reduced by 1.5mA when backlight current is

set to 4.0mA or less. This feature results in higher efficiency under light-load conditions. Further reduction in

quiescent current will result from using fewer than four LEDs.


3. TECHNICAL BRIEF

3.10 MiniABB (Battery Charger & MUIC) Interface

3. TECHNICAL BRIEF

Figure 3-10-1 Mini ABB BLOCK

The LP8727 is designed to provide automatic multiplexing switches between Micro/Min USB connector and USB,

UART, and Audio paths in cellular phone applications, and it also contains a single-input Li-ion battery charger

and over-voltage protected LDO. Programming is handled via ans I2C compatible Serial Interface allowing

control of charger, multiplexing switches, and reading status information of the device.

The multiplexing switches on USB and UART support High-Speed USB and Audio inputs can be driven to

negative voltage rail. The LP8727 is compatible with USB charging specification rev 1.1 form USB IF.

The Li-ion charger requires few external components and integrates the Power FET. Charging is thermally

regulated to obtain the most efficient charging rate for a given ambient temperature. It has Over-Voltage

Protection (OVP) circuit at the charger input protects the PMU from input voltage up to +28V, eliminating the

need for and external protection circuitry.

An Over-voltage protected LDO which can supply up to 50mA is designed for powering up low voltage USB g p pp y p g p g p g

transceiver or waking up a PMU(Power Management Unit)when an external power source(either USB VBUS or

wall adapter) is connected to the USB connector.

3.10 MiniABB (Battery Charger & MUIC) Interface

U401

EAN62339701LP8727-B

C5

D2

B5

D3

D1

E1

E2

E3

E5

E4

A1

C1

B1

A4

A5

A3

A2

D5

4D

4C

3C

2C

2B

3B

4B

LC

SA

DS

¬¡

TN

I

1D

NG

2D

NG

3D

NG

4D

NG

BATT2

DNDP

U1U2

AUD1AUD2

MIC

VBUS1VBUS2

D-D+

ID

RES

DSS

EXPDET

CAP

BATT1

C418

DNI

R410

2.2K

10KR402

414C

u1

1u

C412

FB401 1800

R405 10

R401

47K

R406 10

u1314

C

VDD_IO_1V8

VBATVDD_IO_1V8 VUSB_CHG_IN

C4111u

USB_DPUSB_DM

UART_TXMUIC_ACC_IDUART_RX

VUSB_LDO_4V9

I2C_SDAI2C_SCL

MUIC_IO_PMUIC_IO_M

MUIC_INT_N

3. TECHNICAL BRIEF


3.12 Audio Interface

F i l O i

1. TECHNICAL BRIEF

3.12.1 Functional Overview

The audio front-end of X-GOLD™215 offers the digital and analog circuit blocks for both receive and transmit

audio operation, from a mobile phone perspective (called audio-in and audio-out subsequently). It features a

high-quality, stereo digital-to-analog path with amplifier stages for connecting acoustic transducers to X-

GOLD™215. In audio-in path the supply voltage generation for electret microphones, a low-noise amplifier and p pp y g g p p

analog to digital conversion are integrated in X-GOLD™215. A more detailed functional description will be given

in the following sections.

The audio front-end itself can be considered to be organized in three sub-blocks:

• Interface to processor cores (TEAKLite® and - indirectly - ARM)

• Digital filters• Digital filters

• Analog part

The following figure shows an architecture overview of the Audio section.

Figure 3.12.1 Audio Section Overview

Figure 3.12.1 Audio Section Overview

3.11 Audio Interface

3.11.1 Functional Overview


3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

The audio front-end of X-GOLD™215 has the following major operation modes:

Figure 3.12.2 Overview of Clocking and Interfaces of Audio Front End

• Power-down: All analog parts are in power down and all clocks of the digital part are switched off.

• Audio mode: Digital decimation/interpolation filters are connected to the interface buffers and the analog

part is enabled.

These major modes can be modified by certain control register settings.

• Due to the new gain settings in the TX path, the maximum input voltage is limited to 0.8 Vpp.

• In both voiceband paths, the value range for voice samples is confined to 97.5%, i.e. to [-31948, 31947] or

[8334H, 7CCBH] in X-GOLD™215.

• On the TX path, 83% "1"s on the VTPDM line correspond to a 16-bit value of 7CCBH and 17% "1"s correspond

to a 16-bit value of 8334H at the digital filter output. Thus the usable range is 66%. This range can be scaled to

100% by Firmware.y

• The high-pass functions of the voiceband filters have to be implemented in firmware on TEAKLite®.

DSP RXBuffer

TXBuffer

digitalfiltersASMD

DACr

ADC

DACI

combDSP interruptunit

Cintrd

and sidus

regsiars

FPI bus

DSP bus DSP bus

Shar

edm

emor

y

RX b

uffer

sTX

LNA

outp

utsa

le ct

ion

gain

cont

rol

3. TECHNICAL BRIEF


3.11.2 Digital Part

The digital part of the X-GOLD™�15 audio front-end comprises an interface to the TEAKLite® bus, interfaces to the

interrupt units of TEAKLite®, digital interpolation filters for oversampling digital-to-analog conversion, digital

decimation filters for analog-to-digital conversion and an interface to the analog part of the audio front-end. For

the digital microphone all the filtering is done in a dedicated hardware. The output sample stream is then fed in a

duplicated ring buffer structure like the data from the analog microphone path (after A/D conversion and

subsequent digital filtering).

* Interpolation Filter

The interpolation path of the X-GOLD™�15 audio front-end increases the sampling rate of the audio samples to

the rate of the digital-to-analog converter. Because the input sampling rates can vary between 8 kHz and 47.619

kHz the filter characteristic and oversampling ratio can be adjusted to the respective sampling rate. The

requirements for the interpolation filters depend on the sampling rate, because a sufficient out-of-band

discrimination in the audio frequency band (�0 Hz,...,�0 kHz) has to be ensured.

* Decimation Filter

The digital decimation filter on X-GOLD™�15 has two operating modes: 8 kHz output sampling rate and 16 kHz

output sampling rate (or 16 kHz output sample rate and 16kHz bandwidth in case of doubled ASMD clock).

3.11.3 Analog Part

The analog part of the X-GOLD™�15 audio front-end in audio-out direction consists of a stereo digital to analog

converter (multi-bit oversampling converter) which transforms the output of the digital interpolation filter into

analog signals. It is followed by the gain control/amplifier section. The DAC outputs can be switched to several

output buffers. In audio-in section there is an input multiplexer which selects either one of two differential

microphone inputs to be connected to the low-noise amplifier and analog pre-filter. The signals from the analog

pre-filter are input to a second-order sigma-delta analog-to-digital converter. In addition there is a connection for

FM-radio playing.

* Audio-out Part

The analog audio-out part consists of two multi-bit digital-to-analogue converters (DAC) and an output stage. The

signal sources are switched to the output drivers in the output stage The output drivers consist of: a) one mono,

differential class-D Loudspeaker driver, b) one mono, differential Earpiece driver and c) one stereo, single-ended

(with uni- or bipolar signals), Headset driver.


3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

Digital-to-analog converters

The multi-bit oversampling DACs of the X-GOLD™215 audio front-end convert the 16-bit data words coming

Output Amplifier

The different output buffers in X-GOLD™215 are driven by the outputs of the selection block. The differential

from the digital interpolation filters to analogue signals.

earpiece driver can be used to drive a 16 Ω earpiece and works in differential. The two single ended headset

drivers can be used to drive a 16 Ω headset. They can work unipolar mode, where an AC coupling of the headset

might be needed, or can work also in bipolor mode. The differential loudspeaker driver can be used to drive a 8 Ω

loudspeaker. As it is a class-D amplifier the needed suppression of the higher harmonics of the switching signals

has to be achieved by the external circuitry. The buffers are designed to be short circuit protected.

Figure 3.12.3 Switching for R/L DACs onto Buffers

Figure 3.12.3 Switching for R/L DACs onto Buffers

3. TECHNICAL BRIEF


3. TECHNICAL BRIEF

Figure 3.12.4 Different Application Scenarios

In order to achieve the single-speaker concept by parallel connection of Earpiece and Headset amplifier the

Earpiece amplifier have to sustain the up to 5 V voltage of the class-D amplifier.

Audio-in Path

The audio-in path of X-GOLD™215 provides two differential microphone input sources, MIC1and MIC2.

• The inputs for microphone MIC1 are MICP1 and MICN1.

• The inputs for microphone MIC2 are MICP2 and MICN2.

The audio-in path consists of an input selector, a low noise amplifier and following pre-filter with gain control,

a second order ΣΔ-converter and a digital decimation filter. It supports both standard GSM (bandwidth 3.5

kH ) and ideband (band idth 7 kH ) speech bandskHz) and wideband (bandwidth 7 kHz) speech bands.

The differential input signal from the microphone first passes a low noise amplifier and following pre-filter

and an anti-aliasing pre-filtering stage achieving and overall variable gain ranging from 0 dB to +39 dB . The

signal is then modulated by a second order ΣΔ-converter which is clocked with the same clock rate as the

digital to analog converters. The ΣΔ-converter delivers a 1-bit pulse density modulated data stream at a rate

of 2 MHz to the digital decimation filter which reduces the rate to 8 kHz or 16 kHz, depending on the current

mode.

To improve SNR the sample frequency can be doubled in dedicated modes and the modulated data stream is

4MHz instead of 2 MHz.


3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

Microphone Supply

X GOLD™2 h i l d d l f l i hX-GOLD™215 has a single ended power-supply concept for electret microphones:

For both modes a minimal load capacitance of t.b.d. nF is necessary to guarantee stable operation of the buffer.

The maximal load capacitance must not exceed t.b.d. nF.

2 microphone supplies VMIC and VUMIC are available. The supply VUMIC has a ultra-low-power mode, where

the current consumption is minimum, whilst at the same time the noise performance is reduced.

For this purpose the VUMIC is directly supplied out of the VMIC regulator, the Mic-Buffer can be switched off and

only the quiescent current of the VMIC regulator is present. This mode can be used to supply a headset and

allow accessory detection with highly reduced current consumption For normal operation the supply can be

switched to normal operation mode with improved noise performance. In case of an digital microphone VMIC

can be used for supplying this microphone.

Figure 3.12.5 Typical Microphone Supply Generation (alternative)

VMIC

MICP

MICN

10k

1k5

TBV_Typical_Microphone_Supply_Generation_alternative

Figure 3.11.5 Typical Microphone Supply Generation (alternative)

3. TECHNICAL BRIEF


3.13 Camera Interface(2M Fixed Focus Camera)

3. TECHNICAL BRIEF

3.13.1 XMM215 Camera Interface

The Camera Interface (CIF) represents a complete video and still picture input interface (see Figure 26).

The CIF contains image processing, scaling, and compression functions. The integrated image processing unit

supports image sensors with integrated YCbCr processing.

Scaling is used for downsizing the sensor data for either displaying them on the LCD, or for generating data

streams for MPEG-4 compression. In general, YCbCr 4:2:2 JPEG compressed images should use the full sensor

resolution, but they can also be downscaled to a lower resolution for smaller JPEG files. Scaling also can be used

for digital zoom effects, because the scalers are capable of up-scaling as well.

CIF

All data is transmitted via the memory interface to an AHB bus system using a bus master interface.

Programming is done by register read/write transactions using an AHB slave interface.

Figure 3.13.1 Block Diagram of Camera Interface

3.12 Camera Interface(2M Fixed Focus Camera)

3.12.1 XMM215 Camera Interface

Figure 3.12.1 Block Diagram of Camera Interface


3. TECHNICAL BRIEF

Functional Overview of CIF

3. TECHNICAL BRIEF

The following list gives an overview over the CIF’s functionality:

• 78 MHz system clock

• 78 MHz sensor clock

• 78 MHz JPEG encoder clock

• 32-bit AHB slave programming interface

• ITU-R BT 601 compliant video interface supporting YCbCr

• ITU-R BT 656 compliant video interface supporting YCbCr data

• 8-bit camera interface

• 12-bit resolution per color component internally

• YCbCr 4:2:2 processing

• Hardware JPEG encoder incl JFIF1 02 stream generator and programmable quantization and Huffman• Hardware JPEG encoder incl. JFIF1.02 stream generator and programmable quantization and Huffman

tables

• Windowing and frame synchronization

• Continuous resize support

• Frame skip support for video (e.g. MPEG-4) encoding

• Macro block line, frame end, capture error, data loss interrupts and sync. (h_start, v_start) interrupts

• Programmable polarity for synchronization signals

• Luminance/chrominance and chrominance blue/red swapping for YUV input signals

• Maximum input resolution of 3 Mpixels (2048x1536 pixels)

• Main scaler with pixel-accurate up- and down-scaling to any resolution between 3 MP (2048x1536) and

32x16

• pixel in processing mode

• Buffer in system memory organized as ring-buffer

• Buffer overflow protection for raw data and JPEG files

• Asynchronous reset input, software reset for the entire IP and separate software resets for all sub-modules

• Interconnect test support

• Semi planar storage format

• Color processing (contrast, saturation, brightness, hue)Color processing (contrast, saturation, brightness, hue)

• Power management by software controlled clock disabling of currently not needed sub-modules

3. TECHNICAL BRIEF


IN

D606

AV

21 6C

u1.0

u1.031 6

C

416C

u1.0

C617

7.5p 7.5p

C620

706A

V

806A

V

VCAM_DIG_1V8

VCAM_IO_1V8

VCAM_ANA_2V8506

AV

406A

V

R616

10

CN602

1312

1411

1510

169

178

187

196

205

214

223

232

241

CAM_PCLK

CAM_MCLK

CAM_F_DATA[6]

CAM_F_DATA[5]

CAM_F_DATA[4]

CAM_F_DATA[3]

CAM_F_DATA[2]

CAM_F_DATA[1]

CAM_F_DATA[0]

CAM_F_DATA[7]

I2C_SDA

I2C_SCL

CAM_PWDN

CAM_RST_N

F_CAM_VSYNC

F_CAM_HSYNC

Figure 3-12 Camera Connector


3. TECHNICAL BRIEF

3.13 Touch Interface

Figure 3-13Touch Driver Block Diagram

The touch controller is an analog interface circuit for a human interface touch screen device.

All of touch functions are composed of a register-based architecture and are controlled through

the internal register sets by serial interface.

MMS-100 Series are composed of a 3�-bit ARM processor, a wakeup interrupt controller (WIC), a 3�-Kbytes flash

memory, an 8-Kbytes SRAM, a Receiver Controller with max �0 receiver channels(RX), a Transmitter Controller with max

3� transmitter channel(TX), an embedded I�C slave with four serial I/O lines, a timer, an internal oscillator, an internal

LDO, an internal C/P for HV, and a POR.

A transmitter controller and a receiver controller activate corresponding TX channels and RX channels sequentially.

A LDO generates a regulated power supply voltage from noisy voltage source. The generated voltage is used for the

power supply voltage of analog circuits. PSRR is highly improved by the internal LDO.

A charge pump generates a high voltage source for driving TX channels. The overdriven voltage increases the signal

strength, thereby improving SNR.

A POR generates a reset signal at power-up.

3.14 Touch Interface

3. TECHNICAL BRIEF

The touch controller is an analog interface circuit for a human interface touch screen device. All of touch functions are composed of a register-based architecture and are controlled throughthe internal register sets by serial interface.

Figure 3 14 Touch Driver Block DiagramFigure 3-14 Touch Driver Block Diagram

MMS-100 Series are composed of a 32-bit ARM processor, a wakeup interrupt controller (WIC), a 32-Kbytes flash memory, an 8-Kbytes SRAM, a Receiver Controller with max 20 receiver channels(RX), a Transmitter Controller with max 32 transmitter channel(TX), an embedded I2C slave with four serial I/O lines, a timer, an internal oscillator, an internal LDO, an internal C/P for HV, and a POR.

A i ll d i ll i di TX h l d RXA transmitter controller and a receiver controller activate corresponding TX channels and RXchannels sequentially.

A LDO generates a regulated power supply voltage from noisy voltage source. The generated voltage is used for the power supply voltage of analog circuits. PSRR is highly improved by the internal LDO.

A charge pump generates a high voltage source for driving TX channels. The overdriven voltage i th i l t th th b i i SNRincreases the signal strength, thereby improving SNR.

A POR generates a reset signal at power-up.

OSC

LDO

C/P

POR

MMS-100 Core

WIC3�-bit ARM Core

AMBA bus

AMBA bus

3�-bit KB Flash 8-KB SRAM

Timer� chip

interface1�C

SlaveISP

Transmitter Controller Receiver Controller

HVSwutch

HVSwutch

HVSwutch

AnalogFront-

end

AnalogFront-

end

AnalogFront-

end

TX0 TX1 TX31 RX0 RX1 RX19 SCL SDA RSTB INTB MSD SMD MSC

Max �0 RXMax 3� TX

3. TECHNICAL BRIEF


Figure 3-13-2 Touch Driver Block


4. TROUBLE SHOOTING

4. TROUBLE SHOOTING

4.1 RF Component

4. TROUBLE SHOOTING

U201 U301

X201

i

U101

U301 Memory(2G NAND/1G SDRAM)H9DA2GH1GHMMMR-46M

U201Main Chip (A-GOLD RADIO NAND)

PMB8815

Figure 4.1

PMB8815

U101GPRS QUAD TX DUAL RX MODULE

SKY77550-21

X201Crystal, 26MHz Clock

TSX- 3225

RF SwitchSW101

RF SwitchMS-156C

4.1 RF Component

U201 U301

X201

U101

SW101

4. TROUBLE SHOOTING


4.2 RX Trouble

START

(1) CheckCrystal Circuit

Re-download orDo calibration again

(�) CheckMobile SW &TX module

(3) Check PLL Control

HP8960 : Test mode6� CH, 7 level setting (TCH)

6�CH, -60dBm setting (BCCH)Spectrum analyzer setting

Oscilloscope setting


4. TROUBLE SHOOTING

(1) Checking Crystal Circuit

4. TROUBLE SHOOTING

26 MHzO.K?No

Crystal is OK.

Yes

Replace X201

TP1_1 pin : 26MHz

Figure 4.2.1

ySee next page to check PLL Circuit

X201

TP1

Figure 4.2.2 TP1

Figure 4.2.3

Figure 4.2.2

X201 TSX-3225

26MHz

21

34GND2 HOT2

HOT1 GND1

R213

02V85_VSIM

0.1u

C225

G5F2F3F1

D2D1E2

M10

A13B13K14K13

B4A5B5A4

J10 USIF2_CTS_NUSIF1_TXD_MTSRUSIF1_RXD_MRSTUSIF1_RTS_NUSIF1_CTS_NDPLUSDMINUSXOXXO

VSIMSIM_IOSIM_CLKSIM_RST

MMCI_CMDMMCI_DAT_0MMCI_CLK

USB_DPUSB_DM

UART_TX

SIM_DATASIM_CLK

MSD_CLKMSD_D[0]

MSD_CMD

BT_UART_TXBT_UART_RX

UART_RX

SPI_INT

SIM_RST_N

Connect GND plane directly

Close to the 26MHz XTAL

VDDP_SIM

VDDP_MMC

EINT2

CC1CC6IO

VDDP_ULPI

RF

TP1

(1) Checking Crystal Circuit

Yes

�6 MHzO.K? Replace X�01No

Crystal is OK. See next page to check PLL

ircuit

X201

TP1_1 pin:26MHz

Figure 4.2.1

4. TROUBLE SHOOTING


(2) Checking Mobile SW &TX Module

4. TROUBLE SHOOTING

RF_TX_EN

RF_ANT_SEL[0]

RF_ANT_SEL[1]

RF_TX_RAMP

TP2 TP3

TP1

U101

TP4SW101

Figure 4.2.4

EGSM RxRF_ANT_SEL[1]

RF_TX_RAMP

RF_ANT_SEL[0]

RF_TX_EN

TP4

TP2

TP3

TP1

TP4

(2) Checking Mobile SW &TX Modulen8.1

93 1C

L112

5.6n

R102

12

L106

1.8n

1.8n

L110

C1092.2n

701L

n8.6

U101

SKY77550-21

92

32

42

52

62

72

82

15

16

17

18

19

20

21

22

8

7

6

5

4

3

2

1

41

31

21

11

01 9

NI

_B

L_

xT

NI

_B

H_

xT

NE

_W

SV

SB

1D

VS

R

2D

VS

R

GND1

GND2

VBATT1

VBATT2

GND3

GND4

GND5

GND6

GND7

Rx2

RSVD3

Rx1

RSVD

TxEN

VRAMP

GND8

9D

NG

01

DN

G

TN

A

11

DN

G

21

DN

G

31

DN

G

DN

GP

L105

0.5p

0

L101

FL101

105

8

3

72

6

4

9

1U_P_1960/

B_P_1960/1842_5MHz_2

U_P_1842_5/

B_P_942_5/881_5MHz_1

GND1 B_P_942_5/881_5MHz_2

GND2

B_P_1960/1842_5MHz_1

GND3 GND4

942_5MHz

881_5MHz

C111

DNI

L111 10n

10nL114

L109

0.75p

0.5p

C114

401L

n8.1

SW101

43

2

1ANT COMMON

G3 G4

DNI

L138

DNI

L139

C11639p39p

C11539p

C117

C10833u

DNI

L108

C107

15p

C102

33p

C104

DNI

C101

33p

C103

DNIVBAT

1KR104

C106

10n

C10539p

L103

DNI

L113

DNI

L102

DNI

RF_HB_TX

RF_LB_TX

RF_HB_RXN

RF_LB_RXP

RF_TX_EN

RF_ANT_SEL[0]

RF_ANT_SEL[1]

RF_TX_RAMP

ANT_FEED

RF_HB_RXP

RF_LB_RXN

(50V,J,NP0)

GSM850 / DCS

(10V,2012)

EGSM / PCS

(16V,K,X7R)

RF_ANT_SEL[0]

RF_ANT_SEL[1]

RF_TX_RAMP

RF_TX_EN

TP1

TP4

TP2

TP3

U101TP4

RF_TX_RAMP

RF_ANT_SEL[1]RF_ANT_SEL[0]RF_TX_EN

TP2 TP3

Figure 4.2.4

SW101

TP1


4. TROUBLE SHOOTING

4. TROUBLE SHOOTING

Check TP1 of SW101

TP1 Signal is OK? Replace Mobile SW (SW101)No

Yes

Yes

Check PMB8815(U201)Control Signal is (GpCtrl1 GpCtrl0

No

Check TP4 of U101 ?

Check PMB8815(U201)(GpCtrl1,GpCtrl0,Tx Enable)OK ?

Yes

Replace TX Module (U101)TP2(High Band), TP3(Low Band) Signal is OK ?

No

Yes

Mobile SW & TX Module is OK.

Yes

EGSM RxEGSM Rx

Check TP1 of SW101

TP1 Signal is OK? Replace Mobile SW (SW101)No

Yes

Mobile SW & TX Module is OK.

Control Signal is (RF_ANT_SEL[0], RF_ANT_SEL[1],RF_TX_EN)OK ?

Check PMB8815(U�01)No

Yes

TP�(High Band),TP3(Low Band)Signal is OK ?

Replace TX Module (U101)No

Yes

Check TP4 of U101 ?

Yes

4. TROUBLE SHOOTING


Figure 4.1

4.3 Power On Trouble

U201

VMMC_2V85 ( TP01 : C205 )

VPMU ( TP02 : C203 )

VCORE ( TP03 : C207 )

VDDTDC (TP08 : C212)

VDDXO (TP09 : C211)

VDDMS (TP10 : C213)VDDTRX ( TP07 : C208 )

VRF1 (TP06 : C214)

VDDRF2 (TP05 : C210)

VPA_2V85 (TP04 : C204)


4. TROUBLE SHOOTING

470n

C219

FB201

75

102R

0

2.2u

C202

VDD_IO_1V8

VDD_IO_1V8

VUSBVBAT VCORE

VDDMSVDDTRX

VDD_IO_1V8

0.1u

C216

VDD_IO_1V8

VDDRF2 VDDTDC

VMMC_2V85

VDD_IO_1V8

VRF1

0.1u

C206

VPA_2V85

C203

0.1u

C214

1u

VDDXO

C211

4.7n

C205

470n

VBAT_RF2

1u

C218C213

47n

C212

47n

VPMU

C217

0.1u

VBAT

1u

C208

0.1u

C201C207

220n

C210

220n

470n

C204

C209

18p 1u

C215

VDD_EBU

PIN N10

PIN K9

DBB SUPPLIES

ABB SUPPLIES

PIN_G15 PIN_G16 PIN_E13 PIN_B14

PIN G11 PIN F6,P6

PIN P12PIN P16

VBAT_PMU

(10V)

RF SUPPLIES (CLEAN GND)

PIN P10 PIN L9 PIN M11 PIN K10

PMU SUPPLIES

RF SUPPLIES (DIRTY GND)

PIN_B16 PIN_H15

VDD_IO1

VDD1V8CPVBATSP

VDD_IO2

Speaker Supply

Seperate and shieldPIN_H12

(10V)

Q201

1

23

VBAT

VRF1VDDRF2VUSBVMMC_2V85VPA_2V85VBAT_RF2

VPMU

VDD_IO_1V8

VDD_IO_1V8

VDD_IO_1V8

VDD_IO_1V8

VBAT

10uC222

22u

C221

R205

5.6K

3.9KR203

VDDXO

VBAT

L201

3.3u

R204

100KVDDMSVCORE

470R202

VDD_IO_1V8

C220

1u

VBACKUP_BAT

VDDTDC

VDD_IO_1V8

VDD_IO_1V8

VCORE

8K

7T

8R

9M

6T

8M

8L

21

L7

1C

71

F2

1H

51

G

11

M

9L

41

F0

1P

41

E6

1G

81

R

41

B

31

E

51

H

41

G5

1A

21

J

51

F6

1F

71

P6

1P

01

G0

1K

7R

11

J1

1H

01

F3

A1

1T

21

P

8H

6P

6F

9K

11

G

01

N8

1P

31

L6

1L

9R

9T

8T

9P

N3N5R5A_D0

A_D1A_D2

1D

S_

DD

V

BF

_1

DS

1D

S_

SS

VW

S1

DS

1S

MS

SV

2S

MS

SV

PS

TA

BV

UM

P_

TA

BV

1O

ID

DV

2O

ID

DV

1U

BE

_D

DV

2U

BE

_D

DV

LL

D_

DD

V

UM

PV

UM

P_

SS

V1

ER

OC

SS

V2

ER

OC

SS

V3

ER

OC

SS

V4

ER

OC

SS

V5

ER

OC

SS

V

ER

OC

VE

RO

CD

DV

PC

8V

1D

DV

RS

LS

SV

XR

TS

SV

XR

SS

V

18

V1

DD

VP

MA

RV

GI

D_

SS

V

SM

DD

V

OX

DD

V

CD

TD

DV

GE

ND

DV

TA

BV

OC

DS

SV

XU

AV

OX

SS

V

CM

MV

BS

UV

2F

RD

DV

1F

RV

OL

_S

SV

FR

SS

VC

TR

V

NE

SN

ES

PE

SN

ES

GH

CD

DV

SC

BS

CG

HC

VT

NH

SV

VUSB_LDO_4V9

RF_TX_RAMP

NANDD_DDRA[00]NANDD_DDRA[01]NANDD_DDRA[02]

(1%)

Figure 4.2 power block of T385

TP1 TP3TP4TP2

TP7 TP5 TP9 TP8 TP10 TP6

4. TROUBLE SHOOTING


START

Check Battery Voltage> 3.35V Charge or Change Battery

No

Yes

The phone willProperly operating.

Does it work properly?

Replace the main board

No

Is the phone power on?Replace U�01 and

Re-download softwareNo

Yes

Yes

Push power-on keyAnd check the level change

into high of POWERKEY

Yes

Check the contact of power keyOr dome-switch

No

Check the voltage of The LDO outputs at U�01 Replace U�01

No

VCORE(TP03)=1.�V,

VPMU(TP0�)=1.�V,

VDDMS(TP10)=1.3V,

VPA(TP04)=�.85V,

VMMC_�V85(TP01)=�.85V,

VDDRF�(TP05)=�.5V

VDDXO(TP09)=1.3V,

VDDTDC(TP08)=1.3V,

VRF1(TP06)=1.8V


4. TROUBLE SHOOTING

U401

EAN62339701LP8727-B

C5

D2

B5

D3

D1

E1

E2

E3

E5

E4

A1

C1

B1

A4

A5

A3

A2

D5

4D

4C

3C

2C

2B

3B

4B

LC

SA

DS

¬¡

TN

I

1D

NG

2D

NG

3D

NG

4D

NG

BATT2

DNDP

U1U2

AUD1AUD2

MIC

VBUS1VBUS2

D-D+

ID

RES

DSS

EXPDET

CAP

BATT1

C418

DNI

R410

2.2K

10KR402

414C

u1

1u

C412

FB401 1800

R405 10

R401

47K

R406 10

u1314

C

VDD_IO_1V8


C4111u

USB_DPUSB_DM

UART_TXMUIC_ACC_IDUART_RX

VUSB_LDO_4V9

I2C_SDAI2C_SCL

MUIC_IO_PMUIC_IO_M

MUIC_INT_N

Connected to CN401 #1 pin (TP01)

TP1

Figure 4.5

4.4 Charging Trouble

U401 & E4,E5 Pin(TP1)

TP1

CN401 #1 pin(Connected to TP1) #1 Pin

4. TROUBLE SHOOTING


START

Battery is charged? Charging is properly operating

No

Yes

Charging isproperly operating

Battery is charged? Replace the main boardNo

Yes

Yes

Is I/O Connector(CN401)well-soldered ?

Yes

Resolder the CN401(Pin 1 : VBUS_USB)

No

Check the voltage atTP1 (Charging IC(U401))=5.1V ?

The TA is out of orderChange the TA

No

Change the battery


4. TROUBLE SHOOTING

Figure 4.6

4.5 Vibrator Trouble

-

+

Vibrator PAD / VB401

R408 (TP1)

4. TROUBLE SHOOTING


C237

22p

C238

27p11R7A7B01C01B01A01D

6B51L71L

81L6A01R

01T

21F11E11C

1TUO_PK2TUO_PK3TUO_PK5TUO_PK

BIV

BIV_SSV0TUOKLC

K23F

K23CSON_TESER

NI2T

0KLC_1S2IXR_1S2IXT_1S2I

0AW_1S2ILCS_C2IADS_C2I

FFONO

X202NX3215SA32.768KHz

21

N_TED_DSM

STR_TRAU_TB

STC_TRAU_TBTUO_MCP_TBNI_MCP_TB

K23_CTR

N_TSR_MAC

SC_IPSDI_DCL]2[TUO_YEK

N_TESER

P_BIV

VDDP_DIG1

1TNIE

6TNIE

0TNIE

0TNIE

CTR_DDV

4TNIE

OI4CC1CC

5TNIE

1GID_PDDV

MainChip

(U201)

104L

n65

56n

L402

VB401

2

1

10

R408

1u

C405

33p

C404

VIB_P

TP1


4. TROUBLE SHOOTING

SETTING : Enter the engineering mode, and set vibrator on at vibration of BB test menu

START

Check the soldering of vibrator ? Resolder the Pad.

No

Yes

Replace vibrator

Yes

Yes

Check the TP1Is PWM Signal OK?

Yes

Replace U�01No

Is the voltage at VB401 (+) high? Replace the Pad

No

VibratorWorking well !

4. TROUBLE SHOOTING


Figure 4.7

4.6 LCD Trouble

LCD_F_DATA[7]LCD_F_DATA[6]LCD_F_DATA[5]LCD_F_DATA[4]

LCD_F_DATA[3]LCD_F_DATA[2]LCD_F_DATA[1]LCD_F_DATA[0]

TP7

TP6

LCD_VSYNC_OUT(4th PIN)

LCD_F_WR_N(5th PIN)

LCD_F_CS_N(8th PIN)

LCD_F_RS(9th PIN)

TP4

TP1TP2 TP3 TP5


4. TROUBLE SHOOTING

FL603

15pF

01 5

6 4

7 3

8 2

9 1INOUT_A1INOUT_B1

INOUT_A2INOUT_B2

INOUT_A3INOUT_B3

INOUT_A4INOUT_B4

1G

2G

FL602

15pF

015

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

1G

2G

15pF

FL601

015

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

1G

2G

LCD_RSLCD_CS_N



LCD_F_DATA[7]


LCD_F_WR_NLCD_F_CS_N

LCD_F_RS

LCD_F_DATA[6]

LCD_WR_N

LCD_D[07]LCD_D[06]LCD_D[05]LCD_D[04]


LCD_RD LCD_F_RD

VA601

1u

C607

18p

1u

C622106

R

0

506R

0

VBAT

C603

2.2u

TP603

100K

R604R602DNI

606R

0

DNIR603

TP602

VPA_2V85

VDD_IO_1V8

CN601

21 20

22 19

23 18

24 17

25 16

26 15

27 14

28 13

29 12

30 11

31 10

32 9

33 8

34 7

35 6

36 5

37 4

38 3

39 2

40 1

1u

C606

LCD_LED_CA5LCD_LED_CA4LCD_LED_CA3LCD_LED_CA2LCD_LED_CA1

LCD_PWM

LCD_VSYNC_OUT



LCD_F_DATA[7]


LCD_F_WR_N

LCD_F_CS_NLCD_F_RS

LCD_F_DATA[6]

LCD_RST_N

LCD_ID

LCD_IFMODE

LCD_F_RD

ENBY0036001GB042-40S-H10-E3000 TP6

TP1TP2 TP3TP4

TP5

U601

24

23

22

21

20

19

18

8

7

6

5

9

4

10

3

11

2

12

1

31 41 51 61 71L

CS

AD

S

NE

MW

P

FC

DN

GP

LDO1

N2C

LDO2

N1C

LDO3

P1C

LDO4

P2C

AGND

VIN

LDOIN

LED6

LED5

LED4

LED3

LED2

LED1

VOUT

VPROX_3V0

VTOUCH_3V0

VCAM_DIG_1V8

106B

F 01

VCAM_IO_1V8

R620 0

C619

1u

0R619

0R608

0R609

2.2u

C610

C604

1u

C605

2.2u

VCAM_ANA_2V8

1u

C608

1u

C609C611

1u

1u

C601

C602

1u

VBAT

100K

R611

LCD_LED_CA5


LCD_PWM

I2C_SDA

I2C_SCL

BACKLIGHT_KEY

LCD_BL_CTRL

TP7

4. TROUBLE SHOOTING


4. TROUBLE SHOOTING

LCD_BL_CTRL

Graph 4.7.1. LCD Backlight Control Signal Waveform

LCD_RS

LCD_CS

LCD WRLCD_WR

Graph 4.7.2. LCD Data Waveform


4. TROUBLE SHOOTING

START

Is the connection ofCN601 with LCD connector ok ? Reassemble LCD connector

No

LCD working well !

Does LCD work properly ? Replace LCD moduleNo

Yes

Yes

Check the VoltageLevel of MLED1~%(TP1~5)are

about Battery voltage ? LCD BL Ctrl(TP7)signal is high Level)

Yes

Resoldering or Replace U601No

Check the Waveform of EMI filter ?(FL601,FL60�,FL603,TP606)

Resoldering EMI filter.(FL601,FL60�,FL603)

No

4. TROUBLE SHOOTING


4.7 Camera Trouble

CAM_F_DATA[7]CAM_F_DATA[6]CAM_F_DATA[5]CAM_F_DATA[4]CAM_F_DATA[3]

TP04 :C614TP05 :C613

TP06 :C612

TP09 :VA606(DNI)

TP03 :C619

TP02 :C608

TP01 :C609

TP07 :R211TP08 :R212

Figure 4.8


4. TROUBLE SHOOTING

U601

24

23

22

21

20

19

18

8

7

6

5

9

4

10

3

11

2

12

1

31 41 51 61 71L

CS

AD

S

NE

MW

P

FC

DN

GP

LDO1

N2C

LDO2

N1C

LDO3

P1C

LDO4

P2C

AGND

VIN

LDOIN

LED6

LED5

LED4

LED3

LED2

LED1

VOUT

VPROX_3V0

VTOUCH_3V0

VCAM_DIG_1V8

106B

F 01

VCAM_IO_1V8

R620 0

C619

1u

0R619

0R608

0R609

2.2u

C610

C604

1u

C605

2.2u

VCAM_ANA_2V8

1u

C608

1u

C609C611

1u

1u

C601

C602

1u

VBAT

100K

R611

LCD_LED_CA5


LCD_PWM

I2C_SDA

I2C_SCL

BACKLIGHT_KEY

LCD_BL_CTRL

TP1

TP2

TP3I

ND

606A

V

21 6C

u1.0

u1.031 6

C

416C

u1.0

C617

7.5p 7.5p

C620

706A

V

806A

V

VCAM_DIG_1V8

VCAM_IO_1V8

VCAM_ANA_2V8506

AV

406A

V

R616

10

CN602

1312

1411

1510

169

178

187

196

205

214

223

232

241

CAM_PCLK

CAM_MCLK

CAM_F_DATA[6]

CAM_F_DATA[5]

CAM_F_DATA[4]

CAM_F_DATA[3]

CAM_F_DATA[2]

CAM_F_DATA[1]

CAM_F_DATA[0]

CAM_F_DATA[7]

I2C_SDA

I2C_SCL

CAM_PWDN

CAM_RST_N

F_CAM_VSYNC

F_CAM_HSYNC

TP6

TP5 TP4

1n

C230

47p

C233

47p

C235

47p

C234

47p

C232C231

1n

220n

C236

VDD_IO_1V8

TP204

T12P13R12

P15P14T15R15T14R14

11

F

1T

81

T8

1A

1A

11

R7

A7

B0

1C

01

B0

1A

01

D0

KL

C_

1S

2I

XR

_1

S2

IX

T_

1S

2I

0A

W_

1S

2I

LC

S_

C2

IA

DS

_C

2I

FF

ON

O

1C

N2

CN

3C

N4

CN

SF

DD

V

MICN1MICP1MICN2MICP2

VMICVUMIC

ACDAGNDVREF

2.2KR212

R2112.2K

HS_MIC_N

PWRON

HS_MIC_P

MAIN_MIC_P

ST

R_T

RA

U_T

B

ST

C_T

RA

U_T

BT

UO_

MC

P_T

BNI_

MC

P_T

B

I2C_SDA

I2C_SCL

HS_JACK_DET

MAIN_MIC_N

VDDP_DIG1

1T

NIE

6T

NIE

0T

NIE 1

GID_

PD

DV

TP7

TP8

4. TROUBLE SHOOTING


Graph 4.8.1. I2C Data Waveform

CAM_MCLK

CAM_RESET

I2C_DATA

CAM_MCLK(26MHz)

Graph 4.8.2. MCLK Waveform

CAM_VSYNC

CAM_HSYNC

CAM_HSYNC

CAM_PCLK_26MHz

Graph 4.8.4.CAM_HSYNC vs. CAM_PCLK Waveform

Graph 4.8.3.CAM_VSYNC vs. CAM_HSYNC Waveform


4. TROUBLE SHOOTING

START

Check the each voltageLevel of TP4(�.8V) and TP5,TP6

(1.8V) is right ?(LED_PWM signalis high Level)

Resoldering or Replace U601

No

Yes

Camera working well !

Does Camera workproperly ?

Replace U�01 or Change the boardNo

Yes

Yes

Check the Waveformof I�C_CLK(TP7), I�C_DATA(TP8),

CAM_MCLK(�6MHz) ?

Yes

Replace U�01 or Change the boardNo

Check the Waveform ofData pins on U60�?

Resoldering or Replace Camera Module.No

4. TROUBLE SHOOTING


C229

47p47p

C228C227

DNI

C226

DNI

VMIC_BIAS_P

VAUD_HS_BIAS

N17N18T16R16M18M17

K17

P11P4J4T2J5G1L4J3L2P5P2RAS_n

CAS_nBC0_nBC1_nBC2_nBC3_n

SDCLKOBFCLKO_0BFCLKO_1

CKEANAMON

FSYS_EN

EPNEPPHSLHSRLSNLSP

DDR_CAS_NDDR_RAS_N

DDR_DQS[1]DDR_DQS[0]

DDR_DQM[0]DDR_DQM[1]

BT_CLK_REQ

SPK_HS_LSPK_HS_R

DDR_CLK_P

DDR_CKEDDR_CLK_N

RCV_HS_NRCV_HS_P

ABB

VDDP_DIG1

VDDP_EBU

BBChip

D501

L504

0

D502

39p

C537

CN501

EAB62429501

2

1

C528

39p

L505

0

DNI

C530

SPK_P

SPK_N

TP5

TP6

4.8 Speaker / Receiver Trouble

M501TP01 :C507

TP02 :C508

TP03 :C510 TP04 :C515

U201 BB chip

CN501 Speaker contact

TP05: L504

TP06 : L505


4. TROUBLE SHOOTING

C510 0.1u

0.1uC515

12R508

R509 12

1uC507

C508 1u

0

315R

600FB505

FB504 600

C517

2.2u

C514

39p

M501

3D

1C

2E

2A

C2

B2

B4

A4

B3

E1

A3

D1

A1

C3

B1

E4

E3C4

4D

2D

DD

VP

H

DD

VP

S

IN3- OUT+

OUT-

HPL

IN3+

HPR

CP

IN1+

CN

IN1-

IN2+

IN2-

SDA

SCL

SAI

B

DD

VP

C

SS

VP

C

DN

G

C513

39p

205R

0

C518

2.2u

C5162.2u

C519

2.2u

C503

10u

2.2u C505

VBAT

0.1uC504

VDD_IO_1V8

HS_OUT_R

HS_OUT_L

HS_GND

I2C_SDAI2C_SCL

SPK_P

SPK_N

SPK_HS_L

SPK_HS_R

RCV_HS_N

RCV_HS_P

TP1TP2

TP3TP4

START< Cal l >

Check the state ofcontact of receiver

Replace/ChangeReceiver Speaker

No

Receiver Working well!!

Yes

Yes

Check the Audio signalC507,C508,C510,C515

(TP01~04)

Yes

Change the U�01No

Check the Audio signalL504,L505(TP7,08)

Replace/Change the M501No

START< Mp3>

Check the state ofcontact of speaker

Speaker Working well!!

Yes

Check the Audio signalC507,C508,C510,C515

(TP1~4)

Yes

Check the Audio signalL504,L505(TP5,06)

No

No

No

Yes

4. TROUBLE SHOOTING


4.9 Earphone Trouble

M501

U201 BB chipC229 : TP09

C228 : TP08

C525 : TP12

C521 : TP11

R512 : TP10

FB506 : TP5

FB502 : TP2

FB507 : TP3

FB501 : TP1 FB503 : TP4

C515 : TP7

C510 : TP6


4. TROUBLE SHOOTING

C510 0.1u

0.1uC515

12R508

R509 12

1uC507

C508 1u

600FB505

FB504 600

C517

2.2u

C514

39p

M501

3D

1C

2E

2A

C2

B2

B4

A4

B3

E1

A3

D1

A1

C3

B1

E4

E3C4

4D

2D

DD

VP

H

DD

VP

S

IN3- OUT+

OUT-

HPL

IN3+

HPR

CP

IN1+

CN

IN1-

IN2+

IN2-

SDA

SCL

SAI

B

DD

VP

C

SS

VP

C

DN

G

C513

39p

C518

2.2u

C5162.2u

C519

2.2u

HS_OUT_R

HS_OUT_L

I2C_SDAI2C_SCL

SPK_P

SPK_N

SPK_HS_L

SPK_HS_R

RCV_HS_N

RCV_HS_P

TP6: C510

TP7:C515

C229

47p47p

C228C227

DNI

C226

DNI

VMIC_BIAS_P

VAUD_HS_BIAS

N17N18T16R16M18M17

K17

P11P4J4T2J5G1L4J3L2P5P2RAS_n

CAS_nBC0_nBC1_nBC2_nBC3_n


CKEANAMON

FSYS_EN

EPNEPPHSLHSRLSNLSP

DDR_CAS_NDDR_RAS_N



BT_CLK_REQ

SPK_HS_LSPK_HS_R

DDR_CLK_P

DDR_CKEDDR_CLK_N

RCV_HS_NRCV_HS_P

ABB

VDDP_DIG1

VDDP_EBU

U201BBChip

TP8: C228

TP9: C229

Q501

KTJ6131V1

3

2G

DS

4.7

R507

R506

4.7

C506

560p560p

C509

U502NCS2200SQ2T2G

2

3

1

45

VCC

VIN-

OUTVIN+ GND

525R

M1

625R

K022

47

R527

C541

120p

825R

K001

VDD_IO_1V8

C540

39pF

J501

EAG63234901JAM3333-F36-7H

M5

M4D

M4

M1

M6

ZD503

C522 22n

VDD_IO_1V8

10

R504

ZD502

1800FB507

ZD501

FB503 1800

FB502 1800

C502

27pVA501

47KR501

1n

C501

R523

DNI

L501

100n

ZD504

C525

47p47p

C524

R505

DNI

R512

2.2K

1.5K

R511

C523

2.2u

C521

39pF

C520

22n

VAUD_HS_BIAS

R524

1K

10FB501

1800FB506

R503

220K

HS_MIC_N

HS_MIC_P

HS_OUT_R

HS_OUT_L

HS_GND

HS_GND

HS_GND

HS_JACK_DET

HS_MIC

HS_MIC

HS_HOOK_DET

FM_LNA_IN

TP1:FB501

TP2:FB502

TP3:FB507

TP4:FB503

TP5:FB506 TP10:R512

TP11:C521

TP12:C525

4. TROUBLE SHOOTING


START

Can youhear the sound from

The earphone?Resolder J501 (3.5π EAR-MIC con)

No

Earphone will work properly

Yes

Can you hear the sound from

the earphone?

Yes

Set the audio part ofthe test equipment to PRBS

or Continuous wavemode

No

Resolder J501

Can you hear the sound fromthe earphone?

Yes

No

Can you hearyour voice from the earphone?

Change theearphone

and try again

ResolderFB501(TP01), FB50�(TP0�),FB507(TP03), FB503(TP04),FB506(TP05) C510(TP06)

C515(TP07)

No Change theearphone

and try again

Can you hear yourvoice from

the earphone?

NoResolder

C��8(TP08), C��9(TP09), R51�(TP10) C5�1(TP11),

C5�5(TP1�) Or change the M501(amp),U�01(BB IC)

Yes

Set the audio part of the testEquipment to echo mode


4. TROUBLE SHOOTING

Figure 4.12

4.10 Microphone Trouble

1n

C230

47p

C233

47p

C235

47p

C234

47p

C232

C229

47p47p

C228C227

DNI

C226

DNI

C231

1n

VMIC_BIAS_P

220n

C236

VDD_IO_1V8

VAUD_HS_BIAS

TP204

T12P13R12

P15P14T15R15T14R14

N17N18T16R16M18M17

K17

P11P4J4T2J5G1L4J3L2P5P2J8T5P1T4R6R2N2B1A2

11

F

1T

81

T8

1A

1A

11

R7

A7

BL

CS

_C

2I

AD

S_

C2

IF

FO

NO

1C

N2

CN

3C

N4

CN

SF

DD

V

FWPFCDP_RBn

CS0_nCS1_nCS2_nADV_n

RD_nWR_n

WAIT_nRAS_nCAS_nBC0_nBC1_nBC2_nBC3_n


CKEANAMON

FSYS_EN

EPNEPPHSLHSRLSNLSP


VMICVUMIC

ACDAGNDVREF

2.2KR212

R2112.2K

HS_MIC_N

PWRON

HS_MIC_P

MAIN_MIC_P

DDR_CAS_NDDR_RAS_N



NAND_BSY_NNAND_CS_N

BT_CLK_REQ

HS_JACK_DET

SPK_HS_LSPK_HS_R

NAND_DDR_WE_N

DDR_CLK_P

NAND_WP_N

DDR_CKE

NAND_ALE_NNAND_RE_N

NAND_CLE_N

DDR_CLK_N

DDR_CS_N

MAIN_MIC_N

RCV_HS_NRCV_HS_P

ABB

1T

NIE

6T

NIE 1

GID_

PD

DV

VDDP_DIG1

VDDP_DIG1

VDDP_EBU

U201

TP1

TP3

TP4

10u

C526

VA503VA502

K2.2

915R

C532 33n

415R

K1

R517

10033nC529

100

R518

39p

C536

VMIC_BIAS_P

C535

39p

515R

K2.2

SUMY0003816

OBM-410L44-RC1882

MIC501

2

1

39pF

C531

39p

C527

025R

0

MAIN_MIC_P

MAIN_MIC_N

TP2

TP6

TP5

C234 : TP4

C235 : TP3

C230 : TP1

R514 : TP2

C532 : TP5C529 : TP6

4. TROUBLE SHOOTING


SETTING : After initialize Agilent 8960, Test EGSM900, DCS mode ( or GSM850, PCS mode )

START

Make a phone call,then check C�30(TP1) mic bias

comes from U�01?

1. Check mic Bias signal line�. Change the U�01

No

Yes

Microphone will workproperly.

Check the signalLevel at each side

of MIC501.Is it a few tens

mV AC?

Yes

Change the microphoneNo

Check the soldering ofC53�, C5�9(TP5,6) Re-solder component

No

Check microphone sound hole

Yes


4. TROUBLE SHOOTING

4.11 SIM Card Interface Trouble

Figure 4.13

R213

02V85_VSIM

0.1u

C225

J15K18H17H18G18J18J17H14

E1G4G5F2F3F1

D2D1E2

M10

A13B13 XOX

XO


MMCI_CMDMMCI_DAT_0MMCI_CLKMMCI_DAT_1MMCI_DAT_2MMCI_DAT_3

SWIF_TXRXTDOTDITMSTCKTRST_NTRIG_INMON1

USB_DM

SIM_DATASIM_CLK

MSD_CLKMSD_D[1]

MSD_D[0]MSD_CMD

MSD_D[3]MSD_D[2]

LCD_RST_N

JTAG_TRST_N

JTAG_TDIJTAG_TMSJTAG_TCK

JTAG_TDO

SIM_SEL

SIM_RST_N


VDDP_SIM

VDDP_MMC

VDDP_DIG1

RF

U201

TP1

C318

33pC323

33pC320

33p

33p

C317C316

33p33p

C315203D

Z

713R

K7.4

0.1uC321

S3015000-12P-2_95D-A1-R0EAG63211701

C7

41

C1_1

51

C1

31

C3_1

C6

C2

C5

C5_1

C2_1

C3 C7_1

C6_1

616

DN

G

VPP2

I/O2CLK1

RST2

GND2

GND1

RST1

VPP1

CLK2

3D

NG

VCC1

5D

NG

VCC2

4D

NG

I/O1

VA308VA309

VA312VA311

VA310

813R

K7.4

2V85_VSIM2V85_VSIM2V85_VSIM 2V85_VSIM

0.1u

C319

SIM_CLK

SIM_CLKSIM_DATA_1

SIM_RST_N

SIM_DATA_2

SIM_RST_2

PIN #1

TP1 : C225

PIN#1

4. TROUBLE SHOOTING


START

Does the SIM cardsupport 3V or 1.8V ?

Change the SIM Card. This phone supports 3V or 1.8V SIM card.

No

SIM card is properly working

Yes

Yes

Is Voltage at the pin#1 of S301 �.85V or 1.8V?

Yes

Resolder S301

No

Change the SIM CardAnd try again.Does it work

Properly?

Change the U10�

No

Voltage output of VSIM LDO (TP1)

Is �.85V?

redownload SW.Does it work

Properly?

No

SIM card is properly working.

Yes

Change the main board

No


4. TROUBLE SHOOTING

Figure 4.14

4.12 Micro SD (uSD) Trouble

R308 51

203R

K01

R309 51

R310 51

R311 51

R312 51

R313 51

303R

K01

403R

K 01

503R

K01

603R

K01

1 03D

Z

103A

V

203A

V

403A

V

503A

V

470

R307

C3101u

0

623R

VDD_IO_1V8

VMMC_2V85

R301

470K

603A

V

CN301

14

13

12

11

10

8

7

6

5

4

3

2

1

9

SW1

SW2

313A

V

DNI

C311IN

D

413R

MSD_CLK

MSD_DET_N

MSD_D[1]

MSD_D[0]

MSD_CMDMSD_D[3]

MSD_D[2]

Micro_SD

TP1

TP2

TP3

R301(TP2)

VA313(TP3)C310(TP1)

4. TROUBLE SHOOTING


START

Micro SD DetectOK?

No

Replace Micro SD Card

Yes

Yes

Re-download SWCheck out MC_CLK &Data Timing(TP3) OK?

Re-attach orReplace CN301

No

uSD_DET(R301(TP�))Is High?

No

Check theC310(TP1) = �.8V? Change U�01

No

Yes

Yes

Micro SD Card willwork properly

Yes


4. TROUBLE SHOOTING

Figure 4.16.1

4.13 Bluetooth Trouble

C709

DNIC708

12n

2.7n

C714

3.3n

R703

1nC712

R702

15K

DNI

C713

R704 DNI

C711 1n U701

BCM2070B2KUBXG

F4

D5

1A

6B

7D

6E

3F

6F

A2

3A

B3

E3C3

F2

D2E5

C2F5

A4B4

C4

E4E2

D4C1

C6D1

B2

E1

B5

C5C7

D6

6A

7B

1B

7E

7F

7A

1F

3D

5A

TA

BV

OD

DV

2C

DD

V

GE

RV

XP

DD

VF

RD

DV

BS

U_D

DV

FT

DD

V

VH

GE

RVRES

RFP RST_NREG_EN

SCL

HUSB_DN

SDA TM2

SPIM_CLK PCM_INSPIM_CS_N PCM_OUT

PCM_CLKLPO_IN PCM_SYNC

XIN UART_TXDXOUT UART_RXD

UART_RTS_NGPIO_0 UART_CTS_N

GPIO_1

1C

DD

V

HUSB_DP

6S

SV

5S

SV

4S

SV

3S

SV

2S

SV

1S

SV

GPIO_6

GPIO_5

C70610n

TP701

VDD_IO_1V8

10pC704

C701

2.2u

VPA_2V85

C70310p

C70210n

VDD_IO_1V8

10nC707

1KR705

TP707

TP711

TP708

TP706

TP709

2450MHzFL701

42

31IN OUTGND1 GND2

2.2u

C705

C710 100p

TP710

TP702

TP703

TP704

TP705

FB701

600

CON_ANT_FEEDCON_ANT_FEED


BT_UART_RTSBT_UART_CTS

BT_PCM_SYNC

BT_PCM_OUTBT_PCM_INBT_PCM_CLK

BT_WAKEUP

RTC_32K

BT_CLK_26M

BT_RST_N

BT_WAKEUP_HOSTBT_CLK_REQ

BT_RF

BTCX_STATUS

BTCX_TXCONF

BTCX_RF_ACTIVE

BT_WIFI

must have 1% tolerance

When power class 1.5 is used, R307 is populated and R308 is depopulated.(Vice versa for power class 2)

QCT

IFXVBT_PA_2V6

QCT

IFXVBT_IO_1V8

VREG_MSMP_2V6

VREG_MSME_1V8

VIO_1V8

VPA_2V85

Class 2 or 1.5

VDD_IO_1V8

C711: TP1

C713: TP2

C708:TP4 C709:TP3

R703 C714

ANT701

C708(TP04)

C709(TP03)

C711(TP01)

U701

VDD_IO_1V8 C713(TP02)

4. TROUBLE SHOOTING


STARTCheck of BT Ant condition

A condition is good? Replace Ant701No

Yes

BT will work properly

A condition is good?

Yes

Give the additory solder inTP3~4(C708,C709,R703,C714)

No

Check Bias VoltageVDD_IO_1V8

ReplaceU701

No

Check condition of matching components TP3~4(C708,C709)

Yes

Yes

Check RTC3�KTP1 (C711)

ReplaceU701

No

Yes

Check BT_CLK_�6MTP�(C713)

ReplaceU701

No


4. TROUBLE SHOOTING

4.14 WiFi Trouble

ANT701

C708(TP1)

C703(TP2)

U801

X801

C821 : TP6

C819 : TP4 RTC_32K R803(TP5)

VDD_IO_1V8C818 : TP3

U802

4. TROUBLE SHOOTING


L803

DNI

L804

3.3n

U801

EAT61493201XM2400LV-DL1201TMP

1121 01

9

54 6

3 7

2 8

1VCTL1

RXANT

GND1VCTL3

2C

N

2X

T

1C

N

GND2

DD

V

1X

T

2LT

CV

C807

0.1u

C8190.1u

VBAT

1uC825C824

1u

R803

0

K001

R804

C805

10u

0

R802

218C

u7.4

VBATVDD_TCXO

C823

2.2u

C8155.6n

R801

15K

FB801

120

26MHz

TG-5010LH-87N

X801

4 2

3 1NCOUT

GNDVCC

10p

C820

C81315p

VDD_TCXO

10p

C803

10pC801 VDD_3P3

ODL

NL_T

UO

V

U802

2B

1J

4B

3A

7F

5A

1G

3D

1D

4L

3L

3K

1H

1L

2J

1K

J5

D7

D6

F6

A7

E5

J7

J6

H5

J4

E4

K4

J3

K5

H4

H3

H2

C7

B7

G7

H7

H6

G5

G6

K7

K6

L7

L5

L6

F5

F2

G2

F1

E1

D5

B1

A1

5C

4C

2L

2K

4G

3G

4F

3F

3E

4A

6E

2E

6C

2D

6A

4D

DN

G_

AN

A_

FR

WD

NG

_O

CV

_F

RW

2D

NG

_A

P_

FR

WD

NG

_L

AT

X_

FR

WD

NG

_V

RD

AP

_F

RW

DN

G_

EF

A_

FR

WD

NG

_A

NL

_F

RW

1D

NG

2D

NG

3D

NG

4D

NG

5D

NG

SS

VA

_U

MP

SS

VP

_R

S

TU

O_

OI

PG

_F

RW

2P

1D

DV

_T

UO

_O

DL

_O

CV

_F

RW

WRF_RFINWRF_RFOUT

WRF_RES_EXT

RF_SW_CTRL0RF_SW_CTRL1RF_SW_CTRL2RF_SW_CTRL3

SDIO_DATA_2SDIO_DATA_0/SPI_MISOSDIO_DATA_1/SPI_IRQSDIO_CLK/SPI_CLKSDIO_DATA_3/SPI_CSXSDIO_CMD/SPI_MOSI

JTAG_TMSJTAG_TDOJTAG_TDIJTAG_TCKJTAG_TRST_L

WRF_TCXO_VDD3P3

WRF_XTAL_VDD1P2

VDD1VDD2

VDDIO

VDDIO_SD

EXT_SMPS_REQEXT_PWM_REQ

GPIO_0

WL_RST_N

GPIO_3/BTCX_TXCONFGPIO_4/BTCX_STATUS

GPIO_5/BTCX_RF_ACTIVEGPIO_1/BTCX_FREQ

WRF_TCXO_IN

XTAL_PU

OSCOUTOSCIN

EXT_SLEEP_CLK

2_

1T

AB

DD

V_

RS

2T

AB

DD

V_

RS

XL

V_

RS

3P

3_

TU

OV

1O

DL

NL

_T

UO

V

OD

L_

DD

VO

DL

C_

TU

OV

DD

V_

AP

_F

RW

DD

V_

VR

DA

P_

FR

W

FR

_O

ID

DV

8P

1D

DV

_N

I_

OD

L_

OC

V_

FR

W

2P

1D

DV

_E

FA

_F

RW

2P

1D

DV

_A

NL

_F

RW

2P

1D

DV

_A

NA

_F

RW

1_

1T

AB

DD

V_

RS

1D

NG

_A

P_

FR

W

18p

C817

018C

2.2u

C826

0.1u

u7.4208

C

VDD_IO_1V8

18p

418C

KC

UB

C_T

UO

V

VDD_CORE

100pC821

VOUT_LNLDO

KC

UB

C_T

UO

V

ER

OC_

DD

V

u5.1108L

VDD_IO_1V8

1u

C806

ODL

NL_T

UO

V

ODL

NL_T

UO

V

U803

5

3 2

4 1VOUTVIN

GNDSTBY

DN

GP

TP804

TP807

TP809

TP810

TP801

TP805

TP803

TP802

TP806

TP808

C822

220n

220n

C816

FB802 600

220n

C808

0.5p

C818

208L

n9.3

3P3_

DD

V

3P3_

DD

V

908C

1u

118C

2.2uR805

39K

RTC_32K

BT_RF

BTCX_STATUS

BTCX_TXCONF

SPI_CLK

SPI_MISOSPI_INT

SPI_CSSPI_MOSI

WLAN_REG_ON

BTCX_RF_ACTIVE

BT_WIFI

WRF_TX

XT

_F

RW

XTALP

XTALP

RF_SW_CTRL_BT

RF_SW_CTRL_BT

RF_SW_CTRL_RX

XR_L

RT

C_W

S_F

R

WLAN_CLK_REQ

WLAN_CLK_REQ

RF_SW_CTRL_TX

RF_SW_CTRL_TX

TCXO LDO WiFi TCXO

U801

X801

TP3

VDD_IO_1V8

TP06 : XTALP

TP05 : RTC_32K


4. TROUBLE SHOOTING

STARTCheck of Wifi Ant condition

A condition is good? Replace Ant701No

Yes

Wifi willwork properly


Yes

Give the addition solder in(C818:TP3,C819:TP4)

No

Check Bias VoltageVDD IO 1V8

ReplaceU80�

No

Check condition ofmatching components

C708,C703(TP1,TP�)

Yes

Yes

Check RTC3�K(R806:TP5)

ReplaceU80�

No

Yes

Check XTAL(C8�1:TP6)

ReplaceX801

No

4. TROUBLE SHOOTING


Figure 4.17

4.15 FM Radio Trouble

J501

EAG63234901JAM3333-F36-7H

M5

M4D

M4

M1

M6FB507

FB503

FB502

C502

27pVA501

1n

C501

L501

100n

R505

DNI

10FB501

FB506

HS_GND

FM_LNA_IN

C502:TP1

L501:TP2

VA501:TP3

J 501

IN

D10 2

DZ

R217

4.7K

R21424K

470n

C240

C239

330p

C242 470n

C2411u

R215270

5.1R216

L202

22n

Q202

2

13 FM_LNA_OUT

FM_LNA_EN

FM_LNA_IN

FM Radio(LNA)

To Main Chipset!

L202 : TP04

ZD201 : TP06

C242 : TP05

Q202

Q202

VA501 : TP3

L202 : TP4

C502 : TP1L501 : TP2

ZD201 : TP6

C242 : TP5


4. TROUBLE SHOOTING

STARTCheck of ear jack condition

A condition is good? Replace J501No

Yes

FM_radio willwork properly


Yes

Give the additorysolder in (L501,C50�,VA501: TP1,�,3)

No

Check condition of matching components(L501,C50�,VA501: TP1,�,3)

Yes

Yes

A condition is good? Replace Q�0� No

Yes

Check Bias Voltage VDD_FMR(C��4) Replace U�01

No

Check Bias Voltage FM LNA(LNA_EN_L�0� : TP 04)

4. TROUBLE SHOOTING


4.16 Touch trouble

1n

C230

47p

C233

47p

C235

47p

C234

47p

C232C231

1n

220n

C236

VDD_IO_1V8

TP204

T12P13R12

P15P14T15R15T14R14

11

F

1T

81

T8

1A

1A

11

R7

A7

B0

1C

01

B0

1A

01

D0

KL

C_

1S

2I

XR

_1

S2

IX

T_

1S

2I

0A

W_

1S

2I

LC

S_

C2

IA

DS

_C

2I

FF

ON

O

1C

N2

CN

3C

N4

CN

SF

DD

V


VMICVUMIC

ACDAGNDVREF

2.2KR212

R2112.2K

HS_MIC_N

PWRON

HS_MIC_P

MAIN_MIC_P

ST

R_T

RA

U_T

B

ST

C_T

RA

U_T

BT

UO_

MC

P_T

BNI_

MC

P_T

B

I2C_SDA

I2C_SCL

HS_JACK_DET

MAIN_MIC_N

VDDP_DIG1

1T

NIE

6T

NIE

0T

NIE 1

GID_

PD

DV

TP2 TP3

404A

V

C416

0.1u

IN

D504

AV

604A

VI

ND

GB042-10S-H10-E3000

CN403

65

74

83

92

101

VTOUCH_3V0

K7.4

214R

VA407

VDD_IO_1V8

I2C_SDA

I2C_SCL

TOUCH_ID

TOUCH_INT No7=NC(VDDIO)

No9=NC(reset)

TP1

TP3 : C212

TP2 : C211

TP1 : R412


4. TROUBLE SHOOTING

START

Yes

Resolder CN404 orreplace touch panel

Check I�C signal of U�01R��9, R�30 (TP3~4)

Yes

Resolder or ReplaceU�01

No

Check supply voltage of U40�C417 (TP1)

Check touch signal ZD40�~405 (TP5~8)

Resolder or ReplaceU40�

No

Yes

Check CN404 and touch panel

contactContact well CN404 and

touch panel

No

Touch will workproperly

Yes

4. TROUBLE SHOOTING


4.17 Memory trouble

TP301

B2

K3

K2

K1

J4A0A1A2A3A4

NANDD_DDRA[00]NANDD_DDRA[01]NANDD_DDRA[02]NANDD_DDRA[03]NANDD_DDRA[04]

TP301

TP303

TP304

J1

G2

F2

H2

D3

F8

G8/CK

CKCKE/CS

/RAS/CAS DDR_CAS_N

DDR_RAS_N

DDR_CLK_PDDR_CKE

DDR_CLK_N

DDR_CS_NTP304

TP301TP304


4. TROUBLE SHOOTING

START

Check TP301 NANDD_DDRA[00]of U301

Yes

Resolder or ReplaceU301

No

Check Test PointTP301 TP304

Check TP304 DDR_CS_Nof U301

Resolder or ReplaceU301

No

Yes

Memory will workproperly

4. TROUBLE SHOOTING


Process Detail Guide Description

Disassemble Main Board

1. Disassemble the main board from the Phone.�. Detach gold

gasket tape from shield-can via

pincette.Main Board Detach gold gasket tape

Cut off shield can

1. Cut 4-point of shield-can that

checked red quadrangle via

nipper.�. Flowing iron

through applying heat. In same

time lift a piece of shield can with

a pincette.3. Separated

shield-can throw away.

Cut 4-points that checked red quadrangle

Apply heat to shield-can that removing part

Shield-can cut off Main board

Remove Memory

1. Apply heat via heat-gun.�. Pick up

through pincette when complete melting solder.

3. Polish-up around of

Memory IC pad via Solder paste

for deliberate mounting

Memory IC.

Melt solder via heat-gun. Polish up Memory IC pad area


4. TROUBLE SHOOTING

Soldering Memory and

Shield can

1. Ready to rework new

normal Memory.�. Be locate

exactly position via pincette.

3. Apply heat via heat-gun.

4. Be careful when using

heat-gun for not blowing up other

parts.5. Find out

shield-can and soldering

Ready to rework memory Soldering Memory IC. Soldering shield

can.

Attaching gold gasket

and assemble

1. Attach gold gasket and

remove vinyl through pincette.

�. Assemble other parts that is disassembled

before.3. Function test after finishing

assemble.Attach gold gasket Assemble phone Function test

4. TROUBLE SHOOTING


4.18 Proximity Sensor on/off Trouble Shooting

0

R521

935C

u1.0

C534

1u

VDD_IO_1V8

u01835

C

U501

EUSY0376201

GP2AP002S00F

54

63

72

81LEDA SCL

LEDC SDA

VCC VIO

VOUT GND

335C

u7.4

R522

10

VPROX_3V0

I2C_SDA

I2C_SCL

PROX_INT

TP3

TP2

TP1

TP1 : VA607 TP2 : VA608

TP3


4. TROUBLE SHOOTING

Proximity Sensor is worked as below :Call connected -> Object moved at the sensor -> Control the screen’s on/off operation automatically

START

LCD OFF?

Change the ProximitySensor (U501)

No

Call Connected & Object moved atProximity Sensor

Check I�C_SCL/SDA & PROX_INT

Change the Main boardNo

END

Yes

Work Well?

Yes

No

Yes

Measurement

VREG_MSME_1.8V

VREG_PROX_�.6V

PROX_OUT

PROX_I�C_SCL / SDA

5. DOWNLOAD


5. DOWNLOAD

LG-T385

LG-T385


5. DOWNLOAD

LG-T385

LG-T385

LG-T385

5. DOWNLOAD


LG-T385

LG-T385

LG-T385


5. DOWNLOAD

LG-T385

5. DOWNLOAD


5. DOWNLOAD


‘LG-T385’


5. DOWNLOAD


5. DOWNLOAD

LG-T385

LG-T385

LG-T385 ‘LG-T385’

LG-T385 LG-T385

LG-T385 ‘LG-T385’

LG-T385

5. DOWNLOAD


LG-T385 LG-T385

LG-T385 LG-T385

LG-T385 LG-T385

- 123 - Copyright © 2012 LG Electronics. Inc. All right reserved.Only for training and service purposes

LGE Internal Use Only

7. CIRCUIT DIAGRAM

n8.1

931C

L112

5.6n

C110 3.3n

R102

12

L106

1.8n

1.8n

L110

C1092.2n1

R107

ANT103

HJ-BCT-04Y

1

701L

n8.6

C112

1.2p

U101

SKY77550-21

92

32

42

52

62

72

82

15

16

17

18

19

20

21

22

8

7

6

5

4

3

2

1

41

31

21

11

01 9

NI

_B

L_

xT

NI

_B

H_

xT

NE

_W

SV

SB

1D

VS

R

2D

VS

R

GND1

GND2

VBATT1

VBATT2

GND3

GND4

GND5

GND6

GND7

Rx2

RSVD3

Rx1

RSVD

TxEN

VRAMP

GND8

9D

NG

01

DN

G

TN

A

11

DN

G

21

DN

G

31

DN

G

DN

GP

L105

0.5p

C11327n

0

L101

FL101

105

8

3

72

6

4

9

1U_P_1960/

B_P_1960/1842_5MHz_2

U_P_1842_5/

B_P_942_5/881_5MHz_1

GND1 B_P_942_5/881_5MHz_2

GND2

B_P_1960/1842_5MHz_1

GND3 GND4

942_5MHz

881_5MHz

C111

DNI

HJ-ICT-03Y

ANT102

FEED

HJ-ICT-03Y

ANT101

FEED

L111 10n

10nL114

L109

0.75p

0.5p

C114

401L

n8.1

SW101

43

2

1ANT COMMON

G3 G4

DNI

L138

DNI

L139

C11639p39p

C11539p

C117

C10833u

DNI

L108

C107

15p

C102

33p

C104

DNI

C101

33p

C103

DNIVBAT

1KR104

C106

10n

C10539p

L103

DNI

L113

DNI

L102

DNI

RF_HB_TX

RF_LB_TX

RF_HB_RXN

RF_LB_RXP

RF_TX_EN

RF_ANT_SEL[0]

RF_ANT_SEL[1]

RF_TX_RAMP

ANT_FEED

ANT_FEED

RF_HB_RXP

RF_LB_RXN

RF

HIGH

LOW

(50V,J,NP0)

GSM850 / DCS

HIGH

BS

(10V,2012)

1-0-1-2 ANT_PAD_Ver1.0

LOW

LOW

LOW

HIGH

HIGH

MODE

STANDBY

RX1

RX2

850/900 TX

DCS/PCS TX

VSW_EN

LOW

HIGH

HIGH

HIGH

HIGH

Tx Enable

LOW

LOW

EGSM / PCS

(16V,K,X7R)

7. CIRCUIT DIAGRAM



7. CIRCUIT DIAGRAM

CN201

9

8

7

6

5

4

3

2

1

C237

22p

C238

27p

Q201

1

23

DNI

C245

C223

DNI

IN

D102

DZ

X201 TSX-3225

26MHz

21

34GND2 HOT2

HOT1 GND1

R213

0

470n

C219

VDDTRX342

C

p5.7

1n

C230

47p

C233

47p

C235

47p

C234

47p

C232

C229

47p47p

C228C227

DNI

C226

DNI

VDD_IO_1V8

C231

1n

VMIC_BIAS_P

220n

C236

442C

p5.7

VDD_IO_1V8

100K

R209

100K

R210

812R

01

2V85_VSIM

0.1u

C225

4.7nC224

FB201

75

VBAT

VRF1VDDRF2VUSBVMMC_2V85VPA_2V85VBAT_RF2

VPMU

VDD_IO_1V8

VDD_IO_1V8

VDD_IO_1V8

SC201

1

SC202

1

VDD_IO_1V8

VBAT

10uC222

VAUD_HS_BIAS

TP206

TP205

22u

C221

TP207

R205

5.6K

3.9KR203

VDDXO

VBAT

L201

3.3u

R204

100KVDDMSVCORE

K7.4

602R

470R202

VDD_IO_1V8

C220

1u

VBACKUP_BAT

VBACKUP_BAT

TP204

102R

0

VDDTDC

VDD_IO_1V8

VDD_IO_1V8

VCORE

2.2u

C202

VDD_IO_1V8VDD_IO_1V8

VUSBVBAT VCOREVDDMSVDDTRX

VDD_IO_1V8

0.1u

C216

VDD_IO_1V8

VDDRF2 VDDTDC VMMC_2V85VDD_IO_1V8

VRF1

0.1u

C206

VPA_2V85

C203

0.1uC214

1u

VDDXO

C211

4.7n

C205

470n

VBAT_RF2

1u

C218C213

47n

C212

47n

VPMU

C217

0.1u

VBAT

1u

C208 0.1u

C201C207

220nC210

220n470n

C204C209

18p 1u

C215

R217

4.7K

U201

8K

7T

8R

9M

6T

8M

8L

21

L7

1C

71

F2

1H

51

G

11

M

9L

41

F0

1P

41

E6

1G

81

R

41

B

31

E

51

H

41

G5

1A

21

J

51

F6

1F

71

P6

1P

01

G0

1K

7R

11

J1

1H

01

F3

A1

1T

21

P

8H

6P

6F

9K

11

G

01

N8

1P

31

L6

1L

9R

9T

8T

9P

T12P13R12

P15P14T15R15T14R14

N17N18T16R16M18M17

K17

P11P4J4T2J5G1L4J3L2P5P2J8T5P1T4R6R2N2B1A2

G6H4H2G2G3H3H1H6K4K2J1K3L3J2M2L1M3R1P7N6N4L5M5T3R4R3P3M1M4N3N5R5

L11K12L10

G12H13J13F13G13

C6J14J15K18H17H18G18J18J17H14

E1G4G5F2F3F1

D2D1E2

M10

A13B13K14K13

B4A5B5A4

J10H9J9

H10

B16C14B17B18C15B15C16E18F18C18D18A16A17

R17T17M13M12N13R13T13N14

11

F

1T

81

T8

1A

1A

11

R7

A7

B0

1C

01

B0

1A

01

D

6B

51

L7

1L

81

L6

A0

1R

01

T

21

F1

1E

11

C1

1B

11

D2

1E

21

D2

1C

21

B2

1A

11

A

8E

9G

8F

9E

9F

8G

01

E9

C8

C9

B9

A7

C8

B8

A

2B

2C

4E

6D

5C

5E

5F

1C

4D

3B

3C

4C

5D

4F

3D

3E

0D

_F

ID

1D

_F

ID

2D

_F

ID

3D

_F

ID

4D

_F

ID

5D

_F

ID

6D

_F

ID

7D

_F

ID

8D

_F

ID

1S

C_

FI

DD

C_

FI

DR

W_

FI

DD

R_

FI

DD

H_

FI

DD

V_

FI

DT

ES

ER

_F

ID

0D

_F

IC

1D

_F

IC

2D

_F

IC

3D

_F

IC

4D

_F

IC

5D

_F

IC

6D

_F

IC

7D

_F

IC

KL

CP

_F

IC

CN

YS

H_

FI

CC

NY

SV

_F

IC

2T

UO

KL

CD

P_

FI

CT

ES

ER

_F

IC

0N

I_

PK

1N

I_

PK

2N

I_

PK

3N

I_

PK

4N

I_

PK

5N

I_

PK

0T

UO

_P

K1

TU

O_

PK

2T

UO

_P

K3

TU

O_

PK

5T

UO

_P

K

BI

V

BI

V_

SS

V0

TU

OK

LC

K2

3F

K2

3C

SO

N_

TE

SE

RN

I2

T

0K

LC

_1

S2

IX

R_

1S

2I

XT

_1

S2

I0

AW

_1

S2

IL

CS

_C

2I

AD

S_

C2

IF

FO

NO

1C

N2

CN

3C

N4

CN

SF

DD

V

M0M1M2VDD_FMRFMRINFMRINXCP1CP2

TX1FE2RX12RX12XRX34RX34XVDETPABSPABIASFE1TX2PAENVDDTRX

USIF2_TXD_MTSRUSIF2_RXD_MRSTUSIF2_RTS_NUSIF2_CTS_NUSIF1_TXD_MTSRUSIF1_RXD_MRSTUSIF1_RTS_NUSIF1_CTS_NDPLUSDMINUSXOXXO


MMCI_CMDMMCI_DAT_0MMCI_CLKMMCI_DAT_1MMCI_DAT_2MMCI_DAT_3

SWIF_TXRXTDOTDITMSTCKTRST_NTRIG_INMON1MON2MON3FSYS1FSYS2DIGUP_CLKDIGUP1DIGUP2

LEDFBNLEDFBPLEDDRV

A_D0A_D1A_D2A_D3A_D4A_D5A_D6A_D7A_D8A_D9

A_D10A_D11A_D12A_D13A_D14A_D15

A0A1A2A3A4A5A6A7A8A9

A10A11A12A13A14A15

FWPFCDP_RBn

CS0_nCS1_nCS2_nADV_n

RD_nWR_n

WAIT_nRAS_nCAS_nBC0_nBC1_nBC2_nBC3_n


CKEANAMON

FSYS_EN

EPNEPPHSLHSRLSNLSP


VMICVUMIC

ACDAGNDVREF

1D

S_

DD

V

BF

_1

DS

1D

S_

SS

VW

S1

DS

1S

MS

SV

2S

MS

SV

PS

TA

BV

UM

P_

TA

BV

1O

ID

DV

2O

ID

DV

1U

BE

_D

DV

2U

BE

_D

DV

LL

D_

DD

V

UM

PV

UM

P_

SS

V1

ER

OC

SS

V2

ER

OC

SS

V3

ER

OC

SS

V4

ER

OC

SS

V5

ER

OC

SS

V

ER

OC

VE

RO

CD

DV

PC

8V

1D

DV

RS

LS

SV

XR

TS

SV

XR

SS

V

18

V1

DD

VP

MA

RV

GI

D_

SS

V

SM

DD

V

OX

DD

V

CD

TD

DV

GE

ND

DV

TA

BV

OC

DS

SV

XU

AV

OX

SS

V

CM

MV

BS

UV

2F

RD

DV

1F

RV

OL

_S

SV

FR

SS

VC

TR

V

NE

SN

ES

PE

SN

ES

GH

CD

DV

SC

BS

CG

HC

VT

NH

SV

R21424K

470n

C240

C239

330p

2.2KR212

R2112.2K

C242 470n

C2411u

R215270

5.1R216

L202

22n

Q202

2

13

BAT201

SMZY0023501311HR-VG1

X202NX3215SA32.768KHz

21

]0[A

TA

D_M

AC

]1[A

TA

D_M

AC

]2[A

TA

D_M

AC

]3[A

TA

D_M

AC

]4[A

TA

D_M

AC

]5[A

TA

D_M

AC

]6[A

TA

D_M

AC

]7[A

TA

D_M

AC

CN

YS

H _M

AC

KLC

P_M

AC

CN

YS

V_M

AC

KL

CM

_M

AC

SR _

DCL

HS_MIC_N

USB_DPUSB_DM

PWRON

UART_TX

SIM_DATASIM_CLK

HS_MIC_P

MSD_CLK

N_T

ED_

DS

M

MSD_D[1]

MSD_D[0]MSD_CMD

MSD_D[3]MSD_D[2]

MAIN_MIC_P

N_S

C_D

CL

DDR_CAS_NDDR_RAS_N



NAND_BSY_NNAND_CS_N

DDR_D[15]

DDR_D[05]

DDR_D[01]DDR_D[02]

DDR_D[00]

DDR_D[14]DDR_D[13]DDR_D[12]DDR_D[11]DDR_D[10]DDR_D[09]DDR_D[08]DDR_D[07]DDR_D[06]

DDR_D[04]DDR_D[03]


UART_RX

VUSB_LDO_4V9

ST

R_T

RA

U_T

B

ST

C_T

RA

U_T

B

RF_HB_TX

RF_LB_TX

RF_HB_RXN

RF_LB_RXP

RF_TX_EN

BAT_TEMP

BT_PCM_SYNC

TU

O_M

CP_

TB

NI_M

CP_

TB

BT_PCM_CLK

TU

O_C

NY

SV_

DCL

PU

EK

AW _

TB

K23_C

TR

LCD_RST_N

BT_CLK_26MBT_RST_N

TS

OH_

PU

EK

AW_

TB

BT_CLK_REQ

I2C_SDA

I2C_SCL

ND

WP_

MA

C

N_T

SR_

MA

C

SPI_CLK

SPI_MISO

SPI_INT

SC

_I

PS

SPI_MOSI

DI_D

CL

]3[NI_

YE

K

]2[T

UO_

YE

K

N_R

W_D

CL

N_T

ES

ER

RESET_N

JTAG_TRST_N

JTAG_TRST_N

JTAG_TDI

JTAG_TDI

JTAG_TMS

JTAG_TMS

JTAG_TCK

JTAG_TCK

JTAG_TDO

JTAG_TDO

P_BI

V

]70[D_

DCL

]60[D_

DCL

]50[D_

DCL

]40[D_

DCL

]30[D_

DCL

]20[D_

DCL

]10[D_

DCL

]00[D_

DCL

N_T

NI_CI

UM

TOUCH_ID

]1[NI_

YE

K

HS_JACK_DET

SPK_HS_LSPK_HS_R

WLAN_REG_ON

RF_ANT_SEL[0]

RF_ANT_SEL[1]

RF_TX_RAMP

RF_HB_RXPRF_LB_RXN

FM_LNA_OUT

FM_LNA_OUT

TNI_

HC

UO

T

TE

D_K

OO

H_S

HL

ES

_T

SR

_M

IS

SIM_SEL

NAND_DDR_WE_N

NANDD_DDRA[00]NANDD_DDRA[01]

NANDD_DDRA[10]NANDD_DDRA[11]NANDD_DDRA[12]NANDD_DDRA[13]NANDD_DDRA[14]NANDD_DDRA[15]

NANDD_DDRA[02]NANDD_DDRA[03]NANDD_DDRA[04]NANDD_DDRA[05]NANDD_DDRA[06]NANDD_DDRA[07]NANDD_DDRA[08]NANDD_DDRA[09]

DDR_CLK_P

NAND_WP_N

DDR_CKE

NAND_ALE_NNAND_RE_N

NAND_CLE_N

DDR_CLK_N

DDR_CS_N

SIM_RST_N

MAIN_MIC_N

LR

TC_L

B_D

CL

RCV_HS_NRCV_HS_P

TNI_

XO

RP

FM_LNA_EN

NE_

ANL_

MF

DR_

DCL

FM_LNA_IN

VDD_EBU

PIN N10PIN K9

DBB SUPPLIES ABB SUPPLIES

PIN_G15 PIN_G16 PIN_E13 PIN_B14

PIN G11 PIN F6,P6PIN P12PIN P16

VBAT_PMU

(10V)

RF SUPPLIES (CLEAN GND)

PIN P10 PIN L9 PIN M11 PIN K10

PMU SUPPLIESRF SUPPLIES (DIRTY GND)

PIN_B16 PIN_H15

VDD_IO1 VDD1V8CPVBATSP

VDD_IO2 Speaker Supply

Seperate and shieldPIN_H12

(10V)

(1%)

2-5-1-2_IFX_XMM215x_NAND_V0.1

FM Radio(LNA)


Close to the 26MHz XTAL

INT PORT

BT_DBB_INT

DIF_RESET

EINT4

USIF1_CTS_N _CHG_EOC

SLIDET2IN

SIGNAL NAME

DIGUP2

MUIC_INTCC0CC1IO

EINT7

CC1CC6IO

EINT0

PIN NAME

uSD_DET

USIF1_RTS_N

VDDP_EBU

ABB

VDDP_DIG1

1T

NIE

FOR ESD (LCD - TOP Contact)

6T

NIE

0T

NIE

0T

NIE

CT

R_D

DV

4T

NIE

VDDP_DIG1

OI3C

C1C

C

6T

NIE

VDDP_DIG1

0T

NIE

1T

NIE

OI0C

C1C

C

OI4C

C0C

C

OI4C

C1C

C

5T

NIE

VDDP_SIM

VDDP_MMC

VDDP_DIG1

RF

CC0CC1IO

CC0CC7IO

EINT4/EINT1

VDDP_DIG1

EINT3

EINT2

CC1CC6IO

ABB

RF

VDDP_ULPI

RF

VDDP_DIG2

7T

NIE

1GI

D_P

DD

V

1GI

D_P

DD

V

Shield Can Super Cap

To Main Chipset!VDDP_DIG1

AGR+MCP

PAM

VDDP_DIG1

VDDP_EBU



7. CIRCUIT DIAGRAM

R308 51

203R

K01

R309 51

R310 51

R311 51

R312 51

R313 51

303R

K01

403R

K01

503R

K01

603R

K01

C318

33pC323

33pC320

33p

33p

C317C316

33p33p

C315

103D

Z

203D

Z

103A

V

203A

V

403A

V

503A

V

713R

K7.4

0.1uC321

C30433p

33pC305

S3015000-12P-2_95D-A1-R0EAG63211701

C7

41

C1_1

51

C1

31

C3_1

C6

C2

C5

C5_1

C2_1

C3 C7_1

C6_1

616

DN

G

VPP2

I/O2CLK1

RST2

GND2

GND1

RST1

VPP1

CLK2

3D

NG

VCC1

5D

NG

VCC2

4D

NG

I/O1

K001

223R

470

R307

C3101u

VA308VA309

VA312VA311

VA310

C301

4.7u

TP301

TP302

813R

K7.4

TP303

TP304

TP305

2V85_VSIM2V85_VSIM

FSA2259UMX

U302

EUSY01865046

5

7

4

8

3

9

2

10

1C

CV

2B1

1B1

2A

1A

S2

S1

0B2

1B0

DN

G

2V85_VSIM

R325

100K

0

623R

VDD_IO_1V8

VMMC_2V85

100K

R324

R301

470K

2V85_VSIM

603A

V

2V85_VSIM

0.1u

C319

CN301

14

13

12

11

10

8

7

6

5

4

3

2

1

9

SW1

SW2

C322 1u

313A

V

R321

10K

DNI

C311IN

D

413R

10K

R3232V85_VSIM

IN

D

723R

C302

0.1u

C303

0.1u

C312

0.1u

C313

0.1u 0.1u

C314

C306

4.7u

C309

0.1u

C308

0.1u0.1u

C307

VDD_IO_1V8

VDD_IO_1V8

VDD_IO_1V8

913R

K01VDD_IO_1V8

U301 EAN61927501

H9DA2GH1GHMMMR-46M

B6

B3

B4

A4

A7

A3

A6

M8

L7

M7

N5

N4

M4

N3

N2

L8

M6

L6

N7

L5

M3

M2

M1

H7

D5

H8

D7

J1

G2

F2

H2

D3

F8

G8

B7

B8

C7

C8

C6

D8

C5

E6

J5

J7

K8

J8

K7

K6

K5

K4

J2

H3

E1

E2

J3

C4

D2

C3

D1

C2

B2

K3

K2

K1

J4

N9

N6

M10

L9

L2

K10

J10

H9

H1

G9

F10

E9

D10

C9

B10

B5

B1

A9

M5

A5

L4

L3

J6

H6

H5

H4

G7

G6

G5

G4

G3

F7

F6

F5

F4

F3

F1

E8

E7

E5

E4

E3

D6

D4

A2

M9

L10

K9

J9

H10

F9

E10

D9

C10

B9

N8

L1

G10

G1

C1

A8

01

N

1N

01

A

1A

1C

N6

2C

N8

2C

N9

2C

N

VDD1VDD2VDD3VDD5VDD4VDD6

VDDQ1VDDQ6VDDQ5VDDQ4VDDQ10VDDQ9VDDQ2VDDQ8VDDQ7VDDQ3

NC27NC20NC21NC9NC19NC8NC11NC12NC17NC18NC7NC16NC25NC6NC10NC5NC13NC14NC4NC2NC24NC22NC23A13NC3

VCC1VCC2

VSS1VSS4VSS8VSSQ5VSSQ4VSSQ9VSSQ8VSSQ3VSS2VSS3VSSQ10VSSQ1VSSQ2VSS5VSSQ6VSSQ7VSS6VSS7

A0A1A2A3A4A5A6A7A8A9

A10A11A12BA0BA1

DQ0DQ1DQ2DQ3DQ4DQ5DQ6DQ7DQ8DQ9

DQ10DQ11DQ12DQ13DQ14DQ15

/CKCK

CKE/CS

/RAS/CAS/WEDUDQMLDQMUDQSLDQS

IO0IO1IO2IO3IO4IO5IO6IO7IO8IO9

IO10IO11IO12IO13IO14IO15

/CE/RE/WECLEALE/WPR/B

SIM_DATA

SIM_CLK

SIM_CLK

MSD_CLK

MSD_DET_N

MSD_D[1]

MSD_D[0]

MSD_CMDMSD_D[3]

MSD_D[2]

DDR_CAS_NDDR_RAS_N



NAND_BSY_N

NAND_CS_N

DDR_D[15]

DDR_D[05]

DDR_D[01]DDR_D[02]

DDR_D[00]

DDR_D[14]DDR_D[13]DDR_D[12]DDR_D[11]DDR_D[10]DDR_D[09]DDR_D[08]DDR_D[07]DDR_D[06]

DDR_D[04]DDR_D[03]

SIM_RST_SELSIM_SEL

NAND_DDR_WE_N

NAND_DDR_WE_N

NANDD_DDRA[00]

NANDD_DDRA[00]NANDD_DDRA[01]

NANDD_DDRA[01]

NANDD_DDRA[10]

NANDD_DDRA[10]

NANDD_DDRA[11]

NANDD_DDRA[11]

NANDD_DDRA[12]

NANDD_DDRA[12]

NANDD_DDRA[13]

NANDD_DDRA[13]

NANDD_DDRA[14]

NANDD_DDRA[14]

NANDD_DDRA[15]

NANDD_DDRA[15]

NANDD_DDRA[02]

NANDD_DDRA[02]

NANDD_DDRA[03]

NANDD_DDRA[03]

NANDD_DDRA[04]

NANDD_DDRA[04]

NANDD_DDRA[05]

NANDD_DDRA[05]

NANDD_DDRA[06]

NANDD_DDRA[06]

NANDD_DDRA[07]

NANDD_DDRA[07]

NANDD_DDRA[08]

NANDD_DDRA[08]

NANDD_DDRA[09]

NANDD_DDRA[09]

DDR_CLK_P

NAND_WP_N

DDR_CKE

NAND_ALE_N

NAND_RE_N

NAND_CLE_N

DDR_CLK_N

DDR_CS_N

SIM_DATA_1

SIM_DATA_1

SIM_RST_N

SIM_DATA_2

SIM_DATA_2

SIM_RST_2

SIM_RST_2

DAT1

SIM Switch

SIM_CONNECTOR Dual

T8DAT0

Micro_SD

8-3-1-2_Push_168T_Ver1.0

T5

T4

T3

If Dual SIM, R327=DNI and U302=Insert.

T2

T1

If single SIM, R327=0ohm and U302=DNI.

Pin Number

MCP2-1_2G_1G DDRx16_hynix

VSSCLKVDD

CMD

CD/DAT3

DAT2

Description

T7

MSD_DET_N

T6

High

LowInsert

No card



7. CIRCUIT DIAGRAM

U401

EAN62339701LP8727-B

C5

D2

B5

D3

D1

E1

E2

E3

E5

E4

A1

C1

B1

A4

A5

A3

A2

D5

4D

4C

3C

2C

2B

3B

4B

LC

SA

DS

¬¡

TN

I

1D

NG

2D

NG

3D

NG

4D

NG

BATT2

DNDP

U1U2

AUD1AUD2

MIC

VBUS1VBUS2

D-D+

ID

RES

DSS

EXPDET

CAP

BATT1

C401

1u

TP401

TP416

TP415

33p

C417

404A

V

C416

0.1u

C418

DNI

104L

n65

56n

L402

C406

47u

CN402

3

2

1

D1

D2

TP414

TP413

TP412

TP411

TP410

TP409

TP408

TP407

TP406

TP405

TP404

TP403

TP402

TP417

TP420

TP419

TP418

IN

D504

AV

604A

VI

ND

ZD401

C407

33p

04-5161-005-101-868+

EAG63149901

CN401

11

10

9

5

4

3

2

1

8

7

6

GB042-10S-H10-E3000

CN403

65

74

83

92

101

R410

2.2K

ZD402

10KR402

414C

u1

C410

22pF

VB401

2

1

1u

C412

CN404

3

2

1

FB401 1800

2.2u

C409

VA403

C402

22pF

ZD404

VTOUCH_3V0

K7.4

214R

R407 10

VDD_IO_1V8

VA401ZD403

VBAT

VUSB_CHG_IN

R405 10

680R421

CN405

4

3

2

1

R403

51K

R409

100K

VA407

R419 680

VDD_IO_1V8

VA409VA408

6.8K

R413

C415

0.1u

VA402

VBACKUP_BAT

680R420

FL401

INOUT

GND1GND2

C408

10n

10

R408

R401

47K

R406 10

u1314

CVDD_IO_1V8


C4111u

1u

C405

33p

C404

R418

100K

1K

R417

USB_DPUSB_DM

PWRON

UART_TXMUIC_ACC_ID

MUIC_ACC_ID

UART_RX

VUSB_LDO_4V9

BAT_TEMP

I2C_SDA

I2C_SDA

I2C_SCL

I2C_SCL KEY_IN[3]KEY_OUT[2]

VIB_P

MUIC_IO_P

MUIC_IO_P

MUIC_IO_M

MUIC_IO_M

MUIC_INT_N

TOUCH_ID

KEY_IN[1]

TOUCH_INT

ESD GNDSIDE KEY INTERFACE

SEND

Line Width: 2mm

X

MINI ABB ( MUIC + CHARGE ID)

(1%)

MOTOR

KEY_OUT2 KEY_OUT3

CLR

4-5-1-1 Battery Connector4-2-3-1 Micro-USB 5pin normal

ENDVol_UP

Vol_down

KEY_IN3

KEY_IN1

No7=NC(VDDIO)

KEY_IN0

C-Touch Connector

DNI

DNI

No9=NC(reset)

POWER ON



7. CIRCUIT DIAGRAM

Q501

KTJ6131V1

3

2G

DS

4.7

R507

R506

4.7

0

R52110u

C526

C506

560p560p

C509

U502NCS2200SQ2T2G

2

3

1

45

VCC

VIN-

OUTVIN+ GND

525R

M1

625R

K022

47

R527

C541

120p

825R

K001

VDD_IO_1V8

C510 0.1u

0.1uC515

935C

u1.0

C540

39pF

J501

EAG63234901JAM3333-F36-7H

M5

M4D

M4

M1

M6

ZD503

VA503VA502

C522 22n

VDD_IO_1V8

10

R504

ZD502

K2.2

915R

C532 33n

12R508

R509 12

1uC507

C508 1u

D501

415R

K1

L504

0

D502

0

315R

R517

10033nC529

39p

C537

100

R518

1800FB507

600FB505

ZD501

FB504 600

39p

C536

VMIC_BIAS_P

C535

39p

515R

K2.2

FB503 1800

FB502 1800

C502

27pVA501

47KR501

SUMY0003816

OBM-410L44-RC1882

MIC501

2

1

C517

2.2u

39pF

C531

1n

C501

R523

DNI

C534

1u

VDD_IO_1V8

C514

39p

u01835

C

CN501

EAB62429501

2

1

M501

3D

1C

2E

2A

C2

B2

B4

A4

B3

E1

A3

D1

A1

C3

B1

E4

E3C4

4D

2D

DD

VP

H

DD

VP

S

IN3- OUT+

OUT-

HPL

IN3+

HPR

CP

IN1+

CN

IN1-

IN2+

IN2-

SDA

SCL

SAI

B

DD

VP

C

SS

VP

C

DN

G

C513

39p

205R

0

U501

EUSY0376201

GP2AP002S00F

54

63

72

81LEDA SCL

LEDC SDA

VCC VIO

VOUT GND

39p

C527

C518

2.2u

025R

0

L501

100n

ZD504

C525

47p47p

C524

335C

u7.4

R505

DNI

R522

10

VPROX_3V0

R512

2.2K

C528

39p

1.5K

R511

C523

2.2u

C521

39pF

L505

0

C520

22n

VAUD_HS_BIAS

C5162.2u

R524

1K

C519

2.2u

C503

10u

2.2u C505

VBAT

10FB501

1800FB506

R503

220K

0.1uC504

DNI

C530

VDD_IO_1V8

HS_MIC_N

HS_MIC_P

MAIN_MIC_P

HS_OUT_R

HS_OUT_R

HS_OUT_L

HS_OUT_L

HS_GND

HS_GND

HS_GND

HS_GND

I2C_SDA

I2C_SDA

I2C_SCL

I2C_SCL

HS_JACK_DET

SPK_P

SPK_P

SPK_N

SPK_N

SPK_HS_L

SPK_HS_R

HS_MIC

HS_MIC

HS_HOOK_DET

MAIN_MIC_N

RCV_HS_N

RCV_HS_P

PROX_INT

FM_LNA_IN

SPEAKER MAIN MIC Proximity Sensor

3.5pi HEADSETAUDIO SUBSYSTEM



7. CIRCUIT DIAGRAM

VA601

1u

IN

D606

AV

15pF

FL605

015

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

1G

2G

FL604

15pF015

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

1G

2G

FL603

15pF

01 5

6 4

7 3

8 2

9 1INOUT_A1INOUT_B1

INOUT_A2INOUT_B2

INOUT_A3INOUT_B3

INOUT_A4INOUT_B4

1G

2G

FL602

15pF

015

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

1G

2G

15pF

FL601

015

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

1G

2G

216C

u1.0

u1.031 6

C

416C

u1.0

C607

18p

R612 47

47R613

R614 47

LD602

LD603

LD601

C621

1u

1u

C622

C617

7.5p

106R

0

7.5p

C620

U601

24

23

22

21

20

19

18

8

7

6

5

9

4

10

3

11

2

12

1

31 41 51 61 71L

CS

AD

S

NE

MW

P

FC

DN

GP

LDO1

N2C

LDO2

N1C

LDO3

P1C

LDO4

P2C

AGND

VIN

LDOIN

LED6

LED5

LED4

LED3

LED2

LED1

VOUT

R618100

VPROX_3V0

VTOUCH_3V0

VCAM_DIG_1V8

7.5p

C618

7.5p

C616

R617100

506R

0

106B

F 01

VCAM_IO_1V8

R620 0

VBAT

C603

2.2u

TP603

C619

1u

100K

R604

100KR610

706A

V

806A

V

R602DNI

606R

0

0R619

VCAM_DIG_1V8

VCAM_IO_1V8

VCAM_ANA_2V8

0R608

506A

V

0R609

406A

V

DNIR603

2.2u

C610

VA602

TP602

R616

10

VPA_2V85

VDD_IO_1V8

CN602

1312

1411

1510

169

178

187

196

205

214

223

232

241

C604

1u

C605

2.2u

VCAM_ANA_2V8

1u

C608

1u

C609C611

1u

1u

C601

C602

1u

VBAT

100K

R611

CN601

21 20

22 19

23 18

24 17

25 16

26 15

27 14

28 13

29 12

30 11

31 10

32 9

33 8

34 7

35 6

36 5

37 4

38 3

39 2

40 1

1u

C606

CAM_DATA[0]CAM_DATA[1]CAM_DATA[2]CAM_DATA[3]

CAM_DATA[4]CAM_DATA[5]CAM_DATA[6]CAM_DATA[7]

CAM_HSYNC

CAM_PCLK

CAM_VSYNC

CAM_MCLK

LCD_RS

VBAT

LCD_LED_CA5

LCD_LED_CA5

LCD_LED_CA4

LCD_LED_CA4

LCD_LED_CA3

LCD_LED_CA3

LCD_LED_CA2

LCD_LED_CA2

LCD_LED_CA1

LCD_LED_CA1

LCD_PWM

LCD_PWM

LCD_CS_N

LCD_VSYNC_OUT

CAM_F_DATA[6]

CAM_F_DATA[6]

CAM_F_DATA[5]

CAM_F_DATA[5]

CAM_F_DATA[4]

CAM_F_DATA[4]

CAM_F_DATA[3]

CAM_F_DATA[3]

CAM_F_DATA[2]

CAM_F_DATA[2]

CAM_F_DATA[1]

CAM_F_DATA[1]

CAM_F_DATA[0]CAM_F_DATA[0]

CAM_F_DATA[7]

CAM_F_DATA[7]

LCD_F_DATA[2]

LCD_F_DATA[2]


LCD_F_DATA[1]


LCD_F_DATA[0]

LCD_F_DATA[7]

LCD_F_DATA[7]

LCD_F_DATA[5]

LCD_F_DATA[5]

LCD_F_DATA[4]

LCD_F_DATA[4]

LCD_F_WR_N

LCD_F_WR_N

LCD_F_CS_N

LCD_F_CS_N

LCD_F_RS

LCD_F_RS

LCD_F_DATA[6]

LCD_F_DATA[6]

LCD_RST_N

I2C_SDA

I2C_SDA

I2C_SCL

I2C_SCL

CAM_PWDN

CAM_RST_N

LCD_ID

LCD_WR_N



LCD_IFMODE

LCD_IFMODE

BACKLIGHT_KEY

BACKLIGHT_KEY

LCD_BL_CTRL

F_CAM_VSYNC

F_CAM_VSYNC

F_CAM_HSYNC

F_CAM_HSYNC

LCD_RD LCD_F_RD

LCD_F_RD

2M_FF_CAMERA KEY BACKLIGHT LEDCAM_EMI FILTER

ENBY0036001GB042-40S-H10-E3000

LCD CONNECTOR6ch_CHARGING PUMP _4LDO



7. CIRCUIT DIAGRAM

C709

DNIC708

12n

2.7n

C714

3.3n

R703

1nC712

R702

15K

DNI

C713

R704 DNI

C711 1n U701

BCM2070B2KUBXG

F4

D5

1A

6B

7D

6E

3F

6F

A2

3A

B3

E3C3

F2

D2E5

C2F5

A4B4

C4

E4E2

D4C1

C6D1

B2

E1

B5

C5C7

D6

6A

7B

1B

7E

7F

7A

1F

3D

5A

TA

BV

OD

DV

2C

DD

V

GE

RV

XP

DD

VF

RD

DV

BS

U_D

DV

FT

DD

V

VH

GE

RVRES

RFP RST_NREG_EN

SCL

HUSB_DN

SDA TM2

SPIM_CLK PCM_INSPIM_CS_N PCM_OUT

PCM_CLKLPO_IN PCM_SYNC

XIN UART_TXDXOUT UART_RXD

UART_RTS_NGPIO_0 UART_CTS_N

GPIO_1

1C

DD

V

HUSB_DP

6S

SV

5S

SV

4S

SV

3S

SV

2S

SV

1S

SV

GPIO_6

GPIO_5

C70610n

TP701

VDD_IO_1V8

10pC704

C701

2.2u

VPA_2V85

C70310p

C70210n

VDD_IO_1V8

10nC707

1KR705

TP707

TP711

TP708

TP706

TP709

2450MHzFL701

42

31IN OUTGND1 GND2

2.2u

C705

C710 100p

TP710

TP702

TP703

TP704

TP705

ANT701

FB701

600

CON_ANT_FEED

CON_ANT_FEED|GND

CON_ANT_FEED

CON_ANT_FEED


BT_UART_RTSBT_UART_CTS

BT_PCM_SYNC

BT_PCM_OUTBT_PCM_INBT_PCM_CLK

BT_WAKEUP

RTC_32K

BT_CLK_26M

BT_RST_N

BT_WAKEUP_HOSTBT_CLK_REQ

BT_RF

BTCX_STATUS

BTCX_TXCONF

BTCX_RF_ACTIVE

BT_WIFI

BT

must have 1% tolerance

When power class 1.5 is used, R307 is populated and R308 is depopulated.(Vice versa for power class 2)

QCT

IFXVBT_PA_2V6

QCT

IFXVBT_IO_1V8

VREG_MSMP_2V6

VREG_MSME_1V8

VIO_1V8

VPA_2V85

7-1-1-3_BCM2070(QCT & IFX Only)_0.4Pitch

Class 2 or 1.5



7. CIRCUIT DIAGRAM

L803

DNI

L804

3.3n

U801

EAT61493201XM2400LV-DL1201TMP

1121 01

9

54 6

3 7

2 8

1VCTL1

RXANT

GND1VCTL3

2C

N

2X

T

1C

N

GND2

DD

V

1X

T

2LT

CV

C807

0.1u

C8190.1u

VBAT

1uC825C824

1u

R803

0

K001

R804

C805

10u

0

R802

218C

u7.4

VBATVDD_TCXO

C823

2.2u

C8155.6n

R801

15K

FB801

120

26MHz

TG-5010LH-87N

X801

4 2

3 1NCOUT

GNDVCC

10p

C820

C81315p

VDD_TCXO

10p

C803

10pC801 VDD_3P3

ODL

NL_T

UO

V

U802

2B

1J

4B

3A

7F

5A

1G

3D

1D

4L

3L

3K

1H

1L

2J

1K

J5

D7

D6

F6

A7

E5

J7

J6

H5

J4

E4

K4

J3

K5

H4

H3

H2

C7

B7

G7

H7

H6

G5

G6

K7

K6

L7

L5

L6

F5

F2

G2

F1

E1

D5

B1

A1

5C

4C

2L

2K

4G

3G

4F

3F

3E

4A

6E

2E

6C

2D

6A

4D

DN

G_

AN

A_

FR

WD

NG

_O

CV

_F

RW

2D

NG

_A

P_

FR

WD

NG

_L

AT

X_

FR

WD

NG

_V

RD

AP

_F

RW

DN

G_

EF

A_

FR

WD

NG

_A

NL

_F

RW

1D

NG

2D

NG

3D

NG

4D

NG

5D

NG

SS

VA

_U

MP

SS

VP

_R

S

TU

O_

OI

PG

_F

RW

2P

1D

DV

_T

UO

_O

DL

_O

CV

_F

RW

WRF_RFINWRF_RFOUT

WRF_RES_EXT

RF_SW_CTRL0RF_SW_CTRL1RF_SW_CTRL2RF_SW_CTRL3

SDIO_DATA_2SDIO_DATA_0/SPI_MISOSDIO_DATA_1/SPI_IRQSDIO_CLK/SPI_CLKSDIO_DATA_3/SPI_CSXSDIO_CMD/SPI_MOSI

JTAG_TMSJTAG_TDOJTAG_TDIJTAG_TCKJTAG_TRST_L

WRF_TCXO_VDD3P3

WRF_XTAL_VDD1P2

VDD1VDD2

VDDIO

VDDIO_SD

EXT_SMPS_REQEXT_PWM_REQ

GPIO_0

WL_RST_N

GPIO_3/BTCX_TXCONFGPIO_4/BTCX_STATUS

GPIO_5/BTCX_RF_ACTIVEGPIO_1/BTCX_FREQ

WRF_TCXO_IN

XTAL_PU

OSCOUTOSCIN

EXT_SLEEP_CLK

2_

1T

AB

DD

V_

RS

2T

AB

DD

V_

RS

XL

V_

RS

3P

3_

TU

OV

1O

DL

NL

_T

UO

V

OD

L_

DD

VO

DL

C_

TU

OV

DD

V_

AP

_F

RW

DD

V_

VR

DA

P_

FR

W

FR

_O

ID

DV

8P

1D

DV

_N

I_

OD

L_

OC

V_

FR

W

2P

1D

DV

_E

FA

_F

RW

2P

1D

DV

_A

NL

_F

RW

2P

1D

DV

_A

NA

_F

RW

1_

1T

AB

DD

V_

RS

1D

NG

_A

P_

FR

W

18p

C817

018C

2.2u

C826

0.1u

u7.4208

C

VDD_IO_1V8

18p

418C

KC

UB

C_T

UO

V

VDD_CORE

100pC821

VOUT_LNLDO

KC

UB

C_T

UO

V

ER

OC_

DD

V

u5.1108L

VDD_IO_1V8

1u

C806

ODL

NL_T

UO

V

ODL

NL_T

UO

V

U803

5

3 2

4 1VOUTVIN

GNDSTBY

DN

GP

TP804

TP807

TP809

TP810

TP801

TP805

TP803

TP802

TP806

TP808

C822

220n

220n

C816

FB802 600

220n

C808

0.5p

C818

208L

n9.3

3P3_

DD

V

3P3_

DD

V

908C

1u

118C

2.2uR805

39K

RTC_32K

BT_RF

BTCX_STATUS

BTCX_TXCONF

SPI_CLK

SPI_MISOSPI_INT

SPI_CSSPI_MOSI

WLAN_REG_ON

BTCX_RF_ACTIVE

BT_WIFI

WRF_TX

XT

_F

RW

XTALP

XTALP

RF_SW_CTRL_BT

RF_SW_CTRL_BT

RF_SW_CTRL_RX

XR_L

RT

C_W

S_F

R

WLAN_CLK_REQ

WLAN_CLK_REQ

RF_SW_CTRL_TX

RF_SW_CTRL_TX

TCXO LDO WiFi TCXO

WIFI

8. BGA PIN MAP


8. BGA PIN MAP

BGA IC pin check (U201)

•Ball Diagram (Top View), PMB8815(A-GOLDRADIO+)

: not in use


8. BGA PIN MAP

: not in use

BGA IC pin check (U301)

* Ball Diagram (Top View), H9DA�GH1GHMMMR-46M



9. PCB LAYOUT

18 A

H

J

K

L

N

M

B

C

D

E

F

G

110

J

1

T

R

K

L

M

P

N

E

F

G

H

D

C

B

A

7

1 5A

B

C

D

E

G

A1

B

C

D

E

F

H

J

K

L

R408

LD603

MIC501

413

C

U301

C301

C217

U201

222

C

L201

L102

LD601

C825

812

C

FB201

802

C

412

C20

1R

111

C10

1C

L105

314

C

C412

VA602

U501

L113

C114

013

C

104B

V

1 04 L

102

NC

C405

C404

204L

BAT201

416

R

305A

V

205 A

V

TP305

213

C

TP302

TP303

R327

402

R

202

R

104 L

F

424

R

Q201

302

R

502

R

TP304 TP301

123

R

913

R

223

R

313

C

C304

C215

903

C

503

C

LD602316

R

104

C

C216

022

C

C306

703

C80

3C

303

C

203

C

402P

T

CN401

C207

104

DZ

204

C

014

C

2 04

DZ

1 22

C30

8R

R211

R212

422

C

232

C

432

C10

5N

C

3 32

C

5 32

C

632

C

202

C

C213

C209

C212

X201C211

125

R

L505

735

C

335

C

9 35

C

0 32

C

1 32

C 7 22

C

6 22

C

2 02

X

L103

C411 103A

V

C538

L504

R522

C528

035

C43

5C

D501

D502

602

C

522

C

312

R

C205

302

C

C228

C201

C237

C229

C238

R209

912

C

R210

101L

201

C

401

C7 0

1C

6 01

C8 0

1C

TP205

TP206

TP207

203

R

803

R41

3R

R307

R301

603A

V

C311

903

R

403

R30

3R

013

R

R311

203A

V

VA313

313

R

603

R50

3R

213

R

503A

V40

3AV

1 08

X10

8 BF

708

C61

1C

401

R

0 14

R

J501

228

C

108

R

208

R

C204

208B

F

808

C

C821

618

C

U802

508

C 012

C

918

C

0 18

C

118

C

1 02

R

8 08P

T20

8PT

308P

T

508 P

T

TP810

108P

T

708 P

T

408P

T

908P

T

TP806

111L

C117

501

C

511

C

3 01

C

U101

901

C40

1L10

4R

C414

504

R

R402

604

R

U401

C418

104B

F

R612

418

C

C527

815

R

715

R

301T

NA

U803C824

R804

328

C

L804

C806

208L

C818

C817

C802C809

C812

L801

R805

108

C

C803

028

C

628

C

4 11 L

011L

601L

L109

L107

FL101

L108

L112

235

C

925

C

R514

625

C

635

C

C531

915

R

515

R

R520

623

R53

5C

LG-T385_MAIN_EAX64678601_1.0_TOP

9. PCB LAYOUT

MIC501.no Voice sending-no Voice recoding

CN401 :I/O conn.-no USB Connection.-no Serial Connection.

U401 : MUIC + Charge ID-no Booting.-no USB/Serial Connection.-no Battery Charge.-no LCD Backlight

U101 : Tx Module-no Service-RF Sensitivity & TX Power

X201 : 26Mhz X-tal-no Power On-no Service

U201 : BB IC-no Power On.-no Service.-no FM Radio

U802 : WiiFi Module- No WiFi Connection

J501 : 3.5Φ ear Jack-no Earphone, headset MIC U301 : Memory

-no Booting

BAT201 : Backup Cap.-RTC Reset



9. PCB LAYOUT

E

6

5

10

12

1324

1

C BD A1

4

FEDCBA

7

1204

02

714R

CN403

616R

342C

806AV7 04

C

045C

202Q

C519

C240

305C

C711

707C

TP711

R611

101

WS

Q501

C709

C708

C815

FB601

CN404

214R

404DZ

814R

314R

60 2R

514C

404AV

C223

614C

704AV

3 16C

304D Z

02 6C

41 6C

406A V

506A V216

C

706AV

604AV

504AV304 A V

C406

904C

CN602

FL605 716C

816C

71 6R

606AV

616C

816R

R407

C417904R

804C

VA401

CN402

FL604

812R

442C

3 04R

S301

113AV

803AV

70 1R

32 3C

61 3C

C321 C319

ANT101

215R

125C

C522

213AV

425R

14 2C

202L

6 12R

51 2R

3 07PT

R601

206LF

011CC113

513C

813C

405DZ

R511

605BF

023C

R317

713C

C520

C524

013AV

R318

903AV

105DZ

6 05C

R506

305BF

C509

C525

705R

C523

415C

R513315C

C242

C517

905R

705C

805C

80 5R

015C

5 15C

10 5M

107BF

C706

507R

TP708

TP706

907PT

TP710TP705

707PT

C713

107PT

TP702

R603 706R

R602

106LF

016R

106 AV

306LF

R606R604

R605

C606

C607

TP603

C603

C112

ANT102

103N

C

C502

405R

407C

217C

R421

916C

806C

90 6C

1 1 6C50 6

C

VA501

205BF

105C

R523

102DZ

305DZ

5 05R

10 5BF

705 BF

R501

L501

205DZ

R217

305R

412R

C516

932C

C505

C518

FB505

FB504

405C

205R

50 7C

407 PT

10 7C

207R

3 07C

207C

U701

R420

VA408

R419

VA409

VA402

026R

916R

9 06R

8 06R

U601

106N

C

C139

931L

831L

417C

5 04N

C

C604

016C

ANT701

307R

107LF

308 L

318C

U801

R704 017C

C601

C602

TP602

LG-T385_MAIN_EAX64678601_1.0_BOT

S301 : SIM Conn.-no Sim

ANT701 : BT/WiFi Intenna contact.-no BT connection-no WiFi connection

M501 :Audio Sub System-no Sound

U701 : BT Module-no BT connection

CN601 : LCD Conn.-no Display

CN301 : Flash Socket-no Flash Memory

CN402 : Battery Conn.-no power on

CN403 : Touch screen connector-no touch screen

CN602 : 2M Camera connector-no Camera


10.ENGINEERING MODE

Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided

by a handset. The key sequence for switching the engineering mode on is “1809#*350# “Select. Pressing END

will switch back to non-engineering mode operation. Use Up and Down key to select a menu and press

‘select’ key to progress the test. Pressing ‘back key will switch back to the original testmenu.

[1] BB TEST

[1-1] Battery Info

[1-1-1] BattInfo

[1-2] Bluetooth Test

[1-�-1] Enter Test Mode

[1-�-�] OnOff Test

[1-�-3] Headset Test

[1-�-4] BT Test1

[1-�-5] BT Test�

[2] Model Version

[1-�-6] Xhtml Compose Print

[2-1] Version

[1-�-7] Xhtml Print Test

[3] Eng Mode

[3-1] Cell environ.

[3-2] PS Layer Info

[3-�-1] Mobility

[3-�-�] RadioRes

[3-3] Layer1 Info

[3-4] Reset Information

[3-5] Memory

[3o-n6f]i gMuermarGioennConf

[3-7] MemAllUse

[3-8] MemDetUse

[3-9] MemDump

[ 3-10] Change Frequency Band

[4] Call Timer

[5] Factory Reset

[6] MF TEST

[6-1] All Auto Test

[6-2] Backlight

[6-�-1] Backlight On

[6-�-�] Backlight Off

[6-3] Audio

[6-3-1] Audio Test

[6-4] Vibrator

[6-4-1] Vibrator On

[6-4-�] Vibrator Off

[6-5] LCD

[6-5-1] Auto LCD

[6-6] Key pad

[6-7] Mic Speaker

[6-8] Camera

[6-8-1] Camera Main Preview

[6-8-�] Flash On

[6-8-3] Flash Off

[6-9] FM Radio

[6-8-4] Camera Flash Bunning

[6-9-1] FM Radio Test

[7] Network selection

[7-1] Automatic

[7-2] GSM850

[7-3] EGSM

[7-4] DCS

[7-5] PCS


11. STAND ALONE TEST


10.1 IntroductionThis man al e plains ho to e amine the stat s of RX and TX of the model


This manual explains how to examine the status of RX and TX of the model.

A. Tx Test

TX test - this is to see if the transmitter of the phones is activating normally.

B. Rx Test

RX test - this is to see if the receiver of the phones is activating normally.

10.2 Setting Method

1. Set COM Port

2 Check PC Bau Rate2. Check PC Bau Rate

3. Confirm EEPROM & Delta file prefix name

4. Click “Update Info” for communicating Phone and Test-Program

11.1

11.2 Setting Method



5. For the purpose of the Standalone Test, Change the Phone to “ptest mode” and then Click the “Reset” bar.

6. Select “Non signaling” in the Quick Bar menu. Then Standalone Test setup is finished.





10.3 Tx Test

1. “Non signaling mode” bar and then confirm “OK” text in the command line.

2. Put the number of TX Channel in the ARFCN

3. Select “Tx” in the RF mode menu and “PCL” in the PA Level menu.

4. Finally, Click “Write All” bar and try the efficiency test of Phone.

11.3 Tx Test




10 4 Rx Test10.4 Rx Test

1. Put the number of RX Channel in the ARFCN.

2. Select “Rx” in the RF mode menu.

3. Finally, Click “Write All” bar and try the efficiency test of Phone.

4. The Phone must be changed “normal mode” after finishing Test.

5. Change the Phone to “normal mode” and then Click the “Reset” bar.

11.4 Rx Test




“ “


12.AUTO CALIBRATION

12.AUTO CALIBRATION

11 1 O i

11. AUTO CALIBRATION


11.1 Overview

Auto-cal (Auto Calibration) is the PC side Calibration tool that perform Tx, Rx and BatteryCalibration with Agilent 8960(GSM call setting instrument) and Tektronix PS2521G(ProgrammablePower supply).Auto-cal generates calibration data by communicating with phone and measuring equipment thenwrite it into calibration data block of flash memory in GSM phone.

11.2 Tachyon Directory

12.1 Overview

12.2 Tachyon Directory

LGT385LGT385LGT385LGT385

LGT385/


12.AUTO CALIBRATION

LGT385LGT385


11.3 Test Equipment Setup

1 .Turn on the Phone.2. “/LGE/Tachyon/Tachyon.exe”

11.4 Procedure

12.3 Test Equipment Setup

12.4 Procedure


12.AUTO CALIBRATION


3. Tachyon Login

4. Tachyon Main

LGT385


12.AUTO CALIBRATION


5. Tachyon Loss Setting

lgT385.gms

lgT385.gms

lgT385.gms

lgT385.gms

lgT385.gms


12.AUTO CALIBRATION

LGT385


6. Tachyon Setting

(1) Tachyon Main UI(1) Tachyon Main UI

1) User Model Selection

2) Calibration + Auto Test

3) Stop

4) Auto Test Only

5) Loss Setting

6) System Option Setting

7) Running Option Setting

8) Voltage Current Setting

9) Show Result Window9) Show Result Window

10) Setting clickClick after setting


12.AUTO CALIBRATION


(2) Click “System Option Setting” Menu

(3) Report Data


12.AUTO CALIBRATION


7. Click “User Model Selection” Menu

LGT385

LGT385

LGT385

LGT385

LGT385

LGT385LGT385LGT385LGT385LGT385


12.AUTO CALIBRATION


8. Tachyon RF Calibration Start

9. Tachyon RF Calibration finishes.

lgT385.gms + NewFile.grf

LGT385

LGT385

LGT385


12.AUTO CALIBRATION


11.5 AGCThis procedure is for Rx calibration.

In this procedure, We can get RSSI correction value. Set band EGSM and press Start button the

result window will show correction values per every power level and gain code and the same

measure is performed per every frequency.

11 6 APC11.6 APCThis procedure is for Tx calibration.

In this procedure you can get proper scale factor value and measured power level.

11.7 ADCThis procedure is for battery calibrationThis procedure is for battery calibration.

You can get main Battery Config Table and temperature Config Table will be reset.

11.8 Target Power

HighMiddleLowDescriptionBAND

32 5 dBm32 5 dBm32 5 dBmMax power

914.8 MHz897.4 MHz880.2 MHzFrequency

12437975Channel

EGSM 900

32.5 dBm32.5 dBm32.5 dBmMax power


251191128Channel

GSM 850

1909.8 MHz1880 MHz1850.2 MHzFrequency

810661512Channel

PCS 1900



885699512Channel

DCS1800



12.5 AGC

12.6 APC

12.7 ADC

12.8 Target Power



13. EXPLODED VIEW & REPLACEMENT PART LIST


13.1 EXPLODED VIEW

Location DescriptionACQ00 Cover Assembly,Rear

EAA00 PIFA Antenna,Multiple

EAB00 Speaker,Dual Mode

EAJ00 LCD Module

EBD00 Touch Window Assembly

ABM00 Can Assembly,Shield

MBG00 Button

MBG01 Button,Side

ACQ01 Cover Assembly,Front

MCQ00 Damper,Speaker

MCQ01 Damper,LCD

MDS01 Gasket

MDS00 Gasket

EBR00 PCB Assembly,Main

EAX01 PCB,Flexible

EAX00 PCB,Sidekey

EBR01 Camera Module

SJMY00 Motor,DC

SUMY00 Microphone,Condenser

GMEY00 Screw,Machine

MPHY00 Plate,Protector

EAC00 Rechargeable Battery,Lithium Ion

MCK00 Cover,Battery

EBD00 ACQ00

EAJ00MDS00

MCQ00

MDS01

ABM00

MBG00

MBG01

EAB00 MCQ01

MCK00GMEY00MPHY00

EAC00

ACQ01

EAA00

EAX01

SUMY00

EAX00

EBR00EBR01SJMY00



Note: This Chapterisused for reference,Part order is orderedby SBOM standard on GCSC

Level LocationNo. Description PartNumber Spec Remark

1 AGQ000000 Phone Assembly AGQ86717201 LGT385.ATURBK BK:BLACK BLACK -

2 MEZ002101 Label,Approval MLAA0062316 COMPLEX GU280 OREBK ZZ:Without ColorCOMPLEX, (empty), , , , ,

2 ACQ100400 CoverAssembly,EMS ACQ86021101 LGT385.ATURBK BK:BLACK BLACK -

3 ACQ00 CoverAssembly,Rear ACQ85971301 LGT375.ATHABK ZZ:Without Color -

4 MDS000000 Gasket MDS63943701 COMPLEX LGT375.ATHABK ZZ:Without Color -

4 MKC009400 Window,Camera MKC64323201 CUTTING PC LGT375.ATHABK ZZ:Without Color -

4 MEZ000900 Label,After Service MLAB0001102 COMPLEX C2000 CGRSV WA:White C2000USASV DIA 4.0 PRINTING,

4 MCK063300 Cover,Rear MCK67156601 MOLD PC LGT375.ATHABK ZZ:Without Color -

4 MJN020800 Tape,Decor MJN68116901 COMPLEX LGT375.ATHABK ZZ:Without Color -

4 MCQ043300 Damper,LCD MCQ66973101 COMPLEX LGT375.ATHABK ZZ:Without Color -

4 MCQ015700 Damper,Connector MCQ66973201 COMPLEX LGT375.ATHABK ZZ:Without Color -

4 MCQ009400 Damper,Camera MCQ66998101 COMPLEX LGT375.ATHABK ZZ:Without Color -

4 MCQ074201 Damper,Speaker MCQ66998301 COMPLEX LGT375.ATHABK ZZ:Without Color -

4 MCR000000 Decor MCR64793701 MOLD PC LGT375.ATHABK ZZ:Without Color -

4 MCQ000000 Damper MCQ66953901 COMPLEX LGT375.ATHABK ZZ:Without Color -

3 ACQ003400 CoverAssembly,Bar ACQ86111401 LGT385.ATURBK BK:BLACK BLACK -

13.2 ReplacementParts<Mechanic component>




4 MJN061100 Tape,Protect MJN68155901 COMPLEX LGT385.ATURBK ZZ:Without Color -

4 ABM00 CanAssembly,Shield ABM73757601 LGT375.ATHABK ZZ:Without Color -

5 MBG00 Button MBG64586701 MOLD PC LGT375.ATHABK ZZ:Without Color -

5 MBG01 Button,Side MBG64586601 MOLD PC LGT375.ATHABK ZZ:Without Color -

5 ABM070300 CanAssembly,Shield ABM73797201 LGT375.ATHABK ZZ:Without Color -

6 MBK070300 Can,Shield MBK63273801 PRESS STS 304 0.4 LGT375.ATHABK ZZ:WithoutColor -

5 MHK000000 Sheet MHK63757801 COMPLEX LGT375.ATHABK ZZ:Without Color -

5 MJN000000 Tape MJN68171001 COMPLEX LGT375.AVNMBK ZZ:Without Color -

5 MDJ000000 Filter MDJ63407501 COMPLEX LGT375.ATHABK ZZ:Without Color -

5 MJN061100 Tape,Protect MJN68081501 COMPLEX LGT375.ATHABK ZZ:Without Color -

5 MJN061101 Tape,Protect MJN68081601 COMPLEX LGT375.ATHABK ZZ:Without Color -

4 ACQ01 CoverAssembly,Front ACQ85989401 LGT375.ATHABK ZZ:Without Color -

5 MJB000000 Stopper MJB62950101 COMPLEX LGT375.ATHABK ZZ:Without Color -

5 MDJ000000 Filter MDJ63464901 COMPLEX LGT375.ATHABK ZZ:Without Color -

5 MCQ049800 Damper,Motor MCQ66998001 COMPLEX LGT375.ATHABK ZZ:Without Color -


5 MCK032700 Cover,Front MCK67121901 MOLD PC LGT375.ATHABK ZZ:Without Color -




6 MET099500 INSERT,NUT MICE0016910 MECH_COMMON ZY,ZZ,PRESS, STS, , , , ,

5 MJN000000 Tape MJN68099901 COMPLEX LGT375.ATHABK ZZ:Without Color -

5 MJN089300 Tape,Window MJN68116601 COMPLEX LGT375.ATHABK ZZ:Without Color -


4 MCQ01 Damper,LCD MCQ66997801 COMPLEX LGT375.ATHABK ZZ:Without Color -



4 MEV000000 Insulator MEV64107701 COMPLEX LGT375.ATHABK ZZ:Without Color -

4 MJN061101 Tape,Protect MJN68155801 COMPLEX LGT375.AVNMBK ZZ:Without Color -

6 ANT101ANT102 Contact MCIZ0008201 COMPLEX LG-VN530 VRZ DW:DARK BROWN

PRESS, BeCu, , 3.0, 1.5, 1.5,

5 MEZ000000 Label MLAZ0038301 COMPLEX LG-VX6000 ZZ:Without Color PID Label4 Array PRINTING,

6 ANT103 Contact MCIZ0008701 COMPLEX L-04C, ANTTWV ZZ:Without ColorPRESS, YCUT-FX, 4.2, 2.5, 1.5,

6 SC202 Can,Shield MBK63214601 PRESS SUS 304 0.2 LGT375.ATHABK ZZ:WithoutColor -

6 SC201 Can,Shield MBK63273901 PRESS SUS 304 0.2 LGT375.ATHABK ZZ:WithoutColor -

5 MCQ049800 Damper,Motor MCQ67046101 COMPLEX LGT375.ATHABK ZZ:Without Color -


5 MEV000000 Insulator MEV64231201 COMPLEX LGT375.AVNMBK ZZ:Without Colorinsulator_PCB




3 GMEY00 Screw,Machine GMEY0013901 BH + 1.4mM 4mM MSWR FZB N - ARIMACOMMUNICATIONS CORP.

3 MPHY00 Plate,Protector MPHY0001005 COMPLEX CU8180.BUMWPF ZZ:Without Color -

1 AGF000000 Package Assembly AGF76517805 LGT385.ATURBK ZZ:Without Color LG-T385TUR(EU1W/SMS Text UB/TUR Peel/1,200EA)

2 MAY084000 Box,Unit MAY65497207BOX Paper 120 90 56 4 COLOR LGT385.ATURBKZZ:Without Color LG-T385 TUR(SMS Text) UnitBox(EU1W)

2 MEZ084100 Label,Unit Box MLAQ0018064PRINTING LGC105.ATURBK ZZ:Without ColorTurkey Peel & SMS Label TUR only_Peel+SMStext_unit box label_105×40

2 AGJ000000 PALLET ASSY APLY0003901 GD510 BALBK BK,ZZ,EU1TYPE_Body(SW)+Cap(EU)+AL_1200EA

3 MBEC00 Box,Carton MBEC0003601 COMPLEX GD510 CZESV ZZ:Without Color -

3 MCCL00 Cap,Box MCCL0002501 COMPLEX GD510 CZESV ZZ:Without Color -

3 MPCY00 Pallet MPCY0012403 COMPLEX KG800 FRABK DB:DARK BLUE -

2 MBAD00 Bag,Vinyl MBAD0005204 COMPLEX LG-LX260 SPRAG ZZ:Without Color -

2 MBEE00 Box,Master MBEE0061001 COMPLEX GD510.ACZESV ZZ:Without Color EU1Master Box

2 MLAJ00 Label,Master Box MLAJ0004402PRINTING CG300 CGR DG ZZ:Without ColorLABEL MASTER BOX(for CGR TDR 2VER.mbox_label) GSM standard_master box label

2 MLAZ01 Label MLAZ0050901 COMPLEX KU990.AGBRBK ZZ:Without ColorBattery Warning Label (Lithium ion Battery Label)

1 AAD000000 Addition Assembly AAD85976201 LGT385.ATURBK BK:BLACK BLACK -

2 MCK00 Cover,Battery MCK67265401 MOLD PC LGT385.ATURBK ZZ:Without Color -



Note: This Chapterisused for reference, Part order is orderedby SBOM standard on GCSC


4 EAA00 PIFAAntenna,Multiple EAA62788401 CN007068 QUAD -5DB 5:1 LDS Type -

SHANGHAI AMPHENOL AIRWAVE

4 EAA030101 PIFA AntennaBluetooth EAA62824501 LS01-I-11123-A0 SINGLE -5DB 5:1 Metal Stamping

Type - LS Mtron Ltd.

4 EAB00 Speaker,DualMode EAB62429501

1812-8T-05PP Nd-Fe-B 700mW 8OHM 91DB720HZ 1812*3.0T DCCA new pin type PIN KIRYNTELECOM CO., LTD

4 EAJ00 LCD Module EAJ62130001LM320DN1A QVGA 3.2INCH 240X320 400CDCOLOR 60% 4/3 500 60Hz Inverter N LED 2D -TOVIS

4 EBD00 Touch WindowAssembly EBD61386301 STWC-L0008FA CAPACITIVE TOUCH PFF

MMS128 3.2" B to B - SUNTEL CO.,LTD.

3 EBR00 PCBAssembly,Main EBR75393801 LGT385.ATURBK 1.0 Main

4 EBR071800 PCB AssemblyMain,SMT EBR75393901 LGT385.ATURBK 1.0 Main

5 EBR071600 PCB AssemblyMain,SMT Bottom EBR75368801 LGT385.ATURBK 1.0 Main

6 C112 CapacitorCeramic,Chip ECCH0000196

MCH155A0R75C 0.75pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP - ROHM SemiconductorKOREA CORPORATION

6 C406 CapacitorTA,Conformal ECTH0002002

F981A336MSA 33uF 20% 10V 3.3UA -55TO+125C6OHM 2.0X1.25X0.8MM NONE SMD R/TP 0.9Tmax. NICHICON CORPORATION, EAST JAPANSALES OFFICE

6 C714 InductorMultilayer,Chip ELCH0001403

LL1005-FHL1N0S 1NH 0.3NH - 400mA - - 0.1OHM20GHZ 7 SHIELD NONE 1.0X0.5X0.5MM R/TPTOKO, INC.


LL1005-FHL15NJ 15NH 5% - 300mA 0.5OHM2.8GHZ 9 SHIELD NONE 1.0X0.5X0.5MM R/TPTOKO, INC.

13.2 ReplacementParts<Main component>




6

R502R513R601R605R606R608R609R619R620

Resistor,Chip ERHZ0000401 MCR01MZSJ000 0OHM 5% 1/16W 1005 R/TP -ROHM.

6 C703C704

CapacitorCeramic,Chip ECCH0000110

MCH155A100D 10pF 0.5PF 50V NP0 -55TO+125C1005 R/TP - ROHM Semiconductor KOREACORPORATION

6R218R504R616

Resistor,Chip ERHZ0000402 MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP -ROHM.

6

C408C702C706C707


MCH153CN103KK 10nF 10% 16V X7R -55TO+125C 1005 R/TP - ROHM SemiconductorKOREA CORPORATION

6 L501 InductorMultilayer,Chip ELCH0003842

LQG15HSR10J02D 100NH 5% - 150mA - -1.25OHM 600MHZ 8 SHIELD NONE1.0X0.5X0.5MM R/TP MURATAMANUFACTURING CO.,LTD.

6 U601 IC,Sub PMIC EUSY0344403RT9396GQW QFN,24,R/TP,4CH+2LDO,IC,SubPMICIC,Sub PMIC RICHTEK TECHNOLOGYCORP.

6 R216 Resistor,Chip ERHZ0003801 MCR01MZP5J5R1 5.1OHM 5% 1/16W 1005 R/TP -ROHM.

6

C604C608C609C611C619C621C622

VA601


GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C1005 R/TP - MURATA MANUFACTURINGCO.,LTD.

6

FL601FL602FL603FL604FL605

Filter,EMI/Power SFEY0013201 EVRC14S03Q030100R ESD/EMI 0HZ 15pF 0HSMD R/TP AMOTECH CO., LTD.




6

ZD201ZD302ZD404ZD501ZD502ZD503ZD504

Diode,TVS EDTY0012501UCLAMP3311T.TCT 3.3V 3.5V min. 6.5V 5A -SLP1006P2T R/TP 2P 1 SEMTECHCORPORATION

6

C315C316C317C318C320C323C407C417

CapacitorCeramic,Chip ECZH0000830

C1005C0G1H330JT000F 33pF 5% 50V NP0 -55TO+125C 1005 R/TP - TDK KOREACOOPERATION

6 R503,R526 Resistor,Chip ERHZ0000445 MCR01MZP5J224 220KOHM 5% 1/16W 1005 R/TP- ROHM.

6

C505C516C517C518C519


CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C 1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO., LTD.

6 M501 IC,Audio SubSystem EUSY0420001 TPA2055D3 1.6~5.5V 0W WLCSP R/TP 20P -

TEXAS INSTRUMENTS INCO.

6

C319C321C415C416C504C510C515C612C613C614


GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C 1005 R/TP - MURATAMANUFACTURING CO.,LTD.

6 Q202 TR,Bipolar EQBN0019201 KTC3770V NPN 3V 20V 12V 100mA 999A 999100mW VSM R/TP 3P KEC CORPORAITION

6 C524C525


MCH155A470JK 47pF 5% 50V NP0 -55TO+125C1005 R/TP - ROHM Semiconductor KOREACORPORATION

6

C241C507C508C601C602C606


C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C 1005 R/TP - TDK KOREACOOPERATION




6R419R420R421


6R417R524R705

Resistor,Chip ERHZ0000404 MCR01MZP5J102 1KOHM 5% 1/16W 1005 R/TP -ROHM.

6

R206R217R317R318R412

Resistor,Chip ERHY0000254 MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP- ROHM.

6 R702 Resistor,Chip ERHZ0000221 MCR01MZP5F1502 15KOHM 1% 1/16W 1005R/TP - ROHM.

6

FB502FB503FB506FB507

Filter,Bead SFBH0008102BLM15HD182SN1D 1800 ohm 1.0X0.5X0.5 25%2.2 ohm 0.2A SMD R/TP 2P 0 MURATAMANUFACTURING CO.,LTD.


CL05C270JB5NNNC 27pF 5% 50V NP0 -55TO+125C 1005 R/TP 0.5 SAMSUNG ELECTRO-MECHANICS CO., LTD.

6FB504FB505FB701

Filter,Bead SFBH0008101BLM15AG601SN1D 600 ohm 1.0X0.5X0.5 25% 0.6ohm 0.3A SMD R/TP 2P 0 MURATAMANUFACTURING CO.,LTD.

6 R413 Resistor,Chip ERHZ0000506 MCR01MZP5J682 6.8KOHM 5% 1/16W 1005 R/TP- ROHM.

6

VA402VA404VA408VA409VA604VA605VA607VA608

Varistor SEVY0004301 ICVL0518100Y500FR 18V 0% 10F 1.0*0.5*0.55NONE SMD R/TP INNOCHIPS TECHNOLOGY

6 R501 Resistor,Chip ERHZ0000486 MCR01MZP5J473 47KOHM 5% 1/16W 1005 R/TP- ROHM.

6 CN301 Socket,Card EAG62830201 104031-0811 SD 8P ANGLE SMD R/TP11.95x11.40x1.42t, Push-pull type MOLEX

6 CN602 Connector,BtoB ENBY0034201 GB042-24S-H10-E3000 24P 0.40MM STRAIGHTSOCKET SMD R/TP 1M - LS Mtron Ltd.

6

C513C514C521C540


MCH155A390J 39pF 5% 50V NP0 -55TO+125C1005 R/TP - ROHM Semiconductor KOREACORPORATION




6 VA401VA403 Varistor SEVY0005202 EVLC5S02100 5.5V 0% 100F 1.0*0.5*0.6 UL SMD

R/TP AMOTECH CO., LTD.

6 R506R507 Resistor,Chip ERHZ0000488 MCR01MZP5J4R7 4.7OHM 5% 1/16W 1005 R/TP -

ROHM.

6

VA308VA309VA310VA311VA312

Varistor SEVY0004001 EVLC18S02003 18V 0% 3F 1.0*0.5*0.6 NONESMD R/TP AMOTECH CO., LTD.

6 S301 Card Socket EAG63211701 5000-12P-2.95D-A1-R0 SIM 12P STRAIGHT SMDT/REEL - HYUPJIN I&C CO.,LTD.


6

C243C244C616C617C618C620


GRM1555C1H7R5D 7.5pF 0.5PF 50V C0G -55TO+125C 1005 R/TP - MURATAMANUFACTURING CO.,LTD.

6 FB501FB601 Filter,Bead SFBH0007102

BLM15AG100SN1D 10 ohm 1.0X0.5X0.5 5 ohm0.05 ohm 1A SMD R/TP 2P 0 MURATAMANUFACTURING CO.,LTD.

6 C110R703

InductorMultilayer,Chip ELCH0003826

LQG15HS3N3S02D 3.3NH 0.3NH - 300mA - -0.17OHM 6GHZ 8 SHIELD NONE 1.0X0.5X0.5MMR/TP MURATA MANUFACTURING CO.,LTD.


LQG15HS5N6S02D 5.6NH 0.3NH - 300mA 0.2OHM4.5GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPMURATA MANUFACTURING CO.,LTD.

6 CN403 Connector,BtoB ENBY0051001 GB042-10S-H10-E3000 10P 0.4MM STRAIGHTFEMALE SMD R/TP 1M - LS Mtron Ltd.

6 R107 Resistor,Chip EBC61835701 RC0402FR-071RL 1OHM 1% 1/16W 1005 R/TP -YAGEO CORPORATION

6

R418R604R610R611

Resistor,Chip ERHZ0000406 MCR01MZP5J104 100KOHM 5% 1/16W 1005 R/TP- ROHM.

6 R409R528 Resistor,Chip ERHZ0000204 MCR01MZP5F1003 100KOHM 1% 1/16W 1005

R/TP - ROHM.




6 R215 Resistor,Chip ERHZ0000531 MCR01MZP5J271 270OHM 5% 1/16W 1005 R/TP -ROHM.



6 Q501 FET EBK61952101KTJ6131V P-CHANNEL MOSFET -30V +-20 -0.05A40OHM 100mW VSM R/TP 3P KECCORPORAITION

6

C523C603C605C610C701C705


GRM188R61A225K 2.2uF 10% 10V X5R -55TO+85C 1608 R/TP - MURATAMANUFACTURING CO.,LTD.

6

C501C506C509C711C712


MCH155CN102KK 1nF 10% 50V X7R -55TO+125C1005 R/TP - ROHM Semiconductor KOREACORPORATION


MCH155C150J 15pF 5% 50V NP0 -55TO+125C1005 R/TP - ROHM Semiconductor KOREACORPORATION

6 C520C522


GRM155R71C223K 22nF 10% 16V X7R -55TO+85C 1005 R/TP - MURATAMANUFACTURING CO.,LTD.

6 R407 Resistor,Chip ERHZ0000206 MCR01MZP5F10R0 10OHM 1% 1/16W 1005 R/TP- ROHM.


CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C 1005 R/TP 0.5MM SAMSUNGELECTRO-MECHANICS CO., LTD.

6 C240C242


GRM155R60J474K 470nF 10% 6.3V X5R -25TO+70C 1005 BK-DUP - MURATAMANUFACTURING CO.,LTD.


CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C 1608 R/TP 0.8MM SAMSUNGELECTRO-MECHANICS CO., LTD.

6 VA407 Varistor SEVY0004101 ICVN0505X150FR 5.6V 0% 360F 1.0*0.5*0.55NONE SMD R/TP INNOCHIPS TECHNOLOGY





6 R617R618 Resistor,Chip ERHY0003301 MCR01MZP5J101 100OHM 5% 1/16W 1005 R/TP -

ROHM.

6 R508R509 Resistor,Chip ERHZ0000348 MCR01MZP5F12R0 12OHM 1% 1/16W 1005 R/TP

- ROHM.

6 CN601 Connector,BtoB ENBY0036001GB042-40S-H10-E3000 40P 0.4MM STRAIGHTSOCKET SMD R/TP 1M ENGINEERING PLASTICUL94V-0 AU OVER NI LS Mtron Ltd.

6 R525 Resistor,Chip ERHZ0000407 MCR01MZP5J105 1MOHM 5% 1/16W 1005 R/TP -ROHM.


LQG15HS1N8S02D 1.8NH 0.3NH - 300mA 0.1OHM6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPMURATA MANUFACTURING CO.,LTD.


C1005X7R1H331KT000F 0.33nF 10% 50V X7R -55TO+125C 1005 R/TP - TDK KOREACOOPERATION


6 U502 IC,Comparator EUSY0250501

NCS2200SQ2T2G NCS2200SQ2T2G,SC70,5PIN,R/TP,Comparator,pin compatible toEUSY0077701 - - SC70 R/TP 5P - ONSEMICONDUCTOR

6 U701 IC,Bluetooth EUSY0418701BCM2070B2KUBXG 2.3VTO5.5V 158.4mW 42P -WLBGA R/TP 42P BROADCOM ASIADISTRIBUTION PTE LTD

6 VA501 Diode,TVS EDTY0010501RCLAMP1521P.TCT 15V 16.7 28V 4A 0WSLP1006P2 R/TP 2P 1 SEMTECHCORPORATION




LQG15HS22NJ02D 22NH 5% - 300mA 0.42OHM1.9GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPMURATA MANUFACTURING CO.,LTD.


6 FL701 Filter,Dielectric SFDY0003001

DEA202450BT-1275A1 DEA202450BT-1275A1,2450MHz,2.0*1.25*1.05,SMD,2400M~2500M,IL1.6,4pin,U-U,50-50,BT BPF TDK CORPORATION




6 SW101 Connector,RF ENWY0008701MS-156C NONE STRAIGHT SOCKET SMDT/REEL AU 50OHM 400mDB HIROSE KOREACO.,LTD

6 CN402 ConnectorTerminal Block EAG63254401

00 9245 003 032 868+ 3P 3.00MM STRAIGHT DIPT/REEL - KYOCERA ELCO KOREA SALESCO.,LTD.

6 C710 CapacitorCeramic,Chip ECZH0000813

C1005C0G1H101JT 100pF 5% 50V C0G -55TO+125C 1005 R/TP - TDK KOREACOOPERATION


6 U801 Module, FEM(FrontEnd Module) EAT61493201

XM2400LV-DL1201TMP 8DBM 12.5DB 10% 12mA12mA 2.2DB 23.5DBM 4DBM 12P 1.6x1.6x0.4MM -MURATA MANUFACTURING CO.,LTD.

5 EBR071700PCBAssembly,Main,SMT Top

EBR75368901 LGT385.ATURBK 1.0 Main

6 VA502VA503 Varistor SEVY0007901 ICVS0505481FR 5.6V 0% 480F 1.0*0.5*0.55 NONE

SMD R/TP INNOCHIPS TECHNOLOGY

6 D501D502 Diode,TVS EDTY0012101 PESD5V0F1BL 5.5V 6V min 11V 2.5A - SOD-882

R/TP 2P 1 STC CORP.


LL1005-FHL1N0S 1NH 0.3NH - 400mA - - 0.1OHM20GHZ 7 SHIELD NONE 1.0X0.5X0.5MM R/TPTOKO, INC.


LQG15HS2N7S02D 2.7NH 0.3NH - 300mA0.15OHM 6GHZ 8 SHIELD NONE 1.0X0.5X0.5MMR/TP MURATA MANUFACTURING CO.,LTD.

6 R408 Resistor,Chip ERHZ0000749 RC0603JR-074R7L 4.7OHM 5% 1/10W 1608 R/TP- YAGEO CORPORATION

6 EAX010000 PCB,Main EAX64678601 LGT375.ABRABK 1.0 FR-4 Staggered via 8 0.8Main

6

R502R513R601R605R606R608R609R619R620

Resistor,Chip ERHZ0000401 MCR01MZSJ000 0OHM 5% 1/16W 1005 R/TP -ROHM.




6 C529C532



6

C604C608C609C611C619C621C622

VA601


GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C1005 R/TP - MURATA MANUFACTURINGCO.,LTD.

6

C319C321C415C416C504C510C515C612C613C614


GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C 1005 R/TP - MURATAMANUFACTURING CO.,LTD.

6 X201 Crystal EXXY0025701

TSX- 3225 TSX- 3225 TSX- 3225,26 MHz,10PPM,8 pF,40 ohm,SMD ,32X25X0.6 ,X-Tal (Infinionchip), Pb-Free EPSON TOYOCOM CORP EPSONTOYOCOM CORP

6LD601LD602LD603

LED,Chip EDLH001510319-217/UTD-S887-1/TR8 Snow White 2.7~3.030mA 90~180mcd x, y 110mW 1608 R/TP 2P -EVERLIGHT ELECTRONICS CO., LTD.

6 C406 Capacitor,TA,Conformal ECTH0002002

F981A336MSA 33uF 20% 10V 3.3UA -55TO+125C6OHM 2.0X1.25X0.8MM NONE SMD R/TP 0.9Tmax. NICHICON CORPORATION, EAST JAPANSALES OFFICE

6FB504FB505FB701

Filter,Bead SFBH0008101BLM15AG601SN1D 600 ohm 1.0X0.5X0.5 25% 0.6ohm 0.3A SMD R/TP 2P 0 MURATAMANUFACTURING CO.,LTD.

6

ZD201ZD302ZD404ZD501ZD502ZD503ZD504

Diode,TVS EDTY0012501UCLAMP3311T.TCT 3.3V 3.5V min. 6.5V 5A -SLP1006P2T R/TP 2P 1 SEMTECHCORPORATION





6

C513C514C521C540



6 C524C525




GRM219R60J226M 0.000022F 20% 6.3V X5R -55TO+85C 2012 R/TP 0.85MM MURATAMANUFACTURING CO.,LTD.

6 C401C412

CapacitorCeramic,Chip EAE62505701

CL10A105KB8NNNC 1uF 10% 50V X5R -55TO+85C 1608 R/TP 0.9T max. SAMSUNGELECTRO-MECHANICS CO., LTD.

6

R418R604R610R611


6 FB201 Filter,Bead SFBH0007103BLM15BB750SN1D 75 ohm 1.0X0.5X0.5 25% 0.4ohm 0.3A SMD R/TP 2P 0 MURATAMANUFACTURING CO.,LTD.

6 C240C242


GRM155R60J474K 470nF 10% 6.3V X5R -25TO+70C 1005 BK-DUP - MURATAMANUFACTURING CO.,LTD.

6

C408C702C706C707



6

R308R309R310R311R312R313


6

C523C603C605C610C701C705


GRM188R61A225K 2.2uF 10% 10V X5R -55TO+85C 1608 R/TP - MURATAMANUFACTURING CO.,LTD.




6

R302R303R304R305R306R319R321R323


6 R202R307 Resistor,Chip ERHZ0000484 MCR01MZP5J471 470OHM 5% 1/16W 1005 R/TP -

ROHM.


C1005C0G1H101JT 100pF 5% 50V C0G -55TO+125C 1005 R/TP - TDK KOREACOOPERATION

6

C207C210C236C808C816C822


C1005X5R1A224KT000E 220nF 10% 10V X5R -55TO+85C 1005 R/TP - TDK KOREACOOPERATION

6

VA402VA404VA408VA409VA604VA605VA607VA608

Varistor SEVY0004301 ICVL0518100Y500FR 18V 0% 10F 1.0*0.5*0.55NONE SMD R/TP INNOCHIPS TECHNOLOGY

6

C501C506C509C711C712


MCH155CN102KK 1nF 10% 50V X7R -55TO+125C1005 R/TP - ROHM Semiconductor KOREACORPORATION

6 R617R618 Resistor,Chip ERHY0003301 MCR01MZP5J101 100OHM 5% 1/16W 1005 R/TP -

ROHM.

6 L401L402


LQG15HS56NJ02D 56NH 5% - 200mA 0.82OHM800MHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPMURATA MANUFACTURING CO.,LTD.

6

FB502FB503FB506FB507

Filter,Bead SFBH0008102BLM15HD182SN1D 1800 ohm 1.0X0.5X0.5 25%2.2 ohm 0.2A SMD R/TP 2P 0 MURATAMANUFACTURING CO.,LTD.

6 X801 Oscillator,TCXO EXST0001901TG-5010LH-87N 26MHZ 2.5PPM 2.8V32.0x25.0x10.0MM - SMD R/TP EPSONTOYOCOM CORP




6 C703C704


MCH155A100D 10pF 0.5PF 50V NP0 -55TO+125C1005 R/TP - ROHM Semiconductor KOREACORPORATION

6 U301 IC,MCP,NAND EAN61927501

H9DA2GH1GHMMMR-46M NAND/2G SDRAM/1G1.7VTO1.95V 8.0x9.0x0.9 TR 130P NAND+DDRSDRAM FBGA 2Gb NAND(LB/128Mx16)+1GbDRAM(DDR/200MHz/16Mx4x16) HYNIXSEMICONDUCTOR INC.

6 U501 IC,Proximity EUSY0376201GP2AP002S00F GP2AP002S00FGP2AP002S00F,,8 ,R/TP , SHARPCORPORATION. SHARP CORPORATION.

6

VA308VA309VA310VA311VA312


6R417R524R705

Resistor,Chip ERHZ0000404 MCR01MZP5J102 1KOHM 5% 1/16W 1005 R/TP -ROHM.


1005GC2T3N9SLF 3.9NH 0.3NH - 300mA0.22OHM 4GHZ 8 SHIELD NONE 1.0X0.5X0.5MMR/TP PILKOR ELECTRONICS LTD.




C1005Y5V1A474ZT000F 470nF -20TO+80% 10VY5V -30TO+85C 1005 R/TP - TDK KOREACOOPERATION

6 C301C306

CapacitorCeramic,Chip ECCH0006201 C1608X5R0J475KT000N 4.7uF 10% 6.3V X5R -

55TO+85C 1608 R/TP - TDK CORPORATION

6

C241C507C508C601C602C606


C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C 1005 R/TP - TDK KOREACOOPERATION

6 U401 IC,Mini ABB EAN62339701LP8727- B MUIC with Charger IC CSP R/TP 25PTEXAS INSTRUMENTS KOREA LTD, HONGKONGBRANCH.




6

C114C818L105L109


C1005CH1H0R5BT000F 0.5pF 0.1PF 50V NP0 -55TO+125C 1005 R/TP - TDK KOREACOOPERATION

6R612R613R614

Resistor,Chip ERHY0008207 RC1005F470CS 47OHM 1% 1/16W 1005 R/TP -SAMSUNG ELECTRO-MECHANICS CO., LTD.

6 C526 Capacitor,TA,Conformal ECTH0001902

F981A106MMA 10uF 20% 10V 1UA -55TO+125C8OHM 1.6X0.85X0.8MM NONE SMD R/TP 0.9Tmax. NICHICON CORPORATION, EAST JAPANSALES OFFICE

6

C315C316C317C318C320C323C407C417


C1005C0G1H330JT000F 33pF 5% 50V NP0 -55TO+125C 1005 R/TP - TDK KOREACOOPERATION



6 L201 Inductor,WireWound,Chip ELCP0009410

LQM2HPN3R3MG0 3.3UH 20% - 350mA 0.35 1.20.1OHM - - SHIELD 2.5X2X1MM NONE R/TPMURATA MANUFACTURING CO.,LTD.


CL05C270JB5NNNC 27pF 5% 50V NP0 -55TO+125C 1005 R/TP 0.5 SAMSUNG ELECTRO-MECHANICS CO., LTD.

6 C212C213

CapacitorCeramic,Chip ECCH0002002 C1005X7R1A473KT000F 47000pF 10% 10V Y5P -


6 CN401 Connector,I/O EAG6314990104-5161-005-101-868+ 5P 0.50MM STRAIGHTRECEPTACLE DIP R/TP Reverse type(New IO)KYOCERA ELCO KOREA SALES CO.,LTD.


6 C826 CapacitorCeramic,Chip ECCH0002001 C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P -


6 L111L114


LQG15HS10NJ02D 10NH 5% - 300mA 0.26OHM3.4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPMURATA MANUFACTURING CO.,LTD.





CL05A106MQ5NUNC 10uF 20% 6.3V X5R -55TO+85C 1005 R/TP - SAMSUNG ELECTRO-MECHANICS CO., LTD.

6 FL101 Filter,Saw,Dual EAM62290001SAKEX881MAN0F00R14881.5/942.5/1842.5/1960MHz 1.8*1.4*0.6 SMDR/TP 10P MURATA MANUFACTURING CO.,LTD.


LQG15HS2N2S02D 2.2NH 0.3NH - 300mA - -0.12OHM 6GHZ 8 SHIELD NONE 1.0X0.5X0.5MMR/TP MURATA MANUFACTURING CO.,LTD.


CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C 1608 R/TP 0.8MM SAMSUNGELECTRO-MECHANICS CO., LTD.


GRM188R60J106M 10000000pF,6.3V,M,X5R,TC,1608,R/TP,0.8 mm MURATAMANUFACTURING CO.,LTD.


MCH155C150J 15pF 5% 50V NP0 -55TO+125C1005 R/TP - ROHM Semiconductor KOREACORPORATION

6 U101 Module,Tx Module EAT61713801SKY77550-21 0DBM 0DB 0% 0A 0A 0DB 0DBM0DBM 28P 6.0x6.0x0.9MM GPRS TxM, Quad Tx,Dual Rx, SP4T SKYWORKS SOLUTIONS INC.

6 BAT201 CapacitorAssembly SMZY0023501

PAS311HR-VG1 3.8 Backup Capacitor0.03F,Module Assembly, KOREA TAIYOYUDEN.CO., LTD.

6 C211C224

Capacitor,Ceramic,Chip ECCH0000151

CL05B472KB5NNNC 4.7nF 10% 25V X7R -55TO+125C 1005 R/TP - SAMSUNG ELECTRO-MECHANICS CO., LTD.

6 FB801 Filter,Bead SFBH0007101BLM15AG121SN1D 120 ohm 1.0X0.5X0.5 25%0.25 ohm 0.5A SMD R/TP 2P 0 MURATAMANUFACTURING CO.,LTD.

6 R409R528 Resistor,Chip ERHZ0000204 MCR01MZP5F1003 100KOHM 1% 1/16W 1005

R/TP - ROHM.

6R218R504R616






6C237C402C410



6 Q201 TR,Bipolar EQBN0020501 KTC4075E NPN 5V 60V 50V 150mA 100NA 700100mW ESM R/TP 3P KEC CORPORAITION

6 FL401 Filter,EMI/Power SFEY0015301 NFM18PC104R1C3 ESD/EMI 0HZ 0.1uF 0H SMDR/TP MURATA MANUFACTURING CO.,LTD.

6 X202 Crystal EXXY0026801 NX3215SA 32.768KHZ 20PPM 0F NONE SMDR/TP NIHON DEMPA KOGYO CO.,LTD.

6 U802 IC Assembly EUSY0434401 BCM43362SKUBG BCM43362SKUBGBROADCOM ASIA DISTRIBUTION PTE LTD


6 U201IC,DigitalBasebandProcessor,GSM

EUSY0429401

PMB8815 ,281,EDGE Rx,ARM11 208MHz,NANDbooting,2.0Mp,FMR,IC,Digital Baseband ProcessorBGA R/TP 281P INFINEON TECHNOLOGIES(ASIA PACIFIC) PTE LTD.

6 U803 IC,LDO VoltageRegulator EUSY0407101

BU28TD4WNVX SSON004,4,R/TP,2.8V 150mASingle LDO,IC,LDO Voltage RegulatorIC,LDOVoltage Regulator ROHM.


6 C802C812


CL10A475KP8NNNC 4.7uF 10% 10V X5R -55TO+85C 1608 R/TP - SAMSUNG ELECTRO-MECHANICS CO., LTD.

6 R407 Resistor,Chip ERHZ0000206 MCR01MZP5F10R0 10OHM 1% 1/16W 1005 R/TP- ROHM.

6 U302 IC,Analog Switch EUSY0186504 FSA2259UMX QFN ,8 ,R/TP ,Dual SPDT ,;,IC,Analog Switch FAIRCHILD SEMICONDUCTOR


LQG15HS1N8S02D 1.8NH 0.3NH - 300mA 0.1OHM6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPMURATA MANUFACTURING CO.,LTD.

6 L801 Inductor,WireWound,Chip ELCP0012801

MIPS2520D1R5-LG 1.5UH 30% - 1.2A 1.2 1.20.1OHM - - SHIELD 2.5X2X1MM NONE R/TP FDKCORPORATION.






CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C 1005 R/TP 0.5MM SAMSUNGELECTRO-MECHANICS CO., LTD.


1005GC2T5N6SLF 5.6NH 0.3NH - 300mA0.27OHM 3.2GHZ 8 SHIELD NONE1.0X0.5X0.5MM R/TP PILKOR ELECTRONICSLTD.


6

VA301VA302VA304VA305


6 J501 Jack,Phone EAG63234901JAM3333-F36-7H 5P 2P STRAIGHT R/TP 3.5MBLACK 5P Reverse type HON HAI PRECISIONINDUSTRY CO.,LTD.

6 L107 Inductor,Multilayer,Chip ELCH0001408

LL1005-FHL6N8J 6.8NH 5% - 300mA 0.23OHM5.6GHZ 9 SHIELD NONE 1.0X0.5X0.5MM R/TPTOKO, INC.

5 SAD010000 Software,Mobile SAD33305901 Base V10b - MIDDLE EAST AND AFRICA IFX -

4 EBR071500 PCB AssemblyMain,Insert EBR75394001 LGT385.ATURBK 1.0 Main

5 EAX01 PCB,Flexible EAX64733401 LGT375.ATHABK 1.0 POLYI Multi 2 0.15 Flexible

5 EAX00 PCB,Sidekey EAX64733301 LGT375.ATHABK 1.0 POLYI Multi 2 0.15 Sidekey

5 EBR01 Camera Module EBP61562201 C2FA-H440A C2FA-H440A 2M FF Hynix 1/5", FPC0deg. 7mm LG INNOTEK CO., LTD

5 SJMY00 Motor,DC SJMY0007104 3V 80mA 0A 12KRPM 0RPM 0SEC 0GF.CM 0OHM

5 SUMY00 Microphone,Condenser SUMY0003816 OBM-410L44-RC1882 -44DB 2.2KOHM OMNI

1TO10V 4x1.0t FPCB BSE CO., LTD.

5 RAA050100 Resin,PC BRAH0001301 UF2040 or 3075BHF . . NONE



Note: This Chapterisused for reference,Part order is orderedby SBOM standard onGCSC


2 EAY060000 Adapters EAY62389801STA-U35ED2 100-240V 4.8V 400mA 50-60Hz CB,CE WALL 2P USB - DONGDO ELECTRONICSCO.,LTD

2 EAC00 RechargeableBattery,Lithium Ion EAC61700101

LGIP-531A-WWU-LGC PRISMATIC 3.7V 950mAH190mAH 34x50x5.5 34.15x53.55x5.7 BLACK BarType 553450, 950mAh, Bar Type, WW, Up LGChem,LTD.

2 EAB010200 Earphone,Stereo SGEY0003219 EMB-LGE001STKE ,BLACK,4 POLE PLUG,3.54,Earphone,Stereo CRESYN CO.,LTD

2 AFN053800 Manual AssemblyOperation AFN75741501 LGT385.ATURBK ZZ:Without Color Manual assy for

LGT385 TUR

3 MFL053800 ManualOperation MFL67525101 PRINTING LGT385.ATURBK ZZ:Without Color

Manual for LGT385 TUR

13.3 Accessory

lg t385 service manual

Documents